JP7306250B2 - 基地局及び装置冷却方法 - Google Patents
基地局及び装置冷却方法 Download PDFInfo
- Publication number
- JP7306250B2 JP7306250B2 JP2019223474A JP2019223474A JP7306250B2 JP 7306250 B2 JP7306250 B2 JP 7306250B2 JP 2019223474 A JP2019223474 A JP 2019223474A JP 2019223474 A JP2019223474 A JP 2019223474A JP 7306250 B2 JP7306250 B2 JP 7306250B2
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- JP
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- Prior art keywords
- cooling
- air
- radiator
- liquid
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20654—Liquid coolant without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mobile Radio Communication Systems (AREA)
Description
120 第1領域
121、301 サーバ装置
122 無線制御装置
123 液冷装置
130 第2領域
131 無線装置
131a 放熱フィン
132 アンテナ
133 ラジエータ
133a 開口部
135 吸気ダクト
136 排気ダクト
201 回収タンク
202 熱交換器
203 分配タンク
204 ポンプ部
220 基板
Claims (5)
- 閉空間を仕切り壁によって仕切ることにより得られる第1領域及び第2領域を有し、
前記第1領域は、
通信を制御する第1の装置と、
前記第1の装置へ液体冷媒を送出する液冷装置とを有し、
前記第2領域は、
液体冷媒を空気との熱交換によって冷却し、冷却した液体冷媒を前記液冷装置へ供給するとともに、熱交換に用いられた空気を前記第2領域内へ排出するラジエータと、
前記ラジエータから排出される空気を用いて放熱し、前記第1の装置による制御に従って無線処理を実行する第2の装置とを有する
ことを特徴とする基地局。 - 前記ラジエータは、
前記第2領域内へ空気を排出する開口部を有し、
前記第2の装置は、
前記開口部に対向する位置に配置される
ことを特徴とする請求項1記載の基地局。 - 前記液冷装置は、
第1の液体冷媒と第2の液体冷媒との熱交換により、前記第2の液体冷媒を冷却する熱交換器と、
前記熱交換器によって冷却された前記第2の液体冷媒を前記第1の装置へ送出する送出部とを有し、
前記ラジエータは、
前記第1の液体冷媒を空気との熱交換によって冷却し、冷却した前記第1の液体冷媒を前記熱交換器へ供給する
ことを特徴とする請求項1記載の基地局。 - 前記第1の装置は、
発熱する部品を搭載する基板と、
前記基板に接触し、内部に前記液冷装置から送出される液体冷媒を循環させる板状冷却部材と
を有することを特徴とする請求項1記載の基地局。 - 閉空間を仕切り壁によって仕切ることにより得られる第1領域及び第2領域のうち、前記第1領域に配置され通信を制御する第1の装置を液体冷媒によって冷却し、
前記第1の装置の冷却に用いられた液体冷媒を前記第2の領域に配置されるラジエータへ送出し、
前記ラジエータにおいて液体冷媒を空気との熱交換によって冷却し、熱交換に用いられた空気を前記第2領域内へ排出し、
前記第2領域内へ排出される空気を用いて、前記第2領域に配置され前記第1の装置による制御に従って無線処理を実行する第2の装置に放熱させる
ことを特徴とする装置冷却方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019223474A JP7306250B2 (ja) | 2019-12-11 | 2019-12-11 | 基地局及び装置冷却方法 |
US17/104,942 US11406048B2 (en) | 2019-12-11 | 2020-11-25 | Base station and device cooling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019223474A JP7306250B2 (ja) | 2019-12-11 | 2019-12-11 | 基地局及び装置冷却方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021092995A JP2021092995A (ja) | 2021-06-17 |
JP7306250B2 true JP7306250B2 (ja) | 2023-07-11 |
Family
ID=76312449
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Application Number | Title | Priority Date | Filing Date |
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JP2019223474A Active JP7306250B2 (ja) | 2019-12-11 | 2019-12-11 | 基地局及び装置冷却方法 |
Country Status (2)
Country | Link |
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US (1) | US11406048B2 (ja) |
JP (1) | JP7306250B2 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006012874A (ja) | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | 半導体素子の冷却装置 |
JP2007094648A (ja) | 2005-09-28 | 2007-04-12 | Toshiba Corp | 電子機器 |
JP2007227576A (ja) | 2006-02-23 | 2007-09-06 | Nec Engineering Ltd | 冷却構造 |
JP2009158803A (ja) | 2007-12-27 | 2009-07-16 | Toshiba Corp | 液冷式筺体冷却装置 |
US20140260397A1 (en) | 2013-03-12 | 2014-09-18 | Schneider Electric Industries Sas | Electrical cabinet with improved heat dissipation |
JP2018125497A (ja) | 2017-02-03 | 2018-08-09 | 富士通株式会社 | 電子機器、電子機器用の冷却制御装置及び冷却制御方法 |
US20190335626A1 (en) | 2018-04-25 | 2019-10-31 | Dell Products, L.P. | Modulating ahu vs ram air cooling, based on vehicular velocity |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0920387A (ja) | 1995-07-03 | 1997-01-21 | Sadamu Ichikawa | コンテナ |
JP2832707B2 (ja) | 1997-06-09 | 1998-12-09 | ヤンマー農機株式会社 | コンバイン |
JP2002264851A (ja) | 2001-03-07 | 2002-09-18 | Eiji Yasui | 物流の効率性、利便性に富んだ箱型コンテナ方式による車両牽引用フルトレラー |
US7272945B2 (en) * | 2003-07-29 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | Environmental condition measurement system |
JP2005228216A (ja) | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 電子機器 |
JP4719079B2 (ja) | 2006-05-19 | 2011-07-06 | 株式会社東芝 | 電子機器 |
US20150181769A1 (en) * | 2012-09-14 | 2015-06-25 | Gac Corporation | Air conditioning system |
US20160120059A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Two-phase cooling system |
US10123461B2 (en) * | 2017-04-05 | 2018-11-06 | Google Llc | Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly |
US20190354220A1 (en) * | 2018-05-16 | 2019-11-21 | Johnson Controls Technology Company | Transparent display control device |
-
2019
- 2019-12-11 JP JP2019223474A patent/JP7306250B2/ja active Active
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2020
- 2020-11-25 US US17/104,942 patent/US11406048B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006012874A (ja) | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | 半導体素子の冷却装置 |
JP2007094648A (ja) | 2005-09-28 | 2007-04-12 | Toshiba Corp | 電子機器 |
JP2007227576A (ja) | 2006-02-23 | 2007-09-06 | Nec Engineering Ltd | 冷却構造 |
JP2009158803A (ja) | 2007-12-27 | 2009-07-16 | Toshiba Corp | 液冷式筺体冷却装置 |
US20140260397A1 (en) | 2013-03-12 | 2014-09-18 | Schneider Electric Industries Sas | Electrical cabinet with improved heat dissipation |
JP2018125497A (ja) | 2017-02-03 | 2018-08-09 | 富士通株式会社 | 電子機器、電子機器用の冷却制御装置及び冷却制御方法 |
US20190335626A1 (en) | 2018-04-25 | 2019-10-31 | Dell Products, L.P. | Modulating ahu vs ram air cooling, based on vehicular velocity |
Also Published As
Publication number | Publication date |
---|---|
US20210185860A1 (en) | 2021-06-17 |
JP2021092995A (ja) | 2021-06-17 |
US11406048B2 (en) | 2022-08-02 |
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