JPH04304372A - Multi-chamber vacuum treating device - Google Patents

Abstract

PURPOSE:To improve the efficiency of a substrate handling arm contained in a carrier chamber in carrying the substrate and the throughput in the multi- chamber vacuum treating device. CONSTITUTION:A carrier chamber 1 has a substrate handling arm 7 provided with two substrate receivers, a vacuum treating chamber 4a has two substrate lifters 9a and 10a, and the treated substrate is replaced by a substrate to be treated by one reciprocation of the arm 7. Consequently, the efficiency in carrying the substrate is improved, and the throughput is increased.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a vacuum processing apparatus for processing substrates in a vacuum container, and more particularly to a multi-chamber vacuum processing apparatus having a plurality of vacuum processing chambers for processing substrates one by one. Regarding.

0002

2. Description of the Related Art Vacuum processing equipment is currently used in many fields including the semiconductor industry. The vacuum processing apparatus includes a sputtering apparatus for forming a thin film on the surface of a substrate, a CVD apparatus, and a dry etching apparatus for etching the surface of the substrate. In recent years, L.S.
As wiring becomes finer and more multilayered due to higher integration of I, thin films of different materials are continuously formed under different conditions, or different processes such as sputtering, CVD, and dry etching are applied to the substrate in the atmosphere. There has been a growing demand for continuous processing in a vacuum without exposure. In response to these demands, a multi-chamber vacuum processing apparatus having a plurality of vacuum processing chambers each having an independent exhaust system has been developed. Multi-chamber structured vacuum processing equipment is also called multi-chamber equipment, and since each chamber is completely independent, sputtering materials,
It also has the advantage that mutual contamination of substances such as reaction products and process gases is blocked, and that substrate processing can be performed under different conditions in each chamber. The order of processing can also be arbitrarily selected, and a single device can be used in a variety of ways.

[0003]Generally, a multi-chamber structure type vacuum processing apparatus is shown in FIG.
As shown in A, around the transfer chamber 1 located in the center, there is a load lock chamber 3 for loading and unloading substrate storage cassettes 2 containing substrates in atmospheric conditions, a plurality of vacuum processing chambers 4a, and a vacuum processing chamber. 4b, a vacuum processing chamber 4c, and a vacuum processing chamber 4d are provided, and gate valves 5a, 5b,
The chambers are connected via 5c, 5d, and 5e, and each chamber is evacuated by an independent vacuum pump. Although FIG. 3A shows an example having four vacuum processing chambers, the number changes depending on the application. Generally, it often has 3 to 5 vacuum processing chambers. A substrate handling arm 7 for transferring the substrate 6 is provided inside the transfer chamber 1, and the substrate handling arm 7 rotates around point 0 and expands and contracts to move the substrate 6 to the load lock chamber 3. and a substrate 6 for each vacuum processing chamber 4a, 4b, 4c, 4d.
is accessed.

On the other hand, each vacuum processing chamber 4a, 4b, 4c, 4
Inside d, a substrate stage 8a for placing a substrate,
8b, 8c, and 8d, and each substrate stage has substrate lifters 13a, 13b, and 13 that move linearly in the vertical direction.
c, 13d are built-in. FIG. 3B(a) is a plan view showing the vacuum processing chamber 4a, and FIG. 3B(b) is a plan view showing the vacuum processing chamber 4a.
FIG. 2 is a side view of FIG. As shown in FIG. 3B(b), the substrate lifter 13a supports the substrate 6 from below, and moves the substrate 6 between the substrate stage 8a and the substrate handling arm 7 by linearly moving between positions I and II. It has the role of receiving and receiving. After the processing in the vacuum processing chamber is completed, a flow chart showing the operation of returning the processed substrate from the vacuum processing chamber to the transfer chamber and the operation of transporting the unprocessed substrate from the transfer chamber to the vacuum processing chamber is shown in FIG. 4(a). (
b). Also, the vacuum processing chamber 4a → 4b → 4c → 4d
Table 2 below shows the transition of the substrate transport state in each chamber when processing is performed in the following order.

