JP7501167B2 - X-ray inspection equipment - Google Patents

Description

The present invention relates to an X-ray inspection apparatus that uses X-ray transmission or CT (Computer Tomography).

Conventionally, X-ray inspection devices that use X-ray CT (hereinafter referred to as "X-ray CT devices") perform reconstruction processing using multiple pieces of projection data (e.g., about 15 to 500 sheets) to obtain CT images (see Patent Document 1). When performing CT imaging using an X-ray CT device, a simple calculation shows that the imaging time differs by more than 30 times between 15 sheets and 500 sheets.

In particular, the imaging time for inspection equipment is related to the takt time (the time from when the inspection target is brought into the inspection equipment until it is taken out). This takt time is an important factor for inspection equipment. For example, in a line that is configured to ship products after undergoing an inspection process using an X-ray inspection equipment, the number of shipments per day is limited by the number of items that can be inspected per day by the X-ray inspection equipment.

Patent No. 6519663

However, in the past, it was not possible to determine appropriate X-ray imaging conditions while taking into account takt time.

The present invention was made in consideration of the above problems, and aims to provide an X-ray inspection device that displays the time required for a specific process, including imaging, and can determine appropriate imaging conditions while taking into account the time required for the process.

To solve the above problems, the present invention provides:
An X-ray inspection apparatus that inspects an inspection object by imaging the object using X-rays,
an X-ray generator for generating X-rays to be irradiated onto the inspection object;
an X-ray detector for detecting X-rays transmitted through the object to be inspected;
a setting receiving unit that receives settings of imaging conditions, which are conditions related to the imaging;
a required time estimation unit configured to estimate a required time for a predetermined process including imaging the object using X-rays, the required time being determined based on the imaging conditions that have been set;
a required time display unit that displays the required time;
The present invention is characterized by comprising:

According to the present invention, when the imaging conditions for imaging an object with X-rays are set using the setting reception unit, the time required for a predetermined process including imaging the object with X-rays is estimated by the required time estimation unit and displayed on the required time display unit, so that appropriate imaging conditions can be determined while taking into account the time required for processing.

In the present invention,
a unit imaging area setting unit that sets a unit imaging area, which is an area of the inspection object corresponding to a field of view of the X-ray detector;
the setting reception unit receives settings of the imaging conditions for an object to be inspected that is included in the inspection target;
the unit imaging area setting unit sets the unit imaging area in accordance with the imaging condition set for the object to be inspected;
the imaging conditions include an exposure time, which is a time during which the unit imaging area is irradiated with X-rays generated by the X-ray generator, and an imaging count, which is a number of times that the unit imaging area is imaged;
The required time may include a time required to capture an image of the unit imaging area, which is calculated by multiplying the exposure time by the number of times of capturing images.

In this way, a unit imaging area, which is an area of the inspection object corresponding to the field of view of the X-ray detector, is set according to the imaging conditions set according to the object to be inspected included in the inspection object. Then, the required time including the time to image the unit imaging area, which is the exposure time multiplied by the number of images, is estimated and displayed. In other words, the required time including the time required to image multiple unit imaging areas from different angles, which is the main process among the predetermined processes included in the inspection of the inspection object, particularly in inspections using X-ray CT, is estimated and displayed, so that appropriate imaging conditions can be determined while more accurately considering the time required for processing.

In the present invention,
the required time includes a sum, for all of the unit imaging areas, of a time required to capture the unit imaging areas, the sum being calculated by multiplying the exposure time by the number of times of imaging,
The unit imaging area setting section may set the unit imaging areas in accordance with the object to be inspected so as to reduce the number of the unit imaging areas.

In this way, even when multiple unit imaging areas are set for the object being inspected, the time required for imaging the unit imaging areas from different angles, which is a major process among the predetermined processes included in the inspection of the object being inspected, particularly in inspections using X-ray CT, including the sum of the time required for all unit imaging areas, is estimated and displayed. Furthermore, the unit imaging areas are set so that there are fewer unit imaging areas depending on the object being inspected, so that appropriate imaging conditions can be determined with more accurate consideration without extending the time required for processing.

