JPH04101777A - Blasting abrasive and barrier rib forming method using it - Google Patents

Abstract

PURPOSE:To surely remove a abrasive residual with its sticking to the body to be subjected to etching, by composing the blasting abrasive with an organic resin or carbon having a gasifying property with heating or burning. CONSTITUTION:A thick film layer 24 for a rib is laminated on a base, in case of forming a barrier rib 16 of a gas electric discharging display panel. Then, a resist pattern 26 which exposes the groove forming zone 30 of this thick film layer 24 for rib is formed. The abrasive consisting of an organic resin or carbon is gasified with the thick film layer 24 for rib being calcinated, after the etching removal of the thick film layer 24 for rib of this groove forming zone 30 by blasting with the use of the abrasive.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an abrasive material for blasting and a barrier rib forming method using the abrasive material.

(Prior art) Conventionally, barrier rib formation for gas discharge display panels has been
A thick film printing method suitable for mass production is used. Below, the fourth
With reference to the drawings, the manufacturing process of the gas discharge display panel will be explained, as well as the formation of barrier ribs by the thick film printing method. FIG. 4 is a sectional view of essential parts showing an example of the configuration of a gas discharge display panel.

First, the cathode 12 is formed on the back plate 10 by a thick film printing method. The cathode] 2 is made of a thick Ni film, and a plurality of striped cathodes 12 are arranged in parallel.

Next, barrier ribs 16 for maintaining a constant gap between the cathode 12 and the anode 14 are formed by a thick film printing method. The barrier ribs 16 are made of a thick glass film, and a plurality of striped barrier ribs 16 are arranged in parallel so that the barrier ribs 16 are orthogonal to the cathode 12 when viewed from above. After printing and drying are repeated to stack glass thick films in a predetermined pattern shape to a predetermined height, the glass thick films are fired to complete the barrier ribs 16.

Further, the anode 14 is formed on the front plate 18 by a thin film forming technique. The IlI pole 14 is made of a transparent conductive film (ITO: in
A plurality of nostrive-shaped anodes 14 are arranged in parallel.

Next, a phosphor layer 20 is formed on the anode 14 in the display cell forming area by a thick film printing method.

Next, the electrode forming surfaces of the back plate 1o and the front plate 18 are faced to each other so that the cathode 12 and the anode 4 are orthogonal to each other when viewed in plan, and the peripheries 10 and 18 are sealed with glass. The cathode 12 and the anode 14 intersect 91! A display cell is formed in the area.

Next, the gas-filled area between the sealed back plate 10 and front plate 18 is evacuated to fill the sealed area with discharge gas, thereby completing the panel.

(Issue 11 to be Solved by the Invention) On the other hand, in recent years, there has been an increasing demand for increasing the pixel density of gas discharge display panels. In order to achieve high definition, barrier ribs must be formed finely, for example, with a height of 160 to 200 um and a width of 50 to 60 um.To give a specific example, 640 x 480 When creating a pixel panel in a 12-inch size with a pixel density of 8 pixels per 1 mm, the width of the barrier rib needs to be 62.5 um or less in order to make the aperture ratio of the display cell 50% or more.

However, in the conventional barrier rib formation method described above,
Printing is repeated until the thick film paste is laminated to a predetermined height. Therefore, in order to form fine barrier ribs, it is necessary to pile up the thick film paste precisely in the fine protrusion formation area each time printing is performed. This is a technically very difficult task and is not suitable for forming fine barrier ribs.

Therefore, this applicant filed an application separate from this application,
We have proposed a barrier rib formation method using blast etching as a method more suitable for forming fine barrier ribs than the thick film printing method. To roughly explain this formation method, a thick film layer for ribs is laminated on a substrate on which an electrode, such as a cathode, is formed, and a resist pattern is provided on the dried thick film layer for ribs to expose the groove forming area. Then, an abrasive such as alumina powder is sprayed onto the exposed portions of the thick film layer for ribs and the exposed portions are removed by etching and etching, and the etched thick film layer is fired to complete the barrier ribs. The remaining rib thick film layer constitutes barrier ribs.

FIGS. 5A and 5B are cross-sectional views showing the state of barrier ribs before and after firing the etched thick film layer for ribs.
In the figure, 22 is an etching prevention layer for preventing etching of the cathode 12, 24 is a thick film layer for ribs, 26 is a resist pattern that exposes the groove forming area of the thick film layer for ribs 24, and 28 is an abrasive. It should be noted that when the thick film layer 24 is fired, the etching prevention layer 22 and the resist 26 are burned away.

