JP7339753B2 - Wafer mounting structure, wafer mounting apparatus and base structure using wafer mounting structure - Google Patents

Description

The present disclosure relates to a wafer mounting structure, a wafer mounting apparatus using the wafer mounting structure, and an end substrate structure.

For example, in a semiconductor manufacturing apparatus for manufacturing semiconductors, a wafer mounting structure for mounting a wafer is used. As a wafer mounting structure, for example, Patent Document 1 (wafer support member) and Patent Document 2 (electrode built-in body) are known.

Japanese Patent Application Laid-Open No. 2003-224181 JP-A-2002-141404

A wafer mounting structure capable of reducing the load on the base, a wafer mounting apparatus using the wafer mounting structure, and a base structure capable of reducing the load on the base are provided. I am waiting.

A wafer mounting structure according to an aspect of the present disclosure has an insulating base, a conductor positioned within the base, and a first end and a second end, and from the first end to the second end. a terminal having a length extending from the base, the first end being positioned within the base and electrically connected to the conductor, and the second end being positioned outside the base; The terminal has a recess extending from the first end toward the second end, and the bottom of the recess includes a portion located outside the base.

A wafer mounting apparatus according to an aspect of the present disclosure includes the wafer mounting structure described above, a power supply unit capable of supplying power to the conductor, and a control unit controlling power supply to the power supply unit. are doing.

A base structure according to one aspect of the present disclosure has an insulating base, a conductor positioned within the base, a first end and a second end, and a terminal having a length, the first end positioned within the base and electrically connected to the conductor, and the second end positioned outside the base, the terminal has a recess extending from the first end toward the second end, and the bottom of the recess includes a portion located outside the base.

According to the above configuration, it is possible to reduce the load on the base due to the terminals.

1 is a schematic perspective view of a wafer mounting device according to a first embodiment; FIG. 2 is a cross-sectional view of the wafer mounting device shown in FIG. 1 taken along the line II-II. FIG. 3 is an enlarged view of III shown in FIG. 2; FIG. FIG. 3 is a diagram for explaining a load applied to the substrate shown in FIG. 2; It is a sectional view around a terminal of a wafer mounting structure in a 2nd embodiment and a 3rd embodiment. It is a cross-sectional view around the terminal of the wafer mounting structure in the fourth embodiment and the fifth embodiment. FIG. 14 is a cross-sectional view of the periphery of the terminals of the wafer mounting structure according to the sixth and seventh embodiments; 4 is a view showing a modification of the terminal shown in FIG. 3; FIG.

Embodiments of the present disclosure will be described below with reference to the accompanying drawings. In the description, the upper and lower sides refer to the upper and lower sides with respect to the state in which the wafer is mounted on the wafer mounting structure. In the figure, Up indicates the upper side and Dn indicates the lower side. It should be noted that the drawings to be referred to are schematic representations, and details may be omitted.

[First embodiment]
Please refer to FIG. The wafer mounting apparatus 10 includes a wafer mounting structure 20 (base structure 20) having an A surface 40a on which a wafer is mounted, a power supply section 11 for supplying power to the wafer mounting structure 20, and the and a control unit 13 that controls the power supply unit 11 .

(Wafer mounting structure)
Please refer to FIG. In FIG. 2, the wafer mounting structure 20 includes a shaft member 30, an insulating base 40 fixed to the upper end of the shaft member 30, a conductor 21 positioned within the base 40, and a conductor 21 and a connection portion 22 having one end connected to the terminal 50 .

(shaft member)
In the example shown in FIG. 2 , the shaft member 30 has a bar shape and its upper end is continuous with the base 40 . The upper end of the shaft member 30 is adhered to the base 40 with an adhesive, for example.

The shaft member 30 has a through hole 31 penetrating vertically in the drawing in the shaft member 30 alone. The through hole 31 is open at the upper end and the lower end in the drawing in the shaft member 30 alone. Note that the terms "upper end" and "lower end" are merely expressions used for convenience in describing the relationship with the drawings. For this reason, even though the terms upper end and lower end are used in the present disclosure, they are not limited to the ends in the vertical direction. That is, the upper end can be replaced with one end (one end) of the shaft member 30 , and the lower end can be replaced with the other end (other end) of the shaft member 30 . The upper and lower ends described in the detailed description below are described with the above meanings.

In the example shown in FIG. 2 , the size of the diameter of the through hole 31 is the same from the top end to the bottom end of the shaft member 30 . In other aspects, the diameter of the through-hole 31 may vary from the upper end to the lower end of the shaft member 30 . The shape of the through hole 31 may be circular in a cross section of the shaft member 30 perpendicular to the direction in which the through hole 31 extends. In other aspects, the shape of the through hole 31 may be oval, triangular, rectangular, or the like. The connection portion 22 passes through the through hole 31 .

The material of the shaft member 30 is, for example, insulating ceramics. In other aspects, the material of shaft member 30 is a conductive material (such as metal).

(substrate)
The substrate 40 is made of an insulating material such as ceramic. The ceramic constituting the substrate 40 is mainly composed of, for example, aluminum nitride (AlN), aluminum oxide (Al2O3, alumina), silicon carbide (SiC), silicon nitride (Si3N4), and the like. The main component here means, for example, a component that occupies 50% by mass or more or 80% by mass or more of 100% by mass of all components constituting the substrate 40 .

In the example shown in FIG. 2, the base 40 is a plate-like substrate having a thickness in the vertical direction. The substrate 40 may have a circular, elliptical, rectangular, or trapezoidal shape in plan view. When the substrate 40 has a circular shape in plan view, the dimensions of the substrate 40 are, for example, a diameter of 20 cm or more and 40 cm or less and a thickness of 5 mm or more and 35 mm or less. However, the substrate 40 is not limited to a flat substrate.

Please refer to FIGS. The substrate 40 has an A surface 40a on which a wafer is placed, a B surface 40b constituting a surface opposite to the A surface 40a, and one end (first end 51) of the terminal 50 on the B surface 40b side. ) is located in the insertion portion 41 .

The A surface 40a constitutes the upper surface of the substrate 40, and an object such as a wafer is placed thereon. The B surface 40 b constitutes the lower surface of the base 40 and is continuous with the shaft member 30 . The insertion portion 41 has an opening 42 on the B surface 40b, and the edge of the opening 42 surrounds the terminal 50. As shown in FIG.

The substrate 40 may have a flow path therein through which a fluid that cools the mounted wafer and/or a fluid that is heated by a resistance heating element, which will be described later, passes. The shape, size, and the like of the channel can be appropriately changed according to the purpose of use of the channel. In other words, the shape and size of the flow path can be determined by various types of fluids, such as gas or liquid, that are flowed according to the purpose of use.

(Insert part)
Please refer to FIG. The insertion portion 41 is a recess (for example, a cylindrical depression) located in the lower portion of the base 40 . A part of the terminal 50 is inserted into the insertion portion 41 . The inner diameter of the insertion portion 41 may be slightly smaller than the outer diameter of the terminal 50 . Note that the spatial shape of the recess that becomes the insertion portion 41 before the terminal 50 is inserted is not limited to a cylindrical shape, and may be a cubic shape or the like. In other words, the spatial shape of the depression that serves as the insertion portion 41 is arbitrary.

The insertion portion 41 has an inner surface portion 41 a extending upward from the opening 42 and a bottom surface portion 41 b that is continuous with the upper end of the inner surface portion 41 a and forms the bottom of the insertion portion 41 .

(conductor)
Please refer to FIG. The conductor 21 may be a resistance heating element that generates heat with power from the power supply section 11 . If the conductor 21 is a resistance heating element, the heat generated by the resistance heating element heats the wafer placed on the A surface 40a. That is, it can be said that the wafer mounting structure 20 is a heater. The conductor 21 may be, for example, a coil or electrode containing a conductor.

The conductor 21 may, for example, spiral from the center of the base 40 toward the outer edge. The conductor 21 may be positioned over the entire area of the base 40 along the A surface 40a. Thereby, the entire A surface 40a can be heated.

(Terminal)
Please refer to FIGS. The terminal 50 is electrically connected to the power supply section 11 via the connection section 22 . The terminal 50 is partially or wholly made of a conductive material. The material forming the terminal 50 can be appropriately set. In one aspect, the material of the terminals 50 can be the same as the material of the conductors 21 and/or the connecting portions 22 . In one aspect, the material of terminal 50 can be different from the material of conductor 21 and/or connecting portion 22 . The material of the terminal 50 is, for example, W, Mo or Pt.

The terminal 50 is, for example, a metal (bulk material) having a certain length in the vertical direction. The terminal 50 has one end located inside the insertion portion 41 and the other end located outside the insertion portion 41 . The outer diameter of the terminal 50 may be the same from one end to the other end, or may be different in places. Furthermore, the outer diameter of the terminal 50 may be different between the upper and lower parts with reference to a collar part 54 to be described later. The terminal 50 may have a circular shape, an elliptical shape, or a rectangular shape in a cross section perpendicular to the direction in which the terminal 50 extends. The shape of the terminal 50 is arbitrary.

