JP7523994B2 - Electrical contact structure of electrical contact and electrical connection device - Google Patents

Description

The present invention is a technology relating to the electrical contact structure of an electrical contact and an electrical connection device.

For example, a probe card is used as an electrical connection device to test the electrical characteristics of multiple semiconductor integrated circuits formed on a semiconductor wafer.

Generally, a probe card is configured with multiple electrical contacts (hereinafter referred to as "contacts" or "probes") arranged on the underside of an insulating substrate, and the probe card is attached to an inspection device that inspects each integrated circuit (test subject). During inspection, each contact of the probe card is pressed against each electrode of each integrated circuit to inspect the electrical characteristics of each integrated circuit.

Among the probe cards used as electrical connection devices, there is one called a vertical probe card, in which each contactor is electrically connected vertically to each electrode of the test subject. Furthermore, the electrical contactors used in vertical probe cards include, for example, a spring type and a needle type.

The spring-type contactor has elasticity in the direction perpendicular to the object under test, allowing it to reliably contact the electrodes of the object under test.

Needle-type contacts are linear (rod-shaped) and can reliably make electrical contact with electrodes of the test object that are arranged at a narrow pitch, but it is difficult to make them elastic in the vertical direction.

For this reason, the structure for supporting the multiple contacts 34 is such that each contact 34 is supported using an upper plate (top plate) 43 that supports the upper part of each needle-type contact 34, and a lower plate (bottom plate) 41 that supports the lower part of each contact 34, as shown in FIG. 2. Here, in order to provide elasticity in the vertical direction, the position of the support hole 43A in the upper plate (top plate) 43 and the position of the support hole 41A in the lower plate (bottom plate) 41 are arranged so as to be relatively misaligned in the planar direction. With this structure, each contact 34 is locally curved to provide elasticity in the vertical direction.

In recent years, with the trend toward ultra-fine design and ultra-high integration of semiconductor integrated circuits, electrical contacts (probes) on probe cards are required to accommodate the smaller electrode area on semiconductor chips and the narrower pitch between pads. In addition, with the increasing operating speed of semiconductor integrated circuits, there is a trend toward increasing signal frequencies for input/output pins, and electrical contacts (probes) are also required to accommodate high-frequency characteristics.

Patent Documents 1 and 2 disclose a probe head (or test head) for testing a semiconductor integrated circuit. For example, the probe head is provided with a number of guide holes that accommodate a number of contact probes. Furthermore, in order to provide elasticity in the vertical direction, the contact probe is curved in an S-shape. The contact probe extends along the longitudinal direction between a first end and a second end, and is composed of the first end and a second end that contacts an electrode of the device under test. Furthermore, the contact probe is composed of a non-conductive first portion between the first end and the second end, and a second portion from the first portion to the second end. Furthermore, a conductive portion is provided in the guide hole, and the second portion of the contact probe is electrically connected to the conductive portion to short-circuit it.

International Publication No. 2018/108790 International Publication No. 2019/091946

However, as in the techniques described in Patent Documents 1 and 2, when attempting to electrically contact the conductive contact portion of the contact probe with the conductive portion (electrode portion) of the guide hole, the contact point may become a sliding contact, which may cause wear in the contact portion and/or the conductive portion of the contact probe, resulting in deterioration of the contact point and possibly affecting high-precision inspection.

Therefore, there is a demand for an electrical contact structure and electrical connection device for an electrical contact that can shorten the length of the conductive path through the electrical contact and ensure stable contact between the conductive portion of the electrical contact and the electrode portion.

In order to solve such problems, the electrical contact structure of an electrical contactor according to the first aspect of the present invention comprises: (1) a support hole having an opening formed on one side of a support substrate; (2) an electrical contactor inserted into the support hole and electrically contacting an object to be tested; and (3) an electrode portion provided near the opening of the support hole, (4) the electrical contactor has a non-conductive portion having a bent portion and a conductive portion provided on one end side of the non-conductive portion, (5) the bent portion bends so that when one end of the conductive portion is electrically contacted with the object to be tested, the other end side of the conductive portion is short-circuited with the electrode portion , and (6) the electrical contactor is deformed to bring the bent portion into contact with the inner wall surface of the support hole, thereby moving the other end of the conductive portion in a direction intersecting the axis of the support hole .

The electrical connection device according to the second aspect of the present invention is an electrical connection device that includes a support substrate that supports a plurality of electrical contacts and electrically connects between an object to be inspected and an inspection device, and has the electrical contact structure of the electrical contacts according to the first aspect of the present invention.

According to the present invention, it is possible to shorten the length of the conductive path through the electrical contact, and to achieve stable contact between the conductive portion of the electrical contact and the electrode portion.

