JPH04216013A - Cutting method for slicing machine - Google Patents

Abstract

PURPOSE:To prevent the clogging of the edge of an inner peripheral blade and enhance the cleaning effect of a base material section of the inner peripheral blade. CONSTITUTION:Air nozzles 24A arid 24B are disposed right after a nozzle 22, and air nozzles 28A and 28B are disposed right before a cutting liquid nozzle 26 to increase the flow rate of cleaning liquid and cutting liquid, and also excessive liquid not working for cutting is discharged by facing the flow direction toward the outer periphery. Air is sprayed to the edge 16 of an inner peripheral blade and a base metal section 14 by the air nozzles 24A, 24B, 28A and 28B to clean both of the edge 16 and the base metal section 14.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting method using a slicing machine, and more particularly to a cutting method using a slicing machine that cuts a semiconductor ingot into thin pieces to produce semiconductor wafers.

0002

2. Description of the Related Art In a slicing machine, an inner peripheral blade or an outer peripheral blade is rotated at high speed and pressed against a semiconductor ingot to manufacture a semiconductor wafer. in this case,
The ingot is cut while supplying cleaning fluid or cutting fluid to the inner peripheral blade.

0003

The cutting method of the conventional slicing machine has the following drawbacks. ■The cutting position of the thin film-like inner peripheral blade is unstable, so it is difficult to clean it. Since it is not possible to apply a large amount of cutting fluid, the cutting edge tends to become clogged and the base metal gets dirty. ■For the purpose of increasing the cleaning effect,
In this case, making the nozzle tip narrower or increasing the supply pressure of the cleaning liquid may be effective in cleaning the cutting edge, but the cleaning effect on the base metal portion will be small. ■Cleaning/cutting fluid is discharged outside the inner peripheral blade due to the centrifugal force of the inner peripheral blade rotation, but the liquid discharge efficiency is poor due to the surface tension generated with the base metal part, and the dirty liquid can drain the inner peripheral blade. It will take several turns. ■Since cutting is performed without the cleaning/cutting fluid being sufficiently drained, there is a high possibility that poor cutting will occur due to the surface tension of the cleaning/cutting fluid. In particular, the wafer being cut tends to stick to the base metal part 14 as shown in FIG. 4. (2) For reasons of (2) and (2) above, alkaline solutions, surfactants, etc. are often added to cleaning and cutting fluids, which has the disadvantage of being costly.

0004

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a slicing machine that cuts an ingot into thin pieces with an inner peripheral blade while supplying cleaning fluid with a cleaning fluid nozzle and a cutting fluid nozzle. An air nozzle is installed near the cleaning fluid nozzle and cutting fluid nozzle, and the air pressure from the air nozzle directs the cleaning fluid and used cutting fluid to the outside of the inner peripheral cutter, and increases the flow velocity of the fluid to remove excess fluid that does not affect cutting. It is characterized by cutting while increasing discharge efficiency.

[0005]

[Operation] In the present invention, an air nozzle is placed immediately after the cleaning fluid nozzle and immediately before the cutting fluid nozzle to increase the fluid flow velocity and direct the flow direction toward the outer periphery, thereby increasing the efficiency of discharging excess fluid that does not affect cutting. It works to enhance the. The air nozzle sprays air onto the cutting edge of the inner peripheral blade and the base metal, thereby increasing the effectiveness of cleaning both the cutting edge and the base metal.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the cutting method of the slicing machine according to the present invention will be described in detail below with reference to the accompanying drawings. In FIG. 1, a chuck body 12 is fixed to the upper end of the spindle 10, and a motor (not shown) is connected to the lower end of the spindle 10, so that the spindle 10 and the chuck body 12 are rotated. It has become. The chuck body 12 has a donut-shaped base metal 1.
The outer peripheral edge of the base metal 14 is stretched up, and an inner peripheral edge 16 is formed on the inner peripheral edge of the base metal 14. The inner peripheral blade 16 is made of fine diamond abrasive grains or the like. Also, this base metal 14
The tension of the outer peripheral edge of the chuck body 12 can be adjusted by a known tensioning mechanism (not shown) of the chuck body 12.

The upper end of the semiconductor ingot 20 is fixed to a work support (not shown). The ingot 20 can be moved in the cutting feed direction (X-X direction) by the cutting feed mechanism, and the work support table can also be moved in the work indexing direction (Z-Z direction) by the work indexing mechanism. It has become. As shown in FIGS. 1 and 2, a cleaning liquid nozzle 22 is provided opposite the inner peripheral blade 16, and immediately behind the cleaning liquid nozzle 22, cleaning liquid side air nozzles 24A and 24B are provided above and below the base metal 14.

Further, a cutting fluid nozzle 26 is provided opposite the inner circumferential cutter 16, and the base metal 14 is disposed immediately before the cutting fluid nozzle 26.
Cutting fluid side air nozzles 28A and 28B are provided above and below. The cutting method according to the present invention is carried out as follows using the slicing machine configured as described above.

Normally, cutting is performed by flowing liquid through the rotating inner peripheral blade 16 from the cutting fluid nozzle 26 and the cleaning fluid nozzle 22. Air nozzles 24A and 24B arranged on both sides of the inner peripheral blade immediately after the cleaning liquid nozzle 22 increase the flow velocity of the liquid and direct the flow direction toward the outer periphery. Air nozzle 24A
, 24B sprays air onto the cutting edge 16 and the base metal 14 of the inner peripheral blade, thereby cleaning both the cutting edge 16 and the base metal 14.

[0010] The air nozzles 24A and 24B also have the function of forcing the cutting fluid that flows around to the outer circumferential side. Air nozzles 28A and 28B arranged on both sides of the inner peripheral blade immediately before the cutting fluid nozzle 26 discharge the fluid that has not been completely discharged. As shown in FIG. 3, the air nozzles 24A, 24B, 28A, and 28B are located in the vicinity of the blade, and their tips are narrowed to forcefully apply air.

[0011]

Effects of the Invention According to the cutting method of the slicing machine according to the present invention described above, the following effects can be obtained. ■A larger amount of cutting fluid and cleaning fluid can be applied to the inner peripheral blade compared to conventional methods, and the cleaning effect is improved so that good cutting can be continued. ■Since the liquid can be discharged smoothly, it works to suppress the phenomenon in which the wafer sticks to the inner peripheral blade due to surface tension. ■The life of the inner peripheral blade can be extended. ■Good cutting is possible without the use of additives in cutting and cleaning fluids, resulting in lower costs.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a slicing machine for explaining the cutting method of the slicing machine according to the present invention.

[
Figure 2: Figure 2 is its plan view.

[Figure 3] Figure 3 is an enlarged view of the vicinity of the nozzle.

[Fig. 4] Fig. 4 is an explanatory diagram showing a conventional slicing method.

[Explanation of symbols]

14...base money 16...Inner peripheral blade 20...Ingot 22...Cleaning liquid nozzle 24A, 24B...Air nozzle 26...Cutting fluid nozzle 28A, 28B...Air nozzle

Claims (2)

[Claims] Claim 1: In a slicing machine that cuts an ingot into thin pieces with an inner peripheral blade while supplying cleaning liquid with a cleaning liquid nozzle, an air nozzle is provided near the cleaning liquid nozzle, and the cleaning liquid is supplied to the inner peripheral blade with air pressure from the air nozzle. A cutting method using a slicing machine, characterized in that cutting is performed by directing the cleaning liquid outward and increasing the flow rate of the cleaning liquid. [Claim 2] In a slicing machine that cuts an ingot into thin pieces with an inner peripheral blade while supplying cutting fluid with a cutting fluid nozzle, an air nozzle is provided near the cutting fluid nozzle, and the cutting is performed using air pressure from the air nozzle. A cutting method for a slicing machine characterized by cutting while removing unacting excess liquid toward the outside of an inner peripheral blade.