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JPH04262889A - Method for laser beam machining hollow tubular body - Google Patents

Method for laser beam machining hollow tubular body

Info

Publication number
JPH04262889A
JPH04262889A JP3042796A JP4279691A JPH04262889A JP H04262889 A JPH04262889 A JP H04262889A JP 3042796 A JP3042796 A JP 3042796A JP 4279691 A JP4279691 A JP 4279691A JP H04262889 A JPH04262889 A JP H04262889A
Authority
JP
Japan
Prior art keywords
liquid
melt
recovery
nozzle
pipe material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3042796A
Other languages
Japanese (ja)
Inventor
Toshihiko Chiba
俊彦 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP3042796A priority Critical patent/JPH04262889A/en
Publication of JPH04262889A publication Critical patent/JPH04262889A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/704Beam dispersers, e.g. beam wells

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent the material to be machined from sticking the molten matter or the inner side of the material to be machined from damaging caused with the passing optical laser beam by making needless that any function is added to the positioning device or its peripheral equipment, and making needless the auxiliary working which is generated for filling the liquid in the inside of the tube material. CONSTITUTION:The molten matter recovering nozzle 25 having the molten matter recovering window 29 is inserted in the tube material 3. And the molten recovering window 29 is positioned at the down side of the machine portion 6. The liquid 21 which absorbs the optical laser beam 5 or makes it dispersing and attenuating is supplied from the liquid ejecting tube 26 to the molten matter recovering window 29. And at the same time with this, the laser beam maching is executed while the liquid 21 which is mixed with the recovered molten matter 13 is sucked and discharged from the liquiod recovering tube 27 through the molten matter recovering window 29.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、レーザ光を被加工体に
照射して切断,孔明け,完全溶け込み溶接等を行うレー
ザ加工方法に係り、特に、角パイプや丸パイプ等の中空
管状体(パイプ材)の加工に適するレーザ加工方法に関
する。
[Industrial Application Field] The present invention relates to a laser processing method for cutting, drilling, complete penetration welding, etc. by irradiating a laser beam onto a workpiece, and particularly relates to a laser processing method for cutting, drilling, complete penetration welding, etc., by irradiating a laser beam onto a workpiece, and particularly relates to a laser processing method for cutting, drilling, complete penetration welding, etc. The present invention relates to a laser processing method suitable for processing (pipe material).

【0002】0002

【従来の技術】パイプ材をレーザ光にて切断加工等する
際には、加工時に発生する溶融物の被加工物であるパイ
プ材内面への付着という問題や、加工部位に吸収されな
かった通過レーザ光によるパイプ材内面の損傷という問
題が発生していた。
[Prior Art] When cutting pipe materials using a laser beam, there are problems such as adhesion of molten material generated during processing to the inner surface of the pipe material, which is the workpiece, and the problem of molten material that passes through and is not absorbed into the processing area. There was a problem that the inner surface of the pipe material was damaged by the laser beam.

【0003】上記問題を解決するための代表的な三つの
従来技術を以下に説明する。
Three typical conventional techniques for solving the above problems will be explained below.

【0004】その第一の従来技術を、図6および図7を
用いて説明する。図6は、長尺のパイプ材をレーザ光に
て任意の形状に切断するレーザ加工装置1と、パイプ材
内面への溶融物付着および通過レーザ光による損傷防止
を目的とするパイプ材内面保護装置2を示すものである
The first conventional technique will be explained using FIGS. 6 and 7. FIG. 6 shows a laser processing device 1 that cuts a long pipe material into an arbitrary shape using a laser beam, and a pipe material inner surface protection device that aims to prevent melt adhesion to the inner surface of the pipe material and damage caused by passing laser light. 2.

【0005】図6に示すように、レーザ加工装置1は、
被加工物であるパイプ材3と、パイプ材3を保持しつつ
回転自在にしてその軸方向の位置決めも可能な位置決め
装置4と、レーザ光5を照射するレーザ光照射装置(レ
ーザ光以外は図示省略)とから構成されており、パイプ
材料3を任意の形状に切断加工することが可能である。
As shown in FIG. 6, the laser processing device 1 includes:
A pipe material 3 that is a workpiece, a positioning device 4 that holds the pipe material 3 and can freely rotate it and position it in the axial direction, and a laser beam irradiation device that irradiates a laser beam 5 (other than the laser beam is not shown) (omitted), and it is possible to cut the pipe material 3 into any shape.

【0006】また、パイプ材内面保護装置2は、パイプ
材3の一方の開口部7を閉塞する蓋部材8と、パイプ材
3のもう一方の開口部9側からパイプ材3内の加工部位
6よりも奥側まで挿入されて、切断時に圧縮エアー10
を送り込むためのノズル11と、ノズル11をコンプレ
ッサー等のエアー源(図示省略)に連通接続するための
ホース12とから構成されている。
The pipe material inner surface protection device 2 also includes a lid member 8 that closes one opening 7 of the pipe material 3, and a processing area 6 in the pipe material 3 from the other opening 9 side of the pipe material 3. The compressed air is inserted to the far side when cutting.
It is composed of a nozzle 11 for feeding air, and a hose 12 for connecting the nozzle 11 to an air source (not shown) such as a compressor.

【0007】図7は、図6の加工部位6近傍の断面図で
ある。パイプ材内面保護装置2によって、切断時に加工
部位6にて発生した溶融物13を、ノズル11から噴出
されパイプ材3外へ噴出する圧縮エアー10を介して飛
散排出することができ、溶融物13のパイプ材内面14
への付着を防止できる。また、加工部位6に吸収されな
かった通過レーザ光15も、ノズル11によって遮光さ
れ、パイプ材内面14まで到達することなく損傷を防止
できる。さらに、ノズル11をロボット(図示省略)等
のアームに接続構成させることにより、ノズル11を、
切り離し後のワ−クの回収用棒部材として使用すること
も可能である。かかる技術は、例えば特開平1−162
583号公報に開示されている。
FIG. 7 is a sectional view of the vicinity of the processed portion 6 in FIG. 6. The pipe material inner surface protection device 2 can scatter and discharge the molten material 13 generated at the processing area 6 during cutting through the compressed air 10 that is ejected from the nozzle 11 and out of the pipe material 3. inner surface of pipe material 14
Can prevent adhesion to. Furthermore, the passing laser beam 15 that is not absorbed by the processed portion 6 is also blocked by the nozzle 11, and does not reach the inner surface 14 of the pipe material, thereby preventing damage. Furthermore, by connecting the nozzle 11 to an arm such as a robot (not shown), the nozzle 11 can be
It is also possible to use it as a rod member for recovering workpieces after separation. Such technology is disclosed in, for example, Japanese Patent Application Laid-Open No. 1-162.
It is disclosed in Japanese Patent No. 583.

