JP7306123B2 - IC module, dual IC card, and IC module manufacturing method - Google Patents

Description

The present invention relates to an IC module capable of contact communication and non-contact communication, a dual IC card, and an IC module manufacturing method.

2. Description of the Related Art An IC module equipped with an IC chip having a contact-type communication function and a non-contact-type communication function is used for various purposes because the communication function can be used properly according to the user's purpose. For example, an IC module equipped with an IC chip having such functions is attached to a card body and used as a dual IC card. The IC module and the card body are electrically connected by electromagnetic coupling (transformer coupling) to enable power supply and communication. This is because if the IC module and the card body are directly connected by a conductive connection member such as solder, the connection member may be damaged when the dual IC card is bent.

A terminal (contact terminal section) for a contact interface with an external device is formed on the surface of the IC module for the dual IC card, and a connection coil for electromagnetic coupling is formed on the back surface.

A card body made of a plate-shaped card substrate has a recess formed by milling, in which an IC module is housed. The IC module accommodating portion of the card substrate is composed of an inner portion and an outer portion having different depths, with the inner portion being deeper. Instead of deepening the entire depth to accommodate the resin-sealed part of the IC module, only the inner part is deepened so that the outer IC module accommodating part does not affect the position of the coupling coil. It should be milled. By doing so, it is possible to secure a sufficient number of turns of the coupling coil provided in the antenna inside the card substrate for electromagnetic coupling with the connection coil of the IC module. If the number of turns of the coupling coil is insufficient, sufficient signal transmission cannot be performed due to insufficient electromagnetic coupling.

In order to bridge and move the connection point connected to the end from the outermost end of the connection coil formed on the back surface of the IC module to the position adjacent to the IC chip on the surface of the card substrate, a card base is provided. Through-hole plating is applied to the material, and the surface is bridged (connected by forming bridging wiring). The contact terminals on the front surface of the IC module substrate and the IC chip on the rear surface are connected by punching hole wire bonding. Punching hole wire bonding is to form a through hole in the IC module substrate that contacts the back surface of the contact terminal on the front surface, and wire-bond the two with a conductive wire passing through (inserting) the through hole.

In addition, in the base material of the IC module which is not plated with through-holes, through-holes are formed at both ends of the bridging wiring provided to bridge the outermost ends of the connecting coils, and through-holes are formed to connect to the terminals of the IC chip. The bridging wires and the connecting coil and the bridging wires can be connected by conductive wires inserted through the through holes. In this way, connection is completed by wire bonding without through-hole plating. Therefore, it is possible to manufacture an IC module easily and inexpensively.

A configuration example of the dual IC card and the IC module will be described in more detail with reference to the drawings.
As shown in FIGS. 12 and 13, the dual IC card 1 includes a plate-like card body 10 having a recess 11 formed therein, and an IC module 30 accommodated in the recess 11. As shown in FIGS.
FIG. 13 is a cross-sectional view schematically showing the dual IC card 1, and shows a simplified number of turns of an antenna 13, which will be described later. FIG. 12 shows the antenna 13 and the capacitive element 14 in the card body 10, and only the outer shape thereof is shown through the substrate 12. FIG.

The card body 10 includes a substrate 12, an antenna 13 provided on a first surface 12a on the opening 11a side of the concave portion 11 of the substrate 12, a capacitive element 14 electrically connected to the antenna 13, and the substrate 12. , and a pair of card substrates 15 laminated with an antenna 13 and a capacitive element 14 interposed therebetween.
The substrate 12 is made of an insulating material such as PET (polyethylene terephthalate) or polyethylene naphthalate (PEN) and is rectangular in plan view (see FIG. 12). Each card base material 15 is also formed in a rectangular shape in a plan view.
A housing hole 12d is formed through the substrate 12 in the thickness direction D on the short side 12c side of the substrate 12, ie, the short side side of the card base material 15. As shown in FIG. The accommodation hole 12d is formed in a rectangular shape having sides parallel to the short sides and the long sides of the substrate 12 in plan view. The thickness of the substrate 12 is, for example, 15-50 μm (micrometers).

The antenna 13 includes a coupling coil 18 for electromagnetically coupling with a connection coil 31 (described later) of the IC module 30, and a non-contact external device (not shown) such as a reader/writer for non-contact communication. It has a main coil 19 connected to a main coil 18 . The coupling coil 18 is a coil arranged within the region R1 in FIG. 12, and the main coil 19 is a coil arranged within the region R2 adjacent to the region R1. On the long side 12e side of the substrate 12 with respect to the accommodation hole 12d, that is, on the long side side of the card base material 15, an embossable area R3 is formed in accordance with IC card standards (X 6302-1:2005 (ISO/IEC 7811- 1:2002)).

In this example, the coupling coil 18 is spirally formed and wound five times around the receiving hole 12d. The width of the wiring 18a forming the coupling coil 18 in the embossed region R3 is wider than the width of the wiring 18b outside the embossed region R3. At the end of the wire 18b arranged on the innermost side of the coupling coil 18, a terminal portion 20 having a width wider than that of the wire 18b and having a substantially circular shape is provided. This terminal portion 20 is formed on the first surface 12a.
The main coil 19 is spirally formed and wound three times within the region R2. The width of the wiring 19a forming the main coil 19 in the embossed region R3 is wider than the width of the wiring 19b outside the embossed region R3. By widening the width of the wiring 19a and the width of the wiring 18a described above, it is possible to prevent the wirings 18a, 19a from breaking when the embossing is formed in the embossed region R3.
The end of the outermost wiring 19a of the main coil 19 is connected to the end of the outermost wiring 18a of the coupling coil 18 .

As shown in FIGS. 12 and 13, the capacitive element 14 includes an electrode plate 14a provided on the first surface 12a of the substrate 12 and an electrode plate 14b provided on the second surface 12b of the substrate 12. have. The electrode plates 14a and 14b are arranged to face each other with the substrate 12 interposed therebetween.
The electrode plate 14a is connected to the end of the innermost wiring 19b of the main coil 19 .
A connection wiring 21 provided on the second surface 12b is connected to the electrode plate 14b. The connection wiring 21 extends to a portion facing the terminal portion 20 on the second surface 12b of the substrate 12, and a terminal portion (not shown) is provided at this extended portion. The terminal portion 20 of the coupling coil 18 and the terminal portion of the connection wiring 21 are electrically connected by a known crimping process or the like. Capacitive element 14 is connected in series between coupling coil 18 and main coil 19 .

