JPH04312845A - Vibration-damping metal plate - Google Patents
Vibration-damping metal plateInfo
- Publication number
- JPH04312845A JPH04312845A JP3079894A JP7989491A JPH04312845A JP H04312845 A JPH04312845 A JP H04312845A JP 3079894 A JP3079894 A JP 3079894A JP 7989491 A JP7989491 A JP 7989491A JP H04312845 A JPH04312845 A JP H04312845A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- metal plate
- damping
- resin composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000013016 damping Methods 0.000 title claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 239000011342 resin composition Substances 0.000 claims abstract description 28
- 229920001577 copolymer Polymers 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 15
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract description 14
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 3
- 230000009477 glass transition Effects 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 22
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229910000831 Steel Inorganic materials 0.000 description 13
- 239000010959 steel Substances 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 229920000768 polyamine Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- -1 acrylic ester Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000007591 painting process Methods 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- HNPDNOZNULJJDL-UHFFFAOYSA-N ethyl n-ethenylcarbamate Chemical compound CCOC(=O)NC=C HNPDNOZNULJJDL-UHFFFAOYSA-N 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N isopropyl-benzene Natural products CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Landscapes
- Vibration Prevention Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、中間層として制振性に
優れた樹脂組成物を介在させて、騒音発生源に制振材と
して使用される振動減衰性制振金属板(以下制振金属板
と言う)に関する。さらに詳しくは、建築物や機械の構
成部材、もしくはその一部を構成し、それらの振動を減
少させることにより騒音を低減させる振動減衰能の高い
制振金属板に関する。[Industrial Application Field] The present invention relates to a vibration-damping metal plate (hereinafter referred to as vibration-damping material) which is used as a damping material for noise sources by interposing a resin composition with excellent vibration-damping properties as an intermediate layer. metal plate). More specifically, the present invention relates to a vibration-damping metal plate that constitutes a component of a building or a machine, or a part thereof, and has a high vibration damping ability that reduces noise by reducing vibrations thereof.
【0002】0002
【従来の技術】近年、交通機関の発達や住居と工場、事
業場との接近などに伴い、地域社会の環境保全の見地か
ら、各種交通機関、各種機械などにより発生する騒音対
策が重要な課題となってきた。特に、自動車のオイルパ
ン、ダッシュパネル、電気洗濯機の外板、ホッパーのシ
ュート部、汎用エンジンカバーその他、金属加工機械の
振動低減部材などに制振金属板が検討あるいは採用され
てきている。[Background Art] In recent years, with the development of transportation systems and the proximity of residences to factories and workplaces, countermeasures against noise generated by various transportation systems and machinery have become an important issue from the perspective of environmental conservation in local communities. It has become. In particular, vibration-damping metal plates are being considered or adopted for automobile oil pans, dash panels, outer panels of electric washing machines, hopper chutes, general-purpose engine covers, and vibration reduction members for metal processing machines.
【0003】この制振金属板の中間層樹脂として、従来
よりポリウレタン(特開昭47− 19277号公報)
、ビニルウレタン樹脂(特開昭50− 39737号公
報)、ポリエステル樹脂(特開昭50−143880号
公報)、ポリアミド樹脂(特開昭51− 79146号
公報)、ポリイソブチレン(特開昭54− 43251
号公報)、エチレン/αオレフィン(特開昭55− 8
4655号公報)、EVA(特開昭57− 34949
号公報)、架橋オレフィン(特開昭59−152847
号公報)、ポリビニルアセタール(特開昭60− 38
149号公報)などが検討されており、アスファルト、
合成ゴム、アクリル系粘着剤なども制振性を有すること
が知られている。Polyurethane has conventionally been used as the intermediate layer resin of this vibration-damping metal plate (Japanese Patent Application Laid-open No. 19277-1989).
, vinyl urethane resin (JP-A-50-39737), polyester resin (JP-A-50-143880), polyamide resin (JP-A-51-79146), polyisobutylene (JP-A-54-43251)
(Japanese Unexamined Patent Publication No. 1982-8), ethylene/α-olefin
4655), EVA (Japanese Unexamined Patent Publication No. 57-34949)
Publication No.), cross-linked olefin (JP-A-59-152847)
(Japanese Patent Application Laid-open No. 60-38), polyvinyl acetal
Publication No. 149) etc. are being considered, and asphalt,
Synthetic rubber, acrylic adhesives, and the like are also known to have vibration damping properties.
【0004】0004
【発明が解決しようとする課題】これらの樹脂のうち、
アクリル系粘着剤、ポリイソブチレン、EVAなどの常
温で柔軟な樹脂は、常温付近の温度で比較的高い制振性
を有するが、常温における樹脂の凝集力が低いため接着
強度が低く、当該樹脂を用いた制振金属板は、プレス加
工などの成形加工に耐えられず、また焼き付け塗装工程
に耐える程度の接着耐熱性もない。[Problem to be solved by the invention] Among these resins,
Resins that are flexible at room temperature, such as acrylic adhesives, polyisobutylene, and EVA, have relatively high vibration damping properties at temperatures around room temperature, but their adhesive strength is low due to the low cohesive force of the resin at room temperature. The damping metal plate used cannot withstand forming processes such as press working, and does not have adhesive heat resistance to the extent that it can withstand a baking process.
