JP7473298B2 - Evaporation mask - Google Patents

Description

The present invention relates to a metal mask in which the mask body is supported by a frame. The metal mask according to the present invention is suitable for use, for example, as a deposition mask used when forming a light-emitting layer of an organic EL element.

In mobile devices with display devices such as smartphones and tablet terminals, the use of lighter and less power-consuming organic electroluminescence (EL) displays has begun to replace liquid crystal displays in order to reduce the weight of the devices and extend their operating time. Organic EL displays are manufactured by forming the light-emitting layer (evaporation layer) of the organic EL element on the substrate (evaporation target) using the deposition mask method.

The deposition mask used in the deposition mask method is disclosed, for example, in Patent Document 1, which was previously proposed by the present applicant. In Patent Document 1, the deposition mask is composed of multiple mask bodies arranged in a matrix, a reinforcing frame body arranged to surround each mask body, and a metal layer that inseparably bonds the two. This deposition mask is manufactured through a first electroforming process in which multiple mask bodies are formed on a matrix by electroforming, a frame body arrangement process in which a frame body is arranged on the matrix, a second electroforming process in which a metal layer is formed by electroforming and each mask body is bonded to the frame body, and a peeling process in which the multiple mask bodies, the frame body, and the metal layer are peeled off together from the matrix.

JP 2005-15908 A

If the adhesive strength between the mask body and the metal layer is insufficient, peeling will occur between the mask body and the metal layer during the peeling process in which the mask body, frame, and metal layer are peeled off together from the matrix. In addition, the mask body of the deposition mask peeled off from the matrix is subjected to inward shrinking stress. This is due to the fact that the liquid temperature in the electroforming tank in the first electroforming process in which the mask body is formed is higher than room temperature. As the mask body tries to shrink, a tensile stress acts on the frame via the metal layer, and if this shrinking stress is strong, peeling may occur between the mask body and the metal layer.

The present invention aims to improve the adhesion between a mask body and a metal layer in a deposition mask in which the mask body and a frame are bonded via a metal layer.

The deposition mask according to the present invention comprises a mask body 2 in which a deposition pattern consisting of a large number of independent deposition through holes 9 is formed, a frame body 3 having a mask opening 5 in which the mask body 2 is placed, and a metal layer 4 that integrally bonds the mask body 2 and the frame body 3. The mask body 2 comprises a pattern formation region 7 in which the deposition pattern is formed, and a bonding region 8 in which the metal layer 4 is bonded, and is characterized in that an adhesion plating layer 34 is formed on the upper surface of the bonding region 8.

In addition, an adhesion plating layer 34 can be formed on the upper surface and outer peripheral surface of the joining area 8.

In addition, a joining through hole 10 can be formed in the joining region 8, and an adhesive plating layer 34 can be formed on the inner surface of the joining through hole 10.

The mask body 2 can also be formed into a rectangular shape with rounded corners.

In addition, a cutout hole is provided in the frame body 3, and a blocking body 19 is placed in the cutout hole. The blocking body 19 has a bonding area 21 where the metal layer 4 is bonded, and an adhesive plating layer 34 can be formed in the bonding area 21.

In the present invention, an adhesion plating layer 34 is formed on the upper surface of the bonding region 8 where the metal layer 4 is bonded to the mask body 2 of the deposition mask 1. This can increase the bonding strength of the metal layer 4 to the mask body 2.

1 is a perspective view showing an entire deposition mask according to a first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 2 is a plan view showing a main part of the deposition mask according to the first embodiment. FIG. 2 is a plan view of a frame of the deposition mask according to the first embodiment. 1A to 1C are explanatory diagrams showing a method for manufacturing a deposition mask according to a first embodiment. 1A to 1C are explanatory diagrams showing a method for manufacturing a deposition mask according to a first embodiment. 1A to 1C are explanatory diagrams showing a method for manufacturing a deposition mask according to a first embodiment. FIG. 11 is a perspective view showing an entire deposition mask according to a second embodiment of the present invention. FIG. 11 is a plan view of a frame of a deposition mask according to a second embodiment. FIG. 11 is a plan view showing a main part of a frame of a deposition mask according to a third embodiment of the present invention. FIG. 11 is a vertical sectional view of a deposition mask according to a fourth embodiment of the present invention. 11A to 11C are explanatory diagrams of a deposition process using a deposition mask according to Example 4. FIG. 11 is a vertical sectional view of a deposition mask according to a fifth embodiment of the present invention. FIG. 11 is a vertical sectional view of a deposition mask showing a modified example of the first embodiment.

(Example 1) Figures 1 to 7 show Example 1 of a deposition mask according to the present invention. Note that the dimensions such as thickness and width in each figure of this example are not shown in actuality, but are shown only as a schematic. The same applies to the figures of the following examples.

As shown in Figures 1 and 2, the deposition mask 1 includes a plurality of mask bodies 2 (nine in this embodiment) arranged in a matrix, a reinforcing frame 3 arranged to surround each mask body 2, and a metal layer 4 that bonds the mask bodies 2 and 3 inseparably. The frame 3 has the same number of mask openings 5 as the mask bodies 2 (see Figure 4). Each mask opening 5 is formed to be slightly larger than the mask body 2, and one mask body 2 is arranged in each mask opening 5. The metal layer 4 is formed in the gap between the periphery of the mask body 2 and the opening edge of the mask opening 5, and bonds the mask body 2 and the frame 3.

The mask body 2 is formed in a rectangular shape with rounded corners, and includes an inner pattern formation region 7 that occupies the majority of the area, and an outer bonding region 8 that surrounds the inner pattern formation region 7. In the pattern formation region 7, a deposition pattern consisting of many independent deposition through holes 9 is formed. In the bonding region 8, as shown in FIG. 3, a number of bonding through holes 10 can be formed in two rows along each side of the mask body 2. This mask body 2 is formed by electroforming using nickel as the material for the electrodeposited metal. In this embodiment, the thickness of each mask body 2 is set to 8 μm. The mask body 2 can be formed using nickel alloys such as nickel-cobalt, copper, and other electrodeposited metals other than nickel. Furthermore, the mask body 2 may have a laminated structure of two or more layers. Specifically, for example, the mask body 2 is formed having an upper layer made of a glossy plating layer and a lower layer made of a matte plating layer, and the thickness ratio of each layer can be set to, for example, upper layer:lower layer=5:7.

2, the frame 3 has a laminated structure, and is formed by bonding an upper frame 15 and a lower frame 16 of the same shape with an adhesive layer 17. The upper frame 15 and the lower frame 16 are formed of a metal plate material with a low coefficient of linear thermal expansion, such as Invar material, which is a nickel-iron alloy. In this embodiment, the thickness dimensions of the upper frame 15 and the lower frame 16 are set to 0.5 mm, and the frame 3 is formed to be sufficiently thicker than the mask body 2. In addition to the above-mentioned Invar material, the upper frame 15 and the lower frame 16 may be formed of Super Invar material, which is a nickel-iron-cobalt alloy, or a ceramic material, and the thickness dimensions of the upper frame 15 and the lower frame 16 may be different. In addition to the two-layer structure of the upper frame 15 and the lower frame 16, the frame 3 may be a laminated structure of three or more layers or a single layer structure, or a four-layer structure (for example, two frames 3 each having an upper frame 15 and a lower frame 16 are laminated and bonded together) may be adopted. The adhesive layer 17 can be a sheet-shaped uncured photosensitive dry film resist or various commercially available adhesives.

The frame body 3 comprises a rectangular outer peripheral frame 12 and a lattice frame 13 that defines the mask openings 5 within the outer peripheral frame 12. The outer peripheral frame 12 can be formed with reduced-strength sections 14, and as shown in FIG. 4, by forming the reduced-strength sections 14 consisting of L-shaped cutouts at the four corners, which are the parts of the outer peripheral frame 12 that have the highest tensile strength, it is possible to reduce the tensile strength of the four corners and make the tensile strength uniform around the entire circumference of the outer peripheral frame 12 (the significance of this will be described later). When the reduced-strength sections 14 consist of cutouts, it is preferable to form each corner into an R shape.

When forming the strength-reduced portion 14 in the frame body 3, an L-shaped sheet-like blocking body 19 that is slightly smaller than the strength-reduced portion 14 is placed in the strength-reduced portion 14. The blocking body 19 has an inner blocking region 20 that does not have any through holes and an outer joining region 21 that surrounds the inner blocking region 20, and is inseparably joined to the frame body 3 via the metal layer 4, similar to the mask body 2. A large number of joining through holes 22 arranged in two rows can be formed in the joining region 21 of the blocking body 19, similar to the joining region 8 of the mask body 2. Note that the blocking body 19 is formed of the same material and to the same thickness as the mask body 2 at the same time during the manufacturing process of the deposition mask.

The metal layer 4 is formed continuously from the surface of the frame 3 to the bonding region 8 of the mask body 2 by electroforming, which will be described later. This metal layer 4 is also formed inside the bonding through holes 10, which improves the bonding strength of the metal layer 4 to the mask body 2. In this embodiment, the metal layer 4 is formed from nickel, but it can also be formed from nickel alloys such as nickel-cobalt, or other electrodeposited metals and alloys. In the present invention, it is not essential to form the metal layer 4 on the top surface of the frame 3, and it is sufficient that the metal layer 4 is formed at least on the side surface of the frame 3 (the inner peripheral surface of the mask opening 5).

An example of a method for manufacturing the deposition mask 1 according to this embodiment is shown in Figs. 5 to 7. First, as shown in Fig. 5(a), a negative type photoresist layer 25 is formed on the surface of a matrix 24 made of a conductive material, such as stainless steel or brass. Next, a pattern film 26 made of a glass mask is attached to the photoresist layer 25 to obtain a patterning pre-stage body 27. The pattern film 26 has a light-transmitting hole 26a corresponding to the deposition through hole 9 of the mask body 2, a light-transmitting hole 26b corresponding to the joint through hole 10 of the mask body 2, and a light-transmitting hole 26c corresponding to the joint through hole 22 of the blocking body 19. Furthermore, the pattern film 26 has a light-transmitting groove 26d having a rectangular frame shape in a plan view surrounding a group of light-transmitting holes 26a and 26b corresponding to one mask body 2, and a light-transmitting groove 26e having a hollow L-shape in a plan view surrounding a group of light-transmitting holes 26c corresponding to one blocking body 19. The inner edge of the rectangular frame-shaped light-transmitting groove 26d coincides with the outer contour of the mask body 2, and the inner edge of the hollow L-shaped light-transmitting groove 26e coincides with the outer contour of the occluding body 19.

Then, the obtained patterning pre-stage body 27 and the inside of the furnace of the ultraviolet irradiation device equipped with the ultraviolet lamp 28 are preheated to the furnace temperature during the exposure operation. After the preheating is completed, the patterning pre-stage body 27 is placed in the furnace of the ultraviolet irradiation device, and the photoresist layer 25 is exposed through the pattern film 26 by irradiating it with ultraviolet light from the ultraviolet lamp 28. The patterning pre-stage body 27 after exposure is taken out, the pattern film 26 is removed from the photoresist layer 25, and the unexposed parts of the photoresist layer 25 are dissolved and removed (developed) to form a primary pattern resist 29 on the matrix 24, as shown in FIG. 5(b). The primary pattern resist 29 is composed of resist bodies 29a to 29e corresponding to the light-transmitting holes 26a to 26c and the light-transmitting grooves 26d and 26e of the pattern film 26.

Next, as shown in FIG. 5(c), the surface of the matrix 24 that is not covered by the resist bodies 29a-29e is subjected to electroforming (plating) to form a primary electroforming layer 30 within the height range of the resist bodies 29a-29e. The primary electroforming layer 30 is composed of the mask body 2 and the blocking body 19 that constitute the completed deposition mask 1, and the frame support part 31 that is removed before completion. After the primary electroforming layer 30 is formed, the primary pattern resist 29 is dissolved and removed as shown in FIG. 5(d). This causes the deposition through holes 9 and the connection through holes 10 of the mask body 2, and the connection through holes 22 of the blocking body 19 to appear.

Next, an adhesion plating layer 34 (see FIG. 2) is formed to increase the bonding strength (adhesion) of the metal layer 4 to the mask body 2 and the blocking body 19. In the mask body 2, the adhesion plating layer 34 is formed on the upper and outer peripheral surfaces (side surfaces) of the bonding area 8 and the inner peripheral surfaces of the bonding through holes 10. In the blocking body 19, the adhesion plating layer 34 is also formed on the upper and outer peripheral surfaces (side surfaces) of the bonding area 21 and the inner peripheral surfaces of the bonding through holes 22. The adhesion plating layer 34 is formed by strike plating or matte plating using metals or alloys such as nickel or copper as the material, so as to be sufficiently thinner than the primary electroforming layer 30.

The procedure for forming the adhesion plating layer 34 is as follows: first, as shown in FIG. 6(a), a negative type photoresist layer 35 is formed on the entire surface of the primary electroforming layer 30, and a pattern film 36 is adhered thereon. This pattern film 36 has a rectangular frame-shaped non-transparent portion 36a corresponding to the bonding area 8 of the mask body 2, a hollow L-shaped non-transparent portion 36b corresponding to the bonding area 21 of the blocking body 19, and a transparent portion 36c occupying the remaining portion. Next, ultraviolet light is irradiated from the ultraviolet lamp 28 to expose the photoresist layer 35 through the pattern film 36. After exposure, the pattern film 36 is removed from the photoresist layer 35, and the unexposed portion of the photoresist layer 35 is dissolved and removed (developed) to form the pattern resist 37 shown in FIG. 6(b). This pattern resist 37 has an opening 37a that exposes the bonding areas 8 and 21 of the mask body 2 and the blocking body 19. In other words, the pattern resist 37 covers the entire surface of the primary electroforming layer 30 except for the area where the adhesion plating layer 34 is formed.

Next, the surface of the primary electroforming layer 30 facing the opening 37a is plated (adhesion treatment) to form the adhesion plating layer 34 shown in an enlarged view in FIG. 6(c). The adhesion plating layer 34 is inevitably formed on the surface of the mother mold 24 facing the opening 37a, but since the adhesion plating layer 34 on the mother mold 24 becomes an obstacle when the mask body 2 and the blocking body 19 are later peeled off from the mother mold 24, it is preferable to make its area as small as possible. When the pattern resist 37 is dissolved and removed after the formation of the adhesion plating layer 34, the state shown in FIG. 6(c) is obtained. Instead of forming the adhesion plating layer 34 on the bonding areas 8 and 21 and the bonding through holes 10 and 22, activation treatment (adhesion treatment) such as acid immersion or electrolysis may be performed. This also increases the bonding strength (adhesion) of the metal layer 4 to the mask body 2 and the blocking body 19.

Next, the frame 3 is joined to the mask body 2 and the blocking body 19 of the primary electroforming layer 30 with the metal layer 4. Specifically, as shown in FIG. 7(a), a negative type photoresist layer 40 is first formed on the entire surface of the primary electroforming layer 30 on which the adhesion plating layer 34 has been formed, and a pattern film 41 is then adhered onto the photoresist layer 40. This pattern film 41 has a rectangular light-transmitting hole 41a corresponding to the pattern forming area 7 of the mask body 2 and an L-shaped light-transmitting hole 41b corresponding to the blocking area 20 of the blocking body 19.

Next, ultraviolet light is applied from an ultraviolet lamp 28 to expose the photoresist layer 40 through the pattern film 41. After exposure, the pattern film 41 is removed from the photoresist layer 40, and the unexposed portions of the photoresist layer 40 are dissolved and removed (developed) to form a secondary pattern resist 42 as shown in FIG. 7(b). The secondary pattern resist 42 is composed of a resist body 42a that covers the surface of the pattern formation region 7 of the mask body 2, and a resist body 42b that covers the surface of the blocking region 20 of the blocking body 19. The deposition through holes 9 of the pattern formation region 7 are covered with the resist body 42a, so that electroforming liquid does not penetrate into the through holes 9 during the subsequent electroforming process.

