JP7571688B2 - Soldering Equipment - Google Patents

Description

The present invention relates to a device that uses a head with a heating mechanism to heat a workpiece and solder it to an object to be joined.

Conventionally, there is known a device that heats and presses an electronic component against a workpiece to bond the electronic component to the workpiece.

JP 2001-358455 A

In this method, while pressing the electronic component and the board together, electricity is passed through the ceramic heater to generate heat, and the electronic component is heated via the thermocompression tool. This raises the temperature of the joint between the electrodes of the electronic component and the board according to a heating pattern, and when the joint reaches a predetermined temperature, the solder bumps melt and the solder joint is formed by thermocompression. In the cooling process, air is blown onto the top surface of the ceramic heater to cool it down.

As a result, there was a delay in the temperature response when the temperature was increased and decreased during the heating and cooling processes.

The present invention was made in consideration of the above-mentioned problems, and its purpose is to provide a soldering device that can heat and cool a workpiece with high efficiency during the process of heating, soldering, and cooling the workpiece when soldering.

The soldering apparatus of the present invention is a soldering apparatus which applies solder (2) to the upper surface of an object to be joined (3), and lowers a workpiece (1) from above the solder to join the workpiece to the object to be joined via the solder, and which comprises first suction means (25, 26, 27) which sucks the upper surface of the workpiece with air to float the workpiece, a heating head body (20) which has the first suction means and temperature sensors (13, 14) which can detect the temperature of the workpiece in order to regulate the temperature of the workpiece, and which can be raised and lowered until it abuts on the upper surface of the workpiece, and a first drive unit (28) which drives the heating head body so that it can be raised and lowered up and down. , 29), a second suction means (35, 36) operable independently of the first suction means and sucking the upper surface of the workpiece with air to lift the workpiece, a cooling head body (30) having the second suction means and a cooling device (32) capable of cooling the workpiece, operable independently of the heating head body and capable of being raised and lowered until it abuts against the upper surface of the workpiece, a second drive unit (38, 39) driving the cooling head body so that it can be raised and lowered vertically, and a heater (15, 16, 17, 18, 19) provided on the heating head body and heating the heating head body.

With this soldering device, the cooling head body operates to cool the workpiece and lower its temperature independently of the operation of the heating head body and without being affected by the heat of the heating head. This allows the workpiece to be switched from heating to cooling in a short time. The thermal efficiency of raising and lowering the temperature of the workpiece is good.

1 is a front view showing a configuration of a soldering device according to a first embodiment; FIG. 2 is a partially enlarged view of FIG. FIG. 2 is a view taken along the line III in FIG. 1 . FIG. 4 is a partially enlarged view of FIG. 3 . 4 is a cross-sectional view taken along line VV in FIG. 3. 6 is a cross-sectional view taken along line VI-VI in FIG. 2. 7 is a cross-sectional view taken along line VII-VII of FIG. 5. FIG. 8 is a view taken along the arrow VIII in FIG. 5 . 1A and 1B are diagrams showing a workpiece used in the first embodiment, in which FIG. 1A and 1B are diagrams for explaining the operation of the soldering device of the first embodiment, in which FIG. 1A is a schematic cross-sectional view showing a first step, and FIG. 1B is a front view showing the state of a workpiece in the first step. 5A and 5B are diagrams for explaining the operation of the soldering apparatus of the first embodiment, in which FIG. 5A is a schematic cross-sectional view showing a second step, and FIG. 5B is a front view showing the state of a workpiece in the second step. 5A and 5B are diagrams for explaining the operation of the soldering apparatus of the first embodiment, in which (A) is a schematic cross-sectional view showing a third step, and (B) is a front view showing the state of a workpiece in the third step. 10A and 10B are diagrams for explaining the operation of the soldering device of the first embodiment, in which FIG. 10A is a schematic cross-sectional view showing a fourth step, and FIG. 10B is a front view showing the state of a workpiece in the fourth step. 10A and 10B are diagrams for explaining the operation of the soldering device of the first embodiment, in which FIG. 10A is a schematic cross-sectional view showing a fifth step, and FIG. 10B is a front view showing the state of a workpiece in the fifth step. 11A and 11B are diagrams for explaining the operation of the soldering apparatus of the first embodiment, in which (A) is a schematic cross-sectional view showing a sixth step, and (B) is a front view showing the state of a workpiece in the sixth step. FIG. 11 is a characteristic diagram showing an example of temperature control of the soldering apparatus of the second embodiment. FIG. 11 is a perspective view showing the configuration of a lower part of a soldering device according to a third embodiment. FIG. 11 is a front view showing the configuration of a soldering device according to a third embodiment, the front view corresponding to FIG. FIG. 11 is a plan view showing the configuration of a soldering device according to a third embodiment. This is a cross-sectional view taken along line XX-XX in Figure 19. This is a cross-sectional view taken along line XXI-XXI of Figure 19. 10A to 10C are schematic cross-sectional views illustrating the operation of the soldering device of the third embodiment. 10A to 10C are schematic cross-sectional views illustrating the operation of the soldering device of the third embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a soldering apparatus according to the present invention will be described below with reference to the drawings. In the following, in a number of embodiments, substantially the same components are designated by the same reference numerals, and description thereof will be omitted.
First Embodiment

