JP7202131B2 - Transfer device and transfer method for plate-shaped work - Google Patents

Description

TECHNICAL FIELD The present invention relates to a conveying device and a conveying method for conveying a plate-like work.

A cutting device that cuts a plate-shaped work such as a semiconductor wafer held by a chuck table by cutting the plate-shaped work along the dividing line with a cutting blade does not want to damage the top surface of the plate-shaped work, so Bernoulli's principle is used. The upper surface of the plate-like work is suction-held in a non-contact manner by the transport pad used, and the work is carried into the chuck table. The transfer pad includes a block that contacts the upper surface of the outer peripheral edge of the plate-like work to prevent the plate-like work that is sucked and held in a non-contact manner from slipping (see, for example, Patent Document 1).

The transfer pad of the transfer device disclosed in Patent Document 1 prevents side slipping during transfer of the plate-like work, but does not center the plate-like work. Therefore, there is a transfer pad that can suck and hold a plate-shaped work in a non-contact manner using Bernoulli's principle (see, for example, Patent Document 2).

JP 2014-194991 A JP 2015-076469 A

The conveying apparatus for a plate-like work described in Patent Document 2 includes a centering mechanism that moves a pin toward the center of the plate-like work, and centering is performed by bringing the pin into contact with the outer peripheral edge of the plate-like work. .

Here, when holding the plate-like work on the chuck table, the plate-like work is slid onto the chuck table while the pins are kept in contact with the outer periphery of the plate-like work. As a result, there is a problem that the pin rubs the outer edge of the plate-like work, generating dust, and the dust causes processing failure.
Therefore, when a plate-shaped work is transported while being sucked and held in a non-contact manner, the plate-shaped work is held in a centered state on the chuck table without rubbing the outer peripheral edge of the plate-shaped work, or carried out from the chuck table in a centered state. There is a problem.

In order to solve the above-mentioned problems, the present invention provides suction and hold means for sucking and holding the plate-like work by injecting air from above the plate-like work toward the plate-like work to generate a negative pressure, and moving the suction and holding means. a conveying device for a plate-like work, comprising: a base connected to the moving means; and a non-contact holding part for sucking and holding the plate-shaped work without contact by injecting the above to generate a negative pressure on the upper surface of the plate-shaped work, and at least three at least three equiangularly arranged on the base around the center of the base. a centering pin for centering the plate-shaped work by contacting the outer peripheral edge of the plate-shaped work sucked and held by the non-contact holding portion ; the lower surface of the centering pin forms an inclined surface in which the outer peripheral side is lower than the center side of the base, and the non-contact holding portion sucks and holds the plate -shaped work In this conveying apparatus, the plate-like work is centered by contacting the outer peripheral edge of the plate-like work with the inclined surface.

Further, the present invention for solving the above problems is a conveying method for carrying a plate-like work onto a holding surface of a chuck table using the conveying device, wherein the non-contact holding section holds the plate-like work in a non-contact manner. a holding step of sucking and holding the inclined surface of the centering pin against the outer peripheral edge of the plate-shaped work so as to center the plate-shaped work; a carrying-in step of positioning the center of the work coaxially and bringing the suction and holding means closer to the holding surface, communicating the holding surface with a suction source, and sucking and holding the plate-shaped work by the suction force of the holding surface. transportation method.

Further, the present invention for solving the above-mentioned problems is a conveying method for conveying a plate-shaped work held by a holding surface of a chuck table using the conveying device, wherein the holding surface holds a workpiece. A suction holding preparation step in which the suction holding means is brought close to the upper surface of the plate-like workpiece being held and air is jetted from the non-contact holding portion to generate a negative pressure; a holding step of sucking and holding the plate-like work in a non-contact manner and centering the plate-like work by bringing the inclined surface of the centering pin into contact with the outer peripheral edge of the plate-like work; and separating the suction-holding means from the holding surface. and a carry-out step of carrying out the plate-like work from the holding surface.

