JP7325532B2 - 3D object manufacturing method and 3D object manufacturing device by layered manufacturing method - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to technology for manufacturing metal wiring on a resin layer using an additive manufacturing method.

Conventionally, techniques have been developed for forming a resin layer using an additive manufacturing method. For example, in the manufacturing method of Patent Document 1 below, droplets of an ultraviolet curable resin are ejected from an inkjet head onto a modeling plate, and the ejected droplets are irradiated with ultraviolet rays to be cured to form a resin layer. In the manufacturing method of Patent Literature 1, the liquid droplets are irradiated with a laser beam before the ultraviolet curable resin is cured to increase fluidity and flatten the surface of the resin layer.

JP 2015-174284 A

By the way, let us consider a case where metal wiring such as bumps for mounting wiring and electronic components are formed on the above-described resin layer by lamination molding. In this case, for example, a metal wiring is formed on the resin layer by discharging a fluid containing metal particles onto the resin layer and baking the discharged fluid containing metal particles with an infrared lamp or the like.

However, when the fluid containing metal particles is fired, heat is also applied to the resin layer under the fluid containing metal particles. The resin layer expands when heated. The expansion of the resin layer applies thermal stress to the metal wiring formed on the resin layer. As a result, there arises a problem that a part of the metal wiring may swell or break.

The present disclosure has been made in view of such circumstances, and when metal wiring is formed on a resin layer by a layered manufacturing method, three-dimensional modeling by a layered manufacturing method that can suppress swelling and cracking of the metal wiring. An object of the present invention is to provide a method for manufacturing an object and a three-dimensional structure manufacturing apparatus.

In order to solve the above problems, the present disclosure provides a resin material applying step of applying a resin material onto a base member, a curing step of curing the resin material applied onto the base member, and the resin material applying step. a resin layer forming step of forming a resin layer on the base member by repeatedly performing the step and the curing step; and applying a fluid containing metal particles onto the resin layer formed by the resin layer forming step. a fluid applying step; a metal wiring forming step of forming a metal wiring by heating the fluid containing the metal particles applied on the resin layer from above while cooling the base member to cure the fluid; and mounting an electronic component. and a mounting step, wherein the resin material is an ultraviolet curable resin having a higher glass transition point than the temperature at which the fluid containing the metal particles is heated, and the fluid containing the metal particles contains fine metal particles as a solvent. a metal ink dispersed therein; and a conductive resin paste in which metal particles having a size larger than that of the metal fine particles in the metal ink are dispersed, wherein the fluid applying step includes applying the metal ink. and applying the conductive resin paste, wherein the metal wiring forming step includes heating the metal ink applied on the resin layer from above while cooling the base member to form the wiring. and forming a connection terminal by heating the conductive resin paste applied on the wiring from above while cooling the base member to harden the paste, and forming the connection terminal in the fluid applying step. After the metal ink is heated from above to form the wiring in the metal wiring forming step, the conductive resin is applied onto the wiring in the fluid applying step. A paste is applied, and in the mounting step, the electronic component is arranged so that the electrodes of the electronic component and the wiring are connected via the conductive resin paste, and in the metal wiring forming step, the conductive Disclosed is a method for manufacturing a three-dimensional structure by lamination molding, in which a flexible resin paste is heated from above and hardened to form the connection terminals .

Further, in order to solve the above problems, the present disclosure includes a base member, a coating device, a curing device, a cooling device, a heating device, a mounting device, and a control device, the control device comprising: a resin material application unit that controls the application device to apply the resin material onto the base member; and a curing unit that controls the curing device to cure the resin material applied onto the base member. a resin layer forming unit that repeatedly controls the resin material applying unit and the curing unit to form a resin layer on the base member; a fluid coating unit for coating a fluid containing metal particles on the layer; and the metal coated on the resin layer by controlling the heating device while cooling the base member by controlling the cooling device. a metal wiring forming unit that heats and hardens a fluid containing particles from above to form a metal wiring , and controls the mounting device to mount an electronic component, and the resin material is the fluid containing the metal particles. is an ultraviolet curable resin having a higher glass transition point than the temperature at which the metal particles are heated, and the fluid containing the metal particles is a metal ink in which metal fine particles are dispersed in a solvent, and the metal fine particles in the metal ink. and a conductive resin paste in which large-sized metal particles are dispersed, and the fluid applying unit applies the metal ink and the conductive resin paste to form the metal wiring. While the base member is cooled, the metal ink applied on the resin layer is heated from above to form wiring by curing, and while the base member is cooled, the metal ink is applied onto the wiring. forming connection terminals by heating the conductive resin paste from above to harden it; in the fluid applying section, the metal ink is applied on the resin layer; and in the metal wiring forming section, After forming the wiring by heating the metal ink from above to harden it, the conductive resin paste is applied on the wiring in the fluid applying section, and the electrodes of the electronic component and the wiring are applied by the mounting device. The electronic component is arranged so that the is connected through the conductive resin paste, and the conductive resin paste is heated from above in the metal wiring forming portion to form the connection terminal. , discloses a three-dimensional structure manufacturing apparatus. Note that application in the present disclosure does not only mean applying a fluid containing an ultraviolet curable resin or metal particles with a pin or the like, but also includes the concept of ejecting an ultraviolet curable resin or the like from a nozzle or the like.

According to the method for manufacturing a three-dimensional modeled object and the apparatus for manufacturing a three-dimensional modeled object by the layered manufacturing method of the present disclosure, a resin layer is formed on a base member using a resin material, and a fluid containing metal particles is applied onto the resin layer. apply. Then, while cooling the base member, the fluid containing the metal particles is heated and hardened to form the metal wiring. As a result, even if the heat for heating the fluid containing the metal particles is transmitted to the resin layer under the fluid containing the metal particles, the temperature rise of the resin layer can be suppressed by cooling the base member. Expansion of the resin layer due to heating in the metal wiring formation process can be suppressed, and swelling and cracking of the metal wiring can be suppressed.

It is a figure which shows a three-dimensional molded article manufacturing apparatus. It is a block diagram which shows a control apparatus. 4 is a flow chart showing details of a manufacturing process for manufacturing a wiring board; It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically. It is a figure which shows the state of a manufacturing process typically.