The card base material 15 is made of a polyester-based material such as amorphous polyester, a vinyl chloride-based material such as PVC (polyvinyl chloride), a polycarbonate-based material, or PET-G (polyethylene terephthalate copolymer) having insulating properties and durability. is made of a material having
The recess 11 described above is formed in the card substrate 15 as shown in FIG. The concave portion 11 includes a first accommodating portion 24 formed on the side surface of the card substrate 15 and a second accommodating portion 25 having a smaller diameter than the first accommodating portion 24 formed on the bottom surface of the first accommodating portion 24. and The opening on the side surface of the card substrate 15 of the first accommodating portion 24 is the above-mentioned opening 11a.

Next, an example of an IC module will be described.
As shown in FIGS. 10 and 11, the IC module 30 includes a sheet-like module substrate 33, an IC chip 34 and a connection coil 31 provided on a first surface 33a of the module substrate 33, and a module substrate. A plurality of contact terminals (also referred to as contact terminal portions) 35 and bridges (also referred to as bridging wiring) 36 provided on the second surface 33 b of 33 are provided.
The module base material 33 is made of the same material as the substrate 12 and is formed in a rectangular shape in plan view. In the module base material 33, a first through hole (hereinafter also referred to as a through hole) 33c and a second through hole are spaced apart from each other at positions overlapping both ends of the bridge 36 when viewed in the thickness direction D. A hole (also referred to as a second through hole) 33d is formed. The thickness direction of the module base material 33 coincides with the thickness direction D of the substrate 12 described above. A through hole (auxiliary through hole) 33e is formed in the module base material 33 in addition to the through holes 33c and 33d (see FIG. 10). The thickness of the module base material 33 is, for example, 50 to 200 μm.
As the IC chip 34, one having a known configuration that has a contact communication function and a non-contact communication function can be used. The IC chip 34 has a first terminal 34b, a second terminal 34c and a plurality of connection terminals 34d formed on the outer surface of a chip body 34a.

The connection coil 31 is spirally formed. The connection coil 31 is wound, for example, three times around the IC chip 34 and the through holes 33c and 33e. A second through hole 33 d is formed outside the connection coil 31 . The outermost wiring end (first end) and the innermost wiring end (second end) of the connecting coil 31 are formed wider than the wiring. terminal portions 39 and 40 are provided, respectively. The connection coil 31 is formed by patterning copper foil or aluminum foil by etching. The thickness of the connection coil 31 is, for example, 5 to 50 μm. The connection coil 31 constitutes a non-contact terminal section by electromagnetic coupling with the coupling coil 18 of the card body 10 (see FIG. 11).

As shown in FIG. 10, the plurality of contact terminals 35 and bridges 36 are formed in a predetermined pattern by laminating, for example, copper foil on the second surface 33b of the module substrate 33. As shown in FIG. The bridge 36 is formed so as to straddle the connection coil 31 when viewed in the thickness direction D. As shown in FIG. Although FIG. 10 shows an example formed in an L shape, there is no need to limit it to an L shape.
The plurality of contact terminals 35 and bridges 36 are electrically isolated from each other. A nickel layer with a thickness of 0.5 to 3 μm may be provided by plating on the portion of the copper foil exposed to the outside, and a gold layer with a thickness of 0.01 to 0.3 μm is further plated on the nickel film. may be provided.
Each contact terminal 35 is for contacting a contact-type external device such as an automated teller machine. The contact terminals 35 are connected to elements (not shown) built in the chip body 34 a of the IC chip 34 .
A plurality of contact terminals may be formed on the second surface 33b of the module substrate 33 by a lead frame having a thickness of 50 to 200 μm, and a connection coil may be formed on the first surface 33a of the module substrate 33 by copper wire. .

As illustrated in FIG. 10, the first terminal 34b of the IC chip 34 and the bridge 36 are connected by a first wire (first conductive wire) 41 passing through the first through hole 33c. The bridge 36 and the terminal portion 39 of the connection coil 31 are connected by a second wire (second conductive wire) 42 inserted through the second through hole 33d without plating the second through hole. there is The terminal portion 40 of the connection coil 31 and the second terminal 34 c of the IC chip 34 are connected by a third wire (third conductive wire) 43 .
The connection terminals 34d of the IC chip 34 and the contact terminals 35 are connected by connection wires (auxiliary conductive wires) 44 inserted through the through holes 33e. The wires 41, 42, 43 and the connection wire 44 are made of gold or copper and have an outer diameter of 10 to 40 μm, for example.
Thus, the IC chip 34, the connecting coil 31, the bridge 36, and the wires 41, 42, 43, 44 form a closed circuit.
The first terminal 34b of the IC chip 34 and the bridge 36, and the bridge 36 and the connection coil 31 are connected by punching hole wire bonding using wires 41 and 42, respectively. The connection terminals 34 d of the IC chip 34 and the contact terminals 35 are also connected by punching hole wire bonding using connection wires 44 . The connection coil 31 and the second terminal 34 c of the IC chip 34 are connected by wire bonding using the third wire 43 . By providing a resin sealing portion that covers the IC chip 34, the first wires 41, the third wires 43, and the connection wires 44, the IC chip 34 can be protected and disconnection of the wires 41 and 43 can be prevented. . The resin sealing portion can be formed of, for example, a known epoxy resin.

In such an IC module 30, in order to protect the IC chip 34 and prevent disconnection, the innermost end portion of the connection coil 31 is provided between the IC chip 34, the contact terminals 35 and the connection terminals 34d of the IC chip. between the terminal portion 40 and the second terminal 34c of the IC chip 34, between the first terminal 34b of the IC chip 34 and the bridging wire 36, between the terminal portion 39 at the outermost end of the connecting coil 31 and the bridging wire 36, It is preferable that the conductive lines 41, 42, 43, and 44 connecting the respective wires are covered with a resin sealing portion.

