JPH04313036A - Hollow-type resin sealed semiconductor pressure sensor - Google Patents

Abstract

PURPOSE:To prevent the occurrence of defects during resin molding and to make it possible to perform manufacturing at the high yield rate by filling a filling material, whose hardness is lower than the molding pressure and higher than the resin sealing pressure, between a semiconductor element and a die pad. CONSTITUTION:This sensor is sealed with a resin 5 so that a hollow part 5a is formed on an upper-surface pressure sensing part 2a of a semiconductor element 2 which is mounted on a die pad 9. A recess part 9a which is slightly larger than the element 2 is provided at the upper surface of the die pad 9. The part 9a is filled with a filling material 10 which is provided between the die pad 9 and the element 2. When the resin 5 is molded, the recess part 9a is filled with the filling material 10. The upper and lower surfaces of the material is held with the projections of the metal mold. The resin is made to flow into the space, and the molding is performed. The height of the filling material 10 is corrected by the elastic deformation at the hardness which is lower than the molding pressure in the molding which is performed based on the comparison with a standard height at this time. The hardness is made higher than the sealing pressure of the resin 5 in sealing, and the deformation during the sealing is prevented. Thus, the occurrence of defective products is prevented.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a hollow resin-sealed semiconductor pressure sensor in which a hollow portion is formed in the upper surface pressure sensing portion of a semiconductor element and sealed with resin.

0002

2. Description of the Related Art FIG. 3 is a sectional view showing the structure of a conventional hollow resin-sealed semiconductor pressure sensor of this kind. In the figure,
1 is a die pad, 2 is a semiconductor element bonded on the die pad 1, and a pressure sensing portion 2a is formed on the upper surface. 3 is a lead for connecting to an external device (not shown) via a wire 4; 5 is a pressure sensing portion 2a of the semiconductor element 2;
A hollow portion 5a is formed in a portion corresponding to the die pad 1,
This is a resin that covers and seals the semiconductor element 2, a portion of the leads 3, and the wires 4.

Next, the operation of the conventional hollow resin-sealed semiconductor pressure sensor constructed as described above will be explained. First, pressure fluctuations sensed by the pressure sensing section 2a of the semiconductor element 2 are converted into electrical signals within the semiconductor element 2, and
It is taken out to an external device through the wire 4 and lead 3 and processed.

Furthermore, when molding the resin 5, as shown in FIG. 4, the leads 3, which are connected via wires 4 to the semiconductor element 2 placed on the die pad 1 in advance, are held between the molds 6 and 7. , the upper surface of the semiconductor element 2 and the lower surface of the die pad 1 are held by protrusions 6a and 7a formed approximately at the center of the molds 6 and 7, respectively, and in this state, both molds 6,
A sealing resin is poured into the space 8 formed between the holes 7 and 7, and the resin 5 shown in FIG. 3 is molded. At this time, the protrusion 6a of the mold 6
Accordingly, a hollow portion 5a is formed in a portion of the semiconductor element 2 corresponding to the pressure sensing portion 2a.

[0005]

[Problems to be Solved by the Invention] Since the conventional hollow resin-sealed semiconductor pressure sensor is constructed as described above,
When setting the die pad 1 and the semiconductor element 2 in the molds 6 and 7 and clamping the molds, both protrusions 6a of the molds 6 and 7,
Since the spacing between the molds 7a is constant, if there are variations in the total dimensions of the die pad 1 and the semiconductor element 2 in the height direction, the semiconductor element 2 may be destroyed, or the sealing resin may be damaged by the molds 6, 7a.
There was a problem that leakage occurred between 7 and 7, resulting in defective products and poor product yield.

The present invention was made to solve the above-mentioned problems, and its purpose is to provide a hollow resin-sealed semiconductor pressure sensor that does not cause defects during resin molding and has a high yield. That is.

[0007]

[Means for Solving the Problems] A hollow resin-sealed semiconductor pressure sensor according to the present invention is provided with a clamping pressure applied between a semiconductor element and a die pad when the semiconductor element is placed on the die pad and the mold is clamped. The resin is filled with a filler having a hardness lower than the hardness and higher than the resin sealing pressure when sealing the resin.