(1. Configuration of three-dimensional model manufacturing apparatus)
FIG. 1 shows a three-dimensional structure manufacturing apparatus (hereinafter referred to as "manufacturing apparatus") 10 of one embodiment embodying the three-dimensional structure manufacturing apparatus of the present disclosure. The manufacturing apparatus 10 includes a conveying device 20, a first shaping unit 22, a second shaping unit 24, a third shaping unit 25, a mounting unit 27, and a control device 28 (see FIG. 2). The conveying device 20 , the first shaping unit 22 , the second shaping unit 24 , the third shaping unit 25 and the mounting unit 27 are arranged on the base 29 of the manufacturing device 10 . The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the lateral direction of the base 29 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other. The direction will be referred to as the Z-axis direction for description.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 . The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 . The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor 38 (see FIG. 2), and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction.

The Y-axis slide mechanism 32 also has a Y-axis slide rail 50 and a stage 52 . The Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 in the Y-axis direction is connected to the X-axis slider 36 . As a result, the Y-axis slide rail 50 can move in the X-axis direction as the X-axis slider 36 slides. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see FIG. 2), and by driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .

The stage 52 has a base member 60 , an elevating device 64 and a heating/cooling device 66 . The base member 60 is formed in a flat plate shape, and a release film 130 (see FIG. 4) is attached to the upper surface thereof. The base member 60 is, for example, a metal plate such as iron or stainless steel. The manufacturing apparatus 10 models a three-dimensional modeled object on the release film 130 by the layered manufacturing method.

The elevating device 64 is arranged below the base member 60 and elevates the base member 60 in the Z-axis direction. The heating/cooling device 66 is a device that heats and cools the base member 60 . The heating/cooling device 66 is an example of the cooling device of the present disclosure. The heating/cooling device 66 cools the base member 60 and suppresses expansion of the resin layer 131 (see FIG. 7), for example, when wiring or the like is formed. Further, the heating/cooling device 66 heats the base member 60 to heat the release film 130 and peel the release film 130 from the base member 60 . The heating/cooling device 66 has, for example, a heater (heating wire) provided inside the base member 60 as a device for heating the base member 60 . The heating/cooling device 66 heats the base member 60 by applying an electric current to a heater, for example. The heating/cooling device 66 changes the heating temperature for heating the base member 60 by changing the current value, voltage value, power duty ratio, etc. supplied to the heater. The heating temperature is, for example, 100 degrees or higher. The heating device for heating the base member 60 is not limited to a device using a heater (heating wire). For example, the heating device may be an IH (induction heating) type heating device that heats the metal base member 60 using electromagnetic induction, a heating device using infrared rays, or a heating device using hot water. Alternatively, the heating device may be a heating furnace (atmosphere furnace) including a circulation device for circulating atmosphere gas and a heating element for heating the inside of the furnace.

The heating/cooling device 66 has a liquid cooling device using water as a coolant, for example, as a device for cooling the base member 60 . The heating/cooling device 66 includes a water-cooling pipe provided in the base member 60, a pump device for supplying water to the water-cooling pipe, a constant temperature circulation layer for storing the supplied water, and the like. The heating/cooling device 66 stores, for example, cold water at a constant temperature in a constant temperature circulation tank, and drives a pump device to circulate the cold water in the constant temperature circulation tank in a water cooling pipe. Further, the heating/cooling device 66 can change the cooling temperature for cooling the base member 60 by changing the circulation speed of the cold water and the temperature of the cold water. The cooling device that cools the base member 60 is not limited to the liquid cooling device. For example, the cooling device may be a gas cooling device using gas as a coolant. Further, the cooling device may be, for example, an electric cooling device that cools the base member 60 using a Peltier element, or a blowing cooling device that cools the base member 60 by blowing cold air thereon. Further, the heating/cooling device 66 may have a configuration in which the heating methods and cooling methods described above are combined. Moreover, the manufacturing apparatus 10 may include a heating device and a cooling device separately. For example, the manufacturing apparatus 10 may separately include a heater (heating device) provided inside the base member 60 and a cold air device (cooling device) for applying cold air to the base member 60 from the outside.

The first shaping unit 22 is a unit that shapes wiring on the base member 60 (separation film 130 to be described later), and has an inkjet head 72 , an infrared lamp device 74 , and a cold air device 75 . The inkjet head 72 is a device that ejects metal ink (an example of fluid containing metal particles) by an inkjet method. This metal ink is, for example, fine particles of nanometer-sized metal (such as silver) dispersed in a solvent. The surface of the metal fine particles is coated with, for example, a dispersant to prevent aggregation in the solvent. The inkjet head 72 ejects metal ink from a plurality of nozzles by, for example, a piezoelectric method using piezoelectric elements. Note that the device for ejecting the metal ink is not limited to the inkjet head 72 having a plurality of nozzles, and may be, for example, a dispenser having one nozzle. Further, the method of applying the metal ink is not limited to the method of ejecting (flying) droplets from a nozzle, dispenser, or the like, but a method of contact application can be employed.

The infrared lamp device 74 is a device that heats the metal ink ejected from the inkjet head 72. For example, the infrared lamp device 74 supplies electric power to a heating element (filament) to heat the metal ink with infrared rays. The infrared lamp device 74 is an example of the heating device of the present disclosure. A metallic ink is one example of a fluid containing metallic particles of the present disclosure. The infrared lamp device 74 heats and bakes the metal ink to harden it and form wiring. The firing of the metal ink here means, for example, by applying energy to evaporate the solvent and decompose the protective film of the metal fine particles, that is, the dispersant, etc., and the metal fine particles contact or fuse. , which is a phenomenon in which the electrical conductivity increases. The metal ink is fired to form metal wiring. Note that the device for heating the metal ink is not limited to the infrared lamp device 74 . For example, the manufacturing apparatus 10 may include, as a device for heating the metal ink, a laser irradiation device for irradiating the metal ink with laser light, an atmosphere furnace, or the like.

The cold air device 75 is a device that cools the resin layer 131 (see FIG. 10) by blowing cold air to the resin layer 131 (see FIG. 10), which will be described later. The cooling air device 75 is, for example, a device that blows cold air by applying air to a heat exchanger using a Peltier element. The cold air device 75 cools the resin layer 131 to suppress expansion of the resin layer 131 when the release film 130 is heated by the heating/cooling device 66, for example. The configuration of the device for cooling the resin layer 131 is not particularly limited. For example, the cooling device may comprise a heat exchanger that exchanges heat with water. Alternatively, the cooling device may be configured to cool the resin layer 131 by blowing indoor air (room temperature air) without a heat exchanger.

