JP7027177B2 - Correction information generation method, drawing method, correction information generation device and drawing device - Google Patents

Description

The present invention relates to a technique for generating correction information used for correction of drawing data of an image drawn on a substrate based on the position information of a mark on the substrate.

Conventionally, a pattern can be drawn by irradiating a photosensitive material formed on a semiconductor substrate, a printed circuit board, a glass substrate for a plasma display device, a liquid crystal display device, or the like (hereinafter, referred to as "board") with light. It is done. In recent years, with the increase in definition of patterns, drawing devices that directly draw a pattern by scanning a light beam on a photosensitive material have been used.

For example, in the drawing apparatus of Patent Document 1, a pattern described by CAD data is obtained by irradiating a wafer (so-called molded wafer) on which a plurality of semiconductor chips are mounted on the surface with a modulated laser beam from an optical head. Is drawn on each semiconductor chip.

Japanese Unexamined Patent Publication No. 2017-68002

By the way, in the mold wafer as described above, the position shift due to the position shift at the time of mounting the semiconductor chip and the stress generated at the time of molding occurs. In order to correct such discrete positional deviation and perform drawing, in the drawing apparatus described in Patent Document 1, one mark is set as a mark of interest in the measurement image obtained by capturing the entire wafer, and the vertical direction or from the measurement position is used. A mark included in an adjacent area centered on an adjacent center position separated by a predetermined distance in the lateral direction is extracted as an adjacent mark to acquire a measurement position. Such an acquisition step is repeated while using adjacent marks as new attention marks until the measurement positions of all the marks on the measurement image are acquired. Then, after performing a pairing process in which the measurement positions of all the marks on the measurement image are associated with the design positions of the marks, CAD data (drawing) is performed based on the difference between the measurement positions of the associated marks and the design positions. The correction information for correcting the data) is generated.

However, in the above pairing process, it is premised that all the marks are included in the measurement image and the marks are detected. Therefore, when the mark cannot be detected due to dirt on the substrate or the like, the measurement position cannot be obtained after the mark, and the pairing process cannot be performed correctly.

The present invention has been made in view of the above problems, and can stably perform a mark pairing process required for generating correction information used for correction of drawing data of an image drawn on a substrate. The purpose is to provide technology.

A first aspect of the present invention is a correction information generation method for generating correction information used for correction of drawing data of an image drawn on a substrate based on the position information of a plurality of marks arranged in a grid pattern on the substrate. Therefore, (a) a step of preparing design positions for a plurality of marks, (b) a step of photographing a plurality of marks to acquire a measurement image, and (c) acquiring a measurement position of each mark in the measurement image. Based on the steps to be performed, the step of associating each measurement position acquired by the steps (d) and (c) with the design position, and the difference between the measurement position and the design position associated with the steps (e) and (d). It includes a step of generating correction information used for correction of drawing data, and in the step (d) , the positional deviation from a plurality of measurement positions (d-1) in the second direction orthogonal to the first direction is constant. The process of collecting the measurement positions of a plurality of marks arranged in a row in the first direction while being within the permissible range as a measurement position sequence, and (d-2) the design position corresponding to the measurement position sequence among the plurality of design positions. It has a step of collecting as a design position sequence and a step of (d-3) associating the design position closest to the measurement position in the design position sequence for each measurement position constituting the measurement position sequence, and (d). -1) The step, the step (d-2) and the step (d-3) are performed for each measurement position sequence arranged in the second direction orthogonal to the first direction.

Further, the second aspect of the present invention is correction information that generates correction information used for correction of drawing data of an image drawn on the board based on the position information of a plurality of marks arranged in a grid pattern on the board. It is a generation device, and is acquired by a design position storage unit that stores the design positions of a plurality of marks, a measurement position acquisition unit that acquires the measurement position of each mark in a measurement image obtained by photographing a plurality of marks, and a measurement position acquisition unit. Based on the difference between the pairing processing unit that associates each measured position with the design position of the mark and the measurement position and design position associated with the pairing processing unit, the correction information used for correction of drawing data is obtained. The pairing processing unit is provided with a correction information generation unit to generate, and the pairing processing unit is arranged in a row in the first direction while the positional deviation in the second direction orthogonal to the first direction is within a certain allowable range from a plurality of measurement positions. The measurement positions of a plurality of marks to be measured are acquired as a measurement position sequence, and a plurality of design positions corresponding to the measurement position sequences among a plurality of design positions are acquired as a design position sequence for each measurement position constituting the measurement position sequence. It is characterized in that a column pairing operation for associating the nearest design position among the design position sequences is performed for each measurement position sequence arranged in the second direction orthogonal to the first direction.

