JP7276085B2 - power converter - Google Patents

Description

The disclosure in this specification relates to power converters.

Patent Literature 1 discloses a power conversion device in which the upper surface of a transformer faces the ceiling of a case. As a result, the temperature of the ambient air heated by the heat generated by the transformer is dissipated through the ceiling. The contents of the prior art documents are incorporated by reference as descriptions of technical elements in this specification.

JP 2007-166793 A

In the configuration of the prior art document, the cooler is arranged below the circuit board, and the transformer is arranged on the upper surface of the circuit board. For this reason, it was difficult for the transformer to receive the cooling effect of the cooler. Further improvements are required in the power conversion device in the above-mentioned viewpoints or in other viewpoints not mentioned.

One object of the disclosure is to provide a power conversion device that facilitates cooling of electronic components mounted on a control board.

The power conversion device disclosed herein includes a heat generating component (81) that generates heat when energized during power conversion, and a control board (90) on which a plurality of electronic components (95) for controlling the energization of the heat generating components are mounted. ), a cooler (85) for cooling heat-generating components, and a storage case (10) that houses the control board and the cooler facing each other, the control board facing the cooler and a second main surface (92) opposite to the first main surface. Priority cooling parts (95c, 295c) are mounted, and the storage case has a board storage space for storing a control board and a cooler storage space for storing a cooler. The base plate (11) is a member that is cooled by a cooler and transmits cold heat toward the first main surface, and the base plate has a surface facing the control board, It has a cooling groove (25) recessed in the direction towards the cooler, and part of the priority cooling component is inserted into the cooling groove .

According to the disclosed power converter, at least some of the electronic components are preferential cooling components mounted on the first main surface. Therefore, the priority cooling component can be arranged at a position close to the cooler, and the priority cooling component can be effectively cooled. Therefore, it is possible to provide a power converter that can easily cool the electronic components mounted on the control board.

The multiple aspects disclosed in this specification employ different technical means to achieve their respective objectives. Reference numerals in parentheses described in the claims and this section are intended to exemplify the correspondence with portions of the embodiments described later, and are not intended to limit the technical scope. Objects, features, and advantages disclosed in this specification will become clearer with reference to the following detailed description and accompanying drawings.

It is a bottom view of a power converter device. It is a bottom view of a storage case. It is a perspective view of a storage case. It is a top view of a power converter. It is a top view of a storage case. It is a perspective view of a storage case. FIG. 5 is a cross-sectional view showing a cross section taken along line VII-VII of FIG. 4; FIG. 4 is a configuration diagram showing a positional relationship between a semiconductor cooler and priority cooling components; 4 is an enlarged cross-sectional view showing the peripheral structure of the priority cooling component; FIG. FIG. 11 is a configuration diagram showing the positional relationship between the semiconductor cooler and the priority cooling component in the second embodiment;

A number of embodiments will be described with reference to the drawings. In several embodiments, functionally and/or structurally corresponding and/or related parts may be labeled with the same reference numerals or reference numerals differing by one hundred or more places. For corresponding and/or associated parts, reference can be made to the description of other embodiments.

1ST EMBODIMENT The power converter device 1 is a device which converts the magnitude|size and frequency of the voltage which the power supply output into a desired value. By converting the electric power into a desired value with the electric power conversion device 1, it is possible to appropriately drive the electric load. The power conversion device 1 is mounted on a vehicle, for example, and can be used as a device that provides electric power for driving a driving motor. However, the power conversion device 1 may be mounted on a train, an airplane, or the like.

In FIG. 1, the power converter 1 includes a storage case 10, a capacitor unit 30, a current sensor 40, and a semiconductor unit 80. As shown in FIG. The storage case 10 is made of metal such as aluminum. The storage case 10 has a box shape. Parts such as the capacitor unit 30 are housed inside the storage case 10 . A lid is attached to the storage case 10 in which each component is stored. The storage case 10 protects the parts housed inside and fixes each part to an appropriate place to constitute one power conversion device 1 .