In the present invention,
The required time may include a time required to position the inspection object at a predetermined position for inspection.

This allows appropriate imaging conditions to be determined while taking into account the time required for the process of positioning the object to be examined at a specified position for the examination.

In the present invention,
The required time may include a time required to carry the inspection object into the X-ray inspection apparatus and a time required to carry the inspection object out of the X-ray inspection apparatus.

This makes it possible to determine appropriate imaging conditions while taking into account the time required to load the object into the X-ray inspection device and to load it out of the device.

The present invention provides an X-ray inspection device that displays the time required for a specific process, including imaging, and can determine appropriate imaging conditions while taking into account the time required for the process.

1 is a functional block diagram of an X-ray inspection apparatus according to a first embodiment of the present invention. 5 is a flowchart illustrating a procedure of an inspection time display process of the X -ray inspection apparatus according to the first embodiment of the present invention. 1 is a diagram illustrating an imaging condition setting UI according to the first embodiment of the present invention; 5A to 5C are diagrams illustrating a transition of an imaging condition setting UI according to the first embodiment of the present invention. 13A to 13C are diagrams illustrating another transition of the imaging condition setting UI according to the first embodiment of the present invention.

[Application example]
Hereinafter, application examples of the present invention will be described with reference to the drawings.

Figure 1 is a functional block diagram of an X-ray inspection device 1 to which the present invention is applied, and Figure 2 is a flowchart explaining the procedure for processing to display the inspection time in the X-ray inspection device 1.

In the X-ray inspection device 1, first, the user selects an inspection object for which imaging conditions are to be set (changed) using the imaging condition setting UI 131 (step S1). Here, the inspection object refers to a component or area included in an inspection target such as a board.

Next, the user sets or changes the imaging conditions for the selected object to be inspected using the imaging condition setting UI 131 (step S2).

When the imaging conditions are set (changed) in this way, the angle of view allocation unit 122 allocates an angle of view corresponding to the selected object to be inspected (step S3). The angle of view is the field of view when the X-ray detector 112 images the object to be inspected through which the X-rays irradiated from the X-ray generator 111 pass. The angle of view allocation unit 122 allocates the angle of view so that the number of angles of view allocated is as small as possible, preferably the minimum, according to the selected object to be inspected. For example, in the imaging condition setting UI 131 shown in FIG. 4, the inspection object display area 1311 displays the B part 1311b and the E part 1311e as selected objects to be inspected, in a thick rectangular frame. Then, as shown in the parts list display area 1314 in FIG. 5, the resolution of the imaging conditions for both the B part and the E part is changed from 30 to 25, and the number of projections is changed from 64 to 256, so that the angle of view 13113 is allocated to the B part 1311b, and the angle of view 13111 is allocated to the E part.

Next, the inspection time estimation unit estimates the inspection time, that is, calculates the estimated inspection time (step S4). The inspection time is the time required for a predetermined process including at least imaging the inspection object using X-rays, and various calculation methods are possible. Here, the estimated inspection time is calculated by adding 43.52 seconds, which is the sum of the imaging times for each of the two angles of view (85 x 256 = 21.76 seconds), the time required for the imaging unit 11 to move between the angles of view, the time required for the positioning unit 114 to position, and the time required to carry the inspection object into the X-ray inspection device 1 and the time required to carry it out from the X-ray inspection device 1. For this reason, the inspection time estimation unit 123 calculates the estimated inspection time to be 54.5 seconds.

The estimated examination time calculated in step S4 is sent to and displayed in the examination time display UI 132 (step S5), and the examination time display process ends. For example, in the imaging condition setting UI 131 shown in FIG. 5, the estimated examination time display section 1313e of the detailed information display section 1313 displays 54.5 seconds.

