JP7374793B2 - Dressing board and dressing method - Google Patents

Description

The present invention relates to a dressing board for dressing a cutting edge of a cutting blade, and a dressing method performed using the dressing board.

The wafer, on which multiple devices such as ICs and LSIs are divided by division lines and formed on the surface, is divided into individual device chips by a cutting machine equipped with a rotatable cutting blade having a cutting edge on the outer periphery. , used in electrical equipment such as computers.

In addition, if the cutting edge of the cutting blade of the cutting device becomes clogged and the protrusion of the diamond abrasive grains is insufficient, the dressing board can be cut with the cutting blade to perform so-called sharpening to improve the cutting edge. A conditioning operation, so-called dressing, is performed (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2000-049120

By the way, when cutting a wafer with a cutting device, there are two cases: cutting is carried out in a wet environment while supplying cutting water to the processing area to be cut by a cutting blade, and when cutting a wafer made of Mg-Sn-Si material. In some cases, cutting is performed in a dry environment by supplying cooling air to the machining area without supplying cutting water. Here, when dressing is performed using the above-mentioned dressing board, conventionally the dressing board is placed on the holding means of the cutting device, and cutting is performed while supplying water (generally cutting water) to the dressing board. In a cutting device that requires cutting with a blade and performs cutting in a dry environment, there is a problem in that it is difficult to perform wet dressing while maintaining a dry environment.

The present invention has been made in view of the above facts, and its main technical problem is to perform wet dressing while maintaining a dry environment even in a cutting device that cuts a workpiece in a dry environment. The objective is to provide a dressing board and a dressing method that can be used.

In order to solve the above-mentioned main technical problem, the present invention provides a dressing board for dressing a cutting edge of a cutting blade, which includes a flat part for dressing the cutting blade, a side wall part surrounding the outer periphery of the flat part. Provided is a dressing board having a storage area surrounded by the flat part and the side wall part.

Further, according to the present invention, a holding means for holding a workpiece, a cutting means rotatably equipped with a cutting blade having a cutting blade on the outer periphery for cutting the workpiece held by the holding means, A dressing method carried out using the dressing board of the present invention described above in a cutting device configured to include: a dressing board mounting step of mounting the dressing board on the holding means; and a dressing board mounting step of mounting the dressing board on the holding means. a water storage step of supplying and storing water in the storage area, and moving the cutting means in a direction perpendicular to the dressing board so that the cutting blade of the cutting blade in a rotating state is filled with water. There is provided a dressing method comprising at least a dressing step of entering the reservoir area and performing dressing by making an incision in the flat part.

The dressing board of the present invention includes a flat part for dressing a cutting edge of a cutting blade, and a side wall part surrounding the outer periphery of the flat part, and a storage area surrounded by the flat part and the side wall part is formed. Therefore, even when used for dressing cutting blades of cutting equipment that cuts workpieces in a dry environment, it can be used without unnecessarily polluting the environment in which the workpiece is cut. Wet dressing can be performed while maintaining the environment, and the cutting blade can be kept in good condition.

Further, the dressing method of the present invention uses the above-described dressing board of the present invention, and includes a dressing board mounting step of mounting the dressing board on a holding means, and supplying water to the storage area of the dressing board. a water storage step of storing water, and moving the cutting means in a direction perpendicular to the dressing board to cause the cutting edge of the rotating cutting blade to enter the storage area where water is stored, and and a dressing step in which dressing is performed by cutting into the workpiece, even when dressing a cutting blade of a cutting device that cuts a workpiece in a dry environment, the workpiece can be dressed. Dressing can be performed in a wet manner while maintaining a dry environment without unnecessarily polluting the environment in which the workpiece is cut, and the state of the cutting blade can be maintained in good condition.

