JP7033250B2 - Prober - Google Patents

Description

The present invention relates to a prober for inspecting the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly to a prober provided with a pull-out mechanism for pulling out a device to be maintained to the maintenance area side.

Conventionally, a plurality of measuring units (cells), a transport mechanism (loader) for transporting a transported object (wafer) to each measuring unit, a pull-out mechanism (moving mechanism) for pulling out a pogo frame (maintenance device) laterally, and A prober (wafer inspection device) provided with the above is proposed (see, for example, Patent Document 1). According to the prober described in Patent Document 1, the pogo frame is pulled out laterally in a state where the test head arranged above the pogo frame is raised by the moving mechanism and separated from the pogo frame. When the frame is pulled out laterally, it is possible to prevent the pogo pin from being broken due to the pogo pin of the pogo frame rubbing against the test head.

Japanese Unexamined Patent Publication No. 2014-179379

However, in the prober described in Patent Document 1, it is not proposed at all what kind of relationship is desirable between the pull-out direction of the device to be maintained and the transport direction of the transported object.

The present invention has been made in view of such circumstances, up to a plurality of measuring units equipped with a maintenance device and a pull-out mechanism for pulling out the maintenance device, and a position where the measurement unit to which the transported object is transported can be accessed. In a prober equipped with a transport unit that moves and transports the transported material into the measurement unit of the transport destination, it is possible to suppress the abbe error that must be taken into consideration when positioning the equipment to be maintained, which requires high accuracy. Or to eliminate it).

In order to achieve the above object, the prober of the present invention is a plurality of measuring units arranged between a transport area and a maintenance area, and is used when inspecting a semiconductor element formed on a wafer. A plurality of measuring units equipped with a maintenance device, a pull-out mechanism for pulling out the device to be maintained to the maintenance area side, and a housing for storing the transported object are provided, and the transported object is transported within the transported area. A transport unit that moves to a position accessible to the measurement unit and transports the transported object into the measurement unit at the transport destination is provided, and the withdrawal direction of the device to be maintained and the transport direction of the transported object are in a straight line. be.

In one aspect of the prober of the present invention, an elevating mechanism for raising and lowering the device to be maintained is further provided, and the pull-out mechanism pulls the device to be maintained raised to a predetermined position by the elevating mechanism toward the maintenance area. It is configured.

In one aspect of the prober of the present invention, the device to be maintained is at least one of a test head and a pogo frame arranged below the test head.

In one aspect of the prober of the present invention, the maintenance device is at least one of a test head and a pogo frame arranged below the test head, and the elevating mechanism is electrically connected to a pogo pin of the pogo frame. A test head elevating mechanism that raises and lowers the test head between the pogo pin connection position and the test head drawer position above it, and the probe connection position where the probe of the probe card is electrically connected and the pogo frame drawer position above it. At least one of the pogo frame raising and lowering mechanisms for raising and lowering the pogo frame, the pull-out mechanism is a test head pull-out mechanism that pulls out the test head raised to the test head pull-out position to the maintenance area side. And, at least one of the pogo frame withdrawal mechanisms for pulling out the pogo frame raised to the pogo frame withdrawal position toward the maintenance area.

In one aspect of the prober of the present invention, the test head elevating mechanism includes a test head cylinder for elevating and lowering the test head, and the pogo frame elevating mechanism includes a pogo frame cylinder for elevating and lowering the pogo frame.

In one aspect of the prober of the present invention, the test head drawer mechanism includes a test head guide rail that guides the test head drawer raised to the test head drawer position, and the pogo frame drawer mechanism is the pogo. Includes a guide rail for the pogo frame that guides the drawer of the pogo frame raised to the frame drawer position.

In one aspect of the prober of the present invention, the test head elevating mechanism raises and lowers the test head together with the test head guide rail, and the pogo frame elevating mechanism raises and lowers the pogo frame together with the pogo frame guide rail. ..

In one aspect of the prober of the present invention, the plurality of measuring units further include a probe card holding unit arranged below the pogo frame and a wafer chuck, and the wafer held by the wafer chuck and the probe. It is an alignment device that performs relative alignment with the probe card held in the card holding unit, moves between the plurality of measuring units, and in the moving destination measuring unit, the transport area side and the maintenance. An alignment device that moves to and from the area side is further provided.

In one aspect of the prober of the present invention, a head stage provided in each of the plurality of measuring units and arranged below the pogo frame, a test head positioning mechanism for positioning the test head with respect to the pogo frame, and a test head positioning mechanism. A pogo frame positioning mechanism for positioning the pogo frame with respect to the head stage is provided.

In one aspect of the prober of the present invention, the transport unit is further provided with a transport holding arm for holding the transport, which is provided in the transport unit and enters and exits through an opening formed in the housing, and the transport is a wafer and a probe. At least one of the cards, and the carrier holding arm is at least one of a wafer arm for holding the wafer and a probe card arm for holding the probe card.

In one aspect of the prober of the present invention, each measuring unit is arranged two-dimensionally in the horizontal direction and the vertical direction.

In one aspect of the prober of the present invention, the conveyed object is loaded into the measuring unit.

In one aspect of the prober of the present invention, the measuring section is provided with a loading section for loading the transported object from the maintenance area side.

According to the present invention, a plurality of measuring units provided with a device to be maintained and a pull-out mechanism for pulling out the device to be maintained, and a position where the measurement unit at the destination of the transported object can be accessed are moved to measure the transported object. It is possible to suppress (or eliminate) the abbe error that must be taken into consideration when positioning the equipment to be maintained, which requires high accuracy, in the prober provided with the transport unit for transporting into the unit.

A perspective view showing a schematic configuration of a prober of this embodiment. Front view of each measuring unit Perspective view of the transport unit Vertical cross-sectional view showing the schematic configuration of the transport unit Perspective view of mobile device Partially enlarged perspective view of the mobile device Vertical cross-sectional view showing the schematic configuration of the transport unit and the measuring unit. Perspective view showing the schematic configuration of the prober Front view of each measuring unit (vertical row) Schematic diagram showing the positional relationship between the head stage, pogo frame and test head Partially enlarged perspective view of the measuring part Schematic diagram showing how the test head is pulled out Schematic diagram showing how the Pogo frame is pulled out Top view showing that the pull-out direction of the device to be maintained and the transport direction of the transported object are in a straight line. Top view showing that the transported object is loaded into the measuring unit from the maintenance area side. Conceptual diagram showing an example of a calibration probe card

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

As shown in FIG. 1, the prober 10 of the present embodiment moves between the transported material storage unit 12, the plurality of measuring units 14, the transported material storage unit 12, and each measuring unit 14, and the transported object (book). In the embodiment, at least one of the wafer and the probe card) is conveyed in the conveyed object storage unit 12 or each measurement unit 14, and the transfer unit 16 is between the conveyed object storage unit 12 and each measurement unit 14. It is provided with a moving device 22 which is moved by.

The transported object storage unit 12 and each measuring unit 14 are arranged at regular intervals in the Y direction with the surfaces accessed by the transport unit 16 facing each other (that is, facing each other).

The transport unit 16 is arranged between the transport unit storage unit 12 and each measurement unit 14.

The conveyed object storage unit 12 includes a wafer storage unit 12a for storing a plurality of wafers and a probe card storage unit 12b for storing a plurality of probe cards. The number and arrangement of the transported material storage units 12 are not particularly limited, and in the present embodiment, the four transported material storage units 12 including the wafer storage unit 12a and the probe card storage unit 12b are accessed by the transport unit 16. (The surface on the right side in FIG. 1) is arranged in the horizontal direction (X-axis direction) with the surface facing the same direction. The side opposite to the side accessed by the transport unit 16 (left side in FIG. 1) is accessed by an operator when collecting a wafer or probe card.

As shown in FIG. 8, the plurality of measuring units 14 are arranged between the transport area A1 and the maintenance area A2. As shown in FIG. 1, each of the plurality of measuring units 14 is a rectangular body formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. It is a shape measuring chamber (also referred to as a prober chamber), and as shown in FIGS. 9 and 10, a wafer chuck 18 for holding a wafer, a head stage 20, and a head stage 20 are placed inside the chamber. The test head 44, the pogo frame 46 arranged between the head stage 20 and the test head 44, and the first probe card holding mechanism (probe card holding portion) 36 for holding the probe card PC (FIG. 9, FIG. (Omitted in 10) and are arranged. Further, as shown in FIG. 11, a test head elevating mechanism 48, a test head withdrawal mechanism 50, a pogo frame elevating mechanism 52, and a pogo frame withdrawal mechanism 54 are arranged inside each measuring unit 14. ..

FIG. 2 is a front view of each measuring unit 14.

The number and arrangement of the measuring units 14 are not particularly limited, and in the present embodiment, as shown in FIGS. 1 and 2, a measuring unit group consisting of four measuring units 14 arranged in the horizontal direction (X-axis direction). Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the side surface (the surface on the left side in FIG. 1) accessed by the transport unit 16 facing in the same direction.

A wafer holding arm 16b (wafer arm: carrier holding arm) and a probe card holding arm 16c (probe card arm) of the transfer unit 16 are provided on each measuring unit 14 (the surface on the side accessed by the transfer unit 16). An opening 14a for entering and exiting is formed. Further, an opening 14b (see FIG. 8) for pulling out the test head 44 and the pogo frame 46 is formed on the side of each measuring unit 14 opposite to the side on which the opening 14a is formed.
The surface of each measuring unit 14 other than the surface on which the openings 14a and 14b are formed may be closed or the openings may be formed.

The wafer chuck 18 is adjusted to a high temperature or low temperature target temperature (inspection temperature) by a well-known temperature control device (for example, a heat plate or a chiller device built in the wafer chuck 18).

The environment in each measuring unit 14 is controlled as follows. For example, the temperature in each measuring unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 arranged in each measuring unit 14. Further, the humidity in each measuring unit 14 is controlled to the target humidity by purging the dry air in each measuring unit 14 by a well-known mechanism. Further, the environment in each measuring unit 14 is controlled by purging a predetermined gas (for example, nitrogen gas) in each measuring unit 14 by a well-known mechanism. Each measuring unit 14 carries out a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection in a predetermined gas (for example, nitrogen gas) atmosphere, which will be described later. The environment in each measuring unit 14 is controlled so that the environment in each measuring unit 14 is an environment corresponding to the inspection performed in each measuring unit 14. The inspection performed by each measuring unit 14 may be the same among the measuring units.
They may be different from each other.

The first probe card holding mechanism 36 is a means for holding the probe card PC in a detachable manner, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC carried to the first probe card holding mechanism 36 by the probe card carrying mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further description thereof will be omitted.

In each measurement unit group, four measurement devices 38 and an alignment device 38 that perform relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 are measured. A moving device (not shown) that moves the portions 14 to each other is arranged. The alignment device 38 is moved to each other among the four measuring units 14 included in the measuring unit group in which the alignment device 38 is arranged, and is shared among the four measuring units 14. As a moving device for moving the alignment device 38 to and from each other between the four measuring units 14, for example, those described in JP-A-2014-150168 can be applied.

The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is moved up and down in the Z-axis direction. It is composed of a moving / rotating mechanism for moving the wafer chuck 18 such as the shaft movable portion 38a, the Z-axis fixing portion 38b, and the XY movable portion 38c in the XYZ−θ direction. The alignment device 38 mainly moves the wafer W held by the wafer chuck 18 in the XYZ−θ direction by a method known to the probe of the probe card PC held above the wafer chuck 18. It is used for alignment, electrical contact between the wafer W and the probe, and electrical characteristic inspection of the wafer W via a test head.

The alignment device 38 holds the wafer chuck 18 in the measuring unit 14, and has a probe card receiving position P1 near the opening 14a (see FIG. 7A) and a position P2 below the first probe card holding mechanism 36 (see FIG. 7A). Move to and from FIG. 7 (b)). That is, the alignment device 38 moves between the transport area A1 side and the maintenance area A2 side in the measurement unit 14 at the destination. This movement is achieved by a well-known alignment device movement device (not shown).

