JP7117705B1 - electronic device - Google Patents

Abstract

To ensure reliability when a connector for providing electrical connection from the outside is later mounted on a circuit board having a conductive pattern formed on a substrate. A circuit board having a conductive pattern formed on one surface of a deformable base material, and a circuit board provided on the base material, electrically connected to the conductive pattern, and electrically connected to an external element provided outside. a connector comprising a terminal portion, a body portion surrounding the terminal portion, and a fixing portion provided at the lower end of the body portion and fixed to the base material, and a resin layer covering the other surface opposite to the one surface of the base material. and a fixing member to which the fixing portion is fixed while being embedded in the resin layer and in contact with the fixing portion.

Description

The present invention relates to electronic devices.

A multilayer structure having a first side and an opposite second side, preferably a flexible substrate film and a number of conductive layers optionally defining contact pads and/or conductors. conductive traces, preferably printed on a first side of the substrate film, and a plastic layer, the plastic layer and the substrate, the traces preferably printed on the first side of the substrate film to establish a desired predetermined circuit design; a plastic layer molded onto the first side of the substrate film to enclose the circuitry between the first side of the film and a plastic layer from the opposite second side of the substrate film to the first side; A connector, preferably flexible, for providing an external electrical connection to circuitry embedded thereon, one end of the connector having a predetermined contact on a first surface. While attached to the region, the other end is positioned on the second side of the substrate for coupling with an external element, and the intermediate connecting the two ends. The section is fed through an opening in the base film and preferably the opening extending through the thickness of the base film is sized to accommodate the connector without substantial additional clearance. A structure is known from U.S. Pat.

JP 2019-169722 A

The present invention ensures reliability in the case of post-mounting a connector that provides external electrical connection to a circuit board having a conductive pattern formed on a substrate.

In order to solve the above problems, the electronic device according to claim 1 comprises:
A circuit board in which a conductive pattern is arranged on one surface of a deformable base material;
a terminal portion provided on the base material, electrically connected to the conductive pattern and electrically connected to an external element provided outside; a body portion surrounding the terminal portion; a connector comprising a fixing portion provided at the lower end and fixed to the base material;
a resin layer covering the other surface of the substrate opposite to the one surface;
The contact surface embedded in the resin layer and in contact with the fixing part is exposed on one side of the base material and contacts with the fixing part so that it is flush with the one surface of the base material on which the conductive pattern is formed. a fixing member to which the fixing portion is fixed in a state of
It is characterized by

In order to solve the above problems, the electronic device according to claim 2 includes:
A circuit board in which a conductive pattern is arranged on one surface of a deformable base material;
a resin layer covering the other surface opposite to the one surface of the base material;
a terminal portion provided on the resin layer, penetrating the resin layer and the base material, electrically connected to the conductive pattern, and electrically connected to an external element provided outside; the terminal; a connector comprising a main body portion surrounding a portion, and a fixing portion provided at the lower end of the main body portion and fixed to the resin layer;
The fixing part is fixed in a state of being exposed to one surface side of the resin layer and in contact with the fixing part so that a contact surface embedded in the resin layer and in contact with the fixing part is flush with one surface of the resin layer. a fixed member that is
It is characterized by

The invention according to claim 3 is the electronic device according to claim 1 or 2 ,
The fixing member has an undercut shape formed at one end embedded in the resin layer,
It is characterized by

The invention according to claim 4 is the electronic device according to any one of claims 1 to 3 ,
The fixing part is fixed to the fixing member by soldering,
It is characterized by

The invention according to claim 5 is the electronic device according to any one of claims 1 to 3 ,
The fixing part is screw-fixed to the fixing member,
It is characterized by

The invention according to claim 6 is the electronic device according to any one of claims 1 to 3 ,
The fixing part is fixed to the fixing member with an adhesive,
It is characterized by

The invention according to claim 7 is the electronic device according to any one of claims 1 to 6 ,
wherein the connector is a commonly available connector;
It is characterized by

According to the first aspect of the invention, reliability can be ensured when a connector for providing electrical connection from the outside is later mounted on a circuit board having a conductive pattern formed on a base material.

According to the second aspect of the invention, it is possible to stabilize the mounting of the connector that provides electrical connection from the outside to the circuit board having the conductive pattern formed on the base material.

According to the third aspect of the invention, it is possible to prevent the fixing member from coming off.

According to the fourth aspect of the invention, when the fixing portion is made of metal, the connector can be firmly fixed.

According to the fifth aspect of the invention, the connector can be firmly fixed regardless of the material of the fixing portion.

According to the sixth aspect of the invention, the connector can be fixed regardless of the material of the fixing portion.

According to the seventh aspect of the invention, reliability can be ensured when a connector for providing electrical connection from the outside is later mounted on a circuit board having a conductive pattern formed on a base material.

FIG. 1A is a schematic plan view showing an example of an electronic device according to this embodiment, and FIG. 1B is a schematic cross-sectional view showing an example of the electronic device. FIG. 2A is a schematic partial plan view for explaining fixing of a connector of an electronic device, FIG. 2B is a schematic partial cross-sectional view for explaining fixing of a connector of an electronic device, and FIG. 2C shows an example of an anchor portion of a fixing member for fixing the connector. It is a partial cross-sectional schematic diagram. 3A is a schematic partial plan view illustrating fixing of the connector of the electronic device according to Modification 1, and FIG. 3B is a schematic partial cross-sectional view illustrating fixing of the connector of the electronic device according to Modification 1. FIG. 4A is a schematic partial cross-sectional view illustrating fixing of the connector of the electronic device according to Modification 2, and FIG. 4B is a schematic partial plan view illustrating fixing of the connector of the electronic device according to Modification 2. FIG. It is a flowchart figure which shows an example of the procedure of the outline of the manufacturing method of an electronic device. It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of an electronic device. 7A is a schematic plan view showing an example of the electronic device according to the second embodiment, and FIG. 7B is a schematic cross-sectional view showing an example of the electronic device according to the second embodiment. 8A is a schematic partial plan view for explaining fixing of the connector of the electronic device according to the second embodiment, and FIG. 8B is a schematic partial cross-sectional view for explaining fixing of the connector of the electronic device according to the second embodiment. FIG. 10 is a flow chart diagram showing an example of a schematic procedure of a method for manufacturing an electronic device according to the second embodiment; It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of the electronic device which concerns on 2nd Embodiment.

Next, specific examples of embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.
It should be noted that in the following description using the drawings, the drawings are schematic, and the ratio of each dimension is different from the actual one. Illustrations other than members are omitted as appropriate.

"First Embodiment"
(1) Overall configuration of electronic device 1 FIG. 1A is a schematic plan view showing an example of the electronic device 1 according to the first embodiment, FIG. 1B is a schematic cross-sectional view showing an example of the electronic device 1, and FIG. FIG. 2B is a partial schematic plan view for explaining fixing of the connector 5, FIG. 2B is a partial schematic cross-sectional view for explaining fixing of the connector 5 of the electronic device 1, and FIG. It is a cross-sectional schematic diagram.
Hereinafter, the configuration of the electronic device 1 according to the first embodiment will be described with reference to the drawings.

The electronic device 1 includes a circuit board 4 having a conductive pattern 3 arranged on one surface 2a of a deformable base material 2, and a circuit board 4 provided on the base material 2, electrically connected to the conductive pattern 3, and provided outside. A connector 5 comprising a terminal portion 51 for electrically connecting to an external element, a body portion 52 surrounding the terminal portion 51, and a fixing portion 53 provided at the lower end of the body portion 52 and fixed to the base material 2. a resin layer 6 covering the other surface 2b of the base material 2 opposite to the one surface 2a; and

(Base material)
The base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material. Here, a "deformable substrate" is one that can be deformed after placement of the conductive pattern 3, i.e. from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or air pressure forming. It means a substrate that can be deformed into a shape.

Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyether ether ketone (PEEK), acrylic butadiene styrene ( ABS), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC) and other thermoplastic resins.
In particular, polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.

One surface 2a of the substrate 2 is preferably surface-treated in order to evenly apply catalyst ink such as metal nanoparticles. As the surface treatment, for example, corona treatment, plasma treatment, solvent treatment, primer treatment, or the like can be used.

(Conductive pattern)
When the conductive pattern 3 is arranged on the one surface 2a of the base material 2, first, a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers growth of the metal plating is formed in a predetermined pattern. The base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 2, followed by drying and baking.

The thickness (μm) of the underlayer is preferably 0.1 to 20 μm, more preferably 0.2 to 5 μm, most preferably 0.5 to 2 μm. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.

Gold, silver, copper, palladium, nickel, and the like are used as the material of the catalyst. Gold, silver, and copper are preferable from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferable.

The particle size (nm) of the catalyst is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.

The conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating. As the plating metal, copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.

The thickness (μm) of the plating layer is preferably 0.03 to 100 μm, more preferably 1 to 35 μm, most preferably 3 to 18 μm. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plating layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.

(Electronic parts)
Although the conductive pattern 3 is arranged as a touch sensor 3A in FIG. 1, a plurality of electronic components 3B may be attached to the conductive pattern 3 . The electronic components 3B include control circuits, strain, resistance, capacitance, contact sensing such as TIR, and photodetection components, tactile components or vibration components such as piezoelectric actuators or vibration motors, light emitting components such as LEDs, microphones and Producing or receiving sounds such as speakers, device operating components such as memory chips, programmable logic chips and CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.

(connector)
A plurality of connector connection pads 3a are formed at one end of the conductive pattern 3, and a connector 5 for electrical connection with an external element is electrically connected.
The connector 5 is a generally available connector, and includes a terminal portion 51 for electrically connecting to the conductive pattern 3 and electrically connecting to an external element provided outside, and a body portion holding the terminal portion 51. 52, and a fixing portion 53 for fixing the body portion 52 to the circuit board 4 on which the connector 5 is arranged.

The terminal portion 51 has a connection portion 51 a surface-mounted on the circuit board 4 , and the connection portion 51 a is soldered to a connector connection pad 3 a formed at one end of the conductive pattern 3 .
The fixing portion 53 has a holding portion 53a held by the body portion 52 and a tail portion 53b fixed to the fixing member 7 in contact with the fixing member 7 embedded in the resin layer 6 described later.
The fixing part 53 is preferably made of metal and is fixed to the fixing member 7 by soldering, but it is not necessarily made of metal. good.

Since the fixing portion 53 is fixed with the tail portion 53b in contact with the fixing member 7 embedded in the resin layer 6, the fixing strength of the connector 5 to the circuit board 4 is increased.
In particular, when the connector 5 is fitted to the mating connector, the connector 5 collides with the mating connector, and a force acts on the connector 5 in a direction crossing the thickness direction of the substrate 2 . At this time, the fixing portion 53 is fixed in contact with the fixing member 7 embedded in the resin layer 6 covering the other surface 2b of the substrate 2 opposite to the one surface 2a on which the conductive pattern 3 is arranged. Therefore, the load applied to the solder between the conductive pattern 3 of the circuit board 4 and the connection portion 51a can be reliably reduced.

(resin layer)
The resin layer 6 is formed so as to cover the other surface 2b of the substrate 2 via the adhesive layer AD with respect to the other surface 2b opposite to the one surface 2a of the substrate 2 on which the conductive pattern 3 is arranged. there is The adhesive layer AD may be toned to hide the conductive pattern 3 invisibly from the outside. In addition, the resin layer 6 is formed by making the adhesive layer AD light-transmitting and using a transparent resin material as the resin material. It can be visible.

The resin layer 6 is a thermoplastic resin made of an injection-moldable thermoplastic resin material. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof. A plastic resin can be used.

(fixing member)
As shown in FIG. 2B, the fixing member 7 penetrates the anchor portion 71 embedded inside the resin layer 6 and the base material 2 in the thickness direction of the base material 2 and is exposed on the one surface 2a side of the base material 2. It consists of a contact surface 72 that contacts the tail portion 53b of the connector 5 that is surface-mounted.

The contact surface 72 is exposed on the one surface 2a side of the base material 2 so as to be flush with the one surface 2a of the base material 2 . The connector 5 surface-mounted on the circuit board 4 is fixed to the contact surface 72 by the tail portion 53 b of the fixing portion 53 . Fixing methods include soldering, screw fixing, and bonding with an adhesive. Since the contact surface 72 is flush with the one surface 2 a of the base material 2 , the connector 5 can be prevented from floating from the base material 2 .

The fixing member 7 is made of metal, and the anchor portion 71 is insert-molded with the resin layer 6 and embedded inside the resin layer 6 . Therefore, as shown in FIG. 2B, the anchor portion 71 may be formed to connect the contact surfaces 72 provided in alignment with the tail portions 53b of the fixing portions 53 provided to protrude from both sides of the connector 5. It may well have an undercut feature 71a at one end, as shown in FIG. 2C. As a result, it is possible to prevent the fixing member 7 from coming off.

"Modification 1"
3A is a schematic partial plan view explaining fixing of the connector 5 of the electronic device 1 according to Modification 1, and FIG. 3B is a schematic partial cross-sectional view explaining fixing of the connector 5 of the electronic device 1 according to Modification 1. FIG. .
The electronic device 1 according to Modification 1 includes a fixing member 7A that contacts and fixes the fixing portion 53 of the connector 5 that is surface-mounted on the circuit board 4 so as to press the fixing portion 53 from above.

The fixing member 7A includes an anchor portion 71 embedded inside the resin layer 6, and a connector 5 which penetrates the base material 2 in the thickness direction of the base material 2 and protrudes toward the one surface 2a side of the base material 2 to be surface-mounted. The contact surface 72A contacts and fixes the tail portion 53b so as to press it from above.
To reduce a load applied to solder between a conductive pattern 3 of a circuit board 4 and a connection part 51a without fixing a tail part 53b of the connector 5 with solder or the like when an external force acts on the connector 5. - 特許庁can be done.

"Modification 2"
4A is a partial cross-sectional schematic diagram illustrating fixing of the connector 5 of the electronic device 1 according to Modification 2, and FIG. 4B is a partial plan view illustrating fixing of the connector 5 of the electronic device 1 according to Modification 2. FIG. .
An electronic device 1 according to Modification 2 includes a circuit board 4 in which a conductive pattern 3 is arranged on one surface 2a of a deformable base material 2, and a resin covering the other surface 2b of the base material 2 opposite to the one surface 2a. a layer 6, and a terminal portion provided on the resin layer 6, penetrating the resin layer 6 and the base material 2, electrically connected to the conductive pattern 3, and electrically connected to an external element provided outside. 51, a body portion 52 surrounding the terminal portion 51, and a fixing portion 53 provided at the lower end of the body portion 52 and fixed to the resin layer 6; and a fixing member 7B to which the fixing portion 53 is fixed in a state in which the fixing member 7B is fixed.

The fixing member 7B is composed of an anchor portion 71B embedded inside the resin layer 6 and a contact surface 72B that is exposed on the one surface 6a side of the resin layer 6 and contacts the tail portion 53b of the connector 5 that is surface-mounted.

The contact surface 72B is exposed on the one surface 6a side of the resin layer 6 so as to be flush with the one surface 6a of the resin layer 6 . A tail portion 53b of the fixing portion 53 of the connector 5 is fixed to the contact surface 72B. Fixing methods include soldering, screw fixing, and bonding with an adhesive. Since the contact surface 72</b>B is flush with the surface 6 a of the resin layer 6 , the connector 5 can be prevented from floating from the resin layer 6 .

(2) Manufacturing method of the electronic device 1 FIG. 5 is a flow chart showing an example of the outline procedure of the manufacturing method of the electronic device 1, and FIG. It is a diagram.
The electronic device 1 includes a preparation step S11 for the base material 2, a wiring plating step S12 for arranging the conductive pattern 3 on the base material 2, and positioning the circuit board 4 and the fixing member 7 in the injection mold. a resin filling step S13 for insert-molding the resin layer 6 covering the other surface 2b of the base material 2 and the fixing member 7; It is manufactured through step S<b>14 and fixing step S<b>15 of fixing the tail portion 53 b of the connector 5 to the contact surface 72 of the fixing member 7 .

(Base material preparation step S11)
In the base material preparation step S11, first, the contact surface 72 of the fixing member 7 is exposed on the one surface 2a side of the substantially flat film-like base material 2 formed in a predetermined shape and size. to form a notch 2c (see FIG. 6A).

Then, in order to dispose the conductive pattern 3 on the base material 2, a base layer made of catalyst particles such as metal nanoparticles that trigger the growth of the metal plating is formed on the base material 2 in a predetermined pattern. The substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, primer treatment, etc., in order to uniformly apply the catalyst ink composed of catalyst particles such as metal nanoparticles.

Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.

Specifically, after applying a low-viscosity catalyst ink of 1000 cps or less, for example, 2 cps to 30 cps, by an inkjet printing method, the solvent is volatilized to leave only the metal nanoparticles. After that, the solvent is removed (drying) and the metal nanoparticles are sintered (firing).
The firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the sintering of the metal nanoparticles will be insufficient, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.

(Wiring plating step S12)
Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 6B). The plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.

(Resin filling step S13)
In the resin filling step S13, first, an adhesive layer AD is formed on the other surface 2b of the substrate 2 opposite to the surface 2a on which the conductive pattern 3 is arranged, depending on the combination of the resin materials of the substrate 2 and the resin layer 6. Apply the forming binder ink (see FIG. 6C). Further, it is preferable to apply the binder ink to the anchor portions 71 of the fixing member 7 as well. The binder ink contains an adhesive resin and is applied by screen printing, inkjet printing, spray coating, brush coating, or the like to improve the adhesiveness between the base material 2 and the injection-molded resin layer 6 and between the resin layer 6 and the fixing member 7. Improve.

Next, the base material 2 on which the conductive pattern 3 is arranged and the fixing member 7 are positioned and set in the injection mold (see FIG. 6D), the mold K is closed, and the cavity CA1 is filled with resin. . The resin layer 6 covering the other surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. It will be in the state exposed to the one surface 2a side of the base material 2 so that it may become flush with.

(Electrical joining step S14)
In the electrical connection step S14, the connector connection pad 3a formed at one end of the conductive pattern 3 and the connection portion 51a of the connector 5 are electrically connected with solder W. As shown in FIG. The solder W is desirably a low-temperature solder having a melting temperature lower than the softening point of the base material 2. For example, when polyethylene terephthalate (PET) is used as the base material 2, it is 120 to 140° C. lower than the softening point of the base material 2. It is desirable to have a melting point of
By using a solder paste with a melting point lower than the softening point of the base material 2, the base material 2 does not melt or otherwise deform while the solder paste melts and bonds chemically and physically with the connector connection pads 3a. be ready to join. Then, the solder W is solidified, and the connecting portion 51a of the connector 5 is electrically joined to the conductive pattern 3 via the solder W (see FIG. 6E).

Also, laser soldering or photobaking soldering may be used to join the connecting portions 51a of the connector 5 and the connector connection pads 3a. In this case, the solder is not limited to low-temperature solder, but ordinary solder may be used because it is non-contact and does not apply a load to the base material 2 as compared to soldering with a soldering iron.

(Fixing step S15)
In the fixing step S15, the tail portion 53b of the connector 5 is mechanically joined and fixed to the contact surface 72 of the fixing member 7 exposed on the one surface 2a side of the base material 2 so as to be flush with the one surface 2a of the base material 2. do.
Fixing methods include soldering, screw fixing, and bonding with an adhesive.
By fixing the tail portion 53b of the connector 5 to the contact surface 72 of the fixing member 7, the load applied to the solder between the connector connection pad 3a of the circuit board 4 and the connection portion 51a of the connector 5 can be reliably reduced. , peeling of the conductive pattern 3 can be suppressed.

"Second Embodiment"
7A is a schematic plan view showing an example of an electronic device 1A according to the second embodiment, FIG. 7B is a schematic cross-sectional view showing an example of the electronic device 1A according to the second embodiment, and FIG. 8A is an electronic device according to the second embodiment. FIG. 8B is a partial schematic plan view explaining fixing of the connector 5 of the device 1A, and FIG. 8B is a partial schematic cross-sectional view explaining fixing of the connector 5 of the electronic device 1A according to the second embodiment.
Hereinafter, the configuration of the electronic device 1A according to the second embodiment will be described with reference to the drawings.

(1) Configuration of electronic device 1A The electronic device 1A includes a circuit board 4 in which a conductive pattern 3 is arranged on one surface 2a of a deformable base material 2, and a circuit board 4 provided on the base material 2. a terminal portion 51 for electrically connecting to an external element provided outside; a housing 52 surrounding the terminal portion 51; , a resin layer 6 covering the other surface 2b of the side opposite to the one surface 2a of the base material 2, and a part of the resin layer 6 penetrates the base material 2 and extends toward the one surface 2a side of the base material 2. and a fixing body 8 that covers and fixes the fixing portion 53 by pressing it.

That is, in the electronic device 1A according to the second embodiment, a part of the resin layer 6 penetrates the base material 2 and extends toward the one surface 2a side of the base material 2 to cover the fixing portion 53 of the surface-mounted connector 5. The electronic device 1 is different from the electronic device 1 according to the first embodiment in that it includes a fixing body 8 that presses and fixes the fixing portion 53 in a state. Therefore, the same reference numerals are given to the common parts with the first embodiment, and the detailed explanation thereof will be omitted.

As shown in FIGS. 7A and 8A, the connector 5 has the terminal portion 51 soldered to the connector connection pad 3a of the conductive pattern 3, and the tail portion 53b of the fixing portion 53 is in contact with the surface 2a of the substrate 2. It is surface-mounted on the circuit board 4 in this state.
The base material 2 is provided with a through hole 2c (see FIG. 9A) passing through the base material 2 in the thickness direction on the side of the region where the tail portion 53b is in contact. A fixed body 8 projecting from the substrate 2 toward the one surface 2a side is formed, and is fixed by pressing while covering the fixed portion 53 .

The connector 5 is fixed to the circuit board 4 by pressing and fixing the fixing portion 53 with the tail portion 53b covering the tail portion 53b with the fixing body 8 extending through the base material 2 from the resin layer 6 side. The strength is increased, and the load applied to the solder between the conductive pattern 3 and the connection portion 51a can be reliably reduced.

(2) Manufacturing Method of Electronic Device 1A FIG. 9 is a flow chart diagram showing an example of a schematic procedure of a manufacturing method of the electronic device 1A, and FIG. It is a diagram.
The electronic device 1A includes a preparation step S21 of the substrate 2, a wiring plating step S22 of forming the conductive pattern 3 on the substrate 2, and an electrical connection between the conductive pattern 3 and the connection portion 51a of the connector 5 by soldering. and the circuit board 4 with the connector 5 mounted thereon is positioned in the injection mold, and the resin layer 6 covering the other surface 2b of the base material 2 and the tail portion 53b of the connector 5 are joined together. and a resin filling step S24 for integrally forming the fixed body 8 to be fixed.

(Base material preparation step S21)
In the base material preparation step S21, first, a substantially flat film-like base material 2 having a predetermined shape and size is formed with through holes 2c penetrating in the thickness direction of the base material 2 ( (see Figure 10A). The through hole 2c is a hole that communicates between the cavity CA1 forming the resin layer 6 and the cavity CA2 forming the fixed body 8, and is formed in accordance with the position where the fixed body 8 is formed.

Next, in the same manner as in the first embodiment, a base layer made of catalyst particles such as metal nanoparticles that trigger the growth of metal plating is formed on the base material 2 in a predetermined pattern, and the wiring plating step S22 is performed. A conductive pattern 3 is placed on the substrate (see FIG. 10B).

(Electrical joining step S23)
In the electrical connection step S23, the connector connection pad 3a formed at one end of the conductive pattern 3 and the connection portion 51a of the connector 5 are electrically connected with solder W (see FIG. 10C).

(Resin filling step S24)
In the resin filling step S24, first, an adhesive layer AD is formed on the other surface 2b of the substrate 2 opposite to the surface 2a on which the conductive pattern 3 is arranged, depending on the combination of the resin materials of the substrate 2 and the resin layer 6. Apply the forming binder ink. It is also preferable to apply the binder ink to the tail portion 53b of the connector 5 (see FIG. 10D). The binder ink contains an adhesive resin and improves the adhesiveness between the base material 2 and the injection-molded resin layer 6 and between the tail portion 53 b of the connector 5 and the fixed body 8 .

Next, in a state in which the substrate 2 with the connector 5 surface-mounted is positioned and set in the injection mold (see FIG. 10D), the mold K is closed and the cavity CA1 is filled with resin. A resin layer 6 covering the other surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. The resin filling the cavity CA1 is filled into the cavity CA2 formed on the one surface 2a side of the substrate 2 where the conductive pattern 3 is arranged from the through hole 2c formed in the substrate 2. FIG. The resin filled in the cavity CA2 forms a fixing body 8 that covers and fixes the tail portion 53b of the fixing portion 53 (see FIG. 10E).

As described above, according to the method of manufacturing the electronic device 1A according to the present embodiment, the tail portion 53b of the connector 5 surface-mounted on the circuit board 4 having the conductive pattern 3 formed on the base material 2 is covered. It is possible to provide a fixing body 8 for pressing and fixing in the folded state.

DESCRIPTION OF SYMBOLS 1, 1A... Electronic device 2... Base material 2a... One side (conductive pattern 3 side), 2b... Other side, 2c... Through hole 3... Conductive pattern 3a... - Connector connection pad 3A... Touch sensor 3B... Electronic component 4... Circuit board 5... Connector 51... Terminal part, 51a... Connection part 52... Body part 53... Fixing portion 53a Holding portion 53b Tail portion 6 Resin layer 7, 7A, 7B Fixing member 71, 71A, 71B Anchor portion
72, 72A, 72B Contact surface 71a Undercut shape 8 Fixed body K Mold for injection molding CA1, CA2 Cavity

Claims (7)

A circuit board in which a conductive pattern is arranged on one surface of a deformable base material;
a terminal portion provided on the base material, electrically connected to the conductive pattern and electrically connected to an external element provided outside; a body portion surrounding the terminal portion; a connector comprising a fixing portion provided at the lower end and fixed to the base material;
a resin layer covering the other surface of the substrate opposite to the one surface;
The contact surface embedded in the resin layer and in contact with the fixing part is exposed on one side of the base material and contacts with the fixing part so that it is flush with the one surface of the base material on which the conductive pattern is formed. a fixing member to which the fixing portion is fixed in a state of
An electronic device characterized by: A circuit board in which a conductive pattern is arranged on one surface of a deformable base material;
a resin layer covering the other surface opposite to the one surface of the base material;
a terminal portion provided on the resin layer, penetrating the resin layer and the base material, electrically connected to the conductive pattern, and electrically connected to an external element provided outside; the terminal; a connector comprising a main body portion surrounding a portion, and a fixing portion provided at the lower end of the main body portion and fixed to the resin layer;
The fixing part is fixed in a state of being exposed to one surface side of the resin layer and in contact with the fixing part so that a contact surface embedded in the resin layer and in contact with the fixing part is flush with one surface of the resin layer. a fixed member that is
An electronic device characterized by: The fixing member has an undercut shape formed at one end embedded in the resin layer,
3. The electronic device according to claim 1, wherein: The fixing part is fixed to the fixing member by soldering,
The electronic device according to any one of claims 1 to 3 , characterized in that: The fixing part is screw-fixed to the fixing member,
The electronic device according to any one of claims 1 to 3 , characterized in that: . The fixing part is fixed to the fixing member with an adhesive,
The electronic device according to any one of claims 1 to 3 , characterized in that: wherein the connector is a commonly available connector;
The electronic device according to any one of claims 1 to 6 , characterized in that:

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