JP7496505B2 - Component mounting system and component mounting method - Google Patents

Description

The present invention relates to a component mounting system and a component mounting method.

Conventionally, there is a system in which electronic components such as a drive circuit are mounted on a substrate of a display panel such as a liquid crystal panel or an organic EL (Electro Luminescence) panel (see, for example, Patent Document 1).

The electronic component bonding device disclosed in Patent Document 1 includes an outer lead bonding section, a first compression bonding section, and a second compression bonding section. The bonding device performs alignment in the outer lead bonding section, and then performs main compression bonding in the first and second compression bonding sections. The bonding device aligns the electronic component with the display panel, anticipating misalignment that may occur when the electronic component is compressed onto a display panel such as an LCD (Liquid Crystal Display). This allows the bonding device to perform accurate bonding.

Japanese Patent Application Laid-Open No. 7-201932

In Patent Document 1, for example, electronic components are mounted on a display panel, and the amount of positional deviation of the mounted electronic components from a predetermined position is obtained for 50 display panels (samples), and the average of the amount of positional deviation for each of the obtained 50 samples is calculated as the amount of correction for correcting the mounting position at which the mounting device mounts the components.

Here, if the number of samples is too small, a value far from the optimal correction amount may be calculated. In other words, if the number of samples is too small, there is a risk that a correction amount with low accuracy will be calculated. This will result in low mounting accuracy and a risk of reduced yield. On the other hand, if the number of samples is too large, there will be many display panels on which electronic components are mounted without correction. This will result in an increase in the number of electronic components mounted with low mounting accuracy, and there is a risk of reduced yield.

As such, if the number of samples is too large or too small, there is a risk of reduced yield.

The present invention provides a component mounting system that can suppress a decrease in yield.

A component mounting system according to one aspect of the present invention includes a mounting device that mounts components on a substrate, a calculation unit that calculates a correction amount for the mounting device to correct a mounting position at which the mounting device mounts a component on a substrate based on an amount of deviation from a predetermined position of a component mounted on the substrate by the mounting device, a control unit that causes the mounting device to correct the mounting position based on the correction amount, and an input unit that receives an input for causing the mounting device to correct the mounting position, and the control unit is configured to detect an unreached number of substrates on which components have been mounted by the mounting device before the number of substrates on which the mounting device has mounted components reaches a predetermined number. During the period, the input unit determines whether the input has been received, and if the input unit determines that the input has been received, the mounting device corrects the mounting position based on a first correction amount calculated by the calculation unit based on the deviation amount measured from each of the processed number of boards, and if the input unit determines that the input has not been received, the mounting device mounts components on the specified number of boards, and the mounting device corrects the mounting position based on a second correction amount calculated by the calculation unit based on the deviation amount measured from each of the specified number of boards.

In addition, a component mounting method according to one aspect of the present invention includes mounting components on a board using a mounting device, calculating a correction amount for the mounting device to correct the mounting position at which the mounting device mounts the components on the board based on the amount of deviation from a predetermined position of the position of the components mounted on the board by the mounting device, determining whether or not an input for causing the mounting device to correct the mounting position has been received during a period before the number of boards processed by the mounting device to mount components on the board reaches a predetermined number, and if it is determined that the input has been received, causing the mounting device to correct the mounting position based on a first correction amount calculated based on the amount of deviation measured from each of the processed number of boards, and if it is determined that the input has not been received, causing the mounting device to mount components on the specified number of boards and causing the mounting device to correct the mounting position based on a second correction amount calculated based on the amount of deviation measured from each of the specified number of boards.

These comprehensive or specific aspects may be realized as a system, method, integrated circuit, computer program, or computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, method, integrated circuit, computer program, and recording medium.

The present invention provides a component mounting system that can suppress a decrease in yield.

FIG. 1 is a plan view showing a component mounting system according to an embodiment. FIG. 2 is a block diagram showing a configuration of a component mounting system according to an embodiment. FIG. 3 is a schematic perspective view for explaining a position where the imaging unit images the board. FIG. 4 is a rear view showing the board on which components are mounted. FIG. 5 is a diagram for explaining the amount of deviation measured by the inspection device according to the embodiment. FIG. 6 is a flowchart showing a processing procedure of the component mounting system according to the embodiment.

The following describes in detail the component mounting system and the like according to the embodiments of the present invention with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement and connection form, steps and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that show the highest concept of the present invention are described as optional components.

The figures are schematic diagrams and are not necessarily precise illustrations. In each figure, the same components are given the same reference numerals.

In addition, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are mutually orthogonal, and are both orthogonal to the Z-axis. In addition, in the following embodiments, the substrate transport direction may be described as the positive X-axis direction, the positive Z-axis direction as the upward direction, and the negative Z-axis direction as the downward direction.

(Embodiment)
[composition]
First, the configuration of a component mounting system according to an embodiment will be described.

Figure 1 is a plan view showing a component mounting system 1 according to an embodiment. Figure 2 is a block diagram showing the configuration of the component mounting system 1 according to an embodiment. Figure 3 is a schematic perspective view for explaining the position where the imaging unit 37 images the board 400.

In FIG. 1, the inspection device 200 and the control device 300 are illustrated as functional blocks. For example, the inspection device 200 is connected to the control device 300 so as to be capable of wireless communication or wired communication via a control line or the like. Also, for example, the control device 300 is connected to each device included in the mounting device 100, such as the attachment unit 20, the temporary crimping unit 30, the main crimping unit 40, and the transport unit 60, so as to be capable of wireless communication or wired communication via a control line or the like, and controls each device.

In addition, in FIG. 3, the stage 31 on which the substrate 400 is placed and some of the components of the temporary bonding unit 30, such as the backup stage, are not shown. In addition, in FIG. 3, the mounting head moving mechanism 36 is shown as a functional block.

The component mounting system 1 is a system that mounts a component 440 on a substrate 400. Specifically, the component mounting system 1 is a system that attaches an ACF 430, which is an anisotropic conductive member, to a substrate 400 on which an electrode portion 410 is formed, and mounts the component 440 on the substrate 400 via the ACF 430. In this embodiment, the component mounting system 1 (more specifically, the mounting device 100) thermocompresses the component 440 onto the substrate 400 via the ACF 430.

The substrate 400 is a display panel such as a liquid crystal display panel or an organic EL panel. In this embodiment, the substrate 400 is a substrate that is translucent (more specifically, transparent).

The electrode section 410 is, for example, composed of an electrode.

Component 440 is, for example, an electronic component in which a drive circuit and the like are formed, and examples of such components include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

The component mounting system 1 includes a mounting device 100, an inspection device 200, and a control device 300.

The mounting device 100 is a device (system) that mounts a component 440 on a substrate 400. In this embodiment, the mounting device 100 thermocompresses the component 440 onto the substrate 400. Specifically, the mounting device 100 places (temporarily press-bonds) the component 440 onto the substrate 400 based on the positions of a mark 420 provided on the substrate 400 and a mark 421 (see FIG. 4) provided on the back surface of the component 440, and then thermocompresses (mainly press-bonds) the temporarily pressed component 440 to the substrate 400.

The mounting device 100 includes a board loading section 10, an adhesion section 20, a temporary pressure bonding section 30, a permanent pressure bonding section 40, a board unloading section 50, and a transport section 60. The board loading section 10, the adhesion section 20, the temporary pressure bonding section 30, the permanent pressure bonding section 40, and the board unloading section 50 are connected in this order. The mounting device 100 executes a component mounting process (component pressure bonding process) in which components 440 are mounted (in this embodiment, temporary pressure bonding and permanent pressure bonding) on electrode sections 410 provided on the periphery of the board 400 that is loaded from the board loading section 10 on the upstream side of the board 400 being transported. The board 400 on which the components 440 are mounted is transported to the board unloading section 50, and is unloaded from the board unloading section 50 to the inspection device 200.

The substrate loading section 10 includes a stage 11 mounted on a base 1a. A substrate 400 on which an electrode section 410 is formed is placed on the stage 11.

The adhesion unit 20 is a device that performs an adhesion process in which the ACF 430, which is an adhesive member, is adhered (attached) to the electrode portion 410 of the substrate 400. The adhesion unit 20 includes a stage 21, a stage movement unit 22, and an adhesion mechanism 23.

Stage 21 is the stage on which the substrate 400 transported from stage 11 is placed.

The stage moving unit 22 is a mechanism that moves the substrate 400 placed on the stage 21. The stage moving unit 22 includes, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, and a Z-axis table that is movable in the Z-axis direction. The stage moving unit 22 moves the substrate 400 placed on the stage 21 by the X-axis table, the Y-axis table, and the Z-axis table.

The adhesion mechanism 23 is a device that adheres the ACF 430 to the electrode portion 410 of the substrate 400. The adhesion mechanism 23 includes, for example, a supply unit that supplies the ACF 430, and an adhesion tool for adhering the ACF 430 to the substrate 400. The adhesion tool is, for example, disposed above the base 1b, and has an adhesion head for adhering the ACF 430 supplied from the supply unit to a position corresponding to the electrode portion 410 of the substrate 400.

The temporary bonding unit 30 is a device that performs a temporary bonding process in which a component 440 is placed (more specifically, temporarily bonded) at the position on the substrate 400 where the ACF 430 has been attached by the attachment unit 20.

The temporary bonding unit 30 includes a stage 31, a stage movement unit 32, a component supply unit 33, and a temporary bonding tool 34.

Stage 31 is the stage on which the substrate 400 with ACF 430 attached is placed.

The stage moving unit 32 is a mechanism for moving the substrate 400. The stage moving unit 32 includes, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, and a Z-axis table that is movable in the Z-axis direction.

The stage moving unit 32 has a structure similar to that of the stage moving unit 22 of the adhesion unit 20, and has the function of holding the substrate 400 and moving it in a horizontal plane using an X-axis table, a Y-axis table, and a Z-axis table, as well as raising and lowering it in the vertical direction and rotating it around the Z axis.

The component supply unit 33 is a mechanism that supplies components 440 to the temporary crimping tool 34.

The temporary bonding tool 34 is a device that places the component 440 on the substrate 400 via the ACF 430. The temporary bonding tool 34 includes a mounting head 35 (shown in FIG. 3) provided on the base 1b, a mounting head moving mechanism 36 (shown in FIG. 3) for moving the mounting head 35, an imaging unit 37 (shown in FIG. 3), and a mounting support table (so-called backup stage) for supporting the substrate 400.

The mounting head 35 is a head for picking up (suctioning) the component 440 and placing the picked-up component 440 on the substrate 400.

The mounting head moving mechanism 36 is a device for moving the mounting head 35. The mounting head moving mechanism 36 is realized, for example, by a motor and a guide for moving the mounting head 35.

The imaging unit 37 is a camera that captures images of the board 400 and the component 440 so that the mounting head 35 can place the component 440 on the board 400 in the appropriate position.

The mounting head 35 is freely movable in a horizontal plane by the mounting head moving mechanism 36, and moves up and down in the Z-axis direction to pick up the component 440 supplied by the component supply unit 33 from above. The temporary bonding tool 34 uses information obtained from the imaging unit 37 to place the component 440 picked up by the mounting head 35 on the ACF 430 and presses the component 440 together with the substrate 400 against the mounting support base, thereby placing the component 440 on the substrate 400.

The final bonding unit 40 is a device that performs a final bonding process (i.e., a thermocompression process) in which the component 440 placed on the substrate 400 by the temporary bonding unit 30 is final bonded (i.e., thermocompression bonded) to the substrate 400.

By doing this, the electrode portion 410 formed on the substrate 400 and the component 440 are electrically connected via the ACF 430.

The final crimping unit 40 comprises a stage 41, a stage moving unit 42, and a final crimping tool 43.

Stage 41 is the stage on which the substrate 400 with the component 440 temporarily bonded thereto is placed.

The stage moving unit 42 has a structure similar to that of the stage moving unit 22 of the bonding unit 20, and has the function of holding the substrate 400 and moving it in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis using an X-axis table, a Y-axis table, and a Z-axis table. The stage moving unit 42, for example, moves the substrate 400 held by the stage 41 in a predetermined direction, and moves the substrate 400 on which the component 440 is placed to a component bonding position where the component 440 is thermocompression bonded.

The main bonding tool 43 is a mechanism for thermocompression bonding the component 440 to the substrate 400. The main bonding tool 43 includes, for example, a compression head and a heater for heating the compression head. The main bonding tool 43 uses the compression head heated by the heater to press the component 440 against the substrate 400 via the ACF 430 while heating it, thereby thermocompressing it.

The substrate unloading section 50 includes a stage 51 mounted on a base 1c. The substrate 400 transported from the main pressure bonding section 40 is held on the stage 51. The substrate 400 held in the substrate unloading section 50 is transported to an inspection device 200 located downstream of the mounting device 100.

The transport unit 60 is a device that transports the substrate 400. Specifically, the transport unit 60 transports the substrate 400 that has been brought into the substrate carry-in unit 10 between the predetermined working units to the bonding unit 20, the temporary bonding unit 30, the full bonding unit 40, and the substrate carry-out unit 50 in this order. The transport unit 60 is disposed in the front area (negative Y-axis direction side) of the bonding unit 20, the temporary bonding unit 30, and the full bonding unit 40.

The transport unit 60 is provided with, in order from the upstream side, a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D on a moving base 61 that extends in the X-axis direction across bases 1a, 1b, and 1c.

Each of the substrate transport mechanisms 62A-62D includes a base 63 and one or more arm units 64. In this embodiment, an example is shown in which each of the substrate transport mechanisms 62A-62D includes two arm units 64.

The base 63 is mounted on a movable base 61 and moves freely in the X-axis direction. Two arm units 64 are mounted side by side in the X-axis direction on the base 63. The arm unit 64 has one or more arm-shaped suction nozzles extending horizontally mounted side by side in the X-axis direction, and the arms are provided with suction pads with their suction surfaces facing downward. The arm unit 64 suctions the substrate 400 from above via the suction pads mounted on the suction nozzles, and transports the substrate 400 that has been suctioned.

For example, the substrate transport mechanism 62A receives the substrate 400 placed on the stage 11 of the substrate carry-in section 10 and transfers it to the stage 21 of the bonding section 20. Also, for example, the substrate transport mechanism 62B receives the substrate 400 from the stage 21 of the bonding section 20 and transfers it to the stage 31 of the temporary pressure bonding section 30. Also, for example, the substrate transport mechanism 62C receives the substrate 400 from the stage 31 of the temporary pressure bonding section 30 and transfers it to the stage 41 of the main pressure bonding section 40. Also, for example, the substrate transport mechanism 62D receives the substrate 400 from the stage 41 of the main pressure bonding section 40 and transfers it to the stage 51 of the substrate carry-out section 50.

