JP7287348B2 - resin composition - Google Patents

Description

The present invention relates to resin compositions. Furthermore, it relates to a resin sheet, a circuit board, and a semiconductor chip package containing the resin composition.

In recent years, the demand for compact, high-performance electronic devices such as smartphones and tablet devices has increased, and along with this, insulating materials that can be used as sealing layers and insulating layers for these small electronic devices have also become more functional. It has been demanded. As such an insulating material, for example, those described in Patent Documents 1 and 2 are known.

WO2019/044803 WO2019/131413

In recent years, there has been a demand for smaller electronic devices, and thinner insulation layers or sealing layers used in the electronic devices have been demanded. Warping tends to occur more easily when the insulating layer or sealing layer is made thinner, so an insulating layer or sealing layer capable of suppressing warping is desired. In addition, the insulating layer or the sealing layer is also desired to have high bonding strength with other layers.

The present invention has been invented in view of the above problems, and a resin composition capable of obtaining a cured product having high bonding strength and suppressed warping; a resin using the resin composition A sheet, a circuit board, and a semiconductor chip package;

As a result of intensive studies to solve the above problems, the present inventors have found that at least one curing agent selected from (A) an epoxy resin, (B) an acid anhydride curing agent, an amine curing agent, and a phenolic curing agent The present inventors have found that the above problems can be solved by a resin composition containing a combination of a curing agent, (C) a polyester polyol resin having a predetermined amount of an aromatic structure, and (D) an inorganic filler, and completed the present invention.
That is, the present invention includes the following contents.
[1] (A) epoxy resin,
(B) at least one curing agent selected from acid anhydride curing agents, amine curing agents, and phenolic curing agents;
(C) a polyester polyol resin having an aromatic structure, and (D) an inorganic filler,
A resin composition in which the content of component (C) is 2% by mass or more and 20% by mass or less when the non-volatile component in the resin composition is taken as 100% by mass.
[2] The resin composition according to [1], wherein the component (A) contains a condensed ring skeleton.
[3] The resin composition according to [1] or [2], wherein the terminal of component (C) is either a hydroxy group or a carboxyl group.
[4] Any one of [1] to [3], wherein the content of component (D) is 60% by mass or more and 95% by mass or less when the non-volatile component in the resin composition is 100% by mass. of the resin composition.
[5] The resin composition according to any one of [1] to [4], wherein component (C) is a resin having a polyester-derived structure and a polyol-derived structure.
[6] The resin composition according to [5], wherein the polyol-derived structure includes any one of an ethylene oxide structure, a propylene oxide structure, and a butylene oxide structure.
[7] The resin composition according to any one of [1] to [6], wherein component (C) has a bisphenol skeleton.
[8] The content when the non-volatile component in the resin composition of component (C) is 100% by mass is c1, and the content when the non-volatile component in the resin composition of component (D) is 100% by mass The resin composition according to any one of [1] to [7], wherein d1/c1 is 5 or more and 70 or less, where d1 is the amount.
[9] The resin composition according to any one of [1] to [8], which is used for a sealing layer.
[10] A resin sheet comprising a support and a resin composition layer containing the resin composition according to any one of [1] to [9] provided on the support.
[11] A circuit board comprising a cured product layer formed from a cured product of the resin composition according to any one of [1] to [9].
[12] A semiconductor chip package including the circuit board according to [11] and a semiconductor chip mounted on the circuit board.
[13] A semiconductor chip package comprising a semiconductor chip sealed with the resin composition according to any one of [1] to [9] or the resin sheet according to [10].

According to the present invention, a resin composition capable of obtaining a cured product having high bonding strength and suppressed warping; a resin sheet, a circuit board, and a semiconductor chip package using the resin composition can provide.

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be arbitrarily modified without departing from the scope of the claims of the present invention and their equivalents.

[Resin composition]
The resin composition of the present invention comprises (A) an epoxy resin, (B) at least one curing agent selected from an acid anhydride curing agent, an amine curing agent, and a phenolic curing agent, and (C) an aromatic structure. and (D) an inorganic filler, and the content of the component (C) is 2% by mass or more and 20% by mass or less when the nonvolatile component in the resin composition is 100% by mass. be. By using such a resin composition, it is possible to obtain a cured product having high bonding strength and suppressed warping. Moreover, in the present invention, a cured product having a low coefficient of thermal expansion (CTE) can be obtained.

The cured product of this resin composition can be preferably used as an insulating layer or a sealing layer of a circuit board and a semiconductor chip package by taking advantage of its excellent properties, and can be particularly preferably used as a sealing layer.

The resin composition may further contain optional components in combination with components (A) to (D). Examples of optional components include (E) a curing accelerator, (F) a solvent, and (G) other additives. Each component contained in the resin composition will be described in detail below.

<(A) Epoxy resin>
The resin composition contains (A) an epoxy resin as the (A) component. (A) Epoxy resins include, for example, bixylenol type epoxy resin; bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol S type epoxy resin; bisphenol AF type epoxy resin; Epoxy resin; Phenol novolak type epoxy resin; Glycidylamine type epoxy resin; Glycidyl ester type epoxy resin; Cresol novolak type epoxy resin; Biphenyl type epoxy resin; Linear aliphatic epoxy resin; Resin; heterocyclic epoxy resin; spiro ring-containing epoxy resin; cyclohexane type epoxy resin; cyclohexane dimethanol type epoxy resin; trimethylol type epoxy resin; tetraphenylethane type epoxy resin; naphthylene ether type epoxy resin, tert-butyl- Epoxy resins containing condensed ring skeletons, such as catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, and naphthol-novolac-type epoxy resins. Epoxy resins may be used singly or in combination of two or more. Among them, (A) the epoxy resin preferably contains an epoxy resin containing a condensed ring skeleton from the viewpoint of obtaining the effects of the present invention remarkably.

The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as (A) the epoxy resin. From the viewpoint of obtaining the desired effects of the present invention remarkably, the ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the non-volatile components of the epoxy resin (A) is preferably 50% by mass. % or more, more preferably 60 mass % or more, and particularly preferably 70 mass % or more.

Epoxy resins include liquid epoxy resins at a temperature of 20° C. (hereinafter sometimes referred to as “liquid epoxy resins”) and solid epoxy resins at a temperature of 20° C. (hereinafter sometimes referred to as “solid epoxy resins”). ). As the epoxy resin (A), the resin composition may contain only a liquid epoxy resin, may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin. However, from the viewpoint of obtaining the effect of the present invention remarkably, it is preferable that only the liquid epoxy resin is contained.

A liquid epoxy resin having two or more epoxy groups in one molecule is preferable as the liquid epoxy resin.

Examples of liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolac type epoxy resin, and an ester skeleton. An alicyclic epoxy resin, a cyclohexane type epoxy resin, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and an alicyclic epoxy resin having an ester skeleton and a naphthalene type epoxy resin are preferable. more preferred.

Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC; 828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical Corporation "jER807", "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical Corporation "jER152" (phenol novolac type epoxy resin); Mitsubishi Chemical Corporation "630", "630LSD" (glycidylamine type epoxy resin); Nippon Steel & Sumikin Chemical Co., Ltd. "ZX1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); Nagase ChemteX Co., Ltd. "EX -721" (glycidyl ester type epoxy resin); Daicel's "Celoxide 2021P" (alicyclic epoxy resin having an ester skeleton); Daicel's "PB-3600" (epoxy resin having a butadiene structure); Nippon Steel "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Sumikin Chemical Co., Ltd., and the like can be mentioned. These may be used individually by 1 type, and may be used in combination of 2 or more types.