[0005] The numbers in the columns of transfer chamber, vacuum processing chamber, and load lock chamber in Table 2 indicate the number of substrates, such as the first substrate, second substrate, third substrate, etc. means,
Also, the numbers in the operation column of the substrate handling arm indicate rotation to the adjacent chamber, i.e. 5÷36.
The number of operations is shown when 0=72 degrees is set to 1, and for the expansion/contraction operation, the number of operations is shown when (extension + contraction) is set to 1.

[0006]

[Table 2]

[0007]

[Problems to be Solved by the Invention] In the above-mentioned conventional multi-chamber structure type vacuum processing apparatus, when the substrate handling arm makes an extending motion in a series of operations for returning the processed substrate from the vacuum processing chamber to the transfer chamber, The board handling arm does not carry any board. On the other hand, in a series of operations for sending a substrate to be processed into a vacuum processing chamber, when the substrate handling arm performs a retracting operation, the substrate handling arm does not place a substrate on it. In this way, the substrate handling arm actually places and transports the substrate for about half of its entire operation, and as a result, the transport efficiency is very low and it takes a long time. In a multi-chamber structured vacuum processing apparatus having four vacuum processing chambers as shown in FIG. 3A, vacuum processing chambers 4a→4b
When substrate processing is performed for 60 seconds in each chamber in the order of →4c→4d, the throughput is as low as about 20 sheets/hr.

As described above, while the conventional multi-chamber vacuum processing apparatus has many advantages in terms of process, it also has the disadvantage of low throughput.

An object of the present invention is to provide a multi-chamber structure type vacuum processing apparatus in which a processed substrate and an unprocessed substrate can be replaced by one reciprocating process of the substrate handling arm to each vacuum processing chamber. It is about providing.

0010

[Means for Solving the Problems] In order to achieve the above object, in the multi-chamber vacuum processing apparatus according to the present invention, a plurality of vacuum processing chambers for processing substrates one by one are arranged around the transfer chamber. It is a multi-chamber structure type vacuum processing apparatus equipped with two substrate holders on a substrate handling arm for loading and unloading substrates between the transfer chamber and each vacuum processing chamber. It is equipped with two sets of substrate lifter mechanisms for supporting the substrate from the back side and moving it in the vertical direction.

[0011]

[Operation] The multi-chamber structured vacuum processing apparatus of the present invention is equipped with a substrate handling arm having two substrate holders in a transfer chamber, and two substrate lifters in each vacuum processing chamber, as shown below. An operation of exchanging the processed substrate and the unprocessed substrate is performed in this order. First, after processing in the vacuum processing chamber, the processed substrate is lifted from the substrate stage by one of the substrate lifters, and then the substrate handling arm carrying the unprocessed substrate extends into the vacuum processing chamber. In this state, the processed substrate is placed on the vacant substrate holder of the substrate handling arm, and the unprocessed substrate is lifted from the substrate holder by the other substrate lifter. Thereafter, the substrate handling arm retracts into the transfer chamber and the substrate lifter carrying the unprocessed substrate descends, so that the unprocessed substrate is placed on the substrate stage, and the exchange between the processed substrate and the unprocessed substrate is completed.

The two substrate lifters perform rotational movement in the horizontal plane in addition to linear movement in the vertical direction, and operate independently so as not to collide with each other.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1A is a plan view of a multi-chamber vacuum processing apparatus according to an embodiment of the present invention.

In the figure, the apparatus of the present invention has a load lock chamber 3 for loading and unloading substrate storage cassettes 2 containing substrates in atmospheric conditions, and four vacuum processing chambers around a transfer chamber 1 located in the center. 4a, a vacuum processing chamber 4b, a vacuum processing chamber 4c, and a vacuum processing chamber 4d. In addition, the transfer chamber 1 and each vacuum processing chamber 4a, 4b,
4c, 4d and the load lock chamber 3 is provided with a gate valve 5.
a, 5b, 5c, 5d, and 5e, each of which is evacuated by an independent vacuum pump.