The second modeling unit 24 is a unit that models a resin layer 131 (see FIG. 6) made of resin on a base member 60 (separation film 130 to be described later). have. The inkjet head 84 ejects an ultraviolet curable resin by an inkjet method. An ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 84 may eject the ultraviolet curable resin by, for example, a piezo method using a piezoelectric element, or may eject the ultraviolet curable resin by a thermal method in which air bubbles are generated by heating the ultraviolet curable resin and ejected from a plurality of nozzles. Also good. Further, the ejection device for ejecting the ultraviolet curable resin is not limited to the inkjet type device, and may be a device for contact coating of the ultraviolet curable resin. Further, the resin forming the resin layer 131 is not limited to ultraviolet curable resin, and other types of resin such as thermosetting resin can be used.

The curing section 86 has a flattening device 90 (see FIG. 2) and an irradiation device 92 (see FIG. 2). The flattening device 90 flattens the ultraviolet curable resin ejected by the inkjet head 84. For example, the surface of the ultraviolet curable resin is leveled and the surplus resin is scraped off with a roller or a blade to remove the ultraviolet ray. Make the thickness of the cured resin uniform. Further, the irradiation device 92 has a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured, and the resin layer 131 having insulating properties is formed. Note that the layered manufacturing method in the present disclosure is not limited to stereolithography (SL), but also includes selective laser sintering (SLS), fused deposition molding (FDM), and the like. other methods can be adopted.

The third molding unit 25 is a unit for molding, on the base member 60, connection terminals (bumps) for connecting electrodes and wires of electronic components, and has a liquid droplet applying device 100. FIG. The droplet applying device 100 applies, for example, a conductive resin paste (an example of a fluid containing metal particles) onto wiring or the like. The conductive resin paste is, for example, a resin in which micrometer-sized metal particles (such as silver) are dispersed in a resin that hardens when heated. The metal particles are, for example, flake-shaped. As a method of applying the conductive resin paste, a method of ejecting (flying) droplets from a nozzle of a dispenser or the like or a method of contact coating can be adopted.

The conductive resin paste is heated and cured by, for example, the infrared lamp device 74 of the first modeling unit 22 to form connection terminals. At this time, the hardened resin of the conductive resin paste shrinks, and the flake-like metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. A connection terminal formed of a conductive resin paste has a lower conductivity than, for example, a wiring formed of a metal ink as described above, but has a strong adhesion and excellent adhesion due to curing of the resin. The manufacturing apparatus 10 of the present embodiment can form metal wirings suitable for applications such as wirings and connection terminals by selectively using high-conductivity metal inks and high-adhesion conductive resin pastes.

Further, in the manufacturing apparatus 10 of the present embodiment, a release film 130 (see FIG. 4) is attached onto the base member 60 in manufacturing a three-dimensional structure (such as a wiring board). The first shaping unit 22, the second shaping unit 24, and the third shaping unit 25 form, for example, a resin layer 131, wiring 135, and connection terminals 139 (see FIG. 10) on a peeling film 130 to form a wiring board. Additive manufacturing. The peeling film loses its adhesiveness when heated, and is easily peeled off from the base member 60 .

The mounting unit 27 is a unit for mounting electronic components, and has a supply section 110 and a mounting section 112 . The supply unit 110 has, for example, a plurality of tape feeders that feed taped electronic components one by one, and supplies the electronic components at the supply position. Note that the supply unit 110 is not limited to a configuration including a tape feeder, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Moreover, the supply unit 110 may be configured to include both a tape type and a tray type, or other types of supply devices.

The mounting section 112 has a mounting head 116 (see FIG. 2) and a moving device 118 (see FIG. 2). The mounting head 116 has a suction nozzle (not shown) for sucking and holding the electronic component. The suction nozzle is supplied with negative pressure from a positive/negative pressure supply device (not shown), and sucks and holds the electronic component by sucking air. Then, the electronic component is released by supplying a slight positive pressure from the positive/negative pressure supply device. Also, the moving device 118 moves the mounting head 116 between the supply position of the supply unit 110 and the base member 60 . The mounting unit 112 moves the mounting head 116, sucks and holds the electronic component supplied from the supply unit 110 by the suction nozzle of the mounting head 116, and mounts the sucked and held electronic component on the three-dimensional model.

The mounting unit 112 also includes a robot arm 119 (see FIG. 2). The robot arm 119 is a device that, for example, attaches the release film 130 to the base member 60, peels the release film 130, separates the release film 130 from the three-dimensional model, and assembles the three-dimensional model.

Also, as shown in FIG. 2 , the control device 28 includes a controller 120 , a plurality of drive circuits 122 and a storage device 125 . The plurality of drive circuits 122 includes the electromagnetic motors 38 and 56, the lifting device 64, the heating and cooling device 66, the inkjet head 72, the infrared lamp device 74, the cold air device 75, the inkjet head 84, the flattening device 90, the irradiation device 92, The droplet applying device 100 is connected to the mounting unit 27 . The controller 120 comprises a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122 . The storage device 125 includes RAM, ROM, hard disk, etc., and stores a control program 127 for controlling the manufacturing apparatus 10 . The controller 120 can control the operations of the X-axis slide mechanism 30, the first modeling unit 22, and the like by executing the control program 127 by the CPU.

The manufacturing apparatus 10 of the present embodiment has the configuration described above, and by curing the ultraviolet curing resin, the metal ink, and the conductive resin paste, a wiring board having a resin layer, wiring, and connection terminals is laminated as a three-dimensional model. shape. The manufacturing apparatus 10 can form a wiring board having an arbitrary shape by changing the shape of the laminated resin layers or the like. In addition, the manufacturing apparatus 10 mounts the electronic component using the mounting unit 27 during the modeling process. For example, in the control program 127, three-dimensional data of each layer obtained by slicing the completed wiring board (wiring board 141 described later) is set. The controller 120 controls the first modeling unit 22 and the like based on the data of the control program 127 to eject and cure ultraviolet curable resin or the like to form a wiring board to which electronic components are not connected.

Also, the controller 120 detects information such as the layer and position where electronic components are arranged based on the data of the control program 127 . The controller 120 controls the mounting unit 27 based on the detected information to place the electronic component. The controller 120 heats the wiring board on which the electronic components are arranged by the infrared lamp device 74 to harden the conductive resin paste and fix the electronic components to the wiring board, thereby manufacturing the desired wiring board. After that, the controller 120 heats the release film 130 by the heating/cooling device 66 to separate the release film 130 . The controller 120 controls the robot arm 119 of the mounting section 112 to remove the wiring board and the like.