In implementing the forming method proposed by this applicant,
As shown in Figure (A), after the thick film layer 24 is etched, the etching prevention layer 22, the substrate 10, or the thick film layer 24 is
It is necessary to remove the abrasive material 28 adhering to the thick film layer 24 or the resist pattern 26 before firing because it is very difficult to completely remove it using an air gun. The thick film layer 24 is fired while it is attached or adsorbed onto the etching prevention layer 22. As a result, as shown in FIG. 5(B), the thick film layer 24 (barrier rib 16) may crack or chip due to the difference in thermal expansion coefficient between the thick film layer 24 and the abrasive material 28. However, there is a problem in that the abrasive adheres to the cathode 12, resulting in a decrease in the discharge area of the cathode 12, resulting in deterioration of discharge characteristics.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to provide a blasting abrasive material that is gasified by heating or combustion, and a barrier rib forming method using the abrasive material.

(Means for Solving the Problems) In order to achieve this object, the blasting abrasive material of the first invention is characterized by being made of an organic resin or carbon that has the property of being gasified by heating or combustion.

Further, the barrier rib forming method of the second invention is for forming barrier ribs of a gas discharge display panel using the blasting abrasive material of the first invention, and in forming the barrier ribs, a thick film layer for the ribs is laminated on the base. a step of forming a resist pattern exposing the groove forming region of the thick film layer for ribs; a step of etching away the thick film layer for ribs in the groove forming region by blasting using the abrasive material; The method is characterized in that it includes a step of firing the thick film layer and gasifying the abrasive material.

(Function) According to the abrasive material for blasting of the first invention, the abrasive material is gasified by heating or combustion. Therefore, after the abrasive material is sprayed onto the object to be etched and etching is completed, the abrasive material adhering to the object to be etched is burned or heated, and the abrasive material is gasified and blown away from the object to be etched.

Further, according to the barrier rib forming method of the second invention, the abrasive material of the first invention is used, but in this case, the abrasive material is one that is gasified at any suitable temperature below the firing temperature of the thick film layer for ribs. Therefore, even if the thick film layer for forming ribs is fired with the abrasive still attached to the electrodes of the gas discharge display panel, the thick film layer for forming ribs, etc. after etching, the abrasive will gasify and disappear. In addition, the abrasive material can be removed from the electrode quickly, and the occurrence of chips and cracks in the thick film layer for forming ribs can be significantly reduced.

(Example) Hereinafter, as an example, an example will be described in which the first and second inventions are applied when barrier ribs are formed on the back plate side of a gas discharge panel shown in FIG. It should be noted that the drawings are only schematic representations to the extent that the invention can be understood.

1 and 2 (A) to (H) are a manufacturing process flow and a manufacturing process diagram of an embodiment of the second invention. Figure 2 (A) ~
(C) represents a cross section taken in a direction perpendicular to the direction in which the cathode extends, and FIGS. 2(D) to (G) represent cross sections taken along the direction in which the cathode extends.

*Step 1: First, a back plate [O] comprising a cathode 12 and an etching prevention layer 22 is formed as a base for forming barrier ribs.

In step], a glass substrate is prepared as the back plate 10, and a plurality of striped cathodes 12 are formed in parallel on the back plate 10, as shown in FIG. 2(A). For this formation, Ni thick film paste (manufactured by DuPont, $9535) was used.
)! A plurality of striped cathode patterns are formed by printing, this pattern is dried at a drying temperature of 150'C for 1 hour, and the dried pattern is fired at a temperature of -150°C. 580°
C. for 10 minutes and bake.

Next, as shown in FIG. 2 (8), an etching prevention layer 22 is formed to protect the cathode 12 from etching caused by blasting.
is formed on the cathode 12. The etching prevention layer 22 may have either a single-layer structure or a multi-layer structure, but in this embodiment, it has a two-layer structure consisting of a blast-resistant resin and a protective layer sequentially provided on the cathode 12.

The blast-resistant resin has a property that it is difficult to be etched or not etched by blasting. The blast-resistant resin uses Tokyo Ohka Co., Ltd.'s buffer film resist.
This resin is applied to the barrier rib forming area using a spin coater to a thickness of 15 to 2 um. The resist coating conditions were as follows: The number of revolutions of the stone coater was set to 500 r, p, m for 5 seconds from the start of rotation, and then 500 r, p, m.

] Hold for 5 seconds, then 1500r, p.

The condition is that the temperature is maintained at 1500 r, p, m for 1 second, and then lowered to Or-pom over 5 seconds. After applying the resist, heat the resist to 170°.
C for 15 minutes, and the dried resist is exposed to light at an exposure dose of 15-20 mJ/cm2 to cure.