The alignment device moving device moves the alignment device 38 in a state of holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and the first probe card holding mechanism 36 of the probe card PC. The alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the position P2 at the time of transfer to the position P2.

The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

The second probe card holding mechanism 40 is a means for receiving the probe card PC from the probe card holding arm 16c and holding the probe card PC. For example, the second probe card holding mechanism 40 is a holding mechanism attached to the Z-axis movable portion 38a while surrounding the wafer chuck 18. It is composed of a portion 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that raises and lowers the holding portion 40a with respect to the Z-axis movable portion 38a in the Z-axis direction.

To receive and hold the probe card PC, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a while the alignment device 38 is moved to the probe card receiving position P1 to receive and hold the probe card PC (bottom outer peripheral edge). ), And the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that rises in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18.

The probe card transfer mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, for example, in the Z-axis direction provided in the alignment device 38. It is composed of a Z-axis movable portion 38a that is raised and lowered.

The transfer of the probe card PC to the first probe card holding mechanism 36 is realized by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the position P2.

FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a vertical sectional view showing a schematic configuration of the transport unit 16.

The transport unit 16 moves between the transport material storage unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction to move the wafer W or the probe card PC into the transport object storage unit 12 or each measurement unit 14. As shown in FIGS. 3 and 4, it is a means for transporting and loading, and is a housing for accommodating the wafer W and the probe card PC, and is a housing for the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm). The housing 16a is provided with an opening 16f through which 16c) enters and exits. The housing 16a has a rectangular parallelepiped shape, and inside the housing 16a, a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and a housing 16a are provided. An environment control means 16d for controlling the environment inside and a sensor 16e for detecting the environment inside the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in this embodiment. Two transport units 16 are drawn in FIG. 1, and this is a state in which one transport unit 16 is accessing the transport material storage unit 12 (probe card storage unit 12b) (at the lower right in FIG. 1). (Refer to the drawn transport unit 16) and the state of accessing the measuring unit 14 (see the drawn transport unit 16 in the upper left of FIG. 1).

The wafer holding arm 16b is a means for holding the wafer W, and is, for example, arranged in the housing 16a so as to be horizontally movable along a guide rail (not shown) provided in the housing 16a. There is. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W.

The probe card holding arm 16c is a means for holding the probe card PC, and is arranged in the housing 16a so as to be horizontally movable along a guide rail (not shown) provided in the housing 16a, for example. Has been done. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

The number and arrangement of the arms 16b and 16c are not particularly limited, and in the present embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages. There is. Further, the transport unit 16 loads the transported object into the measuring unit 14 by using the arms 16b and 16c after transporting the transported object to the measuring unit 14.

The arm moving mechanism is composed of a well-known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor in the forward and reverse directions, the arms 16b and 16c individually reciprocate in the horizontal direction and move in and out through the opening 16f formed in the housing 16a.

The transport unit 16 includes an air curtain forming means 42.

The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a a closed or substantially closed space, for example, by a well-known air injection port. It is configured.

The number, shape, and arrangement of the air injection ports are not particularly limited, and in the present embodiment, as shown in FIG. 4, the upper end thereof is near the upper end edge of the opening 16f in a posture in which a plurality of air injection ports inject air downward. It is arranged along the edge (in the direction orthogonal to the paper surface in FIG. 4).

The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a are controlled to the target temperature and humidity under a predetermined gas atmosphere by purging dry air (high temperature or low temperature dry air) or a predetermined gas (nitrogen gas) in each measuring unit 14. Will be done. This is a well-known environmental control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a pipe line connecting the blower (none of which is shown) and the housing 16a (not shown). (Not shown). The environmental control means 16d may include a dehumidifier. The gas (high temperature or low temperature dry air) whose temperature (and humidity) has been adjusted by the temperature control gas supply source is supplied into the housing 16a through the pipeline by a blower and is injected from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in 16a. As a result, the inside of the housing 16a becomes a closed or substantially closed space. The gas supply source supplied into the housing 16a and the gas supply source injected from the air injection port may be the same or different. The surface of the housing 16a other than the surface on which the opening 16f is formed may be closed, or the opening may be formed. The environmental control means 16d may be attached to the housing 16a, or may be attached to the arms 16b and 16c.

The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environmental control means 16d.

The environment control means 16d controls the environment inside the housing 16a so that the environment corresponds to the environment of the transport destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to the target environment based on the detection result of the sensor 16e. For example, the environmental control means 16d controls the temperature control gas supply source so that the temperature and humidity in the housing 16a become the target temperature and humidity based on the detection result of the sensor 16e. The function of the environmental control means 16d is realized by, for example, feedback control by a controller (not shown) to which the sensor 16e and the temperature control gas supply source (heater and cooler) are electrically connected. The environmental control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, an air injection port may be provided downward so as to close the opening 16f, and an air injection port for dry air for controlling the environment inside the housing 16a may be provided. Here, it is preferable that the air injection port for the dry air for controlling the environment in the housing 16a is provided so that the sprayed dry air circulates well in the housing 16a. By integrating the environmental control means 16d and the air curtain forming means 42, the space for providing the environmental control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be effectively used. .. Further, by integrating the environmental control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater, a cooler (cooler), and a temperature control gas supply source including a heater and a cooler (cooler) are provided between the environmental control means 16d and the air curtain forming means 42. Blowers can be shared.

FIG. 5 is a perspective view of the mobile device 22, and FIG. 6 is a partially enlarged perspective view of the mobile device 22.

The moving device 22 is a means for moving the transport unit 16 between the transport unit storage unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction, and is, for example, as shown in FIGS. 5 and 6. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction), which is the arrangement direction of each measuring unit 14, between the transported object storage unit 12 and each measuring unit 14 are moved in the horizontal direction (X-axis direction). The first movable body moving mechanism (not shown) that moves in the direction (direction), is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring unit 14, and is a transport unit. A second movable body 26 that rotatably supports 16 with the vertical axis (Z axis) as the center of rotation, and a second movable body moving mechanism that moves the second movable body 26 in the vertical direction (Z axis direction) (not shown). It is attached to the second movable body 26 and is configured by a transport unit rotation mechanism 28 that rotates the transport unit 16 with the vertical axis (Z axis) as the center of rotation.