Inside the transfer chamber 1, there are substrates 6 for the load lock chamber 3 and each vacuum processing chamber 4a, 4b, 4c, 4d.
The substrate handling arm 7 is provided with a substrate handling arm for transferring and receiving one sheet at a time, and the substrate handling arm 7 performs rotational movement around point 0 as well as telescopic movement.

Inside each of the vacuum processing chambers 4a, 4b, 4c, and 4d and the load lock chamber 3, there are substrate stages 8a, 8b, 8c, 8d, and 8e on which substrates are placed. 8c, 8d, and 8e are first substrate lifters 9a and 9 that move linearly in the vertical direction, respectively.
b, 9c, 9d, 9e and second substrate lifter 10a, 1
0b, 10c, 10d, and 10e are built-in.

As shown in FIG. 1B(a), the substrate handling arm 7 has two substrate holders, an upper substrate holder 11a and a lower substrate holder 1, so that two substrates can be placed at the same time.
1b.

FIG. 1B(b) is a plan view of the vacuum processing chamber 4a;
FIGS. 1B(c) and 1C(d) are schematic side views of the substrate processing chamber 4a viewed from the transfer chamber 1 side and from a direction perpendicular to the transfer chamber 1, respectively. As shown in the figure, the first and second substrate lifters 9a
, 10a are L-shaped shafts 9a-1, 10a-1, and a circular plate 9a-2 for supporting the board from the back side.
, 10a-2, and in addition to linear movement in the vertical direction, it also performs rotational movement in a horizontal plane around the linear movement axis. As shown in FIG. 1(e), both the first and second substrate lifters 9a and 10a are I, II, III, IV, and V.
The substrate stage 8a is set to stop at five heights, and the substrate stage 8a is set to stop at five heights.
Circular plate 9a-2 of substrate lifter 9a, 10a of
, 10a-2, three recesses 12a-1,
12a-2 and 12a-3 are provided. In the state of height I, one of the board lifters is always attached to the central recess 12a-2.
It is decided that it will be stored in That is, the circular plate 9a-2 is placed in the recess 12a-1, and the circular plate 10a is placed in the recess 12a-1.
-2 is housed in the recess 12a-2, or the circular plate 9a-2 is accommodated in the recess 12a-2.
Either 0a-2 is accommodated in the recess 12a-3. States other than height I, i.e. height II, II
In the I, IV, and V states, the first and second substrate lifters 9a
, 10a are both located on the vertical line at the center of the substrate stage, making it possible to support the substrate from the back side.

FIGS. 2A and 2B are flowcharts showing the operation of exchanging the processed substrates with the processed substrates after the processing in the vacuum processing chamber is completed. FIG. 2A shows the case where the unprocessed substrate is placed on the upper substrate holder 11a of the substrate handling arm 7, and FIG. 2B shows the case where the unprocessed substrate is placed on the lower substrate holder 11b. in this way,
The substrate handling arm 7 is connected to each vacuum processing chamber 4a, 4b,
Each time a substrate exchange operation is performed for 4c, 4d and the load lock chamber 3, the substrates are alternately placed on the upper substrate receiver 11a and the lower substrate receiver 11b. Although not shown, the load lock chamber 3 is equipped with a transport mechanism that transfers substrates between the substrate storage cassette 2 and the substrate stage 8e. Since the substrate is transferred in this manner, the transition of the substrate transfer state in each chamber is as shown in Table 1 when processing is performed in the order of vacuum processing chambers 4a→4b→4c→4d.

[0020]

[Table 1]

[0021]

Effects of the Invention As explained above, the multi-chamber structured vacuum processing apparatus of the present invention has two substrate handling arms in the transfer chamber.
In addition, two substrate lifters were installed in each vacuum processing chamber, and the sequence was such that unprocessed substrates and processed substrates were transferred to and from the substrate handling arm at the same time in the vacuum processing chamber. The substrate is placed on it during both expansion and contraction operations, and can be efficiently transported.

