JP7415717B2 - resin composition - Google Patents

Description

The present invention relates to a resin composition containing magnetic powder. Furthermore, the present invention relates to cured products, electronic components, neodymium magnet-containing motors, etc. obtained using the resin composition.

For electronic components with magnetic circuits such as permanent magnets and yokes, the use of regular adhesives can cause magnetic flux leakage in electronic components using adhesives, resulting in decreased performance of electronic components such as motors due to magnetic loss. There were issues such as causing problems.

To address these issues, we have developed a technology that improves the performance of electronic components such as motors by adding magnetic powder to the adhesive to make it magnetic, thereby suppressing magnetic leakage at the bonded parts of magnetic circuits. is known (Patent Document 1).

Generally, when used in camera modules, etc., adhesives with low elasticity are preferred in order to provide impact resistance, but when the adhesive is filled with magnetic powder, the cured adhesive becomes hard and the modulus of elasticity decreases. It tends to be higher.

Japanese Patent Application Publication No. 1-289883

Therefore, an object of the present invention is to provide a resin composition containing magnetic powder, which can yield a cured product with excellent impact resistance.

In order to achieve the problems of the present invention, the present inventors have made extensive studies and have found that the problems of the present invention can be solved by using a resin composition containing a thiol compound, and have completed the present invention.

That is, the present invention includes the following contents.
[1] A resin composition comprising (A) an epoxy resin, (B) a thiol compound, and (C) magnetic powder,
A resin composition, wherein a cured product of the resin composition has an elastic modulus of 500 MPa or less at 25°C, and a cured product of the resin composition has an elongation at break of 30% or more at 25°C.
[2] The epoxy equivalent of component (A) is 200 g/eq. ～1000g/eq. The resin composition according to [1] above.
[3] The resin composition according to [1] or [2] above, wherein the component (B) is a bifunctional or more functional thiol compound.
[4] The ratio of the total number of mercapto groups in the thiol compound (B) to the total number of epoxy groups in the epoxy resin (A) (mercapto group/epoxy group) is 0.3 to 1.0, [1] to The resin composition according to any one of [3].
[5] Any one of [1] to [4] above, wherein the content of component (C) is 40% by mass to 75% by mass when the nonvolatile components in the resin composition are 100% by mass. resin composition.
[6] The resin composition according to any one of [1] to [5] above, further comprising a latent curing accelerator.
[7] The resin composition according to any one of [1] to [6] above, wherein component (A) contains (A-1) a flexible skeleton-containing epoxy resin.
[8] The resin composition according to any one of [1] to [7] above, which has a reaction peak temperature of 100° C. or less based on differential scanning calorimetry.
[9] The resin composition according to any one of [1] to [8] above for use as an adhesive.
[10] The resin composition according to the above [9] for use as an adhesive for bonding a neodymium magnet as an adherend.
[11] The resin composition according to any one of [1] to [8] above for use as a sealing material.
[12] A cured product of the resin composition according to any one of [1] to [11] above.
[13] A neodymium magnet-containing motor, comprising the cured product according to [12] above.
[14] An electronic component comprising the cured product according to [12] above.
[15] An electronic component comprising a neodymium magnet-containing motor and the cured product according to [12] above.

According to the present invention, it is possible to provide a resin composition that includes magnetic powder and can yield a cured product with excellent impact resistance.

FIG. 1 is a DSC chart showing differential scanning calorimetry curves (DSC curves) of the resin composition obtained in Example 1 before and after curing.

Hereinafter, the present invention will be explained in detail based on its preferred embodiments. However, the present invention is not limited to the following embodiments and examples, and may be implemented with arbitrary changes within the scope of the claims of the present invention and equivalents thereof.

<Resin composition>
The resin composition of the present invention includes (A) an epoxy resin, (B) a thiol compound, and (C) magnetic powder. The cured product of the resin composition of the present invention has an elastic modulus of 500 MPa or less at 25°C. The cured product of the resin composition of the present invention has an elongation at break of 30% or more at 25°C. A cured product of such a resin composition has excellent impact resistance.

In addition to (A) an epoxy resin, (B) a thiol compound, and (C) a magnetic powder, the resin composition of the present invention further comprises (D) a stabilizer, (E) a dispersant, and (F) a curing accelerator. , (G) an organic filler, (H) other additives, and (I) an organic solvent. Each component contained in the resin composition will be explained in detail below.

<(A) Epoxy resin>
The resin composition of the present invention includes (A) an epoxy resin. (A) Epoxy resin means a curable resin having an epoxy group.

The epoxy equivalent of the epoxy resin (A) is not particularly limited, but from the viewpoint of keeping the elastic modulus low and improving the elongation at break, it is preferably 50 g/eq. Above, more preferably 100g/eq. Above, more preferably 150g/eq. Above, even more preferably 180g/eq. Above, particularly preferably 200g/eq. That's all. The upper limit of the epoxy equivalent of the epoxy resin (A) is not particularly limited, but from the viewpoint of obtaining a resin composition that is easier to handle when used as an adhesive or sealant, it is preferably 5000 g/eq. Below, more preferably 2000g/eq. Below, more preferably 1000g/eq. Below, even more preferably 700g/eq. Below, particularly preferably 500g/eq. It is as follows. Epoxy equivalent is the mass of resin per equivalent of epoxy group. Epoxy equivalent can be measured according to JIS K7236.

The weight average molecular weight (Mw) of the epoxy resin (A) is preferably 100 to 5,000, more preferably 250 to 3,000, even more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured as a value in terms of polystyrene by gel permeation chromatography (GPC).

The content of the epoxy resin (A) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 99% by mass or less, more preferably 90% by mass or less. It is at most 80% by mass, more preferably at most 80% by mass, even more preferably at most 65% by mass, particularly preferably at most 50% by mass. The lower limit of the content of the epoxy resin (A) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably is 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, particularly preferably 30% by mass or more. In one embodiment, the content of (A) the epoxy resin can be set based on the content of (B) the thiol compound and the thiol equivalent.

<(A-1) Flexible skeleton-containing epoxy resin>
In the present invention, (A) the epoxy resin preferably contains (A-1) a flexible skeleton-containing epoxy resin from the viewpoint of suppressing the elastic modulus to a low level and improving the elongation at break. (A-1) Flexible skeleton-containing epoxy resin means a curable resin having a flexible skeleton and an epoxy group. The flexible skeleton here may be, for example, a saturated chain skeleton consisting of 6 or more (preferably 8 or more) skeleton atoms selected from carbon atoms and oxygen atoms in the main chain. (A-1) The flexible skeleton-containing epoxy resin preferably has 1 to 5 epoxy groups, more preferably 1 to 3, and particularly preferably 2 epoxy groups in one molecule. (A-1) The flexible skeleton-containing epoxy resin may further have a functional group such as a hydroxyl group or an amino group.

(A-1) Flexible skeleton-containing epoxy resins include (A-1-1) flexible skeleton-containing aromatic epoxy resins (having an aromatic ring), and (A-1-2) flexible skeleton-containing epoxy resins. Containing non-aromatic epoxy resins (those having no aromatic ring) can be mentioned. (A-1) The flexible skeleton-containing epoxy resins may be used alone or in combination of two or more in any ratio.

(A-1-1) The flexible skeleton-containing aromatic epoxy resin has at least one aromatic group (for example, phenylene group, etc.), and 6 or more (preferably 8 or more) carbon atoms and oxygen in the main chain. It is an epoxy resin having at least one saturated chain skeleton composed of skeleton atoms selected from atoms.

(A-1-1) Examples of the flexible skeleton-containing aromatic epoxy resin include flexible skeleton-containing modified bisphenol-type epoxy resins, flexible skeleton-containing modified biphenyl-type epoxy resins, flexible skeleton-containing modified novolac-type epoxy resins, Examples include, but are not limited to, modified phenol aralkyl type epoxy resins containing flexible skeletons.

Examples of flexible skeleton-containing modified bisphenol-type epoxy resins include bisphenol A ether structure, bisphenol AP ether structure, bisphenol B ether structure, bisphenol BP ether structure, bisphenol C ether structure, bisphenol E ether structure, bisphenol F ether structure, and bisphenol TMC. It has a bisphenol ether skeleton such as an ether structure.

(A-1-1) The flexible skeleton-containing aromatic epoxy resin may be, for example, an epoxy resin represented by formula (1):

[In the formula, R each independently represents a single bond, -CR ¹ ₂ -, -O-, -CO-, -S-, -SO-, or -SO ₂ -, and R ¹ is Two R ^1s that independently represent a hydrogen atom, an alkyl group (preferably having 1 to 6 carbon atoms), or an aryl group (preferably having 6 to 14 carbon atoms), or are bonded to the same carbon atom together are combined to form a cycloalkane ring (preferably having 3 to 8 carbon atoms), and each R ² is independently an alkyl group (preferably having 1 to 6 carbon atoms) or an aryl group (preferably having 1 to 6 carbon atoms). 6 to 14 carbon atoms), and X and Y are each independently an alkylene group that may have a hydroxyl group (preferably 2 to 20 carbon atoms, more preferably 2 to 10 carbon atoms) , a each independently represents an integer of 0 or more, b each independently represents an integer of 2 or more, c represents an integer of 1 or more, and d each independently represents an integer of 0 to Indicates an integer of 3. ].

The alkyl group refers to a linear, branched, and/or cyclic monovalent aliphatic saturated hydrocarbon group.
Examples of the alkyl group include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, isopentyl group, neopentyl group, sec-pentyl group, tert-butyl group, Examples include -pentyl group, cyclopentyl group, cyclohexyl group, etc., and methyl group is preferred. The aryl group refers to a monovalent aromatic hydrocarbon group. Examples of the aryl group include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and a phenyl group is preferred. The cycloalkane ring refers to a cyclic aliphatic saturated hydrocarbon ring. Examples of the cycloalkane ring include a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a methylcyclohexane ring, a dimethylcyclohexane ring, and a trimethylcyclohexane ring. The alkylene group means a linear or branched divalent aliphatic saturated hydrocarbon group. Examples of the alkylene group which may have a hydroxyl group include -CH ₂ -CH ₂ -, -CH(CH ₃ )-, -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH(CH ₃ )-, -CH(CH ₃ )-CH ₂ -, -C(CH ₃ ) ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH(CH ₃ )- , -CH ₂ -CH(CH ₃ )-CH ₂ -, -CH(CH ₃ )-CH ₂ -CH ₂ -, -CH ₂ -C(CH ₃ ) ₂ -, -C(CH ₃ ) ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH 2 -CH _{2 -CH 2} -, -CH ₂ -CH(CH ₃ )- CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-, -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH 2 -CH ₂ -CH ₂ -CH ₂ -CH _{2 -CH 2} -, -CH ₂ -CH( _CH3 ) _-CH2 -CH( _CH3 ) _-CH2 -CH( _CH3 ) _-CH2 -CH( _CH3 )-, -CH( _CH3 )-CH2 _- CH( _CH3 ) _-CH2 -CH( _CH3 ) _-CH2 -CH( _CH3 ) _-CH2- , -CH2- _{CH2- CH2- CH2} - _CH2 - _CH2 - _{CH2 -} CH2 _{- CH2} -, -CH ₂ -CH ₂ -CH ₂ -CH 2 -CH ₂ -CH ₂ -CH ₂ -CH 2 -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, etc. Alkylene group having 2 to 10 carbon atoms; -CH ₂ -CH ( OH)-, -CH(OH)-CH ₂ -, -CH ₂ -CH(OH)-CH ₂ -, -CH(CH ₂ OH)-CH ₂ -, -CH ₂ -CH(CH ₂ OH)- , -CH ₂ -CH(CH ₂ OH)-CH ₂ - and the like, and hydroxyalkylene groups having 2 to 10 carbon atoms are mentioned.

In formula (1), R is each independently preferably -CR ¹ -. R ¹ is each independently preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom or a methyl group. Each R ² is independently preferably an alkyl group. a is each independently preferably an integer of 0 to 20 (0 or an integer of 1 to 20), more preferably an integer of 0 to 10 (0 or an integer of 1 to 10). b is each independently preferably an integer of 3 to 20, more preferably an integer of 3 to 10. c is preferably an integer of 1 to 20, more preferably an integer of 1 to 10, still more preferably an integer of 1 to 8. d is each independently preferably 0 or 1, more preferably 0.

(A-1-1) Specific examples of the flexible skeleton-containing aromatic epoxy resin include epoxy resins represented by formulas (1A) to (1G):

[In the formula, R ³ , R ⁴ and R ⁵ each independently represent a hydrogen atom or a methyl group, x represents an integer of 1 to 10, and y each independently represents an integer of 1 to 10. Indicates an integer. ].

(A-1-2) The flexible skeleton-containing non-aromatic epoxy resin is an epoxy resin whose basic skeleton is a saturated aliphatic chain consisting of skeleton atoms selected from carbon atoms and oxygen atoms. Examples of the flexible skeleton-containing aromatic epoxy resin include alkanediol diglycidyl ethers such as ethylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether; polyethylene glycol diglycidyl ether; Examples include polyalkylene glycol diglycidyl ethers such as glycidyl ether, polypropylene glycol diglycidyl ether, and polybutylene glycol diglycidyl ether.

(A-1-2) The flexible skeleton-containing non-aromatic epoxy resin may be, for example, an epoxy resin represented by formula (2):

[In the formula, Z each independently represents an alkylene group (preferably having 2 to 20 carbon atoms, more preferably 2 to 10 carbon atoms) which may have a hydroxyl group, and e is 1 or more indicates an integer. ].

In formula (2), each Z independently preferably represents an alkylene group (preferably having 2 to 20 carbon atoms, more preferably having 2 to 10 carbon atoms). e is preferably an integer from 1 to 20.

(A-1) Commercially available flexible skeleton-containing epoxy resins include, for example, ADEKA's "EP-4000S" and "EP-4010S" (modified bisphenol type epoxy resin); Mitsubishi Chemical's "YL7175-500" "YL7175-1000", "YL7410", "YX7105" (modified bisphenol type epoxy resin); DIC "EXA-4850", "EXA-4850-150", "EXA-4816", "EXA-4822" ( "EG-280" manufactured by Osaka Gas Chemical Co., Ltd.; "EX-830" manufactured by Nagase ChemteX (modified bisphenol type epoxy resin); "YX7400" manufactured by Mitsubishi Chemical Corporation (polybutylene glycol diglycidyl ether); ) etc.

(A-1) The epoxy equivalent of the flexible skeleton-containing epoxy resin is not particularly limited, but is preferably 50 g/eq. Above, more preferably 100g/eq. Above, more preferably 200g/eq. Above, even more preferably 300g/eq. Above, particularly preferably 400g/eq. That's all. (A-1) The lower limit of the epoxy equivalent of the flexible skeleton-containing epoxy resin is not particularly limited, but is preferably 5000 g/eq. Below, more preferably 2000g/eq. Below, more preferably 1000g/eq. Below, even more preferably 700g/eq. Below, particularly preferably 500g/eq. It is as follows. Epoxy equivalent is the mass of resin per equivalent of epoxy group. Epoxy equivalent can be measured according to JIS K7236.

(A-1) The weight average molecular weight (Mw) of the flexible skeleton-containing epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and still more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured as a value in terms of polystyrene by gel permeation chromatography (GPC).

The content of the (A-1) flexible skeleton-containing epoxy resin in the resin composition is not particularly limited, but is preferably 70% by mass when the nonvolatile components in the resin composition are 100% by mass. The content is more preferably 60% by mass or less, still more preferably 55% by mass or less, even more preferably 50% by mass or less, particularly preferably 45% by mass or less. The lower limit of the content of (A-1) flexible skeleton-containing epoxy resin in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition is 100% by mass, it is preferably 0. .1% by weight or more, more preferably 1% by weight or more, still more preferably 5% by weight or more, even more preferably 8% by weight or more, particularly preferably 10% by weight or more.

<(A-2) Other arbitrary epoxy resin>
In the present invention, (A) the epoxy resin may contain any other epoxy resin (A-2) other than (A-1) the flexible skeleton-containing epoxy resin.

(A-2) Other optional epoxy resins include, for example, bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type Epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin , glycidyl ester type epoxy resin, cresol novolak type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, Spiro ring-containing epoxy resin, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, isocyanurate type epoxy resin, phenolphthalimidine type Examples include epoxy resins and phenolphthalein type epoxy resins. (A-2) Other optional epoxy resins may be used alone or in combination of two or more.

The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as (A-2) any other epoxy resin. (A-2) The proportion of the epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more with respect to 100% by mass of any other epoxy resin. , particularly preferably 70% by mass or more.

(A-2) Other optional epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter referred to as "solid epoxy resins"). (Sometimes called epoxy resins.) The resin composition of the present invention may contain only a liquid epoxy resin as (A-2) other optional epoxy resin, may contain only a solid epoxy resin, or may contain a liquid epoxy resin and a liquid epoxy resin. It may also be included in combination with a solid epoxy resin.

As the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferable.

Liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolak type epoxy resin, and ester skeleton. Preferred are alicyclic epoxy resins, cyclohexane-type epoxy resins, cyclohexanedimethanol-type epoxy resins, and epoxy resins having a butadiene structure.

Specific examples of liquid epoxy resins include "HP4032", "HP4032D", "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC; "828US", "828EL", "jER828EL", and "825" manufactured by Mitsubishi Chemical Corporation. ", "Epicote 828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical's "jER807", "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical's "jER152" (phenol novolac type epoxy resin); Mitsubishi Chemical's "630", "630LSD", "604" (glycidylamine type epoxy resin); ADEKA's "ED-523T" (glycyol type epoxy resin); ADEKA's "EP-3950L", "EP-3980S" (glycidylamine type epoxy resin); "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA; "ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. (bisphenol A type epoxy resin and bisphenol F type epoxy resin); mixture of epoxy resins); "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX; "Celoxide 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel; "PB-3600", Nippon Soda Co., Ltd.'s "JP-100", "JP-200" (epoxy resin with butadiene structure); Nippon Steel & Sumikin Chemical Co., Ltd.'s "ZX1658", "ZX1658GS" (liquid 1,4- glycidylcyclohexane type epoxy resin), etc. These may be used alone or in combination of two or more.

As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

Solid epoxy resins include bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, naphthol novolac type epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, Naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, phenolphthalyl Midine type epoxy resins and phenolphthalein type epoxy resins are preferred.

Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resin) manufactured by DIC; “N-690” (cresol novolak type epoxy resin) manufactured by DIC; “N-695” (cresol novolac type epoxy resin) manufactured by DIC; “HP-7200”, “HP-7200HH”, “HP” manufactured by DIC -7200H", "HP-7200L" (dicyclopentadiene type epoxy resin); "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S" manufactured by DIC ", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" manufactured by Nippon Kayaku Co., Ltd. (trisphenol type epoxy resin); "NC7000L" manufactured by Nippon Kayaku Co., Ltd. (naphthol novolac type epoxy resin); "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" manufactured by Nippon Kayaku Co., Ltd. (biphenyl type epoxy resin); "ESN475V" manufactured by Nippon Steel Chemical & Materials Co., Ltd. (naphthalene type epoxy resin); "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical &Materials; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Chemical &Materials; "YX4000H", "YX4000" manufactured by Mitsubishi Chemical; "YX4000HK", "YL7890" (bixylenol type epoxy resin); "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical; "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical; "YX7700" (phenol aralkyl type epoxy resin); "PG-100", "CG-500" manufactured by Osaka Gas Chemical Company; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Company; "YL7800" (fluorene type epoxy resin); "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Nippon Kayaku WHR991S” (phenolphthalimidine type epoxy resin). These may be used alone or in combination of two or more.

(A-2) The epoxy equivalent of the other arbitrary epoxy resin is preferably 50 g/eq. ～5,000g/eq. , more preferably 60g/eq. ～2,000g/eq. , more preferably 70g/eq. ～1,000g/eq. , even more preferably 80 g/eq. ～500g/eq. It is. Epoxy equivalent is the mass of resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

(A-2) The weight average molecular weight (Mw) of any other epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured as a value in terms of polystyrene by gel permeation chromatography (GPC).

The content of the other optional epoxy resin (A-2) in the resin composition is not particularly limited, but is preferably 50% by mass when the nonvolatile components in the resin composition are 100% by mass. The content is more preferably 40% by mass or less, still more preferably 30% by mass or less, even more preferably 20% by mass or less, particularly preferably 15% by mass or less. The lower limit of the content of (A-2) other arbitrary epoxy resin in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition is 100% by mass, for example, 0 It can be at least 0.01% by mass, at least 0.1% by mass, at least 0.5% by mass, at least 1% by mass, at least 3% by mass, at least 5% by mass, and so on.

When the resin composition contains (A-2) any other epoxy resin, the mass of (A-2) any other epoxy resin relative to (A-1) the flexible skeleton-containing epoxy resin in the resin composition. The ratio ((A-2)/(A-1)) may be preferably 2 or less, more preferably 1.5 or less, even more preferably 1 or less, particularly preferably 0.7 or less.

<(B) Thiol compound>
The resin composition of the present invention contains (B) a thiol compound. When (B) a thiol compound is used as a curing agent for (A) an epoxy resin, it can be cured at a relatively low temperature and a decrease in magnetic force can be suppressed.

(B) Thiol compound means an organic compound having a mercapto group (-SH), and from the viewpoint of obtaining excellent epoxy curability, it is preferably a difunctional or higher-functional thiol compound, which further improves crosslink density. From this point of view, it is more preferable to use a trifunctional or higher functional thiol compound. (B) When indicating the functional number in the description of the thiol compound, it is based on the number of mercapto groups (-SH) contained in one molecule. Further, such a thiol compound is preferably a primary and/or secondary thiol compound from the viewpoint of increasing reactivity.

(B) Thiol compounds include not only saturated hydrocarbon structures but also those containing unsaturated hydrocarbon structures. (B) Thiol compounds include those containing linear, branched, and/or cyclic structures (e.g., isocyanuric acid structure, glycoluril structure, benzene ring structure, etc.), but in one embodiment, impact resistance is further improved. In view of this, it is preferable to include a thiol compound that does not contain a cyclic structure (one that is linear and/or branched and does not contain a cyclic structure). (B) The thiol compound may be a non-aromatic thiol compound (not containing an aromatic ring) or an aromatic thiol compound (containing an aromatic ring), but in one embodiment, impact-resistant From the viewpoint of further improving properties, non-aromatic thiol compounds (those containing no aromatic ring) are preferred. (B) The thiol compound may have a functional group such as a hydroxy group, a carboxy group, or an amino group in addition to the mercapto group, but in one embodiment, it is preferable not to have it.

(B) Thiol compounds include, for example, hydrocarbon thiol compounds, ether structure-containing thiol compounds, thioether structure-containing thiol compounds, amine-containing thiol compounds, alcohol-containing thiol compounds, carboxylic acid ester structure-containing thiol compounds, isocyanurate structure-containing thiols. compounds, thiol compounds containing a carboxylic acid ester structure and isocyanurate structure, and thiol compounds containing a glycoluril structure. (B) Thiol compounds may be used alone or in combination of two or more in any ratio.

The hydrocarbon thiol compound means a thiol compound having a hydrocarbon as its basic skeleton, such as 1,4-butanedithiol, 1,6-hexanedithiol, 1,8-octanedithiol, 1,10-decanedithiol, 2,2-dimethylpropane-1,3-dithiol, 1,4-cyclohexanedithiol, 1,2-cyclohexanedithiol, m-xylene-α,α'-dithiol, p-xylene-α,α'-dithiol, etc. Difunctional hydrocarbon thiol compounds; 2-mercaptomethyl-1,3-propanedithiol, 2-ethyl-2-(mercaptomethyl)-1,3-propanedithiol, 2-mercaptomethyl-1,4-butanedithiol, Trifunctional hydrocarbon thiol compounds such as 1,2,3-propane trithiol; tetrafunctional hydrocarbon thiols such as tetrakis(mercaptomethyl)methane and 2,2-bis(mercaptomethyl)-1,3-propanedithiol Examples include compounds.

The thiol compound containing an ether structure means a thiol compound having an ether structure, such as 3,6-dioxa-1,8-octanedithiol, 3,6,9-trioxaundecane-1,11-dithiol, 3 , 4-dimethoxybutane-1,2-dithiol, 2,3-dimercaptopropyl methyl ether, bis(2-mercaptoethyl) ether, bis[4-(2-mercaptoethyloxy)phenyl]methane, bis[4- (3-mercaptopropyloxy)phenyl]methane, 2,2-bis[4-(2-mercaptoethyloxy)phenyl]propane, 2,2-bis[4-(3-mercaptopropyloxy)phenyl]propane, etc. Difunctional ether structure-containing thiol compound; (2-mercaptoethyl) (2,3-dimercaptopropyl) ether, trimethylolpropane tris(2-mercaptoethyl) ether, trimethylolethane tris(2-mercaptoethyl) ether, Trimethylolpropane tris(3-mercaptopropyl) ether, trimethylolethane tris(3-mercaptopropyl) ether, trimethylolpropane tris(4-mercaptobutyl) ether, trimethylolethane tris(4-mercaptobutyl) ether, glycerin tris (3-mercaptopropyl) ether, glycerin tris(4-mercaptobutyl) ether, trimethylolpropane tris(2-mercaptopropyl) ether, trimethylolethane tris(2-mercaptopropyl) ether, trimethylolpropane tris(3-mercaptopropyl) ether Thiol compounds containing a trifunctional ether structure such as trimethylolethane tris(3-mercaptobutyl)ether, glycerin tris(2-mercaptopropyl) ether, and glycerin tris(3-mercaptobutyl) ether; bis(2, 3-dimercaptopropyl) ether, pentaerythritol tetrakis (2-mercaptoethyl) ether, pentaerythritol tetrakis (3-mercaptopropyl) ether, pentaerythritol tetrakis (4-mercaptobutyl) ether, pentaerythritol tetrakis (2-mercaptopropyl) ether Thiol compounds containing a tetrafunctional ether structure such as ether, pentaerythritol tetrakis (3-mercaptobutyl) ether; dipentaerythritol hexakis (3-mercaptopropyl) ether, dipentaerythritol hexakis (2-mercaptopropyl) ether, etc. Examples include thiol compounds containing a polyfunctional ether structure having five or more functionalities.

The thiol compound containing a thioether structure means a thiol compound having a thioether structure, such as bis(2-mercaptoethyl) sulfide, 3,6-dithia-1,8-octanedithiol, 3,6,9-trithia Difunctional thioether structure-containing thiol compounds such as undecane-1,11-dithiol and 1,4-dithiane-2,5-di(methanethiol); 4-(2-mercaptoethyl)-3,6-dithia-1 , 8-octanedithiol, 4-mercaptomethyl-3,6-dithia-1,8-octanedithiol and other trifunctional thioether structure-containing thiol compounds; 1,2,6,7-tetramercapto-4-thiaheptane, 4-octanedithiol; ,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol , 2,6-bis(mercaptomethyl)-3,5-dithiaheptane-1,7-dithiol, 3,5-bis(mercaptomethylthio)-2,6-dithiaheptane-1,7-dithiol, and other tetrafunctional thioethers Structure-containing thiol compound; 1,2,9,10-tetramercapto-6-mercaptomethyl-4,7-dithiadecane, 1,2,6,10,11-pentamercapto-4,8-dithiaundecane, 1, 2,9,13,14-pentamercapto-6-mercaptomethyl-4,7,11-trithiatetradecane, 1,2,6,10,14,15-hexamercapto-4,8,12-trithiapentadecane Examples include polyfunctional thioether structure-containing thiol compounds having five or more functionalities.

The amine-containing thiol compound means a thiol compound having an amine structure (preferably a secondary amine structure or a tertiary amine structure) (which may further have an ether structure or a thioether structure), such as bis[4 -(3-phenoxy-2-mercaptopropylamino)phenyl]methane, bis{4-[3-(4-methylphenoxy)-2-mercaptopropylamino]phenyl}methane, 1,4-bis(3-phenoxy- Examples include difunctional amine-containing thiol compounds such as 2-mercaptopropylamino)benzene.

The alcohol-containing thiol compound means a thiol compound having a hydroxyl group (which may further have an ether structure or a thioether structure), such as 1,3-dimercapto-2-propanol, 2,3-dimercapto-1 - Difunctional alcohol-containing thiol compounds such as propanol, 2,2-bis(mercaptomethyl)-1,3-propanediol; pentaerythritol tris(3-mercaptopropyl) ether, 3-mercapto-2,2-bis( Examples include trifunctional alcohol-containing thiol compounds such as (mercaptomethyl)-1-propanol.

A thiol compound containing a carboxylic acid ester structure means a thiol compound having a carboxylic acid ester structure (which may further have an ether structure or a thioether structure), such as bis(2-mercaptoethyl) succinate, phthalate, etc. Acid bis(2-mercaptoethyl), bis(3-mercaptopropyl) phthalate, bis(4-mercaptobutyl) phthalate, ethylene glycol bis(mercaptoacetate), ethylene glycol bis(3-mercaptopropionate), Ethylene glycol bis(4-mercaptobutyrate), propylene glycol bis(3-mercaptopropionate), propylene glycol bis(4-mercaptobutyrate), diethylene glycol bis(3-mercaptopropionate), diethylene glycol bis(4-mercaptopropionate) mercaptobutyrate), tetraethylene glycol bis(3-mercaptopropionate), 1,4-butanediol bis(mercaptoacetate), 1,4-butanediol bis(3-mercaptopropionate), 1,4 -Butanediol bis(4-mercaptobutyrate), 1,8-octanediol bis(3-mercaptopropionate), 1,8-octanediol bis(4-mercaptobutyrate), bis(1-mercapto phthalate) ethyl), bis(2-mercaptopropyl) phthalate, bis(3-mercaptobutyl) phthalate, ethylene glycol bis(2-mercaptopropionate), ethylene glycol bis(3-mercaptobutyrate), propylene glycol bis( 2-mercaptopropionate), propylene glycol bis(3-mercaptobutyrate), diethylene glycol bis(2-mercaptopropionate), diethylene glycol bis(3-mercaptobutyrate), tetraethylene glycol bis(2-mercaptopropionate), 1,4-butanediol bis(2-mercaptopropionate), 1,4-butanediol bis(3-mercaptobutyrate), 1,8-octanediol bis(2-mercaptopropionate), Thiol compounds containing bifunctional carboxylic acid ester structures such as 1,8-octanediol bis(3-mercaptobutyrate); bis(2-mercaptoethyl) thiomalate, trimethylolpropane tris(mercaptoacetate), trimethylolethane Tris (mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), trimethylolethane tris (3-mercaptopropionate), trimethylolpropane tris (4-mercaptobutyrate), trimethylolethane tris ( 4-Mercaptobutyrate), Glycerin Tris (3-Mercaptopropionate), Glycerin Tris (4-Mercaptobutyrate), Trimethylolpropane Tris (2-Mercaptopropionate), Trimethylolethane Tris (2-Mercaptopropionate) pionate), trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercaptobutyrate), glycerin tris (2-mercaptopropionate), glycerin tris (3-mercaptobutyrate), etc. Thiol compound containing trifunctional carboxylic acid ester structure; 2,3-dimercaptosuccinic acid bis(2-mercaptoethyl), pentaerythritol tetrakis (mercaptoacetate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol Thiol compounds containing a tetrafunctional carboxylic acid ester structure such as tetrakis (4-mercaptobutyrate), pentaerythritol tetrakis (2-mercaptopropionate), and pentaerythritol tetrakis (3-mercaptobutyrate); dipentaerythritol hexakis ( 3-mercaptopropionate), dipentaerythritol hexakis (2-mercaptopropionate), and other polyfunctional carboxylic acid ester structure-containing thiol compounds having five or more functionalities.

A thiol compound containing an isocyanurate structure refers to a thiol compound having an isocyanuric acid (i.e., 1,3,5-triazine-2,4,6(1H,3H,5H)-trione) structure (further having an ether structure or thioether structure). For example, tris(3-mercaptopropyl)isocyanurate, tris(2-mercaptopropyl)isocyanurate, tris(2-mercaptoethyl)isocyanurate, tris(4-mercaptobutyl)isocyanurate Examples include thiol compounds containing a trifunctional isocyanurate structure such as nurate.

A thiol compound containing a carboxylic acid ester structure and an isocyanurate structure means a thiol compound having a carboxylic acid ester structure and an isocyanuric acid structure (which may further have an ether structure or a thioether structure). (3-mercaptopropionyloxy)ethyl]isocyanurate, tris[2-(4-mercaptobutyryloxy)ethyl]isocyanurate, tris[2-(2-mercaptopropionyloxy)ethyl]isocyanurate, tris[2-( Examples include thiol compounds containing a trifunctional carboxylic acid ester structure isocyanurate structure such as 3-mercaptobutyryloxy)ethyl isocyanurate.

A thiol compound containing a glycoluril structure means a thiol compound having a glycoluril (i.e., tetrahydroimidazo[4,5-d]imidazole-2,5(1H,3H)-dione) structure, for example, 1,3- Bis(2-mercaptoethyl) glycoluril, 1,3-bis(3-mercaptopropyl) glycoluril, 1,4-bis(2-mercaptoethyl) glycoluril, 1,4-bis(3-mercaptopropyl) glycol Difunctional glycoluril structure-containing thiol compounds such as uril, 1,6-bis(2-mercaptoethyl)glycoluril, and 1,6-bis(3-mercaptopropyl)glycoluril; 1,3,4-tris(2 - Thiol compounds containing a trifunctional glycoluril structure such as mercaptoethyl) glycoluril and 1,3,4-tris(3-mercaptopropyl) glycoluril; 1,3,4,6-tetrakis(2-mercaptoethyl) glycol Examples include thiol compounds containing a tetrafunctional glycoluril structure such as uril and 1,3,4,6-tetrakis(3-mercaptopropyl)glycoluril.

In one embodiment, the thiol compound (B) is preferably a thiol compound that does not contain a carboxylic acid ester structure from the viewpoint of further improving hydrolysis resistance.

In one embodiment, the thiol compound (B) may be a thiol compound that is solid at 25°C or a thiol compound that is liquid at 25°C, but the resin composition may be used as a sealant or adhesive. When used in a form, it is preferably a thiol compound that is liquid at 25°C.

The molecular weight of the thiol compound (B) is not particularly limited, but is preferably 200 or more, more preferably 250 or more, even more preferably 300 or more, particularly preferably 350 or more. The upper limit of the molecular weight of the thiol compound (B) is not particularly limited, but is preferably 1,500 or less, more preferably 1,000 or less, still more preferably 800 or less, particularly preferably 700 or less.

(B) The thiol equivalent of the thiol compound is not particularly limited, but is preferably 1000 g/eq. Below, more preferably 500g/eq. Below, more preferably 300g/eq. Below, even more preferably 200g/eq. Below, particularly preferably 150g/eq. It is as follows. (B) The lower limit of the thiol equivalent of the thiol compound is not particularly limited, but is preferably 50 g/eq. Above, more preferably 70g/eq. Above, more preferably 90g/eq. Above, even more preferably 100g/eq. Above, particularly preferably 110g/eq. That's all. Thiol equivalent is the mass of thiol compound per equivalent of mercapto group.

The ratio of the total number of mercapto groups in the thiol compound (B) to the total number of epoxy groups in the epoxy resin (A) in the resin composition (mercapto group/epoxy group) is preferably 0.1 or more, more preferably 0.3. above, more preferably 0.5 or more, particularly preferably 0.8 or more. The upper limit of the ratio of the total number of mercapto groups in the thiol compound (B) to the total number of epoxy groups in the epoxy resin (A) in the resin composition (mercapto group/epoxy group) is preferably 2.0 or less, more preferably 1. .5 or less, more preferably 1.2 or less, particularly preferably 1.0 or less.

The content of the (B) thiol compound in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass or less. It is not more than 30% by mass, more preferably not more than 30% by mass, even more preferably not more than 25% by mass, particularly preferably not more than 20% by mass. The lower limit of the content of the thiol compound (B) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 0.1% by mass or more, The content is more preferably 1% by mass or more, further preferably 2% by mass or more, even more preferably 5% by mass or more, particularly preferably 7% by mass or more. In one embodiment, the content of the thiol compound (B) can be set based on the content and epoxy equivalent of the epoxy resin (A).

The mass ratio of (B) thiol compound to (A) epoxy resin in the resin composition ((B) thiol compound/(A) epoxy resin) is not particularly limited, but is preferably 0.1 or more, It is more preferably 0.15 or more, still more preferably 0.2 or more, particularly preferably 0.25 or more. The upper limit of the mass ratio of (B) thiol compound to (A) epoxy resin in the resin composition ((B) thiol compound/(A) epoxy resin) is not particularly limited, but is preferably 1.5. Below, it is more preferably 1 or less, still more preferably 0.7 or less, particularly preferably 0.5 or less.

<(C) Magnetic powder>
The resin composition of the present invention contains (C) magnetic powder. By containing the magnetic powder (C) in the resin composition of the present invention, the relative magnetic permeability of the cured product can be improved.

(C) The magnetic powder may be either a soft magnetic powder or a hard magnetic powder, but from the viewpoint of significantly obtaining the effects of the present invention, a soft magnetic powder is preferable.

(C) Magnetic powders include, for example, Fe-Mn ferrite, Fe-Mn-Zn ferrite, Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg -Mn-Sr ferrite, Ni-Zn ferrite, Ba-Zn ferrite, Ba-Mg ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Ni-Co ferrite, Y ferrite, oxidation Iron oxide powder such as iron powder (III) and triiron tetroxide; pure iron powder; Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy Powder, Fe-Ni-Cr alloy powder, Fe-Cr-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co Examples include iron alloy metal powders such as alloy powders based on Fe--Ni--Co alloys, and amorphous alloys such as amorphous Co-based alloys. (C) Magnetic powder may be used alone or in combination of two or more.

Among these, the magnetic powder (C) is preferably at least one selected from iron oxide powder and iron alloy metal powder. The iron oxide powder preferably contains ferrite containing at least one selected from Ni, Cu, Mn, and Zn, and at least one selected from Fe-Mn ferrite and Fe-Mn-Zn ferrite. It is more preferable that there be. Further, the iron alloy metal powder preferably includes an iron alloy metal powder containing at least one selected from Si, Cr, Al, Ni, and Co.

(C) As the magnetic powder, commercially available products can be used, and two or more types may be used in combination. Specific examples of commercially available magnetic powders that can be used include M series such as "M05S" and "M05SWD" manufactured by Powder Tech; "MZ05" manufactured by Powder Tech; "PST-S" manufactured by Sanyo Special Steel; and Epson. Atomics "AW2-08", "AW2-08PF20F", "AW2-08PF10F", "AW2-08PF3F", "Fe-3.5Si-4.5CrPF20F", "Fe-50NiPF20F", "Fe-80Ni" -4MoPF20F"; JFE Chemical "LD-M", "LD-MH", "KNI-106", "KNI-106GSM", "KNI-106GS", "KNI-109", "KNI-109GSM", "KNI-109GS"; manufactured by Toda Kogyo Co., Ltd. "KNS-415", "BSF-547", "BSF-029", "BSN-125", "BSN-125", "BSN-714", "BSN-828" ”, “S-1281”, “S-1641”, “S-1651”, “S-1470”, “S-1511”, “S-2430”; “JR09P2” manufactured by Japan Heavy Chemical Industry Co., Ltd.; CIK Nanotech Co., Ltd. "Nanotek" manufactured by Kinsei Matek, "JEMK-S" and "JEMK-H"; "Yttrium iron oxide" manufactured by ALDRICH, and the like.

(C) The magnetic powder is preferably spherical. The value obtained by dividing the length of the long axis of the magnetic powder by the length of the short axis (aspect ratio) is preferably 2 or less, more preferably 1.5 or less, and even more preferably 1.2 or less. By using spherical magnetic powder, magnetic loss can be reduced and a resin composition having a desired and preferable viscosity can be obtained.

(C) The average particle diameter of the magnetic powder is preferably 0.01 μm or more, more preferably 0.5 μm or more, and even more preferably 1 μm or more, from the viewpoint of improving relative magnetic permeability. The upper limit of the average particle size of the magnetic powder (C) is preferably 10 μm or less, more preferably 9 μm or less, and still more preferably 8 μm or less.

(C) The average particle size of the magnetic powder can be measured by a laser diffraction/scattering method based on Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of the magnetic powder on a volume basis using a laser diffraction scattering type particle size distribution measuring device, and using the median diameter as the average particle size. As the measurement sample, one in which magnetic powder is dispersed in water using ultrasonic waves can be preferably used. As the laser diffraction scattering particle size distribution measuring device, "LA-500" manufactured by Horiba, "SALD-2200" manufactured by Shimadzu Corporation, etc. can be used.

In one embodiment, the magnetic powder (C) may be treated with a surface treatment agent in order to adjust the viscosity of the resin composition and further improve moisture resistance and dispersibility. Examples of the surface treatment agent include vinyl silane coupling agents, (meth)acrylic coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, Examples include silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, and the like. One type of surface treatment agent may be used alone, or two or more types may be used in any combination.

Commercially available surface treatment agents include, for example, "KBM1003" (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical, "KBM503" (3-methacryloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical, and "KBM503" (3-methacryloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical. "KBM403" (3-glycidoxypropyltrimethoxysilane), "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical, "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical , "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical, "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical, "KBM103" (phenyl trimethoxysilane), "KBM-4803" (long chain epoxy type silane coupling agent) manufactured by Shin-Etsu Chemical, "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical etc.

The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the magnetic powder (C). Specifically, 100 parts by mass of the magnetic powder (C) is preferably surface treated with 0.01 parts by mass to 5 parts by mass of a surface treatment agent, and 0.05 parts by mass to 3 parts by mass of a surface treatment agent. It is preferable that the surface be treated, and it is preferable that the surface be treated in an amount of 0.1 parts by mass to 2 parts by mass.

(C) The content (volume %) of the magnetic powder is preferably 0.1 when the nonvolatile component in the resin composition is 100 volume %, from the viewpoint of improving the relative magnetic permeability and reducing the loss coefficient. The content is at least 1% by volume, more preferably at least 1% by volume, even more preferably at least 5% by volume, even more preferably at least 10% by volume, particularly preferably at least 14% by volume. (C) The upper limit of the content (volume %) of the magnetic powder is not particularly limited, but in one embodiment, from the viewpoint of exhibiting the function as a paste-like magnetic adhesive, When the nonvolatile component of is 100% by mass, preferably 85% by volume or less, more preferably 70% by volume or less, even more preferably 60% by volume or less, even more preferably 50% by volume or less, particularly preferably 40% by volume or less. It is.

(C) The content (mass%) of the magnetic powder is preferably 5% by mass when the nonvolatile component in the resin composition is 100% by mass, from the viewpoint of improving the relative magnetic permeability and reducing the loss coefficient. The content is more preferably 20% by mass or more, still more preferably 30% by mass or more, even more preferably 35% by mass or more, particularly preferably 40% by mass or more. (C) The upper limit of the content (mass%) of the magnetic powder is not particularly limited, but in one embodiment, from the viewpoint of exhibiting the function as a paste-like magnetic adhesive, When the nonvolatile components of are 100% by mass, preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less, even more preferably 77% by mass or less, particularly preferably 75% by mass or less. It is.

<(D) Stabilizer>
The resin composition of the present invention may contain (D) a stabilizer as an optional component. (D) The stabilizer has a function of improving the storage stability of the resin composition (particularly a one-component resin composition).

(D) Stabilizers include, for example, borate compounds, titanate compounds, aluminate compounds, zirconate compounds, isocyanate compounds, carboxylic acids, carboxylic acid anhydrides, and the like. (D) The stabilizer may be used alone or in combination of two or more in any ratio.

Examples of borate compounds include trimethylborate, triethylborate, tripropylborate, triisopropylborate, tributylborate, tripentylborate, trihexylborate, tricyclohexylborate, tris(2-ethylhexyl)borate, trioctylborate, and trinonylborate. Trialkylborates such as borate, tridecylborate, tridodecylborate, trihexadecylborate, triotadecylborate; trialkenylborate such as triallylborate; triphenylborate, tris(2-methylphenyl)borate, tris(3- methylphenyl)borate, tris(4-methylphenyl)borate, tris(2-ethylphenyl)borate, tris(3-ethylphenyl)borate, tris(4-ethylphenyl)borate, tris(3,5-dimethylphenyl) Examples include triarylborates such as borate and tris(2,4-dimethylphenyl)borate; trialkylborates such as tribenzylborate; and amino group-containing borates such as triethanolamine borate.

Examples of the titanate compound include tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetrabutyl titanate, and tetraoctyl titanate.

Examples of the aluminate compound include triethyl aluminate, tripropyl aluminate, triisopropyl aluminate, tributyl aluminate, trioctyl aluminate, and the like.

Examples of the zirconate compound include tetraethylzirconate, tetrapropylzirconate, tetraisopropylzirconate, and tetrabutylzirconate.

Examples of the isocyanate compound include n-butyl isocyanate, isopropylisocyanate, 2-chloroethyl isocyanate, phenyl isocyanate, p-chlorophenylisocyanate, benzyl isocyanate, hexamethylene diisocyanate, 2-ethylphenyl isocyanate, 2,6-dimethylphenylisocyanate, Tolylene diisocyanate (e.g. 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate), 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, tolydine diisocyanate, isophorone diisocyanate, xylylene diisocyanate, para Examples include phenylene diisocyanate and bicycloheptane triisocyanate.

Examples of carboxylic acids include saturated aliphatic monobasic acids such as formic acid, acetic acid, propionic acid, butyric acid, caproic acid, and caprylic acid; unsaturated aliphatic monobasic acids such as acrylic acid, methacrylic acid, and crotonic acid; glycolic acid , monobasic oxyacids such as lactic acid; aliphatic aldehydic acids such as glyoxalic acid and grape acid; aliphatic polybasic acids such as oxalic acid, malonic acid, succinic acid, and maleic acid; benzoic acid, p-toluic acid, phenyl Examples include aromatic monobasic acids such as acetic acid, cinnamic acid, and mandelic acid; aromatic polybasic acids such as phthalic acid and trimesic acid; and halogenated fatty acids such as monochloroacetic acid and dichloroacetic acid.

Examples of carboxylic anhydrides include aliphatic polybasic acid anhydrides such as succinic anhydride, dodecynylsuccinic anhydride, maleic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, phthalic anhydride, and trimellitic anhydride. , aromatic polybasic acid anhydrides such as pyrrolimellitic anhydride, and the like.

The content of the stabilizer (D) in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are 100% by mass, it is preferably 1% by mass or less, more preferably 0% by mass. It is .5% by mass or less, more preferably 0.3% by mass or less. The lower limit of the content of the stabilizer (D) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, the lower limit is, for example, 0% by mass or more, 0.0% by mass or more. 001% by mass or more, preferably 0.01% by mass or more, more preferably 0.05% by mass or more, still more preferably 0.1% by mass or more.

<(E) Dispersant>
The resin composition of the present invention may contain (E) a dispersant as an optional component.

(E) Dispersants include, for example, phosphate ester dispersants such as polyoxyethylene alkyl ether phosphoric acid; polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkylphenyl Polyoxyalkylene dispersants such as ether, polyoxyethylene alkylamine, and polyoxyethylene alkylamide; Acetylene dispersants such as acetylene glycol; Polyether-modified polydimethylsiloxane, polyether-modified siloxane, polyester-modified polydimethylsiloxane, etc. Silicone dispersants; anionic dispersants such as sodium polyacrylate, sodium dodecylbenzel sulfonate, sodium laurate, ammonium polyoxyethylene alkyl ether sulfate, sodium carboxymethyl cellulose; polyacrylate resins containing amino groups, amino groups Examples include cationic dispersants such as polystyrene-based resins. (E) Dispersants may be used alone or in combination of two or more.

Commercially available phosphate ester dispersants include "RS-410," "RS-610," and "RS-710" from the "Phosphanol" series manufactured by Toho Chemical Industry Co., Ltd.

Commercially available polyoxyalkylene dispersants include "AKM-0531," "AFB-1521," "SC-0505K," "SC-1015F," and "SC-0708A" from the NOF Corporation's "Marialim" series. , and "HKM-50A".

Commercially available acetylene dispersants include Air Products and Chemicals Inc. Examples include "82," "104," "440," "465," and "485" from the "Surfynol" series manufactured by Manufacturer Co., Ltd., and "Olefin Y."

Examples of commercially available silicone dispersants include "BYK347" and "BYK348" manufactured by BYK Chemie.

Commercially available anionic dispersants include "PN-411" and "PA-111" manufactured by Ajinomoto Fine Techno Co., Ltd.; "A-550" and "PS-1900" manufactured by Lion Corporation.

Commercially available cationic dispersants include "161", "162", "164", "182", "2000", and "2001" manufactured by BIC Chemie; "PB-821" and "PB" manufactured by Ajinomoto Fine-Techno Co., Ltd. Examples include "V-216" and "V-220" manufactured by ISP Japan; "Solspers 13940", "Solspers 24000" and "Solspers 32000" manufactured by Lubrizol.

The content of the dispersant (E) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 1% by mass or less, more preferably 0% by mass. It is .7% by mass or less, more preferably 0.5% by mass or less. The lower limit of the content of the dispersant (E) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is, for example, 0% by mass or more, 0.0% by mass or more. 001% by mass or more, 0.01% by mass or more, preferably 0.05% by mass or more, more preferably 0.1% by mass or more, still more preferably 0.2% by mass or more.

<(F) Curing accelerator>
The resin composition of the present invention may contain (F) a curing accelerator as an optional component.

(F) As the curing accelerator, a latent curing accelerator is preferably used. The latent curing accelerator is an important component especially when preparing a one-component resin composition, and it does not contribute to the curing of (A) epoxy resin at room temperature (25°C), but when heated, it does not contribute to the curing of (A) epoxy resin. It has the function of accelerating the curing of. (F) The curing accelerator may be used alone or in combination of two or more in any ratio.

The latent curing accelerator may be a liquid latent curing accelerator or a solid dispersion type latent curing accelerator, but a solid dispersion type latent curing accelerator is more preferable.

The liquid latent curing accelerator is a liquid that is soluble in the epoxy resin at room temperature (25° C.), and is a compound that functions as a curing accelerator for the epoxy resin when heated. Examples of the liquid latent curing accelerator include, but are not limited to, ionic liquids.

Examples of cations constituting the ionic liquid include imidazolium ions, piperidinium ions, pyrrolidinium ions, pyrazonium ions, guanidinium ions, pyridinium ions, and their hydrocarbon groups (alkyl groups, phenyl groups, combinations thereof, etc.). ) Ammonium cations such as substituted products; phosphonium cations such as tetraalkylphosphonium ions; sulfonium cations such as trialkylsulfonium ions; and the like.

The anions constituting the ionic liquid include halide anions such as fluoride ion, chloride ion, bromide ion, and iodide ion; alkyl sulfate anions such as methanesulfone ion; trifluoromethanesulfonate ion, and hexafluorophosphonate. Fluorine-containing compound anions such as acid ion, trifluorotris(pentafluoroethyl)phosphonate ion, bis(trifluoromethanesulfonyl)imide ion, trifluoroacetate ion, tetrafluoroborate ion: phenol ion, 2-methoxyphenol ion, Phenolic anions such as 2,6-di-tert-butylphenol ion: Acidic amino acid ions such as aspartate ion and glutamate ion: Neutral amino acid ions such as glycine ion, alanine ion, and phenylalanine ion: N-benzoylalanine ion, N - N-acyl amino acid ions such as acetylphenylalanine ion, N-acetylglycine ion, N-acetylglycine ion, etc.; Carboxylic acids such as formate ion, lactate ion, tartrate ion, hippurate ion, N-methyl uric acid, benzoate ion, etc. Examples include a series anion.

A solid dispersion type latent curing accelerator is a solid that is insoluble in an epoxy resin at room temperature (25°C), and is a compound that becomes soluble in an epoxy resin by heating and functions as a curing accelerator for the epoxy resin.

Examples of solid-dispersed latent curing accelerators include, but are not limited to, imidazole compounds that are solid at room temperature (25° C.) and solid-dispersed amine adduct-based latent curing accelerators.

Examples of imidazole compounds that are solid at room temperature (25°C) include 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, and 2-phenyl-4-methyl-5-hydroxy. Methylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, 2, 4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4- Examples include methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole-trimelitate, 1-cyanoethyl-2-phenylimidazole-trimelitate, N-(2-methylimidazolyl-1-ethyl)urea, etc. However, it is not limited to these.

Suitable examples of solid-dispersed amine adduct-based latent curing accelerators are selected from the group consisting of epoxy adducts of amine compounds, urea adducts of amine compounds, and compounds obtained by adding an isocyanate compound to the hydroxyl groups of epoxy adducts. At least one type is mentioned.

Epoxy compounds used as one of the raw materials for producing epoxy adducts of amine compounds include, for example, polyhydric phenols such as bisphenol A, bisphenol F, catechol, and resorcinol, or polyhydric alcohols such as glycerin and polyethylene glycol, and epichlorohydride. Polyglycidyl ether obtained by reacting with phosphorus; glycidyl ether ester obtained by reacting hydroxycarboxylic acid such as p-hydroxybenzoic acid or β-hydroxynaphthoic acid with epichlorohydrin; phthalic acid, terephthalic acid Polyglycidyl esters obtained by reacting polycarboxylic acids such as and epichlorohydrin; glycidylamine compounds obtained by reacting 4,4'-diaminodiphenylmethane, m-aminophenol, etc. with epichlorohydrin Polyfunctional epoxy compounds such as epoxidized phenol novolac resin, epoxidized cresol novolac resin, and epoxidized polyolefin; monofunctional epoxy compounds such as butyl glycidyl ether, phenyl glycidyl ether, and glycidyl methacrylate; It is not limited.

The amine compound used as a raw material for producing the solid-dispersed amine adduct-based latent curing accelerator has one or more active hydrogens in the molecule that can undergo an addition reaction with an epoxy group, and has a primary amino group, a secondary amino group, and Any compound having at least one functional group selected from tertiary amino groups in its molecule may be used. Such amine compounds include, for example, aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; Aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, piperazine, etc. Examples include, but are not limited to, nitrogen-containing heterocyclic compounds.

Among these, compounds having a tertiary amino group in the molecule are raw materials that provide latent curing accelerators with excellent curing accelerating ability, and examples of such compounds include, for example, dimethylaminopropyl. Amine compounds such as amine, diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, N-methylpiperazine, 2-methylimidazole, 2-ethylimidal, 2- Primary or secondary amines having a tertiary amino group in the molecule, such as imidazole compounds such as ethyl-4-methylimidazole and 2-phenylimidazole; 2-dimethylaminoethanol, 1-methyl-2-dimethylamino Ethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-( 2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)- 2-Ethyl-4-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidazoline, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazoline, 2-(dimethylamino) methyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2 -Mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethylaminobenzoic acid, N,N-dimethylglycine, nicotinic acid, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazide, N,N-dimethylpropion Examples include alcohols, phenols, thiols, carboxylic acids, and hydrazides having a tertiary amino group in the molecule, such as acid hydrazide, nicotinic acid hydrazide, isonicotinic acid hydrazide, and the like.

When producing a latent curing accelerator by addition-reacting an epoxy compound and an amine compound, it is also possible to further react with an active hydrogen compound having two or more active hydrogens in the molecule. Examples of such active hydrogen compounds include polyhydric phenols such as bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol, and phenol novolak resin, polyhydric alcohols such as trimethylolpropane, and adipic acid. , polyhydric carboxylic acids such as phthalic acid, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercaptoacetic acid, anthranilic acid, lactic acid, etc. It is not limited.

Examples of the isocyanate compound used as a raw material for producing the solid-dispersed amine adduct-based latent curing accelerator include monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate; hexamethylene diisocyanate, toluylene diisocyanate, and the like; Polyfunctional isocyanate compounds such as isocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, bicycloheptane triisocyanate Furthermore, terminal isocyanate group-containing compounds obtained by reacting these polyfunctional isocyanate compounds with active hydrogen compounds; etc. can also be used. Examples of such terminal isocyanate group-containing compounds include addition compounds having a terminal isocyanate group obtained by the reaction of toluylene diisocyanate and trimethylolpropane, and terminal isocyanate groups obtained by the reaction of toluylene diisocyanate and pentaerythritol. Examples include, but are not limited to, addition compounds having the following.

Furthermore, examples of the urea compound used as a raw material for producing the solid-dispersed amine adduct-based latent curing accelerator include urea, thiourea, etc., but are not limited thereto.

The solid-dispersed amine adduct-based latent curing accelerator can be produced, for example, by appropriately mixing the above-mentioned manufacturing raw materials, reacting at a temperature between room temperature and 200°C, cooling and solidifying, and then pulverizing, or by mixing methyl ethyl ketone, dioxane, etc. It can be easily obtained by reacting in a solvent such as , tetrahydrofuran, removing the solvent, and pulverizing the solid content.

Commercially available solid-dispersed amine adduct-based latent curing accelerators include, for example, "Amicure PN-FJ" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), "Amicure PN-23" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), and "Amicure PN" (manufactured by Ajinomoto Fine-Techno Co., Ltd.). -H” (manufactured by Ajinomoto Fine Techno Co., Ltd.), “Hardener X-3661S” (manufactured by A.C.R. Co., Ltd.), “Hardener TOKA), "Fujicure FXR-1000" (T&K TOKA), "Fujicure FXR-1030" (T&K TOKA), "Novacure HX-3721" (Asahi Kasei), "HX-3722" (Asahi Kasei) (manufactured by Asahi Kasei Corporation), "Novacure HX-3742" (manufactured by Asahi Kasei Corporation), etc.

The content of the curing accelerator (F) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 20% by mass or less, more preferably It is 10% by mass or less, more preferably 7% by mass or less. The lower limit of the content of the curing accelerator (F) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, for example, 0% by mass or more, 0% by mass or more. The content may be .01% by weight or more, 0.1% by weight or more, preferably 0.5% by weight or more, more preferably 1% by weight or more, even more preferably 2% by weight or more.

<(G) Organic filler>
The resin composition of the present invention may further include (G) an organic filler as an optional component.

(G) The organic filler is present in the resin composition in particulate form. (G) As the organic filler, it is preferable to use rubber particles from the viewpoint of significantly obtaining the desired effects of the present invention. (G) The organic filler may be used alone or in combination of two or more in any ratio.

Rubber components contained in the rubber particles include, for example, silicone elastomers such as polydimethylsiloxane; polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, and styrene-isoprene copolymer. Coalescence, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene terpolymer, ethylene-propylene-butene terpolymer Olefin thermoplastic elastomers such as coalescence; heat acrylic thermoplastic elastomers such as propyl poly(meth)acrylate, butyl poly(meth)acrylate, cyclohexyl poly(meth)acrylate, octyl poly(meth)acrylate, etc. Examples include plastic elastomers. Furthermore, a silicone rubber such as polyorganosiloxane rubber may be mixed into the rubber component. The rubber component contained in the rubber particles has a glass transition temperature of, for example, 0°C or lower, preferably -10°C or lower, more preferably -20°C or lower, and even more preferably -30°C or lower.

(G) The organic filler is preferably core-shell type rubber particles from the viewpoint of significantly obtaining the desired effects of the present invention. Core-shell type rubber particles are particulate organic fillers consisting of a core particle containing the rubber component mentioned above and one or more shell layers covering the core particle. Furthermore, core-shell type particles are composed of a core particle containing a rubber component as mentioned above, and a shell portion in which a monomer component copolymerizable with the rubber component contained in the core particle is graft-copolymerized. Preferred are type graft copolymer rubber particles. The core-shell type mentioned here does not necessarily refer only to those in which the core particle and shell part can be clearly distinguished, but also includes those in which the boundary between the core particle and shell part is unclear, and the core particle is in the shell part. It does not have to be completely covered.

The rubber component is preferably contained in the core-shell type rubber particles in an amount of 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more. The upper limit of the content of the rubber component in the core-shell type rubber particles is not particularly limited, but from the viewpoint of sufficiently covering the core particles with the shell part, for example, 95% by mass or less, 90% by mass or less. It is preferable that there be.

Monomer components forming the shell portion of the core-shell rubber particles include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, and (meth)acrylate. (meth)acrylic esters such as octyl acid and glycidyl (meth)acrylate; (meth)acrylic acid; N-substituted maleimides such as N-methylmaleimide and N-phenylmaleimide; maleimide; α such as maleic acid and itaconic acid , β-unsaturated carboxylic acids; aromatic vinyl compounds such as styrene, 4-vinyltoluene, and α-methylstyrene; ) More preferably, it contains methyl acrylate.

Commercial products of core-shell type rubber particles include, for example, "CHT" manufactured by Cheil Industries; "B602" manufactured by UMGABS; and "Paraloid EXL-2602" and "Paraloid EXL-2603" manufactured by Dow Chemical Japan. ", "Paraloid EXL-2655", "Paraloid EXL-2311", "Paraloid-EXL2313", "Paraloid EXL-2315", "Paraloid KM-330", "Paraloid KM-336P", "Paraloid KCZ-201", "Metablen C-223A", "Metablen E-901", "Metablen S-2001", "Metablen W-450A", "Metablen SRK-200" manufactured by Mitsubishi Rayon, "Kane Ace M-511" manufactured by Kaneka, Examples include "Kane Ace M-600," "Kane Ace M-400," "Kane Ace M-580," and "Kane Ace MR-01."

(G) The organic filler may be a dispersion in (A) epoxy resin. The dispersion of (G) organic filler in (A) epoxy resin may be one in which (G) organic filler is dispersed in the form of primary particles in (A) epoxy resin. In the dispersion of (G) organic filler in (A) epoxy resin, the content of (G) organic filler is preferably 10 to 40% by weight.

Examples of commercially available dispersions of (A) epoxy resin dispersions of (G) organic fillers include KaneAce "MX120" and "MX125" manufactured by Kaneka Corporation, which are commercially available as rubbery core-shell polymer-modified bisphenol A epoxy resins; "MX130" (rubber core shell polymer (rubber particle core contains 25% by weight of styrene-butadiene copolymer)), MX960", MX965" (rubber core shell made of silicone rubber (rubber particle core is polydimethylsiloxane, etc.) "RKB-3040" manufactured by Kureha Trading Co., Ltd. (contains 29% by weight of a rubbery core-shell polymer (rubber particle core is butadiene rubber)), "RKB-3040H" (contains a rubbery core-shell polymer (rubber particle core is butadiene rubber)), The particle core contains 25% by weight of butadiene rubber).

The average particle size (average primary particle size) of the organic filler (G) is not particularly limited, but is preferably 20 nm or more, more preferably 30 nm or more, and still more preferably 50 nm or more. (G) The upper limit of the average particle size (average primary particle size) of the organic filler is not particularly limited, but is preferably 5,000 nm or less, more preferably 2,000 nm or less, and even more preferably 1,000 nm. It is as follows. (G) The average particle size (average primary particle size) of the organic filler can be measured using a zeta potential particle size distribution measuring device or the like.

The content of the organic filler (G) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, it is preferably 20% by mass or less, more preferably It is 10% by mass or less, more preferably 5% by mass or less. The lower limit of the content of the organic filler (G) in the resin composition is not particularly limited, but when the nonvolatile component in the resin composition is 100% by mass, for example, 0% by mass or more, 0% by mass or more. It may be .01% by weight or more, 0.1% by weight or more, 1% by weight or more, or 1.5% by weight or more.

<(H) Other additives>
The resin composition of the present invention may further contain arbitrary additives as nonvolatile components. Examples of such additives include phenolic curing agents, naphthol curing agents, acid anhydride curing agents, active ester curing agents, benzoxazine curing agents, cyanate ester curing agents, carbodiimide curing agents, Curing agents other than thiol compounds such as imidazole curing agents; thermoplastics such as phenoxy resin, polyvinyl acetal resin, polyolefin resin, polysulfone resin, polyether sulfone resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, etc. Resin: Organometallic compounds such as organocopper compounds, organozinc compounds, organocobalt compounds; Colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, carbon black; Hydroquinone, catechol, pyrogallol , polymerization inhibitors such as phenothiazine; leveling agents such as siloxane; thickeners such as bentone and montmorillonite; defoaming of silicone antifoaming agents, acrylic antifoaming agents, fluorine antifoaming agents, and vinyl resin antifoaming agents. UV absorbers such as benzotriazole UV absorbers; Adhesion improvers such as urea silane; Silane coupling agents, triazole adhesion agents, tetrazole adhesion agents, triazine adhesion agents, etc. Adhesion imparting agents; Antioxidants such as hindered phenolic antioxidants and hindered amine antioxidants; Fluorescent brighteners such as stilbene derivatives; Surfactants such as fluorine surfactants and silicone surfactants; Phosphorus-based flame retardants (e.g. phosphoric acid ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g. melamine sulfate), halogen-based flame retardants, inorganic flame retardants (e.g. antimony trioxide), etc. Examples include fuel. One type of additive may be used alone, or two or more types may be used in combination in any ratio. (H) The content of other additives can be determined as appropriate by those skilled in the art.

<(I) Organic solvent>
The resin composition of the present invention may further contain an arbitrary organic solvent as a volatile component in addition to the above-mentioned nonvolatile components. As the organic solvent (I), any known organic solvent can be used as long as it can dissolve at least a portion of the nonvolatile components, and its type is not particularly limited. (I) Organic solvents include, for example, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, γ- Ester solvents such as butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether; alcohol solvents such as methanol, ethanol, propanol, butanol, ethylene glycol; Ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate; methyl lactate, ethyl lactate, 2-hydroxyisobutyric acid Ester alcohol solvents such as methyl; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butyl carbitol); N,N-dimethylformamide, Amide solvents such as N,N-dimethylacetamide and N-methyl-2-pyrrolidone; Sulfoxide solvents such as dimethyl sulfoxide; Nitrile solvents such as acetonitrile and propionitrile; Hexane, cyclopentane, cyclohexane, methylcyclohexane, etc. Aliphatic hydrocarbon solvents include aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) The organic solvents may be used alone or in combination of two or more in any ratio. (I) When used, the organic solvents may be used alone or in combination of two or more in any ratio. (I) The smaller the amount of the organic solvent, the better (for example, when the nonvolatile components in the resin composition are 100% by mass, 3% by mass or less, 1% by mass or less, 0.5% by mass or less, 0.1% by mass) (hereinafter, 0.01% by mass or less), and not containing (0% by mass) is particularly preferable.

<Method for manufacturing resin composition>
The resin composition of the present invention can be prepared, for example, in any preparation container (A) epoxy resin, (B) thiol compound, (C) magnetic powder, optionally (D) stabilizer, optionally (E ) a dispersant, as necessary (F) a curing accelerator, as necessary (G) an organic filler, as necessary (H) other additives, and as necessary (I) an organic solvent, They can be produced by adding and mixing in any order and/or some or all at the same time. Further, in the process of adding and mixing each component, the temperature can be set appropriately, and heating and/or cooling may be performed temporarily or throughout. Moreover, in the process of adding and mixing each component, stirring or shaking may be performed. Further, during or after the addition and mixing, the resin composition may be stirred or shaken using a stirring device or shaking device such as a mixer to uniformly disperse the resin composition. Moreover, simultaneously with stirring or shaking, defoaming may be performed under low pressure conditions such as under vacuum. The mixing temperature can be, for example, 10-40°C. The stirring speed during mixing may be, for example, 100 to 10,000 rpm. Mixing time can be, for example, 10 seconds to 10 minutes.