The first movable body 24 is, for example, a frame body formed by connecting the four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and the lower portion thereof is a conveyed object storage unit 12. It is movably connected to two guide rails 30 extending in the X-axis direction arranged parallel to each other on the base 34 between each measuring unit 14.

The first movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor for rotating the ball screw (neither is shown), or the like. By rotating the drive motor in the forward and reverse directions, the first movable body 24 (conveying unit 16) moves in the X-axis direction along the guide rail 30. Of course, not limited to this, the first movable body moving mechanism is a mechanism for self-propelling the first movable body 24, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. May be good.

The second movable body 26 is movably connected to two guide rails 32 extending in the Z-axis direction arranged parallel to the first movable body 24.

The second movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor for rotating the ball screw (neither is shown), or the like. By rotating the drive motor in the forward and reverse directions, the second movable body 26 (conveying unit 16) moves in the Z-axis direction along the guide rail 32. Of course, not limited to this, the second movable body moving mechanism is a mechanism for self-propelling the second movable body 26, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. May be good.

The transport unit rotation mechanism 28 is composed of a well-known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotating shaft (vertical shaft). By rotating the drive motor 28a in the forward and reverse directions, the transfer unit 16 rotates 180 ° about the vertical axis (Z axis), and the opening 16f formed in the transfer unit 16 into which the arms 16b and 16c enter and exit is formed. It is in a state of facing the transported object storage unit 12 or each measuring unit 14.

The test head 44 is a device to be maintained (a device whose maintenance is carried out over time) used when inspecting a semiconductor element formed on a wafer, and is a plurality of devices electrically connected to a pogo pin 46b of a pogo frame 46. Includes terminals (not shown).

The test head 44 is held by a test head holding mechanism.

As shown in FIG. 11, the test head holding mechanism includes a base 56 and two test head guide rails 58 fixed on the base 56 and extending in the Y-axis direction. The test head 44 is slidably connected to the test head guide rail 58. The test head holding mechanism (base 56) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 56 is provided with a locking mechanism (not shown) that locks (fixes) the test head 44 to the base 56 (and the test head guide rail 58). The locking mechanism is composed of, for example, an engaging portion such as a claw portion that engages with or is disengaged from the test head 44.

The test head elevating mechanism 48 is a means for elevating and elevating the test head 44, and is composed of, for example, an actuator such as a test head cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 56 side and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the test head holding mechanism (base 56) is moved up and down in the Z-axis direction along the vertical guide rail, so that the test head 44 is locked by the lock mechanism and is Z-axis together with the test head guide rail 58. It is moved up and down in the direction to the pogopin connection position P3 (see FIG. 10) or the test head extension position P4 (see FIG. 12 (a)).

The pogo pin connection position P3 is a position where the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are electrically connected. The test head extraction position P4 prevents the test head 44 from coming into contact with the pogo pin 46b (and the positioning pin 60a described later) of the pogo frame 46 when the test head 44 is pulled out (and the space for raising the pogo frame 46 described later). It is a considered position (to be secured).

The test head pull-out mechanism 50 (test head slide mechanism) is a means for pulling out the test head 44 raised to the test head pull-out position P4 to the maintenance area A2 side, and is composed of, for example, a test head guide rail 58. ..

The test head 44, which has been raised to the test head pull-out position P4, slides in the Y-axis direction along the test head guide rail 58 when the operator releases the lock by the lock mechanism and pulls it toward the test head. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 12B). This enables maintenance of the test head 44 (for example, replacement of the board inside the test head).

The test head 44, for which maintenance has been completed, is slid by an operator along the test head guide rail 58 to the test head drawer position P4 in the Y-axis direction, and then descends to the pogo pin connection position P3 along the vertical guide rail. .. At that time, as shown in FIG. 10, the test head 44 is arranged above the pogo frame 46, that is, at the pogo pin connection position P3 in a state of being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60.

The test head positioning mechanism 60 is a means for positioning the test head 44 with respect to the pogo frame 46, and is composed of, for example, a positioning pin 60a and a recess 60b with which the positioning pin 60a abuts. The positioning pin 60a may be provided on the pogo frame 46 side or may be provided on the test head 44 side. When the positioning pin 60a is provided on the pogo frame 46 side, the recess 60b with which the positioning pin 60a abuts is provided on the test head 44 side. On the other hand, on the contrary, when the positioning pin 60a is provided on the test head 44 side, the recess 60b with which the positioning pin 60a abuts is provided on the pogo frame 46 side.

The pogo frame 46 is a device to be maintained (a device whose maintenance is carried out over time) used when inspecting a semiconductor element formed on a wafer. As shown in FIG. 10, the pogo frame main body 46a and the pogo It is composed of a plurality of pogo pins 46b held in the frame body 46a. The upper end of the pogo pin 46b protrudes from the upper surface of the pogo frame main body 46a, and the lower end of the pogo pin 46b protrudes from the lower surface of the pogo frame main body 46a. The pogo pin 46b is electrically connected to the terminal of the test head 44 and is also electrically connected to the probe of the probe card PC held by the first probe card holding mechanism 36.

The pogo frame 46 is held by a pogo frame holding mechanism.

As shown in FIG. 11, the pogo frame holding mechanism is composed of a base 62 and two guide rails 64 for pogo frames fixed on the base 62 and extending in the Y-axis direction. The pogo frame 46 is slidably connected to the pogo frame guide rail 64. The pogo frame holding mechanism (base 62) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 62 is provided with a locking mechanism (not shown) that locks (fixes) the pogo frame 46 to the base 62 (and the guide rail 64 for the pogo frame). The locking mechanism is composed of, for example, an engaging portion such as a claw portion that engages with or is disengaged from the pogo frame 46.

The pogo frame elevating mechanism 52 is a means for raising and lowering the pogo frame 46, and is composed of, for example, an actuator such as a pogo frame cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 62 side and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the pogo frame holding mechanism (base 62) is moved up and down in the Z-axis direction along the vertical guide rail, so that the pogo frame 46 is locked by the lock mechanism and together with the pogo frame guide rail 64 on the Z axis. It is moved up and down in the direction to the probe connection position P5 (see FIG. 12 (a)) or the pogo frame extension position P6 (see FIG. 13 (a)).

