JP7114176B2 - Processing method of resin package substrate - Google Patents

Description

The present invention relates to a method of processing a resin package substrate having a device region and a mold resin layer covering the back side of the device region.

2. Description of the Related Art In electronic equipment represented by mobile phones and personal computers, device chips having devices such as electronic circuits are essential components. Device chips are produced by, for example, partitioning the surface of a wafer made of a semiconductor material such as silicon into a plurality of planned cutting lines (streets), forming devices in each region, and then cutting the wafer along the planned cutting lines. obtained by

Each of the plurality of device chips obtained by the above method is, for example, fixed to a substrate for QFN (Quad For Non-Lead Package), electrically connected to the substrate by a method such as wire bonding, and then molded with a mold resin. Sealed. Then, by cutting the resin package substrate on which the device chips are sealed with the mold resin along the planned cutting lines corresponding to the respective device chips, a package device with the device chips sealed with the resin is obtained.

By the way, before cutting the resin package substrate along the planned cutting line, the mold resin of the resin package substrate may be ground for the purpose of thinning the package device. For example, the side (front side) of the resin package substrate opposite to the mold resin is held by suction with a chuck table, and the mold resin on the back side is ground with a grinding wheel (see, for example, Patent Document 1).

However, the resin package substrate may warp after sealing due to heat generated when the device chip arranged on the substrate is sealed with the mold resin. In addition, the resin package substrate may have unevenness formed by electrode patterns or the like provided on the surface side.

In this case, since the surface of the resin package substrate cannot come into contact with the holding surface of the chuck table for the porous plate due to the warp of the resin package substrate and the unevenness of the electrode pattern, the surface of the resin package substrate is sucked by the chuck table. difficult to hold.

JP 2015-85414 A

SUMMARY OF THE INVENTION An object of the present invention is to process a warped and uneven resin package substrate while holding the front side of the resin package substrate by suction with a chuck table.

According to one aspect of the present invention, a substrate having, on its surface, a device region having an electrode pattern with unevenness and a scrap region surrounding the device region; A method of processing a resin package substrate comprising: a mold resin layer covering the back surface side of a device region; a non-adhesive region having no adhesive layer corresponding to the device region; and a non-adhesive region corresponding to the scrap region. an adhesive tape preparation step of preparing an adhesive tape comprising: an adhesive area having the adhesive layer enclosing an adhesive tape; an adhesive tape attaching step of attaching the adhesive tape to the surface of the resin package substrate by attaching the adhesive area to the remnant material area while adhering it closely; and a curable liquid resin that is cured by applying a stimulus. a carrier sheet preparing step of preparing on a flat table a carrier sheet supplied to the upper surface of the carrier sheet; After the adhesive tape side of the adhesive tape is embedded, the curable liquid resin is cured by applying a stimulus to fix the resin package substrate and the carrier sheet with the curable liquid resin via the adhesive tape. A resin package substrate comprising: a step of fixing a curable liquid resin; and a grinding step of holding the carrier sheet side of the resin package substrate by suction with a chuck table and grinding a mold resin layer of the resin package substrate with a grinding wheel. is provided.

Further, according to one aspect of the present invention, the curable liquid resin is an ultraviolet curable liquid resin that is cured by irradiation with ultraviolet rays, and the carrier sheet is a member that transmits ultraviolet rays.

Further, according to one aspect of the present invention, in the step of attaching the adhesive tape, the adhesive tape is attached to the annular frame so that the resin package substrate is supported by the adhesive tape at the opening of the annular frame. be done.

According to the processing method of the present invention, the carrier sheet side of the curable liquid resin can be flattened by fixing the adhesive tape side of the resin package substrate to the flat carrier sheet through the curable liquid resin.

By bringing the carrier sheet into contact with the holding surface of the porous plate of the chuck table, the resin package substrate can be suction-held by the chuck table through the carrier sheet. As a result, the package substrate having unevenness can be processed while being sucked and held by the chuck table. In addition, the adhesive material forming the adhesive layer does not remain in the device region.