(2. Operation of Manufacturing Apparatus 10)
Next, an example of the operation of the manufacturing apparatus 10 will be described with reference to FIGS. 3 to 10. FIG. FIG. 3 is a flow chart showing details of the manufacturing process for manufacturing the wiring board. For example, when receiving an instruction to start manufacturing, the control device 28 executes a predetermined program in the control program 127 to start the manufacturing process shown in FIG. Also, in the following description, the controller 120 executing the control program 127 to control each device may be simply referred to as "the device". For example, "the controller 120 moves the base member 60" means "the controller 120 executes the control program 127, controls the operation of the transport device 20 via the drive circuit 122, and controls the operation of the transport device 20. "to move the base member 60". Also, the contents of the processing, the order of the processing, etc. shown in FIG. 3 are merely examples, and the definitions are changed according to the three-dimensional structure to be manufactured. Also, in the following description, as an example of a three-dimensional structure, a case of manufacturing a wiring board 141 shown in FIG. 10 will be described.

More specifically, when the manufacturing process of FIG. 3 is started, the controller 120 executes the process from step 11 (hereinafter simply referred to as S), controls the transport device 20, and moves the base member 60 (stage 52). It is moved to the first shaping unit 22, the second shaping unit 24, etc., and the wiring board is shaped.

As shown in FIG. 4 , a release film 130 is attached to the upper surface of the base member 60 . The release film 130 has an adhesive surface on one of two surfaces, and the adhesive surface is attached to the upper surface of the base member 60 . The operation of attaching the release film 130 to the base member 60 may be automatically performed by the controller 120 controlling the robot arm 119 (see FIG. 2), or may be manually performed by a person. Moreover, the upper surface (the surface opposite to the adhesive surface) of the release film 130 is, for example, a non-adhesive surface that does not have adhesive properties. The controller 120 lamination-models the wiring substrate 141 on this non-adhesive surface.

For example, when modeling the resin layer 131 (see FIG. 6), the controller 120 repeatedly executes S11 and S13. In S<b>11 , the controller 120 moves the stage 52 to the second modeling unit 24 , controls the inkjet head 84 , and ejects the ultraviolet curing resin 133 onto the release film 130 .

Next, the controller 120 controls the flattening device 90 of the curing section 86 to appropriately flatten the discharged ultraviolet curable resin 133 (S12). Further, as shown in FIG. 5, the controller 120 controls the irradiation device 92 to irradiate and cure the discharged ultraviolet curing resin 133 with ultraviolet rays (S12). The controller 120 repeatedly executes the processes of S11 and S12 to form the resin layer 131 with a desired thickness (see FIG. 6).

Further, when forming the wiring 135 and the through hole 137 shown in FIG. 8 and the connection terminal 139 shown in FIG. 10, the controller 120 executes S13 and S15. The wiring 135 is a metal wiring formed at each position such as above, inside, and below the resin layer 131 . The through holes 137 are metal wirings that connect the wirings 135 in the stacking direction. The connection terminal 139 is a metal wiring (bump) for connecting the electronic component 143 (see FIG. 10) to the wiring 135, or a metal wiring (external terminal) for connecting the wiring board 141 to an external device. When the electronic component 143 is attached to the connection terminal 139, the controller 120 executes S14 between S13 and S15. A case of mounting the electronic component 143 will be described later.

For example, when forming the wiring 135 or the through hole 137, the controller 120 moves the stage 52 to the first forming unit 22 and controls the inkjet head 72 to deposit the metal ink 145 on the release film 130 or on the resin layer. 131 (S13, see FIG. 6). Next, the controller 120 controls the infrared lamp device 74 to bake the ejected metal ink 145 (S15, see FIG. 7).

Here, as shown in FIG. 7, when the wiring 135 and the through holes 137 are baked, heat is applied to the resin layer 131 under the metal ink 145 when the metal ink 145 is baked. The resin layer 131 expands according to the linear expansion coefficient of the ultraviolet curable resin 133 forming the resin layer 131 when heated. The expansion of the resin layer 131 may swell or crack a part of the wiring 135 and the through hole 137 formed on the resin layer 131 .

Therefore, as shown in FIG. 7, the controller 120 of the present embodiment cools the base member 60 by the heating and cooling device 66 when applying heat to the metal ink 145 by irradiating the infrared rays from the infrared lamp device 74. . The heating/cooling device 66 circulates cold water within the base member 60 to cool the base member 60 under the control of the controller 120 . Thereby, the resin layer 131 can be cooled via the base member 60 and the thermal expansion of the resin layer 131 can be suppressed. As a result, swelling and cracking of the wiring 135 and the through-hole 137 can be suppressed.

The controller 120 appropriately executes S11 to S15, forms the resin layer 131, the wiring 135, etc., and determines whether or not the molding of the wiring substrate 141 is completed (S16). For example, based on the information of the wiring board 141 stored in the control program 127, the controller 120 makes an affirmative determination in S16 (S16: YES) when all modeling is finished. When the controller 120 determines that modeling has not ended (S16: NO), it repeats the processing from S11. The controller 120 appropriately executes the processes of S11 to S15 based on the structure of the wiring board 141 to be shaped, that is, the design data of the control program 127, and shapes the resin layer 131, the wiring 135, the through holes 137, and the like.

Moreover, as described above, the controller 120 executes S13, S14, and S15 when the electronic component 143 needs to be mounted. For example, as shown in FIGS. 8 and 9, after forming a plurality of layers of the resin layer 131 and the wiring 135, the connection terminals 139 are formed on the wiring 135 formed on the upper surface, and the electronic component 143 is attached. When forming the connection terminal 139 , the controller 120 moves the stage 52 to the third forming unit 25 and controls the droplet applying device 100 to apply the conductive resin paste 147 to the wiring 135 as shown in FIG. 8 . It is discharged upward (S13).