FIG. 1 is a plan view showing a configuration of an electrical connecting device according to an embodiment. FIG. 1 is a diagram showing a configuration of a conventional electrical connection structure of a contact. 1 is a front view showing a configuration of an electrical connecting device according to an embodiment. 1 is a partial cross-sectional view showing a configuration of an electrical connection structure of a contact according to an embodiment. FIG. 2 is a diagram showing the configuration of a probe according to an embodiment. 1A and 1B are diagrams illustrating the states of a probe in non-contact and contact states. 11 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contact according to a modified embodiment (part 1). FIG. FIG. 2 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contact according to a modified embodiment (part 2). FIG. 4 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contact according to a modified embodiment (part 3). 13A and 13B are configuration diagrams showing the configuration of a probe and the configuration of an electrical connection structure of a contact according to a modified embodiment.

(A) Main Embodiments Hereinafter, embodiments of the electrical contact structure of an electrical contact and an electrical connecting device according to the present invention will be described in detail with reference to the drawings.

(A-1) Configuration of the embodiment In this embodiment, an example is shown in which the present invention is applied to an electrical connection device attached to an inspection device (hereinafter also referred to as a "tester") that inspects the electrical characteristics (e.g., electrical conductivity testing) of multiple semiconductor integrated circuits formed on a semiconductor wafer.

In the following explanation, the term "test subject" refers to an object whose electrical characteristics are inspected by the inspection device, such as an integrated circuit or a semiconductor wafer. A "semiconductor wafer" is assumed to have multiple integrated circuits with circuit patterns formed on the wafer, in the state before dowsing.

The "electrical connection device" has multiple contacts that electrically contact each electrode of the test subject, and electrically connects the test subject to the test device. The electrical connection device is, for example, a probe card, and in this embodiment, a vertical probe card is shown as an example.

The "contactor" is an electrical contactor that electrically contacts an electrode of the test subject. The contactor can be, for example, a probe, such as a needle-type probe made of a linear member or a probe made of a thin, narrow member. In this embodiment, the contactor is exemplified as a needle-type probe made of a linear member as a whole.

The "support substrate" is a plate-like substrate that supports multiple contacts (electrical contacts). The support substrate has multiple support holes with openings formed on one side, and each contact (electrical contact) is inserted into each support hole of the support substrate to support each contact. The support substrate can be, for example, the probe support 17 or wiring substrate 2 described below.

(A-1-1) Detailed configuration of the electrical connecting device 1 Fig. 1 is a plan view showing the configuration of the electrical connecting device 1 according to the embodiment. Fig. 3 is a front view showing the configuration of the electrical connecting device 1 according to the embodiment. Fig. 4 is a partial cross-sectional view showing the configuration of the electrical connection structure of a contactor (probe) 21 according to the embodiment.

The electrical connection device 1 has a wiring board 2, a connection board 3, a plurality of wirings 4, and a probe assembly 5.

The wiring board 2 is a board formed in a disk shape. A rectangular opening 7 is formed in the center of one surface (e.g., the top surface) of the wiring board 2, penetrating the board in the thickness direction (Z direction, plate thickness direction) of the wiring board 2. A large number of connection lands 9 are aligned and formed as connection parts along a pair of opposite sides of the rectangular opening 7 on one surface (e.g., the top surface) of the wiring board 2. In addition, a plurality of tester lands (tester connection parts) that connect to the electrical circuit of an inspection device (tester) are formed on the outer edge of one surface (e.g., the top surface) of the wiring board 2. Each connection land 9 and the corresponding tester land 8 are electrically connected via a conductive path (not shown) of the wiring board 2, as in a conventional electrical connection device.

The connection board 3 is made of an electrically insulating material and is a member that is attached to approximately the center of one surface (e.g., the top surface) of the wiring board. The connection board 3 has a rectangular section 11 of a rectangular planar shape that is accommodated in the opening 7, and a rectangular annular flange 12 that protrudes from the outer edge of one surface (e.g., the top surface) of the rectangular section 11. With the rectangular section 11 of the connection board 3 accommodated in the opening 7 of the wiring board 2 and the annular flange 12 placed on the edge of the opening 7, the annular flange 12 is attached to one surface (e.g., the top surface) of the wiring board 2 by a plurality of screw members 13.

As shown in FIG. 1, the rectangular portion 11 of the connection board 3 has a plurality of through holes 14 formed therethrough in the thickness direction (Z direction, plate thickness direction) of the board. Each of the plurality of through holes 14 is formed to correspond to the position of an electrode 16 of an integrated circuit as the test object 15.

One end of each wiring 4 is inserted into each through hole 14 of the connection board 3. The tip surface of one end of each wiring 4 inserted into each through hole 14 is electrically connected to the corresponding probe 21 supported by the probe assembly 5. Each wiring 4 may be directly connected to the corresponding probe 21, or may be indirectly connected to the probe 21 via a conductive path and a terminal. On the other hand, the other end of each wiring 4 is connected to the corresponding connection land 9. Each probe 21 is connected to each connection land 9 through each wiring 4. Therefore, each probe 21 is connected to the electrical circuit of the inspection device (tester) via the corresponding tester land 8 that is electrically connected to the connection land 9.