A conveying apparatus according to the present invention includes suction and holding means for sucking and holding the plate-like work by injecting air from above the plate-like work toward the plate-like work to generate a negative pressure, and moving means for moving the suction and holding means. The suction and hold means includes a base connected to the moving means, and a plate disposed on the base for injecting air downward from above the plate-like work to generate a negative pressure on the upper surface of the plate-like work. A non-contact holding part that sucks and holds a plate-shaped work without contact, and at least three non-contact holding parts are arranged on the base at equal angles around the center of the base, and the non-contact holding parts contact the outer peripheral edge of the plate-shaped work sucked and held. and a centering pin for centering the plate-like work, the lower surface of the centering pin forming an inclined surface in which the outer peripheral side is lower than the center side of the base. The plate-like work is centered by contacting the inclined surface of the centering pin with the outer peripheral edge of the plate-like work. Then, the plate-like work is held in a state where it is centered on the chuck table without rubbing the outer peripheral edge of the plate-like work, and the center of the chuck table and the center of the plate-like work are aligned, or in a state where it is centered from the chuck table. It becomes possible to carry out the plate-shaped work.

The conveying device according to the present invention includes a plate spring that supports the centering pin so as to be movable upward with respect to the lower surface of the base and urges the centering pin downward. When unloading the plate-like work, the suction holding means is held against the plate-like work without being hindered by the frame of the chuck table or the like, up to a predetermined height position where the non-contact holding part can suction-hold the plate-like work appropriately in a non-contact manner. It is possible to bring it closer.

In the conveying method according to the present invention, in which the plate-like work is carried onto the holding surface of the chuck table using the conveying device, the non-contact holding portion sucks and holds the plate-like work in a non-contact manner, and the inclined surface of the centering pin is plate-shaped. A holding step of contacting the outer periphery of the work and centering the plate-shaped work, and positioning the center of the holding surface of the chuck table and the center of the plate-shaped work sucked and held by the non-contact holding part so as to be coaxial with each other. , bringing the holding surface into communication with the suction source, and sucking and holding the plate-like work with the suction force of the holding surface, thereby centering the plate-like work on the chuck table without rubbing the outer peripheral edge of the plate-like work. By holding the plate-like work in this state, it is possible to align the center of the chuck table with the center of the plate-like work.

In the conveying method according to the present invention, the plate-like work held by the holding surface of the chuck table is carried out from the chuck table using the conveying device. a suction holding preparation step in which the holding means is brought closer and air is jetted from the non-contact holding portion to generate negative pressure; a holding step for centering the plate-shaped work by bringing the inclined surface of the centering pin into contact with the outer peripheral edge of the plate-shaped work; a carry-out step for carrying out the plate-shaped work from the holding surface by separating the suction holding means from the holding surface of the chuck table; By providing, it is possible to carry out the plate-shaped work while it is centered from the chuck table.

A description will be given of a state in which the non-contact holding part sucks and holds the plate-shaped work placed on the mounting table in a non-contact manner, and the inclined surface of the centering pin contacts the outer peripheral edge of the plate-shaped work to center the plate-shaped work. It is a cross-sectional view. FIG. 5 is a cross-sectional view for explaining a state in which the center of the holding surface of the chuck table and the center of the plate-like workpiece sucked and held by the non-contact holding portion are positioned coaxially; FIG. 5 is a cross-sectional view for explaining a state in which the suction holding means is brought closer to the holding surface of the chuck table and the holding surface of the chuck table is communicated with the suction source; FIG. 4 is a cross-sectional view for explaining a state in which a plate-shaped work is held by suction with the suction force of the holding surface of the chuck table; FIG. 5 is a cross-sectional view for explaining a carrying-in step in the case where the plate-like work held by the suction holding means is thicker. FIG. 4 is a cross-sectional view showing a plate-shaped work being held by suction on a chuck table; FIG. 5 is a cross-sectional view for explaining a state in which the suction holding means is brought closer to the upper surface of the plate-like work held by the holding surface of the chuck table; FIG. 5 is a cross-sectional view for explaining a state in which air is jetted from the non-contact holding portion to generate negative pressure; A cross section explaining a state in which air is ejected from the holding surface, the non-contact holding part sucks and holds the plate-shaped work in a non-contact manner, and the inclined surface of the centering pin is brought into contact with the outer peripheral edge of the plate-shaped work to center the plate-shaped work. It is a diagram. FIG. 5 is a cross-sectional view for explaining a holding step and a carry-out step when the plate-like work held by the suction holding means is a plate-like work having a slightly large diameter.