Further, the third aspect of the present invention is correction information that generates correction information used for correction of drawing data of an image drawn on the board based on the position information of a plurality of marks arranged in a grid pattern on the board. It is a generation device, and is acquired by a design position storage unit that stores the design positions of a plurality of marks, a measurement position acquisition unit that acquires the measurement position of each mark in a measurement image obtained by photographing a plurality of marks, and a measurement position acquisition unit. Based on the difference between the pairing processing unit that associates each measured position with the design position of the mark and the measurement position and design position associated with the pairing processing unit, the correction information used for correction of drawing data is obtained. The pairing processing unit is provided with a correction information generation unit to generate, and the pairing processing unit acquires a plurality of measurement positions arranged in a line in a first direction from a plurality of measurement positions as a measurement position sequence and measures among a plurality of design positions. A column pairing operation is orthogonal to the first direction, in which a plurality of design positions corresponding to a position row are acquired as a design position row and the nearest design position among the design position rows is associated with each measurement position constituting the measurement position row. It is characterized in that it is performed for each measurement position sequence arranged in the second direction.

Further, a fourth aspect of the present invention is a drawing device for drawing an image on a substrate, which is formed on a substrate by using a light source unit, the correction information generation device, and correction information generated by the correction information generation device. A drawing data correction unit that corrects the drawing data of the image to be drawn, an optical modulation unit that modulates the light from the light source unit based on the drawing data corrected by the drawing data correction unit, and light modulated by the optical modulation unit. It is characterized by being provided with a scanning mechanism that scans on a substrate.

In the invention configured as described above, the measurement position sequence is collected from the measurement position of the mark included in the measurement image, and the design position sequence corresponding to the measurement position sequence is collected. After the interrelated measurement position sequence and design position sequence are extracted in this way, the measurement positions constituting the measurement position sequence are associated with the design position of the design position sequence and paired. Therefore, even if the measurement position that should be originally included in the measurement position sequence is missing, the other measurement positions are paired with the design position.

As described above, according to the present invention, even if a part of a plurality of marks cannot be detected due to dirt on the substrate or the like, the measurement position and the design position are associated with each other for the remaining marks. It is possible to stabilize the pairing process.

It is a figure which shows the schematic structure of the direct drawing apparatus 1 which is the drawing apparatus which concerns on one Embodiment of this invention. It is a top view which shows an example of the upper surface of a substrate. It is a block diagram which shows the function of a control part. It is a figure which shows the flow of drawing an image on a substrate. It is a flowchart which shows the pairing process performed at the time of generating correction information. It is a flowchart which shows the calculation of the rotation angle executed in a pairing process. It is a figure which shows an example of the measurement position before and after the execution of rotation and offset. It is a flowchart which shows the lower side search / collection process. It is a figure which shows typically the determination condition executed in FIG. It is a flowchart which shows the collection operation of the measurement position which constitutes the selected measurement position sequence.

FIG. 1 is a diagram showing a schematic configuration of a direct drawing device 1 which is a drawing device according to an embodiment of the present invention. The direct drawing device 1 is a device that irradiates the upper surface of a substrate 9 on which a photosensitive layer, which is a layer of a photosensitive material such as a resist, is formed with light to draw an image of a pattern on the substrate 9. The substrate 9 is a variety of substrates such as a semiconductor substrate, a printed wiring board, a color filter substrate, a liquid crystal display device, an organic EL display device, a glass substrate for a flat panel display device such as a plasma display device, and a recording disk substrate. good.

The direct drawing device 1 includes a stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, a transfer robot 15, a cassette mounting unit 16, a base 17, a cover 18, a control unit 19, and the like. The cover 18 covers the upper part of the base 17 and forms a processing space in which the substrate 9 is processed. A stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, and a transfer robot 15 are arranged in the processing space. The light source unit 13 may be arranged outside the processing space. The direct drawing device 1 is also provided with an alignment unit (not shown).

