JPH04186654A - Boat device for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To place and support each semiconductor wafer in the vertical condition as expected at all times by adjusting the mutual communication width between each slot groove of the boat body member on the side and each slot groove of an adjusting member, by the sliding of the adjusting bar member to the boat body member on the side. CONSTITUTION:An adjusting bar member 15, wherein respective slot grooves 16 communicating with each slot groove 14 are made to correspond to the positions of each slot groove 14 of the boat body member 13 on the side, is one which is set, capably in sliding orthogonally to the directions of each slot groove 14 and 16, to the board body member 13 on the side, and by the sliding operation, the mutual communication width of corresponding each slot groove 14 and 16 can be adjusted optionally, and besides it can be maintained at the adjusted position with sliding resistance at the level of requirement. Even if each slot groove 12, 14, and 16 in each member are widened accompanying the adjustment of the communication width, each semiconductor wafer 17 placed and maintained on each member can be maintained at all times in vertical condition and further at an equal interval.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a boat device for manufacturing semiconductor devices, and in particular, to a boat device for manufacturing semiconductor devices.
This invention relates to an improved structure of a boat device for use in vertically mounting and holding a plurality of semiconductor wafers to be processed during etching processing.

[Conventional technology]

FIG. 2 is a partially longitudinal side view schematically showing the main part configuration of a conventional boat apparatus for manufacturing semiconductor devices.

That is, in the configuration of the conventional device shown in FIG.
and 3 each form a set with a plurality of slot grooves 2 and 3 at corresponding positions. and a bottom side boat body member forming 4;
and side boat body members, and these side body members 1 and 3 constitute a boat apparatus for manufacturing a semiconductor device, which is the subject of this embodiment.

Further, 5 is on both boat main body members l9, 3, and the same number of semiconductor wafers are inserted and held at their peripheral edges by passing through each slot groove 2.4, that is, the same number of semiconductor wafers are covered with this S. Each of a plurality of semiconductor wafers to be processed,
For example, each semiconductor wafer 5 is held vertically on a boat apparatus and used during heat treatment, cleaning treatment, etching treatment, etc. during the manufacture of semiconductor devices.

[Problems to be Solved by the Invention] However, in the conventional boat apparatus for manufacturing semiconductor devices having the above configuration, each of the slot grooves 2 and 4 in each of the boat body members 1 and 2 on the bottom side and the side side is In order to facilitate the operation of attaching and detaching each semiconductor wafer 5,
Normally, the width is slightly wider than the wafer thickness, and this also affects the heat treatment during device manufacturing.

During cleaning treatment, etching treatment, etc., the groove width of each of these slot grooves 2.4 is often widened, and this causes the groove width to increase, as shown in Fig. '2.
Each semiconductor wafer 5 placed and supported on the boat device is tilted between the slot grooves 2 and 4, and cannot maintain its original vertical state as expected.As a result, for example, each semiconductor wafer There was a problem in that the required film thickness on the five sides varied, making it impossible to continue using it in a short period of time.

Incidentally, in the conventional case, the service life of the boat device is generally about six months, and after the expiration of the service life, the boat device is discarded and replaced with a new one.

This invention was made to solve these conventional problems, and its purpose is to deal with the widening of the groove width of each slot groove that occurs over the course of use. By making it possible to mount and support each semiconductor wafer in the desired vertical position, the service life can be extended as much as possible.

An object of the present invention is to provide a boat apparatus for manufacturing this type of semiconductor device.

[Means for Solving the Problems] In order to achieve the above object, a boat device for manufacturing semiconductor devices according to the present invention is a boat device for mounting and holding a plurality of semiconductor wafers when manufacturing semiconductor devices. a bottom-side boat body member each formed with a plurality of slot grooves into which corresponding peripheral portions of the respective semiconductor wafers are inserted to hold the respective semiconductor wafers in a vertical state; and a side-side boat body member. In addition, the side boat body member includes an adjustment bar member formed with slot grooves communicating with each slot groove corresponding to each slot groove position of the side boat body member. The adjustment bar member is disposed so as to be slidable perpendicular to the groove direction, and the width of communication between the respective slot grooves in these two members can be adjusted by sliding the adjustment bar member relative to the side boat body member. It is characterized by the fact that

[Function] Therefore, in the boat apparatus for manufacturing semiconductor devices according to the present invention, by sliding the adjustment bar member with respect to the side boat body member, each slot groove of the side boat body member and the adjustment bar member are connected to each other. Since the mutual communication width with each slot groove can be adjusted, even if the groove width of each slot groove in each member including the bottom side boat body member increases over the course of use, Along with adjusting the communication width between each slot groove of the side boat body member and the adjustment bar member,
Each semiconductor wafer can be placed and supported in the desired vertical position at all times.

[Example] Hereinafter, an example of a boat apparatus for manufacturing semiconductor devices according to the present invention will be described in detail with reference to FIG.