In the substrate transfer state transition of each chamber of the present invention and the conventional multi-chamber structured vacuum processing apparatus shown in Tables 1 and 2, after the processed substrate returns to the load lock chamber, the next processed substrate is transferred. When the number of operations of the substrate handling arm during this one cycle is compared, the number of movements of the substrate handling arm in one cycle is as follows:
Elongation + contraction = 6 Conventional multi-chamber structured vacuum processing equipment: Rotation =
15, elongation + contraction = 10, rotation is 1/3, elongation +
It can be seen that the movement is significantly reduced, with the shrinkage being 3/5. In the multi-chamber vacuum processing apparatus shown in FIG. 1A, the throughput is approximately 35 wafers/hour when substrate processing is performed for 60 seconds in each chamber in the order of vacuum processing chambers 4a → 4b → 4c → 4d.
r, which is an improvement of 1.75 times compared to the conventional rate of about 20 sheets/hr. As described above, the multi-chamber structured vacuum processing apparatus of the present invention can greatly improve the low processing capacity, which has traditionally been a major drawback.

[Brief explanation of the drawing]

FIG. 1A is a plan view showing a multi-chamber vacuum processing apparatus according to Example 1 of the present invention.

[Fig. 1B] (a) is an enlarged view showing the substrate handling arm built into the transfer chamber, (b) is a plan view of the vacuum processing chamber, (c)
2A and 2B are schematic side views of the vacuum processing chamber viewed from the transfer chamber side and from a direction perpendicular to the transfer chamber, respectively.

[Fig. 1C] (d) is a schematic side view of the vacuum processing chamber viewed from the transfer chamber side and from a direction perpendicular to the transfer chamber, and (e) is an explanatory diagram showing the height of the substrate lifter in the vacuum processing chamber. It is.

FIG. 2A is a flowchart of an operation for exchanging a processed substrate and an unprocessed substrate after processing in a vacuum processing chamber.

FIG. 2B is a flowchart of an operation for exchanging a processed substrate and an unprocessed substrate after processing in a vacuum processing chamber.

FIG. 3A is a plan view of a conventional multi-chamber vacuum processing apparatus.

FIG. 3B is a plan view of the vacuum processing chamber, and FIG. 3B is a side view of the vacuum processing chamber viewed from the transfer chamber side.

FIGS. 4A and 4B are flowcharts of the operation of returning a processed substrate from the vacuum processing chamber to the transfer chamber, and the operation of sending an unprocessed substrate from the transfer chamber to the vacuum processing chamber, respectively.

[Explanation of symbols]

1 Transfer chamber 2 Substrate storage cassette 3 Load lock chambers 4a, 4b, 4c, 4d Vacuum processing chambers 5a, 5b, 5
c, 5d, 5e Gate valve 6 Substrate 7 Substrate handling arm 8a, 8b, 8c, 8d, 8e Substrate stage 9a,
9b, 9c, 9d, 9e First substrate lifter 9a-
1 L-shaped shaft 9a-2 of the first board lifter
Circular plates 10a, 10b, 1 of the first substrate lifter
0c, 10d, 10e Second substrate lifter 10a-1 L-shaped shaft 10 of second substrate lifter
a-2 Circular plate 11a of second substrate lifter
Upper board receiver 11b Lower board receiver 12a, 12b, 12c Recessed part

Claims (1)

[Claims] 1. A multi-chamber structured vacuum processing apparatus in which a plurality of vacuum processing chambers for processing substrates one by one are arranged around a transfer chamber, wherein a plurality of vacuum processing chambers are provided between the transfer chamber and each vacuum processing chamber. The substrate handling arm for loading and unloading substrates is equipped with two substrate holders, and two substrate lift mechanisms are installed inside each vacuum processing chamber to support the substrate from the back side and move it vertically.
A multi-chamber structured vacuum processing device characterized by the following: