JP7538034B2 - 加工方法 - Google Patents
加工方法 Download PDFInfo
- Publication number
- JP7538034B2 JP7538034B2 JP2020216239A JP2020216239A JP7538034B2 JP 7538034 B2 JP7538034 B2 JP 7538034B2 JP 2020216239 A JP2020216239 A JP 2020216239A JP 2020216239 A JP2020216239 A JP 2020216239A JP 7538034 B2 JP7538034 B2 JP 7538034B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- holding
- substrate
- region
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003672 processing method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 57
- 238000005520 cutting process Methods 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 29
- 238000003754 machining Methods 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 57
- 229910052710 silicon Inorganic materials 0.000 description 30
- 239000010703 silicon Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
2:基台
3:X方向送り手段
31:パルスモータ
32:雄ネジロッド
4:チャックテーブル機構
41:X方向移動基台
42:円筒部材
43:カバー部材
44:チャックテーブル
45:吸着チャック
45a:保持面
5:支持フレーム
5a:前面
50:開口
51:案内レール
6:切削手段
61:Y方向移動基台
612:案内レール
62:Z方向移動基台
63:スピンドルユニット
631:ユニットハウジング
632:回転軸
632a:雄ネジ部
632b:フランジ
633:円盤砥石
634:砥石カバー
635:サーボモータ
636:ナット
637:円盤砥石
64:Y方向送り手段
64a:雄ネジロッド
64b:パルスモータ
65:Z方向送り手段
651:雄ネジロッド
652:パルスモータ
66:スピンドルユニット支持部材
661:取り付け部
662:支持部
10A、10B、10C:シリコンチップ
12A、12B、12C:切削溝
20、22:サブストレート
20A、22A:第1領域
20B、22B:第2領域
20C、22C:第3領域
Claims (1)
- X方向及び該X方向に直交するY方向で規定され被加工物を保持する保持面を備えた保持手段と、該保持手段に保持された被加工物に加工を施す円盤砥石をY方向に延在する回転軸に装着した加工手段と、該保持手段と該加工手段とをX方向に相対的に加工送りするX方向送り手段と、該保持手段と該加工手段とをY方向に相対的に割り出し送りするY方向送り手段と、該保持手段と該加工手段とを該保持面に対して垂直なZ方向に相対的に切り込み送りするZ方向送り手段と、を備えた加工装置を用いてZ方向に加工残し量が異なる2以上の被加工物を加工する加工方法であって、
2以上の被加工物を支持するサブストレートの上面に、加工残し量に対応する段差を形成する段差形成工程と、
該段差が形成されたサブストレートの上面であって、段差を形成する各平面上に被加工物を配設する被加工物配設工程と、
サブストレートの段差が形成された段差方向をX方向に向けて該保持手段の保持面に保持するサブストレート保持工程と、
該Y方向送り手段によって該円盤砥石を所望のY位置に位置付けると共に、該Z方向送り手段によって該円盤砥石を所望のZ位置に位置付ける位置付け工程と、
該X方向送り手段によって該円盤砥石を2以上の被加工物に作用させて加工を施す加工工程と、
から構成される加工方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020216239A JP7538034B2 (ja) | 2020-12-25 | 2020-12-25 | 加工方法 |
CN202111561537.1A CN114683108A (zh) | 2020-12-25 | 2021-12-20 | 加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020216239A JP7538034B2 (ja) | 2020-12-25 | 2020-12-25 | 加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022101881A JP2022101881A (ja) | 2022-07-07 |
JP7538034B2 true JP7538034B2 (ja) | 2024-08-21 |
Family
ID=82135904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020216239A Active JP7538034B2 (ja) | 2020-12-25 | 2020-12-25 | 加工方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7538034B2 (ja) |
CN (1) | CN114683108A (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196328A (ja) | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
JP2001351890A (ja) | 2000-06-08 | 2001-12-21 | Disco Abrasive Syst Ltd | チップの研削方法 |
JP2014189039A (ja) | 2013-03-26 | 2014-10-06 | Autoliv Development Ab | カーテンエアバッグ取付用ブラケットおよびカーテンエアバッグ |
JP2015115526A (ja) | 2013-12-13 | 2015-06-22 | 株式会社ディスコ | チャックテーブルの成形方法 |
JP2020088068A (ja) | 2018-11-20 | 2020-06-04 | 株式会社ディスコ | 被加工物の加工方法 |
JP2020183000A (ja) | 2019-05-08 | 2020-11-12 | 株式会社ディスコ | 加工装置 |
-
2020
- 2020-12-25 JP JP2020216239A patent/JP7538034B2/ja active Active
-
2021
- 2021-12-20 CN CN202111561537.1A patent/CN114683108A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196328A (ja) | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
JP2001351890A (ja) | 2000-06-08 | 2001-12-21 | Disco Abrasive Syst Ltd | チップの研削方法 |
JP2014189039A (ja) | 2013-03-26 | 2014-10-06 | Autoliv Development Ab | カーテンエアバッグ取付用ブラケットおよびカーテンエアバッグ |
JP2015115526A (ja) | 2013-12-13 | 2015-06-22 | 株式会社ディスコ | チャックテーブルの成形方法 |
JP2020088068A (ja) | 2018-11-20 | 2020-06-04 | 株式会社ディスコ | 被加工物の加工方法 |
JP2020183000A (ja) | 2019-05-08 | 2020-11-12 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN114683108A (zh) | 2022-07-01 |
JP2022101881A (ja) | 2022-07-07 |
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