The probe assembly 5 is attached to the other surface (e.g., the bottom surface) of the connection board 3. The probe assembly 5 has a probe support 17 that supports multiple probes 21.

The probe support 17 is a plate-like member formed of an electrically insulating material. The probe support 17 has an opening formed on the other surface (e.g., the lower surface) 18 of the probe support 17, and has a number of support holes 19 facing upward (i.e., in the plate thickness direction, Z direction) that accommodate each of the multiple probes 21. In other words, each support hole 19 can be said to be a recess with an opening formed in the lower surface 18 of the probe support 17.

Each support hole 19 of the probe support 17 is formed at a position corresponding to the position of each electrode 16 of the test object 15. The number of support holes 19 of the probe support 17 is the same as the number of electrodes 16 of the test object 15.

The ceiling 192 of each support hole 19 supporting each probe 21 supports the supported portion 51 at the first end (e.g., the upper end) of the probe 21. For example, as illustrated in FIG. 4, the ceiling 192 of the support hole 19 has a hole for supporting the first end of the probe 21, and the probe 21 housed in the support hole 19 can be supported by inserting the first end of the probe 21 into the hole. In other words, the probe 21 supported by the ceiling 192 hangs down inside the support hole 19 and is housed in the support hole 19, and part or all of the conductive portion 212 on the second end side of each probe 21 (see FIG. 5) is provided to protrude below the lower surface 18 of the support hole 19.

The method of supporting the probe 21 in the support hole 19 is not particularly limited. For example, the supported portion 51 of the probe 21 may be inserted into a hole in the ceiling portion 192 of the support hole 19 and then fixed with an adhesive or the like. Also, each support hole 19 may be a hole having a circular or elliptical cross section, or a hole having a square, rectangular, or polygonal cross section.

Electrode terminals 20 are provided on the underside 18 of the probe support 17 near each support hole 19. As described below, a non-conductive guide portion 211 having a bent portion 54 is formed on the first end side of each probe 21 (see FIG. 5). When each probe 21 and the electrode 16 of the test subject 15 come into contact with each other during testing of the test subject 15, each probe 21 supported by each support hole 19 undergoes elastic deformation (e.g., bending, etc.).

The contact load causes each electrode terminal 20 to come into electrical contact with the conductive portion 212 (see FIG. 5) of each deformed probe 21. In other words, each electrode terminal 20 is a terminal that electrically connects with the conductive portion 212 of each deformed probe 21.

In addition, each electrode terminal 20 is connected to each conductive path 22 formed on the probe support 17. Each conductive path 22 is a portion that passes an electrical signal between each electrode terminal 20 and each corresponding wiring 4. Therefore, the conductive portion 212 of each probe 21 is electrically connected to each corresponding wiring 4 via each electrode terminal 20 and the conductive path 22.

The conductive path 22 may be formed inside the substrate of the probe support 17. Also, for example, when the probe support 17 is formed of a multilayer substrate, a part of the conductive path 22 may be formed in the surface direction of the probe support 17 (i.e., on the XY plane).

Here, we will explain the support structure for the multiple probes 21 in the embodiment by comparing it with the support structure for multiple contacts (probes) 34 in the related art shown in FIG. 2.

The conventional probe support structure in Figure 2 supports each of the roughly S-shaped contacts 34 using an upper plate (top plate) 43 that supports the upper part of each contact 34 and a lower plate (bottom plate) 41 that supports the lower part of each contact 34.

In contrast, the multiple probe support structure in the embodiment does not include at least a lower plate (bottom plate) 41. As described below, in the probe 21 in the embodiment, the non-conductive guide portion 211 is responsible for the elastic function.

Therefore, in the embodiment, the length in the thickness direction (Z direction) of the probe assembly 5 can be made shorter than the length in the thickness direction (Z direction) of a conventional probe assembly. In other words, the length of the conduction path of the current that flows between the electrode 16 of the test object 15 and the wiring 4 via the probe 21 during testing of the test object 15 can be made shorter. As a result, the testing accuracy can be improved. In addition, the cost of the probe assembly 5 can be reduced.

In addition, in the conventional probe support structure shown in FIG. 2, the position of the support hole 43A in the upper plate (top plate) 43 and the position of the support hole 41A in the lower plate (bottom plate) 41 are positioned so that they are relatively misaligned in the planar direction.

In contrast, in the probe support structure of the embodiment, the probe 21 supported in the support hole 19 of the probe support 17 is arranged to extend vertically (Z direction) from the support point.

Therefore, by using the probe support structure of the embodiment, it becomes easier to control the alignment of the probe 21 that contacts the electrode 16 on the semiconductor wafer as the test object 15, and the alignment accuracy can be improved.

