JP7531040B2 - Modeling Equipment - Google Patents

Description

The present invention relates to a molding device.

3D printers are becoming popular as devices for creating objects without using dies. 3D printers using fused filament fabrication (FFF) are also becoming popular for consumer use. In addition, technology is known for improving the strength of objects formed by stacking multiple layers of modeling material in the stacking direction.

Patent document 1 discloses a technique for improving the adhesion between modeling material layers by forming the next modeling material layer on a roughened modeling material layer.

However, in conventional technology, after the modeling material is dispensed, it is smoothed using a roller and then hardened, and the hardened modeling material layer is roughened before the next modeling material layer is formed. As a result, in the past, the shape of the edge of the modeling material layer was distorted by smoothing, and as a result, the model formed may have a different shape from the intended shape. In other words, in the past, it was difficult to create a model of the desired shape with limited loss of strength in the stacking direction.

The present invention has been made in consideration of the above, and aims to provide a molded object of the desired shape in which the decrease in strength in the stacking direction is suppressed.

In order to solve the above-mentioned problems, the modeling apparatus is a modeling apparatus that models a model by stacking modeling material based on modeling data, and is equipped with a control unit that holds the modeling data and creates corrected modeling data for stacking a stack of a size and shape that covers the target object based on the modeling data of the target object , an ejection unit that ejects molten modeling material onto a modeling material layer formed on a modeling table to stack the modeling material layer, a pressure means that pressurizes the formed modeling material layer in the stacking direction, and a cutting unit that cuts at least a portion of the surface of the stack of modeling material layers, and the cutting unit cuts out the target object by cutting the surface of the corrected stack that has been stacked using the corrected modeling data , and the cut range includes an area where the modeling material layer is deformed after being stacked during the modeling of the corrected stack, and deformation different from the shape of the target object occurs .

The present invention makes it possible to provide a molded object of the desired shape with reduced loss of strength in the stacking direction.

FIG. 1 is a schematic diagram illustrating an example of a molding apparatus. FIG. 2 is a schematic cross-sectional view of an example of a discharge portion. FIG. 3 is an enlarged schematic diagram showing the heating unit and the rotating stage. FIG. 4 is a diagram illustrating an example of a hardware configuration of the molding apparatus. FIG. 5 is an explanatory diagram showing an example of lamination of modeling material layers. FIG. 6 is a schematic diagram showing a detailed example of lamination of modeling material layers. FIG. 7 is an explanatory diagram of cooling by the side cooling portion. FIG. 8 is an explanatory diagram of reheating by the heating unit. FIG. 9 is a schematic diagram showing an example of cutting a shaped object. FIG. 10 is a schematic diagram showing an example of a target object. FIG. 11 is a flowchart showing an example of a procedure of the formation processing. FIG. 12 is a schematic diagram illustrating an example of a molding apparatus. FIG. 13 is a schematic diagram illustrating an example of a molding apparatus. FIG. 14 is a schematic diagram illustrating an example of a molding apparatus. FIG. 15 is a schematic diagram illustrating an example of a molding apparatus. FIG. 16 is a schematic diagram illustrating an example of a hardware configuration of the control unit.

The following describes in detail the embodiment of the molding device of this embodiment with reference to the attached drawings. Note that in this specification, parts that have the same configuration and function are given the same reference numerals, and detailed descriptions may be omitted.

In this embodiment, a modeling device that forms an object by fused deposition modeling (FFF) is described as an example. The modeling device may be any device that forms a three-dimensional object, and the modeling method is not limited to fused deposition modeling (FFF).

(First embodiment)
FIG. 1 is a schematic diagram showing an example of a molding apparatus 1 according to the present embodiment.

A modeling table 3 is provided inside the housing 2 of the modeling device 1. The modeling table 3 holds the object M. In other words, the object M is modeled on the modeling table 3.

A modeling material is used to form the model M. In this embodiment, a filament F is used as the modeling material. The filament F is a solid material in which the modeling material is shaped into a long, thin wire. The modeling material is a thermoplastic resin.

The filament F is wound and set on a reel 4 outside the housing 2 of the modeling device 1. The reel 4 rotates on its axis without exerting a large resistance force by being pulled by the rotation of the extruder 11, which is the driving means for the filament F.

In addition, a discharge unit 10 is provided inside the housing 2. The discharge unit 10 discharges molten modeling material to stack modeling material layers, forming a modeled object M, which is a stack of modeling material layers.

Figure 2 is an example of a schematic cross-sectional view of the discharge unit 10. The discharge unit 10 is modularized by an extruder 11, a cooling block 12, a filament guide 14, a heating block 15, a discharge nozzle 18, an imaging module 101, a twisting mechanism 102, and other components. The filament F is drawn in by the extruder 11 and supplied to the discharge unit 10.

The imaging module 101 captures a 360° image of the filament F drawn into the discharge section 10, i.e., an image of a portion of the filament F in all directions. FIG. 2 shows, as an example, a configuration in which the discharge section 10 is equipped with two imaging modules 101. Note that the number of imaging modules 101 provided in the discharge section 10 is not limited to two. For example, a 360° image of the filament F may be captured by one imaging module 101 by using a configuration equipped with a reflector.

The imaging module 101 is, for example, a camera equipped with an imaging optical system such as a lens and an imaging element such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor.

