JP7494842B2 - Semiconductor device having a dolmen structure and its manufacturing method, and laminated film for forming a support piece and its manufacturing method - Google Patents

Description

The present disclosure relates to a semiconductor device having a dolmen structure including a substrate, a first chip arranged on the substrate, a plurality of support pieces arranged on the substrate around the first chip, and a second chip supported by the plurality of support pieces and arranged to cover the first chip. The present disclosure also relates to a method for manufacturing a semiconductor device having a dolmen structure, and a laminated film for forming support pieces and a method for manufacturing the same. A dolmen is a type of stone tomb, and comprises a plurality of supporting stones and a slab-shaped rock placed on the supporting stones. In the semiconductor device having a dolmen structure, the support pieces correspond to the "support stones" and the second chip corresponds to the "slab-shaped rock".

In recent years, in the field of semiconductor devices, there is a demand for high integration, miniaturization, and high speed. As one aspect of semiconductor devices, a structure in which a semiconductor chip is stacked on a controller chip arranged on a substrate has attracted attention. For example, Patent Document 1 discloses a semiconductor die assembly including a controller die and a memory die supported by a support member on the controller die. The semiconductor assembly 100 illustrated in FIG. 1A of Patent Document 1 can be said to have a dolmen structure. That is, the semiconductor assembly 100 includes a package substrate 102, a controller die 103 arranged on its surface, memory dies 106a, 106b arranged above the controller die 103, and support members 130a, 130b that support the memory die 106a.

JP 2017-515306 A

Patent Document 1 discloses that a semiconductor material such as silicon can be used as the support member (support piece), and more specifically, that pieces of a semiconductor material obtained by dicing a semiconductor wafer can be used (see [0012], [0014] and FIG. 2 of Patent Document 1). To manufacture a support piece for a dolmen structure using a semiconductor wafer, the following steps are required, for example, as in the manufacture of a normal semiconductor chip.
(1) A step of attaching a backgrind tape to a semiconductor wafer; (2) A step of backgrinding the semiconductor wafer; (3) A step of attaching a film having an adhesive layer and an adhesive layer (a dicing/die bonding integrated film) to a dicing ring and the backgrinded semiconductor wafer placed therein; (4) A step of peeling off the backgrind tape from the semiconductor wafer; (5) A step of dividing the semiconductor wafer into individual pieces; (6) A step of picking up a support piece consisting of a stack of a semiconductor chip and an adhesive piece from the adhesive layer; (7) A step of pressing a plurality of support pieces into predetermined positions on a substrate.

The present disclosure provides a method for manufacturing a semiconductor device that can simplify the process of producing a support piece in the manufacturing process of a semiconductor device having a dolmen structure and achieve excellent pick-up properties of the support piece. The present disclosure also provides a semiconductor device having a dolmen structure, as well as a laminated film for forming the support piece and a manufacturing method thereof.

One aspect of the present disclosure relates to a method for manufacturing a semiconductor device having a dolmen structure, the method including the following steps.
(A) A step of preparing a laminated film having a base film, an adhesive layer, and a support piece forming film in this order. (B) A step of forming a plurality of support pieces on the surface of the adhesive layer by dividing the support piece forming film. (C) A step of picking up the support piece from the adhesive layer. (D) A step of arranging a first chip on a substrate. (E) A step of arranging a plurality of support pieces on the substrate around the first chip or around the area where the first chip should be arranged. (F) A step of preparing an adhesive piece-attached chip comprising a second chip and an adhesive piece provided on one surface of the second chip. (G) A step of constructing a dolmen structure by arranging the adhesive piece-attached chip on the surface of a plurality of support pieces. The support piece forming film has a multilayer structure including at least a resin layer having a tensile modulus of 8.0 MPa or more. By having the tensile modulus of the resin layer of the support piece forming film be 8.0 MPa or more, excellent pick-up properties of the support piece obtained by dividing the support piece forming film can be achieved. In addition to the resin layer, the support piece forming film may also include, for example, a thermosetting resin layer composed of a material different from the resin layer. In the present disclosure, the tensile modulus refers to a value measured under the following conditions in accordance with the method described in JIS K7127:1999 (Plastics-Test methods for tensile properties-Part 3: Test conditions for films and sheets).
・Test piece dimensions: 10mm x 40mm
Chuck spacing: 30 mm
- Pulling speed: 300 mm/min Either step (D) or step (E) may be performed first. When step (D) is performed first, a plurality of support pieces may be arranged around the first chip on the substrate in step (E). On the other hand, when step (E) is performed first, a plurality of support pieces may be arranged around the region on the substrate where the first chip is to be arranged in step (E), and then the first chip may be arranged in that region in step (D).

In the above manufacturing method according to the present disclosure, support pieces obtained by dividing the support piece forming film are used. This simplifies the process of producing the support pieces compared to conventional manufacturing methods that use pieces of semiconductor material obtained by dicing a semiconductor wafer as the support pieces. That is, whereas conventionally the above-mentioned steps (1) to (7) were required, since the support piece forming film does not include a semiconductor wafer, steps (1), (2), and (4) related to backgrinding the semiconductor wafer can be omitted. In addition, since semiconductor wafers, which are expensive compared to resin materials, are not used, costs can also be reduced.

The adhesive layer of the laminated film prepared in step (A) may be pressure-sensitive or UV-curable. That is, the adhesive layer may or may not be cured by UV irradiation, in other words, it may or may not contain a resin having a photoreactive carbon-carbon double bond. The pressure-sensitive adhesive layer may contain a resin having a photoreactive carbon-carbon double bond. For example, the adhesive layer may have the adhesiveness of a specific region reduced by irradiating the specific region with UV light, and for example, the resin having a photoreactive carbon-carbon double bond may remain in the specific region. When the adhesive layer is UV-curable, the adhesiveness of the adhesive layer can be reduced by performing a step of irradiating the adhesive layer with UV light between steps (B) and (C).

When the film for forming a support piece includes a thermosetting resin layer, the step of heating the film for forming a support piece or the support piece to harden the thermosetting resin layer or the adhesive piece may be performed at an appropriate time, for example, before step (G). At the stage of arranging the chips with adhesive pieces so that they are in contact with the surfaces of the multiple support pieces, the thermosetting resin layer is already hardened, so that deformation of the support pieces due to the arrangement of the chips with adhesive pieces can be suppressed. Note that since the thermosetting resin layer has adhesive properties to other members (e.g., a substrate), it is not necessary to provide a separate adhesive layer or the like on the support pieces.