【0005】また、共重合やブレンドなどにより変性ま
たは改質されたポリオレフィン系樹脂、例えば、エチレ
ン/αオレフィン樹脂などは、前者に比べ50〜 10
0℃の高温域で比較的制振性に優れ、常温における樹脂
の凝集力も高く、成形加工に対する対応性もあるため、
当該樹脂を用いた制振金属板は、自動車のオイルパンな
どの高温で使用される用途の制振金属板に適していると
言われている。[0005] Furthermore, polyolefin resins modified or modified by copolymerization or blending, such as ethylene/α-olefin resins, have a molecular weight of 50 to 10% compared to the former.
It has relatively excellent vibration damping properties in the high temperature range of 0℃, has high resin cohesion at room temperature, and is compatible with molding processing.
It is said that a vibration damping metal plate using the resin is suitable for vibration damping metal plates used at high temperatures such as oil pans of automobiles.
【0006】しかしながら、両者ともその用途を限定し
たとしても制振性や接着強度において十分に満足すべき
水準に達しているものとはいえず、また熱可塑性樹脂で
あるため、焼き付け塗装工程の高温下における接着耐熱
性もない。したがって、自動車のボディ回りの部品を始
めとして常温から高温に渡る温度域で高い制振性を有し
、かつ成形加工に追随する強い接着強度と高温下におけ
る接着耐熱性を要求される制振金属板に適した樹脂はあ
まり知られていない。However, even if their uses are limited, they cannot be said to reach sufficiently satisfactory levels in vibration damping properties and adhesive strength, and since they are thermoplastic resins, they cannot be used at high temperatures during the baking process. There is also no adhesive heat resistance at the bottom. Therefore, vibration-damping metals, such as parts around the body of automobiles, must have high vibration-damping properties in a temperature range ranging from room temperature to high temperatures, and must also have strong adhesive strength that can be used in molding processes, and adhesive heat resistance at high temperatures. Not much is known about the resin suitable for boards.
【0007】本発明は、上記の問題点を解決し、中間層
として使用されて、常温( 0〜40℃)、高温(60
〜 120℃)または広温(0〜 120℃)域で高い
制振性を有し、かつ成形加工に追随する強い接着強度と
焼き付け塗装工程の高温下における接着耐熱性を有する
樹脂組成物を使用した制振金属板を提供することを目的
とするものである。[0007] The present invention solves the above problems and can be used as an intermediate layer at room temperature (0~40°C) and high temperature (60°C).
-120℃) or a wide temperature range (0 to 120℃), and uses a resin composition that has strong adhesive strength that follows molding processing and adhesive heat resistance under the high temperature of the baking painting process. The object of the present invention is to provide a vibration-damping metal plate.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するため
、本発明者等は鋭意検討を重ねた結果、特定のビニルエ
ステル類と不飽和カルボン酸類との共重合体、エポキシ
樹脂および硬化剤からなる樹脂組成物を用いることによ
り、極めて優れた特性を有する制振金属板が得られるこ
とを見出して、本発明を完成するに至った。[Means for Solving the Problems] In order to achieve the above object, the inventors of the present invention have made extensive studies and have developed a method using a copolymer of specific vinyl esters and unsaturated carboxylic acids, an epoxy resin, and a curing agent. The present inventors have discovered that a vibration-damping metal plate having extremely excellent properties can be obtained by using a resin composition, and have completed the present invention.
【0009】すなわち、本発明は、金属板間に、損失正
接(tanδ) の極大温度が−70〜 120℃の間
にあるビニルエステル類と不飽和カルボン酸類との共重
合体、エポキシ樹脂および硬化剤からなる樹脂組成物を
、30〜 150μm の厚さで介在させた制振金属板
である。That is, the present invention provides a copolymer of vinyl esters and unsaturated carboxylic acids, an epoxy resin, and a cured resin having a maximum loss tangent (tan δ) between -70 and 120°C between metal plates. This is a vibration-damping metal plate in which a resin composition consisting of an agent is interposed with a thickness of 30 to 150 μm.