In this embodiment, a case where multiple probes 21 are supported on the probe support 17 of the probe assembly 5 is illustrated. However, this is not limited to this example, and a structure similar to each support hole 19 of the probe support 17 may be provided on the underside of the wiring board 2, and each probe 21 may be supported in each support hole 19 provided in the wiring board 2. In this case, there is no need to provide the upper plate (top plate) 43.

(A-1-2) Configuration of the probe 21 Fig. 5(A) is a side view showing the configuration of the probe 21 according to the embodiment, and Fig. 5(B) is a front view showing the configuration of the probe 21 according to the embodiment. Note that the size, wire diameter, length, degree of bending, etc. of the probe 21 illustrated in Fig. 5(A) and Fig. 5(B) are highlighted.

The probe 21 is formed with a non-conductive guide portion 211 having a bent portion 54, and a conductive portion 212 provided on one end side of the non-conductive guide portion 211. The probe 21 as a whole can be a needle-type contact formed, for example, of a thin wire of an insulating material and a conductive metal. The probe 21 is not limited to a linear member, and may be formed, for example, of a thin plate-like member of an insulating material and a conductive metal with a small width. In this embodiment, the probe 21 formed of a linear member is exemplified.

The wire diameter and overall length of the probe 21 are not particularly limited and can be determined appropriately depending on the size of the electrode 16 of the semiconductor wafer to be inspected. For example, the wire diameter of the probe 21 can be about several tens of μm, and the length can be about several mm.

The non-conductive guide portion 211 of the probe 21 is formed of an insulating material such as an insulating synthetic resin material. The non-conductive guide portion 211 has an elastic function that gives the entire probe 21 elasticity in the vertical direction (Z direction). In addition, the non-conductive guide portion 211 functions as a conductive portion support member that supports the conductive portion 212 of the probe 21. In other words, the non-conductive guide portion 211 functions as an elastic conductive portion support member.

The non-conductive guide portion 211, which is formed in a linear shape from an insulating material, has a supported portion 51 that is supported in the support hole 19 in which the probe 21 is housed, and a lower portion that extends below the supported portion 51 along the longitudinal direction of the probe 21. The lower portion is integrally connected to the supported portion 51.

At approximately the center of the lower part of the non-conductive guide part 211, a bent part 54 is formed by bending the lower part, for example, by bending. For example, when inspecting the test subject 15, the lower end of the probe 21 (the lower end of the conductive part 212) comes into contact with the electrode 16 of the test subject 15, and a contact load acts on the probe 21. At this time, since the bent part 54 is formed in the lower part, the entire probe 21 deforms starting from the bent part 54, the probe 21 is greatly curved, and the entire probe 21 has elasticity in the up-down direction (Z direction).

In FIG. 5A, the bent portion 54 is shown bent greatly, but it is sufficient that the bend is such that the probe 21 can deform from the bent portion 54 when contact is made. The bent portion 54 may be formed by bending, or the wire diameter of the bent portion 54 may be smaller than the wire diameter of the non-conductive guide portion 211 to facilitate bending.

Here, the lower part of the non-conductive guide part 211, from the supported part 51 to the bent part 54, is called the first guide part 52, and the part from the bent part 54 to the lower end of the non-conductive guide part 211 is called the second guide part 53.

The conductive portion 212 of the probe 21 is provided at the lower end of the second guide portion 53 of the non-conductive guide portion 211. The conductive portion 212 is formed of a conductive material. The conductive portion 212 may be formed of a metal such as copper, a copper alloy, or a beryllium copper alloy, a rubber material having conductivity such as an elastomer, or a synthetic resin material having conductivity. The conductive portion 212 may also be formed by plating the surface of the lower end of the non-conductive guide portion 211. In this embodiment, the conductive portion 212 is formed generally from a thin conductive metal wire.

The conductive portion 212 provided in the non-conductive guide portion 211 may be provided by adhering it to the second guide portion 53 of the non-conductive guide portion 211, for example, with an adhesive or the like.

The conductive portion 212 has a second contact portion 56 that contacts the electrode terminal 20 on the other surface (e.g., the lower surface) of the probe support 17, and a first contact portion 55 that contacts the electrode 16 of the test subject 15. In other words, the conductive portion 212 has the second contact portion 56 that is wire-connected to the wiring 4 via the electrode terminal 30 and the conductive path 22, and the first contact portion 55 that electrically contacts the electrode 16 of the test subject 15.

The second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 when the probe 21 undergoes elastic deformation due to a contact load. The shape of the second contact portion 56 is not particularly limited, and may be, for example, a rounded inverted triangular prism or pyramid. In this case, the contact area between the upper surface portion 561 of the second contact portion 56 or its surrounding portion and the electrode terminal 20 becomes larger, resulting in good electrical contact.

