JP7288497B2 - 基板把持装置とこれを含む液処理装置、及び基板処理設備 - Google Patents
基板把持装置とこれを含む液処理装置、及び基板処理設備 Download PDFInfo
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Description
Claims (20)
- 基板処理設備において基板を把持するための基板把持装置であって、
前記基板を支持し、回転可能に構成されたチャックと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記チャックの上部に設けられ前記チャックと共に回転し、前記回転ギヤに結合して前記チャックに対して回転可能に構成されたチャックピンと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部と接触する接触位置と前記基板に対する接触が解除される外部位置との間で移動可能に構成される、基板把持装置。 - 前記ギヤボックスは、
前記回転ギヤが配置される空間を提供するギヤボックスハウジングと、
前記チャックに固定されるように結合し、前記ギヤボックスハウジングを直線移動させるための経路を提供するリニアガイドと、を含む、請求項1に記載の基板把持装置。 - 前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤをさらに含む、請求項1に記載の基板把持装置。
- 基板処理設備において基板を把持するための基板把持装置であって、
回転可能に構成されたチャックと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記回転ギヤに結合して回転可能に構成され、前記基板の側面部と接触するように設けられたチャックピンと、
前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部に接触する接触位置と、前記基板に対する接触が解除される外部位置との間で移動可能に構成され、
前記角度調節ギヤは、前記基板を下方から支持するサポートピンに結合し、前記サポートピンの回転によって前記チャックピンの回転が調節される、基板把持装置。 - 前記回転ギヤに噛み合うように結合し、前記ギヤボックスの外部に延びるように設けられたウォームギヤをさらに含む、請求項1に記載の基板把持装置。
- 前記ウォームギヤを回転駆動させるための駆動源をさらに含む、請求項5に記載の基板把持装置。
- 前記チャックピンが回転しないように固定させるストッパーをさらに含む、請求項1に記載の基板把持装置。
- 前記ギヤボックスの内部に薬液が浸透することを防止するためのオイルシール(oil
seal)をさらに含む、請求項1に記載の基板把持装置。 - 基板を支持する基板支持ユニットと、
前記基板に薬液を供給する処理液供給ユニットと、を含み、
前記基板支持ユニットは、
前記基板を支持し、回転可能に構成されたチャックと、
前記チャックに固定されて前記基板を下方から支持するサポートピンと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記チャックの上部に設けられ前記チャックと共に回転し、前記回転ギヤに結合して前記チャックに対して回転可能に構成されたチャックピンと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部に接触する接触位置と、前記基板に対する接触が解除される外部位置との間で移動可能に構成される、液処理装置。 - 前記ギヤボックスは、
前記回転ギヤが配置される空間を提供するギヤボックスハウジングと、
前記チャックに固定されるように結合し、前記ギヤボックスハウジングを直線移動させるための経路を提供するリニアガイドと、を含む、請求項9に記載の液処理装置。 - 前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤをさらに含む、請求項9に記載の液処理装置。
- 基板を支持する基板支持ユニットと、
前記基板に薬液を供給する処理液供給ユニットと、を含み、
前記基板支持ユニットは、
回転可能に構成されたチャックと、
前記チャックに固定されて前記基板を下方から支持するサポートピンと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記回転ギヤに結合して回転可能に構成され、前記基板の側面部と接触するように設けられたチャックピンと、
前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部に接触する接触位置と、前記基板に対する接触が解除される外部位置との間で移動可能に構成され、
前記角度調節ギヤは、前記サポートピンに結合し、前記サポートピンの回転によって前記チャックピンの回転が調節される、液処理装置。 - 前記回転ギヤに噛み合うように結合し、前記ギヤボックスの外部に延びるように設けられたウォームギヤをさらに含む、請求項9に記載の液処理装置。
- 前記ウォームギヤを回転駆動させるための駆動源をさらに含む、請求項13に記載の液処理装置。
