JPH04176557A - Holding device for member to be polished - Google Patents

Abstract

PURPOSE:To regulate the fitting position and fitting posture of the member to be polished easily and with a high accuracy, by adequately setting each insertion quantities of two members for driving, bend-deforming and twist- deforming a movable part elastically, and making the height and inclination of the member to be polished adjustable. CONSTITUTION:A member 6 to be polished is fixed(e.g. bonded) to a movable plate 3 without its fixing(e.g. bonding) to a sample base 1, directly, and this movable plate 3 is fitted to a fixed plate 2. Then the movable plate 3 fixed with the member 6 to be polished is adjusted at its fitting state, even in the height direction and inclination direction, by two members 5a, 15 for driving, to the fixed plate 2, the member 6 to be polished is positioned, also the misregistration of the case of removing a driving external force is prevented. Consequently the height and inclination of the face to be polished can be adjusted, on each member 6 to be polished which are fixed to each movable plate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a holding device for mounting an object to be polished on a sample stage in a polishing machine such as a lapping machine.

[Conventional technology]

Regarding this type of technology, Japanese Patent Laid-Open No. 57-96767 is known.

In this known technique, a thin plate-like member to be polished is pressed and bonded to a substrate coated with an adhesive, and then processed by a polishing device.

[Problem to be solved by the invention]

According to the above-mentioned known technology, the bottom surface and the top surface are parallel, and it is easy to polish the top surface of the object to be polished, which has a thickness of -, parallel to the bottom surface.

However, this is inconvenient when polishing the top surface of an object to be polished, where the bottom surface and the top surface are not parallel.

Furthermore, the object to be polished is a layered member, and it is not easy to polish the intermediate layer instead of the surface layer.

In particular, if the layer to be polished is not parallel to the bottom surface, it is impossible to polish the layer to be polished.

Here, when the layer that is the polishing target is not parallel to the bottom surface, the shape of the object to be polished may be intentionally made that way, but in general, it is due to machining errors in the object to be polished. Therefore, they are often not parallel, and furthermore, the target layer to be polished is tilted due to variations in the adhesive layer thickness when bonding the object to be polished to the substrate.

Therefore, in the prior art, the polishing target layer is overflowed and cannot be polished accurately. In particular, in recent years, with the demand for higher precision, it is often necessary to perform polishing with precision on the order of submicrons, and conventional techniques cannot handle such cases.

An object of the present invention is to easily and accurately polish a member having a layered structure, even if a specific target layer therein is not parallel to the bottom surface. It is an object of the present invention to provide an inexpensive holding device for a member to be polished, which is improved so that it can be easily applied.

(1!Means for solving IM) In order to achieve the above object, the basic principle of the holding device according to the present invention created will be briefly described.

In other words, instead of directly bonding the object to be polished to a sample stand with a fixed structure as in the past, the sample stand is roughly divided into a fixed part and a movable part, and the movable part is placed above and below the fixed part. It has a structure that can be adjusted and fixed in both the direction and the tilting direction, and the member to be polished is bonded to the movable part.

Based on this principle, the basic policy for realizing the holding device is determined as follows.

■ The member to be polished must be able to be adjusted with high accuracy in the vertical and tilting directions, and the structure must be such that no displacement occurs when the external adjustment driving force is removed.

■ It is an inexpensive holding device. In general, multiple sample stands are often set in a polishing device, and it is possible to shorten the takt time by performing parallel work including one sample in front and one in front. Therefore, a large number of sample stands are required. Therefore, it is necessary to reduce the cost by making the holding mechanism have a small number of components and a simple structure.

As a specific configuration based on this j[31 and policy, the apparatus of the present invention is a polishing apparatus having a structure in which a sample table with a member to be polished attached is attached to perform polishing, in which the sample table is attached to the polishing apparatus.
Roughly divided into a fixed plate and a movable plate, both are connected and fixed at one end, a driving member is inserted into the gap between the two on the side of the other end, and the screw provided at this location is rotated and fed. By moving the driving member in and out, the movable plate can be moved like a cantilever by applying the wedge principle.
It has a structure that adjusts the position of the polished member bonded to the flat surface of the movable plate by elastic deformation, and two pairs of screws and driving members are arranged in a direction perpendicular to the tilting direction of the movable plate. By changing the insertion amount of the two driving members, the height of the member to be polished can be adjusted, and the inclination can also be adjusted. One of the pair of screws is a right-hand thread, and the other is By symmetricalizing the screw residual stress as a left-handed screw, the structure minimizes the positional shift of the polished member when removing the screw drive external force. When implementing the present invention, the fixed plate and the movable plate are arranged circumferentially. It is desirable to arrange them along the same line.

[Effect]

According to this configuration, instead of directly fixing (for example, gluing) the member to be polished to the sample stage, the member to be polished is fixed (e.g., by gluing) to the movable grate, and the movable plate is attached to the fixed plate. A movable plate with attached and fixed part to be polished.

To adjust the mounting state of the fixed plate in both the height direction and the inclination direction using the two driving members, to position the member to be polished, and also to prevent positional shift when removing the driving outer part. I can do it.