Next, the controller 120 moves the stage 52 to the mounting unit 27 and mounts the electronic component 143 (S14). The controller 120 controls the supply section 110 of the mounting unit 27 to supply the electronic component 143 . The controller 120 controls the moving device 118 of the mounting section 112 to move the mounting head 116 to the supply position of the supply section 110 , and the suction nozzle of the mounting head 116 sucks and holds the electronic component 143 . The mounting head 116 is controlled by the controller 120 so that the electrodes 149 of the electronic component 143 and the wiring 135 are connected via the conductive resin paste 147 (see FIG. 8) as shown in FIG. , the electronic component 143 is arranged.

The controller 120 moves the stage 52 to the first modeling unit 22, controls the infrared lamp device 74, and bakes the discharged conductive resin paste 147 (S15). As in the firing of the wiring 135 and the through holes 137 described above, the controller 120 cools the base member 60 by the heating and cooling device 66 when applying heat to the conductive resin paste 147 by irradiating the infrared rays from the infrared lamp device 74. to run. As a result, the resin layer 131 can be cooled via the base member 60, and swelling and cracking of the connection terminals 139 (see FIG. 9) can be suppressed. Although detailed description is omitted, the controller 120 also controls external terminals (not shown) that connect to external devices by manufacturing them in the same manner as the connection terminals 139 that connect to the electronic component 143, thereby suppressing swelling and the like. can be manufactured.

As described above, the controller 120 of this embodiment uses the metal ink 145 in forming the wiring 135 and the through holes 137 . Thereby, a metal wiring with a lower resistance can be formed. Also, the controller 120 uses the conductive resin paste 147 in forming the connection terminals 139 . As a result, in order to fix the electronic component 143 to the wiring 135 and the resin layer 131, by using the conductive resin paste 147 in the portion where the tensile strength is required, it is possible to prevent the electronic component 143 from coming off and the wiring 135 from peeling off. can do.

Also, the linear expansion coefficient of the resin material such as the ultraviolet curable resin 133 changes greatly before and after the glass transition point at which softening starts. In general, the coefficient of linear expansion above the glass transition point rapidly increases compared to the coefficient of linear expansion below the glass transition point. Therefore, as the ultraviolet curable resin 133, for example, it is preferable to employ an ultraviolet curable resin 133 whose glass transition point is higher than the heating temperature for firing, that is, the temperature at which the metal ink 145 and the conductive resin paste 147 are heated. . As a result, the temperature of the resin layer 131 does not exceed the glass transition point due to heating for baking. Expansion of the ultraviolet curable resin due to heating for baking can be suppressed, and swelling and cracking of the metal wiring such as the wiring 135, the through hole 137, and the connection terminal 139 can be suppressed. Incidentally, the glass transition point of the ultraviolet curable resin 133 may be lower than the heating temperature for baking.

Moreover, the heating temperature for heating the metal ink 145 and the conductive resin paste 147 is preferably a temperature that can heat the metal ink 145 and the conductive resin paste 147 until the tensile strength and the electrical resistance value reach desired values. On the other hand, the peeling film 130 attached on the base member 60 loses its adhesive strength due to heating. For this reason, it is preferable that the heating temperature is a temperature that does not reduce the adhesive strength of the release film 130 as much as possible and that is the minimum heating temperature that can bake the metal ink 145 and the conductive resin paste 147 to a desired state.

The controller 120 appropriately executes the processes of S11 to S15 described above based on the control program 127, and executes molding of the resin layer 131, the wiring 135, the through holes 137 and the connection terminals 139, and mounting of the electronic component 143. Thereby, a desired wiring board 141 can be manufactured. In S16, when the controller 120 finishes all modeling and makes an affirmative determination (S16: YES), it heats the release film 130 (S17).

In S<b>17 , the controller 120 moves the stage 52 to the first modeling unit 22 . As shown in FIG. 10 , controller 120 controls heating/cooling device 66 to heat base member 60 . When the release film 130 is heated from the base member 60 , the adhesive strength of the lower surface is reduced and the release film 130 is easily peeled off from the base member 60 . The peeling film 130 is partially or wholly peeled off from the upper surface of the base member 60, for example. This facilitates separation of the base member 60 and the release film 130 .

On the other hand, the resin layer 131 of the wiring board 141 is heated by the heating/cooling device 66 via the release film 130 . The resin layer 131 may expand when heat is applied, similarly to the baking process (S15) described above. Therefore, the controller 120 controls the cooling air device 75 to blow cold air from above the wiring board 141 to the wiring board 141 to cool the resin layer 131 . As a result, while heat is applied to the release film 130 to separate it, the resin layer 131 can be cooled to suppress cracking of the wiring 135 or the like.

If the wiring substrate 141 is warped or the like due to the heating in S17, the manufacturing apparatus 10 may heat the separation film 130 by the heating/cooling device 66 while pressing the wiring substrate 141 . Also, the cool air device 75 may blow cool air from the side of the wiring board 141 instead of from above.

As described above, the controller 120 of the present embodiment ejects the UV curable resin 133 onto the release film 130 attached on the base member 60 in the process of S11. The peeling film 130 loses its adhesion to the base member 60 by being heated. Then, in S<b>17 , the controller 120 heats the release film 130 to make the release film 130 easier to peel off from the base member 60 . According to this, the release film 130 is attached onto the base member 60 and the resin layer 131 is formed on the release film 130 . By heating the release film 130 , the adhesive strength is reduced, and the release film 130 is easily peeled off from the base member 60 . As a result, the shaped wiring board 141 and release film 130 can be easily separated from the base member 60 .

In S17, the controller 120 cools the resin layer 131 from above while heating the base member 60 . Also when the peeling film 130 is heated, heat is applied from the peeling film 130 to the resin layer 131, and the resin layer 131 may expand. Therefore, when heat is applied to the release film 130, the resin layer 131 is cooled. As a result, expansion of the resin layer 131 can be suppressed, and swelling and cracking of the wiring 135 and the like can be suppressed.

Next, the controller 120 moves the stage 52 to the mounting unit 27 and removes the wiring board 141 from the release film 130 in S18. The controller 120 controls the robot arm 119 of the mounting section 112 to remove the wiring board 141 from the release film 130 and the base member 60 . Robot arm 119 removes wiring board 141 from peeling film 130 by, for example, pressing peeling film 130 against base member 60 when wiring board 141 is stuck to peeling film 130 when wiring board 141 is removed.

The robot arm 119 arranges the removed wiring board 141 at a predetermined unloading position. A user can obtain the completed wiring board 141 . After executing S18, the controller 120 ends the manufacturing process shown in FIG. Note that the robot arm 119 may also perform the work of peeling off the release film 130 from the base member 60 or the assembly of the plurality of wiring boards 141 . Alternatively, the wiring substrate 141 and the peeling film 130 may be removed manually.

