JP7414893B1 - Cooling devices and methods for electronic equipment - Google Patents

Abstract

The present invention relates to a technique for efficiently supplying cooling air to a chassis of a server or the like. A cooling device casing 1 has a hexahedral shape, has an air circulation hole 3 in at least a part of a flat surface 2 constituting the hexahedron, and is provided in a server rack in an overlapping manner. A closing plate 4 that covers the flow hole 3 of the casing 1 and is removably attached to the flat surface rotates within a plane that overlaps at least a portion of the flat surface 2, thereby allowing air to flow in a direction intersecting the plane. and a fan 5 that is removably attached to the plane 2. [Selection diagram] Figure 1

Description

The present invention relates to a cooling device and a cooling method for electronic equipment.

In server racks in which servers and other electronic devices are stacked vertically in multiple tiers, the fans installed in each electronic device suck air from inside the server room and remove heat from the heat-generating components inside the devices. A cooling method is adopted in which the energy is absorbed and then released into the server room. In this cooling method, low-temperature air is generally sucked in from the front of the server rack into a so-called cold aisle in an air-conditioned server room, and then exhausted to a hot aisle at the back of the server rack. It is cooled by circulating low-temperature air through it.
Patent Document 1 related to the present invention states that depending on which planes of the hexahedron formed by the chassis stacked in a server rack are closed and which planes are opened, the direction in which cooling air is taken in and discharged is determined. A technique for selecting is disclosed.

Japanese Patent Application Publication No. 2006-32842

However, the server rack described in Patent Document 1 can only change the intake direction and exhaust direction of cooling air, and can change the cooling air according to the heat generation status of electronic devices such as servers housed in the case. It is not possible to set up a cooling air distribution route.

An object of the present invention is to efficiently distribute cooling air to electronic equipment.

In order to solve the above problems, the present invention proposes the following means.
A cooling device for an electronic device according to the present invention includes a housing having a hexahedral shape, having air circulation holes in at least a part of the planes constituting the hexahedron, and provided overlappingly in a server rack; A closing plate that covers the flow hole and is removably attached to the plane, and rotates within a plane that overlaps at least a part of the plane to cause air to flow in a direction intersecting the plane, and to flow into the plane. A plane to which the closing plate is attached and a plane to which the fan is attached constitute a flow regulating mechanism that regulates the inflow direction and the outflow direction of air flowing through the casing.

A method for cooling an electronic device according to the present invention provides a housing having a hexahedral shape and having air circulation holes in at least a part of the planes constituting the hexahedron, and which is provided overlappingly in a server rack; A closing plate that covers the flow hole and is removably attached to the plane, and rotates within a plane that overlaps at least a part of the plane to cause air to flow in a direction intersecting the plane, and to flow into the plane. a step of determining the suction direction and discharge direction of air into the housing by combining a removably attached fan; the determined suction direction and discharge direction; and the position of the heat generating component housed in the housing; and a step of estimating the temperature inside the housing from the combination of the mounting position of the closing plate and the fan from the temperature inside the housing calculated for each combination of the mounting position of the closing plate and the fan. and a step of selecting one.

According to the present invention, cooling air can be efficiently circulated through electronic equipment.

1 is a perspective view showing an example of the minimum configuration of a cooling device according to the present invention. FIG. 2 is a perspective view showing the configuration of parts that constitute the cooling device according to the first embodiment. FIG. 2 is a perspective view of the exterior of the cooling device according to the first embodiment in an assembled state and the interior of the cooling device in a disassembled state. FIG. 3 is an explanatory diagram of the operation of the first embodiment. FIG. 2 is a perspective view showing the appearance of a comparative example of a server rack equipped with a cooling device. FIG. 7 is a perspective view of the external appearance of the cooling device according to the second embodiment in an assembled state and the internal appearance of the cooling device in a disassembled state. FIG. 7 is an explanatory diagram of the operation of the second embodiment. FIG. 7 is a perspective view of the exterior in an assembled state and the interior of a cooling device in a disassembled state according to a third embodiment. FIG. 7 is an explanatory diagram of the operation of the third embodiment. It is a perspective view of a 4th embodiment. It is an explanatory diagram of operation of a 5th embodiment. It is a process diagram of a 6th embodiment.

The configuration according to the present invention will be explained with reference to FIG.
A housing 1 of this cooling device has a hexahedral shape, has air circulation holes 3 in at least a part of a plane 2 constituting the hexahedron, and is provided overlappingly in a server rack. A closing plate 4 that covers the flow hole 3 of the casing 1 and is removably attached to the flat surface rotates within a plane that overlaps at least a portion of the flat surface 2, thereby allowing air to flow in a direction intersecting the plane. and a fan 5 that is removably attached to the flat surface 2. The plane 2 on which the closing plate 4 is attached and the plane 2 on which the fan 5 is attached constitute a flow regulating mechanism that regulates the inflow and outflow directions of air flowing through the casing 1.

According to the cooling device having the above configuration, by attaching the closing plate 4 and/or the fan 5 to the housing 1 to close the circulation hole 3, any surface of the flat surface 2 of the hexahedral housing 1 can be closed. This allows air taken into the housing 1 from the fan 5 provided on any plane 2 to flow out from the circulation hole 3 on any plane 2 without the blocking plate 4. Therefore, depending on the installation conditions of the chassis 1, for example, which of the six planes is open and which is blocked by another server rack, etc., air can be drawn into the chassis 1 from a direction with no obstructions. It is also possible to allow air that has absorbed heat generated from electronic components and the like to flow out in a direction where there is no obstruction, and it is possible to efficiently cool electronic equipment according to its installation conditions.

Further, the minimum configuration of the method for cooling electronic equipment according to the present invention has a hexahedral shape, has air circulation holes 3 in at least a part of the plane 2 constituting the hexahedron, and is provided in a server rack in an overlapping manner. A housing 1 , a closing plate 4 that covers the communication hole 3 of the housing 1 and is removably attached to the flat surface 2 , and rotates within a plane that overlaps at least a portion of the flat surface 2 . 2, and a fan 5 removably attached to the plane 2, to determine the direction of intake and discharge of air into the casing 1. A combination of a step of estimating the temperature inside the housing 1 from the suction direction and the exhaust direction, the position and calorific value of the heat generating components housed in the housing 1, and the mounting positions of the closing plate 4 and the fan 5. and selecting one of the combinations of the mounting positions of the closing plate 4 and the fan 5 from the temperature inside the casing 1 calculated at each time.

According to the above configuration, the closing plate 4 and the fan 5 are attached in various ways to the six planes 2 constituting the casing 1, and the temperatures of the intake air and exhaust air in the attached state are estimated, and the casing is efficiently installed. By selecting a mode capable of cooling the inside of the housing 1, the electronic equipment inside the housing 1 can be efficiently cooled.

A configuration according to a first embodiment of the present invention that embodies FIG. 1 will be described with reference to FIGS. 2 to 4.
2(a) shows a housing 10 that stores a circuit board, electronic parts, etc. to constitute an electronic device, (b) shows a fan 50, (c) shows a closing plate 40, (d) shows a closing plate 41, and (e) ) respectively show the external appearance of the power supply unit 60. In the first embodiment, three closing plates 40, two closing plates 41, five fans 50, and one power supply unit 60 are prepared for one housing 10, and the closing plates 40, 41, and fans 50 are attached to the housing 10 as many as necessary.
The housing 10 is a rectangular parallelepiped made of metal plates and the like, which form a front surface 21, a rear surface 21' parallel to this, an upper surface 22, a lower surface 22' parallel to this, a side surface 23, and a side surface 23' parallel to this. form.
The casing 10 is constructed by combining plates corresponding to each side of a hexahedron, or by attaching plates to a frame corresponding to each side of a hexahedron. Note that the plane of the casing 10 that should be opened does not necessarily have to be made of a plate material with a flow hole as shown in the illustrated example, but it is possible to provide the closing plates 40 and 41 only on the plane that should be closed, and to open it. A configuration may be adopted in which the plane on which the fan 50 is to be provided or the plane on which the fan 50 is to be provided is surrounded by a frame material.
The length of the ridgeline between the top surface 22 and the back surface 21' is L1, the length of the ridgeline between the top surface 22 and the side surface 23' is L2, and the length of the ridgeline between the front surface 21 and the side surface 23. is set to L3.
The front surface 21 and the back surface 21' parallel to the front surface 21, the upper surface 22 and the lower surface 22' parallel thereto, the side surface 23 and the side surface 23' parallel thereto, each have a plurality of communication holes 3. Outside air can flow in and out through 3.
It should be noted that each plane constituting the casing 10 has openings in addition to the communication holes 3 as necessary for the purpose of accessing connectors, disk drives, etc. attached to the casing 10.