【0010】0010
【作用】本発明の構成と作用を説明する。本発明におい
て使用する樹脂組成物は、複数の金属層とそれらを接合
する中間層から構成される制振金属板用の該中間層用物
質であって、ビニルエステル類と不飽和カルボン酸類と
の共重合体と、所定量のエポキシ樹脂と硬化剤で構成さ
れる。この樹脂組成物は、 tanδの極大温度が−7
0〜 120℃の間にあるビニルエステル類と不飽和カ
ルボン酸類との共重合体である。[Operation] The structure and operation of the present invention will be explained. The resin composition used in the present invention is a material for an intermediate layer for a vibration-damping metal plate, which is composed of a plurality of metal layers and an intermediate layer that joins them together, and is composed of vinyl esters and unsaturated carboxylic acids. It consists of a copolymer, a predetermined amount of epoxy resin, and a curing agent. This resin composition has a tan δ maximum temperature of −7
It is a copolymer of vinyl esters and unsaturated carboxylic acids at a temperature between 0 and 120°C.
【0011】制振金属板の用途は、自動車のダッシュパ
ネル、フロア、電気洗濯機の外板、ホッパーのシュート
部、汎用エンジンカバーなどの常温域で制振性を要求さ
れるもの、自動車のオイルパンの80〜 100℃の高
温域で制振性を要求されるものが主であり、上記いずれ
の温度領域で制振性を発現するためには、 tanδの
極大温度が−70〜 120℃の間にあることが必要で
ある。常温域で制振性を発揮するためには、 tanδ
の極大温度が−50〜40℃の間にあることが好ましい
。また、高温域で制振性を発揮するためには、 tan
δの極大温度が20〜80℃の間にあることが望ましい
。[0011] The vibration-damping metal plate is used for things that require vibration-damping properties in the room temperature range, such as automobile dash panels, floors, outer panels of electric washing machines, hopper chutes, general-purpose engine covers, and automobile oil. Damping properties are mainly required in the high temperature range of 80 to 100°C for bread, and in order to exhibit damping properties in any of the above temperature ranges, the maximum temperature of tan δ must be between -70 to 120°C. There needs to be something in between. In order to exhibit vibration damping properties at room temperature, tanδ
It is preferable that the maximum temperature of is between -50 and 40°C. In addition, in order to exhibit vibration damping properties in a high temperature range, tan
It is desirable that the maximum temperature of δ is between 20 and 80°C.
【0012】本発明で用いるビニルエステル類と不飽和
カルボン酸類との共重合体は、ビニルエステル類と不飽
和カルボン酸類のラジカル共重合によって合成できる。The copolymer of vinyl esters and unsaturated carboxylic acids used in the present invention can be synthesized by radical copolymerization of vinyl esters and unsaturated carboxylic acids.
【0013】共重合体の一成分であるビニルエステル類
としては、酢酸ビニル、プロピオン酸ビニルまたは酪酸
ビニルのようなカルボン酸ビニル、アクリル酸メチル、
アクリル酸エチル、アクリル酸ブチルまたはアクリル酸
2−エチルヘキシルのようなアクリル酸エステル、メタ
クリル酸メチル、メタクリル酸エチル、メタクリル酸ブ
チルまたはメタクリル酸2−エチルヘキシルのようなメ
タクリル酸エステルなどが挙げられる。これらのビニル
エステル類は、2種以上組合せて使用することもできる
。Vinyl esters which are one component of the copolymer include vinyl carboxylates such as vinyl acetate, vinyl propionate or vinyl butyrate, methyl acrylate,
Acrylic esters such as ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate; methacrylic esters such as methyl methacrylate, ethyl methacrylate, butyl methacrylate or 2-ethylhexyl methacrylate; and the like. Two or more of these vinyl esters can also be used in combination.
【0014】一方、不飽和カルボン酸類としては、アク
リル酸、メタクリル酸、イタコン酸、クロトン酸、マレ
イン酸またはフマル酸およびこれらの無水物などが挙げ
られる。また、それらの混合物であってもよい。On the other hand, examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid or fumaric acid, and anhydrides thereof. Alternatively, a mixture thereof may be used.
【0015】共重合を行う場合の重合開始剤としては、
アゾビスイソブチロニトリルまたは過酸化ベンゾイルな
どの通常の重合開始剤がいずれも好適に用いられる。[0015] As a polymerization initiator for copolymerization,
Any conventional polymerization initiator such as azobisisobutyronitrile or benzoyl peroxide is suitably used.
【0016】重合に用いる溶媒としては、メチルアルコ
ール、エチルアルコール、イソプロピルアルコール、ア
セトン、メチルエチルケトン、酢酸エチル、酢酸イソプ
ロピルまたはベンゼンなどが挙げられる。これらは重合
温度、生成共重合体の重合度の調節の見地より、単独あ
るいは混合溶媒としていずれも適宜用いられる。Examples of the solvent used in the polymerization include methyl alcohol, ethyl alcohol, isopropyl alcohol, acetone, methyl ethyl ketone, ethyl acetate, isopropyl acetate, and benzene. From the viewpoint of controlling the polymerization temperature and the degree of polymerization of the resulting copolymer, these solvents may be used alone or as a mixed solvent as appropriate.