The first contact portion 55 of the conductive portion 212 is a linear portion extending downward from the second contact portion 56. The lower end portion 551 of the linearly formed first contact portion 55 contacts the electrode 16 of the test subject 15. The lower end portion 551 of the first contact portion 55 is also called the "contact portion" that contacts the electrode 16.

Like the second contact portion 56, the first contact portion 55 is formed from a conductive material such as copper, a copper alloy, or a beryllium copper alloy. The second contact portion 56 and the first contact portion 55 may be integrally formed from the same material. By forming them integrally from the same material, the electrical conductivity characteristics are improved, enabling highly accurate testing.

The probe 21 has a conductive portion 212 at the lower end of the non-conductive guide portion 211. As described below, the length of the conductive portion 212 can be shortened to shorten the length of the conductive path during testing of the test subject 15. For example, the conductive path can be shortened by shortening the length of the conductive portion 212 having the second contact portion 56 and the second contact portion.

For example, the non-conductive guide portion 211 made of an insulating synthetic resin material is easy to process in terms of shape, length, wire diameter, etc. Therefore, the length and shape of the non-conductive guide portion 211 may be changed regardless of the length of the conductive portion 212.

For example, when the length of the conductive portion 212 of the probe 21 is set to a predetermined length and it is desired to increase the needle pressure with which the probe 21 contacts the electrode 16 of the test subject 15, the length of the non-conductive guide portion 211 can be made relatively short, whereas when it is desired to decrease the needle pressure, the length of the non-conductive guide portion 211 can be made relatively long.

(A-1-3) Electrical Contact Structure of Probe 21 Fig. 6(A) is a diagram showing the state of probe 21 when not in contact, and Fig. 6(B) is a diagram showing the state of probe 21 when in contact. Note that the size, wire diameter, length, degree of bending/curvature, etc. of probe 21 shown in Fig. 6(A) and Fig. 6(B) are highlighted.

Figure 6 (A) shows the state in which the supported portion 51 of the non-conductive guide portion 211 of the probe 21 is supported by the ceiling portion 192 of the support hole 19.

When not in contact, the probe 21 extends vertically downward from the position of the supported part 51. The lower end 551 of the first contact part 55 formed on the conductive part 212 is generally located on or near line C that is vertically downward from the position of the supported part 51, which is the support point of the probe 21.

Conventionally, as illustrated in FIG. 2 and Patent Documents 1 and 2, a probe formed in an S-shape is positioned. Therefore, the position of the upper part of the probe is misaligned with the position of the lower end of the probe that contacts the electrode of the test object. In contrast, as in this embodiment, by positioning the lower end 551 on a perpendicular line C that passes through the position of the supported part 51, the position of the supported part 51 and the position of the lower end 551 are aligned (matched or nearly matched). Therefore, according to this embodiment, it becomes easier to control the alignment of the probe 21 with respect to the electrode 16 of the test object 15, and the alignment accuracy is also improved.

In addition, it is desirable that the probe 21, when not in contact, is accommodated in the support hole 19 without touching the inner wall of the support hole 19. A bent portion 54 is formed in the non-conductive guide portion 211, but it is desirable that the probe 21 is accommodated in the support hole 19 without the bent portion 54 touching the inner wall of the support hole 19. In other words, the position of the supported portion 51 that is supported in the support hole 19 does not need to be the center position of the ceiling portion 192 of the support hole 19. The supported portion 51 may be supported on the ceiling portion 192 of the support hole 19 so that the bent portion 54 does not contact the inner wall of the support hole 19.

In addition, although the elasticity of the probe 21 may become weak, as a modified example, the bent portion 54 of the probe 21 when not in contact may be in contact with the inner wall of the support hole 19.

Furthermore, when not in contact, the probe 21 is accommodated in the support hole 19 so that the conductive portion 212 protrudes from the lower surface 18 of the probe support 17. For example, the probe 21 is supported in the support hole 19 so that the position of the second contact portion 56 in the conductive portion 212 is located lower than the lower surface 18 of the probe support 17. This is to ensure that the second contact portion 56 and the electrode terminal 20 are in electrical contact when the probe 21 is in contact and elastically deforms.

Figure 6 (B) shows the state of the probe 21 when the lower end 551 of the probe 21 is in contact with the electrode 16 of the test subject 15 and a contact load is acting on the probe 21.

When the lower end 551 of the probe 21 comes into contact with the electrode 16 and a contact load acts on the probe 21, the probe 21 is deformed. That is, the bent portion 54 formed in the non-conductive guide portion 211 becomes the starting point, and the linear non-conductive guide portion 211 strengthens its curvature, and the bent portion 54 comes into contact with the inner wall of the support hole 19. The contact between the bent portion 54 and the inner wall surface of the support hole 19 moves the second contact portion 56 at the other end of the conductive portion 212 toward the axis of the support hole 19 (which may be, for example, a perpendicular line C from the supported portion 51). Then, almost at the same time, the lower end 551 in contact with the electrode 16 in the conductive portion 212 of the probe 21 becomes the starting point, and the linear first contact portion 55 is curved by the contact load. This causes the second contact portion 56 of the conductive portion 212 to move upward, and the second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20.