The capacitor unit 30 includes a plurality of capacitor elements forming capacitors such as smoothing capacitors and noise removing capacitors. A plurality of capacitor elements are housed in a capacitor case and configured to be handled as an integrated capacitor. When current flows through the capacitor element, Joule heat is generated and the temperature of the entire capacitor unit 30 rises. However, the capacitor unit 30 does not necessarily have to be one device. For example, a smoothing capacitor and a noise removing capacitor may be configured as separate units. In this case, the capacitor unit 30 is composed of a plurality of units.

The semiconductor unit 80 has a semiconductor module 81 and a semiconductor cooler 85 . The semiconductor module 81 includes switching elements such as MOSFETs and IGBTs. The semiconductor module 81 is in the shape of a rectangular thin plate. A plurality of semiconductor modules 81 are arranged side by side. Hereinafter, the direction in which the plurality of semiconductor modules 81 are arranged will be referred to as the X direction.

When a current flows through the semiconductor module 81, Joule heat is generated and the temperature of the semiconductor module 81 and its surroundings rises. Since the current flowing through the semiconductor module 81 is larger than the noise current and the like, the generated Joule heat also increases. Therefore, it is necessary to cool the semiconductor module 81 so that the temperature of the semiconductor module 81 does not rise too much. Semiconductor module 81 provides an example of a heat-generating component.

The semiconductor cooler 85 is a cooler in which a cooling medium for cooling the semiconductor module 81 flows. The semiconductor cooler 85 includes a plurality of flat tubes 87 forming flat flow paths. The semiconductor cooler 85 has two connecting pipes 86 forming flow paths connecting the plurality of flat pipes 87 together. The connecting pipe 86 forms a circular tubular flow path. The flow direction of the cooling medium inside the connecting pipe 86 is the X direction. A single semiconductor module 81 is sandwiched between two flat tubes 87 and cooled on both sides. The semiconductor cooler 85 is a cooler called a laminated cooler. The flow direction of the cooling medium in the flat tube 87 is a direction perpendicular to the X direction. Below, the flow direction of the cooling medium in the flat tube 87 is indicated as the Y direction. A direction orthogonal to the two directions of the X direction and the Y direction is indicated as the Z direction. Semiconductor cooler 85 provides an example of a cooler.

Of the two connecting pipes 86, the connecting pipe 86 through which the cooling medium flows before flowing into the flat pipe 87 is the upstream connecting pipe 86u. On the other hand, the connecting pipe 86 through which the cooling medium flows after flowing out from the flat pipe 87 is the downstream connecting pipe 86d. The cooling medium exchanges heat with the semiconductor module 81 in the process of flowing through the semiconductor cooler 85, and the temperature rises. Therefore, the cooling medium having a temperature lower than that of the downstream connecting pipe 86d flows through the upstream connecting pipe 86u.

The capacitor unit 30 and the semiconductor unit 80 are connected via a positive bus bar and a negative bus bar. A high potential side of a power supply is connected to the positive bus bar. A low potential side of a power supply is connected to the negative bus bar. The positive bus bar and the negative bus bar are current paths that easily generate heat because a large amount of current flows when the power conversion device 1 converts electric power.

The power conversion device 1 includes a current sensor 40 that measures the magnitude of current flowing through busbars such as a positive busbar and a negative busbar. Joule heat is generated when current flows through the busbar. Therefore, the current sensor 40 is heated by the bus bar whose temperature is increased by the generated Joule heat. As the current sensor 40, an ammeter that measures the current value by measuring the voltage across the shunt resistor can be used. As the current sensor 40, a sensor using a magnetoresistive element such as a Hall element, a GMR element, or a TMR element that converts a magnetic field into a current can be employed. The current measurement method in the current sensor 40 is not limited to the above method, and various measurement methods can be appropriately adopted.