【0017】本発明の生成共重合体中における不飽和カ
ルボン酸成分の割合は、 1〜 6モル%の範囲である
のが好ましい。この範囲を超えると、共重合体の制振性
が低下し好ましくない。The proportion of the unsaturated carboxylic acid component in the copolymer produced according to the invention is preferably in the range of 1 to 6 mol %. If it exceeds this range, the vibration damping properties of the copolymer will deteriorate, which is not preferable.
【0018】前記ビニルエステル類、不飽和カルボン酸
類および重合開始剤は、いずれも市販品が入手可能であ
り、あるいは公知の方法で製造利用できる。The vinyl esters, unsaturated carboxylic acids, and polymerization initiators are all commercially available, or can be manufactured and used by known methods.
【0019】ビニルエステル類と不飽和カルボン酸類の
共重合は、通常に従い、例えば、メチルアルコールやア
セトンなどを用いて溶液重合の条件で行うことができる
。脱溶媒により得られた共重合体は、数平均分子量が5
千から10万であり、メチルアルコールやアセトンなど
の溶媒に通常溶解する。Copolymerization of vinyl esters and unsaturated carboxylic acids can be carried out under solution polymerization conditions using, for example, methyl alcohol or acetone. The copolymer obtained by removing the solvent has a number average molecular weight of 5.
It has a molecular weight of 1,000 to 100,000 and is usually soluble in solvents such as methyl alcohol and acetone.
【0020】また、エポキシ樹脂は、 1分子中に 2
個以上のエポキシ基を有するものであり、ビスフェノー
ルA系のエポキシ樹脂、ビスフェノールF系のエポキシ
樹脂、フェノールノボラックエポキシ樹脂、クレゾール
ノボラックエポキシ樹脂、各種のゴム変性エポキシ樹脂
などが例示される。これらのエポキシ樹脂は、1種また
は2種以上組合せて使用することもできる。[0020] In addition, epoxy resin contains 2 in one molecule.
Examples include bisphenol A-based epoxy resins, bisphenol F-based epoxy resins, phenol novolak epoxy resins, cresol novolak epoxy resins, and various rubber-modified epoxy resins. These epoxy resins may be used alone or in combination of two or more.
【0021】硬化剤は、エポキシ樹脂の硬化反応に通常
用いられる硬化剤であり、鎖状脂肪族ポリアミン、環状
脂肪族ポリアミン、脂肪・芳香族ポリアミン、芳香族ポ
リアミン、芳香族ジアミン共融混合物などの第1アミン
類、各種のアダクト類からなる変性ポリアミン類、第2
および第3アミン類、ポリアミド樹脂類とそのアダクト
類、各種のイミダゾール類および各種の潜在性硬化剤な
どが例示される。これらの硬化剤は、1種または2種以
上組合せて使用することもできる。The curing agent is a curing agent commonly used in the curing reaction of epoxy resins, and includes chain aliphatic polyamines, cycloaliphatic polyamines, aliphatic/aromatic polyamines, aromatic polyamines, aromatic diamine eutectic mixtures, etc. Primary amines, modified polyamines consisting of various adducts, secondary amines,
Examples include tertiary amines, polyamide resins and adducts thereof, various imidazoles, and various latent curing agents. These curing agents may be used alone or in combination of two or more.
【0022】本発明に用いられる樹脂組成物においては
、エポキシ樹脂中のエポキシ基が硬化剤や、ビニルエス
テル類と不飽和カルボン酸類からなる共重合体中のカル
ボキシル基と反応することによって、最終的には共重合
体が架橋されて、制振性、接着強度および高温下におけ
る接着耐熱性などの諸特性が満足される。この架橋反応
は、製造ラインの実際の操業条件に合わせた適当な反応
速度にするために、使用するエポキシ樹脂と硬化剤の種
類と量が適宜組合せられる。そして、前記制振性、接着
強度などの諸特性を満たす配合量としては、エポキシ樹
脂は25〜 100重量部、硬化剤は 5〜50重量部
の範囲内であることが望ましい。In the resin composition used in the present invention, the epoxy group in the epoxy resin reacts with the curing agent and the carboxyl group in the copolymer consisting of vinyl esters and unsaturated carboxylic acids, so that the final The copolymer is crosslinked to satisfy various properties such as vibration damping properties, adhesive strength, and adhesive heat resistance at high temperatures. In this crosslinking reaction, the types and amounts of the epoxy resin and curing agent used are appropriately combined in order to achieve an appropriate reaction rate in accordance with the actual operating conditions of the production line. The amount of the epoxy resin to satisfy various properties such as vibration damping properties and adhesive strength is preferably 25 to 100 parts by weight and the curing agent is 5 to 50 parts by weight.