The twisting mechanism 102 regulates the direction of the filament F by rotating the filament F in a direction perpendicular to the drawing direction. The diameter measurement unit 103 measures the width between the edges of the filament in two directions, the X axis and the Y axis, as the diameter from the image of the filament F captured by the imaging module 101. The X axis and the Y axis are two axes that are perpendicular to each other. The X axis and the Y axis are also perpendicular to the Z axis. The Z axis coincides with the vertical direction and the stacking direction of the modeling material layer ML (arrow Z direction).

When the diameter measurement unit 103 detects a diameter that does not meet a predetermined standard, it outputs error information. The error information may be output to a display, a speaker, or another device. The diameter measurement unit 103 may be a circuit, or a function realized by processing in a CPU (Central Processing Unit).

The heating block 15 has a heat source 16 such as a heater, and a thermocouple 17 for controlling the temperature of the heater. The heating block 15 heats and melts the filament F, and supplies the molten filament FM, which is the molten filament F, to the discharge nozzle 18. In the following, "melted" refers to a state in which the ratio of liquid phase to solid phase is higher than before heating by the heating block 15. In other words, "melted" includes the state from when the filament F begins to melt until it melts and becomes liquid, and includes both a semi-melted state and a molten state.

The cooling block 12 is provided between the heating block 15 and the extruder 11. The cooling block 12 has a cooling source 13 and cools the filament F. The cooling block 12 prevents backflow of the molten filament FM from the heating block 15, an increase in the extrusion resistance of the filament F, clogging due to solidification of the molten filament FM, and the like. The filament F extruded by the extruder 11 toward the cooling block 12 is supplied to the heating block 15 via the filament guide 14.

An ejection nozzle 18 is provided on the downstream end face of the heating block 15 in the stacking direction (arrow Z direction) of the modeling material layer ML. The filament F supplied to the heating block 15 is melted by the heating block 15. The molten filament F, which is the molten filament FM, is then ejected from the ejection nozzle 18.

In this embodiment, the discharge nozzle 18 discharges the molten filament FM in a linear extrusion manner onto the modeling table 3. The discharged molten filament FM cools and solidifies, forming a modeling material layer ML on the modeling table 3. The discharge nozzle 18 also repeats the operation of discharging the molten filament FM in a linear extrusion manner onto the formed modeling material layer ML. This repeated discharge causes new modeling material layers ML to be sequentially stacked on the modeling material layer ML, forming a model M that is a stack of modeling material layers ML.

Returning to FIG. 1, the explanation will continue. In this embodiment, the discharge unit 10 may have two discharge nozzles. The two discharge nozzles will be referred to as a first discharge nozzle and a second discharge nozzle.

The first discharge nozzle is the discharge nozzle 18 described above, which melts and discharges the filament F, which is the modeling material that constitutes the model M.

The second discharge nozzle melts and discharges the filament of the support material. In the example shown in FIG. 1, the second discharge nozzle is disposed behind the first discharge nozzle, discharge nozzle 18. The number of discharge nozzles provided in the discharge section 10 is not limited to two and can be any number.

The support material may be made of any material that has thermoplastic properties, and there are no limitations on the material that it is made of. For example, the support material may be made of the same thermoplastic resin as the modeling material, or it may be made of a different thermoplastic resin.

The support portion formed by ejecting the support material is ultimately removed from the formed object M.

The filament of the support material (hereinafter sometimes referred to as the support filament SF) and the filament of the modeling material F are each melted by the heating block 15 and ejected from the corresponding second ejection nozzle and ejection nozzle 18 (first ejection nozzle).

The molding device 1 is also provided with a heating unit 20A. The heating unit 20A is an example of the heating unit 20. The molding device 1 may be provided with one heating unit 20A or multiple heating units 20A.

The heating unit 20A heats the heating target area R. The heating target area R is the area that is to be heated by the heating unit 20A.

In this embodiment, the heating target area R is at least a part of the area on the modeling material layer ML formed on the modeling table 3. For example, the heating target area R is the entire area on the modeling material layer ML formed immediately before. The entire area refers to the entire area of the end face of the modeling material layer ML formed immediately before on the side where the next molten filament FM is supplied by the discharge nozzle 18 (i.e., the anti-vertical side). In other words, the heating target area R refers to the end face (opposing face) facing the discharge nozzle 18 of both end faces in the stacking direction (arrow Z direction) of the modeling material layer ML, which is a stack of modeling material layers ML, in the modeling material layer ML formed immediately before. In this embodiment, the stacking direction (arrow Z direction) of the modeling material layer ML is assumed to coincide with the vertical direction.

The heating unit 20A is supported by a rotating stage 19. The rotating stage 19 is an example of a transport unit.

Figure 3 is an enlarged schematic diagram of the heating unit 20A and the rotating stage 19. The rotating stage 19 transports the heating unit 20A so as to heat the heating target region R from a number of different directions. In this embodiment, the heating unit 20A rotates around the discharge nozzle 18. The heating unit 20A rotates in accordance with the rotation of the rotating stage RS.

This allows the heating unit 20A to heat the heating target area R from multiple different directions.