The closing plate 40 has a rectangular plate shape with a short side having a length L5 and a long side having a length L6. The length L5 of the short side is set to substantially match the width L3 of the front surface 21, and the length L6 of the long side is set to substantially match the length L1 or L2 of the top surface 22.
The closing plate 41 has a rectangular or square plate shape with side lengths L7×L8, and the L7 is set to match the length L1 of the top surface, and the L8 is set to match the length L2 of the top surface. has been done.
Moreover, the width L3 is, with respect to L1 and L2,
It is set as L3=L1/m=L2/n (m and n are natural numbers).
That is, the closing plate 40 can cover the front surface 21, the rear surface 21', or the side surfaces 23, 23' by being set in a shape that matches the front surface 21, the rear surface 21', or the side surfaces 23, 23', Moreover, it has an external shape that covers part of the upper surface 22 and lower surface 22' by itself, and covers all of the upper surface 22 and lower surface 22' by arranging m or n pieces.
Note that the dimensions of the closing plates 40, 41 are not limited to the above-mentioned L6, L7, L8, but a plurality of them may be set to 1/n (n is a natural number) of these L6, L7, L8 and arranged. Therefore, it is sufficient that a part of the plane forming the hexahedron such as the casings 10 and 10A can be covered.

The fan 50 has a configuration in which a fan body 51 is housed in a duct 52. The duct 52 has a square shape with a side length L4 when viewed in the axial direction, and this length L4 substantially matches the width L3 of the front surface 21. Further, the length L4 is set to L4=L1/m=L2/n (m and n are natural numbers) with respect to the length L1 of the front surface 22 and the length L2 of the side surface 23. That is, the fan 50 has an external shape that can cover part of the front surface 21, top surface 22, and side surface 23 by itself, and can cover the entire front surface 21 and side surface 23 by arranging a plurality of fans in a row.
Note that the closing plates 40, 41 and the fan 50 can be removably attached to the housing 10 by a known structure such as fixed parts such as bolts and nuts, concave-convex fitting, or sliding insertion into a groove.

The power supply unit 60 supplies power to the electronic equipment, the fan 50, etc. housed in the housing 10, and connects a power supply circuit housed in the housing 61 and an AC power source that supplies alternating current to the power supply circuit. It includes a cable 62 and a DC cable 63 that supplies DC rectified by the power supply circuit to the electronic equipment and fan 50 in the housing 10. The casing 61 has a height substantially equal to the height L3 of the casing 10, and has a length smaller than the lengths L1 and L2 of the casing 10. Further, the casing 61 has a configuration having a circulation hole to promote heat dissipation of the heat generated in the power supply circuit, and is intended to close one surface of the casing 10 instead of the closing plates 40 and 41. A configuration without a flow hole may also be used.

The housing 10 is used, for example, as shown in FIG. 3, with a predetermined surface of a hexahedron covered with a closing plate 40.
As shown in FIGS. 3(a) and 3(b), the housing 10 is used with the back surface 21' and left and right side surfaces 23 closed with the closing plate 40, and the lower surface 22' with the closing plate 41 closed. Further, inside the front surface 21 of the housing 10, as shown in FIG. 3(b), five fans 50 are arranged in a row in the horizontal direction. Further, a power supply unit 60 that supplies power to the electronic devices inside the housing 10 and the fan 50 is arranged inside the side surface 23 of the housing 10 .
By blocking the predetermined surfaces with the blocking plates 40 and 41 in this manner, air sucked in from the front surface 21 of the casing 10 can be guided to the top surface 22, as shown by arrow A in FIG. 3(a).

For example, as shown in FIG. 4, the housing 10 is supported so as to be pulled out in the horizontal direction by a rail (not shown) that is horizontally supported by a frame-shaped server rack 70. In the example shown in FIGS. 4(a) and 4(b), the casing 10 shown in FIG. 3 is placed at the top.
Furthermore, six housings 10A are arranged below the housing 10, and these housings 10A have a different arrangement of closing plates than the housing 10.
That is, since the casings 10A are arranged one on top of the other and the top is covered with the casing 10, the front surface 21 and the back surface 21' are open, and the other surfaces are covered with the closing plate 40. It is composed of Furthermore, like the case 10, five fans 50 are arranged inside the front surface 21, and the air sucked in from the front surface 21 is exhausted from the rear surface 21'.

A cooling device for an electronic device according to a comparative example, which is a premise for the operation and effect of the first embodiment configured as described above, will be described with reference to FIG. 5.
The device of the comparative example has a configuration in which a plurality of casings 10A are stacked and housed in a server rack 70. The housing 10A has a hexahedral shape as a whole, and has an open front surface 21 and a rear surface 21', and the other surfaces (top surface, bottom surface, left and right side surfaces) are made of a plate material with no openings. The electronic devices and the like are cooled by absorbing the heat of the electronic components and the like inside the housing 10A by the air sucked in the direction of the arrow A in 5 and discharging it from the back surface 21' in the direction of the arrow A'. Further, the heat of the electronic devices and the like inside each of the casings 10A rises in the direction of arrow D and is naturally radiated.
On the other hand, there are various installation conditions for the server rack 70 in a server room or the like. For example, when the back surface 21' is close to a wall or another server rack, the air is emitted from the back surface 21' of the housing 10A. As shown by arrow A', the air flows forward, and high-temperature air is sucked into the housing 10A from the front surface 21 again in the direction of arrow A, resulting in insufficient cooling within each housing 10A. is possible.

In the first embodiment, among the front surface 21, rear surface 21', upper surface 22, lower surface 22', and side surfaces 23 and 23' of the hexahedral housings 10 and 10A, there are obstacles such as obstacles in the cooling air discharge direction. Closing plates 40 and 41 can be attached so as to close the surface where there is and open the surface where there is no. Therefore, the closing plates 40, 41 are used to close the surfaces where exhaust air tends to circulate, the fan 50 is installed on the surface where cooling air as low as possible can be sucked, and the closing plates 40, 41 are attached to the surfaces where there are no obstructions. Because there is no such thing, the electronic device can be efficiently cooled by sucking the low-temperature air generated inside the casings 10 and 10A.

In the example of FIG. 4(a), as shown in FIGS. 3(a) and 3(b), a fan 50 is provided inside the front surface 21 of the uppermost casing 10 to suck in air and exhaust it from the upper surface 22. In the case 10A below the second stage, air sucked in from the front surface 21 can be discharged from the back surface 21'. Note that between the respective casings 10 and 10A, for example, between the bottom surface of the topmost casing 10 and the top surface of the second casing 10A, by covering only one of them with the closing plate 41, the vertical direction It is possible to establish airflow in a predetermined direction by stopping the flow of air to. That is, between the vertically overlapping casings 10 and 10A, either the plate forming the bottom surface of one of the casings or the plate forming the top surface of the casing located below it can be omitted. .

Further, in the example of FIG. 4(b), the upper surface of the uppermost case 10 is closed with a closing plate 41, and the front surface 21 of the uppermost case 10' is closed, and the side surfaces 23 and 23' are opened. By attaching the closing plate 40, heat rising due to natural convection is prevented from being sucked in in the direction of arrow C from the uppermost casing 10 as shown by A in the figure, and is transferred to the casing 10' which is smaller than the casing 10. It is possible to suppress the suction of high-temperature air, and to suck air from the side surfaces 23 and 23' in the direction of arrow C', which is less affected by the exhaust gas from the rear surface 21'.
The casing 10' is a small casing such as a network switch, for example, and although the dimension in the width direction of the server rack 70 matches that of the casing 10, the dimension in the depth direction is small. opens into the server rack 70, and there is a concern that heat dissipation due to natural convection generated from the uppermost casing 10 in the direction of arrow A may be sucked in in the direction of arrow C.
In the example of FIG. 4(b), cooling air is sucked in from outside the area surrounded by the server rack 70 by closing the front surface 21 of the housing 10' with the closing plate 41 and opening the side surface 23. be able to. Note that the illustrated installation conditions for the server rack 70, for example, when other server racks are arranged in close proximity and there is little heat radiation in the direction of arrow A from the top surface of the uppermost casing 10, , the side surface 23 may be closed and cooling air may be sucked in from the front surface 21.

As explained above, in the first embodiment, as shown in the comparative example in FIG. Under airflow conditions in which heat is dissipated in the direction of arrow D by natural convection from 10A, the high temperature cooling air released to the back side as shown by arrow A' in the same figure circulates to the front side and is sucked into the housing 10A again. It is possible to prevent a decrease in cooling capacity due to

A second embodiment will be described with reference to FIGS. 6 and 7.
This second embodiment has a configuration in which the upper surface 22 and lower surface 22' of the housing 10B are opened, and the front surface 21, the rear surface 21', and the side surfaces 23 and 23' are closed by a closing plate 40. A fan 50 is attached to the outside of the upper surface 22 (or the inner surface of the housing 10B), and as shown by arrow A in FIG. By discharging the air from 22, the inside of the housing 10B is cooled.

As shown in the second embodiment, cooling in which cooling air is circulated from the lower surface 22' to the upper surface 22 is suitably adopted, for example, in the installation condition where exhaust equipment is provided on the ceiling of the server room, and the case 10B as a server is The heat generated in the server room is discharged upward without going against natural convection, and is sucked into the exhaust equipment on the ceiling, allowing the server room to be efficiently cooled.

A third embodiment will be described with reference to FIGS. 8 and 9.
This third embodiment has a configuration in which the lower surface 22' and one side surface 23' of the housing 10C are opened, and the front surface 21, the rear surface 21', the upper surface 22, and the other side surface 23 are closed by a closing plate 40. A fan 50 is attached to the inside of the side surface 23', and as shown by arrow E in FIG. The inside of the 10C is cooled.

In the third embodiment, cooling is performed by circulating cooling air from the lower surface 22' to one side surface 23'. When there are other server racks near the rear side 21' and side surface 23), the heat from the lower case 10C is discharged to the side in order to suppress the influence of the heat on the upper case 10C. , can be efficiently cooled.
Furthermore, since the planes blocked by the blocking plates 40 and 41 can be changed, the exhaust direction of the cooling air can be changed to an appropriate direction in accordance with the addition of server racks 70, change in arrangement, etc.

A fourth embodiment will be described with reference to FIG.
The fourth embodiment has a configuration in which casings 10A are stored in multiple stages within a server rack 70, and two casings 10' with small dimensions in the depth direction are arranged one behind the other at the top.
Here, the front case 10' has a front surface 21 and one side surface 23' open, and the rear case 10' has one side surface 23 and another side surface 23' open, and the other surface has a configuration closed by a closing plate 40 or 41.

In this fourth embodiment, of the two housings 10' arranged one behind the other at the same height, the cooling air sucked in from the front surface 21 on the front side is directed from one side surface 23' in the direction of arrow E. On the rear side, the cooling air sucked in from one side surface 23 can be discharged in the direction of arrow F and from the other side surface 23' in the direction of arrow G. Therefore, even though the two casings 10' are arranged at the same height, the air that is sucked into one casing 10' and whose temperature rises by absorbing the heat of the internal heat-generating components flows into the other casing 10'. It is possible to prevent the phenomenon of being sucked into the casing 10' and causing a decrease in the cooling capacity of the other casing 10'.

