JP7555256B2 - Electronic device and display device - Google Patents

Description

The present invention relates to electronic devices and display devices.

In electronic devices, heat sinks for dissipating heat from substrates and the like are known. For example, Patent Document 1 discloses a configuration in which an upper heat sink 107, a single-layer wiring substrate 103, and a chassis 501 are connected by a connecting member 111 in a semiconductor device.

JP 2008-203376 A

In conventional technology, the dimensions and shape of the heat sink provided on the board are determined according to the dimensions and shape of the board. However, the size of the board varies depending on the manufacturer, model, etc. Therefore, there is a problem in that if the board changes, the heat sink needs to be redesigned.

One aspect of the present invention aims to standardize heat sinks for various types of substrates.

In order to solve the above problem, an electronic device according to one aspect of the present invention includes a housing, a heat sink supported by the housing, and a substrate supported by the heat sink and disposed at a distance from the housing.

According to one aspect of the present invention, it is possible to standardize the heat sink for various types of substrates.

1A and 1B are a cross-sectional view and a top view of a heat sink illustrating a configuration of an electronic device according to a first embodiment of the present invention. FIG. 2 is a top view showing the appearance of a heat sink and a substrate according to the first embodiment of the present invention. FIG. 11 is a cross-sectional view showing a configuration of an electronic device according to a second embodiment of the present invention. FIG. 11 is a cross-sectional view showing a configuration of an electronic device according to a third embodiment of the present invention. FIG. 11 is a cross-sectional view showing a configuration of an electronic device according to a fourth embodiment of the present invention.

[Embodiment 1]
Hereinafter, the first embodiment of the present invention will be described in detail.

Figure 1 shows a cross-sectional view of the configuration of an electronic device 1 according to this embodiment, and a top view of a heat sink 3.

As shown in the upper diagram of FIG. 1, electronic device 1 includes a BL (Back Light) chassis (housing) 2, a heat sink 3, a substrate 4, a TCONIC (Timing CONtroller IC) 5, and a heat dissipation sheet 6. Electronic device 1 is, for example, a part of a display (display device) 100 of a television receiver. In other words, the display 100 includes electronic device 1.

The BL chassis 2 is a chassis that holds a backlight for an LCD television. The BL chassis 2 is made of iron, for example, and supports the heat sink 3. Note that the chassis is not limited to the BL chassis 2 and may be another housing. For example, if the display device is a self-luminous device that does not use a backlight, an example of a housing that can replace the BL chassis 2 may be a structural frame for holding the display unit, or a resin structure prepared to support the heat sink 3.

The heat sink 3 is a metal plate member installed to dissipate heat from the board 4 and the TCONIC 5. The heat sink 3 is made of, for example, aluminum, copper, iron, etc., and is supported by the BL chassis 2. The board 4 is, for example, a PCB (Printed Circuit Board). The board 4 is supported by the heat sink 3 and is positioned at a distance from the housing 2.

TCONIC 5 is a liquid crystal timing controller IC and is installed on substrate 4. TCONIC 5 is the main heat source. Heat dissipation sheet 6 is a sheet for dissipating heat from substrate 4 and is placed between TCONIC 5 and heat sink 3.

This allows the heat sink 3 to be standardized for various types of substrates 4. Therefore, the mold for the heat sink 3 can be standardized.

Next, in the electronic device 1, the heat sink 3 has a plurality of insertion holes 31. The substrate 4 has insertion holes 41 that correspond to some of the plurality of insertion holes 31. The electronic device 1 further includes an insertion member 7 that fits into the insertion hole 31 of the heat sink 3 and the insertion hole 41 of the substrate 4 that corresponds to the insertion hole 31. The insertion member 7 is, for example, a screw, a rivet, resin, etc.

As shown in the upper diagram of FIG. 1, the heat sink 3 has four insertion holes 31. The substrate 4 has insertion holes 41 that correspond to the two inner insertion holes 31a among the four insertion holes 31.

This allows the substrate 4 to be fixed to the heat sink 3.

In the electronic device 1, the BL chassis 2 has a boss B protruding from the surface of the BL chassis 2. The boss B is a convex-shaped member having a screw hole, a hole for fitting a pin, etc. The heat sink 3 has an insertion hole 31. The electronic device 1 further includes an insertion member 8 that fits into the boss B and the insertion hole 31.

In the upper diagram of FIG. 1, the insertion member 8 fits into the boss portion B1 located on the outside and the insertion hole 31b of the heat sink 3. On the other hand, in the middle diagram of FIG. 1, the boss portion B2 located on the inside of the boss portion B1 fits into the insertion hole 31c of the heat sink 3. In this way, the boss portion B can be positioned anywhere on the BL chassis 2 as long as it is within the range of the heat sink 3.

By providing the boss portion B on the BL chassis 2, it is possible to ensure a gap between the BL chassis 2 and the board 4 supported by the heat sink 3. The position of the boss B is not limited, and the insertion hole 31 can be drilled at any position on the heat sink 3, so the heat sink 3 can be positioned to match the position of the boss B on the BL chassis 2. Therefore, the position where the heat sink 3 and the board 4 are fixed can be set arbitrarily. This allows the position of the boss B on the BL chassis 2 to be standardized.

The lower diagram in Figure 1 is a top view showing an example of a heat sink 3. As shown in the lower diagram in Figure 1, the heat sink 3 has multiple insertion holes 31 in the vertical and horizontal directions.

Figure 2 is a top view showing the appearance of the heat sink 3 and substrate 4 according to this embodiment. As shown in the middle diagram of Figure 2, the heat sink 3 is larger than the substrate 4a, i.e., it is longer than the substrate 4a in both the vertical and horizontal directions, and covers the entire substrate 4a. On the other hand, as shown in the lower diagram of Figure 2, the heat sink 3 is shorter than the substrate 4b in the vertical direction, but longer than the substrate 4b in the horizontal direction. Therefore, the heat sink 3 does not cover the entire substrate 4b, but covers most of it. It is sufficient that the heat sink 3 covers almost all of the substrate 4b.

In addition, by providing multiple insertion holes 31 in advance in the heat sink 3 to match the insertion holes 41 provided in each of the multiple boards 4 for which the heat sink 3 is to be shared, it is possible to use a single heat sink 3 to fix any of the multiple boards 4.

Note that while FIG. 1 shows a configuration in which the substrate 4 is disposed between the BL chassis 2 and the heat sink 3 in the electronic device 1, the substrate 4 may also be disposed on the opposite side of the heat sink 3 from the BL chassis 2 (above the heat sink 3 in FIG. 1).

(Effects of the First Embodiment)
The substrate 4 is fixed to the heat sink 3 by inserting an insertion member 7 through the insertion hole 31 of the heat sink 3 and the insertion hole 41 of the substrate 4. Furthermore, the heat sink 3 is fixed to the BL chassis 2 by inserting an insertion member 8 through another insertion hole 31 of the heat sink 3 and the BL chassis 2.

As a result, the board 4 and the insertion member 7 do not come into direct contact with the BL chassis 2, and friction that would occur if the board 4 and the insertion member 7 came into contact with the BL chassis 2 does not occur. Therefore, there is no degradation in the quality of the BL chassis 2 due to friction between the board 4 and the insertion member 7 and the BL chassis 2.

Furthermore, since the heat sink 3 has multiple insertion holes 31, it can be made common to substrates 4 of various sizes. Therefore, the mold for the heat sink 3 can be made common.

[Embodiment 2]
A second embodiment of the present invention will be described below. For ease of explanation, the same reference numerals are given to members having the same functions as those described in the first embodiment, and the description thereof will not be repeated.

Figure 3 is a cross-sectional view showing the configuration of the electronic device 1 according to this embodiment. As shown in Figure 3, in the electronic device 1, a spacer S is interposed between the heat sink 3 and the substrate 4, through which the insertion member 7 passes.

By providing a spacer S around the insertion member 7, the heat sink 3 and the substrate 4 are separated, maintaining the distance between them for installing the TCONIC 5 and the heat sink sheet 6.