【0023】また、制振金属板の製造条件を考慮すると
、本発明の共重合体、エポキシ樹脂および硬化剤からな
る樹脂組成物は、トルエン、MEK(メチルエチルケト
ン)、酢酸エチルなどの汎用溶剤に可溶であるものが好
ましく、溶剤に溶解することにより、金属板への塗工が
容易になり、積層部へのガス巻き込みがなく、加工時ス
ポット溶接性付与のために導電性フィラーや添加剤など
の混合あるいは添加が容易になるなどの利点が生じる。Furthermore, considering the manufacturing conditions of the vibration-damping metal plate, the resin composition comprising the copolymer, epoxy resin, and curing agent of the present invention is compatible with general-purpose solvents such as toluene, MEK (methyl ethyl ketone), and ethyl acetate. Preferably, it is dissolved in a solvent, which makes it easier to coat the metal plate, prevents gas from being entrained in the laminated part, and contains conductive fillers, additives, etc. to provide spot weldability during processing. Advantages such as ease of mixing or adding occur.
【0024】また、酸化防止剤は、樹脂組成物の耐熱性
を向上させるために添加される。この酸化防止剤の添加
量は、樹脂組成物に対して通常 1〜 4重量%である
。酸化防止剤は、重合終了後重合反応液に直接加えるこ
ともできる。また、酸化防止剤はニーダーなどの適当な
混合装置を用いて適宜添加される。この酸化防止剤とし
ては、高分子量ヒンダードフェノール〔(イルガノック
ス1076):日本チバガイギー社製〕などが賞用され
る。[0024] Furthermore, an antioxidant is added to improve the heat resistance of the resin composition. The amount of this antioxidant added is usually 1 to 4% by weight based on the resin composition. The antioxidant can also be added directly to the polymerization reaction solution after completion of polymerization. Further, the antioxidant is appropriately added using a suitable mixing device such as a kneader. As this antioxidant, high molecular weight hindered phenol [(Irganox 1076) manufactured by Nippon Ciba Geigy Co., Ltd.] and the like are used.
【0025】さらに、本発明に用いる樹脂組成物には、
制振金属板の溶接性の改良を目的として導電性を付与す
るため、カーボンブラック、黒鉛、金属粉などの各種の
導電性フィラーを配合することができる。かくして得ら
れた樹脂組成物の特性は、制振性、接着強度、接着耐熱
性および塗工性もよい。Furthermore, the resin composition used in the present invention includes:
Various conductive fillers such as carbon black, graphite, and metal powder can be blended to impart conductivity to the damping metal plate for the purpose of improving weldability. The properties of the resin composition thus obtained include good vibration damping properties, adhesive strength, adhesive heat resistance, and coatability.
【0026】上述した樹脂組成物は、金属板の間に介在
されて制振金属板を構成する。これらの金属板の種類は
、特に限定されるものではない。また、これらの金属板
は、同一あるいは異種のいずれであってもよい。かかる
金属板としては、例えば鋼板(表面処理鋼板、ステンレ
ス鋼板などを含む)、アルミニウム板、銅板およびこれ
らの表面処理板などがその用途、環境などに応じていず
れも好適に用いられる。The above-mentioned resin composition is interposed between metal plates to form a damping metal plate. The types of these metal plates are not particularly limited. Furthermore, these metal plates may be of the same type or of different types. As such a metal plate, for example, a steel plate (including a surface-treated steel plate, a stainless steel plate, etc.), an aluminum plate, a copper plate, and a surface-treated plate thereof can be suitably used depending on the application, environment, and the like.
【0027】中間樹脂層の厚さは、30〜 150μm
の範囲にあるのが好ましく、30μm 未満では積層
する金属板の表面状態や反りなどの影響を受け、接着強
度が十分に得られない場合が生じる。また 150μm
を超えるとプレス成形性が著しく悪くなる。[0027] The thickness of the intermediate resin layer is 30 to 150 μm.
If it is less than 30 μm, it may be affected by the surface condition or warpage of the metal plates to be laminated, and sufficient adhesive strength may not be obtained. Also 150μm
If it exceeds this, press formability will deteriorate significantly.
【0028】本発明で使用する樹脂組成物は、共重合体
、エポキシ樹脂と硬化剤が別々に保管され、制振金属板
製造の際に両者が混合されるが、潜在性硬化剤は勿論、
反応性の低い芳香族ポリアミンなどを用いる場合、該樹
脂組成物は室温下でかなり安定に存在するため、一液型
としても供給できる。一液型あるいは二液型は、樹脂組
成あるいは製造ラインの実際の操業条件に合わせて適宜
選択されるが、二液型の場合は二液を適正に配合し、製
造ラインに供給する必要があるので、一液型の方が操業
面からは好ましい。[0028] In the resin composition used in the present invention, the copolymer, epoxy resin, and hardening agent are stored separately, and the two are mixed during the production of vibration-damping metal plates.