A fifth embodiment will be described with reference to FIG. 11.
In the fifth embodiment, a plurality of casings 10C are stored in a server rack 70 in a plurality of stages, each of which is closed so that the cooling air sucked in from a lower surface 22' is discharged from one side 23', as shown by an arrow E. It has a structure with a plate.
Furthermore, one housing 10C and the other housing 10C are each equipped with a temperature sensor (not shown) and can measure the internal temperature. (not shown), so that the amount of air blown can be adjusted.

For example, when the temperature of the upper case 10C increases, compare its own temperature with the temperature of the lower case 10C, and if the temperature of both cases 10C increases, both cases Increase the rotation speed of the fans in the upper and lower housings 10C to increase the cooling capacity, and if only the temperature of the housing itself is rising, increase the rotation speed of the fans in the upper and lower housings 10C. By controlling the cooling capacity, efficient cooling can be achieved.

FIG. 12 shows each step of the cooling method according to the sixth embodiment of the present invention.
This cooling method consists of a step SP1 in which parameters are input to specify the cooling conditions, a step SP2 in which the heat transfer situation is simulated based on the input parameters, and the best parameters are selected from the simulation results. The configuration of the cooling device that can realize the parameters, specifically, includes a step SP3 of determining which side of the casing should be opened, which side should be closed, and which side should have the fan disposed.

In the above step SP1, the model number (model type, serial number, etc.) of each installed device (for example, a server with circuit boards and electronic components mounted inside the case) is used to distinguish the device from other devices. Parameters related to the cooling specifications, such as intake position, exhaust position, heat generation amount of electronic components, etc., and operating temperature of electronic components, etc., are stored in a database by linking them to the relevant model number. Use this as the selection key to select the parameters necessary for heat transfer simulation for that equipment. Also, for example, the conditions of whether or not to provide the closing plate 40 and the fan 50 for each of the six planes constituting the casing 10 of the model with the model number, i.e., which plane should be used for sucking cooling air. Parameters such as which surface should be used as the opening for discharge are set.
In addition, you can set the mounting position (in what tier) of each installed device on the server rack, and set the installation conditions for the server rack, such as the cooling capacity of the air conditioner in the server room, the intake and exhaust conditions, and the surrounding area of the first server rack. Set installation conditions such as the walls, ceiling, and placement of other server racks (for example, whether a certain surface is covered by a wall or other shielding object such as another device).
In the above step SP2, while changing the parameters set in the above step SP1, heat transfer conditions are determined for various combinations of intake positions, exhaust positions, positions of electronic components, calorific value, intake and exhaust directions, intake and exhaust flow rates, etc. to determine the model number of equipment that has the parameters that provide the desired heat transfer situation. Note that the target heat transfer situation refers to whether or not the temperature of the cooling air drawn in and the temperature of the electronic components, etc. in the housing 10 (usable temperature range of the electronic components, etc.) are within the target temperature range. Judgments are made based on such indicators.
In the above step SP3, the state in which the closing plates 40, 41 and the fan 50 are attached to the housing 10 (which planes are open and which planes are closed) is determined so that the air intake and exhaust conditions selected in SP2 can be realized. , the combination of which plane the fan will be installed on).
When evaluating the heat transfer situation above, if it is possible to achieve the same heat transfer situation (temperature conditions at a given location within the housing), reduce the number of fans or the number of rotations (power consumption) as much as possible. It is desirable to select a combination that allows for