Hereinafter, each process in carrying out a transfer method for carrying a plate-like work W onto the holding surface 300a of the chuck table 30 shown in FIG. 2 using the transfer device 2 shown in FIG. 1 will be described.
The plate-like work W shown in FIG. 1 is, for example, a circular plate-like semiconductor wafer whose base material is silicon. The lower surface Wa of the plate-like work W facing downward in FIG. A device (not shown) is formed in the grid-like region formed by the pattern. The lower surface Wa of the plate-like work W is protected by, for example, a protective tape (not shown) adhered thereto. The upper surface Wb of the plate-shaped workpiece W facing upward in FIG. In FIG. 1, a plate-like work W is placed on a placing table 10. As shown in FIG.
Note that the device forming surface of the plate-like workpiece W may be the surface to be held by suction by the conveying device 2 .

(1) Holding Process The conveying device 2 shown in FIG. 1 includes suction holding means 20 for sucking and holding the plate-like work W by injecting air from above the plate-like work W toward the plate-like work W to generate a negative pressure. , and moving means 21 for moving the sucking and holding means 20 .

The suction holding means 20 is fixed to the lower surface side of one end of an arm portion 221 extending horizontally via a connecting member 220 . The moving means 21 is connected to the arm portion 221, and the moving means 21 enables the arm portion 221 to move horizontally or turn on a horizontal plane (X-axis and Y-axis planes), and move in the vertical direction (Z-axis direction). ) can move up and down. The moving means 21 includes, for example, an air cylinder that vertically moves the arm portion 221 in the Z-axis direction by air pressure, a ball screw mechanism that horizontally moves the arm portion 221 by rotating a ball screw with a motor, and the like.

The suction and hold means 20 includes a base 200 connected to the moving means 21 via a connecting member 220 and an arm portion 221, and a base 200 disposed on the base 200 to inject air downward from above the plate-like workpiece W. A non-contact holding part 201 for generating a negative pressure on the upper surface Wb of the plate-like work W and sucking and holding the plate-like work W in a non-contact manner, and at least three of the non-contact holding parts 201 are arranged on the base 200 at an equal angle around the center of the base 200. A centering pin 202 is provided for centering the plate-shaped work W by bringing it into contact with the outer peripheral edge Wd of the plate-shaped work W sucked and held by the non-contact holding portion 201 .

The base 200 is formed in, for example, a circular plate shape, and a connecting member 220 is connected to the central portion of the upper surface thereof. In addition, the shape of the base 200 is not limited to the shape in this embodiment. For example, the base 200 may have an annular outer shape, and
It may be composed of a plurality of members such as an annular member and a linear member.

The non-contact holding part 201 uses Bernoulli's principle, and for example, a plurality of non-contact holding parts 201 are arranged on the lower surface of the base 200 at equal intervals in the circumferential direction and the radial direction. For example, an air supply path 201 a is formed inside the non-contact holding portion 201 having a disk-shaped outer shape, and the air supply path 201 a is an annular air ejection port formed on the bottom surface of the non-contact holding portion 201 . 201b. An air supply source 28 such as a compressor communicates with the air supply path 201 a through a communication path 200 c formed inside the base 200 . For example, an annular orifice or the like that accelerates the air supplied from the air supply source 28 to the non-contact holding portion 201 may be formed in the air supply path 201a.

In this embodiment, each centering pin 202 is supported by each leaf spring 24 fixed to the upper peripheral region of the base 200 so as to be movable upward with respect to the lower surface of the base 200 . The leaf spring 24 is a stainless steel leaf spring or a rubber leaf spring, and protrudes radially outward for a predetermined length from the outer peripheral edge of the base 200. The upper end surface of the centering pin 202 is screwed or screwed to the lower surface of the protruded portion. It is glued and fixed. In this embodiment, three centering pins 202 are arranged on the base 200 at intervals of 120 degrees in the circumferential direction, but four or more may be arranged.

