JP7467367B2 - パネル収納容器 - Google Patents
パネル収納容器 Download PDFInfo
- Publication number
- JP7467367B2 JP7467367B2 JP2021025297A JP2021025297A JP7467367B2 JP 7467367 B2 JP7467367 B2 JP 7467367B2 JP 2021025297 A JP2021025297 A JP 2021025297A JP 2021025297 A JP2021025297 A JP 2021025297A JP 7467367 B2 JP7467367 B2 JP 7467367B2
- Authority
- JP
- Japan
- Prior art keywords
- flange
- peripheral surface
- protective member
- lid body
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003860 storage Methods 0.000 title claims description 77
- 230000002093 peripheral effect Effects 0.000 claims description 117
- 239000000463 material Substances 0.000 claims description 97
- 230000001681 protective effect Effects 0.000 claims description 86
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000007769 metal material Substances 0.000 claims description 17
- 238000003780 insertion Methods 0.000 description 41
- 230000037431 insertion Effects 0.000 description 41
- 239000000758 substrate Substances 0.000 description 34
- 230000007246 mechanism Effects 0.000 description 19
- 125000006850 spacer group Chemical group 0.000 description 15
- 238000013459 approach Methods 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- PQJZHMCWDKOPQG-UHFFFAOYSA-N 2-anilino-2-oxoacetic acid Chemical compound OC(=O)C(=O)NC1=CC=CC=C1 PQJZHMCWDKOPQG-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Rigid Containers With Two Or More Constituent Elements (AREA)
- Closures For Containers (AREA)
- Packages (AREA)
Description
Claims (6)
- 開口を画定するフランジを有し、複数のパネルを収納するための容器本体と、
前記開口を閉塞するための蓋体と、
前記フランジの内周面に設けられた保護部材と、
を備え、
前記保護部材は、
前記蓋体が前記開口を閉塞している状態で前記蓋体の外周面と向かい合う当接面を有し、前記フランジの前記内周面に沿った円板形状の受け部と、
前記受け部の、前記当接面とは反対側の面に設けられ、前記当接面と反対方向に延びるとともに前記フランジの前記内周面に設けられた取付穴に嵌合された軸部と、
を備え、
前記受け部は、前記蓋体が前記開口を閉塞している状態で前記フランジの前記内周面から前記蓋体の前記外周面に向けて突出している、パネル収納容器。 - 前記保護部材は、前記フランジに着脱可能に設けられている、請求項1に記載のパネル収納容器。
- 開口を画定するフランジを有し、複数のパネルを収納するための容器本体と、
前記開口を閉塞するための蓋体と、
前記蓋体の外周面に設けられた保護部材と、
を備え、
前記保護部材は、
前記蓋体が前記開口を閉塞している状態で前記フランジの内周面と向かい合う当接面を有し、前記蓋体の前記外周面に沿った円板形状の受け部と、
前記受け部の、前記当接面とは反対側の面に設けられ、前記当接面と反対方向に延びるとともに前記蓋体の前記外周面に設けられた取付穴に嵌合された軸部と、
を備え、
前記受け部は、前記蓋体が前記開口を閉塞している状態で前記蓋体の前記外周面から前記フランジの前記内周面に向けて突出している、パネル収納容器。 - 前記保護部材は、前記蓋体に着脱可能に設けられている、請求項3に記載のパネル収納容器。
- 前記フランジは、矩形状の枠体であり、
前記保護部材は、第1保護部材と、第2保護部材と、を含み、
前記第1保護部材及び前記第2保護部材は、前記枠体の一辺を成す枠部の両端における前記内周面と前記外周面との間に設けられる、請求項1~請求項4のいずれか一項に記載のパネル収納容器。 - 前記蓋体は、前記外周面を含む蓋本体を備え、
前記蓋本体は、金属材料で構成されており、
前記フランジは、樹脂材料で構成されている、請求項1~請求項5のいずれか一項に記載のパネル収納容器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021025297A JP7467367B2 (ja) | 2021-02-19 | 2021-02-19 | パネル収納容器 |
PCT/JP2021/033748 WO2022176244A1 (ja) | 2021-02-19 | 2021-09-14 | パネル収納容器 |
CN202180083606.4A CN116601087A (zh) | 2021-02-19 | 2021-09-14 | 面板收纳容器 |
KR1020237030263A KR20230147647A (ko) | 2021-02-19 | 2021-09-14 | 패널 수납 용기 |
