JPH0430795Y2 - - Google Patents

Description

[Detailed explanation of the invention] "Industrial application field" This invention is an IC for testing high-speed response ICs, for example.
This invention relates to an IC socket suitable for use in test equipment.

``Prior Art'' To test the functionality of an IC, it is necessary to connect the IC to a predetermined electrical circuit and put it into operation. in this case
Since it is not possible to connect the IC terminals to the electrical circuit by soldering, it is usually done by using a socket.
A method is adopted in which ICs are removably connected to an electrical circuit, and the ICs are tested one after another while being automatically replaced.

4 and 5 show conventional IC sockets.

The IC socket shown in FIG. 4 is a socket that fits an IC whose terminals are inserted into holes in a printed circuit board and mounted.

In other words, a contact storage hole 2 is formed in the insulating block 1, and a gassho-shaped contact 3 is installed in this contact storage hole 2.
The structure is such that the terminal 5 of the IC 4 is inserted and contacted.

The IC socket shown in FIG. 5 shows the structure of an IC socket for connecting a surface mount IC.

In this IC socket, a contact piece 6 is attached to a contact storage hole 2 formed in an insulating block 1, and a contact piece 6 for surface mounting is attached to the contact piece type contact 6.
The structure is such that the terminals 8 of the IC 7 are pressed into contact with each other.

"Problem that the invention aims to solve" Contacts 3 and 6 of the conventional IC socket are IC
For the terminals 5 or 8 of 4 or 7, a mechanical length L between the support portion 9 and the contact portion is required in consideration of ensuring contact force and spring life.

As a result, an inductance component 10 is generated at the contact 3 or 6 as shown in FIG. 6, and when a high-speed signal flows, this inductance component 1
0 becomes a nuisance.

In particular, if an inductance component exists in the power supply terminal circuit that supplies power to the IC, and if the current consumption changes at high speed as the IC operates, that high-speed current will pass through the inductance component 10. This causes a voltage drop, causing the power supply voltage applied to the IC to change rapidly as shown in Figure 7, which adversely affects the operation of the IC under test and reduces the reliability of testing high-speed ICs. It's making it worse.

``Means for solving the problem'' In this idea, two mutually insulated conductive layers are formed on the outer wall of the insulating block that constitutes the IC socket, and a power supply circuit is connected to these two conductive layers. At the same time, these two conductive layers and a contact that contacts the power supply terminal of the IC are connected by a connecting piece, and a capacitor is further connected between the two conductive layers.

According to the structure of this invention, since the conductive layer is formed on the outer wall surface of the insulating block constituting the IC socket, the thickness and area of the conductive layer can be increased.

As a result, the inductance component of the conductive layer can be reduced, and this conductive layer can be connected via the connection piece.
Since it is connected to the free end side of the contact that contacts the power supply terminal of the IC, the inductance component of the contact that contacts the power supply terminal can be short-circuited by the conductive layer, and the inductance component can be substantially removed.

Furthermore, since this idea connects a capacitor between two conductive layers, the capacitor is connected very close to the IC's power supply terminals, which reduces the power supply voltage. The effect of removing fluctuations can be obtained.

``Example'' Figure 1 shows an example of this invention. In this embodiment, a case is shown in which this invention is applied to an IC socket equipped with a palm-shaped contact 3.

In the figure, 11A and 11B indicate two conductive layers formed on the outer wall surface of the insulating block 1. These two conductive layers 11A and 11B can be formed by depositing copper foil or the like, for example.

This example shows the case where this idea is applied to a socket for a daily in-line IC. For this reason
The contacts 3 of the IC socket are housed in contact housing holes 2 formed in a daily in-line arrangement with respect to the insulating block 1, and conductive layers 11A, 11B is deposited and formed.

In the case of a dual-in-line type IC, power supply terminals are provided at opposite ends of two rows of terminal arrays.
Therefore, in the example of FIG. 1, 3A and 3B indicate contacts that come into contact with the power supply terminal of IC4.