In other words, the bent portion 54 functions to bend so that when the lower end portion 511 at one end of the conductive portion 212 is electrically contacted with the electrode 16 of the test subject 15, the second contact portion 56 at the other end of the conductive portion 212 is short-circuited with the electrode terminal 20.

At this time, the probe 21 supported in the support hole 19 is supported by a contact point in contact with the electrode 16 and a contact point in contact with the inner wall of the support hole 19, so the posture of the probe 21 can be stabilized. With the posture of the probe 21 stable, the second contact portion 56 contacts the electrode terminal 20, so sliding of the second contact portion 56 against the electrode terminal 20 can be suppressed. As a result, wear between the electrode terminal 20 and the second contact portion 56 can be suppressed, deterioration of the contact points can be suppressed, and inspection accuracy can be improved.

The following describes the case where the test subject 15 is inspected with the probe 21 in the contact state shown in Figure 6 (B).

In the conductive portion 212 of the probe 21, the lower end 551 of the first contact portion 55 is in electrical contact with the electrode 16 of the test subject 15, and the second contact portion 56 is in electrical contact with the electrode terminal 20. Therefore, the conductive path through which the electrical signal flows is a path between the contact point where the lower end 551 of the first contact portion 55 is in contact with the electrode 16 and the contact point where the second contact portion 56 is in contact with the electrode terminal 20, making the conductive path shorter than in the past.

For example, as the operating speed of integrated circuits serving as test objects 15 increases, probe cards are required to accommodate the high-frequency characteristics of the test objects 15. If the length of the probes 21 used for testing increases, the reactance component also increases accordingly, which can affect the testing accuracy of high-frequency characteristics in particular.

In this embodiment, by using a probe 21 formed of a non-conductive guide portion 211 and a short conductive portion 212, the conductive path is shortened, thereby improving the inspection accuracy.

(A-2) Modifications of the Embodiments Modifications of the above-described embodiments will now be described with reference to the drawings.

(A-2-1) Figure 7(A) is a diagram showing the state of the probe 21 when not in contact in a modified embodiment, and Figure 7(B) is a diagram showing the state of the probe 21 when in contact in a modified embodiment.

In the above-described embodiment, the electrode terminal 20 is provided on the underside 18 of the probe support 17, but Fig. 7(A) and Fig. 7(B) show an example in which the electrode terminal 20 connected to the conductive path 22 is provided on the inner wall surface of the support hole 19 of the probe support 17. For example, in this case, the electrode terminal 20 may be provided on the inner wall surface where the second contact portion 56 of the probe 21, which has a stronger curve, comes into contact with the inner wall of the support hole 19 when contact is made.

Note that Figures 7(A) and 7(B) show an example in which the electrode terminal 20 is provided on a portion of the inner wall of the support hole 19 that houses the probe 21 and that comes into contact with the second contact portion 56 of the probe 21 when contact is made. However, for example, the electrode terminal 20 having a predetermined width in the Z direction may be provided around the entire circumference of the inner wall of the support hole 19. Also, for example, the electrode terminal 20 may be provided on the entire surface of the inner wall of the support hole 19.

By adopting such a structure, the length of the portion of the probe 21 that protrudes downward from the lower surface 18 of the probe support 17 (i.e., the linear first contact portion 55 of the conductive portion 212) can be made shorter. In addition, the diameter of the support hole 19 that accommodates the probe 21 can be made larger. Therefore, it becomes easier to accommodate the probe 21 in the support hole 19.

(A-2-2) Another modified embodiment is illustrated in FIG. 8. FIG. 8(A) is a diagram showing the state of the probe 21 in the modified embodiment when not in contact, and FIG. 8(B) is a diagram showing the state of the probe 21 in the modified embodiment when in contact.

In Figures 8(A) and 8(B), a portion of the open end of the support hole 19 in the probe support 17 may be cut out, and an electrode terminal 20 that connects to the conductive path 22 may be provided on a portion or the entire surface of this cutout portion (slope) 191.

For example, the electrode terminal 20 may be provided on both or either the surface of the cutout portion 191, which is a slope provided at the open end of the support hole 19, and the inner wall surface of the support hole 19 that is connected to the cutout portion 191. In this case, too, the electrode terminal 20 that connects to the conductive path 22 may be provided on the entire surface of the inner wall of the support hole 19.

The cutout portion 191 may be provided, for example, around the entire circumference of the substantially circular opening end of the support hole 19. In other words, the cutout portion 191 may be tapered so that the diameter becomes smaller as it goes upward in the Z direction, relative to the opening end of the support hole 19.