The solid epoxy resin is preferably a solid epoxy resin having 3 or more epoxy groups per molecule, more preferably an aromatic solid epoxy resin having 3 or more epoxy groups per molecule.

Solid epoxy resins include bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, tetraphenylethane type epoxy resin, and more preferably naphthalene type epoxy resin.

Specific examples of solid epoxy resins include "HP4032H" (naphthalene-type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resin) manufactured by DIC; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200" (dicyclopentadiene type epoxy resin) manufactured by DIC Corporation; DIC's "HP-7200HH", "HP-7200H", "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" ( Naphthylene ether type epoxy resin); Nippon Kayaku Co., Ltd. "EPPN-502H" (trisphenol type epoxy resin); Nippon Kayaku Co., Ltd. "NC7000L" (naphthol novolac type epoxy resin); "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin); "ESN475V" (naphthol type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; type epoxy resin); "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX4000HK" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; YX8800" (anthracene type epoxy resin); Osaka Gas Chemicals Co., Ltd. "PG-100", "CG-500"; Mitsubishi Chemical Co., Ltd. "YL7760" (bisphenol AF type epoxy resin); Mitsubishi Chemical Co., Ltd. "YL7800 (fluorene type epoxy resin); Mitsubishi Chemical Corp.'s "jER1010" (solid bisphenol A type epoxy resin); Mitsubishi Chemical Corp.'s "jER1031S" (tetraphenylethane type epoxy resin). These may be used individually by 1 type, and may be used in combination of 2 or more types.

(A) When a liquid epoxy resin and a solid epoxy resin are used in combination as the epoxy resin, the ratio by mass (liquid epoxy resin:solid epoxy resin) is preferably 1:0.1 to 1:0.1. :20, more preferably 1:1 to 1:10, particularly preferably 1:1.5 to 1:5. The desired effect of the present invention can be remarkably obtained by setting the amount ratio of the liquid epoxy resin to the solid epoxy resin within such a range. In addition, it usually provides moderate tackiness when used in the form of a resin sheet. In addition, when used in the form of a resin sheet, sufficient flexibility is usually obtained, and handleability is improved. Furthermore, usually, a cured product having sufficient breaking strength can be obtained.

(A) The epoxy equivalent of the epoxy resin is preferably 50 g/eq. ~5000g/eq. , more preferably 50 g/eq. ~3000g/eq. , more preferably 80 g/eq. ~2000 g/eq. , even more preferably 110 g/eq. ~1000g/eq. is. Within this range, the crosslink density of the cured product of the resin composition layer is sufficient, and an insulating layer with a small surface roughness can be obtained. Epoxy equivalent weight is the weight of an epoxy resin containing one equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

(A) The weight average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 100 to 4,000, and still more preferably 200 to 5,000, from the viewpoint of significantly obtaining the desired effects of the present invention.
The weight average molecular weight of the resin can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.

(A) From the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability, the content of the epoxy resin is preferably 1% by mass or more, when the non-volatile component in the resin composition is 100% by mass. It is preferably 2% by mass or more, more preferably 3% by mass or more. The upper limit of the epoxy resin content is preferably 30% by mass or less, more preferably 25% by mass or less, and particularly preferably 20% by mass or less, from the viewpoint of significantly obtaining the desired effects of the present invention. In the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is 100% by mass, unless otherwise specified.

<(B) At least one curing agent selected from acid anhydride-based curing agents, amine-based curing agents, and phenol-based curing agents>
The resin composition contains (B) at least one curing agent selected from acid anhydride-based curing agents, amine-based curing agents, and phenol-based curing agents as component (B). The curing agent usually has the function of curing the resin composition by reacting with the component (A). In addition to the function of curing, it is possible to obtain a cured product in which the occurrence of warpage is suppressed. (B) component may be used individually by 1 type, and may be used in combination of 2 or more types.

Acid anhydride curing agents include curing agents having one or more acid anhydride groups in one molecule. Specific examples of acid anhydride curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylnazic. acid anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1, 2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3 ,3′-4,4′-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho [ Polymer-type acid anhydrides such as 1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), styrene/maleic acid resin obtained by copolymerizing styrene and maleic acid, and the like. be done.

A commercially available acid anhydride curing agent may be used, for example, "MH-700" manufactured by Shin Nippon Rika Co., Ltd., and the like.

Amine-based curing agents include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Among them, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. Amine-based curing agents are preferably primary amines or secondary amines, more preferably primary amines. Specific examples of amine-based curing agents include 4,4′-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, and 3,3′. -diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl- 4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane Diamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3- bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4′-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, and the like.

Commercially available amine-based curing agents may be used. Kayahard AS", "Epicure W" manufactured by Mitsubishi Chemical Co., Ltd., and the like.

Phenolic curing agents include curing agents having one or more, preferably two or more, hydroxyl groups bonded to an aromatic ring (benzene ring, naphthalene ring, etc.) per molecule. Among them, a compound having a hydroxyl group bonded to a benzene ring is preferred. Moreover, from the viewpoint of heat resistance and water resistance, a phenol-based curing agent having a novolak structure is preferable. Furthermore, from the viewpoint of adhesion, a nitrogen-containing phenolic curing agent is preferable, and a triazine skeleton-containing phenolic curing agent is more preferable. In particular, a triazine skeleton-containing phenol novolak curing agent is preferable from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion.

Specific examples of phenol-based curing agents include "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiwa Kasei; CBN", "GPH"; DIC's "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", " LA-3018-50P", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", "KA-1165"; GDP-6115H", "ELPC75"; and "2,2-diallylbisphenol A" manufactured by Sigma-Aldrich.

The content of component (B) is preferably 0.1% by mass or more, more preferably 0.2% by mass, based on 100% by mass of non-volatile components in the resin composition, from the viewpoint of significantly obtaining the effects of the present invention. % or more, more preferably 0.3 mass % or more, preferably 20 mass % or less, more preferably 15 mass % or less, still more preferably 10 mass % or less.

When the number of epoxy groups in component (A) is 1, the number of active groups in component (B) is preferably 0.1 or more, more preferably 0.3 or more, still more preferably 0.5 or more, and preferably 2. Below, more preferably 1.8 or less, still more preferably 1.5 or less. Here, "the number of epoxy groups of component (A)" is the sum of all the values obtained by dividing the mass of the non-volatile component of component (A) present in the resin composition by the epoxy equivalent. Further, "the number of active groups of component (B)" is the sum of all the values obtained by dividing the mass of the non-volatile components of component (B) present in the resin composition by the active group equivalent. When the number of active groups of component (B) is within the above range when the number of epoxy groups of component (A) is 1, the desired effect of the present invention can be remarkably obtained.

<(C) Polyester polyol resin having an aromatic structure>
The resin composition contains (C) a polyester polyol resin having an aromatic structure as the (C) component. By including the component (C) in the resin composition, the stress of the cured product is relieved, and as a result, it is possible to obtain a cured product that has high bonding strength and suppresses the occurrence of warping of the cured product. Become. In addition, since the component (C) can exhibit the effect of relieving stress, the coefficient of thermal expansion (CTE) of the cured product can generally be lowered. (C) component may be used individually by 1 type, and may be used in combination of 2 or more types.

The content of the component (C) is 2% by mass or more when the non-volatile component in the resin composition is 100% by mass, from the viewpoint of obtaining a cured product having high bonding strength and suppressed warping. , preferably 3% by mass or more, more preferably 4% by mass or more, and still more preferably 5% by mass or more. The upper limit is 20% by mass or less, preferably 15% by mass or less, more preferably 10% by mass or less, and even more preferably 8% by mass or less, from the viewpoint of obtaining a cured product having excellent bonding strength and thermal expansion coefficient.