FIGS. 1(a) and 1(b) are partially longitudinal side views schematically showing the main structure of a boat apparatus for manufacturing semiconductor devices to which this embodiment is applied, as well as side boat body members and adjustment bar members. FIG. 3 is a partial cross-sectional view schematically showing the fitting relationship between

That is, in the configuration of the embodiment device shown in FIG.
1. and 13 each form a set with a plurality of slot grooves 12. and 13 at corresponding positions. , and 14 are formed at equal intervals, and a bottom side boat body member and a side boat body member are shown. Reference numeral 15 denotes an adjustment bar member in which slot grooves 16 are formed corresponding to the positions of the slot grooves 14 of the side boat main body member 13 and communicated with the slot grooves 14 of the side boat main body member 13. With respect to the main body member 13,
It is slidably inserted perpendicular to the groove direction of each slot groove 14, 16, and by the sliding operation, the communication width between the corresponding slot grooves 14, 16 can be arbitrarily adjusted,
Moreover, it can be maintained at the adjusted position with a required amount of sliding resistance.

That is, in this way, these bottom side boat body members 11. The boat apparatus for manufacturing semiconductor devices according to the embodiment in this S is constructed by the side boat body member 13 and the adjustment bar member 15 slidably fitted into the side boat body member 13. It is made to compose.

Therefore, for the boat device according to the configuration of the above embodiment, each slot groove 12 in the bottom side boat body member 11,
Each slot groove 14 in the side boat body member 13. By passing through each slot groove 16 of the adjustment bar member 15 combined with each slot groove 14, each part of the peripheral edge of each semiconductor wafer 17 to be processed in 2S is inserted and held. As in the conventional case, it is used during heat treatment, cleaning treatment, etching treatment, etc. during the manufacture of semiconductor devices.

In the case of this embodiment, by sliding the adjustment bar member 15 with respect to the side boat body member 13, the width of communication between the slot grooves 14 and 16 of both of them can be adjusted. It can be adjusted arbitrarily and selectively, and with the adjustment of the communication width, as shown in FIG.
Even if the width is widened, it will be completely different from the conventional case.
The semiconductor wafers 17 placed and held on the boat device can always be maintained vertically and at equal intervals, which effectively eliminates variations in film thickness among the semiconductor wafers to be processed. In addition, the service life of the boat equipment itself can be extended in a favorable manner.

Figure 3 is a graph showing the relationship between the number of times a semiconductor wafer is processed by the boat equipment and the uniformity of the film thickness on the surface of the semiconductor wafer. In comparison with the conventional case shown in code a,
In the case of this example shown in , it can be seen that the uniformity of the film thickness is hardly affected by the number of treatments. Therefore, it is considered that the useful life of the device can be extended to about 3 years.

[Effect 3 of the Invention As detailed above, according to the present invention, in a boat device that is applied during the manufacture of semiconductor devices and that places and holds a plurality of semiconductor wafers, the corresponding peripheral portion of each semiconductor wafer is inserted. and a bottom boat body member and a side boat body member each having a plurality of slot grooves for holding each semiconductor wafer in a vertical state, and
The side boat body member is provided with an adjustment bar member formed with slot grooves communicating with each slot groove corresponding to each slot groove position of the side boat body member, and extending perpendicularly to the groove direction. Since the adjustment bar member is configured to be slidably interposed, each slot groove of the side boat body member and each slot groove of the adjustment bar member are mutually connected by sliding of the adjustment bar member with respect to the side boat body member. As a result, even if the groove width of each slot groove in each member including the bottom side boat body member is
Even if the width increases over time, the communication width between the slot grooves of the side boat body member and the adjustment bar member can be adjusted at all times.

Each semiconductor wafer can be placed and supported in the desired vertical position, which not only stabilizes the uniformity of the film thickness on the semiconductor wafer to be processed, but also reduces the service life of the boat equipment itself. It has excellent features such as being able to be extended.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are partially vertical side views schematically showing the main structure of a boat device for manufacturing semiconductor devices to which an embodiment of the present invention is applied, as well as a main body member on a side boat. FIG. 2 is a partial cross-sectional view schematically showing the fitting relationship between the above-mentioned boat device and the adjustment bar member; FIG. 2 is a graph showing the relationship between the number of times a semiconductor wafer is processed and the uniformity of film thickness on the surface of the semiconductor wafer in the example apparatus and the conventional apparatus. 11...Bottom side boat body member, 12...Slot groove as above, 13...Side side boat body member, 14...Slot groove as above, 15...Adjustment bar member, 16...Slot groove as above, 17...Semiconductor wafer to be processed. Agent Masuo Oiwa Figure 1 (Q) 1+;, i#P4 'E'-) J-!'p' 41 years old 15
: To Mt8'-? 77 Ki 16: Same as above slot J Mushroom 17: A fill → Cho Q

Claims (1)

[Scope of Claims] A boat device for mounting and holding a plurality of semiconductor wafers, which is applied during the manufacture of semiconductor devices, wherein a corresponding peripheral portion of each semiconductor wafer is inserted and each semiconductor wafer is vertically moved. A bottom side boat body member and a side boat body member each having a plurality of slot grooves formed therein for holding the side boat body member in the same position are provided, and each slot of the side boat body member is provided in the side boat body member. An adjustment bar member having slot grooves communicating with each slot groove corresponding to the groove positions is slidably interposed orthogonal to the groove direction, and the adjustment bar is attached to the side boat body member. 1. A boat apparatus for manufacturing semiconductor devices, characterized in that the width of communication between slot grooves in both members can be adjusted by sliding the members.