(3. Strength of heating and strength of cooling)
Next, control for changing the intensity of heating and cooling in the manufacturing process described above according to the thickness of the resin layer 131 will be described. For example, in the process of S15, the controller 120 makes the strength of heating weaker when the thickness of the resin layer 131 is thicker than when the thickness of the resin layer 131 is thin. For example, in the firing of the connection terminal 139 shown in FIG. 9, if cooling is performed by the heating and cooling device 66 with a certain efficiency, the thickness of the resin layer 131 (for example, the thickness W shown in FIG. 9) increases during firing. Accordingly, the cooling effect on the upper side of the resin layer 131 (on the side of the connection terminal 139), that is, at a position farther from the base member 60 is lowered. The temperature of the resin layer 131 immediately below the connection terminal 139 (conductive resin paste 147) may rise further as the thickness W of the resin layer 131 increases at the time of firing, as the cooling effect decreases. Therefore, the controller 120 adjusts the strength of heating according to the thickness W of the resin layer 131 by making the strength of heating weaker when the thickness W of the resin layer 131 is thicker than when the thickness W of the resin layer 131 is thin. Expansion of the layer 131 can be suppressed.

For example, when the thickness W of the resin layer 131 is thin (the lower layer of the wiring board 141 is formed), the controller 120 increases the heating temperature for heating the metal ink 145 and the conductive resin paste 147 by the infrared lamp device 74. . As a result, when the position where the connection terminals 139 and the like are to be baked is close to the heating/cooling device 66 and a sufficient cooling effect can be obtained, the heating strength is increased until the electrical resistance of the wiring 135 and the like reaches a desired value. Firing can be performed. Further, the controller 120 weakens the heating temperature of the infrared lamp device 74 as the thickness W of the resin layer 131 increases. As a result, when the position where the wiring 135 and the like are to be baked is away from the heating/cooling device 66 and the cooling effect is lowered, the strength of the heating is weakened, thereby suppressing the expansion of the resin layer 131 .

A method for changing the intensity of heating is not particularly limited. For example, the controller 120 may reduce the power supplied to the heating element of the infrared lamp device 74 to lower the heating temperature for heating the metal ink 145 and the conductive resin paste 147 . Alternatively, the controller 120 may change the heating temperature by changing the duty ratio or frequency of power supplied to the heating element.

Also, the controller 120 does not have to change the heating intensity according to the thickness W of the resin layer 131 . The controller 120 may perform heating at a constant intensity regardless of the thickness W. Also, the controller 120 may increase the intensity of heating as the thickness W increases. For example, let us consider a case where cold air is blown from the side (horizontal direction in FIG. 9) to the resin layer 131 . In this case, for example, as the thickness W increases, the cooling effect increases as the thickness W increases, if the amount and range of the blowing cold air are increased. If such a cooling effect increases and the heating temperature necessary for baking the metal ink 145 cannot be ensured, the controller 120 may increase the strength of heating as the thickness W increases. Therefore, if the temperature of the resin layer 131 decreases due to cooling as the thickness W increases and baking becomes insufficient, the heating may be increased. Thereby, the influence of the cooling effect due to the change in the thickness W can be reduced by adjusting the strength of the heating.

Further, the controller 120 may change the strength of cooling the base member 60 in S<b>15 according to the thickness W of the resin layer 131 . A temperature gradient of the resin layer 131 caused by heating by the infrared lamp device 74 and cooling by the heating/cooling device 66 changes according to the thickness W of the resin layer 131 . Therefore, by changing the strength for cooling the base member 60 according to the thickness W of the resin layer 131, the influence of the increase or decrease in the thickness W of the resin layer 131 on the cooling effect is eliminated, and the resin layer 131 is cooled more appropriately. can do.

For example, when the thickness W of the resin layer 131 is thin, the controller 120 weakens the strength with which the heating/cooling device 66 cools the base member 60 . As a result, it is possible to suppress the occurrence of a situation in which the metal ink 145 or the like is cooled excessively due to the thin thickness W, the temperature of the metal ink 145 or the like is lowered, and the baking is insufficient (the electrical resistance is not sufficiently lowered). Also, the controller 120 may increase the strength of cooling the base member 60 as the thickness W of the resin layer 131 increases. Accordingly, it is possible to prevent the thickness W from increasing and lowering the cooling effect on the upper side of the resin layer 131 (on the side of the connection terminal 139 ), that is, at a position farther from the base member 60 . Expansion of the resin layer 131 can be suppressed, and cracking or the like of the connection terminal 139 can be suppressed.

A method for changing the cooling intensity is not particularly limited. For example, the controller 120 may lower the temperature of the cold water used as the coolant for the heating/cooling device 66, or increase the flow rate or amount of cold water supplied to the water-cooling pipes, thereby strengthening the cooling strength. . Alternatively, if a Peltier element is used as the cooling device, the controller 120 may change the power supplied to the Peltier element to change the cooling strength.

Also, the controller 120 does not have to change the cooling strength according to the thickness W of the resin layer 131 . Controller 120 may perform cooling at a constant intensity regardless of thickness W. FIG. Also, the controller 120 may decrease the strength of cooling as the thickness W increases. For example, when the thickness W of the resin layer 131 increases, the heat applied to the resin layer 131 is dispersed, and the temperature rise of the resin layer 131 is suppressed. The temperature of the resin layer 131 immediately below the conductive resin paste 147 may drop. In this case, the controller 120 may weaken the strength of cooling as the thickness W increases. As a result, it is possible to suppress the temperature drop of the metal ink 145 and the like during firing. Therefore, when the temperature of the resin layer 131 below the position to be fired is too low due to variations in the thickness W (when firing is insufficient), cooling is weakened, and when the temperature of the resin layer 131 is too high ( When the resin layer 131 expands, the cooling is strengthened, and the influence of the heating effect due to the change in the thickness W can be reduced by adjusting the strength of the cooling.

Further, the controller 120 may execute the adjustment of the strength of heating and the adjustment of the strength of cooling in combination, or may execute only one of them. Further, the controller 120 may change the strength of heating and the strength of cooling in the heating of the release film 130 in S17 as well as the baking in S15. For example, when the thickness W is thin and the distance between the cool air device 75 and the base member 60 (heating/cooling device 66) shown in FIG. Also good. As a result, when the cooling effect of the release film 130 by the cooling air device 75 becomes strong, the heating by the heating/cooling device 66 can be strengthened to appropriately release the release film 130 .

