JP7417507B2 - Resin molding equipment and method for manufacturing resin molded products - Google Patents

Description

The present invention relates to a cleaning mechanism, a resin molding device, and a method for manufacturing a resin molded product.

Patent Document 1 discloses a technique that uses a suction hose and a brush to remove resin powder adhering to the inner surface of a holding part that holds a resin tablet.

Japanese Patent Application Publication No. 8-238644

In the configuration of Patent Document 1, when removing the resin powder adhering to the inner surface of the holding portion of the transport mechanism, there is a possibility that the resin powder may be scattered around. Such resin powder (resin dust) refers to residual debris that is not transferred to the mold and adheres to the transport mechanism when the resin material is transported to the mold. If resin molded products are manufactured by transporting resin materials through the transport mechanism without removing resin dust adhering to the transport mechanism, the resin powder will contaminate the inside of the resin molding equipment and cause defective products. Sometimes.

In order to solve the above problems, the cleaning mechanism of the present invention includes a suction mechanism that sucks the holding part of a carrying mechanism that holds solid resin in a holding part and carries it into the resin molding part, and a brush that is driven up and down. and a cover that covers the holding section.

The resin molding apparatus of the present invention includes the cleaning mechanism, the carry-in mechanism provided with the holding section, and a resin molding section that performs resin molding using solid resin carried by the carry-in mechanism.

The method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, which includes a resin molding step of resin molding using solid resin transported by the transport mechanism, and a resin molding step of resin molding using solid resin transported by the transport mechanism; The method includes a cleaning step in which the holding portion of the mechanism is cleaned by the cleaning mechanism, and a loading step in which the loading mechanism cleaned in the cleaning step holds the solid resin and conveys it into the mold.

According to the present invention, it is possible to provide a technique for reducing the scattering of resin dust to the surroundings and removing resin dust attached to the inside of a holding part that holds resin.

FIG. 1 is a plan view schematically showing the configuration of a resin molding apparatus according to the present embodiment. FIG. 2 is a side view schematically showing the loading mechanism of the present embodiment. FIG. 3 is a top view schematically showing the loading mechanism of the present embodiment. FIG. 2 is a cross-sectional view taken along cutting line AA in a top view schematically showing the carry-in mechanism of the present embodiment. FIG. 2 is a side view schematically showing a resin molded part of the present embodiment. FIG. 3 is a side view schematically showing the cleaning mechanism of the present embodiment. FIG. 3 is a plan view schematically showing the cleaning mechanism of the present embodiment. FIG. 3 is a cross-sectional view taken along cutting line BB in a plan view schematically showing the cleaning mechanism of the present embodiment. FIG. 3 is a side view showing a cleaning operation performed by the cleaning mechanism of the present embodiment. FIG. 3 is a cross-sectional view taken along cutting line CC in a side view showing a cleaning operation performed by the cleaning mechanism of the embodiment. FIG. 3 is a cross-sectional view taken along cutting line DD in a side view showing a cleaning operation performed by the cleaning mechanism of the embodiment.

<One embodiment of the present invention>
Embodiments of the present invention will be described in detail below with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated.

<Overall configuration of resin molding apparatus 100>
The resin molding apparatus 100 of this embodiment is a resin molding apparatus using a transfer molding method. This resin molding device is for resin molding, for example, a substrate to which a semiconductor chip is connected, and uses a cylindrical tablet-shaped thermosetting resin (hereinafter referred to as "resin tablet") as the resin material. It is something.

Note that examples of the "substrate" include general substrates such as semiconductor substrates such as silicon wafers, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates, and lead frames. Further, the substrate may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Furthermore, it may be one that has already been wired or it may be one that is not wired.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a supply module A that supplies a substrate W before resin sealing and a resin tablet T, a resin molding module B that corresponds to a resin molding section and performs resin molding, A carry-out module C for carrying out the resin molded product and a control unit COM are each provided as constituent elements. In addition, the supply module A, the resin molding module B, and the carry-out module C, which are components, can be attached to and detached from other components, and can be replaced. Furthermore, each module can be increased or decreased, such as increasing the number of resin molded modules B to two or three.