Therefore, the height and inclination of the surface to be polished can be adjusted for each member to be polished that is fixed to each movable plate.
In addition, the target layer of the member to be polished can be polished parallel to the bottom surface of the sample stage and to a predetermined height.

〔Example〕

FIG. 1 is a perspective view showing an embodiment of a holding device for a member to be polished according to the present invention.

1 is a sample stage, and a fixed plate 2. Movable grate 3
, a tapered bottle 4 for driving, a feed screw 5, etc., and a large number of members to be polished 6 are attached to the upper surface of the movable plate 5. After adjusting the position, the sample stage 1 is attached to an unconventional polishing device and polished. will be held.

The sample stage 1 has a disk shape, and a movable plate 3 is fastened to a fixed plate 2 at the center thereof with a set screw 7.

Figures 2 and 3 show a plan view and a side view of the sample stage 1, respectively, and the movable plate is divided into small holes by notches 8 for each small hole from the center in the circumferential direction. There is. However, each divided element 5', 3'' is connected at the center to form an integral structural component.A member to be polished 6 is coated with wax 9 on the flat end of each divided element 3', 3'', etc. It is pasted.

Further, the member to be polished 6 is positioned by a positioning pin 10.

The outer periphery of the fixed plate 2 and the movable grate l is
As shown in Figure 4, which is a cross-sectional view of Figure 5, it has a tapered shape. This tapered part has each division! ! Cumulative 3
', 5'', two tapered pins 4.4'
It is assembled to the fixed plate 2 by m, 15. Further, the through hole 4a of the taper pin 40 has a diameter that is slightly larger than that of the screw 5a.

The distance between the tapered parts of the fixed plate 2 and the movable plate 5 is
It is set to be smaller than the outer diameter of the tapered bin 4. Here, the thickness of the movable plate 3 is made thin enough to allow elastic deflection, and the thickness of the fixed plate 2 is made thick enough to allow negligible deflection. Therefore, when the screw 5a is rotated to advance or retreat the taper pin 4, (
Due to the principle of rust, the tip of the movable plate 3 is elastically displaced, and by varying the amount of advance and retreat of the two taper bins arranged for each dividing element 3', 5'', the member to be polished 6 is The position can be adjusted not only in the vertical direction but also in the tilt direction.

Here, the rotation of the screw 5 is performed by engaging the bit 16 with the head of the screw 5a in FIG. 4 and rotating the bit 16 by a drive unit (not shown). In order to adjust the position of the member to be polished 6 with Lamicron order accuracy, it is necessary to shift the backlash 5'a between the screw 5a and the screw hole and the backlash of the bit drive unit. By rotating the screw in one direction, the movable plate 5 is gradually agitated.

Then, when the member to be polished 6 reaches a predetermined height, the bit 16 is removed from the head of the screw 5a.

Next, a method of devising a method that prevents the member to be polished 6 from shifting when the bit is removed will be described.

In general, unless each component of a mechanism is a completely rigid body, when an external force is removed, a positional shift will inevitably occur on the Cron order.

In Fig. 5, when adjusting the member to be polished 6, the right-hand thread is 5 m,
As the screw 5b is rotated clockwise, the friction force between the lower surface of the screw head and the surface 5"a of the taper pin 4 (7) causes the taper pin 4 to rotate clockwise, and furthermore, the taper pin 4 and the Due to the frictional force at the boundary 4 of the movable plate 3, not only a force of 11 but also an inertial force acts on the movable plate 3. This result.

The movable portion grate 5 is displaced in the A direction with its fixed end 3b as a fulcrum, as shown in FIG. 5, with not only bending deformation but also torsional deformation.

When the target position is reached, the bit is then removed, but at this time, due to the screw residual stress P, the movable plate 3 and the member to be polished 6 fixed thereon are displaced as shown by the dotted line. As a result, a positional deviation A also occurs in the height direction. That is, as shown in FIG. 7, immediately before the bit 16 is removed, the straight portion 5a'' of the screw 5a is
The screw driving torque 〒 causes torsional elastic deformation, 0.

This state is maintained by the reaction force from the bit part. However, when the bit 16 is removed, the reaction force disappears, and the screw tends to return counterclockwise due to the screw residual stress P. Then, in Fig. 5, taper pinch 4.4'
A side force in the opposite direction to that during adjustment is applied to the movable plate 5 via the movable plate 5, and as a result, the movable grate 5 is displaced in the direction of the mouth. For this reason, the target layer 6- of the member to be polished 6 is also displaced A. Also, even if you are able to position within the target tolerance through repeated trial and error,
In Figure 5, the movable plate has an inherent force that tries to return in the opposite direction of A, so when an external force is applied during polishing, the inherent force is released, causing the plate to shift position and prevent proper polishing. .

Therefore, in the present invention, as shown in FIG. 6, a structure is adopted in which the taper bins 4 and 4' are driven by a pair of right-hand screws 5m and a left-hand screw 15, respectively.