One aspect of the present disclosure relates to a semiconductor device having a dolmen structure. That is, the semiconductor device has a dolmen structure including a substrate, a first chip arranged on the substrate, a plurality of support pieces arranged on the substrate around the first chip, and a second chip supported by the plurality of support pieces and arranged to cover the first chip, and the support pieces have a multi-layer structure including at least a resin piece having a tensile modulus of elasticity of 8.0 MPa or more.

The semiconductor device according to the present disclosure may further include an adhesive piece provided on one surface of the second chip and sandwiched between the second chip and the multiple support pieces. In this case, the first chip may be separated from the adhesive piece or may be in contact with the adhesive piece. The adhesive piece is provided, for example, so as to cover at least the area of the second chip facing the first chip. The adhesive piece may extend continuously from the area of the second chip to the peripheral side of the second chip and be sandwiched between the second chip and the multiple support pieces. In other words, one adhesive piece may cover the area of the second chip and bond the second chip to the multiple support pieces.

One aspect of the present disclosure relates to a laminated film for forming a support piece. This laminated film includes a base film, an adhesive layer, and a film for forming a support piece in this order, and the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile modulus of elasticity of 8.0 MPa or more. This resin layer is, for example, a polyimide layer. In addition to the resin layer, the film for forming a support piece may include a thermosetting resin layer made of a material different from that of the resin layer. By having a plurality of layers made of different materials, the film for forming a support piece can be assigned a function to each layer, and the film can be made more highly functional than, for example, a film made of a plurality of layers made of the same material. By dividing a film having such a multilayer structure into individual pieces, a support piece suitable for a dolmen structure can be obtained. Such a support piece includes a resin piece (a resin layer divided into individual pieces) and an adhesive piece (a thermosetting resin layer divided into individual pieces) provided on one side of the resin piece, and the resin piece is made of a material different from that of the adhesive piece. Such a support piece may have a three-layer structure consisting of a resin piece and a pair of adhesive pieces sandwiching the resin piece, and the resin pieces may be made of a different material from the pair of adhesive pieces.

The thickness of the support piece forming film is, for example, 5 to 180 μm. By having the thickness of the support piece forming film in this range, a dolmen structure of appropriate height can be constructed for the first chip (e.g., a controller chip). The support piece forming film may include a thermosetting resin layer. The thermosetting resin layer preferably includes, for example, an epoxy resin and an elastomer. By including an elastomer in the thermosetting resin layer constituting the support piece, stress within the semiconductor device can be alleviated.

One aspect of the present disclosure relates to a method for producing a laminated film for forming a support piece. This production method includes a step of preparing an adhesive film having a base film and an adhesive layer formed on one surface of the base film, and a step of laminating a film for forming a support piece on the surface of the adhesive layer, and the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile modulus of elasticity of 8.0 MPa or more.

A laminated film for forming a support piece having a thermosetting resin layer and a resin layer can be manufactured, for example, as follows. That is, the manufacturing method of this laminated film for forming a support piece includes a step of preparing a laminated film having a base film, an adhesive layer, and a thermosetting resin layer in this order, and a step of bonding a resin layer having a tensile modulus of elasticity of 8.0 MPa or more to the surface of the thermosetting resin layer.

According to the present disclosure, a method for manufacturing a semiconductor device is provided that can simplify the process of producing a support piece in the manufacturing process of a semiconductor device having a dolmen structure and achieve excellent pick-up properties of the support piece. In addition, according to the present disclosure, a semiconductor device having a dolmen structure, and a laminated film for forming a support piece and a manufacturing method thereof are provided.

FIG. 1 is a cross-sectional view illustrating a schematic diagram of a first embodiment of a semiconductor device according to the present disclosure. 2A and 2B are plan views each showing a schematic example of the positional relationship between a first chip and a plurality of support pieces. FIG. 3(a) is a plan view that shows a schematic diagram of one embodiment of the laminated film for forming a support piece, and FIG. 3(b) is a cross-sectional view taken along line bb in FIG. 3(a). FIG. 4 is a cross-sectional view that typically illustrates a process of bonding the adhesive layer and the support piece-forming film together. 5(a) to 5(d) are cross-sectional views that typically show the process of producing the support piece. FIG. 6 is a cross-sectional view that shows a schematic state in which a plurality of support pieces are arranged around a first chip on a substrate. FIG. 7 is a cross-sectional view showing a schematic example of a chip with an adhesive piece. FIG. 8 is a cross-sectional view showing a schematic diagram of a dolmen structure formed on a substrate. FIG. 9 is a cross-sectional view illustrating a schematic diagram of a second embodiment of a semiconductor device according to the present disclosure. FIG. 10 is a cross-sectional view that illustrates a schematic view of another embodiment of the laminated film for forming a support piece.

Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or the corresponding methacrylate. "A or B" may include either A or B, or may include both.

In this specification, the term "layer" includes structures with shapes formed over the entire surface as well as structures with shapes formed on only a portion of the surface when observed in a plan view. Furthermore, in this specification, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved. Furthermore, a numerical range indicated using "~" indicates a range that includes the numerical values before and after "~" as the minimum and maximum values, respectively.

In this specification, the content of each component in the composition means the total amount of the multiple substances present in the composition when multiple substances corresponding to each component are present in the composition, unless otherwise specified. In addition, unless otherwise specified, the example materials may be used alone or in combination of two or more types. In addition, in the numerical ranges described in stages in this specification, the upper limit or lower limit of a certain numerical range may be replaced by the upper limit or lower limit of a numerical range of another stage. In addition, in the numerical ranges described in this specification, the upper limit or lower limit of the numerical range may be replaced by the value shown in the examples.

First Embodiment
(Semiconductor device)
1 is a cross-sectional view showing a semiconductor device according to the present embodiment. The semiconductor device 100 shown in this figure includes a substrate 10, a chip T1 (first chip) arranged on the surface of the substrate 10, a plurality of support pieces Dc arranged around the chip T1 on the surface of the substrate 10, a chip T2 (second chip) arranged above the chip T1, an adhesive piece Tc sandwiched between the chip T2 and the plurality of support pieces Dc, chips T3 and T4 stacked on the chip T2, a plurality of wires w that electrically connect electrodes (not shown) on the surface of the substrate 10 to the chips T1 to T4, and a sealant 50 that fills gaps between the chips T1 and T2.