FIG. 2 is an overall perspective view of the cutting device. FIG. 2 is an enlarged perspective view of a part of the cutting means of the cutting device shown in FIG. 1; (a) An overall perspective view of the dressing board of the present embodiment, and (b) a partially enlarged sectional view of the dressing board shown in (a). It is a perspective view showing an embodiment of a dressing board mounting process. (a) A perspective view showing a mode in which water is supplied to a dressing board in a water storage step, and (b) a perspective view showing a state in which water is stored in the dressing board. (a) A perspective view showing an embodiment of the dressing step, and (b) a conceptual diagram showing the embodiment of the dressing step shown in (a) viewed from the side.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a dressing board constructed based on the present invention and a dressing method using the dressing board will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a cutting device 1 suitable for carrying out a dressing method using the dressing board of this embodiment. The workpiece to be processed by the cutting device 1 is, for example, an Mg-Sn-Si material on which a plurality of devices D are formed on the surface 10a, which is held on an annular frame F via a dicing tape T, as shown in the figure. The wafer 10 is a raw material, and when it is divided into individual device chips, cutting is performed in a dry environment without supplying cutting water to the processing area. The cutting device 1 includes a housing 1A having a substantially rectangular parallelepiped shape, and includes a cassette 4A placed in a cassette placement area 4 of the housing 1A, and an unloading mechanism for unloading a wafer 10, which is a workpiece, from the cassette 4A to a temporary storage table 5. A loading means 3, a holding means 12 for holding the wafer 10, a conveying means 6 having a rotating arm for conveying and placing the wafer 10 carried out to the temporary holding table 5 on the chuck table 12a of the holding means 12, and a chuck. An imaging means 11 that takes an image of the wafer 10 placed and held on the table 10a, a cutting means 20 that performs cutting on the wafer 10, and transports the cut wafer 10 from the chuck table 12a to the cleaning position. A conveyance means 13 for. Although the cutting apparatus 1 shown in FIG. 1 is omitted for convenience of explanation, it is equipped with a cover that surrounds a processing area where the cutting means 20 cuts the wafer 10 held by the holding means 12. The inner space including the processing area is sealed.

Furthermore, inside the housing 1A of the cutting device 1, there are moving means for moving the holding means 12 in the direction shown by the arrow X in the figure, and movement means for moving the cutting means 20 in the direction shown by the arrow Y and the direction shown by the arrow Z. A control means (all not shown) controls the loading/unloading means 3, the conveying means 6, the holding means 12, the cutting means 20, and the moving means for moving them. is controlled.

The wafer 10 carried out from the cassette 4A to the temporary table 5 by the carry-in/out means 3 is carried by the carrying means 6 onto the chuck table 12a of the holding means 12, placed thereon, and held under suction. The wafer 10 held on the chuck table 12a is positioned below the imaging means 11, is imaged by the imaging means 11, the processing position (dividing planned line) is detected, and is then positioned below the cutting means 20. Then, based on the positional information of the planned dividing line detected by the imaging means 11, cutting is performed along the planned dividing line, and the chip is divided into individual chips. The wafer 10 that has been cut is transported to a cleaning position by the transport means 13, where it is cleaned with high pressure air or the like, and then returned to a predetermined position in the cassette 4A by the transport means 6 and the loading/unloading means 3.

FIG. 2 shows a part of the cutting means 20 in an enlarged manner. As shown in the figure, the cutting means 20 includes a housing 21 that rotatably supports a rotating shaft 23 having a cutting blade 22 with a cutting edge 22a fixed to the tip thereof, and a housing 21 that covers the cutting blade 22 at the tip of the housing 21. and an air supply means 26 for supplying cooling air to the processing area to be cut by the cutting blade 22 through the air inlet 25 of the blade cover 24. The cutting edge 22a of the cutting blade 22 of this embodiment is configured by solidifying abrasive grains made of diamond, for example, by electroforming, metal bonding, resin bonding, or the like.

By repeating the cutting process in the cutting device 1 described above, the cutting edge 22a of the cutting blade 22 becomes clogged with cutting debris, etc., and the amount of protrusion of the diamond abrasive grains becomes insufficient, resulting in a decrease in cutting ability. From then on, dressing is performed periodically or as needed. When carrying out this dressing, a dressing board 30 of this embodiment as shown in FIG. 3 is prepared.

As shown in FIG. 3(a), the dressing board 30 includes a flat part 32 and a side wall part 34 that stands upright on the outer periphery of the flat part 32 and surrounds the flat part 32. A concave storage area 36 is formed surrounded by. The dressing board 30 is formed into a plate shape by, for example, kneading green carbon carborundum (GC) abrasive grains made of silicon carbide (SiC) with resin bond made of phenolic resin containing filler. FIG. 3(b) shows an enlarged cross-section of a portion of the outer peripheral portion of the dressing board 30. As shown in FIG. As shown in the figure, the dressing board 30 has a rectangular shape with each side being 8 cm, for example, and has an overall thickness of 1 mm, a flat part 32 of 0.7 mm, and a storage area 36 of 0.3 mm in depth. has been done. Note that the shape and dimensions of the dressing board 30 are not particularly limited, and may be a shape other than a rectangle, for example, a circle. When the shape of the dressing board 30 is circular, a ring-shaped side wall portion is formed around the outer periphery of the circular flat portion.