The heating unit 20A also always follows the movement direction of the discharge nozzle 18, and can heat the heating target area R immediately before the molten filament FM is discharged by the discharge nozzle 18. In other words, even if the movement direction of the discharge nozzle 18 changes, the heating unit 20A can heat the discharge target area as the heating target area R in advance of the discharge by the discharge nozzle 18.

In addition, by rotating the heating unit 20A around the heating target area R, it is possible to continuously heat the heating target area R. Specifically, by rotating the heating unit 20A around the discharge nozzle 18, when the object M is formed by the discharge nozzle 18, it is possible to always heat the modeling material layer ML immediately before the molten filament FM is discharged.

Returning to FIG. 1, the explanation will be continued. In this embodiment, the heating unit 20A includes a laser light source 21A as the heating source 21. The laser light source 21A irradiates laser light. The laser light is, for example, a semiconductor laser. The irradiation wavelength of the laser light is, for example, 445 nm.

That is, in this embodiment, the heating unit 20A heats the heating target region R by irradiating it with laser light. For example, the laser light source 21A irradiates the heating target region R, which is on the modeling material layer ML formed on the modeling table 3 and from which the molten filament FM is to be discharged next, with laser light. Therefore, in this embodiment, the heating unit 20A can heat the heating target region R from a distance in a non-contact and localized manner.

In this embodiment, the modeling device 1 also includes a cutting unit 7. The cutting unit 7 cuts at least a portion of the surface of the model M, which is a laminate of modeling material layers ML formed on the modeling table 3.

In this embodiment, the cutting unit 7 includes an extendable arm unit 7A, a drill 7B, and a drive unit 7C. The drill 7B is a cutting tool for cutting the surface of the object M. The extendable arm unit 7A supports the drill 7B so that the position of the drill 7B can be adjusted. The drive unit 7C is a drive mechanism for adjusting the rotation of the drill 7B and the position of the drill 7B.

For example, when driven by the drive unit 7C, the drill 7B supported by the extendable arm unit 7A cuts the surface of the object M formed on the modeling table 3 (described in detail below).

The cutting unit 7 may have any mechanism and configuration capable of cutting the object M, which is a laminate of modeling material layers ML formed on the modeling table 3, and the mechanism and configuration are not limited to the above-mentioned form.

The discharge unit 10, the heating unit 20A, and the cutting unit 7 are held by the X-axis drive shaft 31 so that they can slide in the X-axis direction (arrow X direction). The X-axis drive shaft 31 is a drive shaft that is long in one direction (arrow X direction) in a plane perpendicular to the stacking direction (arrow Z direction) of the modeling material layer ML. An X-axis drive motor 32 is provided on the X-axis drive shaft 31. The discharge unit 10, the heating unit 20A, and the cutting unit 7 move in the X-axis direction by the driving force of the X-axis drive motor 32.

The X-axis drive motor 32 is held so as to be slidable along the Y-axis drive shaft 33A. The Y-axis drive shaft 33A is a drive shaft that is long in a direction perpendicular to the X-axis direction (arrow Y direction) in a plane perpendicular to the stacking direction (arrow Z direction) of the modeling material layer ML. A Y-axis drive motor 33 is provided on the Y-axis drive shaft 33A. The discharge section 10, the heating section 20A, the cutting section 7, and the X-axis drive motor 32 move in the Y-axis direction by the driving force of the Y-axis drive motor 33.

The modeling table 3 is supported by a Z-axis drive shaft 34 that is long in the stacking direction (arrow Z direction) of the modeling material layer ML and a guide shaft 35, and is held so as to be movable along the stacking direction of the modeling material layer ML. A Z-axis drive motor 36 is provided on the Z-axis drive shaft 34. The modeling table 3 moves in the stacking direction of the modeling material layer ML (arrow Z direction) by the driving force of the Z-axis drive motor 36. The modeling table 3 may be provided with a heating mechanism for heating the model M placed on it.

The modeling device 1 is therefore configured to be able to heat any area on the modeling material layer ML formed on the modeling table 3 using the heating unit 20A. The modeling device 1 is also configured to be able to eject molten filament FM and molten support material onto any area on the modeling table 3. The modeling device 1 is also configured to be able to cut any location and area of the modeled object M, which is a laminate of multiple modeling material layers ML formed on the modeling table 3, using the cutting unit 7.

The modeling device 1 also includes a cleaning brush 37 and a dust box 38. The cleaning brush 37 cleans the area around the tip of the discharge nozzle 18. For example, the cleaning brush 37 collects dust particles from modeling material and the like scattered around the discharge nozzle 18 in the dust box 38.

Figure 4 is an example of a hardware configuration diagram of the modeling device 1. The modeling device 1 has a control unit 100. The control unit 100 is constructed with a CPU or a circuit, etc. The control unit 100 is electrically connected to each unit provided in the modeling device 1.

The molding device 1 is equipped with an X-axis coordinate detection mechanism 105A, a Y-axis coordinate detection mechanism 105B, and a Z-axis coordinate detection mechanism K105C.

The X-axis coordinate detection mechanism 105A detects the X-axis positions of the discharge unit 10, the heating unit 20A, and the cutting unit 7. The X-axis coordinate detection mechanism 105A transmits the X-axis direction detection result to the control unit 100. The control unit 100 controls the drive of the X-axis drive motor 32 based on the X-axis direction detection result, thereby moving the discharge unit 10, the heating unit 20A, and the cutting unit 7 to the target X-axis direction positions.