When an aromatic polyamine or the like having low reactivity is used, the resin composition exists fairly stably at room temperature, so it can be supplied as a one-component type. One-component type or two-component type is selected depending on the resin composition and actual operating conditions of the production line, but in the case of two-component type, it is necessary to properly mix the two components and supply it to the production line. Therefore, the one-component type is preferable from an operational standpoint.
【0029】前記の樹脂組成物を用いて制振金属板を製
造するには、切り板を使用するバッチ法、コイルを使用
する連続法などの任意の方法を採用することができる。
また、金属板に樹脂組成物を形成する方法としては、塗
料状の樹脂溶液を金属板に塗工した後、溶剤を乾燥して
金属板を加熱圧着することにより貼り合わせる方法、あ
るいは離型紙、ポリオレフィンなどの離型フィルム上に
樹脂組成物層を形成し、金属板に樹脂組成物を移行させ
て金属板を加熱圧着することにより貼り合わせる方法な
ど、任意の方法を採用することができる。[0029] In order to produce a damping metal plate using the resin composition, any method such as a batch method using a cut plate or a continuous method using a coil can be adopted. In addition, methods for forming a resin composition on a metal plate include a method of applying a paint-like resin solution to the metal plate, drying the solvent, and bonding the metal plate by heat-pressing, or a method using release paper, Any method can be employed, such as a method of forming a resin composition layer on a release film such as polyolefin, transferring the resin composition to a metal plate, and bonding the metal plate by heat and pressure bonding.
【0030】[0030]
【実施例】以下、本発明の実施例を説明するが、これに
よって本発明は限定されるものではない。実施例で用い
たビニルエステル類と不飽和カルボン酸類との共重合体
の特性の測定方法、積層・接着方法、制振金属板の特性
の測定方法などは、以下のとおりである。[Examples] Examples of the present invention will be described below, but the present invention is not limited thereto. The methods for measuring the characteristics of the copolymer of vinyl esters and unsaturated carboxylic acids used in the examples, the laminating/adhering method, and the method for measuring the characteristics of the vibration-damping metal plate are as follows.
【0031】■共重合体の数平均分子量(バーMn)共
重合体をテトラハイドロフランに溶解し、日本ウォータ
ーズリミテッド社製のサイズ排除クロマトグラフィー(
GPC)を用いて、ポリスチレン換算によりバーMnを
求めた。■Number average molecular weight of the copolymer (bar Mn) The copolymer was dissolved in tetrahydrofuran and subjected to size exclusion chromatography (manufactured by Nippon Waters Limited).
Mn was determined using polystyrene conversion (GPC).
【0032】■共重合体のガラス転移温度(Tg)理学
電機社製の熱流束型示差走査熱量計を用いて、加熱速度
10℃/分で測定した。(2) Glass transition temperature (Tg) of copolymer Measured using a heat flux differential scanning calorimeter manufactured by Rigaku Corporation at a heating rate of 10° C./min.
【0033】■使用金属板0.8mm厚さの冷延鋼板を
脱脂して用いた。■Metal Plate Used A cold-rolled steel plate with a thickness of 0.8 mm was degreased and used.
【0034】■積層・接着方法
アセトン溶媒中で合成した共重合体溶液に、所定量のエ
ポキシ樹脂とプロピレングリコールメチルエーテルに溶
解した硬化剤を加え、必要に応じてMEKを加え、固形
分約30%の溶液とし、ロールコーターを用い、鋼板の
片面に樹脂膜厚さ100μm になるように塗布し、塗
布後乾燥器( 140℃× 3分間)で乾燥・脱溶媒し
た。その後、樹脂の塗布面に他の鋼板を重ね、圧縮成形
機( 240℃× 2分間×面圧 20kgf/cm2
)で加熱、接着し評価を行った。■ Lamination/adhesion method A predetermined amount of epoxy resin and a curing agent dissolved in propylene glycol methyl ether are added to a copolymer solution synthesized in an acetone solvent, and MEK is added as necessary to reduce the solid content to approximately 30. % solution was applied to one side of a steel plate using a roll coater to give a resin film thickness of 100 μm, and after application, it was dried and the solvent was removed in a drier (140° C. for 3 minutes). After that, another steel plate was placed on the resin coated surface, and it was molded using a compression molding machine (240℃ x 2 minutes x surface pressure 20kgf/cm2).
) was heated and bonded and evaluated.
【0035】■接着強度
上記で積層・接着した鋼板を35mm幅に裁断し、剪断
引張り強度の測定を室温でJIS法(K6850)に準
じて行った。同様に、25mm幅に裁断し、T剥離強度
の測定を室温でJIS法(K6854)に準じて行った
。① Adhesive Strength The steel plates laminated and bonded above were cut to a width of 35 mm, and the shear tensile strength was measured at room temperature according to the JIS method (K6850). Similarly, it was cut to a width of 25 mm, and the T-peel strength was measured at room temperature according to the JIS method (K6854).