In this embodiment, a dolmen structure is formed on the substrate 10 by a plurality of support pieces Dc, a chip T2, and an adhesive piece Tc located between the support pieces Dc and the chip T2. The chip T1 is spaced apart from the adhesive piece Tc. By appropriately setting the thickness of the support piece Dc, it is possible to secure space for the wire w that connects the upper surface of the chip T1 to the substrate 10. By spaced apart from the adhesive piece Tc, it is possible to prevent a short circuit of the wire w that is caused by the upper part of the wire w connected to the chip T1 coming into contact with the chip T2. In addition, since there is no need to embed a wire in the adhesive piece Tc that comes into contact with the chip T2, there is an advantage in that the adhesive piece Tc can be made thin.

As shown in FIG. 1, the adhesive piece Tc between the chip T1 and the chip T2 covers the region R of the chip T2 facing the chip T1, and extends continuously from the region R to the periphery of the chip T2. In other words, one adhesive piece Tc covers the region R of the chip T2, and is interposed between the chip T2 and the multiple support pieces to bond them. Note that FIG. 1 illustrates an embodiment in which the adhesive piece Tc is provided so as to cover the entire one side (lower side) of the chip T2. However, since the adhesive piece Tc may shrink during the manufacturing process of the semiconductor device 100, it is sufficient that the adhesive piece Tc substantially covers the entire one side (lower side) of the chip T2, and for example, there may be a portion of the periphery of the chip T2 that is not covered by the adhesive piece Tc. The lower surface of the chip T2 in FIG. 1 corresponds to the back surface of the chip. In recent years, the back surface of the chip is often uneven. By substantially covering the entire back surface of the chip T2 with the adhesive piece Tc, it is possible to suppress the occurrence of cracks or breakage in the chip T2.

The substrate 10 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warping of the semiconductor device 100, the thickness of the substrate 10 is, for example, 90 to 300 μm, and may be 90 to 210 μm.

Chip T1 is, for example, a controller chip, and is adhered to substrate 10 by adhesive piece T1c and electrically connected to substrate 10 by wire w. The shape of chip T1 in plan view is, for example, rectangular (square or oblong). The length of one side of chip T1 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of chip T1 is, for example, 10 to 150 μm, and may be 20 to 100 μm.

Chip T2 is, for example, a memory chip, and is adhered onto support piece Dc via adhesive piece Tc. In plan view, chip T2 has a size larger than chip T1. In plan view, chip T2 has a shape, for example, a rectangle (square or oblong). The length of one side of chip T2 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of chip T2 is, for example, 10 to 170 μm, and may be 20 to 120 μm. Chips T3 and T4 are also, for example, memory chips, and are adhered onto chip T2 via adhesive piece Tc. The length of one side of chips T3 and T4 may be the same as that of chip T2, and the thickness of chips T3 and T4 may be the same as that of chip T2.

The support piece Dc acts as a spacer that forms a space around the chip T1. The support piece Dc is composed of two adhesive pieces 5c and a resin piece 6p sandwiched between them. The adhesive piece 5c is made of a cured product of a thermosetting resin composition (adhesive piece 5p). The resin piece 6p is made of a resin (e.g., polyimide) with a tensile modulus of elasticity of 8.0 MPa or more. The resin piece 6p is made of a material different from that of the adhesive piece 5c. By having multiple layers of different materials, the support piece Dc can be assigned a function to each layer, and the support piece can be made more highly functional than one made of multiple layers of the same material.

As shown in FIG. 2(a), two support pieces Dc (rectangular shape) may be arranged at separate positions on both sides of the chip T1, or as shown in FIG. 2(b), one support piece Dc (square shape, total of four) may be arranged at each position corresponding to the corner of the chip T1. The length of one side of the support piece Dc in a planar view is, for example, 20 mm or less, and may be 1 to 20 mm or 1 to 12 mm. The thickness (height) of the support piece Dc is, for example, 10 to 180 μm, and may be 20 to 120 μm.

The ratio of the total thickness of the two adhesive pieces 5c, 5c to the thickness of the support piece Dc is preferably 0.1 to 0.9, more preferably 0.2 to 0.8, and even more preferably 0.2 to 0.7. When this ratio is 0.1 or more, the adhesive piece 5c can perform its role (for example, supporting the chip T2 and preventing the resin piece 6p from shifting) to a higher degree. On the other hand, if the ratio is 0.9 or less, the resin piece 6p has a sufficient thickness, so that the resin piece 6p can function like a spring plate and achieve better pickup properties (see FIG. 5(d)). From these viewpoints, the thickness of the resin piece 6p may be, for example, 10 to 80 μm, or 20 to 60 μm. The thickness of the adhesive piece 5c (one layer) may be, for example, 5 to 120 μm, or 10 to 60 μm.

(Method of manufacturing the support piece)
An example of a method for producing the support piece will be described. Note that the support piece Dc shown in Fig. 1 is a piece after the adhesive piece (thermosetting resin composition) contained therein has hardened. On the other hand, the support piece Da is a piece before the adhesive piece (thermosetting resin composition) contained therein has completely hardened (see, for example, Fig. 5(b)).

First, prepare a laminated film 20 for forming a support piece as shown in FIG. 3(a) and FIG. 3(b) (hereinafter, sometimes referred to as "laminated film 20"). The laminated film 20 includes a base film 1, an adhesive layer 2, and a film D for forming a support piece. The base film 1 is, for example, a polyethylene terephthalate film (PET film). The adhesive layer 2 is formed into a circular shape by punching or the like (see FIG. 3(a)). The adhesive layer 2 is made of an ultraviolet-curing adhesive. That is, the adhesive layer 2 has a property that its adhesiveness decreases when irradiated with ultraviolet rays. The film D for forming a support piece is formed into a circular shape by punching or the like, and has a smaller diameter than the adhesive layer 2 (see FIG. 3(a)). The film D for forming a support piece is composed of two thermosetting resin layers 5 and a resin layer 6 sandwiched between them.