1A is a top view of the resin package substrate, FIG. 1B is a side view of the resin package substrate, and FIG. 1C is a bottom view of the resin package substrate. FIG. 2(A) is a top view of the adhesive tape, and FIG. 2(B) is a cross-sectional view taken along line II-II of FIG. 2(A). It is a figure explaining the adhesive tape sticking step which sticks an adhesive tape on the surface of a resin package board|substrate. It is a perspective view of a workpiece unit. FIG. 5A is a diagram showing a step of preparing a carrier sheet supplied with a curable liquid resin, and FIG. 5(C) is a diagram showing a curable liquid resin fixing step of fixing the workpiece unit and the carrier sheet via the curable liquid resin. FIG. 6 is an enlarged cross-sectional view of region R of FIG. 5(C); FIG. It is a figure which shows the grinding step which grinds the mold resin layer of a resin package board|substrate with a grinding wheel. It is a flow chart of a processing method of a resin package substrate.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. 1A is a top view of the resin package substrate 11, FIG. 1B is a side view of the resin package substrate 11, and FIG. 1C is a bottom view of the resin package substrate 11. .

1(A), 1(B) and 1(C) show the resin package substrate 11 before being cut along the line 19 to be cut. The resin package substrate 11 is, for example, a package substrate in which a plurality of device chips (not shown) are sealed with resin, and includes a substrate 13 formed in a rectangular shape in plan view.

The substrate 13 is made of a metal such as 42 alloy (alloy of iron and nickel), copper, or the like. It is divided into a scrap area 17 surrounding the device area 15 . Each device region 15 is partitioned into a plurality of regions in a grid pattern by a plurality of crossing planned cutting lines (streets) 19, and a stage 21 is formed in each region.

A device chip (not shown) including a device such as an IC (Integrated Circuit) is arranged on the rear surface side of each stage 21 (on the rear surface 13b side of the substrate 13). A mold resin layer 23 is formed in a region corresponding to each device region 15 on the back surface 13 b side of the substrate 13 , and the device chips arranged on the back surface side of each stage 21 are covered with this mold resin layer 23 . ing.

Around each stage 21 , a plurality of electrode patterns 25 that are part of the substrate 13 before being cut and are formed of metal are provided along the planned cutting lines 19 . The electrode pattern 25 is exposed on the surface 13a of the substrate 13, and protrudes from the surface 13a to a height of, for example, 20 μm or more and 300 μm or less. In addition, the electrode pattern 25 may include a plated layer formed in contact with the substrate 13 .

When the resin package substrate 11 is a QFN (Quad For Non-Lead Package), the electrode pattern 25 protrudes from the surface 13a by a predetermined length of several μm or more and several tens of μm or less. It protrudes from the side surface by a predetermined length of several micrometers or more and several tens of micrometers or less.

The electrode pattern 25 is a convex portion that protrudes outward from the surface 13a, and the portion where the electrode pattern 25 is not provided (that is, the region where the surface 13a is exposed) is a concave portion that is recessed from the electrode pattern 25. . In this manner, the electrode pattern 25 forms unevenness on the surface 13 a side of the substrate 13 .

The electrode pattern 25 is connected to electrodes of the device chip via metal wires (not shown) or the like. One electrode pattern 25 is connected to electrodes of device chips respectively arranged on two stages 21 adjacent to each other with the electrode pattern 25 interposed therebetween.

For example, when the resin package substrate 11 is cut along the planned cutting line 19 to manufacture a package device in which device chips are sealed, the electrode pattern 25 is also cut. The electrode pattern 25 after division becomes the electrode of each package device. A plurality of markers 27 for indicating the positions of the planned cutting lines 19 are provided on the front surface 13 a side of the scrap area 17 of the substrate 13 .

Although not shown in FIG. 1B, the resin package substrate 11 may warp due to heat generated when the device chip placed on the substrate 13 is sealed with the mold resin layer 23 . For example, each mold resin layer 23 warps in a convex shape in the direction from the surface 13a to the back surface 13b in FIG. 1(B).

In this embodiment, the resin package substrate 11 in which a plurality of device chips are fixed on the metal substrate 13 and sealed with the mold resin layer 23 will be described. , there are no restrictions on size, etc. Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device chip and the electrode pattern 25 .

Next, a method for processing the resin package substrate 11 will be described with reference to FIGS. 2 to 8, taking the case of grinding the mold resin layer 23 as an example. In FIG. 2, the adhesive tape 31 attached to the surface 13a side of the resin package substrate 11 will be described. 2(A) is a top view of the adhesive tape 31, and FIG. 2(B) is a sectional view taken along line II-II of FIG. 2(A).

