JPH04101439A - Outer lead bonding device for film carrier semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the damage of a wiring pattern by fixing a protection material, such as Teflon(R) or polyimide onto a chip stage on which an IC chip is mounted or making the area and shape of said chip stage identical to the area and shape of IC chip. CONSTITUTION:In an outer lead bonding device which installs a film carrier semiconductor device to a semiconductor board based on a face down system, either a protection material 6a, such as Teflon(R) is fixed with a chip stage 4a so as to protect the surface of an IC chip from damage or the area and shape of the top of a chip stage 4b is adapted to be identical to the area and shape of the IC chip 1. This construction makes is possible to prevent the sur face of the IC chip from direct contact with the surface of the chip stage and hence protect a wiring formed on the surface of the IC chip from any possible damage.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an outer lead bonding apparatus for a film carrier semiconductor device, and more particularly to a structure of a chip stage of an outer lead bonding apparatus for mounting a film carrier semiconductor device face down. .

[Conventional technology]

Conventionally, bonding of film carrier semiconductor devices, that is, T A B (Tape Out, oriented
Inner lead bonding (hereinafter referred to as LB) using the bonding method is performed as follows. An insulating film made of polyimide, polyester, glass epoxy, etc. with sprocket holes is used as a base film, a metal foil is adhered to this base film via an adhesive, and the desired shape of leads and electricity is attached to this metal foil by photo-etching, etc. The leads and bumps, which are metal protrusions provided in advance on the electrode terminals of the IC chip, are subjected to ILB using thermocompression bonding or eutectic method, and the film carrier tape is electrically sorted. or BT test, and then cut the lead to the desired length.

At this time, in the case of multiple pins with a large number of leads, in order to prevent variations in the outer lead bonding (hereinafter referred to as 0LB) part of the leads, an insulating film such as polyimide that makes up the film carrier tape is attached to the outer end of the outer lead. The leaving method is often used. Further, in order to improve reliability and mechanical protection, resin sealing may be performed by botting the resin. Then, for example, a printed circuit board,
OLB is performed on the bonding pads on ceramic substrates and general lead frames. With the film carrier semiconductor device described above, bonding can be performed at once regardless of the number of leads, so the bonding stage is fast, and the assembly process such as bonding and the electrical selection process can be easily automated and mass-produced. It has advantages such as superior performance.

By the way, common methods for mounting film carrier semiconductor devices include thermocompression bonding, flow method, and the like. The thermocompression bonding method is a method of OLB while pressing the lead using a heating tool. On the other hand, the reflow method
This method involves applying solder paste onto the B pad by screen printing or the like, fixing the semiconductor package with adhesive, melting the solder paste in a reflow oven, and soldering the leads and OLB pads. Of the two types of mounting methods described above, thermocompression bonding is generally used in many cases. This is because, in the case of the flow method, the OLB lead floats due to warping of the tape, resulting in a gap between the lead and the OLB pad, which makes it difficult to solder properly. Furthermore, as the number of pins increases, the size of the semiconductor device increases, and the floating of the leads due to warping of the tape becomes noticeable. Further, as mounting formats, there are a face-down method in which OLH is carried out with the surface of the IC chip facing the printed circuit board, and a face-up method which is the opposite.

A conventional OLH that connects an outer lead and an OLB pad in a face-down manner using such thermocompression bonding method will be described with reference to the cross-sectional view of FIG. 4. A film carrier semiconductor device in which the leads of the film carrier tape 3 and the bumps 2 of the IC chip 1 are ILBed is manufactured by cutting and molding the outer leads to a desired length, and then attaching the IC chip 1 to the IC chip 1.
After being transferred to the bonding stage 10, it is attracted to the chip stage 4d of the OLB device. A suction hole 9 is provided in the chip stage 4d. Next, the bonding pads 8 on the printed circuit board 7 and the outer leads are aligned by a method such as pattern recognition, and are simultaneously connected by one-time thermocompression bonding using the bonding tool 5 loaded with heat and load.

[Problem to be solved by the invention]

The outer lead bonding equipment that mounts the conventional film carrier semiconductor device face-down described above has an upper area of the chip stage on which the IC chip is mounted.
Since the area of the IC chip is small compared to that of the C chip, the surface of the IC chip is directly attracted to and comes into contact with the chip stage, so the TL
When a B film carrier semiconductor device is adsorbed to a chip stage after outer lead cutting, molding, and IC chip transfer, it damages the wiring formed on the IC chip surface, impairs electrical properties, and at the same time causes a decrease in yield. There is a drawback.