Next, as shown in FIG. 7(c), the frame 3 is placed at a predetermined position on the upper surface of the frame support portion 31 of the primary electroforming layer 30. In plan view, the frame support portion 31 is formed to be slightly larger than the frame 3. An adhesive layer 45 is pre-laminated on the lower surface of the frame 3 supported by the frame support portion 31 via a peeling layer 44, and this adhesive layer 45 fixes the frame 3 to the frame support portion 31 so that it cannot shift. In this embodiment, the peeling layer 44 is formed of nickel or its alloy, and the adhesive layer 45 is formed of an unexposed photoresist layer.

7(d), electroforming (plating) is performed to form a secondary electroforming layer, i.e., a metal layer 4, which is continuous from the surface of the frame 3 to the joint regions 8 and 21 of the mask body 2 and the blocking body 19. The metal layer 4 on the surface of the primary electroforming layer 30 is formed within the height range of the resist bodies 42a and 42b. In addition, by forming the metal layer 4 in the joint through holes 10 and 22 at this time, the bonding strength of the metal layer 4 to the mask body 2 and the blocking body 19 is further improved, in combination with the formation of the adhesion plating layer 34 on the inner peripheral surface of the joint through holes 10 and 22. After the electroforming process, the primary electroforming layer 30, the frame 3, and the metal layer 4 are peeled off from the matrix 24, and then the frame support portion 31 of the primary electroforming layer 30 is peeled off from the frame 3 and the metal layer 4 together with the adhesive layer 45 and the peeling layer 44. Finally, the secondary pattern resist 42 is removed to obtain the completed deposition mask 1 shown in FIG. 7(e). The secondary pattern resist 42 may be removed before peeling off the primary electroforming layer 30, the frame 3, and the metal layer 4, or before peeling off the frame support 31, the adhesive layer 45, and the peeling layer 44.

In the completed deposition mask 1 peeled off from the matrix 24, the mask body 2 is subjected to a stress that tends to shrink inward. This is due to the fact that the liquid temperature (e.g., 40 to 50°C) in the electroforming tank when forming the primary electroforming layer 30 including the mask body 2 is higher than room temperature. As each mask body 2 tries to shrink, a tensile stress acts on the frame body 3 via the metal layer 4. Each part of the lattice frame 13 of the frame body 3 is sandwiched between two adjacent mask bodies 2 (mask openings 5) on both sides and is pulled from both sides by the mask bodies 2, but is hardly deformed because the tensile stresses are canceled out by each other. On the other hand, each part of the outer peripheral frame 12 is adjacent to only one mask body 2 (mask opening 5) and is pulled from only one side by the mask body 2, so it is more likely to deform than the lattice frame 13.

The tensile strength of each part of the outer peripheral frame 12 is not the same, and the four corners in particular have a relatively high tensile strength and are difficult to deform (difficult to deform part). If the deformation amount of the outer peripheral frame 12 differs from part to part, each side may bend inward. Therefore, in this embodiment, a strength-reducing part 14 consisting of an L-shaped notch is formed at each of the four corners of the outer peripheral frame 12. This reduces the tensile strength of the four corners of the outer peripheral frame 12, making the tensile strength uniform over the entire circumference of the outer peripheral frame 12. In other words, the tensile stress generated by the contraction of the mask main body 2 can be dispersed throughout the entire outer peripheral frame 12, avoiding concentration at the center (easy to deform part) of each side of the outer peripheral frame 12. This suppresses the inward bending deformation of each side of the outer peripheral frame 12, and allows the overall outer shape of the frame body 3 and therefore the deposition mask 1 to be maintained in good condition. In this embodiment, a stress that tends to contract inward also acts on the blocking body 19 formed simultaneously with the mask main body 2. Although it is preferable that this stress acts, the blocking body 19 can be formed so that the stress is zero or as small as possible. If necessary, the blocking body 19 can be omitted. In this case, the notch hole as the strength reduction portion 14 may be bottomed. In addition, in the present embodiment, the adhesion plating layer 34 is formed on the entire bonding area 8/22 of the mask body 2 and the blocking body 19 (upper surface and outer circumferential surface), but as shown in FIG. 14, the adhesion plating layer 34 may be partially formed only on the upper surface excluding the outer circumferential edge of the bonding area 8/22. Compared to the embodiment in which the adhesion plating layer 34 is formed on the entire bonding area 8/22 as shown in FIG. 2, if the formation area of the adhesion plating layer 34 (contact area with the matrix 24) is made smaller as shown in FIG. 14, the mask body 2 and the blocking body 19 can be relatively easily peeled off from the matrix 24.

(Example 2) Figures 8 and 9 show Example 2 of the deposition mask according to the present invention. In this example, a plurality of strength-reduced portions 14 are formed around the entire circumference of the outer peripheral frame 12 of the frame body 3, and the opening area of these strength-reduced portions 14 (the length dimension in the circumferential direction of the outer peripheral frame 12) is gradually reduced from the corners of the outer peripheral frame 12 to the center of the side. The corners of the outer peripheral frame 12 are difficult-to-deform portions that have a relatively high tensile strength and are difficult to deform, and the center of the side of the outer peripheral frame 12 is an easy-to-deform portion that has a relatively low tensile strength and is easy to deform. As in this example, by gradually reducing the opening area of the strength-reduced portions 14 from the difficult-to-deform portions to the easy-to-deform portions of the outer peripheral frame 12, the tensile strength of each portion of the outer peripheral frame 12 can be more accurately uniformed around the entire circumference, and thus bending deformation of each side of the outer peripheral frame 12 can be more reliably prevented. Since the rest is the same as Example 1, the same members are given the same symbols and their description is omitted. The same applies to the following examples. In addition, instead of gradually reducing the length dimension of the strength-reduced portion 14 in the circumferential direction of the outer peripheral frame 12, the same effect as this embodiment can be obtained by gradually reducing the width dimension of the strength-reduced portion 14 in the width direction perpendicular to the circumferential direction.

The occlusion bodies 19, which are made of the same material and thickness as the mask body 2, exert the effect of suppressing deformation of the mask body 2 by deforming themselves (becoming dummies). By arranging a group of occlusion bodies 19 so as to surround the mask body 2, as in this embodiment, deformation of the mask body 2 can be suppressed more accurately. Furthermore, by forming each occlusion body 19 to have the same shape and size as the mask body 2, the above effect is maximized.

(Example 3) FIG. 10 shows Example 3 of the deposition mask according to the present invention. In this example, a plurality of crosspieces 47 that connect the opening edges of the strength-reduced portions 14 of the frame body 3 are integrally provided with the outer peripheral frame 12. These crosspieces 47 reinforce the tensile strength of the four corners of the outer peripheral frame 12, and are provided to prevent the tensile strength of the four corners from being excessively reduced by forming the strength-reduced portions 14. In this example, the tensile strength of the four corners (difficult-to-deform portions) of the outer peripheral frame 12 including the strength-reduced portions 14 and the crosspieces 47 is approximately equal to the tensile strength of the center of the side portion (easy-to-deform portion) of the outer peripheral frame 12. The crosspieces 47 may be formed integrally with the frame body 3 from the beginning, or the crosspieces 47 made of separate bodies may be joined to the frame body 3 to be integrated. When the two bodies 3 and 47 are separate bodies, the crosspieces 47 may be made of the same material as the frame body 3 or a different material. However, even when the crosspieces 47 are made of a different material from the frame body 3, it is preferable to form the crosspieces 47 from a material with a low thermal expansion coefficient, such as an Invar material or a ceramic material, like the frame body 3.

As another embodiment of this embodiment, the strength-reduced portion 14 can be formed endlessly around the entire circumference of the outer frame 12, and the crosspieces 47 can be provided so that the adjacent pitch gradually decreases from the four corners (difficult to deform portions) to the center of the side (easy to deform portions), or the crosspieces 47 can be gradually thickened without changing the adjacent pitch. According to these other embodiments, the same effect as in the previous embodiment 2 can be obtained. In addition, in the embodiment 3 and its other embodiments, each of the portions separated by the crosspieces 47 can be interpreted as the strength-reduced portion 14, and the non-opening portion between the strength-reduced portions 14 in the embodiment 2 can be interpreted as the crosspiece 47. Furthermore, the crosspieces 47 can be provided in the mask openings 5 for the purpose of improving the strength of the frame body 3 (lattice frame 13) and adjusting the strength around the strength-reduced portion 14 of the frame body 3 (outer frame 12). In this case, the position and shape of the crosspieces 47 are arbitrary, but it is preferable that they do not overlap with the pattern formation region 7 (vapor deposition through hole 9) of the mask body 2 so as not to hinder vapor deposition.