In FIG. 2, the storage case 10 is provided with a base plate 11 for partitioning the internal space in the Z direction. One space partitioned in the Z direction by the base plate 11 is a cooler storage space, and the other space is a substrate storage space. The base plate 11 mainly provides a surface perpendicular to the Z direction. A plurality of uneven shapes and openings are formed in the base plate 11 . The outer peripheral edge of the base plate 11 is provided with an outer peripheral wall portion 12 erected in the Z direction. The outer peripheral wall portion 12 protrudes to both sides in the Z direction with respect to the base plate 11 . The outer peripheral wall portion 12 is made of metal and is integrally formed continuously from the storage case 10 .

The base plate 11 is formed with partition walls 15 for partitioning the cooler housing space into a plurality of spaces. The partition wall 15 has a function of partitioning the portion in which the semiconductor unit 80 is housed from other portions. The partition wall 15 has two intersecting wall portions 15x extending along the X direction intersecting the outer peripheral wall portion 12. As shown in FIG. The partition wall 15 has a connecting wall portion 15y that connects the ends of the two crossing wall portions 15x. The connecting wall portion 15y extends along the Y direction in the substantially central portion of the base plate 11. As shown in FIG. The internal space of the storage case 10 is partitioned into a rectangular shape by two intersecting wall portions 15x, one connecting wall portion 15y, and part of the outer peripheral wall portion 12. As shown in FIG. The partition wall 15 includes an extension wall portion 15a that is provided continuously from the intersecting wall portion 15x and extends toward the outer peripheral wall portion 12 opposite to the outer peripheral wall portion 12 intersecting the intersecting wall portion 15x. The partition wall 15 is made of metal and is integrally formed continuously from the storage case 10 . The partition wall 15 contributes to increasing the rigidity of the storage case 10 .

A connection opening 19 is formed in the inner portion of the base plate 11 that is partitioned by the partition wall 15 . The connection opening 19 is a rectangular opening. The connection opening 19 has the largest opening area among the plurality of openings formed in the base plate 11 . A space partitioned from the periphery by the partition wall 15 is a space in which the semiconductor unit 80 is arranged. The connection opening 19 is an opening for inserting a semiconductor signal line extending in the Z direction from the semiconductor unit 80 .

In FIG. 3 , the partition wall 15 has a smaller amount of protrusion in the Z direction than the outer peripheral wall portion 12 . The partition wall 15 does not partition the entire internal space of the storage case 10 in the Z direction, but partitions up to a part of the space in the Z direction. Therefore, in the internal space of the storage case 10, the space that is partitioned by the partition wall 15 and the space that is not partitioned can partially communicate with each other.

The Z-direction protrusion amount and shape of the partition wall 15 differ depending on the location. One crossing wall portion 15x has a portion with a small amount of protrusion and a portion with a large amount of protrusion, and has a shape in which a step is formed in the Z direction. The connecting wall portion 15y has a shape in which the central portion in the Y direction is notched. The thickness of the cross wall portion 15x in the Y direction is smaller than the thickness of the connecting wall portion 15y in the X direction.

In FIG. 4 , the power converter 1 includes a control board 90 . A plurality of electronic components 95 are mounted on the control board 90 to control the energization of the power converter 1 . The mounting position of the electronic component 95 can be selected as appropriate. However, in order to reduce thermal interference between the electronic components 95, it is preferable to mount the electronic components 95 apart from each other. The control board 90 has a rectangular plate shape with a part notched. The control board 90 provides a surface perpendicular to the Z direction. In the control board 90, Joule heat is generated by current flowing through the mounted electronic components 95 and current paths.