Moreover, the protective layer is for preventing the solvent component contained in the printed thick film layer 24 for ribs from penetrating into the blast-resistant resin and causing the blast-resistant resin to swell and be peeled off. For the protective layer, an anti-bleeding agent manufactured by Tokyo Ohka Co., Ltd. is used, and this anti-bleeding agent is applied to the blast-resistant resin using a spin coater. The coating conditions for the protective layer are the same as those for the resist. After applying the protective layer, apply the protective layer at a temperature of 40″C for 5 to 1
Dry in the dark for 0 minutes.

*Step 2: Next, the cathode 12 and the etching prevention layer 22
The back plate 10 formed with is used as a base for forming barrier ribs,
A thick film layer 24 for the bulge is laminated on this base.

In step 2, glass thick film paste (manufactured by DuPont, $9741) is printed all over the lFr etching prevention layer 22, and printing is repeated until the layer is stacked to a height of 160 to 200 μm. If the printed thick film paste is not laminated to the predetermined height, dry the printed thick film paste at a drying temperature of 150"C for 10 minutes before printing the next print, and once the predetermined height is laminated, the printed thick film paste should be dried. Drying temperature 150'C1
After drying for a certain period of time, a thick film layer 24 for ribs is obtained, which is made of a thick film paste laminated to a predetermined height as shown in FIG. 2(C).

*Step 3: Next, groove forming area 30 of thick film layer 24 for ribs
A resist pattern 26 is formed that exposes.

In step 3, first, as shown in FIG. 2(D), a resist 32 is coated on the rib thick film layer 24 to a thickness of 15 to 20 um using a suton coater. resist 32
The coating conditions were as follows: the spin coater rotation speed was 500 r, p, m after 5 seconds from the start of rotation, and 500 r after closing.
, p, m, for 60 seconds, then 1500r,
pom.

The conditions are that after closing, it is held at 1500 r, p, m for 1 second, and then lowered to Or, p, m over 5 seconds. After applying the resist 32, the resist 32 is dried at a temperature of 70° C. for 15 minutes.

○5BR-82B manufactured by Tokyo Ohkasha as resist 32! However, since this is a negative type, a mask is used that can expose the region of the thick film layer 24 that is desired to remain as a barrier rib. In exposing the resist 32, a negative film of the same size is used, and therefore the mask is used in close contact with the resist 32, so in order to prevent the resist 32 from being attached to the mask, an anti-tack agent manufactured by Tokyo Ohka Co., Ltd. is applied on the resist 32. (not shown) and incubate for 2-3 minutes at room temperature.

Next, the resist 32 is exposed, developed, fixed, and dried to obtain a resist pattern 26 exposing the groove forming regions 3o, as shown in FIG. 2(E). In the exposure, the exposure amount was set to a film thickness of xo and 7 mJ/cm2, and after the exposure, development was carried out by spraying a 0.2% by weight aqueous sodium carbonate solution with a low-pressure spray, and then a mixture of pure water 5β and 0.5% Icc of hydrochloric acid was applied. Spray on it and let it settle. Note that the anti-tack agent is also patterned in the same shape as the resist pattern 26.

*Step 4: Next, thick film layer 2 for ribs in groove forming area 3o
4 is removed by etching by blasting using an abrasive for blasting.

In the step tube 4, the abrasive material used for blasting is made of organic resin or carbon that has the property of being gasified by heating or combustion. In addition, the abrasive material decomposes or burns at any suitable temperature below the firing temperature of the thick film layer 24 for the whelk, and the abrasive material does not ignite or burn in the process before the firing process), such as ethyl cellulose. Powder (manufactured by Tokyo Ohka Co., Ltd., particle size: approximately 5 um) or carbon powder (spherical carbon fine particles (mesocarbon microbeads), manufactured by Osaka Gas Co., Ltd.)
(particle size of about 5 um) is used. @Abrasive material decomposes and gasifies when heated, or oxidizes when burned, producing water vapor, carbon dioxide,
It becomes gasified as silicon oxide etc.

And a blast machine (fine powder type 5C manufactured by Fuji Seisakusho)
-3)! Then, as shown in FIG. 2(F), the thick film layer 24 for ribs in the groove forming area 30 is removed by etching.

Since the rib thick film layer 24 is in a dry state, it can be easily etched.

After finishing the etching and etching, the abrasive material adhering to the rib thick film layer 24, etching prevention layer 22, etc. is removed using, for example, an air gun. This removal does not have to be complete. Further, it is not necessary to remove the abrasive material here.

*Step 51 Next, the thick film layer 24 for the ribs is fired and the abrasive material for the plastic is gasified.