Thus, according to the present invention, the examination time corresponding to the imaging conditions is estimated and displayed in real time, allowing the user to determine appropriate imaging conditions while taking the examination time into consideration.

Example 1
Hereinafter, an X-ray inspection device 1 according to a first embodiment of the present invention will be described in more detail with reference to the drawings. However, the configuration of the device described in this embodiment should be appropriately changed depending on various conditions. In other words, it is not intended to limit the scope of the present invention to the following embodiment.

<Device Configuration>
1 is a functional block diagram showing a schematic configuration of an X-ray inspection apparatus 1. Here, an X-ray inspection apparatus that uses X-ray CT images will be described.
The X-ray inspection device 1 is an apparatus that acquires three-dimensional data by capturing images of an inspection object from multiple imaging positions, and is mainly configured to include an imaging unit 11, a calculation unit 12, a UI unit 13, an inspection object transport unit 14, and a bus 15. The bus 15 is a transmission path that connects each unit and transmits and receives data. An example of an inspection object is a circuit board, but is not limited to this.

The imaging unit 11 includes an X-ray generator 111 , an X-ray detector 112 , a stage 113 , a positioning unit 114 , and an imaging condition storage unit 115 .
The X-ray generator 111 is a device that irradiates an object to be inspected with X-rays.
The X-ray detector 112 is a two-dimensional X-ray detector that detects the X-rays output from the X-ray generator 111 and transmitted through the object to be inspected, and generates an image. For example, an I.I. (Image Intensifier) tube or an FPD (Flat Panel Detector) can be used.
The stage 113 is a mechanism for changing the relative positions of the X-ray generator 111, the X-ray detector 112, and all or a part of the object to be inspected in the X-, Y-, and Z-directions in order to image the object to be inspected from a plurality of imaging positions.
The positioning unit 114 is a means for positioning the inspection object at a predetermined position for inspection, and includes a CCD camera for detecting the position of the inspection object in the XY plane, a displacement sensor for detecting the position in the Z direction perpendicular to this XY plane, and a mechanism for processing the detection results and positioning the inspection object at the predetermined position.
The imaging condition storage unit 115 is a predetermined area of a memory (for example, constituted by an auxiliary storage unit described later), and stores imaging conditions in association with the examination time when an examination was performed under the imaging conditions.

The calculation unit 12 includes an examination target information storage unit 121, a field of view allocation unit 122, and an examination time estimation unit 123. The calculation unit 12 is a device that performs various calculations such as X-ray CT calculations and examination processing, and may be configured with logic circuits such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array). In addition, a general-purpose calculation device called a CPU (Central Processing Unit), a main memory unit, and an auxiliary memory unit can be used. A memory such as RAM can be used as the main memory unit. A ROM, HDD, SSD, etc. can be used as the auxiliary memory unit.

The inspection object information storage unit 121 is a specified area of memory (e.g., constituted by an auxiliary storage unit) and stores information about the inspection object, the objects to be inspected (components and areas) contained therein, and their shapes and arrangements (positional relationships) based on the CAD data of the inspection object and the sample of the inspection object.

The angle-of-view allocation unit 122 is a functional unit that allocates an angle of view, which is an area corresponding to a field of view when an inspection object is imaged by the X-ray detector 112, according to imaging conditions that can be set for each inspection object. When allocating multiple angles of view to the inspection object according to the imaging conditions set for the inspection object, the angle-of-view allocation unit 122 allocates the number of angles of view so as to be as small as possible, preferably to the minimum. Here, the angle of view corresponds to a unit imaging area of the present invention, and the angle-of-view allocation unit corresponds to a unit imaging area setting unit of the present invention.

The inspection time estimation unit 123 is a functional unit that estimates the inspection time of the inspection object based on the set imaging conditions and the angle of view assigned accordingly. Here, the inspection time is an example of the time required for a predetermined process including imaging of the inspection object using X-rays, and corresponds to the required time of the present invention. This inspection time can be the time required to obtain an inspection image of a desired position (area) for three-dimensional data reconstructed from an image of the inspection object positioned at a predetermined position of the X-ray inspection device 1 captured by the X-ray detector 112, and to inspect the object to be inspected. The inspection time may further include the time required for the inspection object carried into the X-ray inspection device 1 to be positioned by the above-mentioned positioning unit 114. In addition, the inspection time may further include the time required for carrying the inspection object into the X-ray inspection device 1 and carrying the inspection object out of the X-ray inspection device 1 after the inspection is completed. In this case, the inspection time estimation unit 123 corresponds to the required time estimation unit of the present invention.

The UI unit 13 includes an imaging condition setting UI 131 and an examination time display UI 132. The UI unit 13 is an interface for transmitting and receiving various information between a user and the X-ray inspection apparatus 1 , and may be displayed on a touch panel display also serving as an input/output unit, or may be displayed on an output unit such as an independently configured display and may receive input from an input unit such as a mouse or a keyboard.
The imaging condition setting UI 131 is a user interface that accepts input of imaging conditions for each object to be inspected, and is configured by, for example, a user interface as shown in FIG.
The examination time display UI 132 is a user interface that displays the examination time estimated by the examination time estimation unit 123. The examination time display UI 132 corresponds to the required time display unit of the present invention.

The inspection object transport unit 14 is a mechanism for transporting the inspection object into the X-ray inspection device 1 and transporting the inspection object out of the X-ray inspection device 1 after inspection has been completed, and is composed of, for example, a conveyor.

<Examination time display process>
Next, the procedure for displaying the examination time will be described.

Figures 3 to 5 show an example of an imaging condition setting UI 131 displayed on the display of the X-ray inspection device 1. Here, Figures 3 to 5 are also examples of an inspection time display UI 132.

Prior to describing the procedure of the examination time display process with reference to the flowchart shown in FIG. 2, the configuration of the imaging condition setting UI 131 will be described with reference to FIG.
A rectangular inspection target display area 1311 is located in the upper left corner of the screen. An image showing a predetermined area of the inspection target is displayed in this inspection target display area 1311. The predetermined area displayed in the inspection target display area 1311 may be the whole or a part of the inspection target. Here, the predetermined area of the substrate to be inspected is shown as viewed from the height direction (Z direction). What is displayed in the inspection target display area 1311 may be CAD data of the inspection target or an image generated based on this, or may be an image of a sample to be inspected.

In addition, the inspection target display area 1311 also displays the object to be inspected, such as an electronic component mounted on the board to be inspected, and a fiducial mark formed on the board. In the description of the imaging condition setting UI 131, the object to be inspected and the fiducial mark are collectively referred to as a component. Here, the inspection target display area 1311 displays an A part 1311a, a B part 1311b, a C part 1311c, a D part 1311d, an E part 1311e, an F part 1311f, a G part 1311g, and an H part 1311h. Here, the A part 1311a, the B part 1311b, the E part 1311e, the F part 1311f, the G part 1311g, and the H part 1311h are the object to be inspected, such as an electronic component, and the C part 1311c and the D part 1311d are fiducial marks imaged by the CCD camera of the positioning unit 114.

Furthermore, the field of view 13111 and field of view 13112, which are the field of view of the X-ray detector 112 when imaging the substrate to be inspected with X-rays, are displayed as rectangular frames. The field of view 13111 includes the A part 1311a, the B part 1311b, and the E part 1311e, and the field of view 13112 includes the F part 1311f, the G part 1311g, and the H part 1311h.

An imaging condition setting section 1312 is arranged in the upper right part of the screen of the imaging condition setting UI 131. The imaging condition setting section 1312 has a pull-down menu 1312a for setting the number of images, a pull-down menu 1312b for setting the resolution (μm), a pull-down menu 1312c for setting the irradiation angle (°), a pull-down menu 1312d for setting the tube voltage (kV), a pull-down menu 1312e for setting the tube current (μA), and a pull-down menu 1312f for setting the exposure time (msec). Here, the default values selected are 64 images, 30 μm resolution, 45° irradiation angle, 100 kV tube voltage, 295 μA tube current, and 85 msec exposure time.