【0008】しかし、パイプ材3の内径が小さい場合に
は、加工部位6からパイプ材内面14までの距離が短い
ために、図8に示すように、溶融物13の一部がパイプ
材3外に飛散排出される前に、パイプ材内面14に付着
してしまうという問題があった。また、、パイプ材3内
径とノズル11外径とのクリアランスも必然的に小さく
、溶融物13の一部がパイプ材3外に排出される前にノ
ズル11表面に付着,堆積し、長時間使用していると付
着凝固物16の塊となってしまった。これにより、上述
したように、ノズル11をロボット等のアームに取り付
け、切り離し後のワ−クの回収用棒部材として使用する
場合、切り離し後のワ−クがノズル11の付着凝固物1
6の塊に引っ掛かり、正常の回収動作ができないという
問題も発生していた。
However, when the inner diameter of the pipe material 3 is small, the distance from the processed part 6 to the inner surface 14 of the pipe material is short, and as shown in FIG. There was a problem in that the particles adhered to the inner surface 14 of the pipe material before being scattered and discharged. In addition, the clearance between the inner diameter of the pipe material 3 and the outer diameter of the nozzle 11 is inevitably small, and a portion of the molten material 13 adheres and accumulates on the surface of the nozzle 11 before being discharged outside the pipe material 3, resulting in long-term use. When doing so, a lump of adhered coagulum 16 formed. As a result, as described above, when the nozzle 11 is attached to an arm of a robot or the like and used as a rod member for recovering the workpiece after being cut off, the workpiece after being cut off is the coagulum adhered to the nozzle 11.
There was also the problem that the retrieval operation could not be performed normally due to the retrieval mechanism getting caught in the clump of No. 6.

【0009】また、パイプ材3の内径が小さい場合には
、ノズル11も小径で肉厚も薄くなり、その場合、図9
に示すように、加工部位6に吸収されなかった通過レー
ザ光15が、ノズル11にまで孔17を明け、パイプ材
内面14まで到達して損傷18を与えているという問題
も発生していた。
Furthermore, when the inner diameter of the pipe material 3 is small, the nozzle 11 also has a small diameter and a thin wall thickness.
As shown in FIG. 2, a problem also occurred in that the passing laser beam 15 that was not absorbed by the processed part 6 created a hole 17 even in the nozzle 11 and reached the inner surface 14 of the pipe material, causing damage 18.

【0010】第二の従来技術を図10および図11を用
いて説明する。図10は、レーザ加工装置1とパイプ材
内面保護装置19を示すものである。レーザ加工装置1
の構成は第一の従来技術と全く同様であるので説明を省
略する。この従来技術におけるパイプ材内面保護装置1
9は、パイプ材3の一方の開口部7に接続された液体供
給ホース20と、液体供給ホース20に水等の液体21
を供給するための液体供給源(図示省略)とから構成さ
れている。
A second conventional technique will be explained using FIGS. 10 and 11. FIG. 10 shows the laser processing device 1 and the pipe material inner surface protection device 19. Laser processing device 1
Since the configuration is exactly the same as that of the first prior art, the explanation will be omitted. Pipe material inner surface protection device 1 in this conventional technology
Reference numeral 9 indicates a liquid supply hose 20 connected to one opening 7 of the pipe material 3, and a liquid 21 such as water to the liquid supply hose 20.
and a liquid supply source (not shown) for supplying.

【0011】図11は、図10の加工部位6近傍の断面
図である。液体供給ホース20より供給される液体21
は、パイプ材3の内部を通過し、開放されている開口部
9より流出する。加工部位6内部に液体21を配置する
ことにより、穴明けや切断時の溶融物13を冷却凝固さ
せ、液体21に混入された状態でパイプ材3外へ排出し
、パイプ材内面14への溶融物13の付着凝固を防止す
ることができる。
FIG. 11 is a sectional view of the vicinity of the processed portion 6 in FIG. 10. Liquid 21 supplied from liquid supply hose 20
passes through the inside of the pipe material 3 and flows out from the open opening 9. By placing the liquid 21 inside the processing area 6, the molten material 13 during drilling or cutting is cooled and solidified, and is discharged outside the pipe material 3 in a state mixed with the liquid 21, so that the molten material 13 is transferred to the inner surface 14 of the pipe material. Adhesion and coagulation of the substance 13 can be prevented.

【0012】液体21に水を使用した場合、波長の特性
で、CO2 レーザ光の水における吸収率は大きく、C
O2 レーザ光は水中をほとんど透過せず吸収され減衰
する。YAGレーザ光は水に対する吸収率は小さいが、
水中における散乱効果より減衰する。よって、パイプ材
内面14の損傷18を防止もしくは軽減することができ
る。かかる従来技術は、例えば、特開昭52−8580
0号公報や特開平2−52188号公報に開示されてい
る。
When water is used as the liquid 21, the absorption rate of CO2 laser light in water is large due to wavelength characteristics,
O2 laser light hardly passes through water and is absorbed and attenuated. Although YAG laser light has a low absorption rate for water,
Attenuated by scattering effects in water. Therefore, damage 18 to the inner surface 14 of the pipe material can be prevented or reduced. Such prior art is disclosed, for example, in Japanese Patent Application Laid-Open No. 52-8580.
This method is disclosed in Japanese Patent No. 0 and Japanese Patent Application Laid-Open No. 2-52188.

【0013】しかし、上記第二の従来技術においても、
液体21に水を使用して、YAGレーザ光により内径の
小さいパイプ材3を加工する場合には、YAGレーザ光
が水中で十分減衰せずにパイプ材内面14まで到達し損
傷を与えるという問題があった。また、パイプ材3内部
に液体21を満たすため、パイプ材3交換時のパイプ材
3内部から液体21を排出する作業やワ−クの乾燥作業
等の付帯作業に多大な工数が必要であった。
However, even in the second prior art,
When using water as the liquid 21 and processing a pipe material 3 with a small inner diameter with a YAG laser beam, there is a problem that the YAG laser beam is not sufficiently attenuated in water and reaches the inner surface 14 of the pipe material, causing damage. there were. In addition, in order to fill the inside of the pipe material 3 with the liquid 21, a large amount of man-hours were required for incidental work such as draining the liquid 21 from inside the pipe material 3 when replacing the pipe material 3 and drying the workpiece. .

【0014】以上の各々の従来技術の問題点を解決する
ために、第一の従来技術に第二の従来技術を組合わせた
第三の従来技術を、図12および図13を用いて説明す
る。図12は、レーザ加工装置1とパイプ材内面保護装
置22を示すものである。レーザ加工装置1の構成は第
一の従来技術と全く同様であるので説明を省略する。図
13は、図12の加工部位6近傍の断面図である。
In order to solve the problems of each of the above-mentioned conventional techniques, a third conventional technique that combines the first conventional technique and the second conventional technique will be explained using FIGS. 12 and 13. . FIG. 12 shows the laser processing device 1 and the pipe material inner surface protection device 22. The configuration of the laser processing device 1 is completely the same as that of the first prior art, so the explanation will be omitted. FIG. 13 is a sectional view of the vicinity of the processed portion 6 in FIG. 12.