The Y-axis coordinate detection mechanism 105B detects the Y-axis positions of the discharge unit 10, the heating unit 20A, and the cutting unit 7. The Y-axis coordinate detection mechanism 105B transmits the Y-axis detection results to the control unit 100. The control unit 100 controls the driving of the Y-axis drive motor 33 based on the Y-axis detection results, thereby moving the discharge unit 10, the heating unit 20A, and the cutting unit 7 to the target Y-axis positions.

The Z-axis coordinate detection mechanism 105C detects the Z-axis position of the modeling table 3. The Z-axis coordinate detection mechanism 105C transmits the Z-axis direction detection result to the control unit 100. The control unit 100 controls the drive of the Z-axis drive motor 36 based on the Z-axis direction detection result to move the modeling table 3 to the target Z-axis direction position.

In this way, the control unit 100 controls the movement of the discharge unit 10, the heating unit 20A, the cutting unit 7, and the modeling table 3, thereby moving the relative three-dimensional positions of the discharge unit 10, the heating unit 20A, the cutting unit 7, and the modeling table 3 to the target three-dimensional positions.

Furthermore, the control unit 100 controls the driving of the extruder 11, cooling block 12, heating block 15, discharge nozzle 18, laser light source 21A, cleaning brush 37, rotating stage RS, imaging module 101, twisting rotation mechanism 102, diameter measurement unit 103, temperature sensor 104, and driving unit 7C of cutting unit 7 by sending control signals to these.

The temperature sensor 104 measures the temperature of the heating target region R (described in detail below). The side surface cooling unit 39 cools the side surface of the object M (described in detail below).

Next, an example of lamination of the modeling material layer ML by the modeling device 1 will be described. Figure 5 is an explanatory diagram showing an example of lamination of the modeling material layer ML.

In this embodiment, the heating unit 20A heats the heating target region R in the modeling material layer ML using laser light L irradiated from the laser light source 21A. The ejection unit 10 ejects the molten filament FM onto the heated modeling material layer ML.

In detail, the laser light source 21A of the heating unit 20A irradiates the laser light L to the heating target region R on the formed modeling material layer ML where the molten filament FM will next be discharged. By this irradiation, the heating unit 20A reheats the heating target region R on the modeling material layer ML. Reheating refers to reheating the molten filament FM after it has cooled and solidified. The reheating temperature is not particularly limited, but it is preferably a temperature equal to or higher than the melting point of the formed modeling material layer ML.

The temperature of the heating target region R is measured by the temperature sensor 104 (see FIG. 4). The temperature sensor 104 is an example of a measurement unit. In this embodiment, the temperature sensor 104 is disposed near the laser light source 21A. The temperature sensor 104 outputs the temperature measurement result to the control unit 100. The control unit 100 adjusts the temperature of the heat applied to the heating target region R by controlling the laser output of the laser light source 21A based on the temperature measurement result.

That is, the heating unit 20A heats the heating target area R based on the temperature measured by the temperature sensor 104. Therefore, the heating unit 20A can stably heat the heating target area R to the target temperature.

By reheating the surface of the formed modeling material layer ML, the temperature difference between the reheated heating target area R in the modeling material layer ML and the molten filament FM that is next ejected onto the heating target area R is reduced, and the constituent materials are mixed together, improving the adhesion between these layers. In other words, the strength of the multiple modeling material layers ML in the stacking direction (arrow Z direction) is improved.

Figure 6 is a schematic diagram showing a detailed example of lamination of the modeling material layer ML. Hereinafter, the modeling material layer ML being modeled by the discharge unit 10 is referred to as the upper layer Ln. The layer immediately below the upper layer Ln is referred to as the lower layer Ln-1, and the layer immediately below the lower layer Ln-1 is referred to as the lower layer Ln-2. The arrow W in Figure 6 indicates the movement path (tool path) of the discharge unit 10. Note that in Figure 6, the discharged molten filament FM is shown diagrammatically as an elliptical cylinder so that the tool path of the discharge unit 10 can be seen. For this reason, gaps are formed between the discharged molten filament FM, but in practice, it is preferable to perform modeling so that no gaps are formed.

By forming the upper layer Ln while reheating the lower layer Ln-1, the modeling material layer ML of the upper layer Ln can be formed while the modeling material layer ML of the lower layer Ln-1 is in a molten state. In this way, the molten modeling materials mix between the multiple stacked modeling material layers ML, improving the adhesion between the modeling material layers ML that are adjacent in the stacking direction. This improves the strength in the stacking direction (arrow Z direction) of the model M, which is a stack of multiple modeling material layers ML.

Next, the side cooling unit 39 will be described. FIG. 7 is an explanatory diagram of cooling by the side cooling unit 39. The side cooling unit 39 cools the side of the object M, i.e., the surface parallel to the extension direction (the direction of the arrow Z in FIG. 1). The side cooling unit 39 may be any cooling source capable of cooling the side of the object M. The side cooling unit 39 is, for example, a fan.

The side cooling unit 39 blows cooling air to the side of the model M when the modeling material layer ML is formed by the discharge unit 10. By blowing cooling air to the side of the model M when the modeling material layer ML is formed, it is possible to prevent the outer shape of the side of the modeling material layer ML from collapsing and the modeling accuracy from deteriorating when the modeling material layer ML is formed.