By adopting such a structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 is improved when contact is made, and the contact area between the second contact portion 56 and the electrode terminal 20 is also increased. As a result, the inspection accuracy is improved.

(A-2-3) Another modified embodiment is illustrated in FIG. 9. FIG. 9(A) is a diagram showing the state of the probe 21 in the modified embodiment when not in contact, and FIG. 9(B) is a diagram showing the state of the probe 21 in the modified embodiment when in contact.

Figures 9(A) and 9(B) show an example in which the support hole 19 of the probe support 17 is provided at an angle to the semiconductor wafer, which is the test object 15. In other words, the support hole 19 is provided at a predetermined inclination with respect to the vertical direction of the Z axis, and the probe 21 is also supported at an angle corresponding to the inclination of the support hole 19.

In this case, the inner wall surface of the support hole 19 is also inclined. On the other hand, a vertical conductive path 22 is provided in the probe support 17. Therefore, the vertical conductive path 22 in the probe support 17 intersects with the support hole 19, and the part of the conductive path 22 that appears on the surface of the inner wall of the support hole 19 may be used as the electrode terminal 20. Figures 9(A) and 9(B) show an example in which the electrode terminal 20 is provided over a wide range from the lower end of the inclined inner wall surface of the support hole 19 to near the center of the inner wall of the support hole 19.

By adopting such a structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 is improved when contact is made, and the contact area between the second contact portion 56 and the electrode terminal 20 is also increased. As a result, the inspection accuracy is improved.

(A-3) Advantages of the embodiment As described above, according to the embodiment, the probe 21 is formed to have the non-conductive guide portion 211 and the conductive portion 212, and the probe 21 supported in the support hole 19 is deformed by a contact load, so that the second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 near the support hole 19. This makes it possible to shorten the conduction path of the current that flows between the electrode 16 of the device under test 15 and the electrode terminal 20 via the probe 21. As a result, it is possible to improve the inspection accuracy of the electrical characteristics of the device under test 15.

In addition, according to the embodiment, when the probe 21 is brought into contact with the electrode 16 of the test subject 15, the probe 21 deforms starting from the bent portion 54 formed in the non-conductive guide portion 211. The position of the probe 21 is stabilized by the contact point where the bent portion 54 contacts the inner wall of the support hole 19 and the contact point where the lower end portion 551 contacts the electrode 16. Therefore, sliding and wear of the second contact portion 56 against the electrode terminal 20 can be suppressed.

(B) Other Embodiments Although various modified embodiments have been mentioned in the above-described embodiment, the present invention can also be applied to the following modified embodiments.

(B-1) The electrical contact (probe) according to the present invention is not limited to the configuration described in the above embodiment. For example, it can also be applied to the configuration of probe 21A shown in FIG. 10 (A).

Figure 10 (A) is a diagram showing the configuration of probe 21A according to a modified embodiment, and Figure 10 (B) is a diagram showing the state of probe 21A during contact in the modified embodiment.

In FIG. 10(A), the probe 21A is formed with a non-conductive guide portion 211A made of a thin wire or a thin plate-like member, and a conductive portion 212A made of a thin wire or a thin plate-like member.

The conductive portion 212A is formed by overlapping from approximately the center of the non-conductive guide portion 211A to the lower end of the non-conductive guide portion 211A, and the lower end of the conductive portion 212A protrudes downward beyond the lower end of the non-conductive guide portion 211A.

For example, the conductive portion 212A may be formed on one side (the left side in FIG. 10A) of the non-conductive guide portion 211A, which is a narrow plate-like member. The conductive portion 212A may be a narrow plate-like member. In that case, the width of the narrow plate-like conductive portion 212A may be the same as or slightly smaller than the width of the non-conductive guide portion 211A.

The non-conductive guide portion 211A has, from above, a supported portion 51A supported by the support hole 19, a support portion 58, a first guide portion 52A, a second guide portion 53A, and a bent portion 54A. On the other hand, the conductive portion 212A has, from above, a guided portion 57, a second contact portion 56A, and a first contact portion 55A. The lower end portion 551A of the first contact portion 55A contacts the electrode 16 of the test subject 15.

The first guide portion 52A, the bent portion 54A, and the second guide portion 53A of the non-conductive guide portion 211A overlap with the guided portion 57, the second contact portion 56A, and the first contact portion 55A of the conductive portion 212A.

The bent portion 54A is formed in the area where the non-conductive guide portion 211A and the conductive portion 212A overlap. As the bent portion 54A bends, the conductive portion 212A also bends, and the bent portion of the conductive portion 212A forms the second contact portion 56A.