In step 5, the rib thick film layer 24 is fired at a temperature of 530°.
C. for 10 minutes and bake. By this baking, the abrasive material is preferably completely combusted, gasified, and removed, and the resist pattern 26, tack inhibitor, blast-resistant resin, and protective layer are also combusted and preferably completely combusted and gasified. As shown in FIG. 2(G), the barrier rib 6 of the gas discharge display panel is completed.

FIGS. 3(A) and 3(B) show the state of the pre-fired sliding door of the barrier rib after etching is shown in a cross section similar to that shown in FIG. 2.

As shown in FIG. 3(A), the abrasive material 2 is
Even if the removal of 8 is incomplete and the abrasive 28 remains attached to the rib thick film layer 24, anti-jabbing layer 22, etc., the abrasive 28 will decompose or burn and gasify. As shown in FIG. 3(B), chipping and cracking of the rib thick film layer 24 (barrier ribs 16) can be prevented from occurring due to firing, and the abrasive material 28 can be prevented from remaining on the cathode 12 after firing. You can do it.

The first and second inventions are not limited to the above-described embodiments, and therefore, the shapes, dimensions, arrangement positions, configurations, forming materials, forming methods, numerical conditions, and other conditions of each component may be adjusted as desired. can be changed to .

In the first invention, the shape of the abrasive material can be, for example, spherical, polygonal columnar, or any other suitable shape. Further, the temperature for gasifying the abrasive can be set to any suitable temperature depending on the use of the abrasive.

Furthermore, in the second invention, for example, the etching prevention layer may be provided only on the entire upper surface of the cathode, but not on the substrate surface, or the etching prevention layer may be provided only on the upper surface of the anode in the barrier rib forming method. It may be arranged so that it is not provided on the substrate surface and the cathode upper surface in the groove forming region. Further, the structure of the base for forming barrier ribs can be changed to any suitable structure.

(Effects of the Invention) As is clear from the above explanation, the abrasive material for blasting of the first invention is gasified by heating or combustion, so the etching process was completed by spraying this abrasive material onto the object to be etched. Afterwards, when the abrasive material adhering to the object to be etched is heated, the abrasive material decomposes or burns, becomes gas, and flies away from the object to be etched. Therefore, the abrasive material remaining on the object to be etched can be removed more easily than before.

Further, according to the barrier rib forming method of the second invention, the abrasive material of the first invention is used, but in this case, the abrasive material is decomposed or treated at any suitable temperature below the firing temperature of the thick film layer for the ribs. Use something that will be baked. Therefore, even if the thick film layer for ribs is fired with the abrasive remaining attached to the electrodes of the gas discharge display panel, the thick film layer for ribs, etc. after etching, the abrasive will gasify and disappear. Therefore, the abrasive material can be removed from the electrode more reliably, and the occurrence of chips and cracks in the thick film layer for ribs due to firing can be significantly reduced. As a result, it is possible to avoid deterioration of discharge characteristics and improve the yield of barrier ribs. Furthermore, since the abrasive material can be removed by firing the thick rib-forming layer, the step of burning and removing the abrasive material can be completed simply.

[Brief explanation of drawings]

FIG. 1 is a manufacturing process flow of barrier ribs, which provides a detailed explanation of the second invention. FIGS. 2(A) to (G) are manufacturing process diagrams, which provide a detailed explanation of the second invention. B) is a cross-sectional view showing the state before and after firing of the thick film layer for ribs in the embodiment of the second invention; FIG. 4 is a diagram showing an example of the configuration of a gas discharge display panel; FIG. 5(A) - (B) are cross-sectional views showing the state of the thick film layer for ribs before and after firing in the conventional method. 16--Barrier tube, 24--Thick film layer 26 for ribs
...Resist pattern 28--Abrasive material, 30... Groove formation region. Patent applicant Oki Electric Industry Co., Ltd. 10a - Substrate surface 2nd factor Barrier rib manufacturing process Flow Example of one configuration of gas discharge display panel 4 Figures 0 to 0 ---

Claims (2)

[Claims] (1) An abrasive material for blasting characterized by being made of organic resin or carbon that has the property of being gasified by heating or combustion. (2) In forming barrier ribs of a gas discharge display panel using the blasting abrasive material according to claim 1, the steps include: laminating a thick film layer for ribs on a base; and forming grooves in the thick film layer for ribs. forming a resist pattern that exposes the region; etching away the rib thick film layer in the groove forming region by blasting with the abrasive material; and firing the rib thick film layer to remove the abrasive material. A method for forming barrier ribs, comprising the step of gasifying.