Note that instead of simulating the heat transfer situation, the attachment to the closing plate may be evaluated by estimating the temperature inside the casing based on the air circulation situation within the casing using the following procedure.
The flow rate of the air flowing inside the housing 10 is determined by the air flow rate of the fan 50, the air blowing pressure, the opening area of the inlet, the opening area of the outlet, the cross-sectional area and cross-sectional shape of the flow path from the inlet to the outlet. The mounting of the closing plates 4, 41 on each of the flat surfaces 21, 22, 23 constituting the housing 10 is By identifying the presence or absence (blocked area), it is possible to identify factors such as the length of the flow path from the inflow point to the outflow point of the cooling air, the cross-sectional area of the flow path (and its shape), the presence or absence of bends in the flow path, etc. Flow path resistance can be calculated. The flow rate of cooling air inside the housing is calculated based on this flow path resistance, and the inlet and outlet ports with the lowest flow path resistance are determined from the temperature calculation results based on the flow rate for various combinations of closing plates and fan placement. The positions of the closing plate and the fan may be determined to realize the selected inlet and outlet.

Of course, the shape of each surface of the hexahedron forming the casing, the number and size of the communication holes, or the configuration of the fan and server rack are not limited to the embodiments.

Although the embodiments of the present invention have been described above in detail with reference to the drawings, the specific configuration is not limited to these embodiments, and may include design changes within the scope of the gist of the present invention.

The present invention relates to a cooling device and a cooling method for electronic equipment.

1 Housing 2 Plane 3 Distribution hole 4 Closing plate 5 Fans 10, 10A, 10B, 10C Housing 21 Front (plane)
21' Back (plane)
22 Top surface (plane)
22' Bottom surface (plane)
23, 23' Side (plane)
50 Fan 51 Fan body 52 Duct 40 Closing plate 41 Closing plate 60 Power supply unit 61 Housing 62 AC cable 63 DC cable 70 Server rack 71 Communication line

Claims (6)

A housing having a hexahedral shape and having air circulation holes in at least a part of the planes forming the hexahedron, and which is stacked in a server rack;
a closing plate that covers the flow hole of the housing and is removably attached to the flat surface;
A fan that rotates within a plane that overlaps at least a portion of the plane to circulate air in a direction intersecting the plane, and that is detachably attached to the plane;
Equipped with
A plane on which the closing plate is attached and a plane on which the fan is attached constitute a flow regulation mechanism that regulates the inflow direction and outflow direction of air flowing through the casing ,
The closing plate includes a first closing plate that covers the entire plane by itself, and a second closing plate that can cover the entire plane by arranging a plurality of plates along the plane.
has,
Cooling equipment for electronic equipment. The fan has a shape that can cover the entire plane by arranging a plurality of fans along the plane when viewed in the direction of the rotation center axis of the fan.
The cooling device for electronic equipment according to claim 1. The circulation regulating mechanism regulates the outflow direction of air by the attachment range of the closing plate on a plane other than the one plane on which the fan is provided.
The cooling device for electronic equipment according to claim 1. comprising a power supply unit having a planar shape that overlaps at least a portion of the plane;
The cooling device for electronic equipment according to any one of claims 1 to 3 . A housing having a hexahedral shape and having air circulation holes in at least a part of the planes forming the hexahedron, and which is stacked in a server rack;
a closing plate that covers the flow hole of the housing and is removably attached to the flat surface;
A fan that rotates within a plane that overlaps at least a portion of the plane to circulate air in a direction intersecting the plane, and that is detachably attached to the plane;
A step of determining the suction direction and discharge direction of air into the casing, with a plane that can suck air as low as possible among the planes constituting the hexahedron as the suction direction;
estimating the temperature inside the housing from the determined suction direction and discharge direction, and the position and calorific value of a heat generating component housed in the housing;
Selecting one of the combinations of the mounting positions of the closing plate and the fan from the temperature inside the casing calculated for each combination of the mounting positions of the closing plate and the fan;
has
The closing plate includes a first closing plate that covers the entire plane by itself, and a second closing plate that can cover the entire plane by arranging a plurality of plates along the plane.
has,
How to cool electronic equipment. storing parameters for specifying the heat transfer state of electronic devices for each identification number that identifies electronic devices with different specifications;
reading out parameters linked to the identification number by inputting the identification number;
It further has
The parameters include the presence or absence of the closing plate and fan for the hexahedron that constitutes the casing of the electronic device;
The method for cooling an electronic device according to claim 5 .

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