That is, when adjusting, turn the right-hand screw 5a clockwise and turn the left-hand screw 1.
5 in the counterclockwise direction to fan the movable plate 3. At this time, the frictional force (side force) acting on the movable grate 3 from each taper bin 4, 4' is symmetrical, so The movable plate 5 rises straightly (in the A' direction). Even when the bit is removed after reaching the target position, the screw residual stress is left-right symmetrical (p, p
As a result, even if screw residual stress acts on the movable plate 3, the target layer 6a does not shift because it cancels out the stress, and the member to be polished 6 can be positioned with extremely high precision (on the order of submicrons). And, the movable plate 5 has
Since there is no residual force, there will be no displacement even if an external polishing force is applied.

According to this embodiment, the position of the member to be polished 6 can be adjusted and fixedly held.

Now, as shown in FIG. 8, it is assumed that the polishing target layer 6a of the member to be polished 6 has an inclination of an angle α with respect to the bottom surface 6b. In such a case, the movable plate 5 is tilted counterclockwise in the drawing by an angle α, with its top surface tilted as shown by 5a (indicated by a virtual line). As a result, the polishing target 6a becomes horizontal.

@9 Figure is a flowchart showing the steps when polishing is performed using the apparatus of this embodiment.

Step a) Apply wax to the top surface of the movable plate.
In Step b), the member to be polished is adhered by heating (Step o). While being forcedly cooled, it is pressed and bonded (Step d).

Next, the height and inclination of each movable plate are adjusted by the operations described with reference to FIGS. 4 and 6 (step).

At this stage, since the upper surfaces of the many movable grates and the members to be polished bonded thereto are not aligned in one horizontal plane, they are polished to flatten them using a rotary polishing machine (step f), and then the sample stage Place it on the lapping machine (step g) and finish with wrapping (step h)
.

In the example, the target layer to be polished was detected by photographing both ends of the member to be polished using a high-magnification camera and displaying the images on a TV monitor.

According to this embodiment, even if the member to be polished is a layered object and the position and inclination of the polishing target layer are uncertain, polishing that remains on the polishing target layer can be performed easily and with high precision. I can do it. In other words, the member to be polished attached to the sample stage can be positioned with high precision in the vertical and tilting directions, and the position will not shift even when the external driving force is removed, and even when external polishing force is applied, it will not shift.
Since the position of the part to be polished does not shift at all,
Polishing can be performed with high accuracy (accuracy on the order of submicrons).

Furthermore, this sample stage achieves high-precision adjustment and fixed holding of the workpiece to be polished using extremely few components: a movable plate, a fixed plate, a taper bin, a right-hand screw, and a left-hand screw, making it possible to use an inexpensive holding device. can be provided.

〔Effect of the invention〕

According to the present invention, it is possible to easily and accurately control the dispersion position and defeated posture of the member to be polished, so that the target surface to be polished of the member to be polished is irregular or Even if there are large adhesion errors in the part to be polished, these variations can be absorbed and the polishing can be performed at a specified height and in a specified direction (generally horizontally).
Can be fixed quickly and easily.

Furthermore, in the present invention, the functions of adjusting the position and posture of the member to be polished and fixing and holding the member to be polished are referred to as a movable grate, a fixed plate, a tapered bin, a right-handed screw, and a left-handed screw.

Because it is realized by combining extremely few components,
An inexpensive holding device can be provided.

[Brief explanation of drawings]

Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 5 is a side view of Fig. 1, Fig. 4 is a sectional view of main parts of Fig. 1, Fig. 5 is an explanatory diagram showing the behavior during conventional positioning, Fig. 6 is an explanatory diagram showing the behavior of the right-handed and left-handed thread parts of this embodiment, Fig. 7 is an explanatory diagram of the thread straight part, and Fig. 8 is an explanatory diagram showing the behavior of the right-hand thread and left-hand thread parts of this embodiment. , FIG. 9 is an explanatory diagram of the operation method and effects of the above embodiment,
It is a 70-chart of the process which shows an example of operation in an Example. 1... Sample stage, 2... Fixed plate,
3... Movable plate, 4... Taper pin, 5m... Right-hand thread, 15... Left-hand thread, 6... Member to be polished.

Claims (1)

[Scope of Claims] 1. A polishing apparatus having a structure in which a sample stage with a member to be polished is mounted, the sample stage being divided into a fixed part and a movable part, both of which are connected and fixed at one end, The side surface of the other end is tapered, a driving member is inserted into the tapered part, and the driving member is moved by the rotational feeding action of a screw provided at that location, thereby applying the wedge principle. The structure is such that the movable part is elastically deformed like a cantilever beam to adjust the position of the member to be polished bonded to the flat part of the movable part, and the screw and the driving member are attached to the movable part. Two pairs are arranged in a direction perpendicular to the tilting direction, the insertion amount of each of the two drive members is set appropriately, and the movable part is elastically deformed by bending and torsion, and the polished part is The structure is such that not only the height but also the inclination of the member can be adjusted, and one of the pair of screws has a right-hand thread, and the other has a left-hand thread, so as to eliminate the positional shift of the member to be polished when removing the external screw driving force. A holding device for a member to be polished, characterized in that screw residual stress is made symmetrical.