<Characteristics of resin composition>
The resin composition of the present invention includes (A) an epoxy resin, (B) a thiol compound, and (C) magnetic powder, and has an elastic modulus of 500 MPa or less at 25° C. of a cured product of the resin composition, and Since the point elongation is 30% or more, a cured product with excellent impact resistance can be obtained. Impact resistance can be evaluated, for example, by the method of Test Example 5 below.

The cured product of the resin composition of the present invention has an elastic modulus of 500 MPa or less at 25°C. In one embodiment, the elastic modulus at 25°C of the cured product of the resin composition of the present invention is preferably 450 MPa or less, 400 MPa or less, more preferably 350 MPa or less, 300 MPa or less, and further Preferably it is 250 MPa or less, 200 MPa or less, particularly preferably 150 MPa or less, and may be 100 MPa or less. The elastic modulus can be measured, for example, by the method of Test Example 1 below. It is known that the elastic modulus can be controlled to a desired elastic modulus by changing the selection of ingredients and their content.

The cured product of the resin composition of the present invention has an elongation at break of 30% or more at 25°C. In one embodiment, the elongation at break of the cured product of the resin composition of the present invention at 25° C. is preferably 35% or more, 40% or more, more preferably 45% or more, from the viewpoint of further improving impact resistance. , 50% or more, more preferably 55% or more, 60% or more, particularly preferably 65% or more, 70% or more. The elongation at break can be measured, for example, by the method of Test Example 2 below. It is known that the elongation at break can be controlled to a desired elongation by changing the selection of ingredients and their content.

In one embodiment, the relative magnetic permeability (μ') at 23° C. (measurement frequency 100 MHz) of the cured product of the resin composition of the present invention is preferably 1 or more, more preferably 1.3 or more, and even more preferably 1. It may be 6 or more, particularly preferably 2 or more. Relative magnetic permeability can be measured, for example, by the method of Test Example 3 below.

In one embodiment, the viscosity at 25°C of the resin composition of the present invention is not particularly limited, but is preferably 0.001 Pa·s or more, more preferably 0.01 Pa·s or more, and even more preferably 0. .1 Pa·s or more, even more preferably 1 Pa·s or more, particularly preferably 10 Pa·s or more. The lower limit of the viscosity at 25°C of the resin composition of the present invention is not particularly limited, but is preferably 1000 Pa·s or more, more preferably 500 Pa·s or more, still more preferably 100 Pa·s or more, particularly preferably It can be 50 Pa·s or more. The viscosity can be measured, for example, by the method of Test Example 4 below.

The reaction peak temperature based on differential scanning calorimetry is preferably 150°C or lower, 140°C or lower, more preferably 130°C or lower, 120°C or lower, even more preferably 110°C or lower, 100°C or lower, particularly preferably 95°C or lower, It can be below 90°C, below 85°C or below 80°C. By being in such a range, the resin composition can be cured at a relatively low temperature, so that a decrease in magnetic force can be suppressed. The lower limit of the reaction peak temperature may be, for example, 50° C. or higher. Here, the reaction peak temperature based on differential scanning calorimetry is the differential scanning calorimetry curve (DSC curve) obtained when performing differential scanning calorimetry at a heating rate of 5°C/min in the temperature range of 25°C to 300°C. ) is the temperature indicating the peak top located on the coldest side.

The curing temperature of the resin composition of the present invention is determined, for example, by referring to the reaction initiation temperature or reaction peak temperature of the resin composition based on differential scanning calorimetry (DSC), and is determined to be sufficient to carry out the curing reaction. All you have to do is set the temperature to the desired temperature. In one embodiment, since the resin composition of the present invention can be cured at a relatively low temperature, the curing temperature of the resin composition of the present invention is, for example, 180°C or lower, preferably 150°C or lower, 140°C or lower, and more preferably 130°C or lower. ℃ or lower, 120℃ or lower, more preferably 110℃ or lower, 100℃ or lower, particularly preferably 95℃ or lower, 90℃ or lower. Note that the lower the curing temperature is, the more preferable it is in order to further suppress a decrease in magnetic force. The lower limit of the curing temperature may be, for example, 50°C or higher, 60°C or higher, or 70°C or higher. At the above curing temperature, the curing time can be set to, for example, 10 minutes or more, 20 minutes or more, etc. The upper limit of the curing time can be set to 60 minutes or less.

<Applications of resin composition>
The resin composition of the present invention can be used in various semiconductor devices (e.g., electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical equipment, televisions, etc.) and vehicles (e.g., It can be used in various electronic parts in motorcycles, automobiles, trains, ships, aircraft, etc.), such as adhesives, casting agents, sealants, sealants, fiber-reinforced resins, coating agents, etc. It can be suitably used as a paint, etc., and particularly suitably used as an adhesive or a sealant.

In particular, the resin composition of the present invention can suppress the magnetic loss of the magnet, so it can be suitably used in electronic components equipped with a magnet. , Applications for adhering magnets and other components as adherends); Applications for adhering components other than magnets (especially applications for adhering constituent members other than magnets as adherends); After mounting parts containing magnets It is suitable for use in the bonding process of electronic components.

Here, the magnet is not particularly limited, but may be a known permanent magnet such as a ferrite magnet, an alnico magnet, or a rare earth magnet (especially a neodymium magnet). Furthermore, neodymium magnets are known to have a strong tendency to contract when heated and expand when cooled, but in one embodiment, the resin composition of the present invention exhibits excellent adhesion to neodymium magnets. Therefore, it may be particularly suitable as an adhesive for bonding a neodymium magnet as an adherend.

The electronic component equipped with a magnet can be, for example, an electronic component including a motor, in particular a motor containing a neodymium magnet. The resin composition of the present invention can be used as an adhesive for electronic components equipped with a neodymium magnet-containing motor, particularly as an adhesive for bonding a magnet and a casing in a neodymium magnet-containing motor.

Since the resin composition of the present invention is used after being finally cured, electronic components using the resin composition of the present invention may include a cured product of the resin composition of the present invention, and in a specific embodiment, , a neodymium magnet-containing motor, and a cured product of the resin composition of the present invention. Further, a neodymium magnet-containing motor using the resin composition of the present invention may include a cured product of the resin composition of the present invention.

Hereinafter, the present invention will be specifically explained with reference to Examples. The present invention is not limited to these examples. In addition, in the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. The temperature condition when there is no particular temperature specification is room temperature (25° C.).

First, resin compositions of Examples 1 to 11 and Comparative Examples 1 to 4 were prepared by mixing each component according to the formulation shown in Table 1 below. Details are as follows.

<Example 1>
In a special plastic container, 60 parts of a flexible skeleton-containing epoxy resin ("EXA-4850-150" manufactured by DIC Corporation, epoxy equivalent: 450 g/eq) and a dispersion of butadiene rubber particles in epoxy resin ("RKB-3040H" manufactured by Kureha Trading Co., Ltd.) ”, bisphenol A type/F type epoxy resin (rubber-like core shell polymer (butadiene rubber core) 25% dispersion), 40 parts of epoxy equivalent 223 g/eq), thiol compound containing carboxylic acid ester structure (manufactured by Yodo Kagaku Kogyo Co., Ltd. “TMTP”) ”, trimethylolpropane tris (3-mercaptopropionate), thiol equivalent 140 g/eq) 39 parts, magnetic powder (Powder Tech Co., Ltd. “M05SWD”) 110 parts, stabilizer (Tokyo Kasei Co., Ltd. “TEB”), 0.8 parts of triethylborate), 1.1 parts of dispersant (SC-1015F manufactured by NOF Corporation), and 14 parts of amine-epoxy adduct hardening accelerator (PN-FJ manufactured by Ajinomoto Fine-Techno Co., Ltd.) Weighed out.

Then, using a rotation/revolution mixer Awatori Rentaro (manufactured by Shinky Co., Ltd.; ARE-310), the mixture was thoroughly mixed at 2000 rpm at a room temperature of 25°C (confirm that the magnetic powder was sufficiently dispersed and mixed with a spatula.Mixing time (approximately 30 seconds to approximately 1 minute), and then degassed the resin composition under vacuum (pressure set to 0) at 1000 rpm for 2 minutes using an automatic revolution stirring defoaming machine "HM-200W" manufactured by Kyoritsu Seiki Co., Ltd. Obtained.

<Example 2>
Instead of 60 parts of flexible skeleton-containing epoxy resin (“EXA-4850-150” manufactured by DIC Corporation), 60 parts of flexible skeleton-containing epoxy resin (“YX-7400” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 440 g/eq) was used. The amount of the thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.) was changed from 39 parts to 40 parts, and the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed to 110 parts. A resin composition was obtained in the same manner as in Example 1 except that the amount was changed from 120 parts to 120 parts.

<Example 3>
The amount of flexible skeleton-containing epoxy resin ("EXA-4850-150" manufactured by DIC Corporation) was changed from 60 parts to 100 parts, and a dispersion of butadiene rubber particles in epoxy resin ("RKB-3040H" manufactured by Kureha Trading Co., Ltd.) was used. The amount of thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.) was changed from 39 parts to 28 parts, and the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed from 39 parts to 28 parts. A resin composition was obtained in the same manner as in Example 1, except that the amount used was changed from 110 parts to 105 parts.

<Example 4>
The resin composition was prepared in the same manner as in Example 1, except that 110 parts of magnetic powder ("AW2-08PF3F", manufactured by Epson Atomics) was used instead of 110 parts of magnetic powder ("M05SWD", manufactured by Powder Tech). I got something.

<Example 5>
A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed from 110 parts to 155 parts.

<Example 6>
A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed from 110 parts to 268 parts.

<Example 7>
A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed from 110 parts to 416 parts.

<Example 8>
Instead of 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.), a thiol compound containing an isocyanurate structure ("TMPIC" manufactured by Ajinomoto Fine Techno Co., Ltd., tris (3-mercaptopropyl) isocyanurate, thiol) A resin composition was obtained in the same manner as in Example 1, except that 38 parts (equivalent weight: 117 g/eq) was used.

<Example 9>
Instead of 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.), 39 parts of a thiol compound containing a carboxylic acid ester structure ("PE-1" manufactured by Showa Denko Co., Ltd., pentaerythritol tetrakis (3-mercaptobutyrate) ), thiol equivalent: 136 g/eq) A resin composition was obtained in the same manner as in Example 1, except that 33 parts of thiol equivalent (136 g/eq) were used.

<Example 10>
Same as Example 1 except that 1.1 parts of the dispersant ("PB-821" manufactured by Ajinomoto Fine Techno Co., Ltd.) was used instead of 1.1 parts of the dispersing agent ("SC-1015F" manufactured by NOF Corporation). A resin composition was obtained.

<Example 11>
A resin composition was obtained in the same manner as in Example 1, except that 1.1 parts of the dispersant ("SC-1015F" manufactured by NOF Corporation) was not used.

<Comparative example 1>
Instead of 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.), 15 parts of polyamine ("FXR-1081" manufactured by T&K TOKA Co., Ltd.) was used, and magnetic powder ("TMTP" manufactured by Powder Tech Co., Ltd.) was used. A resin composition was obtained in the same manner as in Example 1, except that the amount of M05SWD" used was changed from 110 parts to 90 parts.