The centering pin 202 extends from the plate spring 24 in the -Z direction to at least a height position lower than the lower surface of the non-contact holding portion 201 by a predetermined distance. The lower surface of the centering pin 202 forms an inclined surface 202b in which the outer peripheral side is lower than the center side of the base 200. As shown in FIG. The inclination angle of the inclined surface 202b is set to an appropriate angle (for example, 36 degrees to 55 degrees) according to the diameter and thickness of the plate-like workpiece W. That is, the lower surface of the non-contact holding part 201 and the upper surface Wb of the plate-like work W are adjusted so that the non-contact holding part 201 can maintain the negative pressure for sucking and holding the plate-like work W in contact with the inclined surface 202b. The gap between them is set to a predetermined distance.

In the holding step, first, the suction and hold means 20 is horizontally moved by the moving means 21 so that the center of the base 200 substantially coincides with the center of the plate-like work W, and the suction and hold means 20 is moved above the plate-like work W. Positioned. Furthermore, the suction holding means 20 is lowered in the -Z direction to a height position where the non-contact holding portion 201 and the upper surface Wb of the plate-like workpiece W do not come into contact with each other.

After the suction holding means 20 descends to a predetermined height position in the Z-axis direction, the air supply source 28 supplies high-pressure air to the air supply passage 201a inside the non-contact holding portion 201 through the communication passage 200c of the base 200. supply. The air supplied to the non-contact holding part 201 is accelerated through, for example, an annular orifice (not shown) in the air supply path 201a, and is jetted onto the upper surface Wb of the plate-shaped work W from the air ejection port 201b at high speed.

Since the high-pressure air jetted from the air ejection port 201b expands in diameter and decelerates until it reaches the atmospheric pressure, the Bernoulli effect works in the gap between the lower surface of the non-contact holding portion 201 and the upper surface Wb of the plate-like workpiece W. A pressure drop occurs in the central portion of the lower surface of the non-contact holding portion 201 (negative pressure is generated). That is, due to the Bernoulli effect, a suction force is generated on the upper surface Wb of the plate-like workpiece W in a region corresponding to the central portion of the lower surface of the non-contact holding portion 201 as indicated by the thick arrow R1. The suction force indicated by the thick arrow R1 is the suction force for the non-contact holding portion 201 to suck and hold the plate-like workpiece W in a non-contact state.

A plurality of non-contact holding portions 201 suck and hold the plate-shaped work W in a non-contact manner, and the inclined surface 202b of the centering pin 202 contacts the outer peripheral edge Wd of the plate-shaped work W lifted by the suction force, thereby The plate-like work W is horizontally moved (centered) while being guided by the centering pin 202 so that the center of the plate-like work W is aligned with the center of the plate-like work W accurately.
After that, the moving means 21 raises the suction and holding means 20 in the +Z direction, so that the conveying device 2 carries out the plate-like work W from the mounting table 10 .

(2) Loading Process Next, the suction holding means 20 that sucks and holds the plate-like workpiece W in a non-contact manner is moved by the moving means 21 to above the chuck table 30 shown in FIG. For example, until the plate-like work W is transferred onto the chuck table 30 by the transfer device 2, the plate-like work W is subjected to vibration due to the movement of the suction holding means 20, so that the inclined surface of the centering pin 202 is Since the outer peripheral edge Wd of the plate-like work W slides on 202b, the plate-like work W is centered in the suction holding means 20 with higher accuracy.

The chuck table 30 shown in FIG. 2 has, for example, a circular outer shape, and is made up of a holding portion 300 made of a porous member or the like, which sucks and holds the plate-shaped work W, and a frame 301 which surrounds and supports the holding portion 300 . Prepare. The holding part 300 communicates with a suction source 39 such as a vacuum generator or an ejector through an air flow path 390 , and a first opening/closing valve 391 is arranged on the air flow path 390 . By operating the suction source 39 with the first open/close valve 391 open, the suction force generated by the suction source 39 is transmitted to the holding surface 300a, which is the exposed surface of the holding portion 300, and the chuck table 30 is A plate-shaped workpiece W can be held by suction on the holding surface 300a. For example, the inner diameter of the frame 301 is smaller than the outer diameter of the plate-like work W to be held, and the outer diameter of the frame 301 is larger than the outer diameter of the plate-like work W to be held.
The chuck table 30 is not limited to the example shown in this embodiment, and may be a holding table having a holding surface formed with suction grooves or a pin chuck table having a holding surface formed by a plurality of support pins. good too.