However, between the IC chip 34, the terminal portion 40 at the innermost end of the connecting coil 31 and the terminal 34c of the IC chip, between the contact terminal 35 and the connecting terminal 34d of the IC chip, and between the first terminal 34b of the IC chip 34 and the bridging When trying to resin-seal the conductive wires 41, 42, 43, 44 and the wire bonding portion connecting between the wires 36 and between the terminal portion 39 at the outermost end of the connection coil 31 and the bridging wire 36, respectively, the IC There is a problem that the thickness of the entire module 30 is increased, and it cannot be accommodated in the concave portion 11 (see FIG. 13) which is the IC module accommodating portion of the dual IC card substrate 15 (see FIG. 9).

Also, in an IC module without through-hole plating, there is a conductive wire 42 connecting between the terminal portion 39 at the outermost end of the connecting coil 31 and the bridging wiring 36. between the terminal portion 39 at the outer end and the bridging wire 36, between the first terminal 34b of the IC chip 34 and the bridging wire 36, and between the terminal portion 40 at the innermost end of the connecting coil 31 and the second terminal portion of the IC chip 34. In order to resin-seal the entire wire bonding portion between the terminals 34c, the connection coil 31, that is, the end of the IC module 30 must be resin-sealed. The conductive wire 42 between the terminal portion 39 at the outermost end of the connection coil 31 and the bridging wiring 36 is connected to the IC module accommodating portion (recess 11 or the first accommodating portion 24 and the second accommodating portion 24) of the dual IC card substrate 15. 25), the IC module 30 is placed on the bottom surface of the shallow first accommodating portion 24, so if the IC module 30 is resin-sealed from the center to the edge, the height limit will be exceeded. , the IC module 30 could not be accommodated (see FIGS. 9 and 13).

As a countermeasure, if the number of turns of the coupling coil 18 (see FIG. 12) on the antenna 13 inside the dual IC card substrate is reduced, the IC module accommodating portion (the concave portion 11 or the first accommodating portion 24 and the second accommodating portion) 25) of the dual IC card substrate can be deepened. Although it can be housed in the accommodating portion 25) of the card body 10, sufficient electromagnetic coupling with the coupling coil 18 of the card body 10 cannot be achieved.

Further, as illustrated in FIG. 14, the position of the through hole 33d between the terminal portion 39 at the outermost end of the connecting coil 31 and the bridging wiring 36 (not shown), that is, the position of the connecting conductive wire is If a part of the connection coil 31 is bent toward the IC chip 34 in order to arrange it inside the inner circumference of the connection coil 31, all the wire bonding portions are resin-sealed as shown in FIG. Although it can be stored in the IC module accommodating portion (recess 11 or first accommodating portion 24 and second accommodating portion 25) of the dual IC card base material, it is necessary to reduce the number of turns of the connection coil 31 due to the curvature. , and the number of turns of the connection coil 31 is limited.

Japanese Patent No. 6090006

In view of the above circumstances, it is an object of the present invention to provide an IC module which does not exceed the thickness limit of the IC module accommodating portion, which has a height limit, and a method of manufacturing the same.

As a means for solving the above problems, the invention according to claim 1 of the present invention provides a sheet-like base material,
an IC chip having a contact-type communication function and a non-contact-type communication function, having a first terminal and a second terminal formed thereon, and provided on a first surface of a substrate;
a resin sealing portion provided on the first surface of the substrate so as to cover the IC chip;
a connecting coil provided on the first surface of the substrate and formed in a spiral shape;
a contact terminal portion provided on the second surface of the substrate for contact with a contact-type external device;
bridging wiring provided on the second surface of the substrate so as to be positioned inside the resin sealing portion when viewed in the thickness direction of the substrate and electrically insulated from the contact terminal portion; cage,
The connection coil is
a terminal portion located on the outermost side of the connection coil;
the innermost terminal portion of the connecting coil;
When viewed in the thickness direction of the substrate, the outermost terminal portion is formed in a spiral shape surrounding the IC chip so that the outermost terminal portion is located in the inner region of the resin sealing portion. and a conductor wiring that connects with the terminal portion located inside,
A first through-hole and a second through-hole spaced apart from each other are formed in the base material at positions overlapping the bridging wiring when viewed in the thickness direction of the base material,
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire inserted through the first through hole,
The bridging wiring and the outermost terminal portion of the connecting coil are connected by a second conductive wire passing through the second through hole,
the innermost terminal portion of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire,
Of the resin-encapsulated parts,
The conductive wires and wire bonding portions that connect the IC chip, between the innermost terminal portion of the connecting coil and the terminals of the IC chip, and between the terminals of the IC chip and the bridging wiring, respectively, are the outermost terminals of the connecting coil. The IC module is characterized in that the height of the conductive wire and the wire bonding portion connecting between the portion and the bridging wiring is higher than that of the wire bonding portion.

Further, the invention according to claim 2 is a sheet-like base material,
an IC chip having a contact-type communication function and a non-contact-type communication function, having a first terminal and a second terminal formed thereon, and provided on a first surface of a substrate;
a resin sealing portion provided on the first surface of the substrate so as to cover the IC chip;
a connecting coil provided on the first surface of the substrate and formed in a spiral shape;
a contact terminal portion provided on the second surface of the substrate for contact with a contact-type external device;
bridging wiring provided on the second surface of the substrate so as to be positioned inside the resin sealing portion when viewed in the thickness direction of the substrate and electrically insulated from the contact terminal portion; cage,
The connection coil is
a terminal portion located on the outermost side of the connection coil;
the innermost terminal portion of the connecting coil;
A part is curved toward the IC chip so that the outermost terminal portion when viewed in the thickness direction of the base material is located in the inner region of the resin sealing portion, and the spiral shape surrounds the IC chip. and a conductor wiring that connects the terminal portion located on the outermost side and the terminal portion located on the innermost side,
A first through-hole and a second through-hole spaced apart from each other are formed in the base material at positions overlapping the bridging wiring when viewed in the thickness direction of the base material,
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire inserted through the first through hole,
The bridging wiring and the outermost terminal portion of the connecting coil are connected by a second conductive wire passing through the second through hole,
the innermost terminal portion of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire,
Of the resin-encapsulated parts,
The conductive wires and wire bonding portions that connect the IC chip to the innermost terminal portion of the connecting coil and the terminals of the IC chip, and between the terminals of the IC chip and the bridging wiring, respectively, are the outermost terminals of the connecting coil. The IC module is characterized in that the conductive wire and the wire bonding portion connecting between the portion and the bridging wiring are higher than the wire bonding portion.

Further, the invention according to claim 3 is the IC module according to claim 1,
An antenna having a coupling coil for electromagnetically coupling with the connection coil of the IC module, and a main coil connected to the coupling coil for performing contactless communication with a contactless external device, A dual IC card comprising: a plate-shaped card body in which a recess for accommodating an IC module is formed.

Further, according to the invention of claim 4, the spiral conductor wiring surrounding the area where the IC chip having the contact communication function and the contactless communication function is arranged, a step of forming, on the first surface of a sheet-shaped base material, a connection coil having a first terminal portion that is located near the IC chip and a second terminal portion that is disposed at a position closer to the IC chip than the outermost periphery of the conductor wiring; ,
forming a first through-hole and a second through-hole spaced apart from each other in a substrate;
On the second surface of the substrate, a contact terminal portion for contacting a contact-type external device and a bridging wiring electrically insulated from the contact terminal portion are arranged on the second surface of the substrate when viewed in the thickness direction of the substrate. a step of forming a bridging wiring so as to overlap the through hole and the second through hole;
attaching an IC chip to the first surface of the substrate;
connecting the first terminal of the IC chip and the bridging wiring with the first conductive wire inserted through the first through hole;
a step of connecting the bridging wire and the first terminal portion of the connection coil with a second conductive wire inserted through the second through hole;
a step of connecting a second terminal portion on the inner peripheral side of the wiring of the connection coil and a second terminal of the IC chip with a third conductive wire;
A method for manufacturing an IC module comprising the step of covering the IC chip, the first conductive line, the second conductive line, and the third conductive line with a resin sealing portion,
The step of covering the IC chip, the first conductive line, the second conductive line, and the third conductive line with the resin sealing portion includes:
A concave portion inside the dual IC card is formed in the conductive wire and wire bonding portion connecting the IC chip, the innermost terminal portion of the connection coil and the IC chip terminal, and between the IC chip terminal and the bridging wiring, respectively. A step of forming a resin sealing portion with a thickness equal to or less than the depth of
a step of forming a resin sealing portion with a thickness equal to or less than the depth of the recess on the outside of the dual IC card in the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connection coil and the bridging wiring; A method for manufacturing an IC module, characterized by comprising:

According to the IC module of the present invention, the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connection coil and the bridging wiring have the depth of the recess (first accommodating portion) on the outside of the dual IC card. The resin sealing portion is formed with a thickness that does not exceed the thickness. In addition, the conductive wires and wire bonding portions that connect the innermost terminal portion of the connection coil and the IC chip, and between the terminal of the IC chip and the bridging wiring, respectively, are recessed inside the dual IC card (second The resin sealing portion is formed with a thickness equal to or less than the depth of the accommodating portion. Also, between the contact terminal and the IC chip, the resin sealing portion having the same thickness as the resin sealing portion between the innermost terminal portion of the connecting coil and the IC chip, and between the terminal of the IC chip and the bridging wiring. may be formed. Therefore, the thickness limit of the IC module accommodating portion formed in the dual IC card substrate is not exceeded. Moreover, since the through-hole plating process is not required, it is possible to shorten the process time and reduce the manufacturing cost.

According to the dual IC card of the present invention, all wire bonding portions and conductive lines (wires) can be resin-sealed without requiring through-hole plating. Therefore, it is possible to provide a highly reliable dual IC card at low cost.

According to the IC module manufacturing method of the present invention, the IC module of the present invention can be provided.

FIG. 3 is a cross-sectional explanatory diagram illustrating an aspect of a resin-sealed portion in the IC module of the present invention; FIG. 4 is an explanatory top view showing an example of a resin sealing portion in the IC module of the present invention; FIG. 4 is an explanatory top view showing an example of a resin sealing portion in the IC module of the present invention; FIG. 3 is a cross-sectional explanatory diagram illustrating an aspect of a resin-sealed portion in the IC module of the present invention; FIG. 4 is an explanatory top view showing an example of a resin sealing portion in the IC module of the present invention; FIG. 3 is a cross-sectional explanatory diagram illustrating an aspect of a resin-sealed portion in the IC module of the present invention; FIG. 4 is an explanatory top view showing an example of a resin sealing portion in the IC module of the present invention; FIG. 4 is an explanatory top view showing an example of a resin sealing portion in the IC module of the present invention; FIG. 5 is a cross-sectional explanatory diagram illustrating an aspect of a resin sealing portion in a conventional IC module; FIG. 3 is an explanatory top view showing an example of an aspect of a conventional IC module excluding a sealing resin portion; Cross-sectional explanatory drawing which illustrated the aspect except the sealing resin part of the conventional IC module. FIG. 2 is an explanatory top view illustrating an aspect of a dual IC card; Cross-sectional explanatory drawing which illustrated the aspect of a dual IC card. FIG. 2 is an explanatory top view illustrating an aspect of a dual IC card;

<IC module>
An IC module of the present invention will be described.
The IC module of the present invention is an IC module used in an IC module accommodating portion with height restrictions.

An IC module of the present invention has a sheet-like base material, a contact communication function and a non-contact communication function, has a first terminal and a second terminal, and is provided on a first surface of the base material. a resin sealing portion provided on the first surface of the substrate so as to cover the IC chip; a connection coil provided on the first surface of the substrate and formed in a spiral shape; A contact terminal portion provided on the second surface of the base material for contacting a contact type external device, and a second terminal portion of the base material so as to be positioned in the inner region of the resin sealing portion when viewed in the thickness direction of the base material. bridging wiring provided on the surface and electrically insulated from the contact terminal portion.
A sheet-like material having a thickness of about 110 μm made of a material such as glass epoxy can be suitably used as the module base material.

The connecting coil has a terminal portion located on the outermost side of the connecting coil, a terminal portion located on the innermost side of the connecting coil, and a terminal portion located on the outermost side when viewed in the thickness direction of the base material, which is a resin-sealed portion. and a conductor wiring that is formed in a spiral shape surrounding the IC chip so as to be located in the inner region of the IC chip and that connects the outermost terminal portion and the innermost terminal portion. The connection coil can be patterned by etching a copper foil or an aluminum foil through an etching resist pattern. The thickness of the connection coil can be, for example, 5 μm to 50 μm.
Also, in the base material, a first through hole and a second through hole are formed at positions overlapping with the bridging wiring when viewed in the thickness direction of the base material and spaced apart from each other. The diameter of the through holes (also referred to as through holes) can be, for example, 300 μm to 500 μm.
Also, the first terminal of the IC chip and the bridging wiring are connected by a first conductive wire inserted through the first through hole.
Also, the bridging wiring and the outermost terminal portion of the connection coil are connected by a second conductive wire inserted through the second through hole.
The innermost terminal portion of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire.
As these conductive wires, bonding wires made of gold or copper and having a diameter of about 10 μm to 40 μm can be used.

The resin sealing portion includes conductive wires and wire bonding portions for connecting the IC chip, the innermost terminal portion of the connection coil and the terminals of the IC chip, and between the terminals of the IC chip and the bridging wiring. It has a thickness equal to or less than the depth of the second containing portion. This is equivalent to the thickness of the sealing resin portion used in IC modules using through-hole plating.
Also, the conductive wire and wire bonding portion connecting between the outermost terminal portion of the connecting coil and the bridging wiring are characterized by having a thickness equal to or less than the depth of the first accommodating portion.

In addition, the connecting coil of the IC module of the present invention includes a terminal located on the outermost side of the connecting coil, a terminal located on the innermost side of the connecting coil, and a terminal located on the outermost side when viewed in the thickness direction of the base material. A part of the terminal portion is curved toward the IC chip so that the terminal portion to be connected is located in the inner region of the resin sealing portion, and is formed in a spiral shape surrounding the IC chip. and a conductor wiring that connects the terminal portion located in the .

Next, the IC module of the present invention will be described with reference to FIGS. 10 and 11. FIG.
The IC module 30 includes a sheet-like module base (base) 33, an IC chip 34 and a connection coil 31 provided on a first surface 33a of the module base 33, and a second surface of the module base 33. It has a plurality of contact terminals (contact terminal portions) 35 and a bridge (bridging wiring) 36 provided in 33b. The module base material 33 is made of the same material as the substrate 12 and is formed in a rectangular shape in a plan view. The module base material 33 has a first through hole (first through hole) 33c and a second through hole (second through hole) 33d spaced apart from each other at positions overlapping the bridge 36 when viewed in the thickness direction D. is formed. The thickness direction of the module base material 33 coincides with the thickness direction D of the substrate 12 described above. A through hole (auxiliary through hole) 33e is formed in the module base material 33 in addition to the through holes 33c and 33d. The thickness of the module base material 33 is, for example, 50 to 200 μm. As the IC chip 34, one having a known configuration that has a contact communication function and a non-contact communication function can be used. The IC chip 34 has a first terminal 34b, a second terminal 34c and a plurality of connection terminals 34d formed on the outer surface of a chip body 34a.

The connection coil 31 is spirally formed. The connection coil 31 is wound, for example, three times around the IC chip 34 and the through holes 33c and 33e. A second through hole 33 d is formed outside the connection coil 31 . The outermost wiring end (first end) and the innermost wiring end (second end) of the connecting coil 31 are formed wider than the wiring. terminal portions 39 and 40 are provided, respectively. The connection coil 31 is formed by patterning copper foil or aluminum foil by etching. The thickness of the connection coil 31 is, for example, 5 to 50 μm. The connection coil 31 constitutes a non-contact terminal section by electromagnetic coupling with the coupling coil 18 of the card body 10 .

A plurality of contact terminals 35 and bridges 36 are formed in a predetermined pattern by laminating, for example, copper foil on the second surface 33b of the module substrate 33 . The bridge 36 is formed in an L shape so as to straddle the connection coil 31 when viewed in the thickness direction D, but it is not necessary to be limited to this (see FIG. 10). The plurality of contact terminals 35 and bridges 36 are electrically isolated from each other. A nickel layer with a thickness of 0.5 to 3 μm may be provided by plating on the portion of the copper foil exposed to the outside, and a gold layer with a thickness of 0.01 to 0.3 μm is further plated on the nickel film. may be provided. Each contact terminal 35 is for contacting a contact-type external device such as an automated teller machine. The contact terminals 35 are connected to elements (not shown) built in the chip body 34 a of the IC chip 34 . A plurality of contact terminals may be formed on the second surface 33b of the module substrate 33 by a lead frame having a thickness of 50 to 200 μm, and a connection coil may be formed on the first surface 33a of the module substrate 33 by copper wire. .

The first terminal 34b of the IC chip 34 and the bridge 36 are connected by a first wire (first conductive wire) 41 passing through the first through hole 33c. The bridge 36 and the terminal portion 39 of the connection coil 31 are connected by a second wire (second conductive wire) 42 inserted through the second through hole 33d. The terminal portion 40 of the connection coil 31 and the second terminal 34 c of the IC chip 34 are connected by a third wire (third conductive wire) 43 . In this example, the connection terminal 34d of the IC chip 34 and the contact terminal 35 are connected by a connection wire (auxiliary conductive wire) 44 inserted through the through hole 33e. The wires 41, 42, 43 and the connection wire 44 are made of gold or copper and have an outer diameter of 10 to 40 μm, for example. Thus, the IC chip 34, the connecting coil 31, the bridge 36, and the wires 41, 42, 43, 44 form a closed circuit. The first terminal 34b of the IC chip 34 and the bridge 36, and the bridge 36 and the connection coil 31 are connected by punching hole wire bonding using wires 41 and 42, respectively. The connection terminals 34 d of the IC chip 34 and the contact terminals 35 are also connected by punching hole wire bonding using the connection wires 44 . The connection coil 31 and the second terminal 34 c of the IC chip 34 are connected by wire bonding using the third wire 43 .