The probe connection position P5 is a position where the pogo pin 46b of the pogo frame 46 and the probe of the probe card (not shown) held by the first probe card holding mechanism 36 are electrically connected. The pogo frame drawer position P6 is a position considered so that the pogo frame 46 (pogo pin 46b) does not come into contact with the probe (and the positioning pin 66a described later) of the probe card when the pogo frame 46 is pulled out.

The pogo frame pull-out mechanism 54 (pogo frame slide mechanism) is a means for pulling out the pogo frame 46 raised to the pogo frame pull-out position P6 to the maintenance area A2 side, and is composed of, for example, a pogo frame guide rail 64. ..

The Pogo Frame 46, which has been raised to the Pogo Frame pull-out position P6, slides in the Y-axis direction along the Pogo Frame guide rail 64 when the operator unlocks it by the locking mechanism and pulls it toward you. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 13B). This makes it possible to maintain the pogo frame 46 (for example, replace the pogo pin).

The maintenance-completed pogo frame 46 is slid by an operator along the pogo frame guide rail 64 to the pogo frame drawer position P6 in the Y-axis direction, and then descends to the probe connection position P5 along the vertical guide rail. .. At that time, as shown in FIG. 12A, the pogo frame 46 is arranged above the head stage 20 in a state of being positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66, that is, at the probe connection position P5. Will be done.

The pogo frame positioning mechanism 66 is a means for positioning the pogo frame 46 with respect to the head stage 20, and is composed of, for example, a positioning pin 66a and a recess 66b with which the positioning pin 66a abuts. The positioning pin 66a may be provided on the pogo frame 46 side or may be provided on the head stage 20 side. When the positioning pin 66a is provided on the pogo frame 46 side, the recess 66b with which the positioning pin 66a abuts is provided on the head stage 20 side. On the other hand, on the contrary, when the positioning pin 66a is provided on the head stage 20 side, the recess 66b with which the positioning pin 66a abuts is provided on the pogo frame 46 side.

The alignment device 38, the arm moving mechanism, the environmental control means 16d, the moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28), test head elevating mechanism 48, pogo frame elevating mechanism. Each device and mechanism such as 52 is driven by control by a control means (controller or the like) (not shown).

Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Wafer transfer operation example>
First, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a into the measurement unit 14 where the inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

First, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c move in and out of the transfer unit 16. The opening 16f formed in the above is opposed to the wafer accommodating portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a, and one wafer W is taken out from the wafer storage portion 12a and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so that the environment corresponds to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed which is injected from an air injection port to close the opening 16f formed in the housing 16a. Will be done. As a result, the inside of the housing 16a is closed or a substantially closed space.

Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 faces the measurement unit 14 of the transfer destination.

Next, the wafer holding arm 16b is advanced into the measuring unit 14 in the Y-axis direction through the opening 16f on the transfer unit 16 side and the opening 14a on the measuring unit 14 side on which the air curtain is formed, and the wafer W is moved to the wafer chuck 18. Is loaded. The arrow on the right side in FIG. 14 indicates the transport direction of the transported object (wafer W in this case). The wafer holding arm 16b, while holding the wafer W, passes through the opening 16f closed by the air curtain and advances into the measuring unit 14.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W waits until the inspection temperature is reached by the wafer chuck 18, and when the inspection temperature is reached, the alignment device 38 moves in the XYZ−θ direction to move the wafer W held by the wafer chuck 18 to the wafer. The probe of the probe card PC held above the chuck 18 is aligned by a well-known method, and then the wafer chuck 18 moves in the Z-axis direction by the action of the alignment device 38 to electrically connect the wafer W and the probe. Upon contact, the electrical characteristics of the wafer W are inspected via the pogo frame 46 (pogo pin 46b) and the test head 44.

In this way, the environment inside the transfer unit 16 is controlled by utilizing the time from the wafer storage unit 12a to the transfer destination measurement unit 14, and the inspection temperature at the transfer destination measurement unit 14 is adjusted. By reducing the difference, it is possible to shorten (or eliminate) the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination as compared with the conventional technique. As a result, the throughput (processing capacity per unit time) in the measuring unit 14 can be improved.

<Example of probe card transfer operation>
Next, an operation example in which the transfer unit 16 conveys the probe card PC from the probe card storage unit 12b to the measurement unit 14 where the inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

First, the transfer unit 16 is moved to a position where the probe card storage unit 12b can be accessed (a position where the probe card PC can be taken out), and the transfer unit 16 is rotated by 180 ° to transfer the arms 16b and 16c in and out. The opening 16f formed in the unit 16 faces the probe card storage portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, and one probe card PC is taken out from the probe card storage unit 12b and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled so that the environment corresponds to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature has been adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed which is injected from an air injection port to close the opening 16f formed in the housing 16a. Will be done. As a result, the inside of the housing 16a is closed or a substantially closed space.

Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 of the transfer destination (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated by 180 ° to allow the arms 16b and 16c to move in and out. The opening 16f formed in the transfer unit 16 is opposed to the measurement unit 14 of the transfer destination.

Next, the probe card holding arm 16c is advanced into the measuring unit 14 in the Y-axis direction through the opening 16f on the transport unit 16 side on which the air curtain is formed and the opening 14a on the measuring unit 14 side (FIG. 7A). reference). The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f closed by the air curtain and advances into the measuring unit 14 in the Y-axis direction. The arrow on the right side in FIG. 14 indicates the transport direction of the transported object (probe card PC in this case).

Next, the probe card PC is received from the probe card holding arm 16c by the holding portion 40a of the second probe card holding mechanism 40, and the probe card PC is held. Specifically, with the alignment device 38 holding the wafer chuck 18 moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to raise the probe card PC. The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that comes into contact with (the outer peripheral edge of the lower surface) and rises in the Z-axis direction. As a result, the probe card PC is handed over to the holding portion 40a and is held directly above the wafer chuck 18 by the holding portion 40a.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 is moved to the position P2 (see FIG. 7B).