【0036】■制振性
上記で積層・接着した鋼板から短冊型試料(20mm幅
× 200mm長)を作成し、B&K(Briuel
and Kjeaer Ltd.)社製複素弾性
係数測定装置を用い、共振法により測定周波数 250
Hzで振動減衰試験を行った。■Vibration damping property A rectangular sample (20 mm width x 200 mm length) was prepared from the laminated and bonded steel plates described above, and was tested at B&K (Briuel
and Kjeaer Ltd. ) using a complex elastic modulus measuring device made by the company, the measurement frequency was 250 by the resonance method.
Vibration damping tests were conducted at Hz.
【0037】■成形性
上記で積層・接着した鋼板を20mm幅× 200mm
長に裁断し、その端部を10mm直角に折り曲げ加工し
、曲げ部が剥離したものを×、変化のないものを○で示
した。同様に、折り曲げ加工したものを 150℃の恒
温槽中で 8時間放置し、曲げ部が剥離したものを×、
変化のないものを○で示した。■ Formability The steel plates laminated and bonded above are 20 mm wide x 200 mm.
The pieces were cut into long pieces, and the ends were bent at a right angle of 10 mm. Those with peeling at the bent portions were marked with an x, and those with no change were marked with a mark of ○. Similarly, the bent parts were left in a constant temperature bath at 150℃ for 8 hours, and the bent parts peeled off.
Items with no change are marked with a circle.
【0038】表1、表2および表3に示すアクリル酸エ
ステル樹脂、エポキシ樹脂および硬化剤を準備し、それ
ぞれを同表に示す混合割合で混合した樹脂組成物を介在
させて、上記■積層・接着方法の要領で制振鋼板を製造
した。これにより得られた制振鋼板の特性(接着強度、
成形性、制振性の温度依存性)を測定し、その測定結果
を表1、表2および表3に合わせて示す。The acrylic ester resin, epoxy resin, and curing agent shown in Tables 1, 2, and 3 were prepared, and a resin composition prepared by mixing each of them at the mixing ratio shown in the table was interposed, and the above-mentioned (1) lamination/ A damping steel plate was manufactured using the gluing method. The properties of the damping steel plate obtained through this process (adhesive strength,
The temperature dependence of moldability and vibration damping properties) were measured, and the measurement results are shown in Tables 1, 2, and 3.
【0039】表1、表2および表3に示す測定結果によ
れば、表3の実施例9で、折り曲げ加工したものを 1
50℃の恒温槽中で 8時間放置する剥離試験で、剥離
が観られた以外は、不具合が観察されず、本発明に係わ
る樹脂組成物を用いることにより、いずれも優れた特性
を有する制振鋼板が得られた。According to the measurement results shown in Tables 1, 2, and 3, the bending process of Example 9 in Table 3 was
In a peel test in which the resin composition was left in a constant temperature bath at 50°C for 8 hours, no defects were observed except for peeling. A steel plate was obtained.
【0040】尚、表中、GY260:ビスフェノールA
型エポキシ樹脂(日本チバガイギー社製、エポキシ当量
180〜 200)、YL6066:ゴム変性エポキ
シ樹脂(油化シェルエポキシ社製、エポキシ当量 35
2)、EP−4005:ビスフェノールAアルキレンオ
キサイド付加物(旭電化工業社製、エポキシ当量 50
0〜 575)、YR−450:可撓性エポキシ樹脂(
東都化成社製、エポキシ当量 413)、MY−24と
AH−162とAH−209:アミキュア(味の素社製
)を示し、この例ではそれらを使用した。[0040] In the table, GY260: Bisphenol A
Type epoxy resin (manufactured by Nippon Ciba Geigy, epoxy equivalent: 180-200), YL6066: Rubber-modified epoxy resin (manufactured by Yuka Shell Epoxy, epoxy equivalent: 35)
2), EP-4005: Bisphenol A alkylene oxide adduct (manufactured by Asahi Denka Kogyo Co., Ltd., epoxy equivalent: 50
0 to 575), YR-450: Flexible epoxy resin (
MY-24, AH-162, and AH-209: Amicure (manufactured by Ajinomoto Co., Ltd.) were used in this example.
【0041】[0041]
【表1】[Table 1]
【0042】[0042]
【表2】[Table 2]
【0043】[0043]
【表3】[Table 3]
【0044】アクリル酸エステル樹脂として、アクリル
酸n−ブチルとアクリル酸からなる樹脂組成物を用いて
試作した制振鋼板の雰囲気温度と損失係数(tanδ)
の関係を検討した結果を図1に示す。Atmospheric temperature and loss coefficient (tan δ) of a vibration damping steel plate prototyped using a resin composition consisting of n-butyl acrylate and acrylic acid as an acrylic ester resin
Figure 1 shows the results of examining the relationship.