Next, aspects of the sealing resin portion in the IC module of the present invention will be described with reference to FIGS. 1 to 8. FIG.
FIG. 1 is a cross-sectional view illustrating an embodiment of resin sealing portions 2 and 3 in an IC module of the present invention.
Between the IC chip 34, the innermost terminal portion of the connecting coil and the terminal of the IC chip, and I
The resin sealing portion 2, which seals the conductive wires and wire bonding portions connecting the terminals of the C chip and the bridging wiring, has a thickness equal to or less than the depth of the second housing portion 25 (see FIG. 13). I have. Here, the thickness of the resin-sealed portion 2 refers to the total thickness of the resin-sealed portion including the contact terminals 35, the module substrate 33 (see FIG. 11), and the resin of the resin-sealed portion. . The same applies to other resin-sealed portions.
On the other hand, the conductive wire connecting between the outermost terminal portion of the connection coil 31 and the bridging wiring and the resin sealing portion 3 of the wire bonding portion have a thickness equal to or less than the depth of the first accommodating portion 24. .
The resin sealing portion 3 and the resin sealing portion 2 are formed apart from each other.
Between the contact terminal 35 and the IC chip, between the innermost terminal portion 40 of the connection coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36, the resin sealing portion 2 (see Figure 10).
In this manner, the thickness of the resin sealing portion is set to be equal to or less than the depth of the first accommodating portion 24 in the peripheral portion of the IC module, and the thickness of the second accommodating portion 25 in the interior other than the peripheral portion. By making the thickness equal to or less than the depth, the IC module can be accommodated in the recess 11 of the dual IC card 1 (see FIG. 13). As a result, the surface of the contact terminals 35 of the IC module and the surface of the card substrate 15 of the dual IC card are substantially flush with each other.

FIG. 2 is a top view illustrating a case where the outermost terminal portion 39 of the connection coil is positioned at the center of one side of the IC module 30 (see FIG. 10). Since the terminal portion 39 located on the outermost side is located in the center of the side of the IC module, the resin is formed in that portion so that it does not protrude outward from the outermost wiring of the connection coil 31 . A portion of the connection coil 31 is curved toward the IC chip 34 so as to be located in the inner region of the sealing portion 3 and is spirally formed so as to surround the IC chip 34 . Along with this, a through hole (also referred to as a through hole) for electrically connecting to a bridging wire (also referred to as a bridge) 36 formed on the opposite side (surface) of the surface on which the connection coil 31 is formed. 33d are formed adjacently along the direction in which the connecting coil 31 extends. Further, through holes 33e are formed to connect the contact terminals formed on the surface and the terminals of the IC chip by wire bonding.
The resin sealing portion 3 is formed thinner than the resin sealing portion 2 as illustrated in FIG.

FIG. 3 is a top view illustrating a case where the outermost terminal portion 39 of the connection coil is positioned at the corner of the IC module 30 (see FIG. 10). In this case, there is no need to change the shape of the spirally wound connection coil 31 . A position of a through hole for connecting the bridging wire 36 and the terminal portion 39 by wire bonding is arranged at a position adjacent to the terminal portion 39 . Along with this, the resin sealing portion 3-1 for resin-sealing the terminal portion 39, the through holes adjacent thereto, and the conductive lines (wires) connecting them by wire bonding has moved.
The resin sealing portion 3-1 is formed thinner than the resin sealing portion 2, as illustrated in FIG.

FIG. 4 shows the same case as in FIG. 2 except that the shapes of the resin sealing portions 3 and 3-2 are different. 2, the resin sealing portion 2 and the resin sealing portion 3 are formed apart from each other, but in FIG. 4, the resin sealing portion 2 and the resin sealing portion 3-2 are formed in contact with each other. It is In FIG. 3, similarly, the resin sealing portion 2 and the resin sealing portion 3-1 may be formed in contact with each other.
The resin sealing portion 3-2 is formed thinner than the resin sealing portion 2, as illustrated in FIG.

FIG. 5 shows an example of the top view of FIG.

FIG. 6 exemplifies a cross-sectional view of a sealing resin portion 2-1 in which the resin sealing portion 2 and the resin sealing portion 3-2 in FIG. 4 are integrally formed.

FIG. 7 illustrates a top view of FIG.

FIG. 8 illustrates a top view of a sealing resin portion 2-2 formed integrally with the sealing resin portion 2 and the sealing resin portion 3-1 in FIG.

As shown in FIGS. 1 to 5 and 10, between the IC chip 34 and the innermost terminal portion 40 of the connection coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36. , respectively, and their wire bonding portions, the resin sealing portion 2 has a thickness equal to or less than the depth of the second accommodating portion 25 (see FIG. 13). I have.
6 to 8 and 10, between the IC chip 34, the innermost terminal portion 40 of the connecting coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36. The resin sealing portions 2-1, 2-2, and 2-3 for sealing the conductive wires 41 and 43 respectively connecting between and, and wire bonding portions thereof, are provided in the second accommodating portion 25 ( (See FIG. 13).
As shown in FIGS. 1, 2 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36 and the resin sealing of the wire bonding portion The stop portion 3 has a thickness equal to or less than the depth of the first housing portion 24 (see FIG. 13).
3 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connection coil 31 and the bridging wiring 36 and the resin sealing portion 3 of the wire bonding portion -1 has a thickness equal to or less than the depth of the first housing portion 24 (see FIG. 13).
As shown in FIGS. 4, 5 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36 and resin sealing of the wire bonding portion The stop portion 3-2 has a thickness equal to or less than the depth of the first accommodating portion 24 (see FIG. 13).
FIG. 6 shows an example of a cross-sectional view taken along line AA' of the IC module illustrated in FIGS. The resin sealing portion 2 and the resin sealing portion 3-2 illustrated in FIGS. 4 and 5 were in contact with each other at their boundaries, but in FIGS. It has a stop portion 2-1. The integrated resin sealing portion 2-1 includes a resin sealing portion 2-2 and a resin sealing portion 2-3.
The resin sealing portion 2-2 connects the IC chip 34 to the innermost terminal portion 40 of the connection coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36, respectively. The conductive lines 41 and 43 and their wire bonding portions are encapsulated to a thickness equal to or less than the depth of the second housing portion 25 (see FIG. 13).
In addition, the resin sealing portion 2-3 seals the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connection coil 31 and the bridging wiring 36 and the wire bonding portion, and the thickness thereof is has a thickness equal to or less than the depth of the first housing portion 24 (see FIG. 13).

In addition, the connecting coil 31 of the IC module of the present invention has a terminal portion 39 located on the outermost side of the connecting coil 31, a terminal portion 40 located on the innermost side of the connecting coil 31, and a terminal portion 40 located on the innermost side of the connecting coil 31. A portion of the terminal portion 39 is curved toward the IC chip so that the outermost terminal portion 39 is positioned inside the resin sealing portion 3, 3-2, and is formed in a spiral shape surrounding the IC chip. and a conductive wiring connecting the terminal portion 39 located on the outermost side and the terminal portion 40 located on the innermost side.

1 to 8 exemplify the form of the encapsulating resin portion, particularly the thickness of the encapsulating resin portion, in the IC module used in the dual IC card of the present invention.
In the IC module of the present invention, the thickness of the resin sealing portion obtained by sealing the IC chip, the through holes in the peripheral portion thereof, the conductive lines, and the wire bonding portion with the sealing resin is set to the thickness of the dual IC card base material. The case is exemplified in the case where the thickness is set to be smaller than the thickness that can be accommodated in the second accommodation portion, which is a recess provided in the bottom. Similarly, the thickness of the resin sealing portion of the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connection coil and the bridging wiring is set to the depth of the first accommodating portion 24 which is shallower than the second accommodating portion. A case in which the thickness is set to be equal to or less than the thickness is exemplified.
By doing so, the IC module can be accommodated in the IC module accommodating portion, which is a concave portion provided in the card substrate of the dual IC card.

<Manufacturing Method of IC Module>
Next, a method for manufacturing an IC module according to the present invention will be described with reference to FIGS. 10 and 11. FIG.
The method for manufacturing an IC module of the present invention comprises:
A terminal portion (outermost terminal portion 39 ) and a first terminal portion 40 arranged at a position closer to the IC chip 34 than the outermost periphery of the conductor wiring, forming the connection coil 31 on the first surface 33a of the sheet-like base material 33; a step of forming a first through hole 33c and a second through hole 33d spaced apart from each other in the base material 33; 35, and the bridging wiring 36 electrically insulated from the contact terminal portion 35, so that the bridging wiring 36 overlaps the first through hole 33c and the second through hole 33d when viewed in the thickness direction of the base material 33. a step of attaching the IC chip 34 to the first surface 33a of the base material 33; a step of connecting with one conductive wire 41; a step of connecting the bridging wire 36 and the first terminal portion 39 of the connection coil 31 with a second conductive wire 42 inserted through the second through hole 33d; a step of connecting the inner peripheral side end (second terminal portion 40) of the wiring of the coil 31 and the second terminal 34c of the IC chip with a third conductive wire 43; and a step of covering the conductive line 41, the second conductive line 42, and the third conductive line 43 with the resin sealing portions 2, 2-1, 2-2 (see FIGS. 1 to 8). The manufacturing method is characterized by having the following characteristics.

The step of covering the IC chip 34, the first conductive lines 41, the second conductive lines 42, and the third conductive lines 43 with the resin sealing portions 2, 2-1, and 2-2 includes:
Conductive wires 41, 43 and wires for connecting the IC chip 34, between the innermost terminal portion 40 of the connecting coil 31 and the terminal 34c of the IC chip 34, and between the terminal 34b of the IC chip 34 and the bridging wiring 36, respectively. a step of forming the resin sealing portions 2, 2-1, 2-2 in the bonding portion with a thickness equal to or less than the depth of the recess (second accommodating portion 25) inside the dual IC card 1 (see FIG. 13); ),
The conductive wire 42 connecting between the outermost terminal portion 39 of the connection coil 31 and the bridging wiring 36 and the wire bonding portion have a depth equal to or smaller than the depth of the recess (first accommodating portion 24) on the outside of the dual IC card 1. a step of forming the resin sealing portions 3, 3-1, 3-2 with a thickness;
Also between the contact terminals 35 and the terminals of the IC chip 34, between the innermost terminal portion 40 of the connecting coil 31 and the terminal 34c of the IC chip 34, and between the terminal 34b of the IC chip 34 and the bridging wiring 36 are sealed with resin. and forming a resin sealing portion having the same thickness as the stop portions 2, 2-1, and 2-2.

<Dual IC card>
Next, the dual IC card of the present invention will be described with reference to FIGS. 12 and 13. FIG.
The dual IC card of the present invention includes the IC module of the present invention, a coupling coil 18 for electromagnetically coupling with the connection coil 31 of the IC module, and a coupling coil 18 for performing contactless communication with a contactless external device. It is characterized by comprising an antenna 13 having a main coil 19 connected to a coil 18, and a plate-like card body 10 having a recess 11 for accommodating an IC module 30 formed therein.

The concave portion 11 is formed on one surface of the card substrate 15, and seals the chip body 34a of the IC chip 34 of the IC module 30, the through holes 33c and 33e formed around it, and the conductive lines 41 and 43. 1 to 5) and the resin-sealed portions of the resin-sealed portions 2-1 and 2-2 (FIGS. 6-8) inside the connection coil 31. It is formed so that the total thickness as the thickness is equal to or less than the depth of the second accommodating portion 25 .

Resin sealing portions 3, 3-1 in which the first terminal portion (outermost terminal portion) 39, the second through hole 33d, and the second conductive wire 42 of the IC module 30 are sealed with a sealing resin. , 3-2 as an IC module is formed so as to be equal to or less than the depth of the first accommodating portion 24. As shown in FIG.