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, the Z-axis movable portion 38a (second probe card holding mechanism 40) is raised in the Z-axis direction while the alignment device 38 holding the wafer chuck 18 is moved to the position P2. 2 The probe card PC held by the probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36.

<Example of test head withdrawal operation>
Next, an operation example when the test head 44 is pulled out to the maintenance area A2 side will be described.

First, as shown in FIG. 12 (a), the test head holding mechanism (base 56) is raised from the pogo pin connection position P3 to the test head extension position P4 by the test head elevating mechanism 48. As a result, the test head 44 moves to the test head pull-out position P4 together with the test head guide rail 58 fixed to the base 56 in a state of being locked by the lock mechanism.

Next, the operator pulls the test head 44 raised to the test head pull-out position P4 toward the test head 44 after the lock by the lock mechanism is released. As a result, as shown in FIG. 12B, the test head 44 slides along the test head guide rail 58 in the Y-axis direction and is pulled out to the maintenance area A2 side through the opening 14b. This enables maintenance of the test head 44 (for example, replacement of the board inside the test head). The arrow on the left side in FIG. 14 indicates the pull-out direction (and the push-in direction) of the device to be maintained (here, the test head 44).

Next, an operation example in which the test head 44 whose maintenance has been completed is returned to the pogo pin connection position P3 will be described.

First, the operator pushes the test head 44 for which maintenance has been completed along the guide rail 58 for the test head, slides it to the test head extraction position P4 in the Y-axis direction, and locks the test head 44 at that position by the locking mechanism. ..

Next, the test head holding mechanism (base 56) is lowered from the test head pull-out position P4 to the pogo pin connection position P3 by the test head elevating mechanism 48. As a result, the test head 44 moves to the pogo pin connection position P3 together with the test head guide rail 58 fixed to the base 56 in a state of being locked by the lock mechanism. At that time, as shown in FIG. 10, the test head 44 is arranged above the pogo frame 46, that is, at the pogo pin connection position P3 in a state of being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60. As a result, the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are aligned with each other, so that they can be electrically connected with high accuracy.

As described above, the pull-out direction of the device to be maintained (here, the test head 44) (see the arrow on the left side in FIG. 14) and the transport direction of the transported object (wafer W or probe card PC) (arrow on the right side in FIG. 14). Since (see) is linear with respect to the Y-axis direction, it is possible to suppress (or eliminate) the abbe error that must be taken into consideration when positioning the test head 44 with respect to the pogo frame 46, which requires high accuracy. .. In particular, when the test head 44 for which maintenance has been completed is returned to the pogo pin connection position P3, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

<Example of Pogo frame withdrawal operation>
Next, an operation example when the pogo frame 46 is pulled out to the maintenance area A2 side will be described.

First, as shown in FIG. 12 (a), the test head holding mechanism (base 56) is raised from the pogo pin connection position P3 to the test head extension position P4 by the test head elevating mechanism 48. As a result, the test head 44 moves to the test head pull-out position P4 together with the test head guide rail 58 fixed to the base 56 in a state of being locked by the lock mechanism. As a result, the rising space S of the pogo frame 46 is secured.

Next, as shown in FIG. 13A, the pogo frame elevating mechanism 52 raises the pogo frame holding mechanism (base 62) from the probe connection position P5 to the pogo frame pull-out position P6. As a result, the pogo frame 46 moves to the pogo frame pull-out position P6 together with the pogo frame guide rail 64 fixed to the base 62 in a state of being locked by the lock mechanism.

Next, the operator pulls the pogo frame 46 raised to the pogo frame pull-out position P6 toward the front after unlocking by the lock mechanism. As a result, as shown in FIG. 13B, the pogo frame 46 slides along the guide rail 64 for the pogo frame in the Y-axis direction and is pulled out to the maintenance area A2 side through the opening 14b. This makes it possible to maintain the pogo frame 46 (for example, replace the pogo pin). The arrow on the left side in FIG. 14 indicates the pull-out direction (and push-in direction) of the device to be maintained (here, the pogo frame 46).

Next, an operation example in which the pogo frame 46 whose maintenance has been completed is returned to the probe connection position P5 will be described.

First, the operator pushes the pogo frame 46 for which maintenance has been completed along the guide rail 64 for the pogo frame, slides it to the pogo frame drawer position P6 in the Y-axis direction, and locks the pogo frame 46 at that position by the locking mechanism. ..

Next, the pogo frame raising / lowering mechanism 52 lowers the pogo frame holding mechanism (base 62) from the pogo frame withdrawal position P6 to the probe connection position P5. As a result, the pogo frame 46 moves to the probe connection position P5 together with the pogo frame guide rail 64 fixed to the base 62 in a state of being locked by the locking mechanism. At that time, as shown in FIG. 12A, the pogo frame 46 is arranged above the head stage 20 in a state of being positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66, that is, at the probe connection position P5. Will be done. As a result, the pogo pin 46b of the pogo frame 46 and the probe of the probe card are aligned with each other, so that they can be electrically connected with high accuracy.

As described above, the pull-out direction of the device to be maintained (here, the pogo frame 46) (see the arrow on the left side in FIG. 14) and the transport direction of the transported object (wafer W or probe card PC) (arrow on the right side in FIG. 14). Since (see) is linear with respect to the Y-axis direction, it is possible to suppress (or eliminate) the abbe error that must be taken into consideration when positioning the pogo frame 46 with respect to the head stage 20 where high accuracy is required. .. In particular, when the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

Further, in the prior art, since the pogo frame is pulled out without raising the pogo frame, the probe card had to be taken out from the measuring unit (cell) before pulling out the pogo frame. In the present embodiment, the probe card 46 is raised to the pogo frame pull-out position P6 and separated from the probe card, and then the pogo frame 46 raised to the pogo frame pull-out position P6 is pulled out. Therefore, the probe card is used. The pogo frame 46 can be pulled out without carrying out the PC from the measuring unit 14.