The soldering device of the first embodiment of the present invention will be described by way of an example in which the workpiece 1 as the emitter shown in FIG. 9 is joined to the collector 5 side. In this case, the semiconductor element 4 and the spacer 3 as the object to be joined are layered in that order on the upper surface of the collector 5, and the workpiece 1 is soldered to the spacer 3.

The workpiece 1 in the state before joining shown in FIG. 10(A) progresses through the states shown in FIG. 11(A) to FIG. 12(A), FIG. 13(A), and FIG. 14(A) to the state after solder joining shown in FIG. 15(A).

The soldering device will be described with reference to Figs. 1 to 8. The soldering device 10 is equipped with a heating head 11 for heating the workpiece 1 and a cooling head 31 for cooling the workpiece 1. In this embodiment, the joint on the collector 5 side is placed on the upper surface of a heater 50 for heating the solder 2.

The heating head 11 has its heating head body 20 vertically and horizontally positioned by a movable device 24 consisting of a heating side first loader 28 and a heating side second loader 29 perpendicular to the heating side first loader 28. The heating side first loader 28 and the heating side second loader 29 correspond to the first drive unit described in the claims.

The heating head 11 has suction tubes 25, 26, 27 as first suction means capable of suctioning and releasing the workpiece 1 by air pressure, ceramic heaters 15, 16, 17, 18, 19 as heating devices for heating the heating head body 20, sheath-type thermocouples 21, 22 as head temperature sensors for adjusting the temperature of the heating head body 20, and contact thermocouples 13, 14 as contact temperature sensors for adjusting the temperature by contacting the workpiece 1. The contact thermocouples 13, 14 correspond to the first temperature sensors described in the claims.

When the suction tubes 25, 26, 27 are turned off and the heating head 11 is not holding the workpiece 1, the ceramic heaters 15, 16, 17, 18, 19 can be turned on to preheat the workpiece 1. When the suction tubes 25, 26, 27 are turned on and the workpiece 1 is held, the sheathed thermocouples 21, 22 are turned off and the contact thermocouples 13, 14 are turned on, and the contact thermocouples 13, 14 are brought into contact with the workpiece 1, allowing for highly accurate temperature control of the workpiece 1. The sheathed thermocouples 21, 22 correspond to the second temperature sensor described in the claims.

The cooling head 31 has its cooling head body 30 vertically and horizontally position-controlled by a movable device 34 consisting of a cooling-side first loader 38 and a cooling-side second loader 39 perpendicular to the cooling-side first loader 38. The cooling-side first loader 38 and the cooling-side second loader 39 correspond to the second drive unit described in the claims.

The cooling head 31 has a cooling device consisting of suction pipes 35, 36 as second suction means capable of suctioning and releasing the workpiece 1 by air pressure, and a cooling water pipe 32. The cooling head 31 performs the suction and release operations to lift the workpiece 1 by the suction pipes 35, 36 of the workpiece 1, independently of the similar operations of the heating head 11, by using a movable device 34 consisting of a cooling side first loader 38 and a cooling side second loader 39.