A dressing method performed using the dressing board 30 described above will be described below with reference to FIGS. 4 to 6.

In the dressing method of this embodiment, first, the dressing board 30 is placed on the holding means 12 (for convenience of explanation, only the clamps 16 are shown) shown in FIG. In the present embodiment, a frame F to which a dicing tape T having an adhesive force is adhered to the surface thereof is placed on the holding means 12 in advance and held by suction, and the frame F is fixed by the clamp 16. The dressing board 30 is placed in the central area with the storage area 36 facing upward, and is fixed by adhering to the dicing tape T (dressing board placement step). Note that the dressing board mounting step of the present invention is not limited to this procedure; for example, the dressing board 30 is supported by the frame F via the dicing tape T in advance, and the dressing board supported by the frame F is 30 may be placed on the holding means 12 together with the dicing tape T and the frame F and held by suction.

Next, as shown in FIG. 5(a), water W is supplied to the storage area 36 of the dressing board 30, and as shown in FIG. 5(b), the storage area 36 is filled with water W. (Water storage process). Although the method of supplying water W to the storage area 36 is not particularly limited, it can be supplied using a dropper 40, for example, as shown in FIG. 5(a). When measuring an accurate amount of water and supplying it to the storage area 36, a pipette that can easily measure minute amounts of water can also be used.

Once the water storage step described above has been carried out, the holding means 12 is positioned directly below the cutting means 20, as shown in FIG. 6(a). Then, the cutting means 20 is operated to rotate the cutting blade 22 at a predetermined rotation speed (for example, 18,000 rpm) in the direction shown by arrow R1. Then, while the cutting blade 22 is being rotated, a moving means (not shown) is operated to move the cutting blade 22 of the cutting means 20 in a direction perpendicular to the dressing board 30 (indicated by arrow R2), as shown in FIG. As shown in (b), the cutting blade 22a of the cutting blade 22 enters the storage area 36 in which water W is stored, cuts into the flat portion 32, and performs dressing (dressing step). In addition, when carrying out the above-described dressing step, the holding means 12 may be moved in the direction shown by arrow A in the figure. With the above steps, the dressing method of this embodiment is completed.

The internal space including the processing area of the cutting device 1 of this embodiment is in a dry environment, and cutting water is not supplied thereto. However, water W is stored in the storage area 36 formed on the upper surface of the dressing board 30, and wet dressing can be performed without separately supplying cutting water or the like. Furthermore, since a storage area 36 whose depth is shallower (0.3 mm) than the thickness of 1 mm of the dressing board 30 is formed on the upper surface of the dressing board 30, the amount of water W used for dressing is small. Even if the cutting blade 22 cuts into the flat part 32, the environment in which the workpiece is cut is not polluted more than necessary, and wet dressing can be performed while maintaining a dry environment. The state of the cutting blade 22a can be adjusted.

1: Cutting device 1A: Housing 3: Carrying in/out means 4: Cassette mounting area 4A: Cassette 5: Temporary storage table 6: Transport means 10: Wafer 11: Imaging means 12: Holding means 12a: Chuck table 13: Transport means 20: Cutting means 21: Housing 22: Cutting blade 22a: Cutting blade 23: Rotating shaft 24: Blade cover 25: Air inlet 26: Air supply means 30: Dressing board 32: Flat part 34: Side wall part 36: Storage area 40 : Dropper F: Frame T: Dicing tape W: Water

Claims (2)

A dressing board for dressing a cutting edge of a cutting blade,
A dressing board comprising a flat part for dressing a cutting blade and a side wall part surrounding the outer periphery of the flat part, and a storage area surrounded by the flat part and the side wall part. A cutting device configured to include a holding means for holding a workpiece, and a cutting means rotatably equipped with a cutting blade having a cutting blade on the outer periphery for cutting the workpiece held by the holding means. A dressing method carried out using the dressing board according to claim 1, comprising:
a dressing board mounting step of mounting the dressing board on the holding means;
a water storage step of supplying and storing water to the storage area of the dressing board;
The cutting means is moved in a direction perpendicular to the dressing board, and the cutting edge of the rotating cutting blade enters the water storage area and cuts into the flat part. A dressing process for performing dressing;
A dressing method comprising at least: