JPH04128147A - Chip carrier tape - Google Patents
Chip carrier tapeInfo
- Publication number
- JPH04128147A JPH04128147A JP24071990A JP24071990A JPH04128147A JP H04128147 A JPH04128147 A JP H04128147A JP 24071990 A JP24071990 A JP 24071990A JP 24071990 A JP24071990 A JP 24071990A JP H04128147 A JPH04128147 A JP H04128147A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- filling agent
- punching
- inorganic filling
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 238000004080 punching Methods 0.000 abstract description 25
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract description 6
- 229920003023 plastic Polymers 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 abstract description 6
- 239000004743 Polypropylene Substances 0.000 abstract description 3
- -1 polypropylene Polymers 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 6
- 239000011295 pitch Substances 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 6
- 229920001903 high density polyethylene Polymers 0.000 description 6
- 239000004700 high-density polyethylene Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、小型電子部品(以下チップと言う)をキャリ
ヤーテープに搭載して搬送し、産業用ロボットがチップ
を実装する場合に利用される上記パンチングされたチッ
プキャリヤーテープに関する。このようなテープ材質と
して紙とプラスチックがあるが、本発明は、紙の代替即
ち、紙の経済性にプラスチックの利点を相乗的に加味し
たテプの開発を目的になされたものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is used when small electronic components (hereinafter referred to as chips) are mounted on a carrier tape and transported, and an industrial robot mounts the chips. The present invention relates to the punched chip carrier tape. Paper and plastic are available as such tape materials, and the present invention is aimed at developing a tape that synergistically combines the economic efficiency of paper with the advantages of plastic.
従来より、この目的のためのテープ送り穴とチップ搭載
用穴を設けた紙製のパンチングチ、ブキヤリャーテープ
は、例えば特開昭57−83100号公報にも知られて
おり、実際に用いられている。Conventionally, paper punching chips and paper tapes with tape feed holes and chip mounting holes for this purpose have been known, for example, from Japanese Patent Application Laid-Open No. 57-83100, and have not been used in practice. ing.
紙製パンチングテープは、最も安価であり、加工し易く
かつリール巻きによる保管・取扱も容品等の利点もある
が、原料がパルプである為、パンチング時の”ひげ”の
発生は避けられず、近時小型化したチップを搭載した場
合、浮上り現象によってチップが脱落し、ロボットによ
る実装作業に不具合を来すという課題があった。更に、
パンチング時に紙粉が発生し、環境も悪く、製品テープ
から紙粉を除去しなければならなかった。更にまた紙で
ある為、厚みに制限があって厚過ぎると加工時やリール
巻き時の層間剥離及びパンチング抵抗による打抜き性の
低下を招くので、どうしても腰の強い厚手の紙テープを
得られなかった0紙製標準テープの厚みとしては、0.
95mが最高で、ある、また、これ以上の厚みは経済的
にも出来ない。更に、紙は温度と湿度の影響を受けて寸
法安定性が十分ではないという課題もある。Paper punching tape is the cheapest, easy to process, and has the advantage of being easy to store and handle by winding on a reel, but because the raw material is pulp, the occurrence of "whiskers" during punching is unavoidable. When mounting chips that have recently become smaller in size, there has been a problem in that the chips may fall off due to the floating phenomenon, causing problems in the mounting work performed by robots. Furthermore,
Paper dust was generated during punching, and the environment was bad, so paper dust had to be removed from the product tape. Furthermore, since it is made of paper, there is a limit to its thickness, and if it is too thick, it will cause delamination during processing and reeling, and a decrease in punching performance due to punching resistance, so it is impossible to obtain a thick paper tape with strong stiffness. The thickness of standard paper tape is 0.
The maximum thickness is 95m, and it is not economically possible to make it thicker than this. Furthermore, there is also the problem that paper does not have sufficient dimensional stability due to the influence of temperature and humidity.
本発明者等は、上記課題を解決するため鋭意研究の結果
、本発明を完成したもので、本発明は、熱可塑性樹脂4
0〜90重量部と無機充填剤60〜10重量部とを含有
したことを特徴とするパンチングされたチップキャリヤ
ーテープである。The present inventors have completed the present invention as a result of intensive research to solve the above problems.
This is a punched chip carrier tape characterized by containing 0 to 90 parts by weight of an inorganic filler and 60 to 10 parts by weight of an inorganic filler.