Semiconductor signal lines projecting from the semiconductor module 81 in the Z direction are connected to the control board 90 . The control board 90 exchanges signals via semiconductor signal lines to control switching of the semiconductor module 81 . Heat generated in the control board 90 can be conducted to the semiconductor module 81 via the semiconductor signal line. Also, the heat generated in the semiconductor module 81 can be conducted to the semiconductor module 81 via the semiconductor signal line. In other words, heat can be exchanged between the semiconductor module 81 and the control board 90 via the semiconductor signal lines. Here, the control board 90 is also connected to components other than the semiconductor module 81 to control target components. Therefore, the control board 90 can exchange heat with components other than the semiconductor module 81 via signal lines.

In FIG. 5, the base plate 11 is formed with a cooling groove 25 recessed in a direction opposite to the projecting direction of the partition wall 15 . The cooling groove 25 has two intersecting groove portions 25x that intersect the outer peripheral wall portion 12 and extend along the X direction. The intersecting groove portion 25x is provided corresponding to the opposite position in the Z direction of the intersecting wall portion 15x. The cooling groove 25 includes a connecting groove portion 25y provided corresponding to a position opposite to the connecting wall portion 15y in the Z direction. The connecting groove portion 25y extends along the Y direction in the substantially central portion of the base plate 11. As shown in FIG.

In FIG. 6, the amount of depression in the Z direction of the cooling grooves 25 is substantially the same. In other words, the two intersecting groove portions 25x and the one connecting groove portion 25y are groove portions having approximately the same recess amount. The cooling groove 25 has a semicircular cross-sectional shape along the lateral direction. An opening is formed in a part of the intersecting groove 25x.

In FIG. 7, the control board 90 has a first main surface 91 facing the semiconductor cooler 85 and a second main surface 92 opposite to the first main surface 91 . . The electronic component 95 is mounted on each of the first principal surface 91 and the second principal surface 92 . In other words, the electronic components 95 are mounted on both sides of the control board 90 . The normal direction of the first main surface 91 is the Z direction.

On the first main surface 91, a preferential cooling component 95c is mounted on the projection plane of the intersecting groove portion 25x in the Z direction. The priority cooling component 95c is a component that needs to be cooled preferentially among the electronic components 95 for reasons such as a large amount of heat generation and a low allowable upper limit temperature. The preferential cooling component 95c is a component having a protrusion amount larger than the board thickness of the control board 90 . The priority cooling component 95c is, for example, an isolation transformer. However, the priority cooling component 95c is not limited to the insulating transformer, and may be a component such as an electrolytic capacitor or a semiconductor component. Components such as insulating transformers and electrolytic capacitors generate a large amount of heat and tend to reach high temperatures. For this reason, it is a component whose thermal life tends to become a problem.

A part of the cooling groove 25 is shaped along the shape of the semiconductor cooler 85 . More specifically, the intersecting groove portion 25x has an inclined surface that is inclined along the cylindrical shape of the connecting pipe 86 toward the semiconductor cooler 85 . If the crossing grooves 25x were not formed in the base plate 11 and the base plate 11 had a flat plate shape, a dead space would be generated between the flat base plate 11 and the cylindrical connecting pipe 86. . The intersecting groove portion 25x is recessed in a direction approaching the connecting pipe 86 so as to fill this dead space.

The semiconductor cooler 85 cools the semiconductor module 81 and the surroundings of the semiconductor cooler 85 . More specifically, the semiconductor cooler 85 cools the base plate 11 facing the semiconductor cooler 85 in the Z direction. Further, the semiconductor cooler 85 cools the partition wall 15 facing the semiconductor cooler 85 in the Y direction and the X direction. Since the base plate 11 and the partition wall 15 are continuous integral parts, the entire base plate 11 including the partition wall 15 and the cooling grooves 25 is easily cooled. However, the portion of the base plate 11 closer to the semiconductor cooler 85 is more likely to be cooled, and the farther from the semiconductor cooler 85, the more difficult it is to be cooled.

By cooling the base plate 11 , cold heat is also transmitted to the periphery of the base plate 11 . As a result, the first main surface 91 of the control substrate 90 is particularly cooled. In other words, the control board 90 is indirectly cooled by the semiconductor cooler 85 via the base plate 11 . If the configuration does not include the base plate 11 , the control board 90 would be directly cooled by the semiconductor cooler 85 .