In contrast to the conventional outer lead bonding apparatus described above, the present invention has a protective material attached to the chip stage, or the adsorption area and shape of the chip stage is
The difference is that the area and shape of the chip are the same, and the IC chip surface and the chip stage surface are not brought into direct contact.

[Means to solve the problem]

The outer lead bonding apparatus of the present invention is an outer lead bonding apparatus for mounting a film carrier semiconductor device on a printed circuit board in a face-down manner, in which a protective material is fixed on the chip stage, or the area and shape of the top surface of the chip stage is It has the same structure as the IC chip area and shape.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of Embodiment 1 of the present invention. After the bumps 2 provided on the electrode terminals of the IC chip 1 and the leat on the film carrier tape 3 are subjected to ILB, the outer leads are cut to a desired length, the leads are formed, and the IC chip is transferred.
The film carrier semiconductor device attracted to the chip stage 4a is aligned by a mechanical positioning mechanism and an image recognition mechanism such as pattern matching provided in the OL B device, and bonded to the outer lead by the bonding tool 5. Connect with pad 8.

On the chip stage 4a, a material such as Teflon that will not damage the surface of the ICC chip is placed on the protective forest 6.
Fix it as a. This has the effect of preventing damage to the surface of the IC chip 1 and the circuit wiring pattern formed within the chip due to the impact when the film carrier semiconductor device is transported and attracted to the chip stage 4a. Although Teflon is used as an example for the protection forest 6a, it may also be made of polyimide having heat resistance.

FIG. 2 is a sectional view of Example 2 of the present invention.

As described in Example 1, when a protective material such as Teflon is placed on the chip stage, the hardness is smaller than normal metal materials, so damage to the chip surface can be prevented when the chip is adsorbed. If the surface of the protective material is not parallel to the surface of the protective material, the surface of the chip will be inclined with respect to the protective material when the chip is adsorbed, and the surface of the chip may be damaged.

In this embodiment, the area and shape of the upper surface of the chip stage 4b are made equal to the area and shape of the IC chip 1. With this method, the chip stage 4 is
b and the surface on the ICC chip are no longer in direct contact because there are leads and bumps 2 between them, and the effect of scratches on the IC chip surface and the circuit wiring pattern formed inside the chip can be completely ignored, and the surface of the IC chip The advantage is that damage to the material can be completely prevented.

FIG. 3 is a sectional view of Embodiment 3 of the present invention. In this embodiment, the top surface area and shape of the chip stage 4c are made equal to the area and shape of the IC chip 1, and a material such as Teflon having the same area and shape as the chip stage is attached as a protection forest 6C on the chip stage 4c. It is something. With this method, as in Example 2, the surface of the IC chip 1 does not come into direct contact with the chip stage 4c, so damage to the chip surface can be prevented.
The protective material has the effect of minimizing the influence on the lead bumps.

〔Effect of the invention〕

As explained above, the present invention provides an outer lead bonding apparatus for mounting a film carrier semiconductor device face-down on a printed circuit board, in which a protective material such as Teflon or polyimide is fixed on a chip stage on which an IC chip is placed. , or by making the area and shape of the chip stage the same as the area and shape of the IC chip,
Film carrier semiconductor device lead cutting, molding, 'f
c When adsorbing to the chip stage after chip transfer, the IC
This has the effect of preventing damage to the wiring pattern formed on the chip surface.

[Brief explanation of drawings]

FIG. 1, FIG. 2, and FIG. 3 are Embodiment 1 of the present invention,
2.3, and FIG. 4 is a sectional view of a conventional bonding ink device.

Claims (1)

[Claims] 1. In an outer lead bonding device for a film carrier semiconductor device that mounts the film carrier semiconductor device on a printed circuit board in a face-down manner, a protective material is fixed to the upper surface of a chip stage that attracts an IC chip. An outer lead bonding device for a film carrier semiconductor device, characterized in that: 2. The outer lead bonding apparatus for a film carrier semiconductor device according to claim 1, wherein the area and shape of the top surface of the chip stage are the same as the area and shape of the IC chip.