JP7178820B2 - LED light emitting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an LED light-emitting device provided with a region that emits light in a first color and a region that emits light in a second color on a single substrate.

A region that emits light in a first color (hereinafter referred to as "first light emitting region") and a region that emits light in a second color (hereinafter referred to as "second light emitting region") are provided on a single substrate, and the first light emitting region is provided. An LED light-emitting device capable of adjusting the light emission intensity of the region and the second light-emitting region and adjusting the light and color is known.

For example, Patent Literature 1 describes an LED light-emitting device 100 that includes a first spiral light-emitting region and a second spiral light-emitting region. Therefore, FIG. 1 of Patent Document 1 is referred to FIG. 6 of the present application, and the LED light emitting device 100 will be described. FIG. 6 is a plan view of the LED light emitting device 100. FIG.

As shown in FIG. 6, the LED light emitting device 100 includes a substrate 101, an LED die 102 (LED chip), a wire 103, a printed resistor element 104, a first resin dam 105, a second resin dam 106, a first phosphor-containing resin It has a layer 107, a second phosphor-containing resin layer 108, and electrode lands 110-113. The regions filled with the first and second phosphor-containing resin layers 107 and 108 become the first light emitting region and the second light emitting region, respectively. The LED dies 102 are blue light emitting diodes and are connected in series by wires 103 in their respective light emitting regions. In the first light-emitting region, blue light and green light are emitted by a blue light-emitting diode and a first phosphor-containing resin layer 107 containing a phosphor that emits green light by wavelength-converting part of the light emitted from the blue light-emitting diode. A mixed emission color is obtained. In the second light emitting region, blue light and red light are emitted by a blue light emitting diode and a second phosphor-containing resin layer 108 containing a phosphor that emits red light by wavelength-converting part of the light emitted from the blue light emitting diode. A mixed emission color is obtained.

For example, Patent Literature 2 describes an LED light-emitting device 120 in which rectangular first light-emitting regions and second rectangular light-emitting regions are arranged in a checkered pattern. 1 and 3 of Patent Document 2 are cited in FIGS. 7 and 8 of the present application, respectively, and the LED light emitting device 120 will be described. Note that the symbols have been changed for citation. Also, in FIG. 7, AA' line, which is a cross-sectional line, is added.

FIG. 7 is a perspective view of the LED light emitting device 120. FIG. As shown in FIG. 7, the LED light emitting device 120 includes a module substrate 121, electrodes 122a to 122d, a dam 123, a white reflecting member 124, a first light emitting region 125 that emits light in cold colors, and a second light emitting region 126 that emits light in warm colors. It has

FIG. 8 is a cross-sectional view of the LED light-emitting device 120 along line AA′ shown in FIG. 7, showing one first light-emitting region 125 and one second light-emitting region 126 . As shown in FIG. 8, two LED dies 131 are mounted on the module substrate 121 . Each LED die 131 is coated on the sides and top with a cool phosphor 132 and a warm phosphor 133 . A white reflecting member 124 is filled between the cold-color phosphor 132 and the warm-color phosphor 133 .

When the cold-color phosphor 132 and the warm-color phosphor 133 are viewed from above, the light-emitting regions occupied by the cold-color phosphor 132 and the warm-color phosphor 133 are the first light-emitting region 125 and the second light-emitting region 126, respectively. Also, the LED die 131 and the cold phosphor 132 form a so-called CSP 135 (chip size package). In the LED light emitting device 120 , the CSP 135 is flip-chip mounted on the module substrate 121 . Similarly, the LED die 131 and warm phosphor 133 constitute a so-called CSP 136 , which is flip-chip mounted on the module substrate 121 . The white reflective resin 124 is filled between the CSPs 135 and 136 after the CSPs 135 and 136 are mounted on the module substrate 121 .

JP 2017-34287 A (Fig. 1) Japanese Patent Application Laid-Open No. 2014-225600 (Figs. 1 and 3)

In the LED light-emitting device 100, in order to improve color mixing, the first light-emitting region (first phosphor-containing resin layer 107) and the second light-emitting region (second phosphor-containing resin layer 108) are spirally formed and fitted together. It is crowded. In the LED light-emitting device 120, the first light-emitting region 125 that emits light in a cold color and the second light-emitting region 126 that emits light in a warm color are arranged in a checkered pattern in order to improve color mixing.

However, since the LED light-emitting device 100 has a dam (second resin dam 106) between the first light-emitting region 107 and the second light-emitting region 108, the LED die 102 in the first light-emitting region and the LED die 102 in the second light-emitting region The LED die 102 cannot be placed in close proximity. In other words, the LED light emitting device 100 has a problem that it is difficult to increase the light emission intensity by making the LED dies 102 dense.