In FIG. 8, the area of the first main surface 91 facing the semiconductor cooler 85 in the Z direction is a preferential cooling area 91c. The preferential cooling region 91 c is a region of the first main surface 91 that is close to the semiconductor cooler 85 . In other words, the preferential cooling region 91 c is a region that is easily cooled by the semiconductor cooler 85 .

A portion of the priority cooling component 95c is mounted in the priority cooling area 91c. Part of the priority cooling component 95c is provided in a region of the priority cooling region 91c where the connecting pipe 86 and the first main surface 91 face each other. Here, in the semiconductor cooler 85, the temperature of the upstream side connecting pipe 86u through which the cooling medium flows before exchanging heat with the semiconductor module 81 tends to be the lowest. A region of the preferential cooling region 91c facing the connecting pipe 86 is less affected by the heat from the semiconductor module 81 that generates heat when energized, compared to a region of the preferential cooling region 91c facing the flat pipe 87. Hard to accept.

In FIG. 9, a portion of the preferential cooling component 95c is inserted into the intersecting groove portion 25x forming a portion of the cooling groove 25. As shown in FIG. In other words, a portion of the preferential cooling component 95c and the intersecting groove portion 25x face each other in the Y direction. The priority cooling component 95c faces the intersecting groove portion 25x in two directions, ie, the Z direction and the Y direction.

Base plate 11 is cooled by semiconductor cooler 85 . Therefore, the cooling grooves 25 formed integrally with the base plate 11 are also easily cooled. Therefore, the priority cooling component 95c is cooled by the intersecting grooves 25x on the surfaces facing the intersecting grooves 25x. On the other hand, among the electronic components 95 mounted on the first main surface 91 , the electronic components 95 not inserted into the cooling grooves 25 are cooled from the Z direction facing the base plate 11 . Also, the electronic components 95 mounted on the second main surface 92 are cooled via the control board 90 .

The Z-direction distance from the first main surface 91 to the end of the preferential cooling component 95c is greater than the Z-direction distance from the first main surface 91 to a portion of the base plate 11 where the cooling grooves 25 are not formed. In other words, depending on the location of the control board 90 , the distance from the first main surface 91 to the base plate 11 is smaller than the amount of protrusion of the preferential cooling component 95 c from the first main surface 91 .

According to the embodiments described above, at least some of the electronic components 95 are preferential cooling components 95c mounted on the first main surface 91 . Therefore, the preferential cooling component 95c can be mounted on the surface close to the semiconductor cooler 85 for effective cooling. Therefore, it is possible to provide the power conversion device 1 that can easily cool the priority cooling component 95c that is the electronic component 95 mounted on the control board 90 . As a result, it is possible to prevent the temperature of the priority cooling component 95c from rising excessively, and to stably maintain an appropriate operation.

In addition, since the priority cooling component 95c is provided on the first main surface 91, the center of gravity of each component such as the semiconductor cooler 85 arranged in the power conversion device 1 and the center of gravity of the priority cooling component 95c can be easily brought close to each other. . Therefore, even when the power conversion device 1 vibrates due to an external force, it is easy to maintain the position of each component in the storage case 10 in an appropriate state. For example, when the first main surface 91 is directed downward in the gravitational direction, the center of gravity can be positioned lower than when all the electronic components 95 are mounted on the second main surface 92 . Thereby, the vibration resistance of the power conversion device 1 can be improved. When the power conversion device 1 is mounted on a moving body such as a vehicle, a large vibration may be applied during running. Therefore, a configuration capable of improving vibration resistance is very important when the power conversion device 1 is mounted on a moving body.

The priority cooling component 95c is arranged in the priority cooling area 91c. Therefore, the priority cooling component 95c is arranged at a position close to the semiconductor cooler 85. FIG. Therefore, cooling by the semiconductor cooler 85 via the base plate 11 can effectively cool the priority cooling component 95c.

