JP7242130B2 - エキスパンド装置 - Google Patents
エキスパンド装置 Download PDFInfo
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- JP7242130B2 JP7242130B2 JP2019019550A JP2019019550A JP7242130B2 JP 7242130 B2 JP7242130 B2 JP 7242130B2 JP 2019019550 A JP2019019550 A JP 2019019550A JP 2019019550 A JP2019019550 A JP 2019019550A JP 7242130 B2 JP7242130 B2 JP 7242130B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
3 改質層
5 デバイス
7 エキスパンドシート
7a DAF(ダイアタッチフィルム)
9 フレーム
11 被加工物ユニット
13 分割溝
15 デバイスチップ
2,80 エキスパンド装置
4,84 フレーム固定ユニット
6,86 フレーム支持部
6a,8a,86a,88a 開口
8,88 フレーム押さえ部
10,46,90 エアシリンダ
12,48,92 ロッド
14,94 環状冷却路
16,96 分岐路
18,98 供給路
20,100,136 冷却エアー供給路
22,102 噴出口
24,104 ボルテックスチューブ
26,40,62,106,134,140,156 開閉弁
28,108 圧縮エアー供給源
30,110 冷却エアー供給源
32,112 拡張ユニット
34,124 保持テーブル(冷却プレート)
36,128 吸引路
38,130 吸引口
42,132 吸引源
44,120 冷却ユニット
50,142 シート収縮ユニット
52 ロッド
54,148 支持プレート
56,150 加熱ユニット
58,152 エアー供給路
58a,160 開口
60,138,154 エアー供給源
64,158 コイルヒーター
66,168 スイッチ
68,144,162 回転モーター
70,146,164 回転軸
72,166 シャッタープレート
72a,166a 開口
82 筐体
82a 搬出入口
82b 開閉扉
88b 貫通孔
88c フレーム押さえ部支持ボルト
88d シール部
114 拡張ローラー支持部
116 拡張ローラー
118 被加工物冷却ユニット
122 テーブル昇降ユニット
126 テーブルカバー
Claims (4)
- 被加工物と、該被加工物に貼着されたエキスパンドシートと、該エキスパンドシートの外周側が貼着された環状フレームと、を含む被加工物ユニットの該エキスパンドシートを拡張するエキスパンド装置であって、
被加工物ユニットの環状フレームを支持できるフレーム支持部と、該フレーム支持部と共に該環状フレームを挟持できるフレーム押さえ部と、を有したフレーム固定ユニットと、
該フレーム固定ユニットで固定された環状フレームを有した被加工物ユニットに含まれるエキスパンドシートを拡張できる拡張ユニットと、を備え、
該フレーム固定ユニットの該フレーム押さえ部は、噴出口と、一端が該噴出口に通じるとともに他端が冷却エアー供給源に通じる冷却エアー供給路と、を備え、
該噴出口は、該冷却エアー供給源から供給された冷却エアーを該フレーム固定ユニットで固定された環状フレームを有した被加工物ユニットに含まれるエキスパンドシートの被加工物と、該環状フレームの内周縁と、の間の領域に向かって噴出できることを特徴とするエキスパンド装置。 - 該フレーム固定ユニットの該フレーム押さえ部には、環状に並んで配置された複数の該噴出口が形成され、
該冷却エアー供給路は、環状冷却路と、該環状冷却路から複数の該噴出口にそれぞれ至る複数の分岐路と、一端が該冷却エアー供給源に通じ他端が該環状冷却路へ至る供給路と、を含み、
該冷却エアー供給源は、該環状冷却路に冷却エアーを供給することで該フレーム固定ユニットを冷却して該フレーム固定ユニットで固定された該環状フレームを有した該被加工物ユニットの該被加工物の周囲に冷却空間を形成できることを特徴とする請求項1に記載のエキスパンド装置。 - 該フレーム固定ユニットで固定された該環状フレームを有した該被加工物ユニットに含まれる該エキスパンドシートを介して該被加工物ユニットに含まれる該被加工物に接触可能な冷却プレートを更に備えることを特徴とする請求項1または請求項2のいずれかに記載のエキスパンド装置。
- 該拡張ユニットで拡張され弛みが生じた該エキスパンドシートを加熱し収縮させて該弛みを除去するシート収縮ユニットをさらに備え、
該シート収縮ユニットは、支持プレートと、該支持プレートに設けられた加熱ユニットと、該支持プレートに設けられた回転モーターと、該回転モーターに装着された回転軸と、該回転軸に接続されたシャッタープレートと、を備え、
該シャッタープレートは、該支持プレートにおける該加熱ユニットの配置に対応する配置で開口を備え、
該シート収縮ユニットは、該回転モーターを作動させ該回転軸を回転させて該シャッタープレートを回転させ、該加熱ユニットの位置と、該開口の位置と、をずらすことができ、