Here, only the portion of the terminal 50 located within the base 40 is focused. A portion of the terminal 50 located inside the base 40 has, for example, a cylindrical shape. As another aspect, the portion of the terminal 50 located inside the base 40 may be tapered toward the bottom portion 41b. Here, the tapered shape means a shape in which the outer diameter of the portion of the terminal 50 located inside the base 40 becomes smaller toward the bottom portion 41b. This allows the terminals 50 to be easily inserted into the base 40 (the same applies to the unsintered base before firing). As another aspect, the portion of the terminal 50 located inside the base 40 may be tapered inversely toward the bottom portion 41b. The term "inverted tapered shape" as used herein refers to a shape in which the outer diameter of the portion of the terminal 50 located within the base 40 increases toward the bottom surface portion 41b. As a result, a fixing member Fi, which will be described later, can be easily arranged between the inner surface portion 41a and the first outer wall 53a (the same applies to the unsintered substrate before firing). Thus, the shape of the portion of the terminal 50 located within the base 40 is also arbitrary.

At least a portion of terminal 50 is located within base 40 . As one aspect, a portion of the terminal 50 is fixed within the insertion portion 41 via a fixing member Fi (for example, brazing material or the like). As one aspect, a portion of the terminal 50 is fitted into the insertion portion 41 and positioned within the base 40 . As one aspect, a portion of the terminal 50 is embedded in the insertion portion 41 and positioned within the base 40 . In addition, there is also a mode in which a part of the terminal 50 is embedded in the insertion portion 41 and fixed by a fixing member Fi. With these, the terminal 50 is held by the base 40 . The terminal 50 is electrically connected to the conductor 21 located inside the base 40 .

A portion of the terminal 50 is positioned within the through hole 31 and surrounded by the inner surface of the shaft member 30 . As a result, the terminal 50 is less likely to be directly exposed to the outside air.

The terminal 50 has a first end 51 forming one end (the upper end in the drawing) of the terminal 50, a second end 52 forming the other end opposite to the first end 51 (the lower end in the drawing), an outer wall 53 connecting the first end 51 and the second end 52; and a concave portion 55 recessed toward the side. Terminal 50 has a length extending from first end 51 to second end 52 .

The first end 51 is located within the base 40 . The first end 51 faces (faces) the bottom surface portion 41b.

In the example shown in FIG. 3, there may be a gap 40c between the bottom surface portion 41b and the first end 51. As shown in FIG. The space 40c may be in a vacuum state or may be filled with an inert gas. The space between the bottom surface portion 41b and the first end 51 may be filled with a material such as the fixing member Fi without having the space 40c.

The second end 52 is positioned outside the base 40 .

The outer wall 53 has a first outer wall 53 a located inside the insertion portion 41 (base body 40 ) and a second outer wall 53 b continuous with the first outer wall 53 a and located outside the insertion portion 41 . The outer wall 53 constitutes a surface of the terminal 50 in the circumferential direction.

The first outer wall 53a is adhered to the inner surface portion 41a via a fixing member Fi, for example. The terminal 50 is thereby held by the base 40 . The fixing member Fi is an adhesive material made of a conductive organic or inorganic material. The terminal 50 is electrically connected to the conductor 21 because the fixing member Fi is conductive. The fixing member Fi is, for example, brazing material. The fixing member Fi may be positioned over the entire circumference of the first outer wall 53a, or may be positioned only partially. Further, without using the fixing member Fi, a part of the terminal 50 is fitted into the insertion part 41 or a part of the terminal 50 is embedded in the insertion part 41, so that the first outer wall 53a is brought into close contact with the inner surface part 41a. You can also let

(Flange)
The flange portion 54 protrudes outward from the second outer wall 53b. That is, it can be said that the flange portion 54 protrudes outside the base 40 in a direction crossing the first direction Li from the first end 51 to the second end 52 . As one aspect, the flange portion 54 protrudes in a direction perpendicular to the second outer wall 53b (first direction Li). The flange portion 54 may be in contact with the fixing member Fi, may be in contact with the surface B 40b without the fixing member Fi interposed therebetween, or may not be in contact with the fixing member Fi. Furthermore, the flange portion 54 may be positioned away from the fixing member Fi or the B surface 40b. The position of the collar portion 54 is arbitrary.

In the example shown in FIG. 3, the collar portion 54 has a first surface 54a facing the B surface 40b of the base 40, a second surface 54b located on the opposite side of the first surface 54a, these first surfaces 54a and and a third surface 54c connecting the second surfaces 54b.