The preferential cooling region 91c is a portion facing the connecting pipe 86 or a portion facing the flat tube 87 positioned at the end in the stacking direction among the plurality of stacked flat tubes 87 . Therefore, the preferential cooling component 95c arranged in the preferential cooling area 91c can be cooled while facing the connecting pipe 86 and the flat pipe 87 located at the end. In particular, it is possible to effectively cool the priority cooling component 95c disposed at a position facing the upstream connecting pipe 86u through which the cooling medium flows before heat-exchanging with the semiconductor module 81 .

The priority cooling component 95 c is the component closest to the semiconductor cooler 85 among the plurality of electronic components 95 mounted on the control board 90 . Therefore, the priority cooling component 95 c can be effectively cooled by the semiconductor cooler 85 as compared with other electronic components 95 .

Base plate 11 is cooled by semiconductor cooler 85 and transmits cold heat toward first main surface 91 . Therefore, the first main surface 91 can be indirectly cooled by the semiconductor cooler 85 via the base plate 11 . In particular, by ensuring that the base plate 11 is wide enough to a position that does not overlap the semiconductor cooler 85 in the Z direction, the cold heat of the semiconductor cooler 85 can be transmitted over a wide range. For example, cold heat can be transmitted to the entire control board 90 . This makes it easier to reduce differences in temperature distribution in the control board 90 .

A portion of the preferential cooling component 95c is inserted into the cooling groove 25. As shown in FIG. Therefore, the priority cooling component 95c can be cooled also from the Y direction, which is a direction other than the Z direction, which is the direction in which the semiconductor cooler 85 and the control board 90 are arranged. Therefore, the priority cooling component 95c can be effectively cooled. Also, the distance from the first main surface 91 to the portion of the base plate 11 other than the cooling grooves 25 can be made smaller than the distance in the Z direction from the first main surface 91 to the end of the priority cooling component 95c. In other words, it is easy to reduce the dead space between the semiconductor cooler 85 and the base plate 11 and downsize the power converter 1 as a whole.

The cooling grooves 25 may be divided according to the shape of the priority cooling component 95c. For example, the intersecting groove portion 25x is divided into a plurality of rectangular shapes. According to this, the preferential cooling component 95c can be inserted into one of the rectangular intersecting grooves 25x. In this state, the distance in the X direction from the preferential cooling component 95c to the intersecting groove portion 25x can be shortened and brought closer. Therefore, the priority cooling component 95c can be cooled so as to surround it from three directions of the Z direction, the Y direction, and the X direction. Therefore, the priority cooling component 95c can be effectively cooled.

The priority cooling component 95 c is the largest electronic component 95 among the plurality of electronic components 95 . Therefore, the distance from the priority cooling component 95c to the semiconductor cooler 85 can be easily shortened compared to the case where the priority cooling component 95c is an electronic component 95 having a small size. Therefore, it is possible to prevent a situation in which a long distance from the priority cooling component 95c to the semiconductor cooler 85 has to be ensured due to the other large-sized electronic components 95 provided on the first main surface 91 .

Second Embodiment This embodiment is a modification based on the preceding embodiment. In this embodiment, a preferential cooling component 295c is provided at a position facing the flattened tube 87 located at the end.

In FIG. 10, the preferential cooling component 295c is provided at a position facing the flat tubes 87 positioned at both ends in the X direction among the plurality of flat tubes 87 stacked in the X direction. Here, the flat tubes 87 positioned at both ends in the X direction are in contact with the semiconductor module 81 only on one side, and are not in contact with the semiconductor module 81 on the other side. For this reason, compared to the flat tubes 87 that are not located at both ends in the X direction, the cooling medium flowing inside is less likely to warm. Therefore, it is easy to effectively cool the priority cooling component 295c using the low-temperature flat tube 87 .