TW110136776A TW202245094A (zh) | 2021-02-19 | 2021-10-01 | 面板收納容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021025297A JP7467367B2 (ja) | 2021-02-19 | 2021-02-19 | パネル収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022127251A JP2022127251A (ja) | 2022-08-31 |
JP7467367B2 true JP7467367B2 (ja) | 2024-04-15 |
Family
ID=82931318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021025297A Active JP7467367B2 (ja) | 2021-02-19 | 2021-02-19 | パネル収納容器 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7467367B2 (ja) |
KR (1) | KR20230147647A (ja) |
CN (1) | CN116601087A (ja) |
TW (1) | TW202245094A (ja) |
WO (1) | WO2022176244A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024111256A1 (ja) * | 2022-11-25 | 2024-05-30 | 信越ポリマー株式会社 | パネル収納容器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020005369A1 (en) | 1999-01-06 | 2002-01-17 | Nyseth David L. | Door guide for a wafer container |
JP2004186293A (ja) | 2002-12-02 | 2004-07-02 | Miraial Kk | 薄板収納容器 |
JP2014022434A (ja) | 2012-07-13 | 2014-02-03 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2014116490A (ja) | 2012-12-11 | 2014-06-26 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2018120993A (ja) | 2017-01-26 | 2018-08-02 | 信越ポリマー株式会社 | 基板収納容器及びその管理方法 |
JP2019031297A (ja) | 2017-08-07 | 2019-02-28 | 信越ポリマー株式会社 | パネル収納容器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8813990B1 (en) * | 2012-06-26 | 2014-08-26 | Metal Solutions Design & Fabrication, LLC | Container for transporting hazardous material |
JP6396257B2 (ja) * | 2015-06-04 | 2018-09-26 | 信越ポリマー株式会社 | 基板収納容器 |
JP7263673B2 (ja) | 2018-01-12 | 2023-04-25 | 信越ポリマー株式会社 | パネル収納容器 |
-
2021
- 2021-02-19 JP JP2021025297A patent/JP7467367B2/ja active Active
- 2021-09-14 CN CN202180083606.4A patent/CN116601087A/zh active Pending
- 2021-09-14 WO PCT/JP2021/033748 patent/WO2022176244A1/ja active Application Filing
- 2021-09-14 KR KR1020237030263A patent/KR20230147647A/ko unknown
- 2021-10-01 TW TW110136776A patent/TW202245094A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020005369A1 (en) | 1999-01-06 | 2002-01-17 | Nyseth David L. | Door guide for a wafer container |
JP2004186293A (ja) | 2002-12-02 | 2004-07-02 | Miraial Kk | 薄板収納容器 |
JP2014022434A (ja) | 2012-07-13 | 2014-02-03 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2014116490A (ja) | 2012-12-11 | 2014-06-26 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2018120993A (ja) | 2017-01-26 | 2018-08-02 | 信越ポリマー株式会社 | 基板収納容器及びその管理方法 |
JP2019031297A (ja) | 2017-08-07 | 2019-02-28 | 信越ポリマー株式会社 | パネル収納容器 |
Also Published As
Publication number | Publication date |
---|---|
CN116601087A (zh) | 2023-08-15 |
WO2022176244A1 (ja) | 2022-08-25 |
TW202245094A (zh) | 2022-11-16 |
KR20230147647A (ko) | 2023-10-23 |
JP2022127251A (ja) | 2022-08-31 |
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