The first surface 54a may be parallel to the B surface 40b. The first surface 54a may be positioned farther from the base 40 than the B surface 40b. Alternatively, the first surface 54a may be inclined at a predetermined angle with respect to the B surface 40b.

The first surface 54a may be adhered to the B surface 40b via the fixing member Fi. Alternatively, the first surface 54a may not be adhered to the B surface 40b.

The second surface 54b is located farther from the base 40 than the first surface 54a. The second surface 54b may be parallel to the first surface 54a. However, the second surface 54b may be inclined by a predetermined angle with respect to the first surface 54a.

(recess)
In the example shown in FIG. 3 , the recess 55 is a cavity formed from the first end 51 toward the second end 52 of the terminal 50 . When the recess 55 is hollow, it may be in a vacuum or may be filled with an inert gas. The recess 55 may be filled with another material (for example, a material having a composition different from that of the fixing member Fi or the terminal 50). A material having a composition different from that of the terminal 50 is a material that is less likely to apply a load to the base 40 even when thermally expanded, compared to the material that constitutes the terminal 50 itself. A material different in composition from the terminal 50 has a different linear expansion coefficient and/or Young's modulus from the material forming the terminal 50 .

The recess 55 has an inner wall 55a extending from the first end 51 toward the second end 52 of the terminal 50, and a bottom 55b continuous with the inner wall 55a and forming the bottom of the recess 55. As shown in FIG.

(inner wall)
The inner wall 55a is a part of the elements forming the recess 55 that extends from the first end 51 toward the bottom 55b. An upper portion of the inner wall 55a is continuous with the first end 51, and a lower portion of the inner wall 55a is continuous with the bottom portion 55b. In the example shown in FIG. 3, the inner wall 55a is parallel to the first outer wall 53a and the second outer wall 53b (outer wall 53). That is, the inner wall 55a is perpendicular to the B surface 40b. The inner wall 55a is entirely positioned within the base 40 (insertion portion 41).

The shape of the concave portion 55 in plan view may be circular, elliptical, rectangular, or the like. The inner diameter of the inner wall 55a may be, for example, 1/4 the outer diameter of the outer wall 53, 1/2 the outer diameter of the outer wall 53, or the outer diameter of the outer wall 53. It may be as large as 3/4 of the diameter. The inner wall 55a may or may not have the same inner diameter from the upper portion to the lower portion. The shape of the recess 55 is arbitrary.

(bottom)
The bottom portion 55 b is a portion of the elements forming the recess 55 that is located on the second end 52 side and faces the first end 51 side. In the example shown in FIG. 3, the bottom portion 55b is inclined toward the second end 52 from the peripheral edge of the bottom portion 55b toward the center. A portion of the bottom portion 55b is located outside the base 40 and the remaining portion of the bottom portion 55b is located within the base 40 . In other words, it can be said that the bottom portion 55b includes a portion located outside the base 40 . At least a portion of the bottom portion 55b may have a curved surface. More specifically, the bottom portion 55b may have a conical shape that slopes toward the second end 52 from the periphery toward the center. The inclination angle of the bottom portion 55b is arbitrary.

(connection part)
Please refer to FIG. The connection portion 22 has an upper end connected to the terminal 50 and a lower end connected to the power supply portion 11 . The connection portion 22 electrically connects the power supply portion 11 and the terminal 50 . The connecting portion 22 contains a conductive material.

(power supply unit)
The power supply unit 11 is positioned outside the base 40 and supplies power to the conductor 21 (for example, a resistance heating element) via the connection unit 22 . The power supply section 11 is electrically connected to the conductor 21 via the connection section 22 . The power supply unit 11 includes a power supply circuit that converts the power supplied from the power supply into an appropriate voltage and supplies the voltage to the conductor 21 .

(control part)
The control unit 13 controls power supply to the conductor 21 in the power supply unit 11 . For example, the control unit 13 controls the power supply unit 11 to cause the resistance heating element to generate heat. A wafer mounted on the A surface 40a is heated by the heat generated by the resistance heating element.

Next, operation of the first embodiment will be described.

Please refer to FIG. FIG. 4( a ) shows a view in which the entire bottom portion 155 b is located within the base 140 . The terminal 150 expands and contracts in volume as the temperature changes. In the terminal 150 of FIG. 4( a ), the bottom portion 155 b is entirely located within the base 140 . In such a wafer mounting structure 120, with respect to the lower surface 140B of the base 140, the change in volume of the terminals 150 is large on the lower side, and the change of the volume of the terminals 150 is small on the upper side. As a result, a large load is applied to the lower surface 140B of the base 140. FIG.