The preferential cooling component 295 c is preferably provided at a position close to the outer peripheral wall portion 12 . According to this, in addition to the cooling effect from the Z direction via the base plate 11, the cooling effect from the X direction via the outer peripheral wall part 12 can be obtained.

Other Embodiments Although the semiconductor module 81 and the semiconductor cooler 85 have been described as examples of the heat-generating component and the cooler, respectively, the heat-generating component and the cooler are not limited to the above examples. For example, a reactor may be provided as the heat-generating component, and a reactor cooler may be provided as the cooler.

Although the case where the electronic components 95 are provided on each of the first main surface 91 and the second main surface 92 has been described as an example, all the electronic components 95 may be provided on the first main surface 91 . According to this, the work of mounting the electronic component 95 on the control board 90 can be completed on one side. Therefore, compared to the case where the electronic components 95 are mounted on both sides of the control board 90, the workability of mounting the electronic components 95 can be easily improved.

The disclosure in this specification, drawings, etc. is not limited to the illustrated embodiments. The disclosure encompasses the illustrated embodiments and variations thereon by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and/or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure encompasses omitting parts and/or elements of the embodiments. The disclosure encompasses permutations or combinations of parts and/or elements between one embodiment and another. The disclosed technical scope is not limited to the description of the embodiments. The disclosed technical scope is indicated by the description of the claims, and should be understood to include all changes within the meaning and range of equivalents to the description of the claims.

The disclosure in the specification, drawings, etc. is not limited by the description in the claims. The disclosure in the specification, drawings, etc. encompasses the technical ideas described in the claims, and extends to more diverse and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure of the specification, drawings, etc., without being bound by the scope of claims.

Reference Signs List 1 power conversion device 10 storage case 11 base plate 25 cooling groove 25x intersection groove 25y connection groove 80 semiconductor unit 81 semiconductor module (heat generating component) 85 semiconductor cooler (cooler) 86 connection pipe 86u upstream connecting pipe 86d downstream connecting pipe 87 flat pipe 90 control board 91 first main surface 91c priority cooling area 92 second main surface 95 electronic component 95c priority cooling component 295c priority cooling component

Claims (5)

a heat-generating component (81) that generates heat when energized during power conversion;
a control board (90) mounted with a plurality of electronic components (95) for controlling energization of the heat-generating components;
a cooler (85) for cooling the heat generating component;
A storage case (10) storing the control board and the cooler facing each other,
The control board is
a first main surface (91), which is the surface facing the cooler;
a second main surface (92) opposite the first main surface;
at least part of the electronic component is a preferential cooling component (95c, 295c) mounted on the first main surface;
The storage case comprises a metal base plate (11) that partitions the inside of the storage case into a substrate storage space that stores the control substrate and a cooler storage space that stores the cooler,
The base plate is a member that is cooled by the cooler and transmits cold heat toward the first main surface,
The base plate has a cooling groove (25) recessed in a direction toward the cooler on the surface facing the control board,
A power converter , wherein a portion of the preferential cooling component is inserted into the cooling groove . The first main surface has a preferential cooling region (91c), which is a portion facing the cooler in the normal direction of the first main surface,
2. The power converter according to claim 1, wherein said preferential cooling component is arranged in said preferential cooling area. The cooler is a laminated cooler in which a plurality of flat tubes (87) connected by a connecting pipe (86) are stacked with the heat-generating component sandwiched therebetween,
The preferential cooling area is a portion facing the connecting pipe, or a portion facing the flat pipe positioned at an end in the stacking direction among the plurality of stacked flat pipes. 2. The power conversion device according to 2. The electric power according to any one of claims 1 to 3, wherein the priority cooling component is the electronic component closest to the cooler among the plurality of electronic components mounted on the control board. conversion device. The power converter according to any one of claims 1 to 4 , wherein the priority cooling component is the electronic component having the largest size among the plurality of electronic components.

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