As described above, according to the present embodiment, a plurality of measuring units 14 having a device to be maintained (for example, at least one of a test head and a pogo frame) and a pull-out mechanism for pulling out the device to be maintained, and a transported object (for example). For example, in a prober 10 provided with a transfer unit 16 that moves to a position accessible to a measurement unit at a transfer destination (at least one of a wafer and a probe card) and transports a transported object into the measurement unit 14 at the transfer destination. By aligning the withdrawal direction of the device to be maintained and the transport direction of the transported object in a straight line (see FIG. 14), the abbe error that must be taken into consideration when positioning the device to be maintained, which requires high accuracy, is suppressed. Can be done (or eliminated).

That is, with the test head 44 arranged at the pogo pin connection position P3 and the pogo frame 46 arranged at the probe connection position P5, the probe card PC is attached to the pogo frame 46 and the wafer W is attached to the probe card PC. It is necessary to position the wafers, but by transporting the configurations that require these positionings in a straight line, the abbe error can be suppressed. Further, in the present embodiment, by transporting the configurations requiring these positioning in a straight line, the positioning in the straight line can be omitted, so that the positioning becomes easier. Further, in the present embodiment, since the pull-out direction of the device to be maintained and the transport direction of the transported object are in a straight line, the test is performed for a technique of rotating the test head to expose the pogo pin under the test head for maintenance. Space is saved because there is no space for rotating the head.

Further, in the prior art, the test head cannot be pulled out because the test head is not provided with a pull-out mechanism, whereas in the present embodiment, the test head elevating mechanism 48 and the test head pull-out mechanism 50 are not provided. This allows the test head 44 to be pulled out.

Next, another aspect of being loaded (loaded) in the measuring unit 14 will be described. In the above-mentioned example, it has been described that the conveyed object (wafer W or probe card PC) to be loaded in the measuring unit 14 is loaded from the conveying area A1 side by the conveying unit 16 (see FIG. 14). In another aspect of being loaded into 14, the conveyed material loaded into the measuring unit 14 is loaded from the maintenance area A2 side by the loading unit 70.

FIG. 15 is a top view showing that the conveyed object (wafer W and probe card PC) is loaded into the measuring unit 14 from the maintenance area A2 side. As shown in FIG. 15, when the conveyed object is loaded into the measuring unit 14 from the maintenance area A2 side, the conveyed object is loaded into the measuring unit 14 by the loading unit 70. The loading unit 70 may be provided with a transporting means such as the transport unit 16 described above to transport the transported material, or the user or the installer of the prober 10 manually transports the transported material to the loading unit 70. After that, the measuring unit 14 may be loaded by the loading unit 70. The loading unit 70 is not particularly limited, and known loading means can be adopted. For example, the loading unit 70 may load the transported object into the measuring unit by a pull-out mechanism, or may load the transported object into the measuring unit by an arm like the transport unit 16.

In this way, the measuring unit 14 can be loaded with the transported object from the transport area A1 side and the maintenance area A2 side. For example, when the probe card PC is loaded into the measuring unit 14, the transport unit 16 loads the transported object into the measuring unit 14 when the transported object is for inspection of a semiconductor element, and the loading unit 70 transports the transported object. When the object is used for calibrating the position of the measuring unit 14, the conveyed object is loaded into the measuring unit 14.

Further, for example, the transported object is loaded into the measuring unit 14 from the transport area A1 side when the loading to the measuring unit 14 is frequent, and the transported object is loaded into the measuring unit 14 when the loading to the measuring unit 14 is infrequent. Is loaded into the measuring unit 14. Here, the high frequency and the low frequency differ depending on the usage mode of the prober 10 of the user. For example, the high frequency is a transported object that needs to be replaced every time the wafer W is measured, and the low frequency is, for example, maintenance or the prober. It is a transported object that needs to be loaded at the time of installation (start-up) of 10.

Further, for example, the transport unit 16 loads the transported object into the measuring unit 14 when the transported object requires environmental control, and the loading unit 70 loads the transported object when the transported object does not require environmental control. It is loaded into the measuring unit 14. As described above, in the transport area A1, the environment is adjusted by the environment control means 16d of the transport unit 16, so that when a transport object that requires temperature adjustment or humidity adjustment is loaded into the measuring unit 14, the transport object is loaded. It is loaded into the measuring unit 14 from the transport area A1 side.

Further, for example, loading by the transport unit 16 or loading by the loading unit 70 may be divided according to the type of the transported object. That is, since the wafer W and the probe card PC to be transported are used for various purposes and types, the loading or loading unit 70 by the transport unit 16 is used according to the uses and types of the wafer W and the probe card PC. You may separate the loading by.

For example, the probe card PC includes a measurement probe card for inspecting and measuring the wafer W and a calibration probe card for calibrating the position of the wafer W and the like. Then, for example, the calibration probe card is loaded by the loading unit 70, and the measurement probe card is loaded by the transport unit 16.

In this way, more efficient inspection can be performed by changing the loading side of the conveyed object to the measuring unit 14 according to the usage state of the conveyed object and the prober 10.

Here, the loading of the present application is to equip the measuring unit 14 with the probe card PC or the wafer W. Further, it is preferable that the loading by the transport unit 16 and the loading by the loading unit 70 described above are arranged in a straight line with respect to the pull-out direction of the device to be maintained and the transport direction of the transported object. The arrow in FIG. 15 indicates the loading direction performed by the loading unit 70.

FIG. 16 is a conceptual diagram showing an example of a calibration probe card. 16 (a) is a top view of the probe side of the calibration probe card 72, and FIG. 16 (b) is a side view of the calibration probe card 72. The calibration probe card 72 shown in FIG. 16 is composed of a calibration probe card main body 72a and a probe 72b. The calibration probe card 72 has a total of 18 probes 72b, and two probes are paired (a set), one set in the center along the outer circumference of the calibration probe card 72, and one set at 45 ° intervals. They are arranged one by one. The calibration probe card 72 is used for alignment and alignment of the measuring unit 14. Therefore, for example, the calibration probe card 72 is used to align the measuring unit 14 at the time of starting up or installing the prober 10.

Next, a modification will be described.

In the present embodiment, the configuration using the test head elevating mechanism 48, the test head pulling mechanism 50, the pogo frame elevating mechanism 52, and the pogo frame pulling mechanism 54 is illustrated, but the present invention is not limited to this, and the test head elevating mechanism 48 and Only the test head pull-out mechanism 50 may be used, or only the pogo frame elevating mechanism 52 and the pogo frame pull-out mechanism 54 may be used.