- 前記チャックピンが回転しないように固定させるストッパーをさらに含む、請求項9に記載の液処理装置。
- 基板の収納されたキャリアが載置されるロードポート、及び前記基板を搬送するためのインデックスロボットを備えるインデックスモジュールと、
前記基板を一時積載するバッファユニット、及び前記基板に対する液処理工程を行う工程チャンバーを備える工程処理モジュールと、を含み、
前記工程チャンバーは、
前記基板を支持する基板支持ユニットと、
前記基板に薬液を供給する処理液供給ユニットと、を含み、
前記基板支持ユニットは、
前記基板を支持し、回転可能に構成されたチャックと、
前記チャックに固定されて前記基板を下方から支持するサポートピンと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記チャックの上部に設けられ前記チャックと共に回転し、前記回転ギヤに結合して前記チャックに対して回転可能に構成されたチャックピンと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部に接触する接触位置と、前記基板に対する接触が解除される外部位置との間で移動可能に構成される、基板処理設備。 - 前記ギヤボックスは、
前記回転ギヤが配置される空間を提供するギヤボックスハウジングと、
前記チャックに固定されるように結合し、前記ギヤボックスハウジングを直線移動させるための経路を提供するリニアガイドと、を含む、請求項16に記載の基板処理設備。 - 前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤをさらに含む、請求項16に記載の基板処理設備。
- 基板の収納されたキャリアが載置されるロードポート、及び前記基板を搬送するためのインデックスロボットを備えるインデックスモジュールと、
前記基板を一時積載するバッファユニット、及び前記基板に対する液処理工程を行う工程チャンバーを備える工程処理モジュールと、を含み、
前記工程チャンバーは、
前記基板を支持する基板支持ユニットと、
前記基板に薬液を供給する処理液供給ユニットと、を含み、
前記基板支持ユニットは、
回転可能に構成されたチャックと、
前記チャックに固定されて前記基板を下方から支持するサポートピンと、
前記チャックに設けられるギヤボックスと、
前記ギヤボックスの内部に備えられる回転ギヤと、
前記回転ギヤに結合して回転可能に構成され、前記基板の側面部と接触するように設けられたチャックピンと、
前記回転ギヤに噛み合うように結合し、前記回転ギヤの回転を調節するように構成される角度調節ギヤと、を含み、
前記ギヤボックスは、前記チャックピンが、前記基板の側面部に接触する接触位置と、前記基板に対する接触が解除される外部位置との間で移動可能に構成され、
前記角度調節ギヤは、前記サポートピンに結合し、前記サポートピンの回転によって前記チャックピンの回転が調節される、基板処理設備。 - 前記回転ギヤに噛み合うように結合し、前記ギヤボックスの外部に延びるように設けられたウォームギヤをさらに含む、請求項16に記載の基板処理設備。
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JP3343503B2 (ja) * | 1997-12-12 | 2002-11-11 | 東京エレクトロン株式会社 | 洗浄装置 |
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US6405739B1 (en) | 1999-11-09 | 2002-06-18 | Liu Yu-Tsai | Spin chuck capable of providing simultaneous dual-sided processing |
JP2005244196A (ja) | 2004-01-27 | 2005-09-08 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
JP2007044693A (ja) | 2006-10-17 | 2007-02-22 | Dainippon Screen Mfg Co Ltd | 洗浄装置 |
JP2008135750A (ja) | 2006-11-28 | 2008-06-12 | Semes Co Ltd | スピンヘッド及び前記スピンヘッドを備える基板処理装置 |
US20120325275A1 (en) | 2011-06-22 | 2012-12-27 | Nexx Systems, Inc. | Substrate holder |
JP2017069261A (ja) | 2015-09-28 | 2017-04-06 | 株式会社Screenホールディングス | 基板処理装置 |
JP2018195680A (ja) | 2017-05-16 | 2018-12-06 | 株式会社荏原製作所 | 基板洗浄装置および基板処理装置 |
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