本発明で使用する熱可塑性樹脂は、ポリプロピレン(P
P)、ポリエチレン(PE)、ポリスチレン(PS)、
エチレン・酢酸ビニル共1合体(EVA)、塩化ビニル
樹脂(PVC)等が入手の点でも好都合である。これら
は、発泡させたものでも使用できるが、低発泡品の方が
より好ましい。The thermoplastic resin used in the present invention is polypropylene (P
P), polyethylene (PE), polystyrene (PS),
Ethylene/vinyl acetate monomer (EVA), vinyl chloride resin (PVC), etc. are convenient in terms of availability. These can be used even if they are foamed, but low foaming products are more preferable.
最も好ましい熱可塑性樹脂はポリオレフィン系樹脂で、
PE、特に高密度ポリエチレン(HDPE)である。The most preferred thermoplastic resin is polyolefin resin,
PE, especially high density polyethylene (HDPE).
無機充填剤としては、炭酸カルシウム、アルミナ、タル
ク、シリカ等の粉末が安価で入手も容易である。これら
に、更に目的に応じてカーボン、金属粉、窒化硼素等を
含有させて導電性としてもよい。また、これらの導電剤
の2種以上の組成物を混合させでもよい。As the inorganic filler, powders such as calcium carbonate, alumina, talc, and silica are inexpensive and easily available. Depending on the purpose, these may further contain carbon, metal powder, boron nitride, etc. to make them conductive. Further, compositions of two or more of these conductive agents may be mixed.
熱可塑性樹脂と無機充填剤の混合割合は、それぞれ40
〜90重量部と60〜10重量部で、好ましくは60〜
70重量部と40〜30重量部である。この外に顔料、
安定剤、静電防止剤等を通常のプラスチック加工製品同
様に使用することができる。無機充填剤がこの範囲を越
えると、打抜き性は向上するものの、製品テープに貼る
カバテープとボトムテープがつかなくなったり、リル巻
き時に折損することがあるので好ましくない。The mixing ratio of thermoplastic resin and inorganic filler is 40% each.
~90 parts by weight and 60 to 10 parts by weight, preferably 60 to 10 parts by weight
70 parts by weight and 40 to 30 parts by weight. In addition to this pigment,
Stabilizers, antistatic agents, etc. can be used in the same way as for ordinary plastic processed products. If the inorganic filler exceeds this range, although the punching properties will be improved, the cover tape and bottom tape applied to the product tape may not stick to each other or may break during rill winding, which is not preferable.
無機充填剤がこの範囲より少ないと、紙程ではな\1が
プラスチックの”ひげ”と打抜き滓がでる。If the amount of inorganic filler is less than this range, plastic "whiskers" and punching residue will appear, which is not as bad as paper.
シ また、打抜き性も低下する。S In addition, punching properties are also reduced.
本発明品の厚みは、0.3〜5mで祇テープに較べて格
段に厚くすることができる。これによって寸法安定性と
テープの腰が良くなる。尚、テプ幅は4〜30mで紙テ
ープと同様である。The thickness of the product of the present invention is 0.3 to 5 m, and can be made much thicker than the Gion tape. This improves the dimensional stability and stiffness of the tape. The width of the tape is 4 to 30 m, which is the same as that of paper tape.
本発明品を製造するには、−船釣なプラスチック加工技
術を応用できる。例えば、原料シートは、Tダイによる
押出によって製造できる。また、カレンダー法でも可能
である。パンチングは、金型による打抜きで行う、カバ
ーテープとボトムテープは、ポリエステルフィルムに、
イージーピールや静電防止の付与剤等を添加した塗布剤
を押出コティングによって、コートしたものを用いる。To manufacture the product of the present invention, standard plastic processing techniques can be applied. For example, the raw material sheet can be manufactured by extrusion using a T-die. It is also possible to use a calendar method. Punching is done by punching with a die.The cover tape and bottom tape are made of polyester film.
A coating coated by extrusion coating with a coating agent containing an easy-peel or antistatic agent is used.
以上述べた通り、本発明は、単に紙の代替に止まらず、
十分にその機能を向上させ、且つ紙の経済性を維持する
ものである。As mentioned above, the present invention is not limited to simply replacing paper;
This sufficiently improves its functionality and maintains the economic efficiency of paper.
以下、図面に基き、実施例を以て本発明を更に説明する
。Hereinafter, the present invention will be further explained with reference to the drawings and examples.
実施例 I
HDPE :炭酸カルシウムが、重量部で60=40の
氷相化成工業社製食品用シート(商品名サンシート、厚
さ1■、幅50m)を200mに裁断し、1巻とした0
次いで、これを8■幅のテープにスリットしつつ、チッ
プ搭載用穴(1゜9閣×1.1閣)2とテープ送り穴(
1,5m径)3を、打抜き金型でピッチ4■に打抜き、
チップキャリヤーテープ1を得た。チップ搭載用穴はテ
ープ送り方向に対して横長にセットし、テープ送り穴は
、その対角方向にセットされている。Example I HDPE: A food-grade sheet made by Hyosou Kasei Kogyo Co., Ltd. (product name Sunsheet, thickness 1cm, width 50m) containing 60=40 parts by weight of calcium carbonate was cut into 200m pieces and made into one roll.
