JPH04129486U - Board mounting structure for surface mount components - Google Patents

Abstract

(57) [Summary] [Objective] The purpose is to provide a board mounting structure for surface mount components that can reduce the space occupied by the components on the board and can reduce the soldering process to one time. [Structure] The contact portions 13 of the multiple terminals 12 provided in two rows on the connector 2, which is a surface mount component, are arranged in a straight line, and the connector 2 is placed at the end of the board 1. The contact portion 13 is soldered to the contact portion 6 of the substrate 1.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to a structure for attaching surface mount components such as connectors to a board. Ru.

0002

[Conventional technology]

Conventional methods for attaching surface mount components to substrates include the following. That is, As shown in FIG. 8, a component 20 and a terminal 21 are on a substrate 22, and the terminal 21 is As shown in FIG. In some cases, the terminals 21 are connected with the board 22 sandwiched therebetween.

0003

[Problem that the idea aims to solve]

However, as described above, when the component 20 is on the board 22, the board 2 There is a problem of taking up a large space above 2, and when the terminal 21 sandwiches the board 22. The problem with this is that several types of terminal spacing must be made to match the type of board. there were.

0004 This invention is intended to solve the above problems, and its purpose is to Not only can you reduce the space occupied by the components on the board, but you can also solder on one side. This makes it possible to reduce the soldering process to one time without having to match the terminal spacing to the board. An object of the present invention is to provide a board mounting structure for surface mount components that can be mounted on a board.

[0005]

[Means to solve the problem]

In order to achieve the above object, the present invention provides multi-layer Arrange the contact parts of several terminals in a straight line and place surface mount components on the edge of the board. The terminal is arranged so that the contact part of the terminal is soldered to the contact part of the board. Ru.

[0006]

[Effect]

With this configuration, the space above the solder joints can be used to place components on a conventional board. In addition, it is possible to solder on one side, reducing the terminal spacing. There is no need to match the board, and the heat treatment process (soldering process) during solder connection can be This reduces the amount of space occupied by the components on the board. The soldering process can be reduced to one time.

[0007]

【Example】

Embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows surface mounting according to the present invention. FIG. 2 is a plan view of the component board mounting structure, and FIG. 2 is a sectional view thereof. In the drawing, 1 is the board, 2 is the table This is a connector as a surface mount component. Make sure that the connector fits on the edge of board 1. A component accommodating portion 3 consisting of a rectangular notch is formed, and a surface portion of the board 1 is provided with a component housing portion 3. Pin holes 4 are provided on the left and right sides of the component storage section 3, and the pin holes 4 are provided on the surface of the board 1. is brought close to the edge portion 5 of the component storage portion 3, and a large number of contacts are made at a predetermined pitch interval in the left and right direction. Section 6 is provided.

[0008] The connector 2 includes a base member 7 as shown in FIGS. 4 to 7. The right and left sides of the base member 7 are cut out, and these cutouts are formed into the mounting part 8. These mounting portions 8 are provided with pins 10. Terminal attachment part of base member 7 11 is a part excluding the mounting part 8, and this terminal mounting part 11 has a large number of terminals 12. are attached at predetermined pitch intervals over two rows. Then, the contact of terminal 12 The portion 13 is bent at a right angle in the plane and in a crank shape on the side at its base. They are arranged in a straight line in the center of the base member 7. And base member 7 The terminal mounting portion 11 has a length that fits within the component storage portion 3 of the board 1, and the pin The spacing between the pin holes 10 and 10 is equal to the spacing between the pin holes 4.

[0009] Then, when the terminal mounting portion 11 of the connector 2 is accommodated in the component accommodating portion 3 of the board 1, In this case, the connector 2 is attached to the board 1 by inserting the pin 10 into the pin hole 4. In this case, the contact portion 13 of the terminal 12 is in contact with the contact portion 6 of the substrate 1, and both contact portions 1 3 and 6 are soldered.

0010 According to the above embodiment, the connector 2, which is a surface mount component, has multiple The contact parts 13 of several terminals 12 are arranged in a straight line, and the connector is attached to the end of the board 1. 2 and solder the contact part 13 of the terminal 12 to the contact part 6 of the board 1. Since the space H above the solder joint is In addition, the heat treatment process (soldering process) during solder connection is lower than that of conventional This is one fewer time than when the board is sandwiched between terminals. Moreover, the connection of terminal 12 The contact portion 13 is bent at a right angle in the plane and in a crank shape on the side. When arranging them in a straight line in the center of the base member 7, All you have to do is turn the mating terminals 12 upside down, and the two rows of terminals 12 have terminals of the same shape. It can be used to reduce the number of parts.

[0011]

[Effect of the idea]

As explained above, the present invention has two rows of multiple ends on a surface mount component. The contact parts of the terminals are arranged in a straight line, and the surface mount components are placed at the edge of the board. Since the contact part of the terminal is soldered to the contact part of the board, The space required for parts is lower than that required when placing components on a conventional board, and There is no need to match the terminal spacing to the board, making it easier to solder The heat treatment process (soldering process) is one less time compared to the process where the board is sandwiched between terminals. It disappears.

[Brief explanation of drawings]

FIG. 1 is a plan view of a structure for mounting a surface mount component on a board according to the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is a partially omitted plan view of the substrate.

FIG. 4 is a plan view of the connector.

FIG. 5 is a view taken from the direction of FIG. 3A.

FIG. 6 is a view taken from the direction of FIG. 3B.

FIG. 7 is a view taken from the direction of FIG. 3C.

FIG. 8 is a side view of a conventional board mounting structure for surface mount components.

FIG. 9 is a side view of a conventional board mounting structure for surface mount components.

[Explanation of symbols]

1 board 2 Connector (surface mount component) 6 Contact part 12 Terminal 13 Contact part

Claims (1)

[Scope of utility model registration request] Claim 1: The contact portions of a large number of terminals provided in two rows on the surface mount component are arranged in a straight line in one row, and the surface mount component is placed at the edge of the board so that the contact portions of the terminals are connected to the board. A board mounting structure for surface mount components, characterized in that the contact portions are soldered.