[0008]

[Function] The filling material of the hollow resin-sealed semiconductor pressure sensor according to the present invention deforms between the semiconductor element and the die pad during mold clamping, thereby increasing the total dimension in the height direction of the semiconductor element and the die pad. Absorb variation.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the structure of a hollow resin-sealed semiconductor pressure sensor according to an embodiment of the present invention. In the figure, a semiconductor element 2, a pressure sensing part 2a, a lead 3, a wire 4, a resin 5, and a hollow part 5a are the same as those of the conventional pressure sensor shown in FIG. 9 is a semiconductor element 2 on the top surface.
A die pad 9 has a concave portion 9a formed in an area slightly larger than the area occupied by the upper surface of the die pad 9.
It is a filler that is filled in the recessed part of and interposed between the die pad 9 and the semiconductor element 2, and seals the encapsulated resin at a pressure lower than the clamping pressure of mold clamping when molding the resin 5, which will be described later. It has a higher hardness than the resin sealing pressure when it is used.

In the hollow resin-sealed semiconductor pressure sensor according to an embodiment of the present invention configured as described above, first, as in the conventional pressure sensor, the pressure sensed by the pressure sensing portion 2a of the semiconductor element 2 is The pressure fluctuation is converted into an electrical signal within the semiconductor element 2, and the wire 4 and lead 3
is extracted to an external device for processing.

Furthermore, when molding the resin 5, the recess 9a of the die pad 9 is filled with a filler 10, as shown in FIG. Then, the semiconductor element 2 to which the leads 3 are connected in advance via the wires 4 is placed on the filler 10, and both molds 6,
7 sandwich the lead 3, and protrusions 6a and 7a formed approximately at the center of both molds 6 and 7 hold the upper surface of the semiconductor element 2 and the lower surface of the die pad 1, respectively. In this state, a sealing resin is poured into the space 8 formed between the two molds 6 and 7, and the resin 5 shown in FIG. 2 is molded. At this time, a hollow portion 5a is formed by the protrusion 6a of the mold 6 in a portion corresponding to the pressure sensing portion 2a of the semiconductor element 2.

In the hollow resin-sealed semiconductor pressure sensor according to one embodiment of the present invention constructed as described above, since the filler 10 is filled between the semiconductor element 2 and the die pad 9, if the semiconductor If the total dimension in the height direction of the element 2 and the die pad 9 is higher than the standard height, the filler 10 is elastically deformed during mold clamping because its hardness is lower than the clamping pressure of the mold clamp, and the semiconductor element 2 is filler 1
The height is adjusted to the standard height so that it looks as if it is buried in 0. Furthermore, since the hardness of the filler 10 is higher than the resin sealing pressure during resin sealing, even when the resin is sealed in the state shown in FIG.
Since the filling material 10 maintains the corrected standard height without being deformed, there is no problem.

[0013] The filler 10 in the above embodiment is as follows:
Although the recess 9a formed on the die pad 9 is filled, the recess 9 can be filled by filling an appropriate amount of the filler 10.
The purpose of this invention can be fully achieved even without a. or,
Silicone rubber or the like is used as the filler, and its hardness is appropriately selected depending on the clamping pressure during mold clamping and the resin sealing pressure during resin sealing.

[0014]

As described above, according to the present invention, a resin is sealed between the semiconductor element and the die pad, and the clamping pressure is lower than the clamping pressure when the semiconductor element is placed on the die pad and the mold is clamped. To provide a hollow-type resin-sealed semiconductor pressure sensor which is filled with a filler having a hardness higher than the resin-sealing pressure when sealing, so that defects do not occur during molding of the resin and the yield is high. Can be done.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing the configuration of a hollow resin-sealed semiconductor pressure sensor according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a state in which the hollow resin-sealed semiconductor pressure sensor in FIG. 1 is clamped with a mold when resin-sealed.

FIG. 3 is a sectional view showing the configuration of a conventional hollow resin-sealed semiconductor pressure sensor.

FIG. 4 is a sectional view showing a state in which the hollow resin-sealed semiconductor pressure sensor in FIG. 3 is clamped with a mold when resin-sealed.

[Explanation of symbols]

2 Semiconductor element 2a Pressure sensing part 5 Resin 5a Hollow part 9 Die pad 10 Filling material

Claims (1)

[Claims] 1. A hollow resin-sealed semiconductor pressure sensor in which a hollow part is formed in the upper surface pressure sensing part of a semiconductor element placed on a die pad and sealed with resin, wherein the semiconductor element and the die pad are sealed together. and a filler having a hardness lower than the clamping pressure when placing the semiconductor element on the die pad and clamping the mold and higher than the resin sealing pressure when sealing the resin. A hollow resin-sealed semiconductor pressure sensor featuring: