JP7579510B2 - Evaporation mask, method of manufacturing an evaporation mask, method of manufacturing an organic semiconductor element, method of manufacturing an organic EL display device, and evaporation method - Google Patents

Description

This embodiment relates to a deposition mask, a method for manufacturing a deposition mask, a method for manufacturing an organic semiconductor element, a method for manufacturing an organic EL display device, and a deposition method.

As products using organic EL elements or substrate sizes become larger, there is an increasing demand for larger deposition masks as well. The metal plates used to manufacture deposition masks made of metal are also becoming larger. However, with current metal processing technology, it is difficult to accurately form through holes in large metal plates, and it is not possible to meet the demand for highly precise through holes.

Under these circumstances, Patent Document 1 proposes a mask sheet that is made by laminating a film layer having a plurality of opening patterns and a metal layer having a plurality of through holes that contain at least one of the above opening patterns.

JP 2017-179591 A

In recent years, there has been a demand for forming finer through-holes in deposition masks. To form finer through-holes, it becomes necessary to make the resin layer in which the through-holes are formed thinner. However, when a resin layer such as polyimide is made thinner in a mask sheet in which a resin layer and a metal layer are laminated, there is an issue that wrinkles are more likely to occur in the resin layer, particularly at the boundary between the resin layer and the metal layer.

The present disclosure provides a technology that enables the formation of fine deposition patterns, and provides, for example, a deposition mask that can suppress the occurrence of wrinkles in a resin layer, a method for manufacturing a deposition mask, a method for manufacturing an organic EL display device, and a deposition method.

The method for manufacturing a deposition mask according to this embodiment includes the steps of preparing a substrate, forming a resin layer on the substrate, removing the substrate from the resin layer, fixing the resin layer to a support, and forming a plurality of openings in the resin layer that correspond to the pattern to be formed by deposition.

The method for manufacturing a deposition mask according to this embodiment may further include a step of removing a portion of the resin layer that is located on the outer periphery of the support.

The method for manufacturing a deposition mask according to this embodiment may further include a step of attaching a reinforcing film onto the resin layer, and in the step of removing the substrate, the substrate may be removed from the resin layer to which the reinforcing film has been attached.

In the method for manufacturing a deposition mask according to this embodiment, the reinforcing film may include an outer peripheral portion in an area that is gripped when the resin layer is fixed to the support.

In the method for manufacturing a deposition mask according to this embodiment, the reinforcing film may include a central portion located inside the outer peripheral portion, and the central portion and the outer peripheral portion may be spaced apart from each other.

In the method for manufacturing a deposition mask according to this embodiment, the part of the outer periphery facing inward may be formed in a comb-like shape in a plan view.

In the method for manufacturing a deposition mask according to this embodiment, the thickness of the resin layer may be 1 μm or more and 5 μm or less.

The deposition mask according to this embodiment includes a resin mask having a plurality of openings corresponding to the pattern to be formed by deposition, and a support joined to the resin mask.

In the deposition mask according to this embodiment, the support may be joined to the resin mask without the interposition of a metal material.

In the deposition mask according to this embodiment, the resin mask has an effective area in which the openings are arranged in a regular array, and a surrounding area surrounding the effective area, and only the resin mask may be present within the effective area.

In the deposition mask according to this embodiment, the support is frame-shaped, the openings of the resin mask are located inside the support in a plan view, and the resin mask inside the support may be a free-standing thin film.

The method for manufacturing an organic EL display device according to this embodiment is a method for manufacturing an organic EL display device, and includes a step of forming a deposition pattern on a deposition target using a deposition mask according to this embodiment.

The deposition method according to this embodiment includes the steps of preparing a deposition mask according to this embodiment, preparing a deposition object, placing the deposition object on the deposition mask, and depositing a deposition material on the deposition object placed on the deposition mask.

The method for manufacturing an organic EL display device according to this embodiment includes a step of forming a deposition pattern on a deposition target using a deposition mask manufactured by the deposition mask manufacturing method according to this embodiment.

The deposition method according to this embodiment includes the steps of preparing a deposition mask manufactured by the deposition mask manufacturing method according to this embodiment, preparing a deposition object, placing the deposition object on the deposition mask, and depositing a deposition material on the deposition object placed on the deposition mask.

The method for manufacturing an organic semiconductor element according to this embodiment includes a step of forming a deposition pattern on a deposition target using the deposition mask according to this embodiment.

The method for manufacturing an organic semiconductor element according to this embodiment includes a step of forming a deposition pattern on a deposition target using a deposition mask manufactured by the deposition mask manufacturing method according to this embodiment.

The method for manufacturing a deposition mask according to this embodiment includes the steps of preparing a resin layer on which a reinforcing film is disposed, fixing the resin layer on which the reinforcing film is disposed to a support, and forming a plurality of openings in the resin layer corresponding to the pattern to be prepared by deposition, thereby producing a resin mask.

In the method for manufacturing a deposition mask according to this embodiment, the resin mask has an effective area in which the openings are arranged in a regular array, and a surrounding area surrounding the effective area, and only the resin mask may be present within the effective area.

In the method for manufacturing a deposition mask according to this embodiment, the support is frame-shaped, the openings of the resin mask are located inside the support in a plan view, and the resin mask inside the support may be a free-standing thin film.

This embodiment can prevent wrinkles from forming in the resin layer.

FIG. 1 is a plan view showing a deposition mask according to an embodiment. FIG. 2 is a cross-sectional view (cross-sectional view taken along line II-II in FIG. 1) showing a deposition mask according to one embodiment. 3A and 3B are cross-sectional views showing a part of a method for manufacturing a deposition mask according to one embodiment. 4A and 4B are a cross-sectional view and a plan view showing a part of a method for manufacturing a deposition mask according to one embodiment. 5(a) and (b) are plan views showing modified examples of the reinforcing film. 6A and 6B are cross-sectional views showing a part of a method for manufacturing a deposition mask according to one embodiment. 7A and 7B are a cross-sectional view and a plan view showing a part of a method for manufacturing a deposition mask according to one embodiment. 8A and 8B are cross-sectional views showing a part of a method for manufacturing a deposition mask according to one embodiment. 9(a) to 9(c) are cross-sectional views showing the positional relationship between the resin layer and the adhesive layer. 10A and 10B are a cross-sectional view and a plan view showing a part of a method for manufacturing a deposition mask according to one embodiment. 11A and 11B are plan views showing the order in which a plurality of openings are formed. FIG. 12 is a schematic diagram showing a deposition apparatus. FIG. 13 is a schematic diagram showing an organic EL display device manufactured using a deposition mask. 14(a) to 14(c) are schematic diagrams showing a method for manufacturing an organic EL display device using a deposition mask. 15(a) and (b) are plan views showing modified examples of the reinforcing film.

Each embodiment will be described below with reference to the drawings. Each figure shown below is a schematic illustration. Therefore, the size and shape of each part are appropriately exaggerated to make it easier to understand. In addition, it is possible to carry out appropriate modifications within the scope of the technical concept. In each figure shown below, the same parts are given the same reference numerals, and some detailed explanations may be omitted. In addition, the numerical values such as dimensions of each member and the material names described in this specification are examples of embodiments, and are not limited to these, and can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and vertical, are intended to include substantially the same state in addition to their strict meanings.

In this specification, the X direction and the Y direction are two directions parallel to each side of the deposition mask 10, and the X direction and the Y direction are perpendicular to each other. The Z direction is a direction perpendicular to both the X direction and the Y direction. Furthermore, "inside" and "inner side" refer to the side facing toward the center of the deposition mask 10, and "outside" and "outer side" refer to the side away from the center of the deposition mask 10.

First, one embodiment will be described with reference to Figures 1 to 14. Figures 1 to 14 are diagrams illustrating this embodiment.

(Configuration of deposition mask)
The configuration of the deposition mask according to the present embodiment will be described with reference to FIGS.

As shown in Figures 1 and 2, the deposition mask 10 according to this embodiment includes a resin mask 30 having a plurality of openings 31 corresponding to the pattern to be formed by deposition, and a support 40 joined to the resin mask 30.

This deposition mask 10 is used to simultaneously form deposition patterns for multiple screens, and one deposition mask 10 can simultaneously form deposition patterns corresponding to multiple products. Here, the "opening" means a pattern to be produced using the deposition mask 10. For example, when the deposition mask is used to form an organic layer in an organic EL display, the shape of the opening 31 becomes the shape of the organic layer. Also, "one screen" is composed of a collection of openings 31 corresponding to one product, and when the one product is an organic EL display, the collection of organic layers necessary to form one organic EL display, that is, the collection of openings 31 that become the organic layer, becomes "one screen". The area that becomes one screen is also called "effective part". And, in the deposition mask 10, in order to simultaneously form deposition patterns for multiple screens, the above-mentioned "one screen" is arranged in the resin mask 30 at a predetermined interval for multiple screens. That is, the resin mask 30 is provided with the openings 31 necessary to form multiple screens.

The resin mask 30 is provided on one surface (the surface on the positive side in the Z direction) of the support 40. The resin mask 30 has a rectangular shape with each side extending in the X direction and the Y direction. The resin mask 30 has a first surface 30a and a second surface 30b located on the opposite side of the first surface 30a. The first surface 30a is a surface facing the opposite side of the support 40 (the positive side in the Z direction), and the second surface 30b is a surface facing the support 40 side (the negative side in the Z direction).

The resin mask 30 is provided with openings 31 that are used to form multiple screens. Each opening 31 is quadrilateral in shape, and more specifically, has a rectangular shape with each side extending in the X direction and the Y direction. The corners of the quadrilateral that forms the opening 31 may be rounded.

The resin mask 30 includes an effective area 32 in which openings 31 are formed in a regular arrangement, and a peripheral area 33 surrounding the effective area 32. The peripheral area 33 is an area for supporting the effective area 32, and is not an area through which the deposition material 92 (see FIG. 12) intended to be deposited on the deposition substrate 91 passes. On the other hand, in the deposition mask 10 used for deposition of an organic light-emitting material, the effective area 32 is an area in the deposition mask 10 that faces the area that becomes the display area of the deposition substrate 91 where the organic light-emitting material is deposited to form pixels. However, for various purposes, through holes and recesses may be formed in the peripheral area 33. Only the resin mask 30 exists in the effective area 32. That is, there is no metal layer in the effective area 32 that supports the resin mask 30. In the example shown in FIG. 1, each effective area 32 may have a contour that is approximately quadrangular in plan view, or more precisely, approximately rectangular in plan view. Although not shown, each effective area 32 can have a contour of various shapes depending on the shape of the display area of the deposition substrate 91. For example, each effective area 32 may have a circular contour.

As shown in FIG. 1, the multiple effective areas 32 of the deposition mask 10 are arranged at a predetermined interval along two mutually orthogonal directions. In the illustrated example, one effective area 32 corresponds to one organic EL display device. In other words, the deposition mask 10 according to this embodiment enables multi-sided deposition. In addition, the multiple openings 31 formed in each effective area 32 may be arranged at a predetermined pitch along the mutually orthogonal X and Y directions in the effective area 32.

The multiple openings 31 are aligned in the X and Y directions and may have the same shape. The length L1 of one side of each opening 31 (length in the X and Y directions) may be, for example, 5 μm or more and 120 μm or less. Specifically, the length L1 may be, for example, 100 μm or more and 120 μm or less in the case of low resolution (200 ppi), and may be, for example, 5 μm or more and 20 μm or less in the case of high resolution (1000 ppi or more and 3000 ppi or less). The pitch P1 of each opening 31 (center-to-center distance of the openings 31 in the X and Y directions) may be, for example, 6 μm or more and 400 μm or less. Specifically, the pitch P1 may be, for example, 110 μm or more and 400 μm or less in the case of low resolution (200 ppi), and may be, for example, 6 μm or more and 100 μm or less in the case of high resolution (1000 ppi or more and 3000 ppi).

In plan view, the minimum distance between the support 40 and the opening 31 may be 1 mm or more. This allows for a wide area for forming the deposition pattern while leaving a margin in the manufacturing process of the deposition mask 10.

2, the periphery of each opening 31 may be tapered. In this case, each opening 31 has a shape in which the opening area gradually increases from the first surface 30a side (positive side in the Z direction) toward the second surface 30b side (negative side in the Z direction). The periphery of each opening 31 is inclined with respect to the normal direction (Z direction) of the resin mask 30 in a cross-sectional view. The periphery of each opening 31 may be inclined in a linear manner in a cross-sectional view, or may be inclined in a curved manner. Note that the length L1 of one side of each opening 31 and the pitch P1 of each opening 31 described above refer to the length measured on the side where the area of each opening 31 is narrower (the second surface 30b side).

The resin mask 30 can be made of any of the conventionally known resin materials, and is not particularly limited in terms of the material. It is preferable that the resin mask 30 is made of a material that allows the formation of high-definition openings 31 by laser processing or the like, has a small dimensional change rate and moisture absorption rate due to heat or over time, and is lightweight. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyethylene terephthalate resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene-vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, ionomer resin, and the like. Among the materials exemplified above, a resin material whose thermal expansion coefficient is 16 ppm/°C or less is preferable, a resin material whose moisture absorption rate is 1.0% or less is preferable, and a resin material that satisfies both of these conditions is particularly preferable. By using this resin material to make a resin mask, the dimensional accuracy of the opening 31 can be improved, and the dimensional change rate and moisture absorption rate due to heat and time can be reduced. In addition, it is preferable to use a resin material whose thermal expansion coefficient differs from that of the material constituting the support 40 by 15 ppm/°C or less, and the difference may be 10 ppm/°C or less. This makes it possible to prevent wrinkles from occurring in the resin mask 30 due to the difference in thermal expansion coefficient with the support 40. The resin mask 30 may contain a filler other than the resin material. The filler may include pigments, particles of inorganic materials, etc.

There are no particular limitations on the thickness T1 of the resin mask 30, but it may be 1 μm or more and 25 μm or less, preferably 1 μm or more and 5 μm or less, and more preferably 1 μm or more and 3 μm or less. By setting the thickness T1 of the resin mask 30 within this range, the risk of defects such as pinholes and deformations can be reduced, and the occurrence of shadows can be effectively prevented. In particular, by setting the thickness T1 of the resin mask 30 to 1 μm or more and 5 μm or less, a high-resolution pattern exceeding 1000 ppi can be formed.

The resin mask 30 is suppressed from wrinkling on the surface. In particular, the occurrence of wrinkles at the boundary between the resin mask 30 and the support 40 when viewed in a plan view is reduced. That is, the first surface 30a of the resin mask 30 is flattened in-plane (particularly within the effective area 32). The flatness of the resin mask 30 may be 1 μm or more and 5 μm or less. As shown in FIG. 2, on the second surface 30b side of the resin mask 30, the area (inter-aperture area) 31a between the openings 31 is located on approximately the same plane. In the description of this embodiment, "wrinkles" may include a mode showing fine lines formed on the surface of the resin layer, a mode in which the resin layer itself is bent, etc.

The support 40 is provided on one surface (the surface on the negative side in the Z direction) of the resin mask 30. In this embodiment, the support 40 is bonded to the resin mask 30 by an adhesive layer 35. The adhesive layer 35 exists in the area where the support 40 and the resin mask 30 overlap in a plan view. From another perspective, the resin mask 30 located inside the support 40 exists as a free-standing membrane (free-standing thin film) without being supported by a metal layer or the like. In the illustrated example, the support 40 is bonded to the resin mask 30 without the intervention of a metal layer that supports the resin mask 30. For the adhesive layer 35, for example, a thermosetting, photosetting, thermoplastic, or other adhesive can be used. In addition to the above-mentioned adhesive method using the adhesive layer 35, the method of bonding the support 40 and the resin mask 30 can include, for example, a welding method, a melting method, a pressure-sensitive adhesive method, a bonding method using a thermoplastic resin, and a method using a polyimide precursor instead of an adhesive. As a result, even if the resin mask 30 is thinned to, for example, about 1 μm or more and 5 μm or less, the resin mask 30 itself is configured as a self-supporting membrane, so that the occurrence of wrinkles in the resin mask 30 that occurs when there is a metal layer supporting the resin mask can be suppressed. In this specification, the support 40 and the resin mask 30 being bonded includes not only the case where they are directly bonded without any member between them, but also the case where the support 40 and the resin mask 30 are bonded only with a member (which may be a member containing a metal material or a member not containing a metal material) such as an adhesive that is used exclusively to bond the support 40 and the resin mask 30.

The support 40 may be a frame that supports the resin mask 30. The support 40 supports the resin mask 30 in a state where it is pulled in the direction of its surface so that the resin mask 30 does not bend. The support 40 is a frame member having a substantially rectangular shape, and has a through hole 41 for exposing the openings 31 provided in the resin mask 30 to the deposition source side. That is, the multiple openings 31 are located inside the through hole 41 in a plan view. The outer periphery of the support 40 is larger than the outer periphery of the resin mask 30. However, this is not limited to this, and the outer periphery of the support 40 may have a shape smaller than the outer periphery of the resin mask 30, and the outer periphery of the resin mask 30 and the outer periphery of the support 40 may have the same shape. There is no particular limitation on the material of the support 40, but a metal material with high rigidity, such as SUS, Invar material, ceramic material, resin material, or semiconductor material such as silicon can be used.

There is no particular limit to the thickness T2 of the support 40, but it is preferably about 10 mm or more and 30 mm or less in terms of rigidity, etc. The width W1 between the outer peripheral end face of the through hole 41 of the support 40 and the outer peripheral end face of the support 40 is not particularly limited as long as it is a width that can fix the support 40 and the resin mask 30, and an example of a width that can be about 10 mm or more and 250 mm or less can be exemplified.

Whether or not the support 40 is provided is optional, and the support 40 does not necessarily have to be provided. In this embodiment, the deposition mask 10 may include the support 40 (also called a deposition mask device), or may not include the support 40.

(Method of manufacturing deposition mask)
Next, a method for manufacturing a deposition mask according to the present embodiment will be described with reference to Figures 3 to 10. Figures 3 to 10 are process diagrams for explaining the method for manufacturing a deposition mask according to the present embodiment.

First, as shown in FIG. 3(a), a substrate 51 is prepared. The substrate 51 is for supporting the resin layer 30A described later. The surface of the substrate 51, particularly the surface on which the resin layer 30A described later is formed, preferably has a small surface roughness. For example, the roughness of the surface of the substrate 51 may be set so that the arithmetic mean height Sa is 1 μm or less. The "arithmetic mean height (Sa)" is a parameter obtained by expanding the arithmetic mean height (Ra) of a line to a surface, and is a value calculated by averaging the absolute values of the heights of each point with respect to the average surface of the surface to be measured. The arithmetic mean height (Sa) can be calculated, for example, by measuring the surface of the substrate 51 using a shape analysis laser microscope and calculating it according to a method conforming to ISO 25178. Examples of materials for the substrate 51 include glass, resin, silicon, metals such as SUS, and the like. In particular, it is desirable to use transparent glass, taking into consideration the flatness of the surface and peeling by the laser lift-off method described later. For example, the transparent glass may have a transmittance of 80% or more for light with a wavelength of 308 nm. The thickness of the substrate 51 may be, for example, 0.1 mm or more and 10 mm or less.

3B, a resin layer 30A is formed on one surface of the substrate 51. This resin layer 30A is for producing the resin mask 30 of the deposition mask 10 described above. Specifically, a resin solution such as a polyamic acid solution, which is a precursor of polyimide, is applied to the entire surface of the substrate 51, and the resin layer 30A is obtained by heat-treating the resin solution. Alternatively, the resin layer 30A may be obtained by applying a resin solution such as a polyimide varnish, heating it, and drying it. Examples of methods for applying the resin solution include spin coating, die coating, slit coating, dip coating, and spray coating. The thickness of the resin solution applied may be, for example, 1 μm or more and 25 μm or less, preferably 1 μm or more and 5 μm or less, and more preferably 1 μm or more and 3 μm or less. In addition, the material of the resin layer 30A is not limited to polyimide, and a material with a small thermal expansion coefficient can be suitably used. The resin layer 30A may be formed by bonding a film-like material to the surface of the substrate 51. The resin layer 30A may have a single-layer structure or a multi-layer structure in which multiple layers are stacked.

Next, as shown in FIG. 4(a) and (b), a reinforcing film 60 is attached onto the resin layer 30A. The reinforcing film 60 reinforces the thin resin layer 30A. By providing the reinforcing film 60 on the resin layer 30A, the handling property of the resin layer 30A can be improved in the manufacturing process of the deposition mask 10. For example, a re-peelable film, a slightly adhesive film, a heat peelable film, or the like can be used as the reinforcing film 60. Resins such as polyethylene terephthalate (PET), polyethylene (PE), and polypropylene (PP) can be used as the material of the reinforcing film 60. It is preferable that the reinforcing film 60 is thicker than the resin layer 30A. Specifically, the thickness of the reinforcing film 60 may be 50 μm or more and 500 μm or less. The reinforcing film 60 may be formed by patterning a photosensitive resin or the like on the resin layer 30A.

The reinforcing film 60 may be made up of only one part. For example, the reinforcing film 60 may have only the outer peripheral part 61, without having the central part 62 described below (see FIG. 5(a)). The outer peripheral part 61 is provided in an area that is gripped by the grip 55 when the resin layer 30A is fixed to the support 40, as described below. In this case, the reinforcing film 60 may be made up of a single frame-shaped (square ring-shaped) outer peripheral part 61.

The reinforcing film 60 may also be composed of multiple parts. Specifically, the reinforcing film 60 may have an outer peripheral portion 61 and a central portion 62 located inside the outer peripheral portion (see FIG. 5(b)). In this case, the reinforcing film 60 has the central portion 62 and one outer peripheral portion 61, and the outer peripheral portion 61 may be formed in a frame shape (square ring shape).

4B, the reinforcing film 60 has a plurality of (four in this case) outer peripheral portions 61 and a (one in this case) central portion 62 located inside the outer peripheral portions. Each outer peripheral portion 61 extends in a band shape in a plan view. Each outer peripheral portion 61 is arranged along the four sides of the rectangle constituting the resin layer 30A. The width of the outer peripheral portion 61 (the length perpendicular to the longitudinal direction of the outer peripheral portion 61) is preferably larger than the area gripped by the grip 55, and may be, for example, 10 mm or more and 50 mm or less. The area occupied by the outer peripheral portion 61 may be 10% or more and 50% or less, or may be 10% or more and 30% or less, of the entire area of the resin layer 30A. This allows the effective area 32 to be provided widely while ensuring the necessary strength for the reinforcing film 60.

The central portion 62 is rectangular in plan view and is arranged to be surrounded by the four outer peripheral portions 61. The central portion 62 is provided in the region where the opening 31 is formed and the region where the support 40 is joined, and plays a role in protecting these regions. Specifically, the central portion 62 can prevent the resin layer 30A from being scratched or stained during the manufacturing process of the deposition mask. The central portion 62 and each outer peripheral portion 61 are spaced apart from each other, and a gap is formed between the central portion 62 and each outer peripheral portion 61. In this way, the outer peripheral portions 61 and the central portion 62, which have different functions, are spaced apart from each other and can be peeled off and removed from the resin layer 30A at different times. There is no limit to the size of the gap, but it may be, for example, 1 mm or more and 250 mm or less, or further 10 mm or more and 50 mm or less. In the bonding with the support 40 described later, when the resin layer 30A and the support 40 are bonded with the central portion 62 left, the support 40 may be in contact with the resin layer 30A through the gap. In addition, the outer peripheral portions 61 are also spaced apart from one another, forming gaps between the outer peripheral portions 61. There is no limit to the size of the gap, but it may be, for example, 1 mm or more and 20 mm or less. This makes it possible to prevent the outer peripheral portions 61 from overlapping each other while ensuring a margin for the attachment position in the attachment process of the reinforcing film 60.

The outer peripheral portion 61 and the central portion 62 of the reinforcing film 60 may be made of the same material or different materials. For example, the outer peripheral portion 61 may be made thicker than the central portion 62 to increase its physical strength. For example, the outer peripheral portion 61 may be made of a reinforcing film having a higher adhesive strength than the central portion 62, thereby increasing the adhesive strength with the resin layer 30A. For example, the central portion 62 may be made of a reinforcing film having a lower adhesive strength than the outer peripheral portion 61, thereby reducing the burden on the resin layer 30A when peeling and removing the reinforcing film. The reinforcing film 60 may be made of only a plurality of outer peripheral portions 61, without having the central portion 62.

Next, as shown in FIG. 6(a), the substrate 51 is removed from the resin layer 30A to which the reinforcing film 60 is attached. This results in an intermediate body (also called a deposition mask preparation body) having the resin layer 30A and the reinforcing film 60 on the resin layer 30A. The method for removing the substrate 51 from the resin layer 30A can be a laser lift-off method, a peeling method, a water immersion method, or the like. When using the peeling method, the resin layer 30A may be formed larger than the substrate 51 to provide a portion that triggers peeling, or a physical notch may be provided at the end of the substrate 51 to provide a portion that triggers peeling. In addition, in order to improve the handleability of the resin layer 30A, a re-peelable film for reinforcement (not shown) may be attached to the surface of the resin layer 30A after the substrate 51 is removed. In addition, a release agent may be applied to the substrate 51 in advance to make it easier to remove from the resin layer 30A.

After removing the substrate 51, the resin layer 30A may be provided with another reinforcing film 67 (virtual line) in the area where the central portion 62 was located on the side of the resin layer 30A that faced the substrate 51. In this case, the effective area 32 can be protected by the reinforcing film 67.

Next, as shown in FIG. 6(b), the central portion 62 of the reinforcing film 60 is peeled off and removed from the resin layer 30A. At this time, the outer peripheral portion 61 of the reinforcing film 60 remains on the resin layer 30A. By removing the central portion 62 of the reinforcing film 60 from the resin layer 30A in advance in this way, when the resin layer 30A is pulled by the grip 55 as described below, the central portion of the resin layer 30A can stretch in the direction in which the grip 55 pulls. This causes wrinkles in the central portion of the resin layer 30A to be smoothed out and flattened.

If a reinforcing film 67 is provided on the resin layer 30A, the reinforcing film 67 is also removed in the same manner as the reinforcing film 62.

7(a)(b), the support 40 is prepared and the resin layer 30A is fixed to the support 40. Specifically, the resin layer 30A may be joined to the resin mask 30 by the adhesive layer 35 in a stretched state. At this time, the resin layer 30A is gripped by the grips 55 through the outer peripheral portion 61 and pulled in the surface direction. In this state, the resin layer 30A is joined to the support 40 by the adhesive layer 35. At this time, a pressing member 56 may be disposed at a position on the opposite side of the support 40 with respect to the resin layer 30A, and the support 40 may be pressed against the pressing member 56. This makes it easier to join the resin layer 30A to the support 40. In addition, the outer peripheral portion 61 of the reinforcing film 60 is interposed between the grip 55 and the resin layer 30A. Therefore, unlike the case where the thin resin layer 30A is pulled alone, the resin layer 30A is stretched while the strength of the thin resin layer 30A is supplemented by the outer peripheral portion 61. This prevents the resin layer 30A from being wrinkled by being pulled by the grip 55. In contrast, if the thin resin layer 30A were pulled by itself, the film strength may be insufficient and it may tear. In this embodiment, the resin layer 30A is reinforced by the outer peripheral portion 61, so the possibility of such tearing can be reduced. The resin layer 30A and the support 40 may be fixed over the entire surface where they contact, or over a portion of the surface where they contact. The resin layer 30A may also be fixed to the support 40 without being pulled.

Methods for joining the support 40 and the resin layer 30A include, in addition to the adhesion method using the adhesive layer 35 described above, for example, a welding method in which the resin layer 30A is melted by heat, a welding method using a heat-sealing film, an adhesion method using an adhesive, a thermocompression method in which the support 40 and the resin layer 30A are thermocompressed by temperature and heat, a joining method using a thermoplastic resin, and a method in which a polyimide precursor is used instead of an adhesive.

In addition, in this embodiment, the support 40 is fixed to the surface (second surface 30b) of the resin layer 30A on which the reinforcing film 60 is provided. The surface (first surface 30a) of the resin layer 30A on which the reinforcing film 60 is not provided is the surface that was in contact with the substrate 51, and has a higher flatness than the second surface 30b. Therefore, by fixing the support 40 to the second surface 30b side of the resin layer 30A, the surface with a higher flatness (first surface 30a) can be opposed to the substrate 91 to be deposited. However, this is not limited to the above, and the support 40 may be fixed to the first surface 30a of the resin layer 30A.

In addition, in order to increase the adhesive strength between the support 40 and the resin layer 30A, at least one of the support 40 and the resin layer 30A may be subjected to a surface treatment or surface activation treatment. Examples of surface treatment include roughening treatment, which forms irregularities on the surface of the support 40 or the resin layer 30A. Specifically, the arithmetic mean height Sa of the roughness of the surface of the support 40 or the resin layer 30A may be set to 0.001 μm or more and 1 μm or less. Examples of surface activation treatment include treatment to make the surface of the support 40 or the resin layer 30A hydrophobic or hydrophilic.

In this way, as shown in FIG. 8(a), an intermediate body (also called a deposition mask device preparation body) is obtained that has the resin layer 30A, the outer peripheral portion 61 of the reinforcing film 60 formed on the resin layer 30A, and the support 40 fixed to the resin layer 30A. At this time, the support 40 is located inside the outer peripheral portion 61.

Next, as shown in FIG. 8(b), a portion 30c of the resin layer 30A located on the outer periphery of the support 40 is removed. At this time, the outer peripheral portion 61 of the reinforcing film 60 is also removed together with the portion 30c. In this case, the resin layer 30A may be cut with, for example, a blade or laser light. The cut position of the resin layer 30A is a position that corresponds to the inner side of the outer periphery 40b of the support 40 and the outer side of the inner periphery 40a of the support 40. However, this is not limited thereto, and the cut position of the resin layer 30A may be a position that corresponds to the outer periphery 40b of the support 40 or a position that corresponds to the outer periphery 40b of the support 40.

9(a), the outer periphery 30d of the resin layer 30A after cutting and the outer periphery 35a of the adhesive layer 35 may be in a position where they overlap in a plan view. Also, as shown in FIG. 9(b), the outer periphery 35a of the adhesive layer 35 may be located inside the outer periphery 30d of the resin layer 30A after cutting, and the amount δ of the outer periphery 35a of the adhesive layer 35 recessed from the outer periphery 30d of the resin layer 30A after cutting may be 0.1 mm or less. Also, as shown in FIG. 9(c), there may be no depression at the boundary between the resin layer 30A and the adhesive layer 35, and the two may be connected by a substantially flat or curved surface. That is, the outer periphery 35a of the adhesive layer 35 may extend so as to be gently curved from the outer periphery 30d of the resin layer 30A after cutting toward the outer periphery 40b of the support 40. This makes it possible to suppress the residue of the cleaning liquid when cleaning the deposition mask 10.

Next, as shown in Fig. 10(a) and (b), the resin layer 30A is irradiated with laser light (see the arrow in Fig. 10(a)) from the support 40 side to form an opening 31 in the resin layer 30A corresponding to the pattern to be formed by deposition. For example, a KrF excimer laser with a wavelength of 248 nm or a YAG laser with a wavelength of 355 nm can be used as the laser. At this time, a protective film 57 may be attached to the surface of the resin layer 30A opposite the support 40, and in this state, the opening 31 may be formed by irradiating the laser light from the support 40 side. In this case, a laser mask (not shown) corresponding to the pattern to be formed by deposition may be used, and a condenser lens may be installed between the laser mask and the resin layer 30A to form the opening 31 by a laser processing method using a so-called reduced projection optical system. As described above, the deposition mask 10 in this embodiment is configured as a membrane in which the effective area 32 of the resin mask 30 is free-standing without being supported by a metal layer. This makes it easier for the tension from the grip 55 to be transmitted to the resin mask 30, preventing wrinkles from forming in the resin mask 30.

In addition, when forming a plurality of openings 31 for each of the plurality of effective regions 32, as shown by the arrows in FIG. 11(a), a plurality of openings 31 may be formed sequentially for adjacent effective regions 32. That is, after forming a plurality of openings 31 in one effective region 32, a plurality of openings 31 may be formed in an effective region 32 adjacent to the effective region 32 in the X direction or Y direction, and by repeating this, a plurality of openings 31 may be formed in all effective regions 32. Alternatively, as shown by the arrows in FIG. 11(b), a plurality of openings 31 may be formed sequentially for non-adjacent effective regions 32. That is, after forming a plurality of openings 31 in one effective region 32, a plurality of openings 31 may be formed in an effective region 32 not adjacent to the effective region 32 in the X direction or Y direction, and by repeating this, a plurality of openings 31 may be formed in all effective regions 32. After forming a plurality of openings 31 in a certain effective region 32, it is advisable to select the effective region 32 to be processed next while observing the state of the resin layer 30A. For example, in FIG. 11(a), after processing the effective area 32 in the upper right column, the resin layer 30A is observed to check for wrinkles or the like, and the effective area 32 in the middle right column is processed. Thereafter, similar processing is performed sequentially. For example, in FIG. 11(b), after processing the effective area 32 in the upper right column, the resin layer 30A is observed to check for wrinkles or the like, and the effective area 32 in the lower left column (the effective area corresponding to the diagonal position) is processed to adjust the in-plane balance. Thereafter, similar processing is performed sequentially.

In this way, a deposition mask 10 (see Figures 1 and 2) is obtained, which includes a resin mask 30 provided with a plurality of openings 31 corresponding to the pattern to be formed by deposition, and a support 40 joined to the resin mask 30.

The manufacturing method according to this embodiment includes a step of forming a resin layer 30A on the substrate 51, but is not limited to this. For example, a resin layer 30A on which a reinforcing film 60 has been previously arranged may be prepared, and this resin layer 30A may be bonded to the support 40.

(Configuration of Vapor Deposition Apparatus)
Next, a deposition apparatus for depositing a deposition material onto a deposition target using the above-described deposition mask 10 will be described with reference to FIG.

As shown in FIG. 12, the deposition apparatus 80 has a deposition source (e.g., a crucible 81), a heater 82, and a deposition mask 10 arranged therein. The deposition apparatus 80 also has an exhaust means (not shown) for creating a vacuum atmosphere inside the deposition apparatus 80. The crucible 81 contains a deposition material 92 such as an organic light-emitting material. The heater 82 heats the crucible 81 to evaporate the deposition material 92 under a vacuum atmosphere. The deposition mask 10 is arranged to face the crucible 81. That is, the deposition mask 10 is arranged in the deposition apparatus 80 so that the resin mask 30 faces the deposition target substrate (e.g., an organic EL substrate) 91, which is the deposition target to which the deposition material 92 is attached.

Figure 13 is a cross-sectional view showing an organic EL display device 90 manufactured using the deposition device 80 shown in Figure 12. As shown in Figure 13, the organic EL display device 90 includes a deposition substrate (e.g., an organic EL substrate) 91 and pixels including a deposition material 92 arranged in a pattern on the deposition substrate 91.

When a color display using multiple colors is desired, a deposition device 80 equipped with a deposition mask 10 corresponding to each color is prepared, and the deposition substrate 91 is loaded into each deposition device 80 in turn. In this way, for example, a red organic light-emitting material, a green organic light-emitting material, and a blue organic light-emitting material can be deposited in turn onto the deposition substrate 91.

(Method of manufacturing an organic EL display device)
Next, a method for manufacturing an organic EL display device according to the present embodiment will be described with reference to Figures 14(a) to 14(c). In the method for manufacturing an organic EL display device according to the present embodiment, a deposition material 92 is deposited on a deposition target substrate 91, which is a deposition object, by a deposition method using the deposition mask 10 described above, to form a deposition pattern.

First, as shown in FIG. 14(a), a deposition apparatus 80 is prepared that includes the deposition mask 10 shown in FIG. 1 and FIG. 2, a crucible 81 that contains the deposition material 92, and a heater 82.

Next, as shown in FIG. 14(b), the substrate 91 to be deposited is placed on the resin mask 30 of the deposition mask 10. At this time, for example, the alignment mark (not shown) of the substrate 91 to be deposited and the alignment mark (not shown) of the deposition mask 10 may be directly observed, and the substrate 91 to be deposited may be positioned so that the alignment marks overlap each other while the substrate 91 to be deposited is placed on the deposition mask 10.

Next, the deposition material 92 is deposited on the deposition substrate 91 placed on the resin mask 30 of the deposition mask 10. At this time, for example, as shown in FIG. 14(c), the surface of the deposition substrate 91 opposite the deposition mask 10 is brought into close contact with the resin mask 30. Next, the heater 82 heats the crucible 81 to evaporate the deposition material 92. Then, the deposition material 92 that has evaporated from the crucible 81 and reached the deposition mask 10 passes through the opening 31 of the resin mask 30 and adheres to the deposition substrate 91.