Further, as shown in FIG. 9, the controller 120 sets the thickness W of the resin layer 131 based on the thickness W of the resin layer 131 formed under the metal ink 145 or the conductive resin paste 147 heated in S15, for example. It is preferable to The swelling and cracking of the metal wiring such as the wiring 135 and the connection terminal 139 are greatly affected by the expansion of the resin layer 131 immediately below the metal wiring. For example, when forming the connection terminal 139 , the more the resin layer 131 directly under the connection terminal 139 expands, the more likely the connection terminal 139 will swell or crack. In other words, when the connection terminals 139 are formed on part of the upper surface of the resin layer 131 , the expansion of the resin layer 131 at positions away from the connection terminals 139 has little effect on the swelling of the connection terminals 139 . Therefore, the controller 120 uses the thickness W of the resin layer 131 formed under the metal ink 145 and the conductive resin paste 147 to be fired as a reference when adjusting the strength of the heating and cooling described above. . That is, the controller 120 adjusts the intensity of heating and cooling on the basis of the thickness W of the resin layer 131 at the position where the firing is performed in S15. As a result, the expansion of the resin layer 131 can be precisely suppressed to an expansion rate at which the wiring 135 and the connection terminals 139 do not swell or crack. The controller 120 can detect the thickness W during heating or cooling based on the data of the wiring board 141 set in the control program 127 .

Note that the controller 120 does not have to use the thickness W of the resin layer 131 formed under the metal ink 145 and the conductive resin paste 147 to be fired as a reference. For example, the controller 120 may change the strength of heating and the strength of cooling based on the number of times S11 and S12 are executed. That is, the number of steps of forming the resin layer 131 may be used as a reference.

According to the above-described embodiment, the following effects are obtained.
The controller 120 of the manufacturing apparatus 10 performs the processing of S11 for discharging the ultraviolet curable resin 133 onto the release film 130 attached to the base member 60, and the processing of S12 for curing the ultraviolet curable resin 133 discharged onto the release film 130. process and perform. The controller 120 repeatedly executes the processing of S11 and the processing of S12 according to the structure of the wiring board 141 to be manufactured to form the resin layer 131 on the release film 130 (an example of the resin layer forming process). The controller 120 executes the process of S13 to apply the metal ink 145 or the conductive resin paste 147 (an example of fluid containing metal particles) on the formed resin layer 131 . Then, in the process of S15, the controller 120 cools the base member 60 and heats the metal ink 145 or the like applied on the resin layer 131 from above to form the wiring 135 or the like (see FIG. 9). ).

According to this, the resin layer 131 is formed on the base member 60 with the ultraviolet curable resin 133 , and the metal ink 145 or the like is discharged onto the resin layer 131 . Then, while the base member 60 is being cooled, the metal ink 145 and the like are heated from above and hardened to form the wiring 135 and the like. As a result, even if the heat that heats the metal ink 145 and the like is transferred to the resin layer 131 under the metal ink 145 and the like, the temperature rise of the resin layer 131 can be suppressed by cooling the base member 60 . Expansion of the resin layer 131 due to the heat treatment in S15 can be suppressed, and swelling and cracking of the wiring 135 and the like can be suppressed.

The controller 120 of the control device 28 has a resin material application section 161, a curing section 162, a resin layer formation section 163, a fluid application section 164, and a metal wiring formation section 165, as shown in FIG. The resin material application unit 161 is a functional unit that controls the inkjet head 84 (an example of a coating device) to apply an ultraviolet curable resin 133 (an example of a resin material) onto the base member 60 . The curing section 162 is a functional section that controls the irradiation device 92 (an example of a curing device) to cure the ultraviolet curable resin 133 applied on the base member 60 . The resin layer forming section 163 is a functional section that repeatedly controls the resin material applying section 161 and the curing section 162 to form the resin layer 131 on the base member 60 . The fluid applying unit 164 controls the inkjet head 72 and the droplet applying device 100 (an example of the applying device) to apply metal ink 145 and conductive resin paste 147 on the resin layer 131 formed by the resin layer forming unit 163 . (an example of a fluid containing metal particles) is applied. The metal wiring forming part 165 controls the heating/cooling device 66 (an example of a cooling device) to cool the base member 60 , and controls the infrared lamp device 74 (an example of a heating device) to apply the resin layer 131 with the resin layer 131 . It is a functional portion that forms wiring 135 , through holes 137 , and connection terminals 139 by heating and hardening fluid containing metal particles. Each of these functional units is realized, for example, by controller 120 executing control program 127 stored in storage device 125 .

In addition, in the said Example, the heating cooling device 66 is an example of a cooling device. The inkjet heads 72 and 84 and the droplet applying device 100 are examples of the applying device. The infrared lamp device 74 is an example of a heating device. The irradiation device 92 is an example of a curing device. Controller 120 is an example of a control device. The release film 130 is an example of a release member. The ultraviolet curable resin 133 is an example of a resin material. The wiring 135, through holes 137, and connection terminals 139 are examples of metal wiring. The wiring board 141 is an example of a three-dimensional modeled object. The metal ink 145 and the conductive resin paste 147 are examples of fluid containing metal particles. The process of S11 is an example of the resin material coating process and the resin layer forming process. The processing of S12 is an example of a curing step and a resin layer forming step. The process of S13 is an example of the fluid application process. The process of S15 is an example of the metal wiring forming process. S17 is an example of a peeling member heating step.

(4. Others)
It should be noted that the present application is not limited to the above embodiments, and can be implemented in various aspects with various modifications and improvements based on the knowledge of those skilled in the art.
For example, coating in the present disclosure does not only mean discharging a fluid containing the ultraviolet curable resin 133 and metal particles from a nozzle or the like, but also includes contact coating using a plate or the like. For example, any one of the ultraviolet curing resin 133, the metal ink 145, and the conductive resin paste 147 may be printed by screen printing and applied in contact.
Moreover, the manufacturing apparatus 10 may directly form the wiring board 141 on the base member 60 . That is, the release film 130 may not be used.
In addition, the peeling member of the present disclosure is not limited to a film-like member, and various members that have adhesiveness and whose adhesiveness is reduced by applying heat can be employed.