The cooling head 31 is designed to be unaffected by heat separated from the heating head 11 when cooling the cooling head body 30 and the workpiece 1, and is unaffected by the ceramic heaters 15, 16, 17, 18, 19 and the sheathed thermocouples 21, 22. The cooling head 31 cools and cools the workpiece 1 independently of the operation of the heating head 11, which heats and increases the temperature of the workpiece 1. This allows the workpiece to be switched from heating to cooling (fastest temperature increase and decrease) in a short time. The thermal efficiency is good when raising and lowering the temperature of the workpiece 1. As shown in FIG. 9, the configuration is highly accurate because two workpieces 1 can be solder-joined simultaneously to the collector 5 side.

Next, the steps of the soldering operation from soldering preparation to completion of soldering will be explained in order based on Figures 10 to 15.

<First step>
An example of joining the work 1 to the collector 5 side will be described below, as shown in Fig. 10. A semiconductor element 4 and a spacer 3 are layered in this order on the upper surface of the collector 5, and the work 1 is soldered to the spacer 3. The work 1 is carried into a soldering device 10. The work 1 is carried below the work 1 and above the solder 2 on the spacer 3 on the collector 5 side.

The soldering device 10 is equipped with a heating head 11 for heating the work 1 and a cooling head 31 for cooling the work 1. The heating head body 20 is located lower than the cooling head body 30. The collector 5 side, which serves as the object to be joined, is placed on the heater 50 below the heating head body 20 and the cooling head body 30.

<Second step>
As shown in FIG. 10 , the heating head body 20 descends toward the workpiece 1 placed separately above the solder 2, and as shown in FIG. 11 , when it comes into contact with the workpiece 1, the suction tubes 25, 26, and 27 are turned on and the workpiece 1 is sucked in the direction of the arrow 7 and adsorbed to the underside of the heating head body 20.

<Third step>
12, with the workpiece 1 held by the heating head body 20, the heating head 11 heats the workpiece 1 by thermal conduction in the direction of the arrow 8 and lowers to melt the solder 2 and form a solder joint.

<Fourth step>
Next, as shown in FIG. 13 , the cooling head 31 is lowered, the underside of the cooling head body 30 is brought into contact with the workpiece 1, and the suction tubes 35, 36 are turned on to suck air in the direction of the arrow 9, switching the workpiece 1 to simultaneous suction by the heating head 11 and the cooling head 31.

<Fifth step>
14, heat is removed in the direction of arrow 41 to promote cooling and increase the solder joining speed. The suction tubes 25, 26, and 27 of the heating head 11 are turned off and the heating head 11 is lifted from the workpiece 1. This switches to suction by the cooling head 31, and at the same time the cooling water tube 32 of the cooling head 31 is turned on to promote cooling of the workpiece 1 and the solder 2 joined to it.

<Sixth step>
15, when the soldering is completed, the suction tubes 35, 36 of the cooling head 31 are turned off to stop suction of the work 1, the cooling head 31 is separated from the work 1, and the operation of the device is stopped. With the above, the soldering is completed.

In this embodiment, the heating head 11 and the cooling head 31 are driven by different driving devices, and the suction and heating operation of the workpiece 1 and the suction and cooling operation of the workpiece 1 are performed independently, so the heating operation and the cooling operation can be switched quickly by controlling the switching operation. Therefore, the workpiece 1 can be heated, soldered, and cooled quickly and efficiently, the thermal efficiency can be improved, and the workpiece 1 and the spacer 3 as the object to be joined can be joined quickly with the solder 2.

In the above-described embodiment, the suction tubes 35, 36 of the cooling head 31 are turned on before the suction tubes 25, 26, 27 of the heating head 11 are switched from on to off, and the reception of the workpiece 1 is switched from the heating head 11 to the cooling head 31, so that the accuracy of the soldering joint positions of two workpieces 1 can be improved at the same time.

In this embodiment, the position of the workpiece 1 is determined by suction with the suction tubes 25, 26, and 27 of the heating head 11, and then, while continuously lifting, the workpiece 1 is simultaneously suctioned with the suction tubes 35 and 36 of the cooling head 31, improving positional accuracy.

According to the soldering device of this embodiment, heating and cooling are independent of each other, so there is little temperature change in the heating head 11 and the cooling head 31, and cycleability is good. In addition, because the work 1 is heated by directly detecting the temperature using contact thermocouples 13 and 14, defects are unlikely to occur. Because the solder 2 is cooled rapidly, voids are unlikely to occur, and there is an effect of improving the solder quality.