【0015】第三の従来技術におけるパイプ材内面保護
装置22は、図12および図13に示すように、第一の
従来技術の構成における溶融物13を飛散排出させるた
めの圧縮エアー10の代わりに、水等の液体21を使用
するものである。
As shown in FIGS. 12 and 13, the pipe material inner surface protection device 22 according to the third prior art uses compressed air 10 for scattering and discharging the melt 13 in the first prior art configuration. , a liquid 21 such as water is used.

【0016】実際にパイプ材3を加工する際には、液体
吐出ノズル23の先端から液体21を吐出しながら加工
を行う。第一の従来技術の圧縮エアー10の場合と同様
に、加工時に生ずる溶融物13は、パイプ材3内を外方
に向けて逆流する液体21により冷却凝固し、液体21
に混入した状態で外方に排出される。その結果、加工時
に発生する溶融物13は、パイプ材内面14や液体吐出
ノズル23表面に付着することなくパイプ材3の外方に
排出される。
When actually processing the pipe material 3, processing is performed while discharging the liquid 21 from the tip of the liquid discharging nozzle 23. As in the case of the compressed air 10 of the first prior art, the melt 13 generated during processing is cooled and solidified by the liquid 21 flowing outward inside the pipe material 3.
It is discharged outside in a mixed state. As a result, the molten material 13 generated during processing is discharged to the outside of the pipe material 3 without adhering to the inner surface 14 of the pipe material or the surface of the liquid discharge nozzle 23.

【0017】液体21に水を使用しYAGレーザ光を加
工に用いた場合にも、加工部位6に吸収されなかった通
過レーザ光15は、液体吐出ノズル23表面に達するが
、液体21にて散乱減衰した後であるので、肉厚の薄い
液体吐出ノズル23の場合でも、穴は明きにくく、レー
ザ光5の出力を加減して加工を行えば、パイプ材内面1
4まで到達して損傷を与えることはない。
Even when water is used as the liquid 21 and YAG laser light is used for processing, the passing laser light 15 that is not absorbed by the processing area 6 reaches the surface of the liquid discharge nozzle 23, but is scattered by the liquid 21. After attenuation, even if the liquid discharge nozzle 23 has a thin wall, it is difficult to form a hole, and if processing is performed by adjusting the output of the laser beam 5, the inner surface 1 of the pipe material
It will not reach 4 and cause any damage.

【0018】[0018]

【発明が解決しようとする課題】しかし、上記第三の従
来技術の場合には、位置決め装置4やその周辺装置に防
水機能を付加することが必要となり、装置の設計製作に
おいては非常に厳しい制約が与えられ、装置も高額なも
のになってしまうという問題があった。また、パイプ材
3内部に液体21を満たすため、パイプ材3の一方の開
口部7を蓋部材8で閉塞する作業や、パイプ材3交換時
のパイプ材3内部からの液体21の排出作業、加工後の
ワ−クの乾燥作業といった付帯作業に多大な工数が必要
であった。
[Problem to be Solved by the Invention] However, in the case of the third prior art described above, it is necessary to add a waterproof function to the positioning device 4 and its peripheral devices, which imposes very severe restrictions on the design and manufacture of the device. There was a problem in that the equipment was expensive. In addition, in order to fill the inside of the pipe material 3 with the liquid 21, the work of closing one opening 7 of the pipe material 3 with the lid member 8, the work of draining the liquid 21 from the inside of the pipe material 3 when replacing the pipe material 3, A large number of man-hours were required for incidental work such as drying the workpiece after processing.

【0019】本発明は、かかる従来の問題点に鑑みてな
されたもので、従来技術の効果を全く損なうことなく、
位置決め装置やその周辺装置に防水機能を付加する必要
がなく、パイプ材内部に液体を満たすために発生する多
大な付帯作業工数を必要としない中空管状体のレーザ加
工方法を提供することを目的とする。
The present invention has been made in view of the problems of the prior art, and it achieves the following without impairing the effects of the prior art.
The purpose of the present invention is to provide a method for laser processing a hollow tubular body, which does not require adding waterproof functionality to the positioning device or its peripheral equipment, and does not require a large amount of additional work required to fill the inside of the pipe material with liquid. do.

【0020】[0020]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、中空管状体にレーザ光を照射して切断等
の加工を行う中空管状体のレーザ加工方法において、先
端部に上方に向けて開口した溶融物回収窓を有し、切り
離し後のワ−ク回収に利用できる溶融物回収ノズルを、
前記中空管状体の一端側の開口部から中空管状体内に挿
入するとともに、前記溶融物回収窓を中空管状体の加工
部位の下方に位置させた後、溶融物回収窓に連通させて
溶融物回収ノズル内に設けた少なくとも1本の液体吐出
管から溶融物回収窓へレーザ光を吸収もしくは散乱減衰
させる液体を供給すると同時に、溶融物回収窓に連通さ
せて溶融物回収ノズル内に設けた少なくとも1本の液体
回収管により、溶融物回収窓を介して回収した溶融物が
混在する液体を吸引排出しつつ、レーザ加工することと
した。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides a laser processing method for a hollow tubular body in which the hollow tubular body is irradiated with a laser beam to perform processing such as cutting. The melt recovery nozzle has a melt recovery window that opens toward the workpiece and can be used to recover the workpiece after separation.
The hollow tubular body is inserted into the hollow tubular body through the opening at one end thereof, and after the melt recovery window is located below the processing area of the hollow tubular body, the melt is recovered by communicating with the melt recovery window. A liquid that absorbs or scatters and attenuates the laser beam is supplied from at least one liquid discharge pipe provided in the nozzle to the melt recovery window, and at the same time, at least one liquid discharge pipe provided in the melt recovery nozzle communicates with the melt recovery window. We decided to carry out laser processing while sucking and discharging the liquid mixed with the melt collected through the melt collection window using the main liquid collection pipe.

【0021】[0021]

【作用】中空管状体の加工部位内部に挿入されている溶
融物回収ノズルの溶融物回収窓へ、少なくとも1本の液
体吐出管から液体を供給し、加工時に発生する溶融物を
前記液体により冷却,凝固させ、溶融物の中空管状体内
面や溶融物回収ノズルへの付着を防ぐ。また、少なくと
も1本の液体回収管により液体を吸引排出することによ
り、凝固した溶融物を前記液体中に混入させた状態で中
空管状体外へ確実に排出を行う。さらに、加工部位に吸
収されなかった通過レーザ光も前記液体により吸収もし
くは散乱減衰させ、さらには散乱減衰したレーザ光を溶
融物回収ノズルにて遮蔽,吸収することにより、加工部
位に吸収されなかった通過レーザ光による加工部位と対
向する管状中空体内面の損傷も防止できる。
[Operation] Liquid is supplied from at least one liquid discharge pipe to the melt recovery window of the melt recovery nozzle inserted inside the processing part of the hollow tubular body, and the melt generated during processing is cooled by the liquid. , to solidify and prevent the melt from adhering to the inner surface of the hollow tubular body or the melt collection nozzle. Furthermore, by suctioning and discharging the liquid through at least one liquid recovery pipe, the solidified molten material is reliably discharged from the hollow tubular body while being mixed in the liquid. Furthermore, the passing laser light that was not absorbed by the processing area is also absorbed or attenuated by scattering by the liquid, and furthermore, the scattered and attenuated laser light is blocked and absorbed by the melt recovery nozzle, so that it is not absorbed by the processing area. It is also possible to prevent damage to the inner surface of the tubular hollow body facing the processed area due to the passing laser beam.

【0022】[0022]

【実施例1】図2は、本発明に係るレーザ加工方法の実
施例1で用いた装置の溶融物回収装置24(実施例にお
けるパイプ材内面保護装置に相当)と、レーザ加工装置
1の構成主要部を示すものである。図2におけるレーザ
加工装置1の構成は、従来技術と全く同じであるので説
明を省略する。図2は、パイプ材3の加工部位6にレー
ザ光5を照射しつつ切断加工を行っている状態を示して
いる。
[Example 1] FIG. 2 shows the configuration of the melt recovery device 24 (corresponding to the pipe material inner surface protection device in the example) of the device used in Example 1 of the laser processing method according to the present invention, and the laser processing device 1. This shows the main parts. The configuration of the laser processing apparatus 1 in FIG. 2 is completely the same as that of the prior art, so the explanation will be omitted. FIG. 2 shows a state in which cutting is being performed while irradiating the laser beam 5 to the processed portion 6 of the pipe material 3.

【0023】図1は、図2においてパイプ材3の加工部
位6にレーザ光5を照射しつつ切断加工を行っている状
態の、溶融物回収装置24における溶融物回収ノズル2
5の加工点近傍の断面図を示している。
FIG. 1 shows the melt recovery nozzle 2 in the melt recovery device 24 when cutting is being performed while irradiating the processed portion 6 of the pipe material 3 with the laser beam 5 in FIG.
5 shows a cross-sectional view near the processing point No. 5.

【0024】図3は、溶融物回収ノズル25の部分断面
図を示すものである。
FIG. 3 shows a partial sectional view of the melt recovery nozzle 25.

【0025】本実施例の溶融物回収ノズル25の構造は
、図1および図3に示すように、液体吐出管26の外側
に液体吐出管26から吐出された液体(通常の水)21
を回収するための断面円環状の液体回収管27が二重構
造に配置されている。そして、被加工物であるパイプ材
3に挿入される側の液体回収管27の端面は、蓋部材2
8で閉塞されている。また液体回収管27の蓋部材28
により閉塞された側の端面近傍には、上方に向けて溶融
物回収窓29が穿設されている。この蓋部材28は、い
わゆるゴム栓等にて構成されている。溶融物回収窓29
は、液体吐出管26先端と蓋部材28との間の付近に設
けられている。
As shown in FIGS. 1 and 3, the structure of the melt recovery nozzle 25 of this embodiment is such that a liquid (ordinary water) 21 is discharged from the liquid discharge pipe 26 to the outside of the liquid discharge pipe 26.
A liquid recovery tube 27 having an annular cross section for recovering liquid is arranged in a double structure. The end surface of the liquid recovery tube 27 on the side to be inserted into the pipe material 3, which is the workpiece, is connected to the lid member 2.
It is blocked at 8. Also, the lid member 28 of the liquid recovery pipe 27
A melt recovery window 29 is bored upward in the vicinity of the end face on the side closed by. This lid member 28 is made of a so-called rubber plug or the like. Melt collection window 29
is provided in the vicinity between the tip of the liquid discharge tube 26 and the lid member 28.

【0026】液体吐出管26は、図2に示すように、溶
融物回収ノズル25の基端部30に接続された液体吐出
用ホース31を介して液体タンク(図示省略)や液体吐
出用ポンプ(図示省略)に接続されており、液体回収管
27は、液体回収用ホース32を介して液体回収タンク
(図示省略)や吸引ポンプ(図示省略)に接続されてい
る。
As shown in FIG. 2, the liquid discharge pipe 26 is connected to a liquid tank (not shown) or a liquid discharge pump (not shown) via a liquid discharge hose 31 connected to the base end 30 of the melt recovery nozzle 25. The liquid recovery pipe 27 is connected to a liquid recovery tank (not shown) and a suction pump (not shown) via a liquid recovery hose 32.

【0027】上記構成の溶融物回収装置24を備えた加
工装置にてパイプ材3を加工する際には、図1に示すよ
うに、被加工物であるパイプ材3の加工部位6側の開口
部9から、溶融物回収ノズル25を挿入し、加工部位6
の直下に液体回収ノズル25の溶融物回収窓29が位置
するように配置する。加工時には、加工部位6にレーザ
光5を照射させつつ切断するのであるが、この切断時に
は、加工部位6に吸収されなかった通過レーザ光15を
吸収もしくは散乱減衰させる液体21を、液体吐出管2
6の液体吐出口33から吐出しながら加工を行う。
When processing the pipe material 3 with the processing apparatus equipped with the melt recovery device 24 having the above configuration, as shown in FIG. Insert the melt recovery nozzle 25 from the part 9 and process the part 6.
The melt recovery window 29 of the liquid recovery nozzle 25 is positioned directly below the melt recovery nozzle 25 . During machining, the laser beam 5 is irradiated onto the machining area 6 for cutting. During this cutting, a liquid 21 that absorbs or scatters and attenuates the passing laser beam 15 that is not absorbed by the machining area 6 is supplied to the liquid discharge pipe 2.
Processing is performed while discharging liquid from the liquid discharge port 33 of No. 6.

【0028】液体吐出口33から吐出された液体21は
、溶融物回収ノズル25の溶融物回収窓29から混入し
てくる溶融物13を冷却,凝固させる。そして、液体2
1は、凝固した溶融物13を混入させた状態で、吸引ポ
ンプに連通接続された液体回収管27により、液体回収
タンクへと回収される。その結果、加工時に発生する溶
融物13は、パイプ材内面14や液体吐出管26表面お
よび液体回収管27内等に付着することなく、液体回収
タンクへと回収される。
The liquid 21 discharged from the liquid discharge port 33 cools and solidifies the melt 13 entering from the melt recovery window 29 of the melt recovery nozzle 25. And liquid 2
1 is collected into a liquid recovery tank through a liquid recovery pipe 27 connected to a suction pump in a state in which the solidified melt 13 is mixed therein. As a result, the molten material 13 generated during processing is collected into the liquid recovery tank without adhering to the inner surface 14 of the pipe material, the surface of the liquid discharge pipe 26, the inside of the liquid recovery pipe 27, etc.