Similarly, the LED light emitting device 120 has fluorescent resins 132a and 133a on the sides of the LED die 131 (see FIG. 8). That is, since the LED light emitting device 120 has the fluorescent resins 132a and 133a, it is difficult to increase the light emission intensity by making the LED dies 131 dense.

Therefore, the present invention has been made in view of the above problems, and provides an LED light-emitting device having light-emitting regions that emit light in different colors on one substrate, while maintaining high color mixing properties. It is an object of the present invention to provide an LED light emitting device in which LED dies included in a device can be arranged close to each other.

In order to solve the above problems, the LED light emitting device of the present invention includes a substrate, a plurality of first LED dies and second LED dies mounted on the substrate, and filled between the first LED dies and the second LED dies, A white reflective resin that covers side surfaces of a first LED die and a second LED die, a first fluorescent resin and a second fluorescent resin that individually cover upper surfaces of the first LED die and the second LED die, respectively, the white reflective resin, and the second LED die. A first light emitting region having the first fluorescent resin that emits light at a high color temperature and a transparent resin that covers the second fluorescent resin and a transparent resin covering the first fluorescent resin and a second fluorescent resin, and a second light emitting region having the second fluorescent resin that emits light at a low color temperature By arranging the two light emitting regions in a checkered pattern and disposing only the white reflective resin between the first LED die and the second LED die, the light is emitted only from the upper surfaces of the first LED and the second LED, and the The first fluorescent resin and the second fluorescent resin are characterized by having different base areas and resin thicknesses .

In the LED light emitting device of the present invention, the first light emitting region includes one first LED die and the first fluorescent resin, and the second light emitting region includes one second LED die and the second fluorescent resin. . Since the first LED dies and the second LED dies are arranged in a checkered pattern on the substrate, the first light emitting regions and the second light emitting regions are also arranged in a checkered pattern on the substrate. Since white reflective resin is filled between the adjacent first LED die and second LED die, light emitted from the first LED die and second LED die is emitted only from the upper surface. Part of this light is wavelength-converted by the first fluorescent resin and the second fluorescent resin arranged on the upper surfaces of the first LED die and the second LED die. In the first light-emitting region and the second light-emitting region, the wavelength-unconverted light and the wavelength-converted light pass through the transparent resin that protects the first fluorescent resin and the second fluorescent resin and are emitted to the outside of the LED light emitting device. be.

The first fluorescent resin may have a height different from that of the second fluorescent resin.

The white reflective resin may have a meniscus cross section between the first fluorescent resin and the second fluorescent resin.

As described above, in the LED light-emitting device of the present invention, the first light-emitting region and the second light-emitting region, which emit light of different colors, are arranged in a checkered pattern on one substrate, so that the color mixing is high. Furthermore, the first LED die included in the first light emitting region and the second LED die included in the second light emitting region can be mounted close to each other because only the white reflective resin is arranged between them. becomes.

Therefore, even if the LED light-emitting device of the present invention is provided with a plurality of light-emitting regions that emit light of different colors on one substrate, the LED dies included in the respective light-emitting regions can be placed close to each other while maintaining high color mixing. can be placed.

1 is a plan view of an LED light emitting device shown as a first embodiment of the present invention; FIG. FIG. 2 is a partial cross-sectional view of the LED light emitting device shown in FIG. 1; FIG. 2 is a plan view of the LED light emitting device shown in FIG. 1; 2 is a circuit diagram of the LED light emitting device shown in FIG. 1; FIG. FIG. 4 is a cross-sectional view of an LED light emitting device shown as a second embodiment of the present invention; It is a top view of the LED light-emitting device shown as a prior art. 1 is a perspective view of an LED light emitting device shown as another prior art; FIG. FIG. 8 is a cross-sectional view of the LED light emitting device shown in FIG. 7;

Preferred embodiments of the present invention will now be described in detail with reference to FIGS. 1-5. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and overlapping descriptions are omitted. For the sake of explanation, the scales of the members are appropriately changed.

(First embodiment)
An LED light emitting device 10 shown as a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG.

FIG. 1 is a plan view of an LED light emitting device 10. FIG. As shown in FIG. 1, the LED light emitting device 10 includes a substrate 13, power supply electrodes 16, 17, 18, and 19 formed at two corners of the substrate 13, and power supply electrodes 16 to 19 formed in inner regions. a white reflective resin 44 filled inside the dam 15; there is In the area inside the dam 15, the transparent resin 41 covers the white reflecting resin 44 and the upper surfaces of the first light emitting area 11d and the second light emitting area 12d. Wires 14 connecting the first LED dies 11b (see FIGS. 2 and 3) included in the first light emitting region 11d and the second LED dies 12b (see FIGS. 2 and 3) included in the second light emitting region 12d. (see FIG. 3) are not shown.