<Comparative example 2>
Instead of 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.), 39 parts of an allyl group-containing phenol ("MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., hydroxyl equivalent 141 g / eq) was used, The amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) used was changed from 110 parts to 111 parts, stabilizer ("TEB" manufactured by Tokyo Kasei Co., Ltd., triethyl borate) 0.8 part and dispersant (NOF Corporation). Instead of using 1.1 parts of amine epoxy adduct hardening accelerator (PN-FJ manufactured by Ajinomoto Fine Techno Co., Ltd.), 1.1 parts of phosphorus hardening accelerator (SC-1015F manufactured by Ajinomoto Fine-Techno Co., Ltd.) was used instead. A resin composition was obtained in the same manner as in Example 1, except that 0.4 part of "TBP-DA" (Tetrabutylphosphonium decanoate) manufactured by Co., Ltd. was used.

<Comparative example 3>
Instead of 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.), 35 parts of phenol novolac type cyanate ester ("PT-30" manufactured by Ronza, functional group equivalent of cyanate 124 g / eq) The amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) was changed from 110 parts to 105 parts, and the stabilizer ("TEB" manufactured by Tokyo Kasei Co., Ltd., triethyl borate) 0.8 part and dispersant were added. Instead of using 1.1 parts of the amine epoxy adduct hardening accelerator (“SC-1015F” manufactured by NOF Co., Ltd.) and 14 parts of the metal hardening accelerator (“PN-FJ” manufactured by Ajinomoto Fine Techno), A resin composition was obtained in the same manner as in Example 1, except that 0.4 part of acetylacetone manganese(III) (tris(2,4-pentanedionato)manganese(III)), manufactured by Tokyo Kasei Co., Ltd. was used. Ta.

<Comparative example 4>
Stability was achieved by not using 39 parts of a thiol compound containing a carboxylic acid ester structure ("TMTP" manufactured by Yodo Kagaku Kogyo Co., Ltd.) and changing the amount of magnetic powder ("M05SWD" manufactured by Powder Tech Co., Ltd.) from 110 parts to 79 parts. Without using 0.8 part of agent ("TEB", triethylborate, manufactured by Tokyo Kasei Co., Ltd.) and 1.1 part of dispersant ("SC-1015F", manufactured by NOF Corporation), amine epoxy adduct curing accelerator (Ajinomoto Fine) was used. Example 1 except that 2 parts of a phosphorus curing accelerator ("TBP-DA", manufactured by Hokko Chemical Co., Ltd., tetrabutylphosphonium decanoate) was used instead of 14 parts of "PN-FJ" manufactured by Techno Co., Ltd. A resin composition was obtained in the same manner.

<Test Example 1: Measurement of elastic modulus>
Each resin composition obtained in Examples and Comparative Examples was applied onto a release PET film (NS-80A: manufactured by Toray Industries, Inc.) using a bar coat, and heated (curing at reaction peak temperature ±30°C). Temperature and curing time set to 30 minutes or more (same below): Examples 1 to 11 at 80°C for 30 minutes, Comparative Example 1 at 100°C for 30 minutes, Comparative Example 2 at 180°C for 60 minutes, Comparative Example 3 (for 120 minutes at 200°C, and for Comparative Example 4 at 150°C for 60 minutes), a cured product was obtained. The obtained cured product having a thickness of 100 μm was punched out using a dumbbell (trade name: “Super Dumbbell Cutter (Model: SDMK-5889-01)”, manufactured by Dumbbell Co., Ltd.) to prepare a test piece for tensile strength measurement. The PET film was peeled off from the test piece. A tensile test was conducted using a Tensilon universal testing machine (RTM-500, manufactured by Orientech Co., Ltd.) under conditions of a temperature of 25° C., a humidity of 50%, and a tensile speed of 5 mm/min, and the elastic modulus (MPa) was measured.

In addition, for each example, DSC (differential scanning calorimetry) was measured before and after curing, and the differential scanning calorimetry curve (DSC curve) at the curing reaction temperature that existed before curing in the cured product was calculated. It was confirmed that no peak (peak around 60°C to 90°C) appeared. DSC was measured using a differential scanning calorimeter (DSC7000X, manufactured by Hitachi High-Technology) by increasing the temperature from 25°C to 300°C at a rate of 5°C/min. In all of Examples 1 to 11, the reaction peak temperature was 90°C or lower. FIG. 1 is a DSC chart showing differential scanning calorimetry curves (DSC curves) of the resin composition obtained in Example 1 before and after curing. In FIG. 1, the solid line shows the state before curing, and the broken line shows the state after curing.

<Test Example 2: Measurement of elongation at break>
Each resin composition obtained in Examples and Comparative Examples was applied onto a release PET film (NS-80A: manufactured by Toray Industries, Inc.) using a bar coat, and heated (Examples 1 to 11 at 80°C). (Comparative Example 1 at 100°C for 30 minutes, Comparative Example 2 at 180°C for 60 minutes, Comparative Example 3 at 200°C for 120 minutes, Comparative Example 4 at 150°C for 60 minutes) to obtain a cured product. . The obtained cured product having a thickness of 100 μm was punched out using a dumbbell (trade name: “Super Dumbbell Cutter (Model: SDMK-5889-01)”, manufactured by Dumbbell Co., Ltd.) to prepare a test piece for tensile strength measurement. The PET film was peeled off from the test piece. A tensile test was conducted using a Tensilon universal testing machine (RTM-500, manufactured by Orientech Co., Ltd.) at a temperature of 25° C., a humidity of 50%, and a tensile speed of 5 mm/min, and the elongation at break (%) was measured.

<Test Example 3: Measurement of relative magnetic permeability>
Each resin composition obtained in Examples and Comparative Examples was applied onto a release PET film (NS-80A: manufactured by Toray Industries, Inc.) using a bar coat, and heated (Examples 1 to 11 at 80°C). (Comparative Example 1 at 100°C for 30 minutes, Comparative Example 2 at 180°C for 60 minutes, Comparative Example 3 at 200°C for 120 minutes, Comparative Example 4 at 150°C for 60 minutes) to obtain a cured product. . The PET film was peeled off from the test piece. The obtained cured product having a thickness of 400 μm was cut into test pieces having a width of 10 mm and a length of 30 mm to prepare test pieces for measurement. The relative magnetic permeability (μ' ) was measured. The relative magnetic permeability shown in Table 1 below is the relative magnetic permeability (μ') when the measurement frequency is 100 MHz.

<Test Example 4: Measurement of viscosity>
The temperature of each resin composition obtained in Examples and Comparative Examples was maintained at 25°C (±2°C), and an E-type viscometer (“RE-85U” manufactured by Toki Sangyo Co., Ltd., 3° × R9.7 rotor) was used. The viscosity (Pa·s) was measured using a measurement sample of 0.22 ml and a rotation speed of 20 rpm.

<Test Example 5: Evaluation of impact resistance>
A 4 mm thick fluororubber plate (manufactured by As One Corporation) cut to 60 mm x 100 mm was further cut in half, and a 10 mm x 80 mm rectangle was cut out in the center of one of the two pieces. A mold release agent DAIFREE (GA-9700, manufactured by Daikin Industries, Ltd.) was sprayed on the inside of the hollowed out part, and heated at the curing temperature for 30 minutes.

After the heated fluororubber plates were taken out of the thermostatic oven and cooled, the two fluororubber plates were placed on top of each other, the periphery was secured with clips, and each resin composition obtained in the Examples and Comparative Examples was placed in the rectangular depressions so that the surface Pour it so that it is flat and heat each (Examples 1 to 11 at 80°C for 30 minutes, Comparative Example 1 at 100°C for 30 minutes, Comparative Examples 2 and 3 at 180°C for 60 minutes, Comparative Example 4) was cured at 200° C. for 60 minutes).

After taking it out from the constant temperature bath and cooling it, the cured product was removed from the formwork to obtain a test piece of 10 mm x 80 mm x 4 mm. This test piece was inserted 30 mm into the fixed part of an Izod impact tester (manufactured by Orientec Co., Ltd.), and was struck with a hammer at a position 45 mm from the fixed part to confirm whether the test piece was broken or not. Do not glue the gap between the test piece and the impact test piece fixing part. Moreover, no notch was made on the test piece.

The results of the impact resistance test (N = 3) are evaluated as "○" for non-destructive cases and "x" for broken cases, and the final judgment is that all three out of three tests were non-destructive. Those that were not destroyed twice were marked as "◎", those that were non-destructive twice were marked as "△", those that were non-destructed only once were marked as "△", and those that were destroyed all three times were marked as "x".

The non-volatile components and their usage amounts in the resin compositions of Examples and Comparative Examples, as well as the measurement results and evaluation results of Test Examples are shown in Table 1 below.

<Consideration of evaluation results>
From the resin compositions of Examples 1 to 11, cured products with superior impact resistance were obtained compared to the resin compositions of Comparative Examples 1 to 4. Specifically, in Examples 1 to 11 using thiol compounds, the elastic modulus was kept low, the elongation at break was high, and it was found that the samples had excellent impact resistance. In addition, in Comparative Examples 1 to 3 using other curing agents and Comparative Example 4 using a homopolymerization system of epoxy resin, the elastic modulus and elongation at break were deteriorated, and it was found that they were not effective for impact resistance. was confirmed.

Claims (14)

A resin composition comprising (A) an epoxy resin, (B) a thiol compound, and (C) a magnetic powder,
The elastic modulus of the cured product of the resin composition at 25°C is 500 MPa or less, and the elongation at break of the cured product of the resin composition at 25°C is 30% or more,
A resin composition in which component (A) contains (A-1) a flexible skeleton-containing epoxy resin .
However, the flexible skeleton-containing epoxy resin means an epoxy resin whose main chain includes a saturated chain skeleton composed of skeleton atoms selected from six or more carbon atoms and oxygen atoms. A resin composition comprising (A) an epoxy resin, (B) a thiol compound, and (C) a magnetic powder,
The elastic modulus of the cured product of the resin composition at 25°C is 500 MPa or less, and
The elongation at break of the cured product of the resin composition at 25°C is 30% or more,
A resin composition for use as an adhesive or a sealing material for adhering neodymium magnets as adherends. The resin composition according to claim 1, for use as an adhesive or a sealant. 4. The resin composition according to claim 3, for use as an adhesive or a sealing material for bonding a neodymium magnet as an adherend. The epoxy equivalent of component (A) is 200 g/eq. ～1000g/eq. The resin composition according to any one of claims 1 to 4 . The resin composition according to any one of claims 1 to 5 , wherein component (B) is a difunctional or more functional thiol compound. Any one of claims 1 to 6 , wherein the ratio of the total number of mercapto groups in the thiol compound (B) to the total number of epoxy groups in the epoxy resin (A) (mercapto group/epoxy group) is 0.3 to 1.0. The resin composition according to item 1. The resin composition according to any one of claims 1 to 7 , wherein the content of component (C) is 40% by mass to 75% by mass when the nonvolatile components in the resin composition are 100% by mass. . The resin composition according to any one of claims 1 to 8 , further comprising a latent curing accelerator. The resin composition according to any one of claims 1 to 9 , which has a reaction peak temperature of 100°C or less based on differential scanning calorimetry. A cured product of the resin composition according to any one of claims 1 to 10 . A neodymium magnet-containing motor, comprising the cured product according to claim 11 . An electronic component comprising the cured product according to claim 11 . An electronic component comprising a neodymium magnet-containing motor and the cured product according to claim 11 .

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