The through holes 31 of the heat sink 3 may be cut in advance to accommodate multiple boards 4, making the heat sink 3 a common one. Also, the through holes 31 may be threaded each time to fit the board 4.

(Effects of the Second Embodiment)
According to the above, by providing the spacer S between the heat sink 3 and the substrate 4, the contact position between the heat sink 3 and the substrate 4 is limited, and the distance between the heat sink 3 and the substrate 4 is well maintained. This makes it possible to limit the area where the heat sink 3 rubs against the substrate 4. Furthermore, no voltage drop occurs due to contact between the heat sink 3 and the substrate 4.

[Embodiment 3]
A third embodiment of the present invention will be described below. For ease of explanation, the same reference numerals will be given to members having the same functions as those described in the first and second embodiments, and the description thereof will not be repeated.

Figure 4 is a cross-sectional view showing the configuration of the electronic device 1 according to this embodiment. As shown in Figure 4, the heat sink 3 has multiple connecting parts R. In detail, the connecting parts R protrude downward from the lower surface of the heat sink 3 and have a shape that fits the insertion member 7a. The connecting parts R are provided in positions on the heat sink 3 that overlap the insertion holes 41 of the substrate 4.

The connecting portion R is, for example, a drawn metal plate that is compressed by hitting it with a metal or wooden mallet and a metal backing, and then drawn into a concave shape (drawing process), resulting in a shape that has screw holes, holes for inserting pins, etc.

The substrate 4 has insertion holes 41 that correspond to some of the multiple connecting parts R. The electronic device 1 further includes an insertion member 7a that fits into the connecting part R and the insertion hole 41 that corresponds to the connecting part R.

By drawing the heat sink 3 each time, the distance between the heat sink 3 and the substrate 4 for installing the TCONIC 5 and the heat sink sheet 6 is maintained. The number of components in the electronic device 1 can be reduced by the number of connecting parts R. However, drawing must be performed each time to fit the substrate 4.

(Effects of the Third Embodiment)
The shape of the heat sink 3 limits the contact position with the substrate 4 and maintains a distance from the substrate 4, making it possible to reduce the number of parts compared to embodiment 1. In addition, a plurality of connecting portions R may be provided in the heat sink 3, which allows substrates 4 with insertion holes 41 in different positions to be fixed, making it possible to standardize the heat sink 3. Therefore, the mold for the heat sink 3 can be standardized.

[Embodiment 4]
A fourth embodiment of the present invention will be described below. For ease of explanation, the same reference numerals are given to members having the same functions as those described in the first to third embodiments, and the description thereof will not be repeated.

Figure 5 is a cross-sectional view showing the configuration of the electronic device 1 according to this embodiment. The electronic device 1 further includes a conductive sheet C covering the surface of the heat sink 3. In the electronic device 1, the BL chassis 2 and the ground G of the substrate 4 are electrically connected via the conductive sheet C. As shown in Figure 5, the conductive sheet C covers from the contact position between the BL chassis 2 and the heat sink 3 to the contact position between the heat sink 3 and the substrate 4. Note that instead of the conductive sheet C, a conductive tape, a conductive resin, a metal plate, etc. may be used.

In FIG. 5, the BL chassis 2 and the conductive sheet C are connected via the boss B, but they may be connected directly. Also, in FIG. 5, the conductive sheet C and the ground G of the board are connected directly, but they may be connected via another conductive member.

(Effects of the Fourth Embodiment)
The substrate 4 is separated from the BL chassis 2 and is not directly connected to the BL chassis 2. For example, if the heat sink 3 is made of aluminum, the electrical conductivity is poor, which may deteriorate the grounding stability of the substrate 4. Therefore, by attaching a conductive sheet C between the portion where the substrate 4 contacts the heat sink 3 and the portion where the BL chassis 2 contacts the heat sink 3, the grounding stability of the substrate 4 can be ensured.

Other embodiments
In the above embodiment, a configuration has been shown in which one substrate 4 is supported by one heat sink 3 in the electronic device 1, but a configuration in which a plurality of substrates 4 are supported by one heat sink 3 may also be used.

In the manufacturing process of the electronic device 1, the substrate 4 is attached to the heat sink 3, and then the heat sink 3 is attached to the BL chassis 2.