The inspection device 200 is a device that measures (inspects) the position where the component 440 is mounted on the board 400. Specifically, the inspection device 200 is a device that inspects the positional deviation (deviation amount L shown in FIG. 5) of the position where the component 440 is mounted from a predetermined position. The inspection device 200 is, for example, a computer equipped with a camera. The computer is realized by, for example, a communication interface for communicating with the imaging unit 210 and the control device 300, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, a processor for executing the program, etc.

The inspection device 200 includes an imaging unit 210 and a measurement unit 220.

The imaging unit 210 is a camera for identifying the position of the mark 420 on the board 400 and the position of the mark 421 on the component 440.

Figure 4 is a back view showing the substrate 400 on which the component 440 is mounted. In this embodiment, the substrate 400 is a transparent substrate, so in Figure 4 the configuration of the component 440 and other components located above the substrate 400 can also be seen.

The imaging unit 210, for example, captures an image of the substrate 400 from below the substrate 400 to generate an image including the mark 420 provided on the substrate 400 and the mark 421 provided on the component 440.

The measurement unit 220 is a processing unit that measures (inspects) the position where the component 440 is mounted on the board 400 based on the image generated by the imaging unit 210.

Figure 5 is a diagram for explaining the amount of deviation L measured by the inspection device 200 according to the embodiment. Figure 5 is a diagram that shows, for example, a schematic example of an image generated by the imaging unit 210.

For example, the control device 300 places the component 440 on the substrate 400 by controlling the temporary bonding unit 30. Here, when the component 440 is placed on the substrate 400, the position of the component 440 relative to the substrate 400 may deviate from the desired position.

For example, the control device 300 attempts to place the component 440 on the substrate 400 by controlling the temporary bonding unit 30 so that the mark 421 shown in FIG. 5 overlaps with the predetermined position 450. However, when the component 440 is actually placed on the substrate 400, the mark 421 may be shifted from the predetermined position 450. In particular, in this embodiment, after the temporary bonding unit 30 places the component 440 on the substrate 400, the main bonding unit 40 permanently bonds the component 440 to the substrate 400. Therefore, even if the temporary bonding unit 30 properly places the component 440 on the substrate 400, when the main bonding unit 40 permanently bonds the component 440 to the substrate 400, the component 440 may be shifted relative to the substrate 400.

The measurement unit 220 measures the amount of deviation L (e.g., distance) between the mark 421 and the predetermined position 450, for example, based on the image generated by the imaging unit 210.

The measurement unit 220 outputs information indicating the measured amount of deviation L to the control device 300.

For example, in the component mounting system 1, components 440 are sequentially mounted (pre-bonded and final bonded) on multiple boards 400. The imaging unit 210 generates images by sequentially capturing images of the multiple boards 400 on which the components 440 are mounted, and sequentially outputs the generated images to the measurement unit 220. The measurement unit 220 sequentially calculates the amount of deviation L based on the acquired images, and sequentially outputs the calculated amount of deviation L to the control device 300.

When two or more images are acquired from the imaging unit 210, the measurement unit 220 may collectively calculate two or more deviation amounts L based on each of the two or more images, and output the two or more calculated deviation amounts together to the control device 300.

The measurement unit 220 is realized, for example, by a control program stored in a memory provided in the inspection device 200 and indicating the processing procedure executed by the measurement unit 220, a CPU (Central Processing Unit) that executes the control program, and a communication interface for acquiring an image from the imaging unit 210 and transmitting the amount of deviation L to the control device 300.

The control device 300 is a computer that controls the operation of each device of the mounting device 100. Specifically, the control device 300 is communicatively connected to each device, such as the adhesion unit 20, the temporary pressure bonding unit 30, the main pressure bonding unit 40, and the transport unit 60, provided in the mounting device 100, via control lines (not shown) and controls the operation of each device and the timing of the operation. For example, the control device 300 controls the adhesion unit 20, the temporary pressure bonding unit 30, and the main pressure bonding unit 40 to cause each device to perform the above-mentioned predetermined operations such as adhesion, temporary pressure bonding, and main pressure bonding on the substrate 400, and controls the transport unit 60 to perform a substrate transport operation in which the substrate 400 is transported to the next process between each device provided in the component mounting system 1. The control device 300 transports the substrate 400 from the upstream side to the downstream side in synchronization with each device provided in the component mounting system 1.

The control device 300 is realized, for example, by a communication interface for communicating with the mounting device 100 and the inspection device 200, a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input/output port for sending and receiving signals, a processor for executing the program, a display device for displaying images, etc.

As shown in FIG. 2, the control device 300 includes an acquisition unit 310, a calculation unit 320, a control unit 340, an input unit 330, an output unit 350, a display unit 360, and a memory unit 370.

The acquisition unit 310 acquires information indicating the amount of deviation L (hereinafter also simply referred to as the amount of deviation L) from the inspection device 200. The acquisition unit 310 is, for example, a communication interface for communicating with the inspection device 200. For example, the acquisition unit 310 acquires the amount of deviation L sequentially output from the inspection device 200, and sequentially outputs the acquired amount of deviation L to the calculation unit 320.

The calculation unit 320 calculates a correction amount for correcting the mounting position at which the mounting device 100 mounts the component 440 on the substrate 400 based on the deviation amount L from the predetermined position 450 of the position of the component 440 (in this embodiment, the mark 421 provided on the component 440) mounted on the substrate 400 by the mounting device 100, measured by the inspection device 200. Specifically, the calculation unit 320 calculates a correction amount for correcting the mounting position, which is the target position when the mounting device 100 mounts the component 440 on the substrate 400, more specifically, a holding position for holding the component 440, and a correction amount for correcting the position of the mounting head 35 when placing the component 440 on the substrate 400. The correction amount is, for example, a value indicating the coordinates indicating the holding position for holding the component 440, the coordinates indicating the position of the mounting head 35 when placing the component 440 on the substrate 400, and the direction and movement amount (distance) of the mounting head 35 moved by the mounting head moving mechanism 36.

The calculation unit 320 calculates the correction amount based on, for example, the amount of misalignment L in one substrate 400. Next, the calculation unit 320 recalculates the correction amount based on, for example, the calculated correction amount and the amount of misalignment L in the other substrate 400. For example, the calculation unit 320 calculates the average value of the amount of misalignment L in one substrate 400 and the amount of misalignment L in the other substrate 400, and calculates the correction amount based on the calculated average value. Alternatively, for example, the calculation unit 320 calculates the average value of the correction amount calculated based on the amount of misalignment L in one substrate 400 and the correction amount calculated based on the amount of misalignment L in the other substrate 400 as a new correction amount.

In this way, the calculation unit 320 sequentially recalculates (recorrects) the correction amount based on the deviation amount L sequentially acquired by the acquisition unit 310. The calculation unit 320 outputs information indicating the calculated correction amount to the control unit 340 and the display unit 360.

In this embodiment, the mounting device 100 has a temporary bonding unit 30 that places the component 440 on the substrate 400, and a main bonding unit 40 that thermally compresses the component 440 placed on the substrate 400 by the temporary bonding unit 30 to the substrate 400. The calculation unit 320 calculates, based on the deviation amount L measured by the inspection device 200, a correction amount for correcting the mounting position by correcting the placement position at which the temporary bonding unit 30 places the component 440 on the substrate 400, for each type of substrate 400.

The input unit 330 accepts input for causing the mounting device 100 to correct the mounting position. The input unit 330 is, for example, a user interface such as a touch panel that accepts operations by a worker, and accepts input (information) for causing the mounting device 100 to correct the mounting position by accepting operations by the worker.

The input unit 330 may be realized by a communication interface for acquiring information from a user interface such as a touch panel.

The control unit 340 is a processing unit that controls the operation of the mounting device 100 via the output unit 350. For example, the control unit 340 identifies the positions of the marks 420 and 421 by performing image analysis on the image generated by the imaging unit 37, and determines the position on the board 400 where the component 440 is to be mounted based on the identified positions of the marks 420 and 421. More specifically, the control unit 340 determines the position of the mounting head 35 holding the component 440 based on the identified positions of the marks 420 and 421. The control device 300 controls the temporary bonding unit 30 to place the component 440 on the board 400 at the determined position on the board 400 where the component 440 is to be mounted.

The control unit 340 also determines whether the input unit 330 has received input during the period before the number of substrates 400 processed by the mounting device 100 on which the components 440 have been mounted reaches the specified number.

The specified number here is a number that is arbitrarily determined in advance, and information indicating the specified number is stored in advance in, for example, the memory unit 370. The number of processed sheets is the number of components 440 that the mounting device 100 mounts on the substrate 400. More specifically, the number of processed sheets is the number of components 440 that the temporary bonding unit 30 places on the substrate 400.

Also, for example, the unreached period is the period from when the mounting device 100 starts the mounting process of mounting the components 440 on the board 400, or from when the control unit 340 causes the mounting device 100 to correct the mounting position, until the number of processed boards reaches the specified number. In other words, for example, the number of processed boards is the number of boards 400 on which the mounting device 100 has mounted the components 440, from when the mounting device 100 starts the mounting process of mounting the components 440 on the board 400, or from when the control unit 340 causes the mounting device 100 to correct the mounting position. Also, for example, the unreached period is the period from when the number of processed boards 400 on which the mounting device 100 has mounted the components 440 reaches the specified number.

When the control unit 340 determines that the input unit 330 has received input, the control unit 340 causes the mounting device 100 to correct the mounting position based on the first correction amount, which is the correction amount calculated by the calculation unit 320 based on the misalignment amount L measured from each of the number of substrates 400 processed by the inspection device 200. On the other hand, when the control unit 340 determines that the input unit 330 has not received input, the control unit 340 causes the mounting device 100 to mount components 440 on the specified number of substrates 400, and causes the mounting device 100 to correct the mounting position based on the second correction amount, which is the correction amount calculated by the calculation unit 320 based on the misalignment amount L measured from each of the specified number of substrates 400 by the inspection device 200.

In this embodiment, the control unit 340 corrects (changes) the operation of the mounting head moving mechanism 36 based on the first correction amount or the second correction amount so as to correct (change) the position of the mounting head 35 when placing the component 440 of the temporary pressure bonding unit 30 on the substrate 400.

In this way, when the number of processed sheets reaches the specified number, the control unit 340 causes the temporary bonding unit 30 to correct the mounting position based on the correction amount (first correction amount) calculated by the calculation unit 320 based on the respective deviation amounts L (first deviation amounts) in the specified number of substrates 400. On the other hand, even if the number of processed sheets has not reached the specified number, if the input unit 330 has received an input, that is, if the operator has instructed to correct the mounting position, the control unit 340 causes the temporary bonding unit 30 to correct the mounting position based on the correction amount (second correction amount) calculated by the calculation unit 320 based on the respective deviation amounts L (second deviation amounts) in the processed number of substrates 400.

The output unit 350 is a communication interface for outputting information indicating the processing executed by the control unit 340 to the control device 300.

The calculation unit 320 and the control unit 340 are realized, for example, by a control program stored in the storage unit 370 that indicates the processing procedures to be executed by each of the calculation unit 320 and the control unit 340, and a CPU that executes the control program.

The calculation unit 320 and the control unit 340 may be implemented by a single CPU, or may be implemented by different CPUs.

The display unit 360 is a display device that displays deviation amount information based on the deviation amount L. Specifically, the display unit 360 displays deviation amount information based on the deviation amount L that is used when the calculation unit 320 calculates the correction amount. In this way, the display unit 360 displays deviation amount information that is information based on the deviation amount L as information for the worker to determine whether or not to correct the mounting position. The display unit 360 may also display correction information that indicates the correction amount calculated by the calculation unit 320 from the deviation amount L.

The display unit 360 is, for example, a monitor device such as a liquid crystal monitor or an organic EL monitor. The display unit 360 may be realized by a processing unit that displays the deviation amount information on an external monitor device and a communication interface for communicating with the external monitor device.

The memory unit 370 stores various data required for executing each process, such as the size of the board 400, the type of the component 440, the mounting position (attachment of the ACF 430 and placement and pressure bonding of the component 440), the mounting direction, and the timing of transporting the board 400 between each device, as well as control programs executed by each processing unit of the control device 300. The memory unit 370 is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), etc.

[Processing Procedure]
Next, a processing procedure of the component mounting system 1 according to the embodiment will be described in detail.

Figure 6 is a flowchart showing the processing steps of the component mounting system 1 according to the embodiment.

First, the mounting device 100 mounts the component 440 on the substrate 400 (step S101). In this embodiment, in step S101, the temporary bonding unit 30 places the component 440 on the substrate 400, and the main bonding unit 40 thermocompresses the component 440 onto the substrate 400.

Next, the inspection device 200 measures the amount of deviation L of the position of the component 440 on the board 400 from a predetermined position (step S102). For example, the inspection device 200 generates an image by capturing an image of the board 400 on which the component 440 is mounted, and measures the amount of deviation L of the mark 421 provided on the component 440 from a predetermined position 450 based on the generated image, for example, as shown in FIG. 5. The inspection device 200 sequentially outputs the measured amount of deviation L to the control device 300.

Next, the calculation unit 320 calculates a correction amount for correcting the mounting position where the mounting device 100 mounts the component 440 on the substrate 400 based on the deviation amount L measured by the inspection device 200 (step S103). The calculation unit 320 may count the number of substrates processed by the mounting device 100 each time it calculates the correction amount.

Next, the display unit 360 displays the deviation amount information based on the deviation amount L (step S104). For example, when the number of processed sheets has not reached the specified number, the display unit 360 displays the average value of the deviation amount L of the processed number as the deviation amount information. Of course, when the number of processed sheets reaches the specified number, the display unit 360 may display the average value of the deviation amount L of the specified number as the deviation amount information. Alternatively, the display unit 360 may display the deviation amount L of each processed number and a representative value (e.g., an average value or a median value) of the deviation amount L used for the correction amount calculated from the deviation amount L of each processed number. Alternatively, the display unit 360 may display a time series graph of the deviation amount L (a graph showing time on the horizontal axis and time progression of the deviation amount L on the vertical axis).

Next, the control unit 340 determines whether the number of substrates 400 on which the mounting device 100 has mounted components 440 has reached a specified number (step S105).