FIG. 2 is a partial cross-sectional view of the LED light-emitting device 10 showing the essential parts along CC' line in FIG. FIG. 2 shows one first light emitting region 11d and one second light emitting region 12d. As shown in FIG. 2, the first LED die 11b and the second LED die 12b are mounted on the substrate 13 with an adhesive 45 interposed therebetween. A white reflective resin 44 is filled between the first LED die 11b and the second LED die 12b. The upper surfaces of the first LED die 11b and the second LED die 12b are covered with a first fluorescent resin 11c and a second fluorescent resin 12c, respectively. The white reflective resin 44 , the first fluorescent resin 11 c and the second fluorescent resin 12 c are covered with the transparent resin 41 .

When the first fluorescent resin 11c and the second fluorescent resin 12c are viewed from above, the regions occupied by the first fluorescent resin 11c and the second fluorescent resin 12c are the first light emitting region 11d and the second light emitting region 12d, respectively (see FIG. 1). reference). Also, the first light emitting region 11d and the second light emitting region 12d include one first LED die 11b and one second LED die 12b, respectively. The white reflective resin 44 is filled between the first LED die 11b and the second LED die 12b after mounting the first LED die 11b and the second LED die 12b on the substrate 13 . After filling with the white reflective resin 44, the first LED dies 11b or the second LED dies 11b are connected to each other by wires 14 (not shown, see FIG. 3), and then the first LED dies 11b and the second LED dies 11b are respectively connected. The first fluorescent resin 11c and the second fluorescent resin 12c are applied, and finally the transparent resin 41 is coated on the upper surface.

FIG. 3 shows an LED light emitting state in which the transparent resin 41, the white reflective resin 44, the first fluorescent resin 11c and the second fluorescent resin 12c are removed so that the connection between the first LED die 11b and the second LED die 12b can be seen. 1 is a plan view of device 10. FIG. In FIG. 3, the first LED die 11b included in the first light emitting region 11d and the second LED die 12b included in the second light emitting region 12d are both blue light emitting diodes having the same size and the same characteristics. Since it is included in the first light emitting region 11d and the second light emitting region 12d, the second LED die 12b is filled with dots so that the first LED die 11b and the second LED die 12b can be distinguished from each other.

As shown in FIG. 3, the LED light emitting device 10 has 72 first LED dies 11b and 60 second LED dies 12b mounted on a substrate 13. As shown in FIG. A dam 15 is provided on the upper surface of the substrate 13 so as to surround the first LED die 11b and the second LED die 12b. The first LED dies 11b are connected by wires 14 in a zigzag arrangement in the vertical direction of the figure to form a first LED row 11a (see FIG. 4). The first LED die 11b at the upper end and the first LED die 11b at the lower end of the first LED row 11a are connected to wiring electrodes 16a and 18a formed on the substrate 13, respectively.

Similarly, the second LED dies 12b are connected by wires 14 in a zigzag arrangement in the vertical direction of the drawing to form a second LED row 12a (see FIG. 3). The second LED die 12b at the upper end and the second LED die 12b at the lower end of the second LED row 12a are connected to wiring electrodes 17a and 19a formed on the substrate 13, respectively. The wiring electrodes 16a-19a are connected to the power supply electrodes 16-19, respectively. There are 6 rows and 5 rows of the first LED rows 11a and the second LED rows 12a, respectively.

Terminals for wire bonding (anode and cathode) are unevenly distributed along one side of the first LED die 11b and the second LED die 12b. For example, in the top row of the figure, one side of the first LED die 11b and the second LED die 12b are all on the left. In contrast, in the second row of the drawing, one side of the first LED die 11b and the second LED die 12b are all on the right side. Also, since the first LED die 11b and the second LED die 12b are arranged in a checkered pattern, one side of the first LED die 11b and one side of the second LED die 12b adjacent to each other in the vertical direction of the figure are , staggered.

As described above, the first LED die 11b and the second LED die 12b are all blue light emitting diodes with the same characteristics and the same size. When the power supply electrodes 16 and 17 are on the + side and the power supply electrodes 18 and 19 are on the - side, the bonding terminals formed along one side are anodes on the upper side and cathodes on the lower side. On the other hand, odd columns have one edge on the left and even columns have one edge on the right. That is, the first LED die 11b and the second LED die 12b include two types of blue light emitting diodes in a mirror-inverted relationship.