The adhesive tape 31 is a tape (dicing tape) that is attached to the surface 13a side of the resin package substrate 11 and has a diameter larger than that of the resin package substrate 11 . The thickness of the adhesive tape 31 of this embodiment is smaller than the protruding height of the electrode pattern 25, but even if it is larger than the protruding height of the electrode pattern 25, it may not be able to absorb the unevenness of the electrode pattern 25 in some cases.

As shown in FIG. 2B, the adhesive tape 31 has a base layer 34 in contact with the release sheet 32 and an adhesive layer 36 in contact with the base layer 34 . The adhesive area 33 b corresponds to the scrap area 17 , and the multiple non-adhesive areas 33 a correspond to the device area 15 .

The thickness of the base layer 34 of the adhesive tape 31 is, for example, 5 μm or more and 200 μm or less. The adhesive tape 31 is a film made of polymer material such as polyolefin (PO), polyvinyl chloride (PVC), ethylene vinyl acetate (EVA), or the like.

A circular adhesive tape 31 is releasably adhered to a release sheet 32 . The release sheet 32 is longer in the length direction (second direction) orthogonal to the width direction than in the width direction (first direction). A plurality of adhesive tapes 31 are discretely provided along the length direction of the release sheet 32, and one adhesive tape 31 is shown in FIG. 2(A).

The adhesive tape 31 includes a plurality of (three in this embodiment) rectangular non-adhesive regions 33a discretely provided along the second direction, and a plurality of circular non-adhesive regions 33a. and an adhesive region 33b provided so as to surround.

The adhesive region 33 b has the adhesive layer 36 , but each of the plurality of non-adhesive regions 33 a does not have the adhesive layer 36 . Therefore, when the adhesive tape 31 is peeled off from the resin package substrate 11, the adhesive material constituting the adhesive layer 36 does not remain (that is, there is no residue), and the device region 15 with a clean surface 13a side can be obtained. can be done.

After the adhesive tape 31 preparation step of preparing the adhesive tape 31 described above, the adhesive tape 31 is attached to the resin package substrate 11 . 3A and 3B are diagrams for explaining the adhesive tape 31 attaching step of attaching the adhesive tape 31 to the surface 13a of the resin package substrate 11. FIG. However, in FIG. 3, the electrode pattern 25 shown in FIG. 1B is omitted.

In this embodiment, the annular frame 45 and the resin package substrate 11 are arranged on the flat table 42 so that the resin package substrate 11 is positioned in the opening of the annular frame 45 having the opening. At this time, the rear surface 13 b side of the resin package substrate 11 is opposed to the table 42 so that the mold resin layer 23 is in contact with the table 42 .

Then, pressure is applied to the back side of the release sheet 32 (that is, the side opposite to the adhesive tape 31 ) with a roller 40 or the like to press the adhesive tape 31 against the front surface 13 a side of the resin package substrate 11 and the annular frame 45 . . As a result, the surface side of the release sheet 32 (that is, the side of the adhesive tape 31) and the side of the surface 13a of the resin package substrate 11 are brought into close contact.

The non-adhesive area 33a of the adhesive tape 31 is in close contact with the surface 13a side of the device area 15 of the resin package substrate 11 . Therefore, the base layer 34 of the adhesive tape 31 is attached to the front surface 13a side of the resin package substrate 11 so as to follow the unevenness of the electrode pattern 25 . By attaching the adhesive tape 31 to the resin package substrate 11, damage, contamination, etc. of the electrode pattern 25 on the surface 13a side can be reduced.

An adhesive region 33b is attached to the surface 13a side of the scrap region 17 of the resin package substrate 11. As shown in FIG. Furthermore, since the outer peripheral portion of the adhesive tape 31 is attached to the annular frame 45 , the resin package substrate 11 is supported by the adhesive tape 31 at the opening of the annular frame 45 .

When the adhesive tape 31 is attached to the surface 13a, a device (vacuum laminator) that attaches the adhesive tape 31 to the surface 13a using a roller 40 or the like under vacuum may be used. By using a vacuum laminator, it is possible to prevent air, dust, other foreign matter and contaminants from entering gaps between the adhesive tape 31 and the unevenness of the electrode pattern 25, as compared with the case where the vacuum laminator is not used.