Please refer to FIG. FIG. 4(b) shows a view including a portion where the bottom portion 55b is positioned outside the base 40. As shown in FIG. Since the bottom portion 55 b includes a portion positioned outside the base 40 , part of the recess 55 is positioned outside the base 40 . As a result, the difference in change in the volume of the terminal 50 between the upper side and the lower side with respect to the lower surface 40B of the base 40 can be reduced. As a result, the load on the substrate 40 is reduced.

Please refer to FIG. The terminal 50 has a recess 55 extending from the first end 51 toward the second end 52 , and the bottom 55 b of the recess 55 includes a portion positioned outside the base 40 . As a result, even when the temperature of the terminal 50 changes, the difference in volume change between the portion inside the base 40 and the portion outside the base 40 in the terminal 50 is reduced. As a result, application of locally strong force to the substrate 40 can be suppressed. That is, the load on the base 40 by the terminal 50 can be reduced.

At least a portion of the bottom portion 55b may be curved. As a result, the cross-sectional area of the terminal 50 gradually increases from the first end 51 toward the second end 52 near the bottom portion 55b. As a result, even if the temperature of the terminal 50C changes, it is possible to suppress local application of a strong force to the base 40 . Thereby, the load on the base 40 by the terminals 50 can be further reduced.

The bottom portion 55 b may have a conical shape with an inner diameter that increases toward the first end 51 . From another point of view, the space corresponding to the bottom portion 55 b may have a conical shape that widens toward the first end 51 . Since the bottom portion 55b (the space corresponding to the bottom portion 55b) is conical, the bottom portion 55b can be easily formed by pressing a rotating body with a sharp tip such as a drill against it. As a result, the production efficiency of the wafer mounting structure 20 can be improved.

Next, a second embodiment of the present disclosure will be described.

[Second embodiment]
Please refer to FIG. FIG. 5(a) is a diagram showing a second embodiment of the present disclosure, and corresponds to FIG. 3 above. A wafer mounting structure 20A in the second embodiment differs from the first embodiment in the arrangement of conductors 21A and the shape of recesses 55A. Other specific structures are common to the wafer mounting structure 20 according to the first embodiment. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

In the example shown in FIG. 5A, the conductor 21A is positioned above the terminal 50A and is in contact with the first end 51. In the example shown in FIG. Although not shown, a fixing member Fi may be interposed between the conductor 21A and the terminal 50A, and the conductor 21A may be in contact with the first end 51 via the fixing member Fi.

55 A of recessed parts are exhibiting substantially cylindrical shape, for example. As another aspect, the concave portion 55A has, for example, a rectangular parallelepiped shape. The bottom surface of the recess 55A has a planar shape. The shape of the recess 55A is arbitrary.

The recess 55A includes a portion located between the B surface 40b and the first surface 54a.

The inner wall 55</b>Aa extends from the first end 51 toward the bottom 55</b>Ab and includes a portion located outside the base 40 . A lower end of the inner wall 55Aa is positioned between the B surface 40b and the first surface 54a.

Although overlapping with the first embodiment, the inner wall 55Aa is parallel to the first outer wall 53a and the second outer wall 53b (outer wall 53). From another point of view, the inner wall 55Aa is perpendicular to the B surface 40b.

The entire bottom portion 55Ab is positioned closer to the second end 52 than the B surface 40b. More specifically, the entire bottom portion 55Ab is positioned outside the base 40 between the B surface 40b and the first surface 54a. The bottom portion 55Ab is perpendicular to the inner wall 55Aa. From another point of view, the bottom portion 55Ab is parallel to the B surface 40b.

The entire bottom portion 55Ab is positioned outside the base 40 . As a result, the portion of the concave portion 55A located outside the base 40 becomes larger than when the entire bottom portion 55Ab is not located outside the base 40 . As a result, even if the temperature of the terminal 50A changes, the difference in volume change between the portion inside the base 40 and the portion outside the base 40 in the terminal 50A becomes smaller. That is, it is possible to further reduce the burden on the base 40 due to the terminals 50A.

The inner wall 55Aa of the recess 55A is parallel to the outer wall of the terminal 50A, and the bottom 55Ab is perpendicular to the inner wall 55Aa. As a result, the portion of the concave portion 55A located outside the base 40 becomes larger. As a result, the load on the substrate 40 can be further reduced.

[Third embodiment]
Please refer to FIG. FIG. 5(b) is a diagram showing a third embodiment of the present disclosure. Similar to the above, the wafer mounting structure 20B in the third embodiment corresponds to FIG. 3 shown above. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

The recess 55B includes a portion located between the first surface 54a and the second surface 54b.