In this invention, a connecting piece 12 is used to connect the free ends of the contacts 3A, 3B that come into contact with the power terminal and the conductive layers 11A, 11B.

For this purpose, a slit 13 is formed between the contact housing hole 2, which houses the contacts 3A and 3B, and the outer wall surface.
is formed, and the connection piece 12 is inserted through this slit 13.
is inserted between the contact housing hole 2 and the outer wall surface. One end of the connecting piece 12 is bent into an L shape and welded or soldered to the conductive layers 11A and 11B, and the other end is attached to the free ends of the contacts 3A and 3B, especially at the contact portion with the terminal 5 of the IC4. Connect electrically as close as possible.

The biasing force applied to the contact piece 12 from the contacts 3A and 3B is due to the deflection of the contact piece 12 and the conductive layer 11A,
11B can be absorbed by deflecting outward.

The conductive layers 11A and 11B are also extended to the back side of the insulating block 1, and the contact 3 is formed at this portion.
It is electrically connected to the base sides of A and 3B, and a capacitor 14 is connected to the portions facing each other. This capacitor 14 may have a capacitance of, for example, about 0.3 microfarads.

FIG. 3 shows another embodiment of this invention. This example shows the case where this idea is applied to a flat mount type IC socket.

In this case as well, a slit 13 is formed between the contact housing hole 2 and the outer wall surface, the connecting piece 12 is inserted between the outer wall surface of the insulating block 1 and the contact housing hole 2 through the slit 13, and one end is connected to the conductive layer 11.
A and 11B, respectively, and the other end is connected to contacts 6A and 6B, respectively, which are in contact with the power supply terminal of IC7.

"Effects of the invention" As explained above, according to this invention, the contact 3A that contacts the power supply terminal of the IC of the IC socket,
The free ends of 3B or 6A, 6B are connected to the conductive layers 11A, 11B formed on the outer wall surface of the insulating block 1, and the contacts 3A, 3B or 6A, 6B are connected.
Contacts 3A, 3B and 6A, 6B are connected to conductive layers 11A, 11B at their base ends.
is electrically connected by the conductive layers 11A and 11B, and transfers the inductance component to the conductive layers 11A and 11B.
Can be shorted by.

Therefore, it can be seen that the inductance component of contacts 3A, 3B or 6A, 6B is equivalently removed, and as a result, even if a high-speed operation type IC is connected and operated, there is no inductance component in the power supply circuit, so the IC The power supply voltage applied to the IC does not fluctuate due to changes in the current flowing through the IC.
Therefore, the IC can operate stably.

Further, a capacitor 1 is placed between the conductive layers 11A and 11B.
4 is connected, even if a voltage fluctuation occurs due to a slight inductance component present in the connecting piece 12, etc., this voltage fluctuation can be smoothed by this capacitor 14, and the power supply voltage of the IC can be further increased. It can be stabilized.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an embodiment of this invention, Fig. 2 is a sectional view taken along line A-A shown in Fig. 1, Fig. 3 is a sectional view showing a modified embodiment of this invention, and Fig. 4. and FIG. 5 is a sectional view for explaining the conventional technology,
FIG. 6 is an equivalent circuit diagram for explaining the drawbacks of the prior art, and FIG. 7 is a waveform diagram for explaining the drawbacks of the prior art. 1... Insulation block, 2... Contact storage hole, 3, 6... Contact, 3A, 3B, 6A,
6B...Contact connected to the power supply terminal of the IC,
4...Dual line type IC, 5, 8...IC terminal, 7...Plane mounting IC, 11A, 11B...
Conductive layer, 12... Connection piece, 13... Slit, 1
4... Capacitor.

Claims (1)

[Scope of Claim for Utility Model Registration] A: In an IC socket configured with a contact that contacts the terminal of an IC installed in a contact storage hole formed in an insulating block, B. C. At least two conductive layers attached to each other, C. Connecting pieces that respectively connect these two conductive layers and the free end side of the contact that contacts the power supply terminal of the IC, and D. Between the two conductive layers. An IC socket consisting of a connected capacitor and .