The stage moving mechanism 12 is arranged on the base 17. The stage moving mechanism 12 includes a Y-direction moving mechanism 121, an X-direction moving mechanism 122, and a rotation mechanism 123. The stage 11 holds the substrate 9 in a horizontal posture on the upper surface thereof. The stage moving mechanism 12 is a moving mechanism that moves the substrate 9 together with the stage 11. The rotation mechanism 123 rotates the stage 11 about a central axis facing the Z direction, which is the vertical direction. The X-direction moving mechanism 122 moves the rotation mechanism 123 and the stage 11 in the X direction, which is the sub-scanning direction. The X direction is a horizontal direction perpendicular to the Z direction. The Y-direction moving mechanism 121 moves the X-direction moving mechanism 122, the rotation mechanism 123, and the stage 11 in the Y direction, which is the main scanning direction. The Y direction is a horizontal direction perpendicular to the Z direction and the X direction.

The Y-direction moving mechanism 121 has a linear motor and a guide rail 212, and the X-direction moving mechanism 122 is moved along the guide rail 212 by the linear motor. The X-direction moving mechanism 122 also has a linear motor 221 and a guide rail 222, and the rotating mechanism 123 is moved along the guide rail 222 by the linear motor 221.

The light source unit 13 is supported by a support column 131 fixed to the base 17. The optical head 14 is connected to the light source unit 13. The number of optical heads 14 may be two or more, and in this case, for example, the optical heads 14 are arranged in the X direction. The light source unit 13 includes a laser drive unit, a laser oscillator, and an optical system. The light beam generated by the light source unit 13 is guided to the optical head 14.

The optical head 14 includes a spatial light modulator 141, which is an optical modulator that modulates the light from the light source unit 13. Spatial light modulator 141 is, for example, a GLV® (Grating Light Valve). The spatial light modulator 141 may be a DMD (Digital Mirror Device) or the like. The optical head 14 is spatially modulated by an optical system that converts the light beam from the light source unit 13 into linear light having a linear light beam cross section and guides the light beam to the spatial light modulator 141, and the spatial light modulator 141. It further includes an optical system that guides the light beam to the substrate 9.

The unprocessed substrate 9 is mounted on the cassette mounting portion 16 in a state of being housed in the cassette 161. The substrate 9 is taken out from the cassette 161 by the transfer robot 15 through the opening of the cover 18 and placed on the stage 11. Then, the alignment unit is controlled by the control unit 19, and the position and the rotation position of the substrate 9 in the XY direction are adjusted.

The stage 11 moves in the Y direction by the Y-direction moving mechanism 121, and in parallel, a space-modulated light beam is emitted from the optical head 14 toward the substrate 9, and a pattern is drawn on the substrate 9. When the movement in the Y direction is completed, the stage 11 is stepped in the X direction by the X direction moving mechanism 122, and drawing is performed while moving in the direction opposite to the previous time from the Y direction moving mechanism 121. When the above operation is repeated and drawing is performed on the entire area to be drawn on the substrate 9, the substrate 9 is conveyed from the stage 11 to the cassette 161 by the transfer robot 15.

In the direct drawing device 1, the stage moving mechanism 12 is a scanning mechanism that scans the light modulated by the spatial light modulator 141 on the substrate 9. As the scanning mechanism, a mechanism for moving the optical head 14 in the X direction and the Y direction may be provided on the fixed stage 11. The direct drawing device 1 further includes an image pickup unit 21 that images the upper surface 91 of the substrate 9. The image pickup unit 21 is attached to, for example, the optical head 14.

FIG. 2 is a plan view showing an example of the upper surface of the substrate. The substrate 9 is a semiconductor chip 92 mounted on a substantially disk-shaped semiconductor substrate, and the plurality of semiconductor chips 92 are molded with resin (so-called molded substrate). Each semiconductor chip 92 has a substantially rectangular shape in a plan view. In the example shown in FIG. 2, a mark 93 is provided at the upper left corner of each semiconductor chip 92. The mark 93 is, for example, an alignment mark provided on the upper surface of each semiconductor chip 92. The mark 93 may be a part of a pattern provided on the upper surface of the semiconductor chip 92. In FIG. 2, the mark 93 is indicated by a black circle, but the shape of the mark 93 may be changed in various ways. Further, the number and arrangement of the semiconductor chips 92 and the number and arrangement of the marks 93 may be changed in various ways.