Component (C) suppresses the occurrence of warpage of the cured product, improves adhesion to conductor layers such as copper foil, and further improves hydrolyzability. It is preferably a resin having This resin can be obtained, for example, by reacting a polyol with a polycarboxylic acid. In addition, as the component (C), it is preferable to have an aromatic structure in either the structure derived from the polyester or the structure derived from the polyol, and from the viewpoint of significantly obtaining the effects of the present invention, It is more preferable to have a bisphenol skeleton in any of the structures, and it is even more preferable to have a bisphenol skeleton in the polyol-derived structure. Aromatic structures are chemical structures generally defined as aromatic and also include polycyclic aromatic and heteroaromatic rings. The bisphenol skeleton includes, for example, a bisphenol A skeleton, a bisphenol B skeleton, a bisphenol C skeleton, a bisphenol AF skeleton and the like, and a bisphenol A skeleton is preferred.

From the viewpoint of improving compatibility with (A) epoxy resin and adhesion to copper foil, etc., component (C) has either a hydroxy group or a carboxyl group at the end of the molecular chain of component (C). is preferred. The number of hydroxy groups and carboxyl groups contained in component (C) is preferably 2 or more, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less per molecule. , particularly preferably two.

From the viewpoint of significantly obtaining the effects of the present invention, the polyol-derived structure is an ethylene oxide structure (--CH ₂ CH ₂ O--), a propylene oxide structure (--CH ₂ CH ₂ CH ₂ O--), a butylene oxide structure (--CH ₂ CH ₂ CH ₂ CH ₂ O—), and preferably has an alkylene oxide structure having 2 or more carbon atoms.

Examples of polyols include aliphatic polyols such as ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, neopentyl glycol and 1,3-butanediol; Examples include polyols having a cyclic structure; polyols having an aromatic structure such as a bisphenol skeleton such as bisphenol A and bisphenol F; and polyols obtained by modifying the above-mentioned polyols having an aromatic structure with an alkylene oxide. Among them, the polyol is preferably a polyol having an alicyclic structure, a polyol having an aromatic structure, or a polyol obtained by modifying a polyol having an aromatic structure with alkylene oxide, and more preferably a polyol obtained by modifying a polyol having an aromatic structure with alkylene oxide. preferable. Polyols may be used singly or in combination of two or more.

Examples of alkylene oxides used for modifying polyols having an aromatic structure include alkylene oxides having 2 or more carbon atoms, such as ethylene oxide, propylene oxide and butylene oxide. The upper limit of the number of carbon atoms in the alkylene oxide having 2 or more carbon atoms is preferably 4 or less, more preferably 3 or less.

The number average molecular weight of the polyol is preferably 50 or more, preferably 1500 or less, more preferably 1000 or less, still more preferably 700 or less.

A commercially available polyol may be used. Examples of commercially available products include "Hybrox MDB-561" manufactured by DIC.

Examples of polycarboxylic acids include aliphatic polycarboxylic acids such as succinic acid, adipic acid, sebacic acid and dodecanedicarboxylic acid; aromatic polycarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid and naphthalenedicarboxylic acid; Examples include anhydrides and esters.

One type of polycarboxylic acid may be used alone, or two or more types may be used in combination, and the polycarboxylic acid preferably contains an aliphatic polycarboxylic acid. The content of the aliphatic polycarboxylic acid is preferably 5 mol % or more, more preferably 10 mol % or more, and preferably 100 mol % or less of the total polycarboxylic acid content.

In one embodiment, an aliphatic polycarboxylic acid and an aromatic polycarboxylic acid are used in combination as the polycarboxylic acid. The content ratio of the aromatic polycarboxylic acid and the aliphatic polycarboxylic acid (aromatic polycarboxylic acid/aliphatic polycarboxylic acid) is preferably 1/99 or more, more preferably 30/70 or more on a molar basis, and further It is preferably 50/50 or more, preferably 99/1 or less, more preferably 90/10 or less, still more preferably 85/15 or less. By setting the content ratio of the aromatic polycarboxylic acid and the aliphatic polycarboxylic acid within such a range, the effect of the present invention can be significantly obtained.

Component (C) may contain an oxyalkylene unit having 4 or more carbon atoms to the extent that the object of the present invention is not impaired. The content of oxyalkylene units having 4 or more carbon atoms is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less.

Component (C) can be produced, for example, by reacting a polyol with a polycarboxylic acid. The reaction temperature is preferably 190° C. or higher, more preferably 200° C. or higher, and preferably 250° C. or lower, more preferably 240° C. or lower. Further, the reaction time is preferably 1 hour or more and preferably 100 hours or less.

A catalyst may be used as necessary during the reaction. Examples of the catalyst include titanium catalysts such as tetraisopropyl titanate and tetrabutyl titanate; tin catalysts such as dibutyltin oxide; organic sulfonic acid catalysts such as p-toluenesulfonic acid. The catalyst may be used singly or in combination of two or more.

The content of the catalyst is preferably 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more with respect to 100 parts by mass in total of the polyol and the polycarboxylic acid, from the viewpoint of efficiently proceeding the reaction. Yes, preferably 0.01 parts by mass or less, more preferably 0.005 parts by mass or less.

The hydroxyl value of component (C) is preferably 2 mgKOH/g or more, more preferably 4 mgKOH/g or more, still more preferably 6 mgKOH/g or more, 10 mgKOH/g or more, or 25 mgKOH, from the viewpoint of significantly obtaining the effects of the present invention. /g or more, 30 mgKOH/g or more, or 35 mgKOH/g or more, preferably 450 mgKOH/g or less, more preferably 100 mgKOH/g or less, still more preferably 50 mgKOH/g or less, 45 mgKOH/g or less, or 40 mgKOH/g or less is. A hydroxyl value can be measured by a method based on JIS K0070.

The acid value of component (C) is preferably 2 mgKOH/g or more, more preferably 4 mgKOH/g or more, still more preferably 6 mgKOH/g or more, and 10 mgKOH/g or more, from the viewpoint of significantly obtaining the effects of the present invention. , 25 mgKOH/g or more, 30 mgKOH/g or more, or 35 mgKOH/g or more, preferably 450 mgKOH/g or less, more preferably 100 mgKOH/g or less, still more preferably 50 mgKOH/g or less, 45 mgKOH/g or less, or 40 mgKOH/g g or less. Acid value can be measured by a method based on JIS K0070.

The viscosity of component (C) at 75° C. is preferably 0.1 Pa·s or more, more preferably 0.2 Pa·s or more, and still more preferably 0.5 Pa·s, from the viewpoint of significantly obtaining the effects of the present invention. Above, preferably 25 Pa·s or less, more preferably 20 Pa·s or less, still more preferably 15 Pa·s or less. Viscosity can be measured, for example, using an E-type viscometer.

The number average molecular weight of component (C) is preferably 500 or more, more preferably 1000 or more, still more preferably 1500 or more, from the viewpoint of improving compatibility with epoxy resin (A) and adhesion to copper foil or the like. It is 2,000 or more, or 2,500 or more, preferably 7,000 or less, more preferably 6,000 or less, and still more preferably 5,000 or less. The number average molecular weight can be measured using GPC (gel permeation chromatography).

The glass transition temperature of component (C) is preferably −100° C. or higher, more preferably −80° C. or higher, still more preferably −70° C. or higher, and preferably 50° C. or higher, from the viewpoint of significantly obtaining the effects of the present invention. °C or less, more preferably 40°C or less, and even more preferably 30°C or less. The glass transition temperature is a value measured by DSC (differential scanning calorimetry).

<(D) Inorganic filler>
The resin composition contains (D) an inorganic filler. By including (D) the inorganic filler in the resin composition, it is possible to obtain a cured product having an excellent coefficient of thermal expansion.