〔summary〕
An electronic device according to a first aspect of the present invention includes a housing, a heat sink supported by the housing, and a substrate supported by the heat sink and disposed at a distance from the housing.

The above configuration allows the heat sink to be standardized for various types of substrates. Therefore, the mold for the heat sink can be standardized.

The electronic device according to aspect 2 of the present invention may be the same as in aspect 1, except that the heat sink has a plurality of insertion holes, the substrate has insertion holes corresponding to some of the plurality of insertion holes, and the electronic device further includes insertion members that fit into the insertion holes of the heat sink and the corresponding insertion holes of the substrate.

According to the above configuration, the heat sink has multiple insertion holes, so it can be made common to boards of various sizes. Therefore, the mold for the heat sink can be made common.

The electronic device according to aspect 3 of the present invention may be the same as in aspect 1, except that the heat sink has a plurality of connecting parts, the substrate has insertion holes corresponding to some of the plurality of connecting parts, and the electronic device further includes insertion members that fit into the connecting parts and the corresponding insertion holes.

With the above configuration, the heat sink has multiple connecting parts, so it can be used in common for boards of various sizes.

The electronic device according to aspect 4 of the present invention may be any of the above aspects 1 to 3, further comprising a conductive sheet covering the surface of the heat sink, and the housing and the ground of the board may be electrically connected via the conductive sheet.

With the above configuration, the ground of the board is electrically connected to the housing, ensuring grounding stability of the board.

The electronic device according to aspect 5 of the present invention may be any of the above aspects 1 to 4, in which the housing has a boss portion protruding from the surface of the housing, the heat sink has an insertion hole, and further includes an insertion member that fits into the boss portion and the insertion hole.

With the above configuration, the housing has a boss portion, so that a sufficient distance can be secured between the substrate supported by the heat sink and the housing.

The electronic device according to aspect 6 of the present invention may be the electronic device according to aspect 2, in which a spacer through which the insertion member passes is interposed between the heat sink and the substrate.

The above configuration maintains a good distance between the heat sink and the substrate, limiting the areas where the heat sink and the substrate rub against each other.

The display device according to aspect 7 of the present invention includes the electronic device according to aspects 1 to 6 above.

The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. The technical scope of the present invention also includes embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Furthermore, new technical features can be formed by combining the technical means disclosed in the respective embodiments.

1 Electronic equipment 2 BL chassis (housing)
3 Heat sink 4, 4a, 4b Board 5 TCONIC
6 heat dissipation sheet 7, 7a, 8 insertion member 31, 31a, 31b, 31c, 41 insertion hole 100 display C conductive sheet B, B1, B2 boss portion G ground R connection portion S spacer

Claims (6)

A housing and
a heat sink supported by the housing and spaced apart from the housing ;
a substrate supported by the heat sink and disposed between the heat sink and the housing at a distance from the housing;
Equipped with
a joint between the heat sink and the housing is provided at a position different from a joint between the heat sink and the board,
a conductive sheet is further provided on a surface of the heat sink facing the housing, the conductive sheet covering a portion from a joint between the heat sink and the housing to a joint between the heat sink and the substrate,
an electronic device, wherein the housing and the ground of the substrate are electrically connected via the conductive sheet ; The heat sink has a plurality of insertion holes,
the substrate has insertion holes corresponding to some of the plurality of insertion holes,
2. The electronic device according to claim 1, further comprising an insertion member that fits into an insertion hole of the heat sink and a corresponding insertion hole of the substrate. The heat sink has a plurality of connecting portions,
the substrate has insertion holes corresponding to some of the plurality of connecting portions,
2. The electronic device according to claim 1, further comprising an insertion member that fits into the connecting portion and the corresponding insertion hole. The housing has a boss portion protruding from a surface of the housing,
The heat sink has an insertion hole,
4. The electronic device according to claim 1, further comprising an insertion member that fits into the boss portion and the insertion hole. 3. The electronic device according to claim 2, further comprising a spacer, through which the insertion member passes, interposed between the heat sink and the substrate. A display device comprising the electronic device according to claim 1 .

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