Furthermore, the furnace-less structure contributes to space saving, energy saving and reduced equipment costs, and the soldering equipment can be made compact, which has the added benefit of making it easier to maintain.

Second Embodiment
The soldering apparatus according to the second embodiment of the present invention uses the apparatus according to the first embodiment shown in FIGS. 1 to 8, and its operation is as shown in FIGS.
A semiconductor element and a spacer as an object to be bonded are formed in a layered structure in this order on the upper surface of the collector, and an emitter is conveyed above the spacer and lowered, and the emitter is soldered to the upper surface of the spacer.
In this soldering process, the respective elements of the heating head, emitter, collector and cooling head are temperature controlled for a solder melting temperature of 229° C., for example as shown in FIG.

Here, the heating head target temperature is T1, the preheating target temperature for preheating the emitter is T2, the melting holding upper limit temperature is T3, the preheating target temperature for preheating the collector is T4, and the cooling head temperature is T5.

1 to 8, the soldering device includes a heating head 11 for heating an emitter as a work 1, and a cooling head 31 for cooling the emitter. In this embodiment, the joint on the collector 5 side is placed on the upper surface of a heater 50 for heating the solder 2.
Next, a specific embodiment of the temperature control will be described by way of example.

(1) Preheating process:
In the preheating step, the temperatures of the emitter and collector are adjusted as follows.
The emitter is heated by a second preheater 52 .
The collector as the part to be joined is heated by a heater such as a first preheater 50. The collector is adjusted to a preheat target temperature T4, for example, 220° C. or lower.

(2) Work lift process:
In the process of holding and lifting the emitter sucked by the heating head, the heating head is set to a heating head target temperature T1, for example, 310° C. At this time, the emitter heated by the heating head is adjusted to a preheat target temperature T2, for example, 290° C., which is equal to or higher than the solder melting temperature of 229° C.
The collector is adjusted to a preheat target temperature T4, for example, 220° C. or less.

(3) Heating process (solder melting process):
In the process of melting the solder, the heating head is lowered above the collector side. This removes heat from the emitter while heating the solder on the top surface of the spacer on the collector side. This melts the solder and bonds the emitter and spacer.
When melting, the emitter is kept at a melting holding temperature, for example, in the range of 250 to 270° C. When melting, the temperature on the collector side rises instantly.

After the solder has melted, the temperature of the solder is lowered to solidify the solder, and the temperatures of the emitter, spacer, semiconductor element, and collector are also lowered.
Thereafter, the solder is maintained at a preheat target temperature T4, for example 220°C, which is lower than the solder melting temperature of 229°C.
This bonds the emitter to the spacer on the collector side via solder.
The heating head temperature is set to 310°C to achieve the target height of the emitter relative to the collector when solidified, and the collector temperature is set to 220°C to complete the emitter bonding, and the molten hold temperature is set to 260°C to pull up the emitter bonding solder.

(4) Delivery process:
The cold head is then lowered to hold the emitter, and the means for holding the emitter is then switched from the hot head to the cold head, which removes heat from the emitter.
The heating head releases the emitter from its hold, and the means for holding the emitter is switched from the heating head to the cooling head, and the process switches from applying heat to the solder to removing heat from it.

(5) Temperature decreasing step:
Next, in the process of solidifying the solder, a cooling head holds the emitter and removes heat from the solder through the emitter, causing the solder to solidify rapidly.
The heating head is heated in preparation for the next step.
As described above, the cycle from the preheating step to the temperature decreasing step is repeated.

As described above, when the solder is melted, heat is applied to the solder from above to melt the solder, and when the solder is solidified, heat is removed from the solder from above to solidify the solder.
In this embodiment, two temperature sensors for temperature control are provided in the heating head, and sensor switching, temperature control temperature setting switching, and forced heater output cut-off are performed.

(i) Before emitter adsorption: The head temperature sensor adjusts the temperature to 310°C.
(ii) When the emitter is adsorbed: the sensor is switched and the emitter temperature sensor is adjusted to 290°C.
(iii) When the emitter is brought into contact with the solder: the temperature is adjusted to 260°C.
(iv) When the cooling head is in contact with the emitter: the heating head heater output is set to 0%.
(v) Emitter open: The sensor switching head temperature sensor is adjusted to 310°C.

In this way, heat is forcibly given to the emitter, and then heat is forcibly taken away from the emitter.