In this manner, the deposition material 92 is deposited on the deposition substrate 91 in a desired pattern corresponding to the positions of the openings 31 in the resin mask 30. That is, the deposition material 92 is formed in a shape corresponding to the multiple openings 31 in the resin mask 30. In this manner, an organic EL display device 90 is obtained that includes a deposition substrate (e.g., an organic EL substrate) 91 and pixels including the deposition material 92 arranged in a pattern (see FIG. 13).

(Method for manufacturing an organic semiconductor element)
Next, a method for manufacturing an organic semiconductor device according to the present embodiment will be described. The method for manufacturing an organic semiconductor device according to the present embodiment includes a step of forming a deposition pattern on a deposition target using the deposition mask 10 described above, or a step of forming a deposition pattern on a deposition target using the deposition mask 10 manufactured by the method for manufacturing the deposition mask 10 described above. The step of forming a deposition pattern on a deposition target is not limited in any way, and examples of the method include physical vapor deposition methods such as reactive sputtering, vacuum deposition, ion plating, and electron beam deposition, and chemical vapor deposition methods such as thermal CVD, plasma CVD, and photo CVD.

The manufacturing method of an organic semiconductor element according to one embodiment, which has a process of forming a deposition pattern on a deposition target, includes an electrode forming process of forming an electrode on a substrate, an organic layer forming process, a counter electrode forming process, a sealing layer forming process, etc., and a deposition pattern may be formed on the substrate by a deposition method using a deposition mask 10 in each optional process. For example, when a deposition method using a deposition mask 10 is applied to each of the processes of forming the R, G, and B light-emitting layers of an organic EL device, a deposition pattern of each color light-emitting layer is formed on the substrate. Note that the manufacturing method of an organic semiconductor element according to this embodiment is not limited to these processes, and can be applied to any process of a conventionally known organic semiconductor element that uses a deposition method.

The deposition mask 10 according to the present embodiment described above can be used as is for the deposition mask 10, and detailed description here will be omitted. With the deposition mask 10 according to the present embodiment described above, an organic semiconductor element having a highly precise pattern can be formed. Examples of organic semiconductor elements manufactured by the manufacturing method according to the present embodiment include an organic layer, a light-emitting layer, and a cathode electrode of an organic EL element. In particular, the manufacturing method for an organic semiconductor element according to the present embodiment can be suitably used for manufacturing the R, G, and B light-emitting layers of an organic EL element, which requires highly precise pattern accuracy.

In this manner, according to the present embodiment, when manufacturing the deposition mask 10, a process of attaching the reinforcing film 60 onto the resin layer 30A is provided. This makes it possible to improve the handleability of the resin layer 30A in the manufacturing process of the deposition mask 10. In addition, by attaching the reinforcing film 60 onto the resin layer 30A, it is possible to prevent wrinkles from occurring in the deposition mask 10.

In addition, according to this embodiment, a step of attaching a reinforcing film 60 onto the resin layer 30A is provided. This makes it possible to suppress the occurrence of wrinkles on the outer periphery of the resin layer 30A (for example, near the grip 55) or the breakage of the resin layer 30A when the resin layer 30A is pulled in the step of fixing the resin layer 30A to the support 40 (FIGS. 7(a) and 7(b)). As a result, the resin mask 30 of the deposition mask 10 can be flattened, and the distance between the resin mask 30 and the deposition substrate 91 during deposition can be made uniform. This makes it possible to form pixels of the organic EL display device 90 with high quality.

In addition, according to this embodiment, a process is provided for removing the portion of the resin layer 30A that is located on the outer periphery of the support 40 (FIG. 8(b)). This makes it possible to remove the unnecessary portion 30c of the resin layer 30A that is located around the support 40. In addition, since the outer peripheral portion 61 of the reinforcing film 60 is also removed together with the portion 30c of the resin layer 30A, there is no need to provide a separate process for removing the outer peripheral portion 61.

Furthermore, according to this embodiment, the reinforcing film 60 includes an outer peripheral portion 61 in the area that is gripped when the resin layer 30A is fixed to the support 40. As a result, in the process of fixing the resin layer 30A to the support 40 (FIGS. 7(a) and 7(b)), the outer peripheral portion 61 can pull the resin layer 30A while maintaining the flatness of the resin layer 30A. This makes it possible to prevent wrinkles from occurring in the resin layer 30A due to pulling by the grip 55.

According to this embodiment, the reinforcing film 60 includes a central portion 62 located more centrally than the peripheral portion 61, and the central portion 62 and the peripheral portion 61 are spaced apart from each other. This central portion 62 can protect the area where the opening 31 is formed and the area where the support 40 is bonded. In addition, since the central portion 62 and the peripheral portion 61 are not integrated, the central portion 62 can be removed before the peripheral portion 61. Therefore, in the process of fixing the resin layer 30A to the support 40 (FIGS. 7(a) and 7(b)), the area of the resin layer 30A where the central portion 62 was provided is pulled, and the occurrence of wrinkles in this area can be suppressed. In addition, the support 40 can be bonded to the area of the resin layer 30A where the central portion 62 was provided.

In addition, according to this embodiment, the deposition mask 10 includes a resin mask 30 and a support 40 bonded to the resin mask 30. By configuring the resin mask 30 itself as a free-standing membrane, it is possible to suppress the occurrence of wrinkles in the resin mask 30 that would occur if there was a metal layer supporting the resin mask 30.

(Modification)
Next, various modifications of this embodiment will be described.

(Modifications of the Reinforcing Film)
15(a) and (b) are plan views showing a state in which the reinforcing film 60A according to this modification is attached onto the resin layer 30A. As shown in FIG. 15(a) and (b), the reinforcing film 60A according to this modification has a frame-shaped outer peripheral portion 61A. This outer peripheral portion 61A is arranged along the inside of the four sides of the rectangle constituting the resin layer 30A. In the part of the outer peripheral portion 61A facing inward, a notch portion 65 (FIG. 15(a)) or a slit 66 (FIG. 15(b)) is formed in a plan view, and specifically, the notch portion 65 or the slit 66 is formed in a comb-tooth shape. That is, the outer peripheral portion 61A has a peripheral edge portion 63 and a plurality of protruding portions 64 protruding inward in the planar direction from the peripheral edge portion 63. The plurality of protruding portions 64 are arranged at intervals from each other (FIG. 15(a)), or are arranged via gaps that have substantially no width (FIG. 15(b)).

In this way, the inward-facing portion of the outer peripheral portion 61A is formed in a comb-like shape in a plan view, and thus, in the process of fixing the resin layer 30A to the support 40 (FIGS. 7(a) and 7(b)), it is possible to suppress the occurrence of wrinkles in the resin layer 30A. That is, since the outer peripheral portion 61A is formed in a comb-like shape, when the resin layer 30A is pulled, the force is less likely to concentrate on a specific point in the surface of the resin layer 30A, and it is possible to suppress the occurrence of wrinkles in the resin layer 30A. When the reinforcing film 60A has long sides (sides extending in the vertical direction in FIG. 15(a) and 7(b)) and short sides (sides extending in the horizontal direction in FIG. 15(a) and 7(b)), the number of protrusions 64 present on the long sides may be greater than the number of protrusions 64 present on the short sides. The intervals between the multiple protrusions 64 may be constant, or the intervals may be locally larger or smaller.

In this modified example, the reinforcing film 60A may have multiple outer peripheral portions 61A. For example, similar to the embodiment shown in FIG. 4(b), the outer peripheral portion 61A may extend in a band shape in a plan view and be formed in a comb-like shape. In this modified example, a central portion 62 may be provided inside the outer peripheral portion 61A.

(Modification of the method for manufacturing a deposition mask)
Next, each of the modified examples of the method for manufacturing the deposition mask will be described.

In the above embodiment, (i) the process of removing the substrate 51 from the resin layer 30A (FIG. 6(a)), (ii) the process of fixing the resin layer 30A to the support 40 (FIGS. 7(a) and 7(b)), (iii) the process of removing the portion of the resin layer 30A that is located on the outer periphery of the support 40 (FIG. 8(b)), and (iv) the process of forming a plurality of openings 31 in the resin layer 30A (FIGS. 10(a) and 10(b)) are performed in this order, but the present invention is not limited to this.

For example, the steps of (iv) forming a plurality of openings 31 in the resin layer 30A, (i) removing the substrate 51 from the resin layer 30A, (ii) fixing the resin layer 30A to the support 40, and (iii) removing the portion of the resin layer 30A located on the outer periphery of the support 40 may be performed in this order. This allows the openings 31 to be formed in a state where the resin layer 30A is fixed to the support 40, so that the waviness of the resin layer 30A is suppressed by the support 40, and the openings 31 formation step can be performed stably. In this case, the step of attaching the reinforcing film 60 to the resin layer 30A may be performed between the step of forming the openings 31 and the step of removing the substrate from the resin layer 30A.

Also, (iv) a step of forming a plurality of openings 31 in the resin layer 30A, (ii) a step of fixing the resin layer 30A to the support 40, (i) a step of removing the substrate 51 from the resin layer 30A, and (iii) a step of removing a portion of the resin layer 30A located on the outer periphery of the support 40 may be performed in this order. This allows the flat surface of the resin layer 30A (the surface in contact with the substrate 51) to be protected by the substrate 51 throughout the manufacturing process of the deposition mask 10. In this case, it is not necessary to provide a step of attaching a reinforcing film 60 to the resin layer 30A.

Also, the steps of (ii) fixing the resin layer 30A to the support 40, (i) removing the substrate 51 from the resin layer 30A, (iii) removing the portion of the resin layer 30A located on the outer periphery of the support 40, and (iv) forming a plurality of openings 31 in the resin layer 30A may be performed in this order. This makes it possible to easily perform the fixing operation since waviness of the resin layer 30A is suppressed in the step of fixing the resin layer 30A to the support 40. In this case, it is not necessary to provide a step of attaching a reinforcing film 60 to the resin layer 30A.

Also, (ii) a step of fixing the resin layer 30A to the support 40, (iv) a step of forming a plurality of openings 31 in the resin layer 30A, (i) a step of removing the substrate 51 from the resin layer 30A, and (iii) a step of removing a portion of the resin layer 30A located on the outer periphery of the support 40 may be performed in this order. This makes it easier to perform the step of fixing the resin layer 30A to the support 40, and also makes it possible to stably perform the step of forming the openings 31. In this case, it is not necessary to provide a step of attaching a reinforcing film 60 to the resin layer 30A.

The multiple components disclosed in the above embodiments and modifications may be combined as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modifications.

REFERENCE SIGNS LIST 10 deposition mask 30 resin mask 30A resin layer 31 opening 32 effective area 33 peripheral area 35 adhesive layer 40 support 51 substrate 60 reinforcing film 61 peripheral portion 62 central portion

Claims (8)

providing a substrate;
forming a resin layer on the substrate;
removing the substrate from the resin layer;
fixing the resin layer to a support;
forming a plurality of openings in the resin layer corresponding to a pattern to be formed by vapor deposition;
removing a portion of the resin layer located on an outer periphery of the support. providing a substrate;
forming a resin layer on the substrate;
removing the substrate from the resin layer;
fixing the resin layer to a support;
forming a plurality of openings in the resin layer corresponding to a pattern to be formed by vapor deposition;
and attaching a reinforcing film onto the resin layer.
In the step of removing the substrate, the substrate is removed from the resin layer to which the reinforcing film is attached,
The reinforcing film includes an outer peripheral portion in a region that is gripped when the resin layer is fixed to the support. The method for manufacturing a deposition mask according to claim 2, wherein the reinforcing film includes a central portion located inside the outer peripheral portion, and the central portion and the outer peripheral portion are spaced apart from each other. The method for manufacturing a deposition mask according to claim 2 or 3, wherein the part of the outer periphery facing inward is formed in a comb-like shape in a plan view. The method for manufacturing a deposition mask according to any one of claims 1 to 4, wherein the thickness of the resin layer is 1 μm or more and 5 μm or less. A method for manufacturing an organic electroluminescence display device, comprising the steps of:
A method for manufacturing an organic electroluminescence display device, comprising: forming a deposition pattern on a deposition target by using the deposition mask manufactured by the method for manufacturing a deposition mask according to claim 1 . preparing a deposition mask manufactured by the method for manufacturing a deposition mask according to claim 1 ;
preparing a deposition object;
placing the deposition object on the deposition mask;
and depositing a deposition material onto the deposition target placed on the deposition mask. A method for manufacturing an organic semiconductor device, comprising the steps of:
A method for manufacturing an organic semiconductor element, comprising: forming a deposition pattern on a deposition target by using a deposition mask manufactured by the method for manufacturing a deposition mask according to claim 1 .

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