The resin molding apparatus 100 also includes a carry-in mechanism 1 (hereinafter referred to as "loader 1") that loads the substrates W and resin tablets T supplied by the supply module A into the resin molding module B all at once, and a resin molding module. The unloader 2 includes a carry-out mechanism 2 (hereinafter referred to as "unloader 2") which carries out the resin molded product resin-molded by B to a carry-out module C.

As shown in FIG. 2, the loader 1 includes a substrate holding section 11 that holds a substrate W, and a resin holding section 12 that holds a resin tablet T.

In the loader 1, substrate holding parts 11 are arranged at both ends, and a resin holding part 12 is arranged at the center. As shown in FIG. 3, the loader 1 includes a substrate holding section 11 that holds two substrates W, and a resin holding section 12 that holds three resin tablets. Note that the number of substrate holders 11 and resin holders 12 may be changed depending on the number of substrates W and the number of resin tablets supplied to the mold 6.

The substrate holder 11 may be provided with a heater for preheating the substrate W while the substrate W is being carried in. Thereby, the temperature of the substrate W is made uniform during resin molding, and warping of the substrate due to non-uniform thermal expansion can be suppressed.

As shown in FIGS. 2 to 4, the resin holding section 12 includes four pin-shaped guide members 12a that support the resin tablet T and a shutter 12b that is an opening/closing member. The shutter 12b can be opened and closed by a drive mechanism (not shown). The shutter 12b is formed in an L-shape, and the resin tablet T supported by the four guide members 12a supports and holds the bottom surface of the resin tablet T in a closed state. Note that the number of guide members 12a does not need to be four, but may be three or more.

The supply module A of this embodiment includes a substrate supply mechanism 3, a resin supply mechanism 4, and a cleaning mechanism 5.

The substrate supply mechanism 3 includes a substrate delivery section 31 and a substrate supply section 32. The substrate delivery section 31 sends out the substrate W to the substrate supply section 32. The substrate supply section 32 receives the substrates W from the substrate delivery section 31, aligns the received substrates W in a predetermined direction, and delivers them to the loader 1.

The resin supply mechanism 4 includes a resin delivery section 41 and a resin supply section 42. The resin delivery section 41 sends out the resin tablets T to the resin supply section 42. The resin supply section 42 receives the resin tablets T from the resin delivery section 41, aligns the received resin tablets T in a predetermined direction, and delivers them to the loader 1.

The cleaning mechanism 5 cleans the holding section 11 provided on the loader 1 that holds the resin tablet T after the loader 1 carries the substrate W and the resin tablet T into the resin molding module B, as will be described later.

The resin molding module B has a mold 6 and a mold clamping mechanism 7. As shown in FIG. 5, the mold 6 includes a lower mold 61 that can be raised and lowered, an upper mold 62 that is fixed oppositely above the lower mold 61, and a mold for clamping the lower mold 61 and the upper mold 62. It has a mold clamping mechanism 7. The lower mold 61 is fixed to the upper surface of the movable platen 63, and the upper mold 62 is fixed to the lower surface of the upper fixed platen 64. The mold clamping mechanism 7 clamps or opens the upper mold 62 and the lower mold 61 by moving a movable platen 63 up and down.

The lower mold 61 is formed with an upper surface 61a on which the substrate W carried in by the loader 1 is placed, and a plurality of pots 61b into which the resin tablets T carried in by the loader 1 are supplied. Further, the lower mold 61 is provided with a plunger 61c for injecting the resin tablet T into the pot 61b into, for example, a resin passage 62a and a cavity 62b formed in the upper mold 62.

In addition, heating parts 65 such as heaters are embedded in the upper mold 62 and the lower mold 61, respectively. The upper mold 62 and the lower mold 61 are normally heated to about 180° C. by this heating section.

The control unit COM is configured to control at least the cleaning mechanism 5. The control unit COM includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, and is configured to control each component according to information processing. Note that the control unit COM may be configured to control the entire resin molding apparatus.