Third Embodiment
The soldering device of the third embodiment of the present invention uses the device of the first embodiment shown in FIGS. 1 to 7 for the configuration on the head side above the workpiece, and its operation is as shown in FIGS.
In this third embodiment, the configuration on the head side and the configuration on the block side are combined to achieve high speed and high cycle performance in heating and cooling the workpiece.

As shown in Figures 17 to 21, the soldering device of this third embodiment has separate heating and cooling functions for the block side configuration below the workpiece.

The schematic diagram of the configuration of the soldering device of the third embodiment is shown in FIG. 22(A). The operation of this soldering device is in the order of FIG. 22(A), (B), (C), (D), FIG. 23(E), (F), (G).

A semiconductor element 4, which corresponds to the object to be bonded, and a spacer 3, which corresponds to the object to be bonded, are formed in this order in a layered structure on the upper surface of a collector 5, which corresponds to the object to be bonded. An emitter 1, which corresponds to the workpiece, is lowered and transported above the spacer 3, and the emitter 1 is soldered to the upper surface of the spacer 3 via solder 2.

The configuration of the soldering device above the work is basically the same as that of the first embodiment, and includes a heating head 11 for heating an emitter as the work 1, and a cooling head 31 for cooling the emitter.
FIG. 17 shows the configuration of the lower part of the workpiece, and omits the configuration of the upper part of the workpiece.

As shown in FIGS. 17 to 21, a soldering apparatus 80 of the third embodiment includes a heating block body 60 and a cooling block body 70 instead of the heater 50 of the first embodiment.
The soldering device 80 basically comprises a heating block body 60 that heats the collector 5, and a cooling block body 70 that cools the collector 5. As shown in Figures 22 and 23, the cooling block body 70 has a fixed level L at which it can support the lower surface of the collector 5. Meanwhile, the heating block body 60 is capable of reciprocating up and down relative to the cooling block body 70 by a movable device 88 (third drive unit).

The heating block body 60 is vertically position-controlled by the movable device 88. The movable device 88 corresponds to the third drive unit described in the claims.

The heating block body 60 has a suction tube 65 as a fourth suction means capable of suctioning and releasing the collector 5 by air pressure, a ceramic heater 62 as a heating device for heating the heating block body 60, a sheath-type thermocouple 63 as a head temperature sensor for adjusting the temperature of the heating block body 60, and a contact thermocouple 83 as a contact temperature sensor for adjusting the temperature by contacting the collector 5. The contact thermocouple 83 corresponds to the third temperature sensor described in the claims.

When the suction tube 65 is turned off and the collector 5 is not being held, the heating block body 60 can be preheated by turning on the ceramic heater 62. Also, when the suction tube 65 is turned on and the collector 5 is being held, the sheathed thermocouple 63 is turned off, the contact thermocouple 83 is turned on, and the contact thermocouple 83 is brought into contact with the collector 5, allowing for highly accurate temperature control of the collector 5. The sheathed thermocouple 63 corresponds to the fourth temperature sensor described in the claims.

The cooling block body 70 has a fixed position level L.

The cooling block body 70 has a cooling device consisting of an adsorption tube 75 as a third suction means capable of adsorbing and detaching the collector 5 by air pressure, and cooling water tubes 77 and 78. The cooling block body 70 performs the adsorption and detachment operations of the collector 5 by the adsorption tube 75 independently from the similar operations of the heating block body 60.

The cooling block body 70 also has heating and cooling devices 72 and 73 that can raise and lower the temperature and correspond to the fifth temperature sensor. The heating and cooling devices 72 and 73 consist of a cartridge heater (cooling side heating mechanism) and a sheath-type thermocouple (cooling side block temperature control sensor).

The cooling block body 70 and the cooling of the collector 5 are designed to be unaffected by heat separated from the heating block body 60, and are not affected by the ceramic heater 62 and the sheathed thermocouple 63. The cooling block body 70 cools and cools the collector 5 independently of the operation of the heating block body 60, which heats and warms the collector 5. This allows the speed of switching from collector heating to collector cooling (fastest temperature rise and fall) to be achieved in a short time. It has good thermal efficiency in raising and lowering the temperature of the collector 5.