該シート収縮ユニットは、該回転モーターを作動させ該回転軸を回転させて該シャッタープレートを回転させ、該加熱ユニットの位置に該開口の位置を合わせ、該開口を通じて該加熱ユニットで該エキスパンドシートの該領域を加熱できることを特徴とする請求項1から請求項3のいずれかに記載のエキスパンド装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019019550A JP7242130B2 (ja) | 2019-02-06 | 2019-02-06 | エキスパンド装置 |
CN202010079512.7A CN111540693A (zh) | 2019-02-06 | 2020-02-04 | 扩展装置 |
TW109103411A TWI826641B (zh) | 2019-02-06 | 2020-02-04 | 擴展裝置 |
KR1020200013823A KR20200096879A (ko) | 2019-02-06 | 2020-02-05 | 익스팬드 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019019550A JP7242130B2 (ja) | 2019-02-06 | 2019-02-06 | エキスパンド装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020126960A JP2020126960A (ja) | 2020-08-20 |
JP7242130B2 true JP7242130B2 (ja) | 2023-03-20 |
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JP2019019550A Active JP7242130B2 (ja) | 2019-02-06 | 2019-02-06 | エキスパンド装置 |
Country Status (4)
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JP (1) | JP7242130B2 (ja) |
KR (1) | KR20200096879A (ja) |
CN (1) | CN111540693A (ja) |
TW (1) | TWI826641B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2023042263A1 (ja) * | 2021-09-14 | 2023-03-23 | ヤマハ発動機株式会社 | エキスパンド装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011077482A (ja) | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
US20140051232A1 (en) | 2012-08-20 | 2014-02-20 | William F. Burghout | Semiconductor die singulation method |
JP2018019007A (ja) | 2016-07-29 | 2018-02-01 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4851795B2 (ja) | 2006-01-13 | 2012-01-11 | 株式会社ディスコ | ウエーハの分割装置 |
JP6494360B2 (ja) | 2015-03-25 | 2019-04-03 | 株式会社ディスコ | 拡張装置 |
JP6846205B2 (ja) | 2017-01-12 | 2021-03-24 | 株式会社ディスコ | 分割装置及び分割方法 |
-
2019
- 2019-02-06 JP JP2019019550A patent/JP7242130B2/ja active Active
-
2020
- 2020-02-04 TW TW109103411A patent/TWI826641B/zh active
- 2020-02-04 CN CN202010079512.7A patent/CN111540693A/zh active Pending
- 2020-02-05 KR KR1020200013823A patent/KR20200096879A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011077482A (ja) | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
US20140051232A1 (en) | 2012-08-20 | 2014-02-20 | William F. Burghout | Semiconductor die singulation method |
JP2018019007A (ja) | 2016-07-29 | 2018-02-01 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI826641B (zh) | 2023-12-21 |
TW202030832A (zh) | 2020-08-16 |
CN111540693A (zh) | 2020-08-14 |
KR20200096879A (ko) | 2020-08-14 |
JP2020126960A (ja) | 2020-08-20 |
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