【0029】この時、液体21の吐出量と、液体21の
回収のための吸引量とは、溶融物回収窓29から液体2
1が溢れ出ないように調整する。また、切断時にはアシ
ストガスを使用するが、その場合、加工点を通過したア
シストガスにより液面が波立たされて溶融物回収窓29
から液体21が外へ溢れ出る場合は、溶融物回収ノズル
25の外径を被加工物であるパイプ材3の内面に近づけ
たり、溶融物回収窓29を加工点に近づけるなどして、
液体21の溢流を防止するとよい。
At this time, the amount of liquid 21 to be discharged and the amount of suction for recovering liquid 21 are as follows:
Adjust so that 1 does not overflow. In addition, assist gas is used during cutting, but in that case, the assist gas that has passed through the processing point causes the liquid surface to ripple, causing the molten material collection window 29
If the liquid 21 overflows to the outside, move the outer diameter of the melt recovery nozzle 25 closer to the inner surface of the pipe material 3, which is the workpiece, or move the melt recovery window 29 closer to the processing point.
It is preferable to prevent the liquid 21 from overflowing.

【0030】また、加工部位6に吸収されなかった通過
レーザ光15は、液体21により吸収もしくは散乱減衰
され、液体回収管27を損傷させることはあっても、貫
通孔を明けるまでには至りにくい。従って、パイプ材内
面14を加工部位6に吸収されなかった通過レーザ光1
5により損傷することはない。
Furthermore, the passing laser beam 15 that is not absorbed by the processing area 6 is absorbed or attenuated by scattering by the liquid 21, and although it may damage the liquid recovery pipe 27, it is unlikely to cause a through hole to be formed. . Therefore, the laser beam 1 that passed through the inner surface 14 of the pipe material and was not absorbed by the processed portion 6
5 will not cause any damage.

【0031】本実施例によれば、冷却,凝固した溶融物
13を混入させた液体21を、溶融物回収ノズル25の
液体回収管27により回収するので、加工点近傍に液体
21の受け皿等が不要になり、液体21の飛沫による装
置の汚れもなくなる。また、パイプ材内面14に液体2
1が接触することがないので、液体21によって濡れた
パイプ材内面14に凝固した溶融物13が付着し汚れて
いたり、液体21自体による汚れもないので、加工後の
ワ−クを洗浄する必要なく、次の工程に流すことができ
、工数削減上大きな効果がある。
According to this embodiment, since the liquid 21 mixed with the cooled and solidified melt 13 is recovered by the liquid recovery pipe 27 of the melt recovery nozzle 25, there is a tray for the liquid 21 near the processing point. This is no longer necessary, and the device is no longer contaminated by splashes of the liquid 21. Also, liquid 2 is applied to the inner surface 14 of the pipe material.
1 does not come into contact with the inner surface 14 of the pipe material wetted by the liquid 21, the solidified molten material 13 adheres to the inner surface 14 of the pipe material and there is no contamination due to the liquid 21 itself, so there is no need to clean the workpiece after processing. It can be passed on to the next process, which has a great effect on reducing man-hours.

【0032】また、ワ−ク加工終了後には、液体21の
供給を停止し、液体回収管27により液体吐出管26お
よび液体回収管27内の液体21をすべて回収すれば、
従来と同様に、溶融物回収ノズル25をロボット(図示
省略)等のアームに接続構成させることにより、切断切
り離し後のワ−クを溶融物回収ノズル25に引っ掛けた
状態で、溶融物回収ノズル25を切り離し後のワ−クの
回収棒部材として使用し、切断切り離し後のワ−クを排
出部およびストッカー部へ配送するといった自動化への
対応も可能である。
Furthermore, after the workpiece processing is completed, if the supply of the liquid 21 is stopped and all of the liquid 21 in the liquid discharge pipe 26 and the liquid recovery pipe 27 is recovered by the liquid recovery pipe 27,
As in the past, by connecting the melt recovery nozzle 25 to an arm of a robot (not shown) or the like, the melt recovery nozzle 25 can be operated while the workpiece after cutting is hooked to the melt recovery nozzle 25. It is also possible to respond to automation by using the rod as a collection rod member for the workpiece after cutting and delivering the workpiece after cutting and separation to the discharge section and the stocker section.

【0033】なお、本実施例においては、切断加工の例
について説明したが、孔加工や完全解け込み溶接等の場
合にも適用できるのは勿論である。
In this embodiment, an example of cutting has been described, but it goes without saying that the present invention can also be applied to hole drilling, complete penetration welding, and the like.

【0034】また、本実施例では、液体21として通常
の水を用いたが、レーザ光5を吸収もしくは散乱減衰さ
せる液体であれば、水に限定されるものではない。また
、液体回収管27は、断面円環状に限定されず、角型そ
の他の中空管状体としてもよい。蓋部材28は、ゴム栓
等に限定されず、液体吐出管26から吐出される液体2
1の圧力に耐え得るものであれば、材質,形状等はどの
ようなものでもよい。溶融物回収窓29は、液体吐出管
26先端と蓋部材28との間に設けるのではなく、液体
吐出管26の本体上方に位置するように設けてもよい。 さらに、液体回収管27により回収した液体21は、フ
ィルタ等を通して溶融物13を除去し、清浄な液体21
に再生して、再度液体タンクに戻して使用してもよい。
Further, in this embodiment, ordinary water is used as the liquid 21, but the liquid is not limited to water as long as it absorbs or scatters and attenuates the laser beam 5. Further, the liquid recovery pipe 27 is not limited to an annular cross section, and may be a square or other hollow tubular body. The lid member 28 is not limited to a rubber stopper or the like, and the lid member 28 is not limited to a rubber plug or the like, and the lid member 28 is used to store the liquid 2 discharged from the liquid discharge pipe 26.
Any material, shape, etc. may be used as long as it can withstand the pressure of 1. The melt recovery window 29 may be provided above the main body of the liquid discharge tube 26 instead of being provided between the tip of the liquid discharge tube 26 and the lid member 28. Furthermore, the liquid 21 recovered by the liquid recovery pipe 27 is passed through a filter or the like to remove the melt 13, and the liquid 21 is purified.
It may be regenerated and returned to the liquid tank for use again.

【0035】本実施例では、溶融物回収ノズル25の構
造は、液体吐出管26の外側に液体回収管27を配置し
たが、これとは逆に液体回収管の外側に液体吐出管を配
置しても構わない。また、本実施例では、液体吐出管2
6と液体回収管27を2本の中空管状体の2重構造で構
成したが、同等の機能を持つのであれば、溶融物回収ノ
ズルの最大外径が被加工物である中空管状体の内径より
も小径であり、その先端部に上方に開口した溶融物回収
窓(凹部)が設けられており、溶融物回収ノズル内に溶
融物回収窓に至る2本の管路が設けられておれば、管路
の並列配置でも構わない。2本の管路の一方を液体吐出
管として使用し、溶融物回収窓に液体を供給し、他の一
方の管路を液体回収管として使用し、液体の吸引回収を
行う。もしくは、2本以上の管路を設け、いずれかの管
路に液体吐出管や液体回収管の機能を持たせたものでも
良い。
In this embodiment, the structure of the melt recovery nozzle 25 is such that the liquid recovery tube 27 is disposed outside the liquid discharge tube 26, but on the contrary, the liquid discharge tube is disposed outside the liquid recovery tube. I don't mind. In addition, in this embodiment, the liquid discharge pipe 2
6 and the liquid recovery tube 27 are constructed with a double structure of two hollow tubular bodies, but if they have the same function, the maximum outer diameter of the melt recovery nozzle is the inner diameter of the hollow tubular body that is the workpiece. If the melt recovery nozzle has a smaller diameter than the molten metal recovery nozzle, and has a melt recovery window (recess) that opens upward at its tip, and two pipes leading to the melt recovery window are provided in the melt recovery nozzle. , the pipes may be arranged in parallel. One of the two pipes is used as a liquid discharge pipe to supply liquid to the melt recovery window, and the other pipe is used as a liquid recovery pipe to collect the liquid by suction. Alternatively, two or more pipes may be provided, and one of the pipes may function as a liquid discharge pipe or a liquid recovery pipe.

【0036】[0036]

【実施例2】本実施例で用いる装置は、溶融物回収ノズ
ル25の構成以外は実施例1と全く同様であるので、そ
れらの説明は省略する。
[Embodiment 2] The apparatus used in this embodiment is completely the same as in Embodiment 1 except for the structure of the melt recovery nozzle 25, so a description thereof will be omitted.

【0037】本実施例における溶融物回収ノズル25の
構成を、図4を用いて説明する。本実施例の溶融物回収
ノズル25が実施例1と異なる点は、液体吐出口33が
上方を向いている点である。かかる構成を可能とするた
め、液体吐出管34は溶融物回収窓29よりも奥側まで
配置され、液体吐出管34の端部は蓋部材35で閉塞さ
れている。そして、溶融物回収窓29の下方に位置する
液体吐出管34の上方は開口され、液体吐出口33が形
成されている。
The structure of the melt recovery nozzle 25 in this embodiment will be explained using FIG. 4. The melt recovery nozzle 25 of this embodiment differs from that of the first embodiment in that the liquid discharge port 33 faces upward. In order to make such a configuration possible, the liquid discharge pipe 34 is arranged to the back side of the melt recovery window 29, and the end of the liquid discharge pipe 34 is closed with a lid member 35. The upper part of the liquid discharge pipe 34 located below the melt recovery window 29 is open, and a liquid discharge port 33 is formed.

【0038】実施例1においては、液体21の吐出量に
対して吸引量が多すぎる場合、溶融物回収窓29下方に
存在する液体21の量が少なくなり、溶融物回収ノズル
25内に溶融物13が付着したり、加工部位6に吸収さ
れなかった通過レーザ光15が液体21に十分に減衰さ
れずに溶融物回収ノズル25を損傷,貫通し、被加工物
であるパイプ材3を損傷させるおそれがある。そのため
、液体21の吐出量と吸引量は適正に調整しておく必要
がある。
In the first embodiment, when the suction amount is too large for the discharge amount of the liquid 21, the amount of the liquid 21 existing below the melt recovery window 29 decreases, and the melt does not enter the melt recovery nozzle 25. 13 or the passing laser beam 15 that is not absorbed by the processing area 6 is not sufficiently attenuated by the liquid 21 and damages and penetrates the melt recovery nozzle 25, damaging the pipe material 3 that is the workpiece. There is a risk. Therefore, it is necessary to appropriately adjust the amount of discharge and suction of the liquid 21.

【0039】しかし、本実施例においては、液体吐出口
33が上方に向けて開口している構成となっているため
、液体吐出口33から溢れ出た液体21のみが液体回収
管27により吸引回収される。従って、液体21の吐出
量は少量でも吐出さえしていれば、溶融物回収窓29下
方の液体21が液体吐出口33に確保されている。また
、吸引量も溶融物回収窓29から液体21が溢れ出ない
ように、一定レベル以上の吸引量を確保しておればよい
。すなわち、本実施例においては、実施例1に比較して
液体21の吐出量と吸引量の調整が容易になるといった
効果がある。
However, in this embodiment, since the liquid discharge port 33 is configured to open upward, only the liquid 21 overflowing from the liquid discharge port 33 is suctioned and collected by the liquid recovery pipe 27. be done. Therefore, even if the amount of liquid 21 to be discharged is small, as long as the liquid 21 is discharged, the liquid 21 below the melt recovery window 29 is secured to the liquid discharge port 33 . Further, the suction amount may be set to a certain level or more so that the liquid 21 does not overflow from the melt recovery window 29. That is, in this embodiment, compared to the first embodiment, there is an effect that the amount of discharge and suction of the liquid 21 can be easily adjusted.

【0040】[0040]

【実施例3】本実施例で用いる装置も、溶融物回収ノズ
ル25の構成以外は実施例1と全く同様であるので、そ
れらの説明は省略する。
Embodiment 3 The apparatus used in this embodiment is completely the same as in Embodiment 1 except for the structure of the melt recovery nozzle 25, so a description thereof will be omitted.

【0041】本実施例における溶融物回収ノズル25の
構成は、実施例2における液体吐出口33の開口面積を
広げたことを特徴とする。液体吐出口33の開口面積を
広げる方法としては、単純に液体吐出口33の開口面積
を拡大させる方法と、液体吐出口33を複数以上設け、
総合面積として液体吐出口33の面積を広げる方法とが
ある。
The structure of the melt recovery nozzle 25 in this embodiment is characterized in that the opening area of the liquid discharge port 33 in the second embodiment is increased. There are two methods of increasing the opening area of the liquid discharge port 33: a method of simply increasing the opening area of the liquid discharge port 33, and a method of providing a plurality of liquid discharge ports 33 or more.
There is a method of increasing the area of the liquid discharge ports 33 as the total area.