Returning to FIG. 1, we will continue the explanation. Next, we will explain how the cutting unit 7 cuts the object M.

As described above, in this embodiment, the modeling device 1 reheats the surface of the formed modeling material layer ML and stacks the modeling material layer ML by ejecting a molten filament FM, which is a molten modeling material, onto the heated modeling material layer ML. Then, by repeatedly heating the modeling material layer ML and ejecting the molten filament FM, a modeled object M, which is a stack of multiple modeling material layers ML, is produced.

Here, when heating by the heating unit 20A, the shape of the end of the modeling material layer ML may be distorted (see FIG. 6). As shown in FIG. 6, the outer surface OS of the model M may be deformed.

When the discharge unit 10 forms the modeling material layer ML, even if the side cooling unit 39 sends cooling air to the side of the model M, deformation of the outer surface OS of the model M may not be sufficiently suppressed.

This will be explained using Figure 8. Figure 8 is an explanatory diagram of reheating by heating unit 20A.

Figure 8 (A) is a three-dimensional schematic diagram showing an example of a model M formed by repeatedly heating the modeling material layer ML and discharging the molten filament FM. Figure 8 (B) is a schematic diagram showing an example of the shape of the model M shown in Figure 8 (A) when viewed from a direction (e.g., the Y direction) perpendicular to the stacking direction (arrow Z direction) of the modeling material layer ML.

As shown in FIG. 8, when a molded object M is produced by repeatedly forming a molten filament FM on a heated mold material layer ML, the shape of the molded object M may differ from the intended shape. Specifically, for example, the end of the molded object M (see region B) may collapse due to reheating, and the outer shape may be deformed from the intended shape.

The modeling device 1 of this embodiment is therefore equipped with a cutting unit 7. The cutting unit 7 cuts at least a portion of the surface of the model M, which is a laminate of modeling material layers ML formed on the modeling table 3.

Figure 9 is a schematic diagram showing an example of cutting of a model M by the cutting unit 7. Figure 9 (A) is a three-dimensional schematic diagram showing an example of a model M formed by repeatedly heating the modeling material layer ML and discharging the molten filament FM. Figure 9 (B) is a schematic diagram showing an example of the shape of the model M shown in Figure 8 (A) when viewed from a direction (e.g., Y direction) perpendicular to the stacking direction of the modeling material layer ML (arrow Z direction).

In this embodiment, the control unit 100 of the modeling device 1 receives modeling data for the object M. The modeling data is composed of image data for each modeling material layer ML that constitutes the object M. In the following, the object M indicated by the modeling data will be referred to as the target object MB.

The control unit 100 corrects the printing data so as to print a laminated body MA that is slightly larger than the target object MB. A laminated body MA that is slightly larger than the target object MB may be a laminated body MA that is large and shaped to cover the target object MB.

Then, the control unit 100 uses the corrected modeling data (hereinafter referred to as corrected modeling data) to repeat the process of ejecting the molten filament FM onto the heated modeling material layer ML, thereby modeling the laminate MA.

The control unit 100 then controls the cutting unit 7 to cut the laminate MA to produce the target object MB. Through this cutting, the cutting unit 7 removes the deformed region (region B) in the laminate MA, and produces the target object MB.

Figure 10 is a schematic diagram showing an example of the target object MB after cutting by the cutting unit 7. Figure 10(A) is a three-dimensional schematic diagram showing an example of the target object MB formed by cutting by the cutting unit 7. Figure 10(B) is a schematic diagram showing an example of the shape of the target object MB shown in Figure 10(A) when viewed from a direction (e.g., the Y direction) perpendicular to the stacking direction (arrow Z direction) of the modeling material layer ML.

As shown in FIG. 10, the laminate MA is cut by the cutting unit 7, whereby the deformed area (area B) is removed, and the target object MB, which is the object M indicated by the modeling data, is obtained.

The laminate MA cut by the cutting unit 7 is a laminate MA in which the strength of the multiple modeling material layers ML in the stacking direction (arrow Z direction) has been improved. Therefore, the target object MB obtained by cutting the laminate MA by the cutting unit 7 has high strength in the stacking direction (arrow Z direction) and exhibits the shape indicated by the modeling data (i.e., the desired shape).

As a result, the modeling device 1 can provide a target object MB of the desired shape with reduced loss of strength in the stacking direction.

In addition, in this embodiment, the modeling device 1 is equipped with a cutting unit 7. Therefore, the range of the region R to be heated by the heating unit 20A can be the entire surface area of the modeling material layer ML. The entire area is the entire surface area of the formed modeling material layer ML that faces the discharge nozzle 18, as described above. In other words, since the cutting unit 7 cuts the laminate MA to cut out the target object MB, the range of the region R to be heated can be the entire surface area of the modeling material layer ML. This reduces the need for precise control of the heating range by the heating unit 20A, and makes it possible to easily produce a target object MB of the desired shape with reduced strength reduction in the stacking direction.

The modeling device 1 is not limited to a configuration including a side cooling unit 39. However, from the viewpoint of obtaining a target object MB of a desired shape with greater precision, it is preferable that the modeling device 1 is configured to include a side cooling unit 39. In this case, the cutting unit 7 and the side cooling unit 39 can be used to obtain a target object MB of a desired shape with greater precision.