The thickness of the thermosetting resin layer 5 is, for example, 5 to 180 μm, and may be 10 to 170 μm or 15 to 160 μm. The thicknesses of the two thermosetting resin layers 5 may be the same or different. The resin layer 6 is, for example, a polyimide layer. The thermosetting resin layer 5 is made of a thermosetting resin composition. The thermosetting resin composition can be in a semi-cured (B stage) state and then in a completely cured (C stage) state by a subsequent curing process. The thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer (e.g., an acrylic resin), and further contains an inorganic filler and a curing accelerator, etc., as necessary. The composition of the two thermosetting resin layers 5 may be the same or different. Details of the thermosetting resin composition constituting the thermosetting resin layer 5 will be described later.

The thickness of the resin layer 6 is, for example, 5 to 100 μm, and may be 10 to 90 μm or 20 to 80 μm. The tensile modulus of the resin layer 6 is 8.0 MPa or more, and may be 9.0 MPa or more or 10.0 MPa or more. When the tensile modulus of the resin layer 6 is 8.0 MPa or more, the resin piece 6p plays a role like a spring plate in the process of picking up the support piece Da (see FIG. 5 (d)), and excellent pick-up properties can be achieved. The upper limit of the tensile modulus of the resin layer 6 is about 15 MPa in terms of ease of obtaining materials. Examples of materials constituting the resin layer 6 include polyimide and polyethylene terephthalate (PET). The resin layer 6 may be a layer made of a thermosetting resin composition or a photocurable resin composition that has been subjected to a curing treatment so that the tensile modulus is within the above range.

The laminated film 20 can be produced, for example, by bonding a first laminated film having a base film 1 and an adhesive layer 2 on its surface, and a second laminated film having a cover film 3 and a support piece forming film D on its surface (see FIG. 4). The first laminated film is obtained through a process of forming an adhesive layer on the surface of the base film 1 by coating, and a process of processing the adhesive layer into a predetermined shape (e.g., circular) by punching or the like. The second laminated film is obtained through a process of forming a thermosetting resin layer 5 on the surface of the cover film 3 (e.g., a PET film or a polyethylene film) by coating, a process of forming a resin layer 6 on the surface of the thermosetting resin layer 5, a process of forming a thermosetting resin layer 5 on the surface of the resin layer 6 by coating, and a process of processing the support piece forming film formed through these processes into a predetermined shape (e.g., circular) by punching or the like. When using the laminated film 20, the cover film 3 is peeled off at an appropriate timing.

As shown in FIG. 5(a), a dicing ring DR is attached to the laminated film 20. That is, the dicing ring DR is attached to the adhesive layer 2 of the laminated film 20, and the support piece forming film D is arranged inside the dicing ring DR. The support piece forming film D is diced into individual pieces (see FIG. 5(b)). As a result, a large number of support pieces Da are obtained from the support piece forming film D. The support piece Da is composed of two adhesive pieces 5p and a resin piece 6p sandwiched between them. After that, the adhesive layer 2 is irradiated with ultraviolet light to reduce the adhesive force between the adhesive layer 2 and the support piece Da. After the ultraviolet light irradiation, the base film 1 is expanded as shown in FIG. 5(c), so that the support pieces Da are separated from each other. As shown in FIG. 5(d), the support pieces Da are pushed up by a push-up jig 42 to peel off the support pieces Da from the adhesive layer 2, and the support pieces Da are picked up by suction with a suction collet 44. The curing reaction of the thermosetting resin may be allowed to proceed by heating the support piece forming film D before dicing or the support piece Da before picking up. When the support piece Da is appropriately cured at the time of picking up, excellent pick-up properties can be achieved. It is preferable that the cuts for individualization are formed up to the outer edge of the support piece forming film D. The diameter of the support piece forming film D may be, for example, 300 to 310 mm or 300 to 305 mm. The shape of the support piece forming film D in a plan view is not limited to the circle shown in FIG. 3(a) and may be rectangular (square or oblong).

The ratio of the total thickness of the two thermosetting resin layers 5, 5 to the thickness of the support piece forming film D is preferably 0.1 to 0.9, more preferably 0.2 to 0.8, and even more preferably 0.2 to 0.7. When this ratio is 0.1 or more, as described above, the adhesive piece 5c can perform its role (for example, supporting the chip T2 and preventing the resin piece 6p from shifting) to a higher degree. On the other hand, if the ratio is 0.9 or less, the resin piece 6p has a sufficient thickness, so that the resin piece 6p can function like a spring plate and achieve better pickup properties (see FIG. 5(d)). From these viewpoints, the thickness of the resin layer 6 is, for example, 10 to 80 μm, and may be 20 to 60 μm. The thickness of the thermosetting resin layer 5 (one layer) is, for example, 5 to 120 μm, and may be 10 to 60 μm.

(Method of manufacturing a semiconductor device)
The following describes a method for manufacturing the semiconductor device 100. The manufacturing method according to this embodiment includes the following steps (A) to (H).
(A) A step of preparing a laminated film 20 (see FIG. 4)
(B) A step of forming a plurality of support pieces Da on the surface of the adhesive layer 2 by dividing the support piece forming film D (see FIG. 5(b)).
(C) Step of picking up the support piece Da from the adhesive layer 2 (see FIG. 5(d))
(D) a step of arranging a first chip T1 on the substrate 10; (E) a step of arranging a plurality of support pieces Da around the first chip T1 on the substrate 10 (see FIG. 6 );
(F) A step of preparing an adhesive piece-attached chip T2a including a second chip T2 and an adhesive piece Ta provided on one surface of the second chip T2 (see FIG. 7).
(G) A process of constructing a dolmen structure by placing adhesive chips T2a on the surfaces of multiple support pieces Dc (see FIG. 8).
(H) A process of sealing the gap between the chip T1 and the chip T2 with a sealing material 50 (see FIG. 1).

Steps (A) to (C) are the process of producing multiple support pieces Da, and have already been explained. Steps (D) to (H) are the process of constructing a dolmen structure on the substrate 10 using multiple support pieces Da. Steps (D) to (H) are explained below with reference to Figures 6 to 8.