【0045】図1から明らかなように、前記の樹脂組成
物を用いて試作した制振鋼板は、常温(20〜40℃)
域での損失係数が 0.1以上であり、制振性が高い。[0045] As is clear from Fig. 1, the vibration damping steel plate prototyped using the resin composition described above was
The loss coefficient in the area is 0.1 or more, and the damping performance is high.
【0046】同様に、モノマーの種類を変えたアクリル
酸エステル樹脂を用いて試作した制振鋼板の雰囲気温度
と損失係数(tanδ) の関係を検討した結果の一例
を図2に示す。Similarly, FIG. 2 shows an example of the results of examining the relationship between the ambient temperature and the loss coefficient (tan δ) of vibration damping steel plates prototyped using acrylic acid ester resins with different types of monomers.
【0047】図2から明らかなように、モノマーの種類
を変えることにより、損失係数の極大温度、極大値およ
び温度依存性を好ましい方向に変化させることができる
。As is clear from FIG. 2, by changing the type of monomer, the maximum temperature, maximum value, and temperature dependence of the loss coefficient can be changed in a preferable direction.
【0048】したがって、本発明に使用される樹脂組成
物を介在させた制振金属板は、使用条件に応じて常温用
または恒温用として好適であることが分かる。[0048] Therefore, it can be seen that the vibration-damping metal plate interposed with the resin composition used in the present invention is suitable for use at room temperature or constant temperature depending on the usage conditions.
【0049】[0049]
【発明の効果】本発明は、以上説明したように構成され
ているから、ビニルエステル類と不飽和カルボン酸類と
の共重合体に併用されるエポキシ樹脂と硬化剤が三次元
架橋して樹脂組成物中に架橋体を形成するとともに、共
重合体中のカルボキシル基も同時に架橋し、金属材料と
の界面の接着性向上にも有効に働き、制振性を低下させ
ることなしに、プレス加工性に大きな影響を与える高い
接着強度(剪断引張り強度)と焼き付け塗装工程の高温
下における接着耐熱性が可能になったものと考えられ、
好ましい制振性、接着強度および接着耐熱性を具備する
制振金属板を得ることができ、産業上きわめて有用であ
る。Effects of the Invention Since the present invention is constructed as described above, the epoxy resin and curing agent used together with the copolymer of vinyl esters and unsaturated carboxylic acids are three-dimensionally crosslinked to form a resin composition. In addition to forming a crosslinked product in the object, the carboxyl groups in the copolymer are also crosslinked at the same time, which effectively improves the adhesion at the interface with metal materials, improving press workability without reducing vibration damping properties. This is thought to be due to the high adhesive strength (shear tensile strength) that has a large effect on the adhesive properties and the adhesive heat resistance under the high temperatures of the baking painting process.
A vibration-damping metal plate having favorable vibration-damping properties, adhesive strength, and adhesive heat resistance can be obtained, and is extremely useful industrially.
【図1】本発明制振金属板の損失係数の温度依存性をの
一例を示すための実測グラフ図である。FIG. 1 is an actual measurement graph showing an example of the temperature dependence of the loss coefficient of the damping metal plate of the present invention.
【図2】本発明制振金属板の損失係数の温度依存性をの
一例を示すための実測グラフ図である。FIG. 2 is an actual measurement graph showing an example of the temperature dependence of the loss coefficient of the damping metal plate of the present invention.
Claims (1)
損失正接(tanδ) の極大を示す温度が−70〜
120℃の間にあるビニルエステル類と不飽和カルボン
酸類との共重合体 100重量部に対し、 1分子中に
2個以上のエポキシ基を有するエポキシ樹脂を25〜
100重量部、硬化剤を 5〜50重量部を配合して
なる中間層用樹脂組成物を、複数の金属板の間に、30
〜 150μm の範囲の厚みで介在せしめてなること
を特徴とする制振金属板。Claim 1: As an essential component, the temperature at which the loss tangent (tan δ) reaches a maximum due to glass transition is -70 to -70.
For 100 parts by weight of a copolymer of vinyl esters and unsaturated carboxylic acids between 120°C and 25 to 25 parts by weight of an epoxy resin having two or more epoxy groups in one molecule.
A resin composition for an intermediate layer containing 100 parts by weight and 5 to 50 parts by weight of a curing agent was placed between a plurality of metal plates at 30 parts by weight.
A vibration-damping metal plate characterized in that the vibration-damping metal plate is interposed with a thickness in the range of 150 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3079894A JPH04312845A (en) | 1991-04-12 | 1991-04-12 | Vibration-damping metal plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3079894A JPH04312845A (en) | 1991-04-12 | 1991-04-12 | Vibration-damping metal plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04312845A true JPH04312845A (en) | 1992-11-04 |
Family
ID=13702984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3079894A Withdrawn JPH04312845A (en) | 1991-04-12 | 1991-04-12 | Vibration-damping metal plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04312845A (en) |
-
1991
- 1991-04-12 JP JP3079894A patent/JPH04312845A/en not_active Withdrawn
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