Next, the procedure of the modeling process executed by the modeling device 1 of this embodiment will be described. FIG. 11 is a flowchart showing an example of the procedure of the modeling process executed by the modeling device 1 of this embodiment.

First, when the control unit 100 of the modeling device 1 receives the modeling data of the target object MB, it corrects the modeling data so as to model a laminated body MA that is slightly larger than the target object MB. The control unit 100 then executes the processing routine shown in FIG. 11 using the corrected modeling data. The corrected modeling data is composed of image data for each modeling material layer ML that constitutes the laminated body MA.

The control unit 100 of the modeling device 1 drives the X-axis drive motor 32 or the Y-axis drive motor 33 to move the discharge unit 10 in the X-axis or Y-axis direction. While the discharge unit 10 is moving, the control unit 100 discharges the molten filament FM from the discharge nozzle 18 based on the image data of the bottom layer of the corrected modeling data. In this way, the modeling device 1 forms a modeling material layer ML on the modeling table 3 according to the image data (step S11).

Next, the heating unit 20A irradiates the laser light L to the heating target region R on the modeling material layer ML that was previously formed on the modeling table 3, and heats the heating target region R (step S12). By the process of step S12, the heating target region R in the modeling material layer ML that was previously formed is remelted.

Next, the control unit 100 reads image data of the modeling material layer ML to be layered on the modeling material layer ML formed immediately before in the corrected modeling data. The control unit 100 then ejects the molten filament FM from the ejection nozzle 18 based on the image data. As a result, the modeling device 1 forms a modeling material layer ML according to the image data on the modeling material layer ML formed immediately before and heated by the heating unit 20A (step S13).

The control unit 100 may control the process of step S12 and the process of step S13 to be executed in parallel. In this case, the discharge unit 10, for example, starts the process of irradiating the laser light L onto the modeling material layer ML formed immediately before, and then starts discharging the molten filament FM for the next modeling material layer ML before completing the laser irradiation onto the entire range of the heating target region R.

Next, the side cooling unit 39 cools the side of the modeling material layer ML formed by the processing of step S13 (step S14).

Next, the control unit 100 judges whether the outermost modeling material layer ML in the corrected modeling data has been formed (step S15). If the judgment in step S15 is negative (step S15: No), the process returns to step S12. If the judgment in step S15 is positive (step S15: Yes), the process proceeds to step S16.

Next, the control unit 100 controls the cutting unit 7 to cut the laminate MA formed on the modeling table 3 until it becomes the target object MB (step S16). For example, the control unit 100 performs the processing of step S16 by identifying a cutting range using the corrected modeling data and the uncorrected modeling data, and controlling the cutting unit 7 to cut the cutting range. Then, this routine ends.

As described above, the modeling device 1 of this embodiment includes a heating unit 20A, a discharging unit 10, and a cutting unit 7. The heating unit 20A heats the formed modeling material layer ML. The discharging unit 10 discharges molten filament FM (molten modeling material) onto the heated modeling material layer ML to laminate the modeling material layer ML. The cutting unit 7 cuts at least a portion of the surface of the laminate MA (modeled object M) of the modeling material layer ML.

In this way, the modeling device 1 of this embodiment heats the modeling material layer ML formed by the extruded molten filament FM using the heating unit 20A, and extrudes the molten filament FM onto the heated modeling material layer ML to form the modeling material layer ML.

In this way, by reheating the formed modeling material layer ML, the temperature difference between the reheated heating target area R in the modeling material layer ML and the modeling material layer ML formed by the molten filament FM that is next ejected onto the heating target area R is reduced, and these constituent materials are mixed together, improving the adhesion between each layer of the modeling material layer ML that is adjacent in the stacking direction (arrow Z direction). In other words, the strength of the multiple modeling material layers ML in the stacking direction (arrow Z direction) is improved.

This results in a laminate MA (modeled object M) with reduced strength loss in the stacking direction (arrow Z direction).

In addition, in the modeling device 1 of this embodiment, the cutting unit 7 cuts at least a portion of the surface of the laminate MA (modeled object M). In other words, the cutting unit 7 cuts at least a portion of the surface of the laminate MA in a state in which the strength in the stacking direction has been improved.

Therefore, by cutting the laminate MA so that it has the desired shape of the target object MB, the cutting section 7 can produce a target object MB (object M) of the desired shape with reduced loss of strength in the stacking direction.

The modeling device 1 of this embodiment can therefore provide a target object MB (model M) of the desired shape with reduced strength loss in the stacking direction (arrow Z direction).

The transport unit (rotary stage RS) transports the heating unit 20A so as to heat the heating target area R from multiple different directions.

The temperature sensor 104 (measurement unit) measures the temperature of the heating target area R of the heating unit 20A. The heating unit 20A heats the heating target area R based on the temperature measured by the temperature sensor 104. The heating unit 20A irradiates the laser light L.

The modeling device 1 of this embodiment may also be provided with multiple heating units 20A. By providing multiple heating units 20A, the heating time by the heating units 20A can be shortened, and the modeling time for the modeled object M can be shortened.