The cooling block body 70 or the heating block body 60 is capable of supporting the collector 5 .
<First step>

As shown in FIG. 22(A), an example of joining the workpiece 1 to the collector 5 side will be described. The semiconductor element 4 and spacer 3 are layered in this order on the top surface of the collector 5, and the workpiece 1 is soldered to the spacer 3. The workpiece 1 is carried into the soldering device 10. The workpiece 1 is transported below the workpiece 1 and above the solder 2 on the spacer 3 on the collector 5 side.

The soldering device 10 is provided with a heating head 11 for heating the work 1 and a cooling head 31 for cooling the work 1 on the upper side of the work, and a heating block body 60 for heating the collector 5 and a cooling block body 70 for cooling the collector 5 on the lower side of the work.

The heating head body 20 is located at a lower position than the cooling head body 30. The collector 5, which serves as an object to be bonded, is placed on the heating block body 60 below the heating head body 20 and the cooling head body 30. The collector 5 is sucked by the heating block body 60 in the direction of the arrow 90 using a suction tube 65. The heating block body 60 is located at a higher position than the cooling block body 70.
<Second step>

The heating head body 20 descends toward the workpiece 1 placed separately above the solder 2, and when it comes into contact with the workpiece 1 as shown in FIG. 22(B), the suction tubes 25, 26, and 27 are turned on and the workpiece 1 is sucked in the direction of arrow 7 and adsorbed to the underside of the heating head body 20.
<Third step>

Next, as shown in FIG. 22C, with the workpiece 1 adsorbed to the heating head body 20, the workpiece 1 is heated by thermal conduction from the heating head 11 in the direction of the arrow 8 and is lowered to melt the solder 2 and form a solder joint.
<Fourth step>

Next, as shown in FIG. 22 (D), the heating block body 60 is lowered, the upper surface of the cooling block body 70 is brought into contact with the collector 5, and the suction tube 75 is turned on to suck air in the direction of the arrow 91, thereby switching the suction of the collector 5 from that of the heating block body 60 to that of the cooling block body 70.
<Fifth step>

Next, as shown in FIG. 23(E), the cooling head 31 is lowered, the underside of the cooling head body 30 is brought into contact with the workpiece 1, and the suction tubes 35, 36 are turned on to suck air in the direction of the arrow 9, switching the workpiece 1 to simultaneous suction by the heating head 11 and the cooling head 31.
The cooling block body 70 supports the collector 5 and sucks the collector 5 by means of a suction tube 75 .
<Sixth step>

23(F), heat is removed in the direction of arrow 41 to promote cooling and increase the solder joining speed. The suction tubes 25, 26, and 27 of the heating head 11 are turned off and the heating head 11 is lifted from the workpiece 1. This switches to suction by the cooling head 31, and at the same time the cooling water tube 32 of the cooling head 31 is turned on to promote cooling of the workpiece 1 and the solder 2 joined to it.
<Seventh step>

When the soldering is completed, as shown in Fig. 23(G), the suction tubes 35, 36 of the cooling head 31 are turned off to stop suction of the workpiece 1, the cooling head 31 is separated from the workpiece 1, and the operation of the device is stopped. With the above, the soldering is completed.
Other Embodiments

In the first embodiment, a heater was installed on the underside of the collector, but the present invention also allows for an embodiment in which this heater is not installed.

The solder bonding apparatus according to the first embodiment of the invention has been described with reference to an example of a workpiece in which an emitter is bonded to a collector side, but the bonding object and the bonded object in the present invention are not limited to this example.
In the description of the second embodiment, specific control temperatures such as T1, T2, and the cooling temperature 220° C. are shown in FIG. 16, but the present invention is not limited to these specific temperature indications.

The present invention also includes an embodiment in which the heating and cooling functions are separated only for the lower part of the workpiece, thereby achieving faster heating and cooling of the workpiece and higher cycle performance.

The present invention is not limited to the above-mentioned embodiment, and can be implemented in various forms without departing from the spirit of the invention.