When the control unit 340 determines that the number of substrates 400 on which the mounting device 100 has mounted components 440 has not reached the specified number (No in step S105), the control unit 340 determines whether the input unit 330 has received, for example, an input from an operator to cause the mounting device 100 to correct the mounting position at which the mounting device 100 mounts the components 440 on the substrate 400 (step S106). In this way, the control unit 340 determines whether the input unit 330 has received an input to cause the mounting device 100 to correct the mounting position during the period before the number of substrates processed reaches the specified number (i.e., when No in step S105).

If the control unit 340 determines that the input unit 330 has not accepted input (No in step S106), the control unit 340 returns the process to step S101.

On the other hand, if the control unit 340 determines that the input unit 330 has received the input (Yes in step S106), it causes the mounting device 100 to correct the mounting position based on the correction amount (first correction amount) calculated by the calculation unit 320 based on the deviation amount L measured from each of the number of substrates 400 processed by the mounting device 100 (step S107).

In addition, when the control unit 340 determines that the number of substrates 400 on which the mounting device 100 has mounted components 440 has reached the specified number (Yes in step S105), it causes the mounting device 100 to correct the mounting position based on a correction amount (second correction amount) based on the deviation amount L measured from each of the specified number of substrates 400 (step S108).

After step S107 or step S108, that is, after the control unit 340 has caused the mounting device 100 to correct the mounting position, the control unit 340 initializes (step S109) the count of the number of substrates 400 on which the mounting device 100 has mounted components 440 (i.e., sets it to zero), and returns the process to step S101. This allows the control unit 340 to determine whether or not the period is not reached, which is the period from when the mounting device 100 starts the mounting process of mounting components 440 on the substrate 400 in step S104, or from when the control unit 340 has caused the mounting device 100 to correct the mounting position, until the number of substrates processed reaches the specified number.

[Effects, etc.]
As described above, the component mounting system 1 according to the embodiment includes the mounting device 100 that mounts the component 440 on the substrate 400, a calculation unit 320 that calculates a correction amount for the mounting device 100 to correct the mounting position at which the mounting device 100 mounts the component 440 on the substrate 400 based on a deviation amount L from a predetermined position of the position of the component 440 mounted on the substrate 400 by the mounting device 100, a control unit 340 that causes the mounting device 100 to correct the mounting position based on the correction amount calculated by the calculation unit 320, and an input unit 330 that receives an input for causing the mounting device 100 to correct the mounting position. The control unit 340 determines whether the input unit 330 has received an input during a period before the number of substrates 400 on which the mounting device 100 has mounted the components 440 reaches the specified number. When the control unit 340 determines that the input unit 330 has received the input, the control unit 340 causes the mounting device 100 to correct the mounting position based on the first correction amount calculated by the calculation unit 320 based on the deviation amount L measured from each of the processed number of substrates 400. On the other hand, when the control unit 340 determines that the input unit 330 has not received the input, the control unit 340 causes the mounting device 100 to mount the components 440 on the specified number of substrates 400, and causes the mounting device 100 to correct the mounting position based on the second correction amount calculated by the calculation unit 320 based on the deviation amount L measured from each of the specified number of substrates 400. In this embodiment, the control unit 340 causes the mounting device 100 to correct the mounting position by causing the temporary pressure bonding unit 30 to correct the placement position of the components in the temporary pressure bonding unit 30.

According to this, the control unit 340 can automatically correct the mounting position of the mounting device 100 based on the correction value calculated from the deviation amount L measured from each of the specified number of substrates 400 (for example, calculated from the deviation amount L of the same number as the specified number), and can also correct the mounting position of the mounting device 100 at a timing determined by the operator even if the number of processed substrates has not reached the specified number. For example, when the mounting device 100 performs mounting of the component 440 for the first time, it is assumed that the deviation amount L is large at first. In such a case, even if the number of processed substrates has not reached the specified number, that is, even if the number of samples for calculating the correction amount is small, it may be possible to suppress a decrease in yield by correcting the mounting position early. Therefore, according to the component mounting system 1, the mounting device 100 can correct the mounting position at a timing determined by the operator, so that a decrease in yield can be suppressed.

For example, the component mounting system 1 further includes a display unit 360 that displays deviation amount information based on the deviation amount L.

This allows the worker to check the deviation amount information displayed on the display unit 360. Therefore, the worker can easily understand whether the timing for correcting the mounting position by the mounting device 100 is appropriate. As a result, the display unit 360 can further suppress a decrease in yield.

Also, for example, the number of processed sheets is the number of boards 400 on which the mounting device 100 has mounted components 440 after the mounting device 100 starts the mounting process (step S101) in which the mounting device 100 mounts components 440 on the boards 400, or after the control unit 340 causes the mounting device 100 to correct the mounting position (step S107). Also, for example, the non-reaching period is the period before the number of processed sheets reaches the specified number.

This allows the mounting device 100 to automatically correct the mounting position based on the correction amount calculated from an appropriate number of samples, and also allows the mounting device 100 to correct the mounting position at a timing determined by the operator, thereby preventing a decrease in yield.