An inorganic compound is used as the material of the inorganic filler. Examples of inorganic filler materials include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, Magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide , barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica and alumina are preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, as silica, spherical silica is preferable. (D) The inorganic filler may be used singly or in combination of two or more.

(D) Commercially available inorganic fillers include, for example, "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials; "YC100C", "YA050C" and "YA050C-MJE" manufactured by Admatechs. ”, “YA010C”; “UFP-30” manufactured by Denka; "SO-C4", "SO-C2", "SO-C1";

(D) The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, and particularly preferably 0.1 μm or more, from the viewpoint of significantly obtaining the desired effects of the present invention, It is preferably 25 μm or less, more preferably 5 μm or less, and even more preferably 1 μm or less.

(D) The average particle size of the inorganic filler can be measured by a laser diffraction/scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction/scattering type particle size distribution measuring device, and the median diameter can be used as the average particle size for measurement. A measurement sample can be obtained by weighing 100 mg of an inorganic filler and 10 g of methyl ethyl ketone in a vial and dispersing them with ultrasonic waves for 10 minutes. The measurement sample is measured using a laser diffraction particle size distribution measuring device, the wavelengths of the light source used are blue and red, and the volume-based particle size distribution of the inorganic filler (D) is measured by the flow cell method. The average particle size can be calculated as the median size from the size distribution. Examples of the laser diffraction particle size distribution analyzer include "LA-960" manufactured by Horiba, Ltd., and the like.

(D) The specific surface area of the inorganic filler is preferably 1 m ² /g or more, more preferably 1.5 m ² /g or more, and particularly preferably 2 m ² /g, from the viewpoint of significantly obtaining the desired effects of the present invention. or more or 3 m ² /g or more. Although there is no particular upper limit, it is preferably 60 m ² /g or less, 50 m ² /g or less, or 40 m ² /g or less. The specific surface area is obtained by adsorbing nitrogen gas on the sample surface using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountec) according to the BET method and calculating the specific surface area using the BET multipoint method. .

(D) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of enhancing moisture resistance and dispersibility. Examples of surface treatment agents include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate compounds. A coupling agent etc. are mentioned. Moreover, one type of surface treatment agent may be used alone, or two or more types may be used in combination.

Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Industry Co., Ltd. "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "SZ-31" ( Hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd. "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM-4803" (long-chain epoxy type silane coupling agent), Shin-Etsu Chemical Co., Ltd. "KBM- 7103” (3,3,3-trifluoropropyltrimethoxysilane).

From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment with the surface treatment agent is preferably within a predetermined range. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2-5 parts by mass of a surface treatment agent, and is surface-treated with 0.2-3 parts by mass. preferably 0.3 parts by mass to 2 parts by mass of the surface treatment.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, and more preferably 0.2 mg/m ² from the viewpoint of improving the dispersibility of the inorganic filler. The above is more preferable. On the other hand, from the viewpoint of suppressing the melt viscosity of the resin varnish and the melt viscosity in the sheet form, it is preferably 1 mg/m ² or less, more preferably 0.8 mg/m ² or less, and further preferably 0.5 mg/m ² or less. preferable.

The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent, and ultrasonic cleaning is performed at 25° C. for 5 minutes. After removing the supernatant liquid and drying the solid content, a carbon analyzer can be used to measure the amount of carbon per unit surface area of the inorganic filler. As a carbon analyzer, "EMIA-320V" manufactured by Horiba Ltd. can be used.

(D) The content of the inorganic filler is preferably 60% by mass or more, more preferably 65% by mass, when the non-volatile component in the resin composition is 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention. % or more, more preferably 70 mass % or more and 75 mass % or more, preferably 95 mass % or less, more preferably 93 mass % or less, still more preferably 92 mass % or less and 90 mass % or less.

d1 is the content of component (D) when the non-volatile component in the resin composition is 100% by mass, and c1 is the content of component (C) when the non-volatile component in the resin composition is 100% by mass. , from the viewpoint of significantly obtaining the effects of the present invention, d1/c1 is preferably 5 or more, more preferably 10 or more, still more preferably 15 or more, preferably 70 or less, more preferably 60 or less, More preferably, it is 50 or less, 45 or less, 40 or less, or 35 or less.

<(E) Curing accelerator>
The resin composition may further contain (E) a curing accelerator as an optional component in addition to the components described above. (E) Curing time and the like can be efficiently adjusted by including a curing accelerator.

Examples of curing accelerators include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, and the like. Among them, phosphorus curing accelerators, amine curing accelerators, imidazole curing accelerators, and metallic curing accelerators are preferred, and amine curing accelerators, imidazole curing accelerators, and metallic curing accelerators are more preferred. The curing accelerator may be used singly or in combination of two or more.

Phosphorus curing accelerators include, for example, triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl)triphenylphosphonium thiocyanate. , tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate, and triphenylphosphine and tetrabutylphosphonium decanoate are preferred.

Examples of amine curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo (5,4,0)-undecene, 1,8-diazabicyclo[5,4,0]undecene-7,4-dimethylaminopyridine, 2,4,6-tris(dimethylaminomethyl)phenol and the like, 4-dimethylaminopyridine, 1,8-diazabicyclo(5,4,0)-undecene are preferred.

Examples of imidazole curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecyl imidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4- Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate, 2-phenylimidazole isocyanurate, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline , 2-phenylimidazoline and the like, and adducts of imidazole compounds and epoxy resins, with 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole being preferred.

As the imidazole-based curing accelerator, a commercially available product may be used. —CN”, “Cl1Z-CNS”, “Cl1Z-A”, “2MZ-OK”, “2MA-OK”, “2PHZ” and the like.

Guanidine curing accelerators include, for example, dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, Tetramethylguanidine, Pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0] Dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1 -allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide and the like, with dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene being preferred.

Metal-based curing accelerators include, for example, organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organocopper complexes such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. and the like, organic iron complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate. Examples of organic metal salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

(E) The content of the curing accelerator is preferably 0.01% by mass or more, more preferably 0.01% by mass or more, when the non-volatile component in the resin composition is 100% by mass, from the viewpoint of significantly obtaining the desired effects of the present invention. is 0.05% by mass or more, more preferably 0.1% by mass or more, preferably 1.5% by mass or less, more preferably 1% by mass or less, and still more preferably 0.5% by mass or less.

<(F) Solvent>
The resin composition may further contain any solvent as a volatile component. Examples of solvents include organic solvents. Moreover, a solvent may be used individually by 1 type, and may be used in combination of 2 or more types by arbitrary ratios. The smaller the amount of solvent, the better. The amount of the solvent is preferably 3% by mass or less, more preferably 1% by mass or less, still more preferably 0.5% by mass or less, still more preferably 0.1% by mass, based on 100% by mass of the non-volatile components in the resin composition. It is not more than 0.01% by mass, more preferably not more than 0.01% by mass, and is particularly preferably not contained (0% by mass). Moreover, the resin composition may be in the form of a paste when the amount of the solvent is small in this way. The viscosity of the pasty resin composition at 25° C. is preferably in the range of 20 Pa·s to 1000 Pa·s.

<(G) Other Additives>
The resin composition may further contain other additives as optional components in addition to the components described above. Examples of such additives include thermoplastic resins; curing agents other than component (B); organic fillers; ; and the like. These additives may be used singly or in combination of two or more.

The method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method of adding a solvent or the like to the compounding ingredients as necessary and mixing and dispersing using a rotary mixer or the like.