[Step (D)]
Step (D) is a step of arranging a first chip T1 on the substrate 10. For example, first, the chip T1 is arranged at a predetermined position on the substrate 10 via an adhesive layer T1c. Then, the chip T1 is electrically connected to the substrate 10 by a wire w. Step (D) may be a step performed before step (E), or may be performed before step (A), between steps (A) and (B), between steps (B) and (C), or between steps (C) and (E).

[Step (E)]
Step (E) is a step of arranging a plurality of support pieces Da around the first chip T1 on the substrate 10. Through this step, the structure 30 shown in FIG. 6 is produced. The structure 30 includes the substrate 10, the chip T1 arranged on the surface thereof, and a plurality of support pieces Da. The arrangement of the support pieces Da may be performed by a pressure bonding process. The pressure bonding process is preferably performed, for example, under conditions of 80 to 180° C. and 0.01 to 0.50 MPa for 0.5 to 3.0 seconds. The adhesive piece 5p contained in the support piece Da may be completely cured to become the support piece Dc at the time of step (E), or may not be completely cured at this time. The adhesive piece 5p contained in the support piece Da may be completely cured to become the adhesive piece 5c at the time before the start of step (G).

[Step (F)]
Step (F) is a step of preparing the chip T2a with adhesive piece shown in Fig. 7. The chip T2a with adhesive piece includes the chip T2 and an adhesive piece Ta provided on one surface of the chip T2. The chip T2a with adhesive piece can be obtained, for example, by using a semiconductor wafer and a dicing/die bonding integrated film through a dicing step and a pick-up step.

[Step (G)]
Step (G) is a step of arranging the chip T2a with adhesive pieces above the chip T1 so that the adhesive pieces Ta are in contact with the upper surfaces of the multiple support pieces Dc. Specifically, the chip T2 is pressure-bonded to the upper surface of the support piece Dc via the adhesive pieces Ta. This pressure-bonding process is preferably carried out for 0.5 to 3.0 seconds under conditions of, for example, 80 to 180°C and 0.01 to 0.50 MPa. Next, the adhesive pieces Ta are hardened by heating. This hardening process is preferably carried out for 5 minutes or more under conditions of, for example, 60 to 175°C and 0.01 to 1.0 MPa. As a result, the adhesive pieces Ta harden and become adhesive pieces Tc. Through this process, a dolmen structure is constructed on the substrate 10 (see FIG. 8).

After step (G) and before step (H), chip T3 is placed on chip T2 via an adhesive piece, and chip T4 is placed on chip T3 via an adhesive piece. The adhesive piece may be a thermosetting resin composition similar to the adhesive piece Ta described above, and becomes adhesive piece Tc by heat curing (see Figure 1). Meanwhile, chips T2, T3, and T4 are each electrically connected to substrate 10 by wires w. Note that the number of chips stacked above chip T1 is not limited to three as in this embodiment, and may be set as appropriate.

[Step (H)]
Step (H) is a step of sealing the gap between the chip T1 and the chip T2 with the sealing material 50. Through this step, the semiconductor device 100 shown in FIG.

(Thermosetting resin composition)
As described above, the thermosetting resin composition constituting the thermosetting resin layer 5 contains an epoxy resin, a curing agent, and an elastomer, and further contains an inorganic filler, a curing accelerator, etc., as necessary. According to the studies of the present inventors, it is preferable that the support piece Da and the support piece Dc after curing have the following characteristics.
Characteristic 1: When the support piece Da is thermocompression-bonded to a predetermined position on the substrate 10, displacement is unlikely to occur (the melt viscosity of the adhesive piece 5p at 120°C is, for example, 4300 to 50000 Pa·s or 5000 to 40000 Pa·s).
Characteristic 2: The adhesive piece 5c exhibits stress relaxation properties within the semiconductor device 100 (the thermosetting resin composition contains an elastomer (rubber component)).
Characteristic 3: The adhesive strength of the chip with adhesive piece to the adhesive piece Tc is sufficiently high (the die shear strength of the adhesive piece 5c to the adhesive piece Tc is, for example, 2.0 to 7.0 MPa or 3.0 to 6.0 MPa).
Characteristic 4: The shrinkage rate associated with curing is sufficiently small. Characteristic 5: The support piece Da is easily visible by a camera in the pick-up process (the thermosetting resin composition contains, for example, a coloring agent).
Property 6: The adhesive piece 5c has sufficient mechanical strength

[Epoxy resin]
The epoxy resin is not particularly limited as long as it has an adhesive action when cured. Bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin, etc. can be used. In addition, generally known epoxy resins such as multifunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins can be applied. These may be used alone or in combination of two or more.

[Curing agent]
Examples of the curing agent include phenolic resins, ester compounds, aromatic amines, aliphatic amines, and acid anhydrides. Of these, phenolic resins are preferred from the viewpoint of achieving high die shear strength. Commercially available phenolic resins include, for example, LF-4871 (trade name, BPA novolac type phenolic resin) manufactured by DIC Corporation, HE-100C-30 (trade name, phenylarakyl type phenolic resin) manufactured by Air Water Inc., Phenolite KA and TD series manufactured by DIC Corporation, Milex XLC-series and XL series (e.g., Milex XLC-LL) manufactured by Mitsui Chemicals Inc., HE series (e.g., HE100C-30) manufactured by Air Water Inc., MEHC-7800 series (e.g., MEHC-7800-4S) manufactured by Meiwa Kasei Co., Ltd., and JDPP series manufactured by JEF Chemical Co., Ltd. These may be used alone or in combination of two or more types.

From the viewpoint of achieving high die shear strength, the blending ratio of epoxy equivalent to hydroxyl equivalent of the epoxy resin and phenolic resin is preferably 0.6 to 1.5, more preferably 0.7 to 1.4, and even more preferably 0.8 to 1.3. By keeping the blending ratio within the above range, it is easy to achieve sufficiently high levels of both curability and fluidity.