Next, while slitting this into 8cm wide tape, insert holes for chip mounting (1°9 x 1.1cm) 2 and tape feed hole (
1.5m diameter) 3, punched with a punching die to a pitch of 4■,
Chip carrier tape 1 was obtained. The chip mounting hole is set horizontally with respect to the tape feeding direction, and the tape feeding hole is set diagonally to the tape feeding direction.
このテープに、5.3m幅で厚さ12μの延伸ポリエス
テル(PET)とシール材とを積層した昌剥離テープ(
東洋化学社製、商品名 カバーテープ)をボトムテープ
5として熱シールした。これに、チップコンデンサーを
約3000個搭載し、ボトムテープと同材料の幅5,3
wmのカバーテープ6をチップ搭載用穴の両側面接着幅
各0.5腿となる様に熱シールによって、連続的に貼り
合せ、径17B閣のリールに巻き取った。カバーテずつ
プリント基板に実装した。結果を表に示す。This tape is laminated with a 5.3m wide, 12μ thick stretched polyester (PET) and a sealing material.
Bottom tape 5 (manufactured by Toyo Kagaku Co., Ltd., trade name: cover tape) was heat-sealed. This is equipped with approximately 3,000 chip capacitors, and is made of the same material as the bottom tape with a width of 5.3 mm.
Wm cover tape 6 was continuously pasted by heat sealing so that the adhesion width on both sides of the chip mounting hole was 0.5 mm each, and the tape was wound onto a reel with a diameter of 17B. Each cover was mounted on a printed circuit board. The results are shown in the table.
実施例2
HDPEをカルブ工業社製PE(商品名カルブシート)
に変えた以外は実施例1と同様に行った。Example 2 HDPE was converted to PE manufactured by Calb Industries (trade name Calb Sheet)
The same procedure as in Example 1 was carried out except that .
実施例3
HDPEを三菱油化社製PP(商品名工コロシート)に
変えた以外は実施例1と同様に行った。Example 3 The same procedure as in Example 1 was carried out except that HDPE was changed to PP manufactured by Mitsubishi Yuka Co., Ltd. (trade name: Koro Sheet).
比較例1
PE:炭酸カルシウムを95重量部:5重量部とした以
外は実施例2と同様に行った。Comparative Example 1 The same procedure as in Example 2 was carried out except that PE:calcium carbonate was changed to 95 parts by weight: 5 parts by weight.
比較例2
PE:炭酸カルシウムを35重量部:65重量部とした
以外は実施例2と同様に行った。Comparative Example 2 The same procedure as in Example 2 was carried out except that PE:calcium carbonate was changed to 35 parts by weight: 65 parts by weight.
比較例3
HDPEと炭酸カルシウムを紙100%(標準品)とし
た以外は実施例1と同様に行った。Comparative Example 3 The same procedure as in Example 1 was carried out except that HDPE and calcium carbonate were used as 100% paper (standard product).
判定基準
a、″ひげ”
”ひげ”が第3図7に示す如く存在し、そのために、チ
ソブンデンサー3000個中3個脱落したものをB、6
個以上脱落したものをC1全然脱落しなかったものをA
とした。Judgment Criteria A, "Beard""Beard" exists as shown in Fig. 3, and therefore, out of 3,000 chisobundensas, 3 have fallen off are classified as B, 6.
Items that have fallen off more than 100 pieces are C1. Items that have not fallen off at all are A.
And so.
b、打抜き粉
粉がテープにまで付着しているものをC、テブ裏面側の
打抜き台上に落ちているものをB、全然粉が認められな
いものをAとした。b. A case where the punching powder adhered to the tape was rated C, a case where the punching powder had fallen onto the punching table on the back side of the tape was rated B, and a case where no powder was observed was rated A.
C0寸法安定性
テープを30−に短く切って、一端を固定し、他端を3
閣引っ張ると、著しく形の崩れるものをC1多少崩れる
ものをB、若干伸びる程度のものをAとした。Cut C0 dimensionally stable tape into 30- length strips, secure one end, and secure the other end at 30-.
Items that lose their shape significantly when pulled are rated C, items that slightly collapse are rated B, and items that only slightly stretch are rated A.
d、打抜き性
打抜き時のトルクを手動のパンチング金型のレバー長さ
で変えて、300閣をA、400mをB、500mをC
とした。d. Punching performance: By changing the torque during punching by changing the lever length of the manual punching die, 300 m is A, 400 m is B, and 500 m is C.
