JP7034179B2 - 複合セラミック噴霧器及びその製造方法 - Google Patents
複合セラミック噴霧器及びその製造方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims description 49
- 239000002131 composite material Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 25
- 238000010304 firing Methods 0.000 claims description 15
- 239000000779 smoke Substances 0.000 claims description 14
- 239000000155 melt Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 6
- 229910007541 Zn O Inorganic materials 0.000 claims description 6
- 238000000889 atomisation Methods 0.000 claims description 6
- 239000005995 Aluminium silicate Substances 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 5
- 230000001680 brushing effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000003595 mist Substances 0.000 claims 1
- 239000003921 oil Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229920000742 Cotton Polymers 0.000 description 5
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- BJBUTJPAZHELKY-UHFFFAOYSA-N manganese tungsten Chemical compound [Mn].[W] BJBUTJPAZHELKY-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910001950 potassium oxide Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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Description
図1、図2、および、図3を参照して、複合セラミック噴霧器14は、第1の本体1と第2の本体2を含み、前記第1の本体1と前記第2の本体2は施釉封着工程によって一体成形されており、前記第1の本体1と前記第2の本体2は施釉によって形成されたグレーズ面3によって接続されている。前記グレーズ面3は、部分的に、第1の本体1と第2の本体2との接続箇所の表面を覆う。前記第1の本体1は、発熱キャリアと加熱するための導電路4とを含み、前記導電路4が発熱キャリアの内部に形成されて、電源に接続されるための第1の接触部分7および第2の接触部分8を有し、前記第2の本体2は、窒化ケイ素多孔質セラミックで形成されており、液体を伝導するためのものである。
図4、図5に示すように、複合セラミック噴霧器14は、第1の本体1と第2の本体2を含み、前記第1の本体1と前記第2の本体2は施釉封着工程によって一体成形されており、前記第1の本体1と前記第2の本体2は施釉によって形成されたグレーズ面3によって接続されており、前記グレーズ面3は、部分的に、第1の本体1と第2の本体2との接続箇所の表面を覆う。前記第1の本体1は、発熱キャリアと加熱するための導電路4とを含み、前記導電路4が発熱キャリアの表面に形成されて、電源に接続されるための第1の接触部分7および第2の接触部分8を有し、本実施例に記載の第1の接触部分7と第2の接触部分8が導電性ロッドである。前記第2の本体2は、炭化ケイ素多孔質セラミックで形成されており、液体を伝導するためのものである。
複合セラミック霧化器14の製造方法であって、複合セラミック霧化器14は、第1の本体1と第2の本体2が施釉封着工程によって一体成形されており、整体として製造され、具体的なプロセス工程は以下の通りである。
複合セラミック霧化器14の製造方法であって、第1の本体1と第2の本体2は施釉封着工程によって一体成形されており、整体として製造され、具体的なプロセス工程は以下の通りである、ことを特徴とする。
複合セラミック霧化器14の製造方法であって、第1の本体1と第2の本体2は施釉封着工程によって一体成形されており、整体として製造され、具体的なプロセス工程は以下の通りである、ことを特徴とする。
Claims (9)
- 第1の本体と、第2の本体と、を含み、
前記第1の本体と前記第2の本体は施釉封着工程によって一体成形されており、前記第1の本体と前記第2の本体は施釉によって形成されたグレーズ面によって接続されており、前記グレーズ面は、第1の本体と第2の本体との接続箇所の表面を部分的に覆い、
前記第1の本体は、発熱キャリアと加熱するための導電路とを含み、前記導電路が発熱キャリアの表面または内部に形成されて、電源に接続されるための第1の接触部分および第2の接触部分を有し、
前記第2の本体は、液体を伝導するためのものであり、
前記導電路は、抵抗加熱層として完全または部分的に形成され、第2の本体までの厚さが第1の本体までの厚さ以下であり、
2つの第1の本体と1つの第2の本体とで構成されており、そのうち、第2の本体が2つの第1の本体の間に位置し、第1の本体1と第2の本体2は、一部の接触領域に施釉して形成されたグレーズ面3によって接続されているが、施釉されていない部分が即ち、継ぎ目17に形成される、
ことを特徴とする複合セラミック霧化器。 - 第1の本体の全体に亘る熱量損耗を減少して第2本体の孔面積を増加させて、霧化効果を高めるために、前記第1の本体は前記第2の本体の表面を部分的に覆う、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 前記抵抗加熱層と第2の本体との距離は0.3mm以下である、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 前記抵抗加熱層は、完全または部分的に、第1の本体の表面を覆い、または、第1の本体内に置かれており、前記抵抗加熱層の抵抗値は、0.02Ω~3Ωである、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 前記第1の接触部分および第2の接触部分は接触点、電源の正極と負極の間に限定されたパターン、導線、または、支持機能を有する導電性ロッドである、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 前記第2の本体は、完全または部分的に、アルミナ多孔質セラミック、炭化ケイ素多孔質セラミック、または窒化ケイ素多孔質セラミックで形成されている、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 前記複合セラミック霧化器における煙を放出するための空気孔は、第1の本体と第2の本体との接続箇所に予め設けられた継ぎ目、または、第1の本体に予め設けられたチャンネル、または、第2の本体に予め設けられたチャンネルである、ことを特徴とする請求項1に記載の複合セラミック霧化器。
- 請求項1~7のいずれか1項に記載の複合セラミック霧化器の製造方法において、
ステップ1において、第1の本体の表面に施釉して、グレーズ面の厚さを5μm~40μmの範囲に制御し、釉が透明釉であり、透明釉が質量パーセントで次の成分を含み、すなわち、透明フリットを80%~94%、カオリンを5%~19%、および、カルボキシメチルセルロース(CMC)を0.2%~1%含み、そのうち、透明フリットの化学成分が質量パーセント別で、SiO2を40%~60%、Al2O3を2%~15%、Na2Oを0~8%、K2Oを0~5%、ZnOを3%~15%、BaOを2%~10%、CaOを5%~15%、MgOを0%~10%含み、釉の融解温度が600℃~1000℃であり、施釉前に、グレーズペーストの粘度を0.5Pa・s~1.5Pa・sに調整し、第1の本体に対して乾燥、すす吹き、水拭取りの工程を施すこと、
ステップ2において、第1の本体を水平さやに置き、第2の本体を第1の本体の上に置き、焼成温度を700℃~1000℃の範囲に制御し、溶融粘度ηの大きさを2<lgη<6に制御すること、を特徴とする製造方法。 - ステップ1における施釉方式は、乾式施釉またはブラッシング施釉である、ことを特徴とする請求項8に記載の複合セラミック霧化器の製造方法。
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