The inner wall 55Ba includes a portion located between the first surface 54a and the second surface 54b.

The entire bottom portion 55Bb is located closer to the second end 52 than the first surface 54a. More specifically, the entire bottom portion 55Bb is positioned outside the base 40 between the first surface 54a and the second surface 54b. The bottom portion 55Bb has a planar shape.

The bottom portion 55Bb includes a portion located farther from the base 40 than the first surface 54a. As a result, the portion of the concave portion 55B located outside the base 40 becomes even larger. As a result, the load on the base 40 due to the terminal 50B can be further reduced.

In addition, for example, the bottom portion 55Bb can be formed using the first surface 54a forming the flange portion 54 as a mark. Thereby, the production efficiency of the wafer mounting structure 20B can be improved.

[Fourth embodiment]
Please refer to FIG. FIG. 6(a) is a diagram showing a fourth embodiment of the present disclosure. Similarly to the above, the wafer mounting structure 20C in the fourth embodiment corresponds to FIG. 3 shown above. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

The inner wall 55Ca includes a portion located between the B surface 40b and the first surface 54a. Alternatively, the inner wall 55Ca may include a portion located between the first surface 54a and the second surface 54b, or may include a portion located closer to the second end 52 than the second surface 54b. You can stay. That is, the length of the inner wall 55Ca is arbitrary.

The bottom portion 55Cb includes a portion that is farther from the base 40 than the second surface 54b. The peripheral edge of the bottom portion 55Cb may be positioned between the B surface 40b and the first surface 54a, may be positioned between the first surface 54a and the second surface 54b, or may be positioned between the first surface 54a and the second surface 54b. It may be positioned further from the base 40 than the second surface 54b.

At least part of the bottom portion 55Cb has a curved surface. For example, the bottom portion 55Cb has a hemispherical shape that slopes toward the second end 52 .

In the first embodiment, the bottom portion 55b is a portion of the elements forming the recess 55 that is located on the second end 52 side and faces the first end 51 side. However, in this embodiment, the boundary between the inner wall 55Ca and the bottom 55Cb may become unclear. In such a case, in the direction from the first end 51 to the second end 52, the first portion where the inner diameter of the concave portion 55C gradually decreases may be the peripheral edge of the bottom portion 55Cb (the starting portion of the bottom portion 55Cb). can.

The collar portion 54 further has a second surface 54b located on the opposite side of the first surface 54a, and the bottom portion 55Cb includes a portion located farther from the base 40 than the second surface 54b. This makes it easier for the first end 51 side of the terminal 50C to be elastically deformed. As a result, the load on the substrate 40 is reduced.

[Fifth embodiment]
See FIG. 6(b). FIG. 6(b) is a diagram showing a fifth embodiment of the present disclosure. Similar to the above, the wafer mounting structure 20D in the fifth embodiment corresponds to FIG. 3 shown above. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

The inner wall 55Da is inclined by a predetermined angle with respect to a plane along the first outer wall 53a and the second outer wall 53b. From another point of view, the inner wall 55Da is inclined such that the inner diameter of the recess 55D decreases from the first end 51 toward the bottom 55Db. That is, the thickness of the terminal 50D from the first outer wall 53a to the inner wall 55Da gradually increases toward the second end 52 side.

The bottom portion 55Db is inclined such that the inner diameter decreases from the peripheral edge of the bottom portion 55Db toward the center. That is, the bottom portion 55Db has a conical shape with an inner diameter that increases toward the first end 51 . The peripheral edge of the bottom portion 55Db may be provided within the base 40, may be provided between the B surface 40b and the first surface 54a, or may be provided between the first surface 54a and the second surface 54b. may be The position where the peripheral edge of the bottom portion 55Db is provided is arbitrary.

In addition, in this embodiment, each of the inner wall 55Da and the bottom portion 55Db is inclined. Therefore, as in the fourth embodiment, the boundary between the inner wall 55Da and the bottom portion 55Db may become unclear. In such a case, in the direction from the first end 51 to the second end 52, the first portion where the inclination angle of the inner diameter of the recess 55D changes may be the peripheral edge of the bottom portion 55Db (the starting portion of the bottom portion 55Db). can.

Furthermore, in this embodiment, the inclination angles of the inner wall 55Da and the bottom portion 55Db may be the same. Even when the inclination angles of the inner wall 55Da and the bottom portion 55Db are the same, the boundary between the inner wall 55Da and the bottom portion 55Db becomes unclear. In such a case, the recessed portion 55D is considered to be composed only of the bottom portion 55Db. For example, if the recessed portion 55D has a conical shape, it is considered that the recessed portion 55D is composed only of the bottom portion 55Db.