The plurality of marks 93 are arranged in a grid pattern on the substrate 9 in the horizontal direction (X direction) and the vertical direction (Y direction) in FIG. In the following description, the X and Y directions are also simply referred to as "horizontal" and "vertical". Further, as will be described later, since the measurement positions are collected in units of the marker rows arranged in a row in the Y direction, they are arranged in a row in the Y direction on the most upstream side in the X direction as shown in FIG. The one mark 93 is collectively referred to as a mark row 941, and the four marks 93 constituting the mark row 941 are referred to as marks 93a to 93d, respectively. The same applies to the other marker columns 942 to 944. That is, the four marks 93 constituting the mark row 942 are referred to as marks 93e to 93h, respectively, the four marks 93 constituting the mark row 943 are referred to as marks 93i to 93l, respectively, and the four marks 93 constituting the mark row 944 are referred to. Are referred to as marks 93m to 93p, respectively.

In the direct drawing device 1, the drawing data of the image drawn on the substrate 9 is corrected by the control unit 19 based on the position information of the mark 93 on the substrate 9, and the plurality of semiconductor chips 92 are corrected based on the corrected drawing data. A pattern is drawn on top. The correction of drawing data will be described later. On the substrate 9, the upper surfaces of the plurality of semiconductor chips 92 are a plurality of pattern drawing areas on which patterns are drawn.

FIG. 3 is a block diagram showing the functions of the control unit. FIG. 3 also shows a part of the configuration of the direct drawing device 1 connected to the control unit 19. The control unit 19 has a general computer system configuration including a CPU that performs various arithmetic processes, a ROM that stores basic programs, and a RAM that stores various information. The function of the control unit 19 may be realized by a dedicated electric circuit, or a partially dedicated electric circuit may be used.

As shown in FIG. 3, the control unit 19 includes a correction information generation device 31 and a drawing data correction unit 32. The correction information generation device 31 includes a design position storage unit 311, a measurement position acquisition unit 312, a pairing processing unit 313, and a correction information generation unit 314. The correction information generation device 31 generates correction information used for correction of drawing data of an image drawn on the board 9 based on the position information of the mark 93 on the board 9. The drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 by using the correction information generated by the correction information generation device 31.

Next, the flow of drawing an image on the substrate 9 by the direct drawing device 1 will be described with reference to FIG. In the direct drawing device 1, first, the design positions of the plurality of marks 93 arranged in a grid pattern in the vertical direction and the horizontal direction on the substrate 9 are stored by the design position storage unit 311 of the correction information generation device 31. Prepared (step S1). That is, the set positions of the marks 93a to 93p are extracted from the CAD data, which is the design data of the image to be drawn on the substrate 9, and stored in the design position storage unit 311. Therefore, the correction information generation device 31 can appropriately collect all or a part of the set positions of the marks 93a to 93p.

In the design data, the Y-direction spacing of the markings 93 in each of the marking rows 941 to 944 (the spacing PT in FIG. 9 described later) and the X-direction spacing of the marking rows 941 to 944 are both set to about 2 mm. However, they may be different from each other. Moreover, it is not limited to 2 mm.

Subsequently, the image pickup unit 21 takes an image of the upper surface 91 of the substrate 9 on the stage 11 and acquires an image of the substrate 9 (hereinafter referred to as “measurement image”) (step S2). The measurement image of the substrate 9 is an image obtained by photographing all the marks 93 on the substrate 9. The measurement image acquired by the image pickup unit 21 is sent to the measurement position acquisition unit 312 of the control unit 19.

The measurement position acquisition unit 312 recognizes the mark image (not shown) included in the measurement image, acquires the positions of all the marks 93, and temporarily stores them in the RAM (step S3). In the following description, the positions of the marks on the measurement image are referred to as "measurement positions", and the measurement positions of the marks 93a to 93p acquired by executing the above step S3 are the measurement positions Pa (xa, ya) to Pp (xp), respectively. , Yp), or simply the measurement positions Pa to Pp. Since a conventionally known method for obtaining the measurement position of the mark 93 from the measurement image can be used, detailed description thereof will be omitted here.

In this way, when the acquisition of the design position and the measurement position for all the marks 93 is completed, the pairing process is executed by the pairing processing unit 313, and the measurement position and the design position of each mark 93 are associated with each other (step S4). The pairing process will be described in detail later.