(Example 4) Figures 11 and 12 show Example 4 of the deposition mask according to the present invention. In this example, the upper frame 15 constituting the frame body 3 is formed narrower than the lower frame 16, so that the mask opening 5 in the upper frame 15 is slightly larger than the same opening 5 in the lower frame 16. The width dimension of the vertical and horizontal frames constituting the lattice frame 13 of the upper frame 15 is set to one-third of the same width dimension of the lower frame 16, and when the upper frame 15 and the lower frame 16 are bonded together with the adhesive layer 17, the width dimension W1 of the vertical and horizontal frames of the upper frame 15 is equal to the width dimension W2 of the top surface of the lower frame 16 on both sides of the upper frame 15.

In the deposition process for forming a deposition layer on a substrate (deposition target) B, as shown in FIG. 12, the deposition mask 1 is placed upside down and in close contact with the lower surface of the substrate B, and the deposition material rising from below is passed through according to the deposition pattern (deposition through holes 9). In this embodiment, if the mask opening 5 of the upper frame 15 is made slightly larger than the opening 5 of the lower frame 16, when the deposition mask 1 is turned over so that the upper frame 15 is on the lower side in the deposition process, the upper frame 15 is prevented from becoming an obstacle to the rising deposition material by the amount of the narrowing of both sides. In addition, when the above-mentioned four-layer structure (a four-layer structure in which two frames 3 each having an upper frame 15 and a lower frame 16 are laminated together) is adopted, in order to obtain the same effect as in this embodiment, it is preferable to form the upper frame 15 and the lower frame 16 constituting one frame 3 thinner than the upper frame 15 and the lower frame 16 constituting the other frame 3, and to laminate the narrower frame 3 on top of the wider frame 3.

(Example 5) Figure 13 shows Example 5 of the deposition mask according to the present invention. In this example, the entire surface of the blocking body 19 is covered with a metal layer 4. An adhesion plating layer 34 is formed on the entire joint surface between the metal layer 4 and the blocking body 19. When the metal layer 4 is formed on the entire surface of the blocking body 19, the strength around the strength-reduced portion 14 increases, and this can be used to adjust the strength of that portion.

REFERENCE SIGNS LIST 1 deposition mask 2 mask body 3 frame 4 metal layer 5 mask opening 7 pattern formation area 8 bonding area 9 deposition through hole 10 bonding through hole 19 blocking body 21 bonding area 34 adhesion plating layer

Claims (3)

A deposition mask comprising: a mask body (2) in which a deposition pattern consisting of a large number of independent deposition through-holes (9) is formed; a frame body (3) having a mask opening (5) in which the mask body (2) is placed; and a metal layer (4) integrally joining the mask body (2) and the frame body (3),
The mask body (2) includes a pattern forming region (7) where a deposition pattern is formed, and a bonding region (8) where the metal layer (4) is bonded and formed,
an adhesion plating layer (34) is formed so as to cover the upper surface and the outer peripheral surface of the mask body (2) in the bonding region (8), and the metal layer (4) is formed on the adhesion plating layer (34);
The adhesion plating layer (34) is formed continuously on the surface of the metal layer (4) facing the deposition pattern ,
A cutout hole is provided in the frame body (3), and a blocking body (19) is disposed in the cutout hole;
The closure (19) has a bonding region (21) where the metal layer (4) is bonded,
A deposition mask characterized in that an adhesion plating layer (34) is formed on an upper surface of the blocking body (19) at least in the bonding region (21), and the metal layer (4) is formed on the adhesion plating layer (34) . The deposition mask according to claim 1, characterized in that a joining through hole (10) is formed in the joining region (8), the adhesion plating layer (34) is formed on the inner peripheral surface of the joining through hole (10), and the metal layer (4) is formed on the adhesion plating layer (34). The deposition mask according to claim 1 or 2, characterized in that the mask body (2) is formed in a rectangular shape with rounded corners.