<Resin molding operation of resin molding apparatus 100>
The basic operation of resin molding by the resin molding apparatus 100 of this embodiment will be explained below.

As shown in FIG. 1, the substrate delivery section 31 sends out the substrate W in the magazine to the substrate supply section 32. The substrate supply unit 32 aligns the received substrates W in a predetermined direction and delivers them to the loader 1. In parallel with this, the resin delivery section 41 sends out the resin tablet T to the resin supply section 42. The resin supply unit 42 delivers a necessary number (three in FIG. 1) of the received resin tablets T to the loader 1.

Next, the loader 1 simultaneously carries the received two substrates W and three resin tablets T into the mold 6. The loader 1 supplies the substrate W to the upper surface 61a of the lower mold 61 and the resin tablet T to the inside of the pot 61b formed in the lower mold 61, respectively. At this time, by opening the shutter 12b provided on the resin holding part 12 of the loader 1, the resin tablet T can be dropped from the resin holding part 12 and supplied to the pot 61b of the mold 6.

Thereafter, the upper mold 62 and the lower mold 61 are clamped using the mold clamping mechanism 7. Then, the resin tablets T in each pot 61b are heated and melted to generate molten resin, and the molten resin is pressed by the plunger 61c. Thereby, the molten resin is injected into the cavity 62b formed in the upper mold 62 through the resin passage 62a. Subsequently, by heating the molten resin for a time required for curing, the molten resin is cured to form a cured resin. As a result, the semiconductor chip in the cavity 62b and the substrate around it are sealed in a cured resin (sealing resin) molded to correspond to the shape of the cavity 62b.

Next, after the time required for curing has elapsed, the upper mold 62 and the lower mold 61 are opened, and the sealed substrate P, which is a resin molded product, is released from the mold. Thereafter, the unloader 2 is used to store the sealed substrate (resin molded product) resin-sealed by the resin molding module B into the substrate accommodating section 8 of the carry-out module C.

While resin molding is being performed in the resin molding module B, the loader 1, which has finished loading the substrate W and resin tablet T into the mold 6, carries the substrate W and resin tablet T used for the next resin molding into the mold 6. In order to do this, return to the positions of the substrate supply section 32 and the resin supply section 42. Before returning to this predetermined position, the resin holding portion 12 of the loader 1 is cleaned by the cleaning mechanism 5, as will be described later.

<Configuration of cleaning mechanism 5>
The basic configuration of the cleaning mechanism 5 of this embodiment will be explained below.

As shown in FIG. 6, the cleaning mechanism 5 includes a cover 51, a suction mechanism 52, and a brush 53.

The cover 51 reduces the scattering of resin dust around the resin holding portion 12 of the loader 1 when cleaning the resin dust. As shown in FIGS. 6 to 8, the number of covers 51 corresponds to the number of resin holding parts 12 of the loader 1. The cover 51 covers the guide member 12a of the resin holding part 12, and has a notch 51a (see FIG. 9) on the side surface of the cover 51 so that the shutter 12b does not come into contact with the cover 51. Note that the cover 51 may have a cylindrical shape or a rectangular tube shape. Further, the material of the cover 51 may be metal or non-metal such as resin. Here, although a plurality of resin holding parts 12 are provided in the common loader 1, each of the resin holding parts 12 is separated so that it can be covered with the cover 51.

The suction mechanism 52 is for sucking resin dust adhering to the resin holding portion 12 of the loader 1 . As shown in FIG. 8, the suction mechanism 52 includes a dust collector 52a, a connecting pipe 52b that opens and connects to the bottom of each cover 51 , and a suction path 52c that connects the dust collector 52a and the connecting pipe 52b.

The number of each connecting pipe 52b corresponds to the number of resin holding parts 12 of the loader 1. Note that the opening position of each connecting pipe 52b is not limited to the above, and may be any position as long as it can collect resin dust from each part.