Also, the cooling air device 75 may be provided in a device other than the first modeling unit 22 .
Further, in S15, the heating/cooling device 66 may perform cooling intermittently or discretely (once every several heating steps, etc.) instead of always performing cooling. Similarly, in the heating of S17, the cold air device 75 does not have to always perform cooling.

Also, the materials used in the layered manufacturing method may be changed as appropriate. For example, the resin layer 131 may be modeled using a thermosetting resin without using the ultraviolet curable resin 133 . As the metal used for the wiring 135 and the connection terminal 139, metals other than silver (gold, copper, etc.) may be used.
Also, in the above embodiment, the wiring 135 is formed with the metal ink 145 , but the wiring 135 may be formed with the conductive resin paste 147 .
Also, the configuration of the manufacturing apparatus 10 shown in FIGS. 1 and 2 in the above embodiment is an example. For example, the manufacturing apparatus 10 may include a press device that presses the wiring board 141 to correct warpage. For example, when applying heat to press, the manufacturing apparatus 10 may perform cooling by the heating/cooling device 66 to suppress expansion of the resin layer 131 .

10 three-dimensional model manufacturing device, 28 control device, 60 base member, 66 heating and cooling device (cooling device), 72 inkjet head (coating device), 74 infrared lamp device (heating device), 84 inkjet head (coating device), 92 irradiation device (curing device), 100 droplet coating device (coating device), 131 resin layer, 133 ultraviolet curing resin (resin material), 135 wiring (metal wiring), 137 through hole (metal wiring), 139 connection terminal ( metal wiring), 141 wiring board (three-dimensional model), 145 metal ink (fluid containing metal particles), 147 conductive resin paste (fluid containing metal particles), 161 resin material application part, 162 curing part, 163 resin Layer formation part 164 Metal wiring formation part 165 Metal wiring formation part.

Claims (7)

a resin material application step of applying a resin material onto the base member;
a curing step of curing the resin material applied onto the base member;
a resin layer forming step of repeatedly performing the resin material applying step and the curing step to form a resin layer on the base member;
a fluid applying step of applying a fluid containing metal particles onto the resin layer formed in the resin layer forming step;
a metal wiring forming step of forming a metal wiring by heating the fluid containing the metal particles applied on the resin layer from above while cooling the base member to harden the fluid;
a mounting process for mounting the electronic component;
including
The resin material is
An ultraviolet curable resin having a glass transition point higher than the temperature at which the fluid containing the metal particles is heated,
The fluid containing the metal particles is
A metal ink in which metal fine particles are dispersed in a solvent, and a conductive resin paste in which metal particles having a size larger than the metal fine particles in the metal ink are dispersed,
The fluid application step includes
Applying the metal ink and applying the conductive resin paste,
The metal wiring forming step includes:
forming a wiring by heating the metal ink applied on the resin layer while cooling the base member from above and curing the ink; heating the resin paste from above to harden it and form a connection terminal;
In the fluid applying step, the metal ink is applied on the resin layer, and in the metal wiring forming step, the metal ink is heated from above to harden to form the wiring, and then in the fluid applying step, applying the conductive resin paste on the wiring, and arranging the electronic component so that the electrodes of the electronic component and the wiring are connected through the conductive resin paste in the mounting step; A method for manufacturing a three-dimensional structure by lamination molding, wherein in the metal wiring forming step, the conductive resin paste is heated from above to be cured to form the connection terminals. In the resin material application step,
applying the resin material on the peeling member attached on the base member;
The peeling member is
By applying heat, the adhesive force between the base member is reduced,
a peeling member heating step of heating the peeling member so that the peeling member can be easily peeled off from the base member ;
The temperature for heating the fluid containing the metal particles is
2. The three-dimensional structure according to claim 1, which is a minimum heating temperature at which the adhesive force of the peeling member does not decrease as much as possible and at which the fluid containing the metal particles can be heated to a desired state. Production method. In the peeling member heating step,
3. The method of manufacturing a three-dimensional structure according to claim 2, wherein the resin layer is cooled from above while the base member is heated. In the metal wiring forming step,
4. The three-dimensional structure according to any one of claims 1 to 3, wherein the strength of heating when the thickness of the resin layer is thick is made weaker than when the thickness of the resin layer is thin. A method of manufacturing a modeled object. In the metal wiring forming step,
5. The method of manufacturing a three-dimensional structure according to any one of claims 1 to 4, wherein the strength of cooling the base member is changed according to the thickness of the resin layer. The thickness of the resin layer is
6. The method of manufacturing a three-dimensional structure according to claim 4 or 5, wherein the thickness of the resin layer formed under the fluid containing the metal particles heated in the metal wiring forming step. a base member;
a coating device;
a curing device;
a cooling device;
a heating device;
a mounting device;
a controller;
with
The control device is
a resin material application unit that controls the application device to apply a resin material onto the base member;
a curing unit that controls the curing device to cure the resin material applied on the base member;
a resin layer forming unit that repeatedly controls the resin material applying unit and the curing unit to form a resin layer on the base member;
a fluid coating unit that controls the coating device to apply a fluid containing metal particles onto the resin layer formed by the resin layer forming unit;
While controlling the cooling device to cool the base member, the heating device is controlled to heat and harden the fluid containing the metal particles applied on the resin layer from above to form a metal wiring. a wiring forming unit;
with
Controlling the mounting device to mount the electronic component,
The resin material is
An ultraviolet curable resin having a glass transition point higher than the temperature at which the fluid containing the metal particles is heated,
The fluid containing the metal particles is
A metal ink in which metal fine particles are dispersed in a solvent, and a conductive resin paste in which metal particles having a size larger than the metal fine particles in the metal ink are dispersed,
The fluid applying section is
Applying the metal ink and applying the conductive resin paste,
The metal wiring forming part is
forming a wiring by heating the metal ink applied on the resin layer while cooling the base member from above and curing the ink; heating the resin paste from above to harden it and form a connection terminal;
In the fluid applying section, the metal ink is applied on the resin layer, and in the metal wiring forming section, the metal ink is heated from above to cure and form the wiring, and then, in the fluid applying section, applying the conductive resin paste on the wiring, arranging the electronic component so that the electrodes of the electronic component and the wiring are connected by the mounting device through the conductive resin paste; A three-dimensional structure manufacturing apparatus , wherein the conductive resin paste is heated from above to harden in a metal wiring forming section to form the connection terminals.

Images