Further, in the present embodiment, the configuration in which the pogo frame elevating mechanism 52 is used and the pogo frame 46 in the raised state is pulled out is illustrated, but the present invention is not limited to this, and the pogo frame elevating mechanism 52 may be omitted. That is, the pogo frame withdrawal mechanism similar to that of the prior art may be used, and the pogo frame 46 may be pulled out without raising the pogo frame 46.

Further, in the present embodiment, the configuration in which the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a is exemplified, but the present invention is not limited to this, and for example, the housing of the transport unit 16 is exemplified. A similar opening (not shown) is formed on the surface of 16a opposite to the side on which the opening 16f is formed, and the arms 16b and 16c individually reciprocate in the horizontal direction to reciprocate the opening 16f and vice versa. It may be configured to enter and exit through a side opening. By doing so, the transfer unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, access to the transport object storage unit 12 or each measurement unit 14 by the arms 16b and 16c can be realized without rotating the transfer unit 16. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transport unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is provided. By providing the transport unit 16 with the same air curtain forming means to be formed, the inside of the housing 16a can be sealed or a substantially closed space, and the same effect as that of the above embodiment can be obtained.

Further, in the present embodiment, the configuration in which each measuring unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is exemplified, but the present invention is not limited to this, and each measuring unit 14 is not limited to this. May be arranged in only one row in the horizontal direction (X-axis direction), or may be arranged in only one row in the vertical direction (Z-axis direction). By arranging the measuring units 14 in only one row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. Further, by arranging the measuring units 14 in only one row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

Further, in the present embodiment, the configuration using one transport unit 16 and one mobile device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of mobile devices 22 may be used. By doing so, the throughput in each measuring unit 14 can be further improved.

Further, in the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c is illustrated, but the present invention is not limited to this, and only the wafer holding arm 16b may be used, or only the probe card holding arm 16c may be used. You may use it.

Further, in the present embodiment, the configuration in which the arms 16b and 16c are provided on the transport unit 16 is exemplified, but the present invention is not limited to this, and the arms 16b and 16c (or An arm corresponding to this) may be provided. Also by this, the conveyed object can be taken out from the conveyed object storage unit 12 or the measuring unit 14 and stored in the conveyed object 16 by each arm, and the conveyed object can be taken out from the conveyed object 16 and stored in the conveyed object storage unit 12 or It can be handed over to the measuring unit 14.

Further, in the present embodiment, the configuration in which the opening 16f formed in the housing 16a is closed by an air curtain is exemplified, but the present invention is not limited to this, and the opening 16f is opened when the transported object is taken out or delivered, and the transported object is not limited to this. The transfer unit 16 may be provided with opening / closing means such as a shutter or a door that is closed during transportation, and the opening / closing means may be used to open / close the opening 16f. Further, the opening 14a formed in each measuring unit 14 may be configured to be closed by the same air curtain, or the opening 14a may be configured to be opened and closed by the same opening opening / closing means.

As described above, a plurality of measuring units equipped with a device to be maintained and a pull-out mechanism for pulling out the device to be maintained, and a position where the measurement unit at the destination of the transported object can be accessed are moved to measure the transported object. In a prober equipped with a transport unit that transports the inside of the unit, the pull-out direction of the device to be maintained and the transport direction of the transported object are aligned so that high accuracy is required when positioning the device to be maintained. The idea of suppressing the indispensable Abbe error is not limited to the prober of the above embodiment, but also a plurality of measuring units equipped with a device to be maintained and a pull-out mechanism for pulling out the device to be maintained, and a measuring unit to which the transported object is transported. It can be applied to any kind of prober equipped with a transport unit that moves to a position accessible to and transports the transported material into the measuring unit at the destination.

Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and it goes without saying that various improvements and modifications may be made without departing from the gist of the present invention. be.

10 ... prober, 12 ... wafer storage unit, 12a ... wafer storage unit, 12b ... probe card storage unit, 14 ... measurement unit, 14a ... opening, 16 ... transfer unit, 16a ... housing, 16b ... wafer holding arm, 16c ... Probe card holding arm, 16d ... Environmental control means, 16e ... Sensor, 16f ... Opening, 18 ... Wafer chuck, 20 ... Head stage, 22 ... Moving device, 24 ... First movable body, 26 ... Second movable body, 28 ... Transfer unit rotation mechanism, 28a ... Drive motor, 30, 32 ... Guide rail, 34 ... Base, 36 ... First probe card holding mechanism, 38 ... Alignment device, 40 ... Second probe card holding mechanism, 40a ... Holding unit, 42 ... Air curtain forming means, 44 ... Test head, 46 ... Pogo frame, 46a ... Pogo frame main body, 46b ... Pogo pin, 48 ... Test head elevating mechanism, 50 ... Test head withdrawal mechanism, 52 ... Pogo frame elevating mechanism, 54 ... Pogo frame pull-out mechanism, 56 ... Base, 58 ... Test head guide rail, 60 ... Test head positioning mechanism, 60a ... Positioning pin, 60b ... Recess, 62 ... Base, 64 ... Pogo frame guide rail, 66 ... Pogo frame positioning Mechanism, 66a ... Positioning pin, 66b ... Recess, CH ... Card holder, PC ... Probe card, W ... Wafer

Claims (2)

A prober that inspects the electrical characteristics of semiconductor devices formed on a wafer.
A probe card in which a plurality of probes are arranged on a surface facing the wafer, and a probe card.
A test head arranged on the side opposite to the wafer with respect to the probe card,
A pogo frame interposed between the probe card and the test head,
A pogo frame elevating mechanism that elevates and elevates the pogo frame with respect to the probe card,
A pogo frame pull-out mechanism that pulls out the pogo frame in a direction perpendicular to the elevating direction of the pogo frame,
Prober equipped with. A test head elevating mechanism that elevates and elevates the test head to the pogo frame,
A test head pull-out mechanism that pulls out the test head in a direction perpendicular to the elevating direction of the test head,
The prober according to claim 1.

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