In addition, the component mounting method according to the embodiment includes mounting the component 440 on the substrate 400 by the mounting device 100 (step S101), calculating a correction amount for correcting the mounting position at which the mounting device 100 mounts the component 440 on the substrate 400 based on the deviation amount L from a predetermined position of the position of the component 440 mounted on the substrate 400 by the mounting device 100 (step S103), and determining whether or not an input for causing the mounting device 100 to correct the mounting position has been received during the period before the number of substrates on which the mounting device 100 has mounted the component 440 reaches the specified number (No in step S105), and determining that the input has been received. If so (Yes in step S106), the mounting device 100 is caused to correct the mounting position based on the first correction amount calculated based on the misalignment amount L measured from each of the processed number of boards 400 (step S107). If it is determined that no input has been received (No in step S106), the mounting device 100 is caused to mount components 440 on the specified number of boards 400, that is, steps S101 to S106 are repeated until Yes is determined in step S105, and the mounting device 100 is caused to correct the mounting position based on the second correction amount calculated based on the misalignment amount L measured from each of the specified number of boards 400 (step S108).

This provides the same effect as component mounting system 1.

(Other embodiments)
Although the component mounting system and the like according to the present embodiment have been described based on the above embodiment, the present invention is not limited to the above embodiment.

For example, the substrate 400 has light-transmitting properties and has the mark 420 on the upper surface. This allows the mark 420 to be imaged even if the imaging unit 210 images the substrate 400 from below. Of course, the substrate 400 may have the mark 420 on the lower surface. In this case, the substrate 400 may or may not have light-transmitting properties.

Also, for example, in the above embodiment, all or some of the components of the control device 300 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory.

The components of the control device 300 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

The one or more electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC), or a large scale integration (LSI). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a very large scale integration (VLSI), or an ultra large scale integration (ULSI). Also, a field programmable gate array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose.

In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of the present invention.

The present invention can be used in component mounting systems that produce display panels and the like by mounting components on substrates.

REFERENCE SIGNS LIST 1 Component mounting system 1a, 1b, 1c Base 10 Substrate loading section 11, 21, 31, 41, 51 Stage 20 Adhesive section 22, 32, 42 Stage moving section 23 Adhesive mechanism 30 Pre-pressure bonding section 33 Component supply section 34 Pre-pressure bonding tool 35 Mounting head 36 Mounting head moving mechanism 37, 210 Imaging section 40 Main pressure bonding section 43 Main pressure bonding tool 50 Substrate unloading section 60 Transport section 61 Movement base 62A, 62B, 62C, 62D Substrate transport mechanism 63 Base 64 Arm unit 100 Mounting device 200 Inspection device 220 Measurement section 300 Control device 310 Acquisition section 320 Calculation section 330 Input section 340 Control section 350 Output section 360 Display section 370 Memory section 400 Substrate 410 Electrode section 420, 421 Mark 430 ACF
440 Part 450 Predetermined position L Displacement amount

Claims (4)

A mounting device that mounts components on a substrate;
a calculation unit that calculates a correction amount for the mounting device to correct a mounting position at which the mounting device mounts a component on a board, based on an amount of deviation of a position of the component mounted on the board by the mounting device from a predetermined position;
a control unit that causes the mounting apparatus to correct the mounting position based on the correction amount;
an input unit that receives an input for causing the mounting device to correct the mounting position,
The control unit is
determining whether or not the input unit has received the input during a period before the number of processed boards on which the mounting device has mounted components reaches a specified number;
when the input unit determines that the input has been received, the mounting device corrects the mounting position based on a first correction amount calculated by the calculation unit based on the deviation amount measured for each of the processed number of substrates;
when it is determined that the input unit has not received the input, having the mounting device mount components on the specified number of boards, and having the mounting device correct the mounting positions based on a second correction amount calculated by the calculation unit based on the deviation amounts measured from each of the specified number of boards;
Component mounting system. Further, a display unit is provided that displays deviation amount information based on the deviation amount.
The component mounting system according to claim 1 . the number of processed substrates is the number of substrates on which the mounting device has mounted components since the mounting device started a mounting process for mounting components onto substrates or since the control unit caused the mounting device to correct the mounting positions,
The non-reaching period is a period before the number of processed sheets reaches the specified number.
The component mounting system according to claim 1 or 2. The mounting device mounts the components on the board.
calculating a correction amount for the mounting device to correct a mounting position at which the mounting device mounts the component on the substrate based on an amount of deviation of a position of the component mounted on the substrate by the mounting device from a predetermined position;
determining whether or not an input for causing the mounting device to correct the mounting position has been received during a period before the number of processed substrates on which components have been mounted by the mounting device reaches a prescribed number;
when it is determined that the input has been received, the mounting device is caused to correct the mounting position based on a first correction amount calculated based on the deviation amount measured for each of the processed number of substrates;
when it is determined that the input has not been accepted, having the mounting device mount components on the specified number of boards, and having the mounting device correct the mounting positions based on a second correction amount calculated based on the deviation amount measured from each of the specified number of boards;
Component mounting method.

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