FIG. 4 is a circuit diagram of the LED light emitting device 10. As shown in FIG. The LED light emitting device 10 comprises a circuit 11e that emits light at a high color temperature and a circuit 12e that emits light at a low color temperature. Note that the members shown in FIG. 3 and the parts shown in FIG. 4 are directly related, so the terms in FIG. 3 are used for parts, wirings and terminals.

As shown in FIG. 4, in the circuit 11e, six first LED arrays 11a each having twelve first LED dies 11b connected in series are connected in parallel. The anode of the first-stage first LED die 11b included in the first LED row 11a is connected to the power supply electrode 16 via the wiring electrode 16a. The cathode of the final stage first LED die 11b included in the first LED row 11a is connected to the power supply electrode 18 via the wiring electrode 18a.

Similarly, in the circuit 12e, five second LED arrays 12a each having twelve second LED dies 12b connected in series are connected in parallel. The anode of the first-stage second LED die 12b included in the second LED row 12a is connected to the power supply electrode 17 via the wiring electrode 17a. The cathode of the final stage second LED die 12b included in the second LED row 12a is connected to the power supply electrode 19 via the wiring electrode 19a.

The base material of the substrate 13 is white ceramics made of alumina. The base material of the substrate 13 may be aluminum nitride with a reflective surface, or aluminum with an insulating layer on the surface. The first LED die 11b and the second LED die 12b are blue light emitting diodes with a planar size of 0.65 mm×0.65 mm. In addition, as described above, the first LED die 11b and the second LED die 12b are blue light emitting diodes having the same size and the same characteristics, and having anodes and cathodes arranged along one side. Two types of blue light-emitting diodes, such as cathodes, are included in a mirror-inverted relationship. The gap between the first LED die 11b and the second LED die 12b is 0.1-0.4 mm. The dam 15 is made of white silicone resin and has a thickness of 0.7 to 1.0 mm and a height of 0.5 to 0.8 mm. The white reflective resin 44 is obtained by kneading fine particles of titanium oxide into silicone resin. The wiring electrodes 16a to 19a and the power supply electrodes 16 to 19 formed on the upper surface of the substrate 13 are metal films in which Ni and Au are laminated on Cu.

As shown in FIG. 1, the first light emitting region 11d and the second light emitting region 12d are arranged in a checkered pattern. The first light emitting region 11d emits light with a high color temperature of about 5000°K. The second light emitting region 12d emits light with a low color temperature of about 3000°K. The LED light emitting device 10 has six first LED rows 11a and five second LED rows 12c. In other words, the light emitting region of the LED light emitting device 10 has only the first light emitting regions 11d at the left and right ends (side portions). In this way, in the area related to the light emission of the LED light emitting device 10, the first LED die 11b and the second LED die 12b are connected in a zigzag manner, so that the left and right ends where the symmetry is likely to be lost are made to have a high color temperature. Light is emitted from (the first LED die 11b), and the symmetry of the irradiated light is maintained. The first fluorescent resin 11c included in the first light-emitting region 11d and the second fluorescent resin 12c included in the second light-emitting region 12d are each made of a phosphor emitting green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce ) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu).

(Second embodiment)
In the LED light emitting device 10 shown as the first embodiment of the present invention, as shown in FIG. 2, the first fluorescent resin 11c and the second fluorescent resin 12c have the same cross-sectional shape. However, as described above, the phosphor contained in the first fluorescent resin 11c and the second fluorescent resin 12c are different in material and amount of the fluorescent substance.

Generally, an LED light emitting device adjusts the concentration of the phosphor and the thickness of the fluorescent resin to obtain a desired emission color. This situation is the same for the LED light emitting device of the present invention. However, since the LED light-emitting device of the present invention has two types of first light-emitting region and second light-emitting region that emit light of different colors, the concentration of the phosphor and the thickness of the fluorescent resin are adjusted for each light-emitting region. There must be. That is, the first fluorescent resin and the second fluorescent resin often have different cross-sectional shapes. Therefore, as a second embodiment, an LED light emitting device 50 in which the first fluorescent resin and the second fluorescent resin have different cross-sectional shapes will be described with reference to FIG.

FIG. 5 is a cross-sectional view of a main part of the LED light emitting device 50, and, like FIG. 2, shows a cross section of the LED light emitting device 50 in a range including one each of the first LED die 11b and the second LED die 12b. . In FIG. 5, members common to those in FIG. 2 are denoted by the same reference numerals, and wires 14 connecting the first LED dies 11b and the second LED dies 12b are not shown in the same manner as in FIG. Also, since the LED light emitting device 50 differs from the LED light emitting device only in the cross-sectional shapes of the first fluorescent resin 51c and the second fluorescent resin 52c, the plan view and circuit diagram of the LED light emitting device 50 are not shown. do not have.