An inner wall 55Da of the recess 55D is inclined such that the inner diameter of the recess 55D decreases from the first end 51 of the terminal 50D toward the bottom 55Db. That is, it can be said that the first end 51 side of the terminal 50D has a shape in which the cross-sectional area gradually increases toward the second end 52 side. Accordingly, it is possible to suppress a large change in the cross-sectional area of the terminal 50D in the vicinity of the bottom portion 55Db. As a result, application of locally strong force to the substrate 40 can be suppressed. That is, the load on the base 40 can be further reduced.

[Sixth embodiment]
Please refer to FIG. FIG. 7(a) is a diagram showing a sixth embodiment of the present disclosure. Similar to the above, the wafer mounting structure 20E in the sixth embodiment corresponds to FIG. 3 shown above. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

The inner wall 55Ea includes a portion farther from the base 40 than the second surface 54b. Furthermore, the inner wall 55Ea is parallel to the B surface 40b. As a result, the first end 51 side of the terminal 50E is more easily elastically deformed.

[Seventh embodiment]
Refer to FIG. 7(b). FIG. 7(b) is a diagram showing a seventh embodiment of the present disclosure. As above, the wafer mounting structure 20F in the seventh embodiment corresponds to FIG. 3 shown above. For parts common to the first embodiment, reference numerals are used and detailed explanations are omitted.

A peripheral edge of the bottom portion 55Fb is located near the first surface 54a. A portion of the bottom portion 55Fb that is closest to the second end 52 is located between the first surface 54a and the second surface 54b.

Next, a modification of the terminal according to the present disclosure will be described.

Please refer to FIG. FIG. 8 is a diagram showing a modification of the terminal 50 according to Embodiment 1 of the present disclosure. A terminal 50G in the modified example differs from the first embodiment in that it has a terminal hole portion 56G on the second end 52 side. Other basic configurations are the same as those of the first embodiment. Reference numerals are used for parts common to the first embodiment, and detailed description thereof is omitted.

The terminal 50G has a terminal hole portion 56G extending from the second end 52 toward the first end 51 side. A conductive member Co is screwed into the terminal hole portion 56G. For example, the connection portion 22 (see FIG. 2) can be connected to the conductive member Co. This facilitates connection of the connecting portion 22 to the terminal 50G.

The size of the terminal hole portion 56</b>G may be the same as that of the recess 55 , larger than the recess 55 , or smaller than the recess 55 .

The size of the terminal hole portion 56</b>G may be the same as that of the recess 55 , larger than the recess 55 , or smaller than the recess 55 .

The wafer mounting apparatuses 10 to 10F include the above-described wafer mounting structures 20 to 20F, a power supply section 11 capable of supplying power to the conductors 21 and 21A, and a control section 13 for controlling the power supply of the power supply section 11. ,have. Accordingly, it is possible to provide the wafer mounting apparatuses 10 to 10F in which the load on the base 40 is reduced.

In addition, in the first embodiment, a mode in which the base is fixed to the shaft member by a fixing member or the like has been described. However, when both the base and the shaft member are made of ceramic, the base and the shaft member can be integrally formed by firing.

Furthermore, in the first embodiment, the case where the conductor is a resistance heating element has been described. However, the conductor may be an electrostatic chuck that attracts the wafer to the A surface. The electrostatic chuck generates a Coulomb force between itself and the wafer by means of power supplied from the power supply unit, thereby attracting the wafer to the A surface. Furthermore, the conductor may be a high-frequency electrode used when generating plasma. In other words, the conductor is arbitrary.

As a method of positioning the terminals in the base, the terminals are inserted into the base before firing (base before sintering), and the base before firing is fired, so that the terminals are positioned inside the base (base after sintering). There is a way to position some of the terminals. As another method, there is also a method of inserting terminals into the substrate (insertion portion) after sintering. Any method may be used to position a portion of the terminal within the base.

Also, in the first embodiment, an example in which the terminals are arranged on the bottom surface of the base has been described. However, the terminals may be arranged on the top surface of the substrate or may be arranged on the side surfaces of the substrate. That is, the positions where the terminals are arranged are arbitrary.

Furthermore, the collar portion in the present disclosure is not an essential component. Therefore, it is possible to eliminate the collar portion.

Further, in the first embodiment, the example in which the B plane is formed parallel to the A plane has been described. However, the B plane does not necessarily have to be parallel to the A plane. Furthermore, the B surface may have depressions (unevenness) in places. In some cases, depressions may be formed in some places, and the depressions may surround portions of the terminals located outside the base. In this case, the portion of the terminal positioned outside the base means a portion provided with a predetermined space between the terminal and the surface forming the base.

Furthermore, in the fifth embodiment, the inner wall and/or the bottom are slanted so that the inner diameter of the recess decreases from the first end to the second end. However, the inner wall or bottom may be slanted such that the inner diameter of the recess increases from the first end to the second end. Also, the inner wall and/or the bottom may be slanted at a predetermined angle with respect to the first direction from the first end to the second end.

In addition, again, the portion of the bottom portion closest to the second end may be positioned between the B surface and the first surface, or may be positioned between the first surface and the second surface. or may be located further from the substrate than the second surface. The peripheral edge of the bottom (the portion on the first end side) may be positioned anywhere from the first end to the bottom.

Furthermore, the wafer mounting structure (substrate structure) in the present disclosure can mount objects other than wafers.

Further, the wafer mounted on the wafer mounting structure according to the present disclosure is not limited to a semiconductor, and may be a crystal wafer.

That is, the present disclosure is not limited as long as the actions and effects of the present disclosure are achieved.

DESCRIPTION OF SYMBOLS 10-10G... Wafer mounting apparatus 11... Power supply part 13... Control part 20-20G... Wafer mounting structure 21, 21A... Conductor 40... Base 50-50G... Terminal 51... First end 52... Second end 53 Outer wall 54 Flange 55 to 55F Recess 55a to 55Fa Inner wall 55b to 55Fb Bottom Li First direction

Claims (11)

an insulating substrate;
a conductor located within the substrate;
a terminal having a first end and a second end and an outer wall positioned between the first end and the second end and having a length extending from the first end to the second end;
a conductive fixing member,
the terminal has the first end positioned inside the base and the second end positioned outside the base;
the fixing member is in contact with at least part of the outer wall of the terminal;
The terminal is electrically connected to the conductor via the fixing member,
the terminal has a recess extending from the first end toward the second end;
The recess has an inner wall, a bottom, and a space surrounded by the inner wall and the bottom,
The bottom portion is located closer to the second end than the inner wall,
at least a part of the inner wall is positioned closer to the second end than the base and the fixing member;
The wafer mounting structure, wherein the bottom portion includes a portion positioned closer to the second end than the base and the fixing member. 2. The wafer mounting structure according to claim 1, wherein the entirety of said bottom portion is positioned outside said base. the terminal has a flange protruding outside the base in a direction crossing a first direction from the first end to the second end;
The collar has a first surface facing the base,
3. The wafer mounting structure according to claim 1, wherein said bottom portion includes a portion located farther from said substrate than said first surface. The collar further has a second surface located on the opposite side of the first surface,
4. The wafer mounting structure according to claim 3 , wherein said bottom portion includes a portion located farther from said base than said second surface. 5. The wafer mounting structure according to any one of claims 1 to 4, wherein at least part of said bottom is curved. The wafer mounting structure according to any one of claims 1 to 5, wherein the bottom portion has a conical shape whose inner diameter increases toward the first end. an inner wall of the recess is parallel to an outer wall of the terminal;
A wafer mounting structure according to any one of claims 1 to 4, wherein said bottom is perpendicular to said inner wall. The wafer mounting structure according to any one of claims 1 to 6, wherein the inner wall of the recess is inclined so that the inner diameter of the recess decreases from the first end of the terminal toward the bottom. body. 9. The wafer mounting structure according to claim 1, wherein said conductor is a heater including a resistance heating element. a wafer mounting structure according to any one of claims 1 to 9;
a power supply unit capable of supplying power to the conductor;
a control unit that controls power supply from the power supply unit;
A wafer placement device. an insulating substrate;
a conductor located within the substrate;
a terminal having a first end and a second end and an outer wall positioned between the first end and the second end and having a length extending from the first end to the second end;
a conductive fixing member,
the terminal has the first end positioned inside the base and the second end positioned outside the base;
the fixing member is in contact with at least part of the outer wall of the terminal;
The terminal is electrically connected to the conductor via the fixing member,
the terminal has a recess extending from the first end toward the second end;
The recess has an inner wall, a bottom, and a space surrounded by the inner wall and the bottom,
The bottom portion is located closer to the second end than the inner wall,
at least a part of the inner wall is positioned closer to the second end than the base and the fixing member;
The base structure, wherein the bottom portion includes a portion positioned closer to the second end than the base and the fixing member.

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