For example, an air source 38 capable of supplying compressed air is connected to the air flow path 390 via a second opening/closing valve 392 . The air source 38 is used to separate the plate-like workpiece W sucked and held by the chuck table 30 from the holding surface 300a. That is, the air supplied from the air source 38 to the air flow path 390 with the second opening/closing valve 392 open passes through the air flow path 390, reaches the holding portion 300, and flows upward from the holding surface 300a. erupt. The plate-like work W is pushed up from the holding surface 300a by the jet pressure of this air, and the vacuum suction force remaining between the holding surface 300a and the plate-like work W (vacuum suction force remaining after stopping the suction by the suction source 39) is reduced. The plate-like work W can be reliably removed from the chuck table 30. - 特許庁

In the carry-in step, first, as shown in FIG. 2, the suction holding means 20 is moved horizontally by the moving means 21, and the center of the holding surface 300a of the chuck table 30 and the non-contact holding portions 201 are held by suction without contact. The center of the plate-shaped work W that has been formed is coaxially positioned.

Next, as shown in FIG. 3, the moving means 21 moves the lower surface Wa of the plate-like workpiece W out of contact with the holding surface 300a and prevents the lowermost end of the centering pin 202 from contacting the frame 301 of the chuck table 30. The suction holding means 20 descends in the -Z direction to a position where the upper surface comes into contact with it.
In addition, after the first open/close valve 391 is opened and the holding surface 300a is communicated with the suction source 39, the suction source 39 operates, whereby the suction force generated by the suction source 39 is transmitted to the holding surface 300a.

As shown in FIG. 4, the suction holding means 20 is further lowered by the moving means 21, so that the centering pins 202 are pushed upward (substantially vertically) by the upper surface of the frame 301 and moved. The horizontal distance between the inclined surfaces 202b is increased. In addition, the leaf spring 24 bends to store an urging force that pushes the centering pin 202 back downward.

Basically, the suction force with which the chuck table 30 draws the plate-shaped work W in the -Z direction is greater than the suction force with which the suction holding means 20 sucks and holds the plate-shaped work W, which is generated according to Bernoulli's principle. W drops vertically onto the holding surface 300a of the chuck table 30 and is held by suction on the holding surface 300a. Here, since suction forces are applied to the plate-like work W in the ±Z directions respectively, it is possible to prevent the plate-like work W from sliding horizontally when the plate-like work W falls vertically. . Therefore, the center of the plate-like workpiece W sucked and held by the chuck table 30 is aligned with the center of the holding surface 300a.
Further, since the lower surface of the centering pin 202 forms an inclined surface 202b in which the outer peripheral side is lower than the center side of the base 200, the outer peripheral edge Wd of the plate-shaped work W falls vertically. Since the inclined surface 202b is not rubbed, dust is not generated.

After the chuck table 30 sucks and holds the plate-like work W as described above, the air supply source 28 stops supplying high-pressure air to the non-contact holding portion 201 , so that the plate-like work W is sucked and held by the suction holding means 20 . The suction power that was working disappears. After that, the suction holding means 20 is separated from above the plate-like work W by the moving means 21, and the centering pin 202 returns to its original state by the biasing force stored by the plate spring 24. As shown in FIG.

For example, the lower surface Wa of the plate-like workpiece W shown in FIG. , the suction force is transmitted from the suction source 39 to the holding surface 300a of the chuck table 30, and the air supply source 28 supplies high-pressure air to the non-contact holding portion 201. Then, the suction holding of the plate-shaped work W by the suction holding means 20 is stopped.
As a result, the vertically dropped plate-like workpiece W may be sucked and held by the holding surface 300a of the chuck table 30 while being centered.

It should be noted that the method of transporting the plate-like work W onto the holding surface 300a of the chuck table 30 using the transport device 2 according to the present invention is not limited to the above embodiment. Also, the configurations of the conveying device 2 and the chuck table 30 shown in the accompanying drawings are not limited to this, and can be changed as appropriate within the scope in which the effects of the present invention can be exhibited.

For example, FIG. 5 is a cross-sectional view for explaining a carrying-in step in a carrying method for carrying a plate-like work W onto the holding surface 300a of the chuck table 30 using the carrying device 2. As shown in FIG. A plate-shaped work W2 shown in FIG. 5 is a work having a greater thickness than the plate-shaped work W shown in FIGS. The plate-shaped workpiece W2 may be, for example, a wafer or the like in which a carrier plate is attached to the wafer.

Even when the thickness of the plate-like work held by the suction holding means 20 becomes thick like the plate-like work W2, the gap between the lower surface of the non-contact holding part 201 and the upper surface W2b of the plate-like work W2 causes the Bernoulli movement. In order for the effect to work and to generate a suction force for sucking and holding the plate-like work W2, it is necessary to keep the gap at the same distance as when the plate-like work W is sucked and held by the suction holding means 20. Therefore, after the center of the holding surface 300a of the chuck table 30 and the center of the plate-like work W2 sucked and held by the non-contact holding part 201 are positioned coaxially, the moving means 21 brings the suction holding means 20 closer to the holding surface 300a. The stop height position when the plate-shaped work W2 is stopped by pressing, that is, the height position of the lower surface W2a of the plate-shaped work W2 changes.

Here, since the conveying device 2 recognizes information (set value) about the thickness of the plate-shaped work W2 in advance, the height position at which the suction and hold means 20 is stopped is determined from the set value, whereby the plate-shaped work W2 can be It is possible to align the center of the chuck table 30 with the center of the plate-like work W2 by holding the plate-like work W2 in a state of being centered on the chuck table 30 without rubbing the outer peripheral edge W2d of the work W2.
In the case of a plate-shaped work W2 having a large thickness, after the suction holding means 20 is brought close to the holding surface 300a to bring the lower surface W2a of the plate-shaped work W2 into contact with the holding surface 300a, the plate-shaped work W2 is held by the holding surface 300a. You can hold it with suction.

Hereinafter, each process in carrying out a carrying method for carrying out the plate-like workpiece W sucked and held by the holding surface 300a of the chuck table 30 shown in FIG. 5 from the chuck table 30 will be described.

(1) Suction and holding preparation step First, as shown in FIG. 7, the moving means 21 moves the suction and holding means 20 so that the center of the base 200 substantially coincides with the center of the plate-like workpiece W sucked and held by the chuck table 30. , and the base 200 is positioned above the plate-like work W. As shown in FIG. Furthermore, the suction holding means 20 is lowered in the -Z direction to a height position where the non-contact holding portion 201 and the upper surface Wb of the plate-like workpiece W do not come into contact with each other. In this state, the outer peripheral edge Wd of the plate-like workpiece W is surrounded by the inclined surface 202b of the centering pin 202. As shown in FIG.
Further, an inclined surface 202b is formed so that the outer peripheral edge Wd of the plate-like workpiece W and the inclined surface 202b of the centering pin 202 do not come into contact with each other when the lowermost end of the centering pin 202 is in contact with the upper surface of the frame 301. Good.

As shown in FIG. 8, the suction holding means 20 is further lowered by the moving means 21, so that the centering pins 202 are pushed upward (substantially vertically) by the upper surface of the frame 301 and moved. The horizontal distance between the inclined surfaces 202b is increased. The leaf spring 24 bends to store an urging force that pushes the centering pin 202 back downward. In addition, the air supply source 28 supplies air to each non-contact holding portion 201, so that the area on the upper surface Wb of the plate-like workpiece W corresponding to the central portion of the lower surface of the non-contact holding portion 201 is sucked upward. A force is generated (negative pressure is generated).
As in this embodiment, the centering pin 202 of the suction holding means 20 can be moved upward with respect to the lower surface of the base 200 by the plate spring 24, so that the non-contact holding portion 201 can hold the plate-like workpiece W appropriately. The suction and hold means 20 can be brought close to the plate-like work W without being blocked by the frame 301 of the chuck table 30 to a predetermined height position where it can be held by suction without contact.

(2) Holding Step As shown in FIG. 8, the first open/close valve 391 is closed, and the suction force of the holding surface 300a disappears. Further, after the second opening/closing valve 392 is opened, the air source 38 supplies air to the chuck table 30, and the supplied air is ejected upward from the holding surface 300a. Then, the vacuum suction force remaining between the holding surface 300a and the plate-like work W is eliminated by the ejected air, and the suction holding means 20 can reliably separate the plate-like work W from the chuck table 30 and hold it by suction. state.

As a result, as shown in FIG. 9, the plurality of non-contact holding portions 201 suck and hold the plate-like work W in a non-contact manner, thereby bringing the plate-like work W closer to the plurality of non-contact holding portions 201, and the centering pin The plate-like work W is attached to the centering pin so that the center of the base 200 and the center of the plate-like work W are precisely matched by the inclined surface 202b of the plate-like work W coming into contact with the outer peripheral edge Wd of the plate-like work W that has risen. 202 to move horizontally (centered).

(3) Unloading Step The moving unit 21 raises the suction holding unit 20 in the +Z direction to separate it from the holding surface 300a of the chuck table 30, whereby the plate-like workpiece W is unloaded from the chuck table 30 by the conveying device 2. be. Also, the centering pins 202 try to return to their original state by the urging force stored by the leaf springs 24, and the horizontal distance between the inclined surfaces 202b of the centering pins 202 is such that the inclined surfaces 202b of the plate-like workpiece W Since the plate-like work W is about to shrink to the original distance while maintaining contact with the outer peripheral edge Wd, the state in which the plate-like work W is centered in the suction holding means 20 is maintained.

For example, until the plate-shaped work W is transported to the next carry-in location by the transport device 2, the plate-shaped work W receives vibration due to the movement of the suction and hold means 20, so that the inclined surface of the centering pin 202 is moved. Since the outer peripheral edge Wd of the plate-like work W slides on 202b, the plate-like work W is centered in the suction holding means 20 with higher accuracy.

It should be noted that the method of transporting the plate-shaped work W held by the holding surface 300a of the chuck table 30 using the transport device 2 according to the present invention is not limited to the above embodiment. Also, the configurations of the conveying device 2 and the chuck table 30 shown in the accompanying drawings are not limited to this, and can be changed as appropriate within the scope in which the effects of the present invention can be exhibited.

For example, FIG. 10 is a cross-sectional view for explaining a holding step and a carrying-out step in a carrying method for carrying out from the chuck table 30 the plate-shaped work W1 sucked and held by the holding surface 300a of the chuck table 30. As shown in FIG. A plate-like work W1 shown in FIG. 10 has a diameter slightly larger than that of the plate-like work W shown in FIGS. Even if the diameter of the plate-like work held by the suction holding means 20 is slightly increased like the plate-like work W1, air is jetted from the holding surface 300a of the chuck table 30 to hold the work in a non-contact manner. The portion 201 can suck and hold the plate-like work W1 without contact, and the inclined surface 202b of the centering pin 202 can be brought into contact with the outer peripheral edge W1d of the plate-like work W1 to center the plate-like work W1.

That is, in order for the Bernoulli effect to work in the gap between the lower surface of the non-contact holding part 201 and the upper surface W1b of the plate-like work W1 and to generate a suction force for sucking and holding the plate-like work W1, the gap must be set to a predetermined value. you have to keep your distance. Here, the conveying device 2 includes a plate spring 24 that supports the centering pin 202 so as to be movable upward with respect to the lower surface of the base 200 and biases the centering pin 202 downward. Therefore, in the holding step, even after the inclined surfaces 202b of the centering pins 202 come into contact with the outer peripheral edge W1d of the plate-like workpiece W1, the distance in the horizontal direction between the inclined surfaces 202b of the centering pins 202 is the same as that of the inclined surfaces 202b. By expanding while maintaining contact with the outer peripheral edge W1d of the work W1, the upper surface W1b of the plate-like work W1 can be brought closer to the non-contact holding portion 201 so that the gap becomes a predetermined distance. At the same time, while the outer peripheral edge W1d of the plate-like work W1 is in contact with the inclined surface 202b of the centering pin 202, the plate-like work W1 can move horizontally so as to be centered while being pushed downward by the centering pin 202.

Further, as shown in FIG. 10, even when the suction holding means 20 is separated from the holding surface 300a of the chuck table 30 and the plate-shaped work W1 is carried out from the holding surface 300a, the centering pin 202 is pushed downward by the leaf spring 24. In other words, the horizontal distance between the inclined surfaces 202b of the centering pins 202 is reduced to the original distance, so that the inclined surfaces 202b are kept in contact with the outer peripheral edge W1d of the plate-like workpiece W1. As a result, the state in which the plate-like work W1 is centered in the suction holding means 20 is maintained.

W: Plate-like work Wb: Upper surface of plate-like work 2: Conveying device 20: Suction holding means 200: Base 200c: Communication path 201: Non-contact holding part 201a: Air supply path 201b: Air ejection port 202: Centering pin 202b : Inclined surface of centering pin 21: Moving means 220: Connecting member 221: Arm portion 24: Leaf spring 28: Air supply source
30: Chuck table 300: Holding portion 300a: Holding surface 301: Frame body 39: Suction source 390: Air flow path 391: First opening/closing valve 38: Air source 392: Second opening/closing valve

Claims (3)

Conveying a plate-shaped work comprising suction and holding means for sucking and holding the plate-shaped work by injecting air from above the plate-shaped work toward the plate-shaped work to generate negative pressure, and moving means for moving the suction and holding means a device,
The suction and hold means includes a base connected to the moving means, and a plate-like work which is disposed on the base and ejects air from above the plate-like work downward to generate a negative pressure on the upper surface of the plate-like work. a non-contact holding part for sucking and holding the workpiece in a non-contact manner; and at least three of the plate-shaped workpieces are arranged on the base at equal angles around the center of the base, and the outer periphery of the plate-shaped workpiece sucked and held by the non-contact holding parts. a centering pin for centering the plate-shaped work by contacting the base, and a leaf spring for supporting the centering pin so as to be movable upward with respect to the lower surface of the base and urging the centering pin downward ,
The lower surface of the centering pin forms an inclined surface whose outer peripheral side is lower than the center side of the base, and when the non-contact holding portion sucks and holds the plate-shaped work, the outer peripheral edge of the plate-shaped work contacts the inclined surface. A conveying device for centering plate-like workpieces. A conveying method for carrying a plate-shaped work onto a holding surface of a chuck table using the conveying device according to claim 1,
a holding step in which the non-contact holding portion sucks and holds the plate-shaped work in a non-contact manner, and the inclined surface of the centering pin contacts the outer peripheral edge of the plate-shaped work to center the plate-shaped work;
The center of the holding surface of the chuck table and the center of the plate-like workpiece sucked and held by the non-contact holding portion are positioned coaxially, and the suction holding means is brought close to the holding surface to communicate the holding surface with a suction source. and a carrying-in step of sucking and holding the plate-shaped work with the suction force of the holding surface. A conveying method for unloading a plate-shaped work held by a holding surface of a chuck table using the conveying device according to claim 1, the conveying method comprising:
a suction holding preparation step of causing the suction holding means to approach the upper surface of the plate-shaped work held by the holding surface and injecting air from the non-contact holding portion to generate negative pressure;
A holding step of blowing air from the holding surface, sucking and holding the plate-shaped work by the non-contact holding portion in a non-contact manner, and centering the plate-shaped work by bringing the inclined surface of the centering pin into contact with the outer peripheral edge of the plate-shaped work. When,
and a carrying-out step of separating the suction holding means from the holding surface and carrying out the plate-shaped work from the holding surface.

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