<Physical properties and applications of the resin composition>
A cured product obtained by thermally curing the resin composition at 180° C. for 90 minutes exhibits excellent bonding strength. Bonding strength can be represented by shear strength, for example. Therefore, the cured product usually provides an insulating layer or sealing layer with excellent shear strength. The shear strength is preferably 2 kgf/mm ² or more. The shear strength can be evaluated according to the method described in Examples below.

A cured product obtained by thermally curing a resin composition at 190° C. for 90 minutes usually exhibits a low coefficient of thermal expansion (CTE). Thus, the cured product provides an insulating or encapsulating layer with a low coefficient of thermal expansion. The coefficient of thermal expansion (CTE) is preferably less than 13 ppm/°C. The evaluation of the coefficient of thermal expansion can be measured according to the method described in Examples below.

A cured product obtained by heat-curing the resin composition at 190° C. for 90 minutes exhibits the characteristic that the amount of warpage is suppressed. Therefore, the cured product provides an insulating layer or sealing layer with a suppressed amount of warpage. Specifically, a resin composition layer is obtained by compression-molding a resin composition on a silicon wafer. A sample substrate is obtained by thermally curing the resin composition layer. Using a shadow moiré measuring device, the amount of warpage of the sample substrate at 25° C. is determined according to JEITA EDX-7311-24 of the Japan Electronics and Information Technology Industries Association standard. The amount of warpage is less than 2 mm. The details of the measurement of the amount of warpage can be measured according to the method described in Examples below.

Since the resin composition has the properties described above, it can be suitably used as a resin composition (sealing resin composition) for sealing electronic devices such as organic EL devices and semiconductors. Suitable for use as a resin composition for encapsulating a semiconductor (semiconductor encapsulation resin composition), preferably as a resin composition for encapsulating a semiconductor chip (semiconductor chip encapsulation resin composition) be able to. Moreover, the resin composition can be used as an insulating resin composition for an insulating layer in addition to the sealing use. For example, the resin composition is a resin composition for forming an insulating layer of a semiconductor chip package (a resin composition for an insulating layer of a semiconductor chip package), and a circuit board (including a printed wiring board). It can be suitably used as a resin composition for forming an insulating layer (resin composition for insulating layers of circuit boards).

Examples of semiconductor chip packages include FC-CSP, MIS-BGA package, ETS-BGA package, Fan-out type WLP (Wafer Level Package), Fan-in type WLP, Fan-out type PLP (Panel Level Package), Fan-in type PLPs can be mentioned.

The resin composition may also be used as an underfill material, for example, as a material for MUF (Molding Under Filling) used after connecting a semiconductor chip to a substrate.

Furthermore, the resin composition can be used in a wide range of applications such as resin sheets, sheet-like laminated materials such as prepreg, solder resists, die bonding materials, hole-filling resins, component-embedding resins, and the like.

[Resin sheet]
The resin sheet of the present invention has a support and a resin composition layer provided on the support. The resin composition layer is a layer containing the resin composition of the present invention, and is usually formed of the resin composition.

The thickness of the resin composition layer is preferably 600 μm or less, more preferably 550 μm or less, even more preferably 500 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, or 200 μm or less from the viewpoint of thinning. The lower limit of the thickness of the resin composition layer is not particularly limited, and may be, for example, 1 µm or more, 5 µm or more, or 10 µm or more.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.

When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"). Polycarbonate (hereinafter sometimes abbreviated as "PC"); Acrylic polymers such as polymethyl methacrylate (hereinafter sometimes abbreviated as "PMMA"); Cyclic polyolefins; Triacetyl cellulose (hereinafter polyether sulfide (hereinafter sometimes abbreviated as "PES"); polyether ketone; polyimide; Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil. Among them, copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. may be used.

The support may be subjected to matte treatment, corona treatment, antistatic treatment, or the like on the surface to be bonded to the resin composition layer.

Further, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the release layer-attached support includes, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. . Examples of commercially available release agents include alkyd resin-based release agents such as “SK-1”, “AL-5” and “AL-7” manufactured by Lintec. Examples of the release layer-attached support include "Lumirror T60" manufactured by Toray Industries, Inc.; "Purex" manufactured by Teijin Limited; and "Unipeel" manufactured by Unitika.

The thickness of the support is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. When a release layer-attached support is used, the thickness of the release layer-attached support as a whole is preferably within the above range.

The resin sheet can be produced, for example, by coating a resin composition on a support using a coating device such as a die coater. If necessary, the resin composition may be dissolved in an organic solvent to prepare a resin varnish, and this resin varnish may be applied to produce a resin sheet. By using a solvent, the viscosity can be adjusted and the coatability can be improved. When a resin varnish is used, the resin composition layer is usually formed by drying the resin varnish after application.

Examples of organic solvents include ketone solvents such as acetone, methyl ethyl ketone and cyclohexanone; acetic ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate; carbitols such as cellosolve and butyl carbitol. Solvents; aromatic hydrocarbon solvents such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone; The organic solvent may be used singly or in combination of two or more at any ratio.

Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are such that the content of the organic solvent in the resin composition layer is usually 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% by mass to 60% by mass of the organic solvent, drying at 50 ° C. to 150 ° C. for 3 minutes to 10 minutes The resin composition layer can be formed.

The resin sheet may contain arbitrary layers other than the support and the resin composition layer, if necessary. For example, in the resin sheet, the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support) may be provided with a protective film conforming to the support. The thickness of the protective film is, for example, 1 μm to 40 μm. The protective film can prevent dust from adhering to the surface of the resin composition layer and scratches on the surface of the resin composition layer. When the resin sheet has a protective film, the resin sheet can be used by peeling off the protective film. In addition, the resin sheet can be wound into a roll and stored.

A resin sheet can be suitably used for forming an insulating layer in the manufacture of a semiconductor chip package (an insulating resin sheet for a semiconductor chip package). For example, the resin sheet can be used to form an insulating layer of a circuit board (resin sheet for insulating layer of circuit board). Examples of packages using such substrates include FC-CSP, MIS-BGA packages, and ETS-BGA packages.

In addition, the resin sheet can be suitably used for sealing semiconductor chips (semiconductor chip sealing resin sheet). Applicable semiconductor chip packages include, for example, Fan-out type WLP, Fan-in type WLP, Fan-out type PLP, Fan-in type PLP and the like.

Also, the resin sheet may be used as a material for the MUF that is used after connecting the semiconductor chip to the substrate.

Furthermore, the resin sheet can be used in a wide range of other applications that require high insulation reliability. For example, a resin sheet can be suitably used to form an insulating layer of a circuit board such as a printed wiring board.

[Circuit board]
The circuit board of the present invention includes a cured product layer formed from a cured product of the resin composition of the present invention. The cured material layer can be an insulating layer or a sealing layer. This circuit board can be manufactured, for example, by a manufacturing method including the following steps (1) and (2).
(1) A step of forming a resin composition layer on a substrate.
(2) A step of thermosetting the resin composition layer to form an insulating layer.

In step (1), a substrate is prepared. Examples of base materials include substrates such as glass epoxy substrates, metal substrates (stainless steel, cold-rolled steel plate (SPCC), etc.), polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. Moreover, the base material may have a metal layer such as a copper foil on the surface as part of the base material. For example, a substrate having peelable first and second metal layers on both surfaces may be used. When such a substrate is used, a conductor layer as a wiring layer capable of functioning as circuit wiring is usually formed on the surface of the second metal layer opposite to the first metal layer. Examples of the material for the metal layer include copper foil, copper foil with a carrier, material for the conductor layer described later, and the like, and copper foil is preferred. Moreover, as a base material having such a metal layer, a commercially available product can be used.

Also, a conductor layer may be formed on one or both surfaces of the substrate. In the following description, a member including a base material and a conductor layer formed on the surface of the base material may be referred to as a "wiring layer-attached base material" as appropriate. The conductor material contained in the conductor layer is, for example, one selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Materials containing the above metals can be mentioned. As the conductor material, a single metal may be used, or an alloy may be used. Examples of alloys include alloys of two or more metals selected from the above group (eg, nickel-chromium alloys, copper-nickel alloys and copper-titanium alloys). Among them, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper as single metals; and nickel-chromium alloys as alloys , a copper-nickel alloy, and a copper-titanium alloy; are preferred. Among them, single metals of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper; and nickel-chromium alloys; are more preferred, and single metals of copper are particularly preferred.

The conductor layer may be patterned, for example, to function as a wiring layer. At this time, the line (circuit width) / space (width between circuits) ratio of the conductor layer is not particularly limited, but is preferably 20/20 μm or less (that is, the pitch is 40 μm or less), more preferably 10/10 μm or less, and further It is preferably 5/5 μm or less, more preferably 1/1 μm or less, and particularly preferably 0.5/0.5 μm or more. The pitch need not be the same throughout the conductor layer. The minimum pitch of the conductor layers may be, for example, 40 μm or less, 36 μm or less, or 30 μm or less.

The thickness of the conductor layer is preferably 3 μm to 35 μm, more preferably 5 μm to 30 μm, even more preferably 10 μm to 20 μm, particularly preferably 15 μm to 20 μm, depending on the design of the circuit board.

The conductor layer is formed by, for example, a process of laminating a dry film (photosensitive resist film) on a base material, and performing pattern drying by exposing and developing the dry film under predetermined conditions using a photomask to form a pattern. It can be formed by a method including a step of obtaining a film, a step of forming a conductor layer by a plating method such as electroplating using the developed patterned dry film as a plating mask, and a step of peeling off the patterned dry film. As the dry film, a photosensitive dry film made of a photoresist composition can be used. For example, a dry film made of a resin such as a novolak resin or an acrylic resin can be used. The conditions for laminating the substrate and the dry film may be the same as the conditions for laminating the substrate and the resin sheet, which will be described later. Stripping of the dry film can be carried out using, for example, an alkaline stripping solution such as sodium hydroxide solution.

After preparing the substrate, a resin composition layer is formed on the substrate. When a conductor layer is formed on the surface of the substrate, the resin composition layer is preferably formed so that the conductor layer is embedded in the resin composition layer.

Formation of the resin composition layer is performed, for example, by laminating a resin sheet and a substrate. This lamination can be performed, for example, by bonding the resin composition layer to the substrate by thermocompression bonding the resin sheet to the substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the substrate (hereinafter sometimes referred to as "thermocompression member") include heated metal plates (such as SUS end plates) and metal rolls (such as SUS rolls). be done. Instead of pressing the thermocompression member directly onto the resin sheet, it is preferable to press the resin sheet through an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the uneven surface of the substrate.

Lamination of the base material and the resin sheet may be carried out, for example, by a vacuum lamination method. In the vacuum lamination method, the thermocompression bonding temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C. The thermocompression pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably 0.29 MPa to 1.47 MPa. The thermocompression bonding time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions of 13 hPa or less.

After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. Pressing conditions for the smoothing treatment may be the same as the thermocompression bonding conditions for the lamination described above. Lamination and smoothing may be performed continuously using a vacuum laminator.

Formation of the resin composition layer can be performed by, for example, a compression molding method. For specific operations of the compression molding method, for example, an upper mold and a lower mold are prepared as molds. A resin composition is applied to a substrate. The substrate coated with the resin composition is attached to the lower mold. After that, the upper mold and the lower mold are clamped, and heat and pressure are applied to the resin composition for compression molding.

Further, the specific operation of the compression molding method may be, for example, as follows. An upper mold and a lower mold are prepared as molds for compression molding. A resin composition is placed on the lower mold. Also, the substrate is attached to the upper mold. Thereafter, the upper mold and the lower mold are clamped so that the resin composition placed on the lower mold is in contact with the substrate attached to the upper mold, and heat and pressure are applied to perform compression molding.

Molding conditions in the compression molding method vary depending on the composition of the resin composition. The temperature of the mold during molding is preferably a temperature at which the resin composition can exhibit excellent compression moldability. It is 200° C. or lower, more preferably 170° C. or lower, and still more preferably 150° C. or lower. The pressure applied during molding is preferably 1 MPa or higher, more preferably 3 MPa or higher, still more preferably 5 MPa or higher, and preferably 50 MPa or lower, more preferably 30 MPa or lower, and still more preferably 20 MPa or lower. The curing time is preferably 1 minute or longer, more preferably 2 minutes or longer, particularly preferably 5 minutes or longer, and preferably 60 minutes or shorter, more preferably 30 minutes or shorter, and particularly preferably 20 minutes or shorter. After formation of the resin composition layer, the mold is usually removed. The mold may be removed before or after heat curing of the resin composition layer.

After forming the resin composition layer on the substrate, the resin composition layer is thermally cured to form an insulating layer. The thermosetting conditions for the resin composition layer vary depending on the type of resin composition, but the curing temperature is usually in the range of 120°C to 240°C (preferably in the range of 150°C to 220°C, more preferably in the range of 170°C to 200°C). range), and the curing time is in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, more preferably 15 minutes to 90 minutes).

Prior to thermal curing of the resin composition layer, the resin composition layer may be subjected to a preheating treatment of heating at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is usually heated at a temperature of 50 ° C. or higher and lower than 120 ° C. (preferably 60 ° C. or higher and 110 ° C. or lower, more preferably 70 ° C. or higher and 100 ° C. or lower). may be preheated for usually 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

A circuit board having an insulating layer can be manufactured in the manner described above. Moreover, the method for manufacturing the circuit board may further include an arbitrary step.
For example, when a circuit board is manufactured using a resin sheet, the method for manufacturing the circuit board may include a step of peeling off the support of the resin sheet. The support may be peeled off before heat curing of the resin composition layer, or may be peeled off after heat curing of the resin composition layer.

The method of manufacturing the circuit board may include, for example, a step of polishing the surface of the insulating layer after forming the insulating layer. A polishing method is not particularly limited. For example, the surface of the insulating layer can be polished using a surface grinder.

The method of manufacturing the circuit board may include, for example, the step (3) of connecting the conductor layers between the layers, that is, the step of drilling holes in the insulating layers. As a result, holes such as via holes and through holes can be formed in the insulating layer. Examples of methods for forming via holes include laser irradiation, etching, and mechanical drilling. The size and shape of the via hole may be appropriately determined according to the design of the circuit board. In step (3), interlayer connection may be performed by polishing or grinding the insulating layer.

After forming the via hole, it is preferable to perform a step of removing smear in the via hole. This process is sometimes called a desmear process. For example, when the conductive layer is formed on the insulating layer by a plating process, the via holes may be subjected to a wet desmear treatment. Further, when the conductor layer is formed on the insulating layer by a sputtering process, a dry desmear process such as a plasma treatment process may be performed. Furthermore, the insulating layer may be roughened by a desmear process.

Further, the insulating layer may be roughened before forming the conductor layer on the insulating layer. According to this roughening treatment, the surface of the insulating layer including the inside of the via hole is usually roughened. As the roughening treatment, either dry or wet roughening treatment may be performed. Examples of dry roughening treatment include plasma treatment and the like. Moreover, examples of wet roughening treatment include a method in which swelling treatment with a swelling liquid, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing liquid are performed in this order.

After forming the via holes, a conductor layer is formed on the insulating layer. By forming a conductor layer at the position where the via hole is formed, the newly formed conductor layer and the conductor layer on the surface of the base material are electrically connected to each other, thereby performing interlayer connection. Methods for forming the conductor layer include, for example, plating, sputtering, vapor deposition, etc. Among them, plating is preferred. In a preferred embodiment, the surface of the insulating layer is plated by an appropriate method such as a semi-additive method or a full-additive method to form a conductor layer having a desired wiring pattern. Moreover, when the support in the resin sheet is a metal foil, a conductor layer having a desired wiring pattern can be formed by a subtractive method. The material of the conductor layer to be formed may be a single metal or an alloy. Moreover, this conductor layer may have a single layer structure, or may have a multi-layer structure including two or more layers of different kinds of materials.

An example embodiment of forming a conductor layer on an insulating layer will now be described in detail. A plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a portion of the plating seed layer corresponding to a desired wiring pattern. After forming an electrolytic plating layer on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. After that, the unnecessary plating seed layer is removed by a treatment such as etching to form a conductor layer having a desired wiring pattern. The dry film used for forming the mask pattern when forming the conductor layer is the same as the dry film described above.

The circuit board manufacturing method may include a step (4) of removing the base material. By removing the substrate, a circuit board having an insulating layer and a conductor layer embedded in this insulating layer is obtained. This step (4) can be performed, for example, when a base material having a peelable metal layer is used.

[Semiconductor chip package]
A semiconductor chip package according to a first embodiment of the present invention includes the circuit board described above and a semiconductor chip mounted on the circuit board. This semiconductor chip package can be manufactured by bonding a semiconductor chip to a circuit board.

Any condition that allows conductor connection between the terminal electrodes of the semiconductor chip and the circuit wiring of the circuit board can be adopted as the bonding condition of the circuit board and the semiconductor chip. For example, conditions used in flip-chip mounting of semiconductor chips can be employed. Alternatively, for example, the semiconductor chip and the circuit board may be bonded via an insulating adhesive.

As an example of the bonding method, there is a method of crimping the semiconductor chip to the circuit board. As for the crimping conditions, the crimping temperature is usually in the range of 120° C. to 240° C. (preferably 130° C. to 200° C., more preferably 140° C. to 180° C.), and the crimping time is usually in the range of 1 second to 60 seconds. (preferably 5 seconds to 30 seconds).

Another example of the bonding method is a method of reflowing and bonding a semiconductor chip to a circuit board. The reflow conditions may range from 120.degree. C. to 300.degree.

After bonding the semiconductor chip to the circuit board, the semiconductor chip may be filled with a mold underfill material. As the mold underfill material, the resin composition described above may be used, or the resin composition layer of the resin sheet described above may be used.

A semiconductor chip package according to a second embodiment of the present invention includes a semiconductor chip and a cured product of the resin composition sealing the semiconductor chip. In such a semiconductor chip package, the cured resin composition usually functions as a sealing layer. As a semiconductor chip package according to the second embodiment, for example, a fan-out type WLP can be used.

A method for manufacturing a semiconductor chip package such as a fan-out type WLP includes:
(A) a step of laminating a temporary fixing film on a substrate;
(B) temporarily fixing the semiconductor chip on the temporary fixing film;
(C) a step of laminating the resin composition layer of the resin sheet of the present invention on a semiconductor chip, or applying the resin composition of the present invention onto a semiconductor chip and heat-curing to form a sealing layer;
(D) a step of peeling the substrate and the temporary fixing film from the semiconductor chip;
(E) forming a rewiring layer (insulating layer) on the surface of the semiconductor chip from which the substrate and the temporary fixing film have been removed;
(F) forming a conductor layer (rewiring layer) on the rewiring layer (insulating layer); and (G) forming a solder resist layer on the conductor layer. Also, the method of manufacturing a semiconductor chip package may include the step of (H) dicing the plurality of semiconductor chip packages into individual semiconductor chip packages to separate them into individual pieces.

Details of a method for manufacturing such a semiconductor chip package can be referred to paragraphs 0066 to 0081 of WO 2016/035577, the contents of which are incorporated herein.

The semiconductor chip package according to the third embodiment of the present invention is, for example, the semiconductor chip package of the second embodiment, in which the rewiring formation layer or the solder resist layer is formed from the cured product of the resin composition of the present invention. is.

[Semiconductor device]
Examples of semiconductor devices on which the above-described semiconductor chip package is mounted include electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical equipment, televisions, etc.) and vehicles (e.g. , motorcycles, automobiles, trains, ships, aircraft, etc.).

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to the following examples. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. In addition, unless otherwise specified, the operations described below were performed in an environment of normal temperature and normal pressure.

In addition, silica A, silica B, and alumina A used in Examples and Comparative Examples are as follows.
Silica A: Silica having an average particle size of 1.8 μm, a specific surface area of 3.5 m ² /g, and surface-treated with N-phenyl-3-aminopropyltrimethoxysilane (“KBM-573” manufactured by Shin-Etsu Chemical Co., Ltd.).
Silica B: Silica having an average particle diameter of 3.2 μm, a specific surface area of 4.6 m ² /g, and surface-treated with 3-glycidoxypropyltrimethoxysilane (“KBM-403” manufactured by Shin-Etsu Chemical Co., Ltd.).
Alumina A: Alumina having an average particle diameter of 6.2 μm, a specific surface area of 1.7 m ² /g, and surface-treated with N-phenyl-3-aminopropyltrimethoxysilane (“KBM-573” manufactured by Shin-Etsu Chemical Co., Ltd.).

<Synthesis Example 1: Synthesis of polyester polyol resin A having an aromatic structure>
A reactor was charged with 779.1 parts by mass of bisphenol A glycol ether (Hybrox MDB-561, manufactured by DIC), 132.9 parts by mass of isophthalic acid, and 40.4 parts by mass of sebacic acid, and the temperature was raised. and started stirring.
Next, after raising the internal temperature to 230° C., 0.10 parts by mass of tetraisopropyl titanate was added and reacted at 230° C. for 24 hours to synthesize a polyester polyol resin A having an aromatic structure. The resulting polyester polyol resin A having an aromatic structure has OH groups at both ends, has a hydroxyl value of 36.9 mgKOH/g, a number average molecular weight of 3040, and a glass transition temperature of -14°C at 75°C. The viscosity was 9 Pa·s.

<Synthesis Example 2: Synthesis of polyester polyol resin B having an aromatic structure>
A reaction apparatus was charged with 596.8 parts by mass of bisphenol A glycol ether (Hybrox MDB-561, manufactured by DIC) and 257.4 parts by mass of sebacic acid, and heating and stirring were started.
Next, after raising the internal temperature to 230° C., 0.10 part by mass of tetraisopropyl titanate was added and reacted at 230° C. for 24 hours to synthesize a polyester polyol resin B having an aromatic structure. The resulting polyester polyol resin B having an aromatic structure has —COOH groups at both ends, an acid value of 36.6 mgKOH/g, a number average molecular weight of 3070, and a glass transition temperature of −33° C., 75. The viscosity at °C was 12 Pa·s.

<Example 1>
Alicyclic epoxy resin (manufactured by Daicel, "CEL2021P", epoxy equivalent 136 g / eq.) 6.6 parts, naphthalene type epoxy resin (manufactured by DIC, "HP4032D", epoxy equivalent 142 g / eq.) 8 parts, amine System curing agent (manufactured by Nippon Kayaku Co., Ltd., "Kayahard AA") 0.5 parts, polyester polyol resin A 2.5 parts having an aromatic structure synthesized in Synthesis Example 1, silica A 80 parts, curing accelerator ("2MA-OK" manufactured by Shikoku Kasei Co., Ltd.) was uniformly dispersed using a mixer to obtain a resin composition 1.