【0042】本実施例における溶融物回収ノズル25の
構成を、図5を用いて説明する。単純に液体吐出口33
の開口面積を拡大させた場合については、実施例2と液
体吐出口33の面積以外は同様であるので、図5により
、液体吐出口33を複数以上設けた場合について説明す
る。図5では、液体吐出管36に上方に向けて設けられ
ている液体吐出口33は2個としたが、3個以上でも構
わない。また、溶融物回収窓29の下方に、複数の液体
吐出口33のうちのいずれかの液体吐出口33が位置し
ていれば良い。
The configuration of the melt recovery nozzle 25 in this embodiment will be explained using FIG. 5. Simply liquid discharge port 33
The case where the opening area is enlarged is the same as Example 2 except for the area of the liquid ejection ports 33, so the case where a plurality of liquid ejection ports 33 or more are provided will be described with reference to FIG. In FIG. 5, the number of liquid discharge ports 33 provided upward in the liquid discharge pipe 36 is two, but there may be three or more. Furthermore, any one of the plurality of liquid discharge ports 33 may be located below the melt recovery window 29 .

【0043】実施例2において、吐出量を調整しようと
した時に、必要以上に吐出流量を増加させた場合、液体
21は上方に向いて開口された液体吐出口33より、上
方に噴出してしまう。また、何らかの原因により、例え
ば吐出用のポンプの出力変動等により、吐出圧力が変動
して吐出流量が増加した場合にも、液体21は液体吐出
口33より、上方に噴出してしまう。
In the second embodiment, when attempting to adjust the discharge amount, if the discharge flow rate is increased more than necessary, the liquid 21 will be spouted upward from the liquid discharge port 33 which is opened upward. . Further, even if the discharge pressure fluctuates and the discharge flow rate increases due to some reason, such as a fluctuation in the output of the discharge pump, the liquid 21 will be spouted upward from the liquid discharge port 33.

【0044】しかし、本実施例のように、液体吐出口3
3の開口面積を拡大することにより、吐出流量が増加し
た場合にも、液体21の噴出高さは実施例2の場合より
低く押さえることができる。従って、吐出量の調整作業
も容易となり、吐出圧力の変動による吐出流量の増加に
も寛容になるといった効果がある。
However, as in this embodiment, the liquid discharge port 3
By enlarging the opening area of 3, even when the discharge flow rate increases, the ejection height of the liquid 21 can be kept lower than in the case of the second embodiment. Therefore, it becomes easier to adjust the discharge amount, and there is an effect that an increase in the discharge flow rate due to fluctuations in the discharge pressure can be tolerated.

【0045】[0045]

【発明の効果】以上のように、本発明によれば、特に比
較的小径の被加工物である中空管状体をレーザ加工する
際において、中空管状体の内面への溶融物付着防止や加
工部位に吸収されなかった透過レーザ光による損傷防止
に、水等の液体を利用しながらも、位置決め装置やその
周辺装置に防水機能を付加する必要がないので、装置の
設計製作においては安価なレーザ加工装置の提供を可能
にできる。また、パイプ材内部に液体を満たさないので
、パイプ材の一方の開口部を蓋部材で閉塞する作業や、
加工後のワ−クの乾燥作業、パイプ材交換時のパイプ材
内部からの液体の排出作業といった付帯作業が不要にな
り多大な工数が削減できる。
As described above, according to the present invention, when laser processing a hollow tubular body, which is a workpiece having a relatively small diameter, it is possible to prevent melt from adhering to the inner surface of the hollow tubular body and to improve the processing area. Although liquids such as water are used to prevent damage caused by transmitted laser light that is not absorbed by the device, there is no need to add waterproofing to the positioning device or its peripheral devices, so it is possible to use inexpensive laser processing when designing and manufacturing the device. equipment can be provided. In addition, since the inside of the pipe material is not filled with liquid, it is necessary to close one opening of the pipe material with a lid member,
Additional work such as drying the workpiece after processing and draining liquid from inside the pipe material when replacing the pipe material is no longer necessary, and a large amount of man-hours can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の実施例1で用いた加工装置おける溶融
物回収装置の溶融物回収ノズルの加工部位近傍を示す縦
断面図である。
FIG. 1 is a longitudinal sectional view showing the vicinity of a processing portion of a melt recovery nozzle of a melt recovery device in a processing apparatus used in Example 1 of the present invention.

【図2】本発明の実施例1で用いた加工装置におけるレ
ーザ加工装置と溶融物回収装置との主要構成部を示す斜
視図である。
FIG. 2 is a perspective view showing the main components of a laser processing device and a melt recovery device in the processing device used in Example 1 of the present invention.

【図3】本発明の実施例1で用いた溶融物回収ノズルの
一部を破断した斜視図である。
FIG. 3 is a partially cutaway perspective view of the melt recovery nozzle used in Example 1 of the present invention.

【図4】本発明の実施例2で用いた溶融物回収ノズルの
一部を破断した斜視図である。
FIG. 4 is a partially cutaway perspective view of a melt recovery nozzle used in Example 2 of the present invention.

【図5】本発明の実施例3で用いた溶融物回収ノズルの
一部を破断した斜視図である。
FIG. 5 is a partially cutaway perspective view of a melt recovery nozzle used in Example 3 of the present invention.

【図6】第一の従来技術で用いた加工装置におけるレー
ザ加工装置とパイプ内面保護装置との主要構成部を示す
斜視図である。
FIG. 6 is a perspective view showing the main components of a laser processing device and a pipe inner surface protection device in the processing device used in the first conventional technique.

【図7】図6に示す装置の加工部位近傍を示す縦断面図
である。
7 is a longitudinal cross-sectional view showing the vicinity of a processing region of the apparatus shown in FIG. 6. FIG.

【図8】図6に示す装置の加工部位近傍を示す縦断面図
である。
8 is a longitudinal cross-sectional view showing the vicinity of a processing region of the apparatus shown in FIG. 6. FIG.

【図9】図6に示す装置の加工部位近傍を示す縦断面図
である。
9 is a longitudinal cross-sectional view showing the vicinity of a processing region of the apparatus shown in FIG. 6. FIG.

【図10】第二の従来技術で用いた加工装置におけるレ
ーザ加工装置とパイプ内面保護装置との主要構成部を示
す斜視図である。
FIG. 10 is a perspective view showing the main components of a laser processing device and a pipe inner surface protection device in the processing device used in the second prior art.

【図11】図10に示す装置の加工部位近傍を示す縦断
面図である。
FIG. 11 is a longitudinal sectional view showing the vicinity of a processing region of the apparatus shown in FIG. 10;

【図12】第三の従来技術で用いた加工装置におけるレ
ーザ加工装置とパイプ内面保護装置との主要構成部を示
す斜視図である。
FIG. 12 is a perspective view showing the main components of a laser processing device and a pipe inner surface protection device in a processing device used in the third conventional technique.