A detailed information display section 1313 is located in the center right of the screen of the imaging condition setting UI 131. The detailed information display section 1313 includes a total part number display section 1313a, a total screen number display section 1313b, a number of CCD screens display section 1313c, a number of X-ray screens display section 1313d, and an estimated inspection time display section 1313e. The total part number display section 1313a displays the number of parts included in the inspection object displayed in the inspection object display area 1311. As described above, the inspection object includes eight parts, A parts 1311a to H parts 1311h, so 8 is displayed as the total part number. The total screen number indicates the sum of the number of X-ray screens, which is the number of angles of view of the X-ray detector 112, and the number of CCD screens, which is the number of angles of view of the CCD camera included in the positioning section 114. As displayed in the inspection target display area 1311, the number of X-ray screens is two, the angle of view 13111 and the angle of view 13112, and the number of CCD screens is two, the angle of view for the C part 1311c and the D part 1311d, so the total number of screens is displayed as 4. The X-ray screen number display section 1313d displays the number of X-ray screens described above, and the CCD screen number display section 1313c displays the number of CCD screens described above.

The estimated examination time display unit 1313e is the examination time display UI 132 in FIG. 1. It displays the examination time estimated by the examination time estimation unit 123. Here, 31.2 seconds is displayed as the examination time estimated based on the above-mentioned imaging conditions, number of X-ray screens, and number of CCD screens.

A parts list display area 1314 is located at the bottom of the screen of the imaging condition setting UI 131. This displays, for each of parts A through H displayed in the inspection target display area 1311, the surface on which the part exists, and the imaging conditions of irradiation angle, resolution, number of projections, tube voltage, tube current, and exposure time. For parts C and D, which are fiducial marks, the only imaging condition that can be set is resolution, so values are not displayed for other imaging conditions such as irradiation angle.

A confirm button 1315 and a cancel button 1316 are provided in the upper right corner of the screen of the imaging condition setting UI 131. If the user confirms the display of the estimated inspection time and determines that the inspection time is appropriate, the user can confirm the set or changed imaging conditions by, for example, placing the cursor on the confirm button 1315 and left-clicking the mouse. If the user determines that the inspection time is not appropriate, the user can change the imaging conditions by selecting the cancel button 1316. At this time, the user may start over from selecting the object to be inspected.

A board surface display 1317 and a board back surface display 1318 are located at the top center of the screen of the imaging condition setting UI 131. When the front surface of the board to be inspected is displayed in the inspection target display area 1311, the board surface display 1317 is actively displayed, and when the back surface of the board is displayed, the board back surface display 1318 is actively displayed. Here, the front surface of the board is displayed in the inspection target display area 1311, and the board surface display 1317 is actively displayed.

Returning to the flowchart in Figure 2, the procedure for displaying the examination time will now be explained.

When the inspection time display process is started, the user selects an object to be inspected (step S1). Specifically, in the imaging condition setting UI 131 shown in FIG. 3, the user moves the cursor displayed on the screen to the position of the B part 1311b in the inspection target display area 1311, and selects the B part 1311b by an operation such as left-clicking the mouse. Furthermore, the E part 1311e is selected in the same manner. When the B part 1311b and the E part 1311e are selected in this manner, the selected parts are displayed in a thick line as shown in FIG. 4. The change in the display mode of the selected parts is not limited to this, and a method such as changing the display color can be appropriately adopted. In addition, when a part is selected, the display color of the row of the selected part is changed in the factor and parts list display section 1314 shown in FIG. 4. Here, the rows of the B part 1311b and the E part 1311e are displayed in gray. The change in the display mode of the selected part is not limited to this, and a method such as inverting the display can be appropriately adopted.

Next, the user sets or changes the X-ray imaging conditions (step S2). Specifically, in the imaging condition setting UI 131 in the state shown in FIG. 4, the user changes the X-ray imaging conditions. The changed imaging conditions are stored in the imaging condition storage unit 115 in association with the object selected in step S1. To change the X-ray imaging conditions, a pull-down menu for setting the imaging conditions to be changed is selected from the pull-down menus 1312a to 1312f arranged in the imaging condition setting unit 1312, and the numerical value is changed. Here, with the B part 1311b in the inspection target display area 1311 selected, the number of projections in the imaging condition setting unit 1312 is changed from 64 to 256, and the resolution is changed from 30 to 25. The number of projections for the E part 1311e in the inspection target display area 1311 is also changed from 64 to 256, and the resolution is changed from 30 to 25. FIG. 5 shows the state in which the number of projections and the resolution are changed by the imaging condition setting unit 1312 in this way. In response to this change in imaging conditions, the resolution has been changed to 25 and the number of projections to 256 in the rows for parts B and E in the parts list display area 1314.

As described above, when the imaging conditions are set or changed, the angle of view is assigned by the angle of view assignment unit 122 in response to the change in the imaging conditions (step S3). As shown in Fig. 5, in addition to the angle of view 13111 including the E part 1311e and the angle of view 13112 including the F part 1311f, the G part 1311g, and the H part 1311h, the angle of view 13113 including the B part 1311b and the A part 1311a is newly assigned to the inspection target display area 1311. Also, 3 is displayed in the X-ray screen number display unit 1313d of the detailed information display unit 1313. At this time, when multiple angles of view are assigned to the inspection target, the angle of view assignment unit 122 assigns the angles of view so that the number of angles of view is smaller, preferably the minimum. In this way, the number of angles of view imaged during the inspection is reduced, so that the imaging time and the inspection time can be shortened.

Next, based on the imaging conditions set or changed in step S2 and the angle of view assigned in step S3, the examination time estimation unit 123 estimates the examination time, that is, calculates an estimated examination time (step S4).

The inspection time estimated by the inspection time estimation unit 123 is a time required for a predetermined process including at least imaging of the inspection object using X-rays, and various calculation methods are possible. For example, the inspection time includes an imaging time of an angle of view obtained by multiplying the exposure time by the number of times of imaging. The inspection time may also include a sum of imaging times of angles of view obtained by multiplying the exposure time by the number of times of imaging for all angles of view captured. The inspection time may also include a time calculated in this manner plus a time for the imaging unit 11 to move from one angle of view to the next angle of view. The inspection time may also include a time required for the positioning unit 114 to position the inspection object, for example, an imaging time by a CCD camera or a detection time by a displacement sensor. The inspection time may also include a carry-in time required for the inspection object to be carried into the X-ray inspection device 1 by the inspection object transport unit 14, and a carry-out time required for the inspection object to be carried out of the X-ray inspection device 1.
Moreover, the above-mentioned movement between the angles of view, the positioning by the positioning unit 114, and the carrying in and carrying out of the inspection object by the inspection object transport unit 14 are examples of predetermined processing of the present invention.

5, among the imaging conditions for the B part 1311b and the E part 1311e, the resolution is changed from 30 to 25, and the number of projections is changed from 64 to 256. For the imaging conditions changed in this way, the inspection time estimation unit 123 calculates the estimated inspection time to be 69.4 seconds.
5, the number of projections for the B part 1311b is 256, so that 256 images are taken from different angles for the angle of view indicated by the angle of view 13113. The X-ray exposure time for each image is 85 msec, so that the image taking time for the B part is 85 (msec)×256/1000=21.8 seconds obtained by multiplying the exposure time by the number of images taken. Similarly, the number of projections for the E part 1311e is 256, so that 256 images are taken from different angles for the angle of view indicated by the angle of view 13111. The X-ray exposure time for each image is 85 msec, so that the image taking time for the E part 1311e is 85 (msec)×256/1000=21.8 seconds obtained by multiplying the exposure time by the number of images taken. In the example shown in Fig. 4, the angle of view 13111 including the B part 1311b and the E part 1311e is imaged 64 times from different angles with an X-ray exposure time of 85 msec, so the imaging time is 85 (msec) x 64/1000 = 5.4 seconds. Therefore, the increase in imaging time due to the change in imaging conditions for the angle of view 13111 from the example shown in Fig. 4 to the example shown in Fig. 5 is 21.8 - 5.4 = 16.4 seconds. When the imaging time of 21.8 seconds for the newly assigned angle of view 13113 is added, the increase in imaging time due to the change in imaging conditions from the example shown in Fig. 4 to the example shown in Fig. 5 is 38.2 seconds. Therefore, the estimated inspection time after the change in imaging conditions is 69.4 seconds, which is an increase of 38.2 seconds from the estimated inspection time of 31.2 seconds before the change in imaging conditions.