<Example 2>
In Example 1, 0.5 parts of the polyester polyol resin A having an aromatic structure was changed to 0.5 parts of the polyester polyol resin B having an aromatic structure. A resin composition 2 was prepared in the same manner as in Example 1 except for the above matters.

<Example 3>
Alicyclic epoxy resin (manufactured by Daicel, "CEL2021P", epoxy equivalent 136 g / eq.) 3 parts, naphthalene type epoxy resin (manufactured by DIC, "HP4032D", epoxy equivalent 142 g / eq.) 3 parts, acid anhydride System curing agent (manufactured by New Japan Chemical Co., Ltd., "MH-700") 10 parts, polyester polyol resin A 4 parts having an aromatic structure synthesized in Synthesis Example 1, silica A 100 parts, curing accelerator (manufactured by Shikoku Kasei Co., Ltd. , “2MA-OK”) was uniformly dispersed using a mixer to obtain a resin composition 3.

<Example 4>
In Example 3,
changing 4 parts of polyester polyol resin A having an aromatic structure to 8 parts of polyester polyol resin B having an aromatic structure,
100 parts of Silica A was replaced with 130 parts of Alumina A.
A resin composition 4 was prepared in the same manner as in Example 3 except for the above matters.

<Example 5>
Alicyclic epoxy resin (manufactured by Daicel, "CEL2021P", epoxy equivalent 136 g / eq.) 7 parts, naphthalene type epoxy resin (manufactured by DIC, "HP4032D", epoxy equivalent 142 g / eq.) 8 parts, phenolic curing Agent (2,2-diallyl bisphenol A) 1 part, polyester polyol resin A 2 parts having an aromatic structure synthesized in Synthesis Example 1, silica A 70 parts, curing accelerator (manufactured by Shikoku Kasei Co., Ltd., "2MA-OK" ) was uniformly dispersed using a mixer to obtain a resin composition 5.

<Comparative Example 1>
In Example 2, 2.5 parts of polyester polyol resin A having an aromatic structure was not used. A resin composition 6 was produced in the same manner as in Example 2 except for the above matters.

<Comparative Example 2>
In Example 3, the amount of polyester polyol resin A having an aromatic structure was changed from 4 parts to 0.5 parts. A resin composition 7 was prepared in the same manner as in Example 3 except for the above matters.

<Comparative Example 3>
In Example 3, the amount of polyester polyol resin A having an aromatic structure was changed from 4 parts to 35 parts. A resin composition 8 was produced in the same manner as in Example 3 except for the above matters.

<Evaluation of share strength>
Resin compositions 1 to 8 prepared in Examples and Comparative Examples were filled in a cylindrical shape with a height of 5 mm on a silicon wafer coated with polyimide using a silicon rubber frame with a diameter of 4 mm. After heating at 180° C. for 90 minutes, the silicon rubber frame was removed to prepare a test piece of a cured product of the resin composition. The shear strength of the interface between the polyimide and the test piece was measured with a bond tester (Dage series 4000) under the conditions that the head position was 1 mm from the substrate and the head speed was 700 μm/s. The test was conducted 5 times, and the average value was used for evaluation according to the following criteria.
○: 2 kgf/mm ² or more ×: less than 2 kgf/mm ²

<Measurement of warpage amount>
On a 12-inch silicon wafer, the resin compositions prepared in Examples and Comparative Examples were compression-molded using a compression molding apparatus (mold temperature: 130°C, pressure: 6 MPa, cure time: 10 minutes) to obtain a thickness. A resin composition layer having a thickness of 300 μm was formed. After that, the resin composition layer was thermally cured by heating at 180° C. for 90 minutes. As a result, a sample substrate including a silicon wafer and a cured product layer of the resin composition was obtained. Using a shadow moire measuring device (“Thermoire AXP” manufactured by Akorometrics), the amount of warpage of the sample substrate at 25° C. was measured. The measurement was performed in accordance with JEITA EDX-7311-24 of the Japan Electronics and Information Technology Industries Association standard. Specifically, a virtual plane calculated by the method of least squares of all data of the substrate surface in the measurement area was used as a reference plane, and the difference between the minimum value and the maximum value in the direction perpendicular to the reference plane was obtained as the amount of warpage. A warp amount of less than 2 mm was evaluated as "◯", and a warp amount of 2 mm or more was evaluated as "x".

<Measurement of coefficient of thermal expansion (CTE)>
Resin compositions 1 to 8 prepared in Examples and Comparative Examples were applied onto a release-treated 12-inch silicon wafer using a compression molding apparatus (mold temperature: 130°C, pressure: 6 MPa, cure time: 10 minutes). The resin composition layer having a thickness of 300 μm was formed by compression molding. After that, the resin composition layer was peeled off from the release-treated silicon wafer and heated at 180° C. for 90 minutes to thermally cure the resin composition layer to prepare a cured product sample. A test piece was obtained by cutting the cured product sample into a width of 5 mm and a length of 15 mm. This test piece was subjected to thermomechanical analysis by a tensile load method using a thermomechanical analyzer (“ThermoPlus TMA8310” manufactured by Rigaku Corporation). Specifically, after mounting the test piece on the thermomechanical analyzer, the measurement was performed twice continuously under the measurement conditions of a load of 1 g and a heating rate of 5° C./min. Then, in the second measurement, the thermal expansion coefficient (ppm/°C) in the planar direction was calculated in the range from 25°C to 150°C, and evaluated according to the following criteria.
○: Less than 13 ppm/°C ×: 13 ppm/°C or more

In Examples 1 to 5, even if the component (E) is not contained, it has been confirmed that results similar to those of the above Examples can be obtained, albeit to varying degrees.

Claims (12)

(A) an epoxy resin,
(B) at least one curing agent selected from acid anhydride curing agents, amine curing agents, and phenolic curing agents;
(C) a polyester polyol resin having an aromatic structure, and (D) an inorganic filler,
(A) The content of the component is 1% by mass or more and 30% by mass or less when the non-volatile component in the resin composition is 100% by mass,
(C) The content of the component is 2% by mass or more and 20% by mass or less when the non-volatile component in the resin composition is 100% by mass,
A resin composition in which the content of component (D) is 60% by mass or more and 95% by mass or less when the non-volatile component in the resin composition is taken as 100% by mass. 2. The resin composition according to claim 1, wherein component (A) contains a condensed ring skeleton. 3. The resin composition according to claim 1, wherein the terminal of component (C) is either a hydroxyl group or a carboxyl group. 4. The resin composition according to any one of claims 1 to 3 , wherein the component (C) is a resin having a polyester-derived structure and a polyol-derived structure. 5. The resin composition according to claim 4 , wherein the polyol-derived structure includes any one of an ethylene oxide structure, a propylene oxide structure, and a butylene oxide structure. The resin composition according to any one of claims 1 to 5 , wherein component (C) has a bisphenol skeleton. The content when the non-volatile component in the resin composition of component (C) is 100% by mass is c1, and the content when the non-volatile component in the resin composition of component (D) is 100% by mass is d1 7. The resin composition according to any one of claims 1 to 6 , wherein d1/c1 is 5 or more and 70 or less. The resin composition according to any one of claims 1 to 7 , which is used for a sealing layer. A resin sheet comprising a support and a resin composition layer containing the resin composition according to any one of claims 1 to 8 provided on the support. A circuit board comprising a cured product layer formed from a cured product of the resin composition according to any one of claims 1 to 8 . A semiconductor chip package comprising the circuit board according to claim 10 and a semiconductor chip mounted on the circuit board. A semiconductor chip package comprising a semiconductor chip sealed with the resin composition according to any one of claims 1 to 8 or the resin sheet according to claim 9 .