As shown in FIG. 5, the first LED die 11b and the second LED die 12b are mounted on the substrate 13 with an adhesive 45 interposed therebetween. A white reflective resin 44 is filled between the first LED die 11b and the second LED die 12b. The upper surfaces of the first LED die 11b and the second LED die 12b are covered with a first fluorescent resin 51c and a second fluorescent resin 52c, respectively. The white reflective resin 44 , the first fluorescent resin 51 c and the second fluorescent resin 52 c are covered with the transparent resin 41 . In the LED light emitting device 50, the second fluorescent resin 52c is larger than the first fluorescent resin 51c . That is, the cross-sectional shape of the second fluorescent resin 52c has a larger base area and is thicker in the vertical direction of the figure than the cross-sectional shape of the first fluorescent resin 51c .

When the first fluorescent resin 51c and the second fluorescent resin 52c are viewed from above, the regions occupied by the first fluorescent resin 51c and the second fluorescent resin 52c are the first light emitting region 51d and the second light emitting region 52d, respectively. Also, the first light emitting region 51d and the second light emitting region 52d include one first LED die 11b and one second LED die 12b, respectively.

In the LED light emitting devices 10 and 50, after the first LED die 11b and the second LED die 12b are mounted on the substrate 13, the space between the first LED die 11b and the second LED die 12b is filled with the white reflective resin 44. FIG. At this time, the upper surface of the first LED die 11b, the upper surface of the second LED die 12b, and the upper surface of the white reflective resin 44 are at the same height. However, these heights do not necessarily have to be the same.

For example, the filling amount of the white reflective resin 44 may be set a little so that the side surfaces of the first LED die 11b and the second LED die 12b are covered with the white reflective resin 44 by surface tension. At this time, the upper surface of the white reflective resin 44 becomes a downwardly convex curved surface (meniscus). On the contrary, the filling amount of the white reflective resin 44 is set to be large so that the side surfaces of the first LED die 11b and the second LED die 12b are covered with the white reflective resin 44. A white reflective resin may be piled up in a meniscus shape. In this way, when the gap between the first LED die 11b and the second LED die 12b is filled with the white reflective resin 44, the light emitted from the side surfaces of the first LED die 11b and the second LED die 12b can be reliably blocked. For example, the second fluorescent resin 12c is not excited by the first LED die 11b. In other words, by providing the white reflective resin 44 with the aforementioned meniscus portion, it is possible to avoid deterioration of the characteristics relating to the color of emitted light while using a simple manufacturing method.

When the first LED die 11b and the second LED die 12b are flip-chip mounted, the white reflective resin 44 is filled, then the white reflective resin 44 is polished so that it has the same height as the first LED die 11b and the second LED die 12b. can be

For the first fluorescent resins 11c, 51c and the second fluorescent resins 12c, 52c, an inkjet method or a spray coating method using a mask can be employed.

10, 50...LED light-emitting device,
11a... First LED row,
11b... first LED die,
11c, 51c... first fluorescent resin,
11d, 51d... first light emitting region,
11e, 12e... circuits,
12a... second LED row,
12b... second LED die,
12c, 52c... second fluorescent resin,
12d, 52d... second light emitting region,
13... Substrate,
14... wire,
15 dam,
16 to 19 ... power electrodes,
16a to 19a: wiring electrodes,
41... transparent resin,
44... White reflective resin,
45... Adhesive.

Claims (3)

a substrate;
a plurality of first and second LED dies mounted on the substrate;
a white reflective resin filled between the first LED die and the second LED die and covering side surfaces of the first LED die and the second LED die;
a first fluorescent resin and a second fluorescent resin respectively covering upper surfaces of the first LED die and the second LED die;
a transparent resin covering the white reflective resin and the first fluorescent resin and the second fluorescent resin ;
with
A first light emitting region having the first fluorescent resin that emits light at a high color temperature and a second light emitting region having the second fluorescent resin that emits light at a low color temperature are arranged in a checkered pattern,
By disposing only the white reflective resin between the first LED die and the second LED die, light is emitted only from the upper surfaces of the first LED and the second LED,
The LED light emitting device, wherein the first fluorescent resin and the second fluorescent resin are different in base area and resin thickness . 2. The LED light emitting device of claim 1 , wherein the white reflective resin covers side surfaces of the first LED die and the second LED die and has a meniscus cross section between the side surfaces. 2. The LED light-emitting device according to claim 1, wherein the second fluorescent resin has a larger base area and resin thickness than the first fluorescent resin.

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