Therefore, as shown in FIG. 10(B), when contact is made, the lower end 551A of the probe 21A comes into contact with the electrode 16 and a contact load acts on the probe 21A, causing the bent portion 54A of the non-conductive guide portion 211A to become a starting point and deforming the probe 21A.

At this time, the second contact portion 56A, which is located in a position corresponding to the bent portion 54A, comes into contact with the electrode terminal 20 on the inner wall of the support hole 19, and the support portion 58 of the non-conductive guide portion 211A bends and comes into contact with the inner wall of the support hole 19.

In this case, the probe 21A supported in the support hole 19 is supported by a contact point in contact with the electrode 16 and a contact point in contact with the inner wall of the support hole 19 (the second contact portion 56A and the contact point 58A of the support portion 58), so the posture of the probe 21A can be stabilized.

In other words, since the second contact portion 56A contacts the electrode terminal 20 while the attitude of the probe 21A is stable, sliding of the second contact portion 56A against the electrode terminal 20 can be suppressed. As a result, wear between the electrode terminal 20 and the second contact portion 56A can be suppressed, deterioration of the contact points can be suppressed, and inspection accuracy can be improved.

In addition, FIG. 10(B) illustrates an example in which the electrode terminal 20 is provided on the inner wall surface of the support hole 19. However, the electrode terminal 20 may be provided on the lower surface 18 of the probe support 17 as illustrated in FIG. 6(A) and FIG. 6(B), or may be provided on the cutout portion 191 and/or the inner wall surface of the support hole 19 as illustrated in FIG. 8(A) and FIG. 8(B).

(B-2) In the above-described embodiment, an example was given of an electrode terminal for wiring connection of the probe 21 provided near the support hole 19 or on the inner wall of the support hole 19. The position of the electrode terminal 20 may be any position that allows contact with the second contact portion 56 when the probe 21 is deformed by a contact load, and is not limited to the above-described embodiment.

(B-3) In the above embodiment, the non-conductive guide portion 211 of the probe 21 has a bent portion 54. However, the number of bent portions 54 provided on the non-conductive guide portion 211 is not limited to one, and may be multiple (e.g., two or more).

1...electrical connection device, 5...probe assembly, 15...object under test, 16...electrode, 17...probe support, 18...underside of probe support, 19...support hole, 191...cutout portion, 192...ceiling portion, 20...electrode terminal, 21 and 21A...electrical contactor (probe), 211 and 211A...non-conductive guide portion, 212 and 212A...conductive portion, 51 and 51A...supported portion, 52 and 52A...first guide portion, 53 and 53A...second guide portion, 54 and 54A...bent portion, 55 and 55A...first contact portion, 551...lower end portion, 56 and 56A...second contact portion, 57...guided portion, 58...support portion.

Claims (8)

a support hole having an opening formed on one surface of a support substrate;
an electrical contact that is inserted into the support hole and electrically contacts the device under test;
an electrode portion provided near the opening of the support hole,
The electrical contact has a non-conductive portion having a bent portion and a conductive portion provided on one end side of the non-conductive portion,
the bent portion is bent such that, when one end of the conductive portion is brought into electrical contact with the test object, the other end of the conductive portion is short-circuited with the electrode portion,
The deformation of the electrical contact causes the bent portion to come into contact with the inner wall surface of the support hole, thereby moving the other end of the conductive portion in a direction intersecting the axis of the support hole.
2. An electrical contact structure for an electrical contact comprising: 2. The electrical contact structure of claim 1, wherein a second contact portion is provided on the other end side of the conductive portion so as to protrude in a direction intersecting with the axial direction of the conductive portion. The electrical contact structure of the electrical contactor according to claim 1 or 2, characterized in that the deformation of the electrical contactor brings the second contact portion of the conductive portion into contact with the electrode portion. The non-conductive portion of the electrical contact is formed of a linear member or a narrow plate-like member,
a second contact portion of the conductive portion is formed of a member that contacts the electrode portion over a wide area at the one end of the non-conductive portion,
The electrical contact structure of an electrical contactor according to any one of claims 1 to 3 , characterized in that the first contact portion of the conductive part is formed of a linear member or a narrow plate member supported by the second contact portion. 5. The electrical contact structure of an electrical contactor according to claim 1 , wherein the electrode portion is provided on the bottom surface of the support substrate in the vicinity of an opening of the support hole. 5. The electrical contact structure of an electrical contactor according to claim 1, wherein the electrode portion is provided on a part or the entire surface of an inner wall of the support hole. The electrical contact structure of an electrical contactor according to any one of claims 1 to 4 , characterized in that the electrode portion is provided on a sloping surface of a cutout portion formed by cutting out an opening of the support hole, and/or on an inner wall surface of the support hole. An electrical connection device comprising a support substrate supporting a plurality of electrical contacts and electrically connecting an object to be inspected and an inspection device, the electrical connection device having the electrical contact structure of the electrical contacts according to any one of claims 1 to 7 .

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