1 dual IC card 2, 2-1, 2-2, 2-3 resin sealing portion 3, 3-1, 3-2 resin sealing portion 4 resin sealing portion 10 card body 11 concave portion 11a opening 12 substrate 12a One surface 12b Second surface 12c (substrate) short side 12d Accommodating hole 12e (substrate) long side 13 antenna 14 capacitive elements 14a, 14b (capacitive element) electrode plate 15 card substrate 18 coupling coil 18a Coupling coil wiring 18b Wiring other than coupling coil 19 Main coil 19a Main coil wiring 19b Main coil wiring 20 (formed in a substantially circular shape) Terminal portion 21 (provided on second surface 12b) Connection wiring 24 First housing portion 25 Second housing portion 30 IC module 31 Connection coil 33 Module base material (base material)
33a first surface 33b second surface 33c first through hole (first through hole)
33d second through hole (second through hole)
33e through hole (auxiliary through hole)
34 IC chip 34a Chip main body 34b (IC chip) first terminal (first terminal section)
34c (IC chip) second terminal (second terminal section)
34d (IC chip) connection terminal (connection terminal part)
35 contact terminal (contact terminal part)
36 bridge (bridging wiring)
39 (outermost terminal of connection coil) terminal (first terminal)
40 (innermost of connection coil) terminal (second terminal)
41 first wire (first conductive wire)
42 second wire (second conductive wire)
43 third wire (third conductive wire)
44 connecting wire (auxiliary conducting wire)
D Substrate thickness direction R1 Region R2 (where IC module and coupling coil are placed) Region R3 (adjacent to region R1) Region R3 (where embossing can be formed)

Claims (4)

a sheet-like base material;
an IC chip having a contact-type communication function and a non-contact-type communication function, having a first terminal and a second terminal formed thereon, and provided on a first surface of a substrate;
a resin sealing portion provided on the first surface of the substrate so as to cover the IC chip;
a connecting coil provided on the first surface of the substrate and formed in a spiral shape;
a contact terminal portion provided on the second surface of the substrate for contact with a contact-type external device;
bridging wiring provided on the second surface of the substrate so as to be positioned inside the resin sealing portion when viewed in the thickness direction of the substrate and electrically insulated from the contact terminal portion; cage,
The connection coil is
a terminal portion located on the outermost side of the connection coil;
the innermost terminal portion of the connecting coil;
When viewed in the thickness direction of the substrate, the outermost terminal portion is formed in a spiral shape surrounding the IC chip so that the outermost terminal portion is located in the inner region of the resin sealing portion. and a conductor wiring that connects with the terminal portion located inside,
A first through-hole and a second through-hole spaced apart from each other are formed in the base material at positions overlapping the bridging wiring when viewed in the thickness direction of the base material,
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire inserted through the first through hole,
The bridging wiring and the outermost terminal portion of the connecting coil are connected by a second conductive wire passing through the second through hole,
the innermost terminal portion of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire,
Of the resin-encapsulated parts,
The conductive wires and wire bonding portions that connect the IC chip to the innermost terminal portion of the connecting coil and the terminals of the IC chip, and between the terminals of the IC chip and the bridging wiring, respectively, are the outermost terminals of the connecting coil. An IC module characterized by being higher than a conductive wire and a wire bonding portion connecting between the portion and the bridging wiring. a sheet-like base material;
an IC chip having a contact-type communication function and a non-contact-type communication function, having a first terminal and a second terminal formed thereon, and provided on a first surface of a substrate;
a resin sealing portion provided on the first surface of the substrate so as to cover the IC chip;
a connecting coil provided on the first surface of the substrate and formed in a spiral shape;
a contact terminal portion provided on the second surface of the substrate for contact with a contact-type external device;
bridging wiring provided on the second surface of the substrate so as to be positioned inside the resin sealing portion when viewed in the thickness direction of the substrate and electrically insulated from the contact terminal portion; cage,
The connection coil is
a terminal portion located on the outermost side of the connection coil;
the innermost terminal portion of the connecting coil;
A part is curved toward the IC chip so that the outermost terminal portion when viewed in the thickness direction of the base material is located in the inner region of the resin sealing portion, and the spiral shape surrounds the IC chip. and a conductor wiring that connects the terminal portion located on the outermost side and the terminal portion located on the innermost side,
A first through-hole and a second through-hole spaced apart from each other are formed in the base material at positions overlapping the bridging wiring when viewed in the thickness direction of the base material,
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire inserted through the first through hole,
The bridging wiring and the outermost terminal portion of the connecting coil are connected by a second conductive wire passing through the second through hole,
the innermost terminal portion of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire,
Of the resin-encapsulated parts,
The conductive wires and wire bonding portions that connect the IC chip, between the innermost terminal portion of the connecting coil and the terminals of the IC chip, and between the terminals of the IC chip and the bridging wiring, respectively, are the outermost terminals of the connecting coil. An IC module characterized by being higher than a conductive wire and a wire bonding portion connecting between the portion and the bridging wiring. an IC module according to claim 1;
An antenna having a coupling coil for electromagnetically coupling with the connection coil of the IC module, and a main coil connected to the coupling coil for performing contactless communication with a contactless external device, A dual IC card, comprising: a plate-like card body having a recess for accommodating an IC module. Spiral conductor wiring surrounding an area in which an IC chip having a contact communication function and a non-contact communication function is arranged; A step of forming a connection coil having a second terminal portion arranged at a position closer to the IC chip than the outermost periphery on the first surface of the sheet-like base material;
forming a first through-hole and a second through-hole spaced apart from each other in a substrate;
On the second surface of the substrate, a contact terminal portion for contacting a contact-type external device and a bridging wiring electrically insulated from the contact terminal portion are arranged on the second surface of the substrate when viewed in the thickness direction of the substrate. a step of forming a bridging wiring so as to overlap the through hole and the second through hole;
attaching an IC chip to the first surface of the substrate;
connecting the first terminal of the IC chip and the bridging wiring with the first conductive wire inserted through the first through hole;
a step of connecting the bridging wire and the first terminal portion of the connection coil with a second conductive wire inserted through the second through hole;
a step of connecting a second terminal portion on the inner peripheral side of the wiring of the connection coil and a second terminal of the IC chip with a third conductive wire;
A method for manufacturing an IC module comprising the step of covering the IC chip, the first conductive line, the second conductive line, and the third conductive line with a resin sealing portion,
The step of covering the IC chip, the first conductive line, the second conductive line, and the third conductive line with the resin sealing portion includes:
A concave portion inside the dual IC card is formed in the conductive wire and wire bonding portion connecting the IC chip, the innermost terminal portion of the connection coil and the IC chip terminal, and between the IC chip terminal and the bridging wiring, respectively. A step of forming a resin sealing portion with a thickness equal to or less than the depth of
a step of forming a resin sealing portion with a thickness equal to or less than the depth of the recess on the outside of the dual IC card in the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connection coil and the bridging wiring; A method of manufacturing an IC module, comprising:

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