[Elastomer]
Examples of the elastomer include acrylic resin, polyester resin, polyamide resin, polyimide resin, silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

From the viewpoint of achieving high die shear strength, acrylic resins are preferred as elastomers, and more preferably, acrylic resins such as epoxy group-containing (meth)acrylic copolymers obtained by polymerizing functional monomers having epoxy groups or glycidyl groups as crosslinkable functional groups, such as glycidyl acrylate or glycidyl methacrylate. Among acrylic resins, epoxy group-containing (meth)acrylic acid ester copolymers and epoxy group-containing acrylic rubbers are preferred, and epoxy group-containing acrylic rubbers are more preferred. Epoxy group-containing acrylic rubbers are rubbers having epoxy groups, mainly composed of acrylic acid esters and copolymers of butyl acrylate and acrylonitrile, ethyl acrylate and acrylonitrile, etc. The acrylic resins may have not only epoxy groups, but also crosslinkable functional groups such as alcoholic or phenolic hydroxyl groups and carboxyl groups.

Commercially available acrylic resins include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, and SG-P3 solvent-modified product (product name, acrylic rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent is cyclohexanone) manufactured by Nagase Chemtec Corporation.

From the viewpoint of achieving high die shear strength, the glass transition temperature (Tg) of the acrylic resin is preferably -50 to 50°C, and more preferably -30 to 30°C. From the viewpoint of achieving high die shear strength, the weight average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 3,000,000, and more preferably 500,000 to 2,000,000. Here, Mw means a value measured by gel permeation chromatography (GPC) and converted using a calibration curve of standard polystyrene. Note that by using an acrylic resin with a narrow molecular weight distribution, it tends to be possible to form adhesive pieces with high elasticity.

From the viewpoint of achieving high die shear strength, the amount of acrylic resin contained in the thermosetting resin composition is preferably 10 to 200 parts by mass, and more preferably 20 to 100 parts by mass, per 100 parts by mass of the epoxy resin and epoxy resin curing agent combined.

[Inorganic filler]
Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, boron nitride, crystalline silica, and amorphous silica. These may be used alone or in combination of two or more.

From the viewpoint of achieving high die shear strength, the average particle size of the inorganic filler is preferably 0.005 μm to 1.0 μm, and more preferably 0.05 to 0.5 μm. From the viewpoint of achieving high die shear strength, it is preferable that the surface of the inorganic filler is chemically modified. A silane coupling agent is an example of a suitable material for chemically modifying the surface. Examples of types of functional groups of the silane coupling agent include vinyl groups, acryloyl groups, epoxy groups, mercapto groups, amino groups, diamino groups, alkoxy groups, and ethoxy groups.

In order to achieve high die shear strength, the content of inorganic filler is preferably 20 to 200 parts by mass, and more preferably 30 to 100 parts by mass, per 100 parts by mass of the resin component of the thermosetting resin composition.

[Curing accelerator]
Examples of the curing accelerator include imidazoles and their derivatives, organic phosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high die shear strength, imidazole compounds are preferred. Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. These may be used alone or in combination of two or more.

From the viewpoint of achieving high die shear strength, the content of the curing accelerator in the thermosetting resin composition is preferably 0.04 to 3 parts by mass, and more preferably 0.04 to 0.2 parts by mass, per 100 parts by mass of the epoxy resin and epoxy resin curing agent combined.

Second Embodiment
9 is a cross-sectional view showing a semiconductor device according to the second embodiment. In the semiconductor device 100 according to the first embodiment, the chip T1 is separated from the adhesive piece Tc, whereas in the semiconductor device 200 according to the present embodiment, the chip T1 is in contact with the adhesive piece Tc. In other words, the adhesive piece Tc is in contact with the upper surface of the chip T1 and the upper surface of the support piece Dc. For example, by appropriately setting the thickness of the support piece forming film D, the position of the upper surface of the chip T1 can be made to coincide with the position of the upper surface of the support piece Dc.

In the semiconductor device 200, the chip T1 is flip-chip connected to the substrate 10, not by wire bonding. If the wire w is embedded in the adhesive piece Ta, the chip T1 can be in contact with the adhesive piece Tc even if the chip T1 is wire-bonded to the substrate 10. The adhesive piece Ta and the chip T2 form the adhesive piece-attached chip T2a (see FIG. 8).

As shown in FIG. 9, the adhesive piece Tc between chip T1 and chip T2 covers the region R of chip T2 facing chip T1 and extends continuously from region R to the peripheral side of chip T2. This single adhesive piece Tc covers region R of chip T2 and is interposed between chip T2 and multiple support pieces, bonding them together. The lower surface of chip T2 in FIG. 9 corresponds to the back surface. As mentioned above, the back surfaces of modern chips often have irregularities. By covering substantially the entire back surface of chip T2 with adhesive piece Tc, it is possible to prevent cracks or breakage in chip T2 even if the upper surface of chip T1 comes into contact with adhesive piece Tc.

Although the embodiments of the present disclosure have been described in detail above, the present invention is not limited to the above embodiments. For example, the above embodiment illustrates a laminated film 20 having an ultraviolet-curing adhesive layer 2, but the adhesive layer 2 may be a pressure-sensitive type.

In the above embodiment, as shown in FIG. 3(b), a laminate film 20 for forming a support piece is illustrated, which includes a three-layer structure film D for forming a support piece. However, the laminate film for forming a support piece may be two layers or four or more layers. The laminate film 20A for forming a support piece shown in FIG. 10 has a two-layer film D2 (film for forming a support piece) having a thermosetting resin layer 5 and a resin layer 6. That is, in the laminate film 20A for forming a support piece, a thermosetting resin layer 5 is disposed between the adhesive layer 2 and the outermost resin layer 6.

The ratio of the thickness of the thermosetting resin layer 5 to the thickness of the two-layer film D2 is preferably 0.1 to 0.8, more preferably 0.2 to 0.7, and even more preferably 0.2 to 0.6. When this ratio is 0.1 or more, the adhesive pieces 5p and 5c can perform their roles (e.g., supporting the chip T2 and preventing the resin piece 6p from shifting) to a higher degree. On the other hand, when the ratio is 0.8 or less, the resin piece 6p has a sufficient thickness, so that the resin piece 6p plays a role like a spring plate, and a better pickup performance can be achieved (see FIG. 5(d)). From these viewpoints, the thickness of the resin layer 6 may be, for example, 20 to 80 μm, or 20 to 60 μm. The thickness of the thermosetting resin layer 5 may be, for example, 5 to 120 μm, or 10 to 60 μm.