And so.
e、眉間剥離
テープを100−長に切断し、両端で60°角になるよ
うに自然に曲げた場合、全熱剥離力(ないものをA、剥
離が若干認められるものをB、使用に耐えないものをC
とした。e. When the glabellar peeling tape is cut into 100-length pieces and bent naturally to form a 60° angle at both ends, the total heat peeling force (A for those with no peeling, B for those with slight peeling), which can withstand use. C what is not there
And so.
f、腰
テープを50−長に切断し、一端を固定し、他端が全然
垂れないものをA、5閤以内のものをB、それ以上のも
のをCとして腰が弱し1とした。f. The waist tape was cut into 50-length pieces, one end was fixed, and the other end did not sag at all, which was rated A. If it was less than 5 tapes, it was rated B. If it was longer than that, it was rated C. If the waist was weak, it was rated 1.
g、カバーテープ、ボトムテープの5剥離性テープがち
ぎれたり、ちぎれそうになるものを難剥離としてB、保
管中に自然に剥離したり、それに類するものを過剥離と
してC1手で軽く剥離するものを易剥離性としてAとし
た。G. Cover tape, bottom tape 5. Peelability Tapes that are torn or are about to tear are considered difficult to peel. B. Those that naturally peel off during storage or similar are considered excessive peeling. C1 Tapes that can be lightly peeled off by hand. was rated A for easy peelability.
■従来の紙をパンチングしたチ・ノブキ中リヤーテープ
特有の”ひげ”がない、従って、チップ搭載時、チップ
の浮上による脱落がなし)。■There is no "whisker" characteristic of the conventional paper-punched Chi Nobuki medium rear tape, so when the chip is mounted, the chip does not come off due to floating).
■パンチング時に紙粉が出ない。■No paper powder comes out when punching.
■熱可塑性樹脂に無機充填剤を特定量配合することによ
り、打抜き性が著しく向上する。■By adding a specific amount of inorganic filler to thermoplastic resin, punching properties are significantly improved.
■厚手で腰の強いパンチングテープが得られる。■Produces thick and strong punching tape.
■寸法安定性がよい。■Good dimensional stability.
■テープの層間剥離がないので、リール巻き等の保管時
も心配ない。■There is no delamination of the tape, so you don't have to worry about storing it on a reel.
■紙間等の経済性を維持出来る。■It is possible to maintain economy in terms of paper space, etc.
第1図は、本発明によるチップキャリヤーテープを一部
リールに収納した状態を示す斜視図、第2図は、本発明
によるチップキャリャーテブの一部を切欠して示す部分
拡大斜視図、第3図は、比較例として、紙製のチップキ
ャリヤーテープの一部を切欠して示す部分拡大斜視図で
ある。
1・・・チップキャリヤーテープ 5・・・ボトムテー
プ2・・・チップ搭載用穴 6・・・カバーテ
ープ3・・・テープ送り穴 7・・・”ひげ
14・・・リール
叉二ノ
第
図FIG. 1 is a perspective view showing a chip carrier tape according to the present invention partially stored in a reel; FIG. 2 is a partially enlarged perspective view showing a chip carrier tape according to the present invention partially cut away; FIG. 3 is a partially enlarged perspective view showing a paper chip carrier tape with a portion cut away as a comparative example. 1... Chip carrier tape 5... Bottom tape 2... Hole for chip mounting 6... Cover tape 3... Tape feed hole 7... Beard 14... Reel fork diagram
Claims (1)
10重量部とを含有したことを特徴とするパンチングさ
れたチップキャリヤーテープ。1 40-90 parts by weight of thermoplastic resin and 60-90 parts by weight of inorganic filler
10 parts by weight of a punched chip carrier tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24071990A JPH04128147A (en) | 1990-09-11 | 1990-09-11 | Chip carrier tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24071990A JPH04128147A (en) | 1990-09-11 | 1990-09-11 | Chip carrier tape |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04128147A true JPH04128147A (en) | 1992-04-28 |
Family
ID=17063686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24071990A Pending JPH04128147A (en) | 1990-09-11 | 1990-09-11 | Chip carrier tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04128147A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
JP2016078862A (en) * | 2014-10-10 | 2016-05-16 | デンカ株式会社 | Sheet for punch carrier tape |
-
1990
- 1990-09-11 JP JP24071990A patent/JPH04128147A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
JP2016078862A (en) * | 2014-10-10 | 2016-05-16 | デンカ株式会社 | Sheet for punch carrier tape |
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