In this embodiment, the resin package substrate 11 and the annular frame 45 integrally fixed via the adhesive tape 31 are collectively referred to as a workpiece unit 47 . 4 is a perspective view of the workpiece unit 47. FIG.

As described above, even if the adhesive tape 31 is attached to the surface 13a side, the surface side of the adhesive tape 31 does not become flat. Therefore, in this embodiment, a curable liquid resin 53 and a carrier sheet 51 are provided on the surface side of the adhesive tape 31 (that is, the side opposite to the resin package substrate 11) to eliminate unevenness appearing on the surface of the adhesive tape 31. .

FIG. 5A shows a step of preparing a carrier sheet 51 supplied with a curable liquid resin 53. FIG. The carrier sheet 51 is placed on the table 54a so that the lower surface 51b is in contact with the flat table 54a.

In this embodiment, even if the workpiece unit 47 is pressed against the carrier sheet 51 via the curable liquid resin 53 , the curable liquid resin 53 does not protrude from the carrier sheet 51 . The amount of resin 53, pressing force, etc. are adjusted.

The curable liquid resin 53 of this embodiment is an ultraviolet curable liquid resin that is cured by being irradiated with ultraviolet rays. Examples of the ultraviolet curable liquid resin include epoxy acrylate and urethane acrylate. Further, the carrier sheet 51 is made of, for example, a resin such as PO, PVC, or EVA described above. A person skilled in the art can understand the degree of flatness of the carrier sheet 51 and the table 54a. Of course, the upper surface 51a of the carrier sheet 51 placed on the flat table 54a is also flat.

The carrier sheet 51 and the table 54a of this embodiment are members that transmit ultraviolet rays. By using an ultraviolet curable liquid resin, the resin can be cured by ultraviolet irradiation for several seconds, so that the working time can be shortened compared to other curable liquid resins.

However, the curable liquid resin 53 may be a photocurable resin that is cured by irradiation with visible light other than ultraviolet rays, or a thermosetting resin that is cured by heat. Alternatively, it may be a self-curing resin that is cured by mixing a main agent and a curing agent.

Underneath the table 54a is a table stand having a light source 56 for curing the curable liquid resin 53 by irradiating ultraviolet rays which act as a stimulus for curing the curable liquid resin 53, and a cavity for arranging the light source 56. 54b are provided. The table 54 a , the table base 54 b and the light source 56 constitute the light irradiation device 52 .

Before curing the curable liquid resin 53 , the workpiece unit 47 is moved onto the carrier sheet 51 using the moving unit 58 . The moving unit 58 has a suction pad 58a for sucking the annular frame 45, and a suction pad 58b for sucking the plurality of mold resin layers 23 of the resin package substrate 11 and having a flat contact surface with the mold resin layer 23, The workpiece unit 47 can be moved in a third direction (eg, up and down direction) perpendicular to the first and second directions.

As described above, the resin package substrate 11 is warped, but the moving unit 58 temporarily flattens the warp of the resin package substrate 11 by sucking the plurality of mold resin layers 23 with the suction pads 58b. can be corrected to

The moving unit 58 moves the workpiece unit 47 toward the curable liquid resin 53 in a state in which the resin package substrate 11 is flattened by correcting the warp with the suction pads 58b. As a result, the adhesive tape 31 side of the resin package substrate 11 opposite to the mold resin layer 23 side is embedded into the curable liquid resin 53 on the upper surface 51 a of the carrier sheet 51 .

FIG. 5B is a diagram showing how the workpiece unit 47 is arranged on the carrier sheet 51 with the curable liquid resin 53 interposed therebetween. Note that the electrode pattern 25 shown in FIG. 1B is omitted in FIG. 5B. 5(C) is a cross-sectional view taken along a plane perpendicular to the front surface 13a of the substrate 13 and passing through the planned cutting line 19 shown in FIG. 1(A).

After that, in a state in which warping of the resin package substrate 11 is flattened by the moving unit 58 , the curable liquid resin 53 is cured by irradiating the curable liquid resin 53 with ultraviolet rays from the light irradiation device 52 . As a result, the resin package substrate 11 and the carrier sheet 51 are fixed with the curable liquid resin 53 via the adhesive tape 31 . FIG. 5(C) is a diagram showing a curable liquid resin 53 fixing step for fixing the workpiece unit and the carrier sheet 51 via the curable liquid resin 53 .

Here, the manner in which the carrier sheet 51 side of the curable liquid resin 53 is flattened will be described. The warped resin package substrate 11 is fixed to the curable liquid resin 53 via the adhesive tape 31, so that the warp is eliminated and becomes flat (FIG. 5(C)).

FIG. 6 is an enlarged cross-sectional view of region R in FIG. 5(C). As described above, since the adhesive tape 31 does not have the adhesive layer 36 in the area corresponding to the device area 15, the base material layer 34 is attached to the electrode pattern 25 so as to follow the unevenness of the electrode pattern 25, as shown in FIG. come into contact with

In addition, the curable liquid resin 53 enters between the electrode patterns 25 (convex portions) and the carrier sheet 51, and also enters between the two electrode patterns 25 (concave portions) and the carrier sheet 51. there is

The height t of the substrate layer 34 and the electrode pattern 25 from the surface 13a is smaller than the height T of the substrate layer 34, the electrode pattern 25 and the curable liquid resin 53 from the surface 13a. Also, the height of the base layer 34 and the curable liquid resin 53 from the surface 13a between the two electrode patterns 25 (recess portion) is also T. As shown in FIG.

Since the upper surface 51a side of the carrier sheet 51 of the curable liquid resin 53 becomes flat following the shape of the flat upper surface 51a, the carrier sheet 51 side of the curable liquid resin 53 (that is, the lower surface 51b of the carrier sheet 51) is flat. become.

In this way, by using the curable liquid resin 53 and the carrier sheet 51 to eliminate the warp and unevenness of the resin package substrate 11, the carrier sheet 51 side of the resin package substrate 11 can be strongly sucked and held by the chuck table 60.

Note that when the resin package substrate 11 is attached to a general adhesive tape (dicing tape), the adhesive force of the adhesive tape is not strong enough to eliminate warping of the resin package substrate 11 . Therefore, it is difficult to suck and hold the resin package substrate 11 with the chuck table 60 through the adhesive tape.

In addition, when the resin package substrate 11 is attached to an adhesive tape having a strong adhesive force capable of eliminating the warp of the resin package substrate 11, even if the adhesive tape is peeled off from the resin package substrate 11 after processing, the resin package substrate 11 does not stick to the adhesive tape. There is a problem that the adhesive layer of the adhesive tape remains.

On the other hand, in this embodiment, by using the curable liquid resin 53 and the carrier sheet 51 to eliminate the warp and unevenness of the resin package substrate 11 , the resin package substrate 11 can be strongly held by suction on the chuck table 60 . . In addition, by bringing the device region 15 of the resin package substrate 11 into contact with the non-adhesive region 33 a of the adhesive tape 31 , it is possible to prevent the adhesive layer from remaining on the resin package substrate 11 .

The chuck table 60 has a disk-shaped porous plate 62 made of porous ceramics or the like having pores. The pores of the porous plate 62 are connected to a channel 64, and the channel 64 is connected to suction means (not shown) such as a vacuum pump through a valve or the like (not shown).

The resin package substrate 11 is sucked and held on the holding surface 62a of the porous plate 62 via the carrier sheet 51 by the negative pressure of the suction means. Further, the chuck table 60 is provided with clamps 66 for holding and fixing the annular frame 45 of the workpiece unit 47 from four sides.

The grinding mechanism 68 is arranged above the chuck table 60 . Grinding mechanism 68 includes a spindle 78 that rotates about an axis of rotation generally parallel to the aforementioned third direction. This spindle 78 is moved up and down by a lifting mechanism (not shown). A disk-shaped wheel mount 76 is fixed to the lower end of the spindle 78 .

A grinding wheel 70 having substantially the same diameter as the wheel mount 76 is attached to the lower surface of the wheel mount 76 . Grinding wheel 70 has an annular wheel base 72 made of a metal material such as aluminum or stainless steel.

The wheel base 72 is attached to the spindle 78 by fixing the upper surface side of the wheel base 72 to the wheel mount 76 . A plurality of grinding wheels 74 are provided on the lower surface of the wheel base 72 opposite to the upper surface. Then, with the chuck table 60 sucking and holding the lower surface 51b of the carrier sheet 51, the mold resin layer 23 on the rear surface 13b side of the resin package substrate 11 is ground.