1: Emitter (workpiece),
2: solder,
5: Collector (object to be bonded),
10: soldering equipment,
11: heating head,
13, 14: Contact thermocouple (temperature sensor),
15, 16, 17, 18, 19: Ceramic heater (heater),
20: Heating head body,
21, 22: sheathed thermocouple (temperature sensor),
25, 26, 27: adsorption tube (first suction means),
28: heating side first loader (first driving unit),
29: Heating side second loader (first driving unit),
30: Cooling head body,
31: cooling head,
32: Cooling water pipe (cooling device),
35, 36: Adsorption tube (second suction means),
38: Cooling side first loader (second drive unit),
39: Cooling side second loader (second drive unit),
50: heater (heating device, first heater);
52: second preheater,
60: Heating block body,
62: Ceramic heater (fourth temperature sensor),
63: Sheathed thermocouple (fourth temperature sensor),
65: Adsorption tube (fourth suction means),
70: Cooling block body,
72, 73: Heating/cooling device (fifth temperature sensor),
75: Adsorption tube (third suction means),
83: Contact thermocouple (third temperature sensor),
88: Third drive unit.

Claims (11)

A soldering apparatus that applies solder (2) to an upper surface of an object to be joined (3), and lowers a workpiece (1) from above the solder to join the workpiece to the object to be joined via the solder,
a first suction means (25, 26, 27) for sucking the upper surface of the workpiece with air to lift the workpiece;
a heating head body (20) having the first suction means and a temperature sensor (13, 14) capable of detecting the temperature of a workpiece in order to adjust the temperature of the workpiece, and capable of ascending and descending until it abuts on an upper surface of the workpiece;
a first drive unit (28, 29) that drives the heating head body so that it can be raised and lowered up and down;
A second suction means (35, 36) that can operate independently of the first suction means and that sucks the upper surface of the workpiece with air to lift the workpiece;
a cooling head body (30) having the second suction means and a cooling device (32) capable of cooling the workpiece, operable independently of the heating head body, and capable of ascending and descending until it abuts against an upper surface of the workpiece;
a second drive unit (38, 39) that drives the cooling head body so that it can be raised and lowered vertically;
A soldering apparatus comprising: a heater (15, 16, 17, 18, 19) provided on the heating head body and configured to heat the heating head body. The soldering device according to claim 1, wherein the temperature sensor of the heating head body is a first temperature sensor (13, 14) that detects the temperature of the workpiece, and the workpiece temperature is controlled based on this first temperature sensor. The soldering device according to claim 2, wherein the heating head body is provided with a second temperature sensor (21, 22) that detects the temperature of the heating head body. The soldering device according to any one of claims 1 to 3, wherein the first suction means and the second suction means have a mechanism for sucking a predetermined area of the upper surface of the workpiece onto a surface that can contact the workpiece. The soldering device according to any one of claims 1 to 4, wherein the heating head body has a pair of legs (41, 42) capable of simultaneously sucking two workpieces, one of the legs (41) has the first heater (15, 16) and the other leg (42) has the second heater (18, 19). The soldering device according to any one of claims 1 to 5, which is provided with a heater (50) that heats the workpiece below the work. a step of preheating a work held by a heating head to a temperature equal to or higher than a solder melting temperature;
a step of lowering the workpiece onto an object to be joined having an upper surface coated with solder, and joining the workpiece via the solder;
switching the means for holding the workpiece from a heating head to a cooling head;
a step of removing heat from the workpiece by the cooling head. a third suction means (75) for sucking the lower surface of the workpiece with air and fixing the workpiece;
a cooling block body (70) having the third suction means and a heating and cooling device (72, 73) capable of heating and cooling the object to be bonded and capable of supporting the object to be bonded below the object to be bonded;
a heating block body (60) having a fourth suction means (65) capable of operating independently of the third suction means, sucking the lower surface of the workpiece and fixing the workpiece, and capable of contacting the workpiece to support and heat it;
a third drive unit (88) that drives the heating block body so that it can be raised and lowered vertically;
2. The soldering apparatus according to claim 1, further comprising a third temperature sensor (83) capable of detecting the temperature of the workpiece in order to adjust the temperature of the workpiece. The soldering device according to claim 8, further comprising a fourth temperature sensor (62) for detecting the temperature of the heating block body. The soldering device according to claim 8, further comprising a fifth temperature sensor (72, 73) for detecting the temperature of the cooling block body. In addition to the steps as claimed in claim 7,
a step of heating the workpiece from below by a heating block before joining the workpiece and the workpiece;
switching a means for supporting the object to be bonded from the heating block to a cooling block;
8. The soldering method according to claim 7, further comprising the step of: after switching from the heating block to the cooling block, the cooling block removes heat from the workpiece.

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