By starting the operation of the dust collector 52a (turning on the power), resin dust is sucked from the connecting pipe 52b, and by stopping the operation of the dust collector 52a, sucking the resin dust from the connecting pipe 52b is stopped. .

The brush 53 is inserted into the resin holding part 12 of the loader 1 to clean the inside of the resin holding part 12. The brush 53 is supported by a support portion 54. The support part 54 is connected to the lower end of the brush 53, and can move the brush 53 up and down simultaneously. Further, the brush 53 is driven up and down by, for example, an air cylinder connected to the support portion 54.

The brush 53 is configured to move up and down in contact with four guide members 12a provided on the resin holding portion 12 (see FIGS. 10 and 11). An example of the brush 53 is a twisted brush.

<Operation of cleaning mechanism 5>
The basic operation of the cleaning mechanism 5 of this embodiment will be explained below. The operations described here are controlled by the control unit COM.

After loading the substrate W and resin tablet T into the mold 6, the loader 1 is stopped on the cleaning mechanism 5. As shown in FIG. 9, the cover 51 of the cleaning mechanism 5 covers the resin holding portion 12 of the loader 1 as the entire cleaning mechanism 5 rises. This reduces the scattering of resin dust to the surroundings. Moreover, by covering with the cover 51, the volume of the space to be sucked can be reduced, and the efficiency of sucking resin dust can be improved.

Next, the brush 53 of the cleaning mechanism 5 is inserted inside the resin holding part 12 covered with the cover 51. By moving the brush 53 up and down several times and sucking the resin dust with the suction mechanism 52, the resin dust adhering to the inside of the resin holding part 12 is removed. Here, the brush 53 may be rotated instead of repeatedly moving up and down, or it may be rotated and repeatedly moved up and down.

Specifically, as shown in FIGS. 10 and 11, the brush 53 comes into contact with the inside of the four guide members 12a provided on the resin holding part 12. Then, by sucking the resin dust removed by the brush through the connecting pipe 52b of the suction mechanism 52, the resin dust can be efficiently removed. Further, by moving the brush 53 up and down, resin dust scattered inside the cover 51 can also be removed by the suction mechanism 52.

When cleaning of the resin holding portion 12 by the cleaning mechanism 5 is completed, the entire cleaning mechanism 5 is lowered. The cleaned loader 1 returns to the positions of the substrate supply section 32 and the resin supply section 42 in order to carry the substrate W and resin tablet T used for the next resin molding into the mold 6.

<Other embodiments>
The idea of the above embodiments is not limited to the embodiments described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

In the cleaning mechanism 5 of the above embodiment, the cover 51 covers the guide member 12a of the resin holding part 12, and has a notch 51a on the side surface of the cover 51 so that the shutter 12b does not come into contact with the cover 51. However, the cover 51 may be provided to cover the guide member 12a and the shutter 12b of the resin holding portion 12 without providing the cutout portion 51a. In this case, the brush 53 is configured to move up and down so as to contact the guide member 12a and the shutter 12b.

In the cleaning mechanism 5 of the above embodiment, the suction mechanism 52 includes one dust collector 52a, but may include a plurality (two or more). Thereby, resin dust can be removed more strongly.

In the cleaning mechanism 5 of the above embodiment, the brushes 53 are configured to move up and down simultaneously, but the brushes 53 may be configured to move up and down separately.

In the resin molding apparatus 100 of the above embodiment, the carrying-in mechanism (loader 1) and the carrying-out mechanism (unloader 2) were separately provided, but the carrying-in mechanism has the function of the carrying-out mechanism, and the carrying-in and carrying-out It may be configured to perform both operations.

<Configuration of embodiment and its effects>
The cleaning mechanism of the above embodiment includes a suction mechanism that sucks the holding part of a carrying mechanism that holds solid resin in a holding part and carries it into the resin molding part, a brush that is driven up and down, and a cover that covers the holding part. Equipped with. According to this cleaning mechanism, it is possible to reduce the scattering of resin dust to the surroundings and to remove the resin dust adhering to the inside of the holding part that holds the resin.

Moreover, the resin molding apparatus of the above embodiment includes the cleaning mechanism, the carrying-in mechanism provided with the holding section, and a resin-molding section that performs resin molding using the solid resin carried by the carrying-in mechanism. With this resin molding apparatus, it is possible to reduce the scattering of resin dust over the entire apparatus and to remove the resin dust adhering to the inside of the holding part that holds the resin.

As a specific configuration of the resin molding apparatus, the cleaning mechanism cleans the solid resin after the carrying mechanism carries the solid resin into the resin molding section and before holding the solid resin to be used in the next resin molding. With this configuration, it is possible to reduce the scattering of resin dust over the entire device and to remove the resin dust adhering to the inside of the holding portion that holds the resin.

Further, as a specific configuration of the resin molding apparatus, a plurality of the holding parts are provided in the common carrying mechanism, and the brushes and the covers are provided in correspondence to the number of the holding parts, and each of the holding parts The parts are separated so that they can be covered by the cover. With this configuration, it becomes easy to use a configuration in which the holding portion is covered with a cover, and it is possible to effectively reduce scattering of resin dust.

Furthermore, as a specific configuration of the resin molding apparatus, each of the holding parts includes a plurality of pin-shaped guide members. With this configuration, it is possible to reduce the contact area of the solid resin with the holding portion and effectively reduce scattering of resin dust.

Further, the method for manufacturing a resin molded product of the above embodiment is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a resin molding step of resin molding using the solid resin carried in by the carrying mechanism. , a cleaning step in which the holding portion of the carry-in mechanism is cleaned by the cleaning mechanism, and a carry-in step in which the carry-in mechanism cleaned in the cleaning step holds the solid resin and carries it into the mold. With this method of manufacturing a resin molded product, it is possible to reduce the scattering of resin dust to the surroundings and reduce the occurrence of defective products.

The embodiments of the present invention have been exemplarily described above. That is, the detailed description and accompanying drawings have been disclosed for purposes of illustration. Therefore, some of the components described in the detailed description and the attached drawings may not be essential for solving the problem. Therefore, just because a non-essential component is depicted in the detailed description and accompanying drawings, such non-essential component should not be immediately identified as essential.

Further, the above embodiments are merely illustrative of the present invention in all respects. Various improvements and changes can be made to the above embodiments within the scope of the present invention. That is, in implementing the present invention, specific configurations can be adopted as appropriate depending on the embodiment.

100...Resin molding device 1...Carrying mechanism (loader)
2... Unloading mechanism (unloader)
5... Cleaning mechanism 51... Cover 52... Suction mechanism 53... Brush 6... Molding mold A... Supply module B... Resin molding module (resin molding section)
C...Export module W...Substrate T...Resin tablet

Claims (4)

a resin molding section that performs resin molding using a plurality of solid resins;
a carrying mechanism that has a plurality of holding parts each holding a plurality of solid resins , and carries the plurality of solid resins held by the holding parts into a resin molding part ;
and a cleaning mechanism that cleans the plurality of holding parts,
The cleaning mechanism includes:
a plurality of cylindrical covers covering each of the plurality of holding parts;
a suction mechanism that sucks dust inside the plurality of covers ;
a plurality of brushes arranged inside each of the plurality of covers and driven up and down;
and a common support part connected to the plurality of brushes . The resin molding apparatus according to claim 1 , wherein the cleaning mechanism cleans the solid resin after the loading mechanism transports the solid resin into the resin molding section and before holding the solid resin to be used in the next resin molding. The resin molding apparatus according to claim 1 or 2 , wherein each of the plurality of holding parts includes a plurality of pin-shaped guide members. A method for producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 3, comprising:
a resin molding step of resin molding using the solid resin transported by the transport mechanism;
a cleaning step of cleaning the holding part of the carry-in mechanism with the cleaning mechanism;
A method for manufacturing a resin molded product, comprising a carrying step in which the carrying mechanism cleaned in the cleaning step holds the solid resin and carries it into a mold.

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