In addition, in the laminated film 20, 20A for forming a support piece, a metal layer (e.g., a copper layer or an aluminum layer) having a tensile modulus of elasticity of 8.0 MPa or more may be used instead of the resin layer 6. The thickness of the metal layer is, for example, 5 to 100 μm, and may be 10 to 90 μm or 20 to 80 μm. By including a metal layer in the laminated film 20, 20A for forming a support piece, in addition to excellent pick-up properties, the optical contrast between the resin material and the metal material can achieve excellent visibility of the support piece in the pick-up process.

The support piece forming laminate film 20A can be manufactured, for example, through the following steps.
A step of preparing a laminated film having a base film 1, an adhesive layer 2, and a thermosetting resin layer 5 in this order; and a step of bonding a resin layer 6 to the surface of the laminated film.

The present disclosure will now be described with reference to examples, but the present invention is not limited to these examples.

(Preparation of Varnish A)
Varnish A for forming a thermosetting resin layer of a film for forming a support piece was prepared using the following materials.
Epoxy resin 1: YDCN-700-10: (trade name, Nippon Steel & Sumitomo Metal Chemical Co., Ltd., cresol novolac type epoxy resin, solid at 25°C) 5.4 parts by mass Epoxy resin 2: YDF-8170C: (trade name, Nippon Steel & Sumitomo Metal Chemical Co., Ltd., liquid bisphenol F type epoxy resin, liquid at 25°C) 16.2 parts by mass Phenol resin (hardener): LF-4871: (trade name, DIC Corporation, BPA novolac type phenolic resin) 13.3 parts by mass Inorganic filler: SC2050-HLG: (trade name, Admatechs Co., Ltd., silica filler dispersion, average particle size 0.50 μm) 49.8 parts by mass Lastmer: SG-P3 solvent change product (trade name, Nagase ChemteX Corporation, acrylic rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent is cyclohexanone) 14.9 parts by mass Coupling agent 1: A-189: (trade name, GE Toshiba Corporation, γ-mercaptopropyltrimethoxysilane) 0.1 parts by mass Coupling agent 2: A-1160: (trade name, GE Toshiba Corporation, γ-ureidopropyltriethoxysilane) 0.3 parts by mass Curing accelerator: Curesol 2PZ-CN: (trade name, Shikoku Chemical Industry Co., Ltd., 1-cyanoethyl-2-phenylimidazole) 0.05 parts by mass Solvent: Cyclohexane

(Preparation of Varnish B)
Varnish B for forming a thermosetting resin layer of a film for forming a support piece was prepared using the following materials.
Epoxy resin: YDCN-700-10: (trade name, Nippon Steel & Sumikin Chemical Co., Ltd., cresol novolac type epoxy resin, solid at 25°C) 13.2 parts by mass Phenolic resin (curing agent): HE-100C-30: (trade name, Air Water Inc., phenylarakyl type phenolic resin) 11.0 parts by mass Inorganic filler: Aerosil R972: (trade name, Nippon Aerosil Co., Ltd., silica, average particle size 0.016 μm) 7.8 parts by mass Elastomer: SG-P3 solvent change product (trade name, Nagase ChemteX Corporation, acrylic 66.4 parts by weight of 1,3-diphenylmolecular-weight rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent: cyclohexanone; 0.4 parts by weight of coupling agent 1: A-189 (trade name, manufactured by GE Toshiba Corporation, γ-mercaptopropyltrimethoxysilane); 1.15 parts by weight of coupling agent 2: A-1160 (trade name, manufactured by GE Toshiba Corporation, γ-ureidopropyltriethoxysilane); 0.03 parts by weight of curing accelerator: Curesol 2PZ-CN (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., 1-cyanoethyl-2-phenylimidazole); 0.03 parts by weight of solvent: cyclohexane

Example 1
As described above, cyclohexanone was used as a solvent, and the solid content of varnish A was adjusted to 40% by mass. Varnish A was filtered through a 100-mesh filter and vacuum degassed. A polyethylene terephthalate (PET) film (thickness 38 μm) that had been subjected to a release treatment was prepared as a film to which varnish A was applied. The varnish A after vacuum degassing was applied to the release-treated surface of the PET film. The applied varnish A was heated and dried in two stages at 90 ° C for 5 minutes and then at 140 ° C for 5 minutes. In this way, a thermosetting resin layer in a B-stage state (semi-cured state) was formed on the surface of the PET film. A polyimide film (thickness: 25 μm, tensile modulus: 46.4 MPa) was attached to the surface of the thermosetting resin layer on a hot plate at 70 ° C., thereby producing a support piece forming film having the same configuration as the two-layer film D2 shown in FIG. 10 on the surface of the PET film.

A laminated film (dicing tape) having an ultraviolet-curing adhesive layer was prepared by the following procedure. First, 83 parts by mass of 2-ethylhexyl acrylate, 15 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid were used as raw materials, and ethyl acetate was used as a solvent to obtain a copolymer by solution radical polymerization. 12 parts by mass of 2-methacryloyloxyethyl isocyanate was reacted with this acrylic copolymer to synthesize an ultraviolet-irradiation type acrylic copolymer having a carbon-carbon double bond. In the above reaction, 0.05 parts of hydroquinone monomethyl ether was used as a polymerization inhibitor. The weight-average molecular weight of the synthesized acrylic copolymer was measured by GPC and was found to be 300,000 to 700,000. The acrylic copolymer obtained in this manner was mixed with 2.0 parts in terms of solid content of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., product name: Coronate L) as a curing agent, and 0.5 parts of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator to prepare an ultraviolet-irradiation type adhesive solution. This ultraviolet irradiation type adhesive solution was applied and dried on a polyethylene terephthalate release film (thickness: 38 μm) so that the thickness after drying was 10 μm. Then, a polyolefin film (thickness: 90 μm) with one side subjected to corona discharge treatment was attached to the adhesive layer. The obtained laminated film was aged in a thermostatic chamber at 40° C. for 72 hours to prepare a dicing tape.

A support piece forming film (a two-layer film of a thermosetting resin layer and a polyimide film) was attached to the adhesive layer of the dicing tape using a rubber roll on a hot plate at 70°C, with the side of the support piece forming film having the thermosetting resin layer facing the adhesive layer. This resulted in a laminate of the support piece forming film and the dicing tape. The thickness of the thermosetting resin layer was 25 μm.

Example 2
A laminate of a support piece-forming film and a dicing tape was obtained in the same manner as in Example 1, except that varnish B was used instead of varnish A.