(Variation 1)
In the above embodiment, the heating unit 20A that irradiates laser light has been described as the heating unit 20. However, the heating unit 20 is not limited to the configuration that heats the heating target region R by irradiating laser light.

For example, the heating unit 20 may be a mechanism for blowing heated air. FIG. 12 is a schematic diagram showing an example of the modeling apparatus 1B. The modeling apparatus 1B is similar to the modeling apparatus 1 of the above embodiment, except that it is equipped with a heating unit 20B instead of the heating unit 20A (see also FIG. 1).

The heating unit 20B includes a hot air source 21B. The hot air source 21B blows hot air toward the heating target area R. The hot air source 21B may be any mechanism capable of blowing air at a temperature equal to or higher than the melting point of the material that constitutes the heating target area R. The hot air source 21B may be, for example, a heater or a fan.

Therefore, in this embodiment, the heating unit 20B can heat the heating target area R from a distance without contact.

In this way, the heating unit 20 may be heating unit 20B that blows heated air.

(Variation 2)
In the above embodiment and the above modification 1, the heating unit 20 heats the heating target region R without contacting the heating target region R. However, the heating unit 20 may be configured to heat the heating target region R by contact heating.

Figure 13 is a schematic diagram showing an example of the modeling apparatus 1C of this modification 2. The modeling apparatus 1C is similar to the modeling apparatus 1 of the above embodiment, except that it is equipped with a heating unit 20C instead of the heating unit 20A (see also Figure 1).

The heating section 20C includes a cooling block 22, a guide 24, and a contact heating source 21C. The contact heating source 21C contact heats the heating target region R.

The contact heating source 21C includes a heating block 25 and a heating plate 28. The heating plate 28 contacts the modeling material layer ML to heat and pressurize the heating target region R of the modeling material layer ML.

The heating block 25 heats the heating plate 28. The heating block 25 includes a heat source 26 such as a heater and a thermocouple 27 for controlling the temperature of the heating plate 28.

The cooling block 22 is a mechanism for preventing heat conduction from the heating block 25. The cooling block 22 is equipped with a cooling source 23. A guide 24 is provided between the heating block 25 and the cooling block 22.

The heating section 20C is held slidably on the X-axis drive shaft 31 (see FIG. 1) via a connecting member. The heating section 20C is heated by the heating block 25 and reaches a high temperature. To reduce the transfer of heat to the X-axis drive motor 32, it is preferable that the transport path, including the filament guide 14, and the guide 24 have low thermal conductivity.

The downstream end of the heating plate 28 in the stacking direction (arrow Z direction) of the modeling material layer ML is positioned lower (further downstream in the stacking direction) by one layer of modeling material layer ML than the lower end of the discharge nozzle 18. While the discharge unit 10 and heating unit 20C are scanned in the XA direction shown in Figure 13 to discharge the molten filament FM, the heating plate 28 simultaneously reheats the modeling material layer ML one layer below the modeling material layer ML being modeled by contact heating. This reduces the temperature difference between the modeling material layer ML being modeled and the modeling material layer ML one layer below, and the materials mix between the layers. This improves the interlayer strength of the modeled object M.

In this way, the heating unit 20 may be a heating unit 20C that contact heats the heating target area R.

(Variation 3)
The manner in which the heating target region R is contact-heated is not limited to the manner shown in the second modified example.

Figure 14 is a schematic diagram showing an example of a modeling apparatus 1D according to the present modified example 3. The modeling apparatus 1D is similar to the modeling apparatus 1 according to the above embodiment, except that it includes a heating unit 20D instead of the heating unit 20A.

The heating section 20D includes a cooling block 22, a guide 24, and a contact heating source 21D. The contact heating source 21D contact heats the heating target region R. The cooling block 22 and the guide 24 are the same as those in the second modification.

The contact heating source 21D includes a tap nozzle 28D and a heating block 25. The heating block 25 is the same as that of the second modification. That is, the contact heating source 21D is the same as the contact heating source 21C of the second modification, except that it includes a tap nozzle 28D instead of a heating plate 28.

The tap nozzle 28D is heated by the heating block 25. The tap nozzle 28D repeatedly taps the model M in the stacking direction of the modeling material layer ML using power from a motor or the like. This tapping action causes the tap nozzle 28D to heat and pressurize the heating target area R of the modeling material layer ML. This reduces the temperature difference between the modeling material layer ML being modeled and the modeling material layer ML below, causing the materials to mix between the layers. This improves the interlayer strength of the model M.

The discharge unit 10 also discharges the molten filament FM so as to fill the heating target area R in the modeling material layer ML that has been recessed by the tapping operation. This makes it possible to smooth the shape of the outermost surface of the modeling material layer ML.

In this way, the heating unit 20 may be a heating unit 20D that contact heats the heating target area R.

(Variation 4)
The manner in which the heating target region R is contact-heated is not limited to the manner shown in the second and third modified examples.

Figure 15 is a schematic diagram showing an example of the modeling apparatus 1E of this modification 4. The modeling apparatus 1E is similar to the modeling apparatus 1 of the above embodiment, except that it is equipped with a heating unit 20E instead of the heating unit 20A.