The estimated examination time calculated as described above is sent to the examination time display UI 132 and displayed in the estimated examination time display section 1313e (step S5), and the examination time display process ends.

In this way, by estimating the examination time corresponding to the imaging conditions and displaying it in real time, the user can determine appropriate imaging conditions while taking the examination time into consideration.

In the following, the components of the present invention will be described with reference to the reference numerals in the drawings in order to make it possible to compare the components of the present invention with the configurations of the embodiments.
<Invention 1>
An X-ray inspection device (1) for inspecting an inspection object by imaging the object using X-rays,
an X-ray generator (111) for generating X-rays to be irradiated onto the inspection object;
an X-ray detector (112) for detecting X-rays transmitted through the object to be inspected;
A setting reception unit (131) that receives settings of imaging conditions, which are conditions related to the imaging;
a time required estimation unit (123) for estimating a time required for a predetermined process including imaging the object using X-rays, the time required for the imaging conditions being set;
A required time display unit (132) for displaying the required time;
An X-ray inspection device (1).

1: X-ray inspection device 111: X-ray generator 112: X-ray detector 123: Inspection time estimation unit 131: Imaging condition setting UI
132: Inspection time display UI

Claims (4)

An X-ray inspection apparatus that inspects an inspection object by imaging the object using X-rays,
an X-ray generator for generating X-rays to be irradiated onto the inspection object;
an X-ray detector for detecting X-rays transmitted through the object to be inspected;
a setting receiving unit that receives settings of imaging conditions, which are conditions related to the imaging;
a unit imaging area setting unit that sets a unit imaging area, which is an area of the inspection target corresponding to a field of view of the X-ray detector;
a required time estimation unit configured to estimate a required time for a predetermined process including imaging the object using X-rays, the required time being determined based on the imaging conditions that have been set;
a required time display unit that displays the required time;
Equipped with
the setting reception unit receives settings of the imaging conditions for an object to be inspected that is included in the inspection target;
the unit imaging area setting unit sets the unit imaging area in accordance with the imaging condition set for the object to be inspected;
the imaging conditions include an exposure time, which is a time during which the unit imaging area is irradiated with X-rays generated by the X-ray generator, and an imaging count, which is a number of times that the unit imaging area is imaged;
The X-ray inspection apparatus according to claim 1, wherein the required time includes a time required to image the unit imaging area, the time being calculated by multiplying the exposure time by the number of times the imaging is performed. the required time includes a sum, for all of the unit imaging areas, of a time required to capture the unit imaging areas, the sum being calculated by multiplying the exposure time by the number of times of imaging,
2. The X-ray inspection apparatus according to claim 1 , wherein the unit imaging area setting section sets the unit imaging areas in accordance with the object to be inspected so that the number of the unit imaging areas is reduced. 3. The X-ray inspection apparatus according to claim 1 , wherein the required time includes a time required to position the inspection object at a predetermined position for inspection. 4. The X-ray inspection apparatus according to claim 1 , wherein the required time includes a time required to carry the inspection object into the X-ray inspection apparatus and a time required to carry the inspection object out of the X-ray inspection apparatus.

Images