<Comparative Examples 1 and 2>
Laminates according to Comparative Examples 1 and 2 were obtained in the same manner as in Examples 1 and 2, except that the thickness of the thermosetting resin layer was 50 μm instead of 25 μm, and no polyimide film was attached to the surface of the thermosetting resin layer.

The films for forming support pieces of the Examples and Comparative Examples were evaluated as follows.
(1) Peel strength The laminate including the support piece forming film according to the examples and comparative examples was cut to a width of 25 mm and a length of 100 mm to prepare a test piece. Then, ultraviolet rays were irradiated from the dicing tape side under conditions of 80 mW/cm ² and 200 mJ/cm ² using a halogen lamp. The peel strength (peel angle: 180°, peel speed: 300 mm/min) of the interface between the adhesive layer irradiated with ultraviolet rays and the support piece forming film was measured. For each example and comparative example, the measurement was performed three times, and the average value is shown below.
Example 1: 0.04N/25mm
Example 2: 0.05N/25mm
Comparative Example 1: 0.09 N/25 mm
Comparative Example 2: 0.05N/25mm

(2) Pick-up properties A laminate of the support piece forming film (shape: circular with a diameter of 320 mm) and the dicing tape (shape: circular with a diameter of 335 mm) according to the examples and comparative examples was prepared. A dicing ring was laminated to the dicing tape of this laminate at 70°C. The support piece forming film was cut into individual pieces with a height of 55 μm using a dicer. As a result, a support piece having a size of 10 mm x 10 mm was obtained. The adhesive layer of the support piece was irradiated with ultraviolet light from the dicing tape side under conditions of 80 mW/cm ² and 200 mJ/cm ² using a halogen lamp. After that, the support piece was picked up in a state where it was expanded (expanded amount: 3 mm) by a die bonder. A three-stage push-up stage was used as a push-up jig, and the conditions were a push-up speed of 10 mm/sec and a push-up height of 1200 μm. Pick-up was attempted for six support pieces for each example and each comparative example. As a result, all six support pieces could be picked up for Examples 1 and 2. In contrast, in Comparative Examples 1 and 2, of the six support pieces, two or less could be picked up.

According to the present disclosure, a method for manufacturing a semiconductor device is provided that can simplify the process of producing a support piece in the manufacturing process of a semiconductor device having a dolmen structure and achieve excellent pick-up properties of the support piece. In addition, according to the present disclosure, a semiconductor device having a dolmen structure, and a laminated film for forming a support piece and a manufacturing method thereof are provided.

1...base film, 2...adhesive layer, 5...thermosetting resin layer, 5c...adhesive piece (cured product), 5p...adhesive piece, 6...resin layer, 6p...resin piece, 10...substrate, 20, 20A...laminated film for forming support piece, 50...sealing material, 100, 200...semiconductor device, D...film for forming support piece, D2...two-layer film (film for forming support piece), Da, Dc...support piece, R...area, T1...first chip, T2...second chip, T2a...chip with adhesive piece, Ta, Tc...adhesive piece

Claims (12)

A method for manufacturing a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip on the substrate, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip, comprising:
(A) preparing a laminated film having a base film, an adhesive layer, and a support piece-forming film in this order;
(B) forming a plurality of support pieces on the surface of the adhesive layer by dividing the support piece forming film;
(C) picking up the support piece from the adhesive layer;
(D) disposing a first chip on a substrate;
(E) arranging a plurality of the support pieces on the substrate around the first chip or around a region in which the first chip is to be arranged;
(F) preparing a chip with an adhesive piece, the chip comprising a second chip and an adhesive piece provided on one surface of the second chip;
(G) constructing a dolmen structure by placing the adhesive chips on the surfaces of a plurality of the support pieces;
Including,
The method for manufacturing a semiconductor device, wherein the support piece-forming film has a multilayer structure including at least a resin layer having a tensile modulus of elasticity of 8.0 MPa or more. The adhesive layer is an ultraviolet curing type,
The method for manufacturing a semiconductor device according to claim 1 , further comprising the step of irradiating the adhesive layer with ultraviolet light between steps (B) and (C). The support piece forming film includes a thermosetting resin layer,
The method for manufacturing a semiconductor device according to claim 1 , further comprising the step of heating the support piece-forming film or the support piece prior to the step (G). A support piece forming laminated film used in a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip,
A base film;
An adhesive layer;
A support piece forming film that is divided into a plurality of support pieces ;
in this order,
The support piece-forming laminate film has a multilayer structure including at least a resin layer having a tensile modulus of elasticity of 8.0 MPa or more. The support piece-forming laminate film according to claim 4 , wherein the resin layer is a polyimide layer. The support piece forming laminate film according to claim 4 or 5 , wherein the support piece forming film has a thickness of 5 to 180 μm. The support piece forming laminate film according to any one of claims 4 to 6 , wherein the adhesive layer is a pressure-sensitive type or an ultraviolet-curable type. The support piece forming film includes a thermosetting resin layer,
The support piece forming laminate film according to claim 4 , wherein the thermosetting resin layer is made of a material different from that of the resin layer. The laminated film for forming a support piece according to claim 8 , wherein the thermosetting resin layer contains an epoxy resin. The support piece-forming laminate film according to claim 8 or 9 , wherein the thermosetting resin layer contains an elastomer. A method for manufacturing a support piece-forming laminated film used in a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip, comprising:
A step of preparing an adhesive film having a base film and an adhesive layer formed on one surface of the base film;
A step of laminating a support piece forming film on a surface of the adhesive layer , the film being cut into individual pieces to form the plurality of support pieces ;
Including,
The method for producing a laminated film for forming a support piece, wherein the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile modulus of elasticity of 8.0 MPa or more. A method for manufacturing a support piece-forming laminated film used in a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip, comprising:
A step of preparing a laminated film having a base film, an adhesive layer, and a thermosetting resin layer in this order;
A step of forming a support piece-forming film by laminating a resin layer having a tensile modulus of 8.0 MPa or more on a surface of the thermosetting resin layer;
Including,
The method for producing a laminated film for forming a support piece, wherein the film for forming a support piece includes the thermosetting resin layer and the resin layer, and is singulated to form a plurality of the support pieces.

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