The heating unit 20E includes a contact heating source 21E that melts and pressurizes the heating target region R. The contact heating source 21E is an example of the heating source 21. An ultrasonic vibration mechanism is mounted on the contact heating source 21E. The contact heating source 21E melts the heating target region R by transmitting ultrasonic vibrations generated by the ultrasonic vibration mechanism to the modeling material layer ML. When the ultrasonic vibrations are transmitted to the model M, each modeling material layer ML in the model M is welded and joined.

The number of contact heating sources 21E may be one or more. In the case of a configuration with multiple contact heating sources 21E, the shape of each horn may be the same or different.

-Hardware Configuration-
FIG. 16 is a schematic diagram showing an example of a hardware configuration of the controller 100 provided in each of the modeling apparatus 1, the modeling apparatus 1B, the modeling apparatus 1C, the modeling apparatus 1D, and the modeling apparatus 1E.

Each of the modeling apparatuses 1, 1B, 1C, 1D, and 1E includes a CPU 250, a ROM (Read Only Memory) 260, a RAM (Random Access Memory) 270, a HDD (Hard Disk Drive) 280, and a communication I/F (interface) 240, and is connected to each other via a bus 210.

The CPU 250 comprehensively controls the operation of the modeling apparatus 1, the modeling apparatus 1B, the modeling apparatus 1C, the modeling apparatus 1D, and the modeling apparatus 1E. The CPU 250 uses the RAM 270 as a work area and executes programs stored in the ROM 260 or the HDD 280, etc., to control the operation of the modeling apparatus 1, the modeling apparatus 1B, the modeling apparatus 1C, the modeling apparatus 1D, and the modeling apparatus 1E.

The HDD 280 stores programs, data, etc. The communication I/F 240 is an interface for communicating with other devices and equipment via the network 200.

The programs for executing the above processes executed by each of the modeling apparatus 1, modeling apparatus 1B, modeling apparatus 1C, modeling apparatus 1D, and modeling apparatus 1E in the above-mentioned embodiment and modified examples may be provided by recording them in an installable or executable format on a computer-readable recording medium such as a CD-ROM, a flexible disk (FD), a CD-R, a DVD (Digital Versatile Disk), or a USB (Universal Serial Bus) memory, or may be provided or distributed via a network such as the Internet. In addition, the various programs may be provided by being pre-installed in a ROM or the like.

In the above-mentioned embodiment and modified examples, the programs executed by each of the modeling apparatuses 1, 1B, 1C, 1D, and 1E are modularized to include the above-mentioned functional units. In actual hardware, for example, the CPU 250 (processor circuit) reads and executes the programs from the ROM 260 or HDD 280, thereby loading the above-mentioned functional units into the RAM 270 (main memory), and generating the above-mentioned functional units in the RAM 270 (main memory). Note that some or all of the functions of the modeling apparatuses 1, 1B, 1C, 1D, and 1E can also be realized using dedicated hardware such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array).

Although the above describes embodiments and modifications, the above embodiments and modifications are presented as examples and are not intended to limit the scope of the invention. The above novel embodiments and modifications can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. The above embodiments and modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents as set forth in the claims.

Reference Signs List 1, 1B, 1C, 1D, 1E Molding device 7 Cutting section 10 Discharge section 19 Rotation stage 20, 20A, 20B, 20C, 20D, 20E Heating section 104 Temperature sensor

JP 2015-74164 A

Claims (10)

A modeling apparatus that forms a model by stacking modeling materials based on modeling data, comprising:
a control unit that holds the modeling data and creates corrected modeling data for laminating a laminate having a size and shape that covers the target object, based on the modeling data of the target object ;
a discharging unit that discharges a molten modeling material onto a modeling material layer formed on a modeling table to laminate the modeling material layer;
A pressurizing means for pressing the formed modeling material layer in a stacking direction;
A cutting unit that cuts at least a portion of a surface of the stack of modeling material layers;
Equipped with
the cutting unit cuts out the target object by cutting a surface of the correction stack using the corrected modeling data, and the cut range includes a region in which the modeling material layer is deformed after being stacked during modeling of the correction stack, and a deformation different from the shape of the target object occurs.
Molding equipment. The pressure applying means improves the strength of the modeling material layer in the stacking direction.
The molding apparatus according to claim 1 . The pressurizing means pressurizes the modeling material layer by a tapping motion reciprocating in the stacking direction.
The molding apparatus according to claim 1 . The pressurizing means includes a heating unit that heats the formed modeling material layer,
The discharging unit discharges the molten modeling material onto the heated and pressurized modeling material layer.
The molding apparatus according to claim 1 . The pressurizing means is a tap nozzle heated by the heating unit.
The molding apparatus according to claim 4 . The heating unit contact-heats the heating target area.
The molding apparatus according to claim 4 . A measurement unit for measuring a temperature of a heating target area of the heating unit,
The heating unit heats a heating target area based on the temperature measured by the measuring unit.
R,
The molding apparatus according to claim 4 . The discharging unit discharges the molten modeling material onto the modeling material layer so as to fill in the area recessed by the pressurizing unit.
The molding apparatus according to claim 1 . The cutting unit is capable of cutting any location and area of a modeled object which is a stack of a plurality of modeling material layers formed on the modeling table.
The molding apparatus according to claim 1 . The control unit is capable of moving the discharge unit, the pressurizing unit, and the cutting unit to target positions in the X-axis direction and the Y-axis direction.
The molding apparatus according to claim 1 .

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