【図13】図12に示す装置の加工部位近傍を示す縦断
面図である。
FIG. 13 is a longitudinal sectional view showing the vicinity of a processing region of the apparatus shown in FIG. 12;

【符号の説明】[Explanation of symbols]

1  レーザ加工装置 3  パイプ材 4  位置決め装置 5  レーザ光 6  加工部位 7  開口部 8  蓋部材 9  開口部 13  溶融物 14  パイプ材内面 15  通過レーザ光 21  液体 24  溶融物回収装置 25  溶融物回収ノズル 26  液体吐出管 27  液体回収管 28  蓋部材 29  溶融物回収窓 31  液体吐出用ホース 32  液体回収用ホース 33  液体吐出口 34  液体吐出管 35  蓋部材 36  液体吐出管 1 Laser processing equipment 3 Pipe material 4 Positioning device 5 Laser light 6 Processing part 7 Opening 8 Lid member 9 Opening 13 Melt 14 Inner surface of pipe material 15 Passing laser beam 21 Liquid 24 Melt recovery device 25 Melt collection nozzle 26 Liquid discharge pipe 27 Liquid recovery pipe 28 Lid member 29 Melt collection window 31 Liquid discharge hose 32 Liquid recovery hose 33 Liquid discharge port 34 Liquid discharge pipe 35 Lid member 36 Liquid discharge pipe

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  中空管状体にレーザ光を照射して切断
等の加工を行う中空管状体のレーザ加工方法において、
先端部に上方に向けて開口した溶融物回収窓を有する溶
融物回収ノズルを、前記中空管状体の一端側の開口部か
ら中空管状体内に挿入するとともに、前記溶融物回収窓
を中空管状体の加工部位の下方に位置させた後、溶融物
回収窓に連通させて溶融物回収ノズル内に設けた少なく
とも1本の液体吐出管から溶融物回収窓へレーザ光を吸
収もしくは散乱減衰させる液体を供給すると同時に、溶
融物回収窓に連通させて溶融物回収ノズル内に設けた少
なくとも1本の液体回収管により、溶融物回収窓を介し
て回収した溶融物が混在する液体を吸引排出しつつ、レ
ーザ加工することを特徴とする中空管状体のレーザ加工
方法。
[Claim 1] A method for laser processing a hollow tubular body, in which a hollow tubular body is irradiated with a laser beam to perform processing such as cutting,
A melt recovery nozzle having a melt recovery window opened upward at its tip is inserted into the hollow tubular body through an opening at one end of the hollow tubular body, and the melt recovery window is inserted into the hollow tubular body. Supplying a liquid that absorbs or scatters and attenuates laser light to the melt recovery window from at least one liquid discharge pipe provided in the melt recovery nozzle and communicated with the melt recovery window after being positioned below the processing area. At the same time, at least one liquid recovery pipe connected to the melt recovery window and provided inside the melt recovery nozzle sucks and discharges the liquid containing the melt collected through the melt recovery window, while the laser A method for laser processing a hollow tubular body.
JP3042796A 1991-02-15 1991-02-15 Method for laser beam machining hollow tubular body Withdrawn JPH04262889A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3042796A JPH04262889A (en) 1991-02-15 1991-02-15 Method for laser beam machining hollow tubular body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3042796A JPH04262889A (en) 1991-02-15 1991-02-15 Method for laser beam machining hollow tubular body

Publications (1)

Publication Number Publication Date
JPH04262889A true JPH04262889A (en) 1992-09-18

Family

ID=12645933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3042796A Withdrawn JPH04262889A (en) 1991-02-15 1991-02-15 Method for laser beam machining hollow tubular body

Country Status (1)

Country Link
JP (1) JPH04262889A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
EP1175953A3 (en) * 2000-07-27 2003-07-23 Denso Corporation High density energy beam machining method and apparatus for the same
EP1454700A1 (en) * 2003-03-05 2004-09-08 Trumpf Werkzeugmaschinen GmbH + Co. KG Cooling- and/or rincing lance for a laser machining apparatus and method for extraction of particles, gases or fumes during laser machining
DE10249756B4 (en) * 2002-10-25 2006-11-16 Robert Bosch Gmbh Device for laser processing
JP2009125936A (en) * 2007-11-19 2009-06-11 Minoru Kasei Kk Method for making hole in blow molded body
JP2010502442A (en) * 2005-09-06 2010-01-28 トルンプ・ヴェルクツォイクマシーネン・ゲーエム・ベーハー・ウント・コンパニ・カーゲー Beam capture device for processing machine
FR2960807A1 (en) * 2010-06-03 2011-12-09 Snecma METHOD FOR THE MACHINING OF WEAR LIGHTS FOR A ROTOR BLADE, PLUG FOR ROTOR BLADE FOR IMPLEMENTING THE PROCESS
CN103212820A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Processing method for laser wet cutting of thin-wall pipes
CN103212821A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Wet type laser cutting machine
JP2015504783A (en) * 2011-12-07 2015-02-16 ジェネラル アトミックス Method and system for use in laser processing
JP2016117078A (en) * 2014-12-19 2016-06-30 三菱重工業株式会社 Laser cutting method

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
EP1175953A3 (en) * 2000-07-27 2003-07-23 Denso Corporation High density energy beam machining method and apparatus for the same
DE10249756B4 (en) * 2002-10-25 2006-11-16 Robert Bosch Gmbh Device for laser processing
EP1454700A1 (en) * 2003-03-05 2004-09-08 Trumpf Werkzeugmaschinen GmbH + Co. KG Cooling- and/or rincing lance for a laser machining apparatus and method for extraction of particles, gases or fumes during laser machining
US7321104B2 (en) 2003-03-05 2008-01-22 Trumpf Werkzeugmaschinen Gmbh & Co. Kg Cooling duct of a laser processing machine
JP2010502442A (en) * 2005-09-06 2010-01-28 トルンプ・ヴェルクツォイクマシーネン・ゲーエム・ベーハー・ウント・コンパニ・カーゲー Beam capture device for processing machine
JP2009125936A (en) * 2007-11-19 2009-06-11 Minoru Kasei Kk Method for making hole in blow molded body
FR2960807A1 (en) * 2010-06-03 2011-12-09 Snecma METHOD FOR THE MACHINING OF WEAR LIGHTS FOR A ROTOR BLADE, PLUG FOR ROTOR BLADE FOR IMPLEMENTING THE PROCESS
US8991021B2 (en) 2010-06-03 2015-03-31 Snecma Method of machining rotor blade wear indicators, and rotor blade plug for implementing the method
JP2015504783A (en) * 2011-12-07 2015-02-16 ジェネラル アトミックス Method and system for use in laser processing
US9815141B2 (en) 2011-12-07 2017-11-14 General Atomics Methods and systems for use in laser machining
CN103212820A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Processing method for laser wet cutting of thin-wall pipes
CN103212821A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Wet type laser cutting machine
JP2016117078A (en) * 2014-12-19 2016-06-30 三菱重工業株式会社 Laser cutting method

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