FIG. 7 shows a grinding step of grinding the mold resin layer 23 of the resin package substrate 11 with a grinding wheel 74 . While rotating the chuck table 60 and the spindle 78 in predetermined directions, the spindle 78 is lowered to press the grinding wheel 74 against the mold resin layer 23 on the back surface 13 b side of the resin package substrate 11 . Thereby, the mold resin layer 23 is ground.

In this embodiment, the molding resin layer 23 is ground with the grinding wheel 74 in a state where the resin package substrate 11 is freed from warping by using the curable liquid resin 53 and the carrier sheet 51 . Therefore, the mold resin layer 23 can be ground so that the thickness of the mold resin layer 23 (the height of the mold resin layer 23 from the back surface 13b) in the device region 15 becomes uniform.

The processing method of the resin package substrate 11 according to the present embodiment includes the step of preparing the adhesive tape 31 (S10) in FIG. 2, the step of attaching the adhesive tape 31 (S20) in FIG. 3, and the step of preparing the carrier sheet 51 in FIG. 5A. (S30), a step of fixing the curable liquid resin 53 (S40) in FIGS. 5B and 5C, and a grinding step (S50) in FIG. FIG. 8 is a flowchart of a method for processing the resin package substrate 11. As shown in FIG.

In the above-described embodiment, an example in which the mold resin layer 23 of the resin package substrate 11 is ground has been described. The resin package substrate 11 may be cut in a state in which warping and irregularities of the substrate 11 are eliminated. In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

REFERENCE SIGNS LIST 11 resin package substrate 13 substrate 13a front surface 13b back surface 15 device region 17 scrap region 19 scheduled cutting line (street)
21 stage 23 mold resin layer 25 electrode pattern 27 marker 31 adhesive tape 32 release sheet 33a non-adhesive area 33b adhesive area 34 base layer 36 adhesive layer 40 roller 42 table 45 annular frame 47 workpiece unit 51 carrier sheet 51a upper surface 51b Lower surface 52 Light irradiation device 53 Curable liquid resin 54a Table 54b Table stand 56 Light source 58 Moving unit 58a, 58b Suction pad 60 Chuck table 62 Porous plate 62a Holding surface 64 Channel 66 Clamp 68 Grinding mechanism 70 Grinding wheel 72 Wheel base 74 Grinding Wheel 76 Wheel Mount 78 Spindle

Claims (3)

A substrate having a device region having an uneven electrode pattern and a scrap region surrounding the device region on its surface, and a mold resin provided on the back surface of the substrate corresponding to the device region and covering the back side of the device region. A method of processing a resin package substrate comprising a layer,
an adhesive tape preparation step of preparing an adhesive tape comprising a non-adhesive region corresponding to the device region and having no adhesive layer, and an adhesive region surrounding the non-adhesive region and having the adhesive layer corresponding to the scrap region;
The non-adhesive region of the adhesive tape is adhered to the surface side of the device region so as to follow the unevenness of the electrode pattern, and the adhesive region of the resin package substrate is adhered to the scrap region. an adhesive tape attaching step of attaching the adhesive tape to a surface;
a carrier sheet preparation step of preparing on a flat table a carrier sheet having a curable liquid resin to be cured by applying a stimulus supplied to the upper surface thereof;
After the adhesive tape side of the resin package substrate whose warp has been temporarily corrected is embedded in the curable liquid resin on the upper surface of the carrier sheet, the curable liquid resin is stimulated. a curable liquid resin fixing step of fixing the resin package substrate and the carrier sheet with the curable liquid resin via the adhesive tape;
a grinding step of sucking and holding the carrier sheet side of the resin package substrate with a chuck table and grinding the mold resin layer of the resin package substrate with a grinding wheel;
A method of processing a resin package substrate, comprising: 2. The method of processing a resin package substrate according to claim 1, wherein the curable liquid resin is an ultraviolet curable liquid resin that is cured by irradiation with ultraviolet rays, and the carrier sheet is a member that transmits ultraviolet rays. 3. The adhesive tape is attached to the annular frame in the step of attaching the adhesive tape so that the resin package substrate is supported by the adhesive tape at the opening of the annular frame. 3. The method for processing the resin package substrate according to 1.

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