In the next step S5, for each mark 93, correction information used for correction of drawing data is generated based on the difference between the measurement position and the design position associated with each other by the pairing process. Specifically, the deviation of the measurement position of each mark 93 from the design position is acquired as the position deviation from the design position of the semiconductor chip 92 corresponding to each mark 93, and the positions of all the semiconductor chips 92 on the substrate 9 are obtained. Correction information for correcting each deviation is generated. As will be described later, when rotation correction or shift correction is executed in the pairing process, correction information is generated in consideration of these correction contents.

When the correction information is acquired as described above, the drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 by using the correction information (step S6). Specifically, the position of the pattern to be drawn on each semiconductor chip 92 included in the drawing data is corrected based on the correction information indicating the positional deviation of each semiconductor chip 92 from the design position. Then, the spatial light modulator 141 and the stage moving mechanism 12 are controlled based on the corrected drawing data, so that the modulated light is scanned on the substrate. As a result, the pattern for each semiconductor chip 92 included in the drawing data is accurately drawn on each corresponding semiconductor chip 92 in consideration of the positional deviation of the semiconductor chip 92 (step S7).

Next, the pairing process will be described in detail with reference to FIGS. 5 to 10. FIG. 5 is a flowchart showing a pairing process performed when the correction information is generated. This pairing process is a process of associating the position of each mark 93 measured based on the measurement image, that is, the measurement position with the design position. In this embodiment, not only the position of the semiconductor chip 92 with respect to the substrate 9 is displaced, but also the substrate 9 itself rotates or shifts with respect to a preset reference position and is placed on the stage 11. It may be. When such rotation or shift displacement is large, if the pairing process is performed while such rotation or shift displacement occurs, the accuracy may decrease. Therefore, in the present embodiment, as shown in FIG. 4, the stage 11 on which the substrate 9 is placed is actually rotated by executing steps S41 to S43 before pairing the measurement position and the design position. The measurement position is rotationally corrected on the data without shifting in the X or Y direction, and the measurement position is offset by the shift correction to rotate the measurement position and the design position. It suppresses the inclusion of misalignment components due to shift displacement.

More specifically, the pairing processing unit 313 executes the rotation angle calculation process (step S41) shown in FIG. 6 to calculate the rotation angle of the substrate 9. In this calculation process, instead of using the measurement positions of all the marks 93, the measurement position sequences arranged in a row in the Y direction are extracted and the measurement position sequence is used. For example, when the measurement positions Pa (xa, ya) to Pd (xd, yd) of the marks 93a to 93d constituting the mark sequence 941 are used, they are extracted from all the measurement positions and used as the measurement position sequence for calculating the rotation angle. Function. In the following, the above-mentioned "measurement position sequence" means a measurement position group arranged in a row in the Y direction. For example, in FIG. 7, the measurement position Pa (xa, ya) of the mark column 941 is used. )-Pd (xd, yd), and the measurement position sequence P942 composed of the measurement positions Pe (xe, ye) to Ph (xh, yh) of the mark column 942 are shown. ..

In order to extract the measurement position sequence, in the present embodiment, the pairing processing unit 313 is provided with two types of storage units, that is, a ListMes storage unit 313a and a ListLeft storage unit 313b. Further, the pairing processing unit 313 further has a ListCAD storage unit 313c for the pairing processing described later. Of these, the ListMes storage unit 313a stores all measurement positions Pa (xa, ya) to Pp (xp, yp) immediately after the start of the rotation angle calculation process (step S411).

In the next step S412, the measurement positions Pa (xa, ya) to Pp (xp, yp) stored in the ListMes storage unit 313a are sorted in ascending order by the X coordinate. For example, when the measurement position Pa is located at the uppermost stream in the X direction as shown in the column (a) of FIG. 7, the measurement position Pa (xa, ya) is ListMes according to the arrangement order of the marks 93a to 93d. It is located at the head of the storage unit 313a. On the other hand, when the measurement position Pb is located at the uppermost stream in the X direction as shown in the column (b) of the figure, the measurement position Pb (xb, yb) is located at the head of the ListMes storage unit 313a. Then, the measurement position located at the head of the ListMes storage unit 313a that has been sorted in ascending order is taken out from the ListMes storage unit 313a and stored as the position P0 in the ListLeft storage unit 313b of the pairing processing unit 313 (step S413).

This position P0 means the extraction start position of the measurement position sequence, and the lower search / collection process (step S414) of the measurement position for searching and collecting the measurement position toward the lower side of FIG. 7 from here. , The upper side search / collection process (step S415) of the measurement position for searching and collecting the measurement position toward the upper side of FIG. 7 is executed in order. Since these two processes are substantially the same except that the search directions are opposite, the lower search / collection process (step S414) will be described in detail with reference to FIGS. 8 and 9. The description of the upper search / collection process (step S415) will be omitted.

FIG. 8 is a flowchart showing a lower search / collection process of searching for measurement positions arranged in a row in the Y direction and extracting and collecting them. FIG. 9 is a diagram schematically showing the determination conditions executed in FIG. Here, the position P0 is first set as the reference position p_ref (xr, yr) (step S414a). Then, from the reference position p_ref (xr, yr) to the lower side (lower side in FIG. 9), the measurement position p_ref. It is determined whether or not next () exists (step S414b). For example, as shown in the column (a) of FIG. 9, when another measurement position exists in the vicinity position which is separated from the reference position p_ref (xr, yr) by the interval PT, it is the measurement position p_ref. While it corresponds to next (), as shown in the column (b) of the figure, the measurement position is missing at the vicinity position, and the vicinity is separated from the reference position p_ref (xr, yr) by an interval (2 × PT). If another measurement position exists at the position, it is the measurement position p_ref. Corresponds to next (). The measurement position p_ref is located below the reference position p_ref (xr, yr). If next () does not exist (“NO” in step S414b), the lower search / collection process (step S414) is terminated, and the process proceeds to the upper search / collection process (step S415).

In step S414b, the measurement position p_ref. When the presence of next () is confirmed, the measurement position p_ref is set as the position p_cur as shown in FIGS. 8 and 9. next () is set (step S414c), and the process proceeds to step S414d. In this step S414d, it is determined whether or not the following determination condition A is satisfied. This determination condition A has a condition relating to the X coordinate and a condition relating to the Y coordinate. Specifically, the condition regarding the X coordinate is that the X coordinate p_cur of the position p_cur. x is the following inequality p_ref. x-α <p_cur. x <p_ref. x + α
However, p_ref. x is the X coordinate of the reference position p_ref, that is, xr,
α is an allowable value of misalignment, for example, 1/10 of the interval PT,
Means to be satisfied.

Further, the condition regarding the Y coordinate of the determination condition A is the Y coordinate p_cur. y is the following inequality p_ref. y-PT + α <p_cur. y <p_ref. y-3 × PT-α
However, p_ref. y is the Y coordinate of the reference position p_ref, that is, xy,
Means to be satisfied. That is, satisfying the determination condition A including these is, for example, within the allowable region shown by the broken line in FIG. 9, and the measurement position p_cur is arranged in a row in the Y direction below the reference position p_ref (xr, yr). It means that it is a measurement position that is arranged in the above and constitutes a measurement position sequence.

Therefore, when the determination condition A is satisfied in step S414d and the determination is "True", the measurement position p_cur is taken out from the ListMes storage unit 313a as the measurement position constituting the measurement position sequence and stored in the ListLeft storage unit 313b. Along with (step S414e), the measurement position p_cur is set to the new reference position p_ref (step S414f), and then the process returns to step S414b. Therefore, while the determination is “True” in step S414d, the measurement positions arranged in a line in the Y direction are sequentially taken out from the ListMes storage unit 313a and stored in the ListLeft storage unit 313b.

On the other hand, if the determination condition A is not satisfied in step S414d and it is determined to be "False", the process proceeds to step S414g, and the ListMes storage unit 313a has the measurement position p_cur next to the measurement position p_cur. It is determined whether or not next () exists. Then, the next measurement position p_cur. If next () is present, this is set as the new measurement position p_cur (step S414h), and the process returns to step S414d.

By executing such a series of processes, the measurement positions arranged in a line in the Y direction from the head position P0 are taken out from the ListMes storage unit 313a. For example, in the case shown in the column (a) of FIG. 7, the measurement positions Pa to Pd are taken out and collected, while in the case shown in the column (b) of FIG. 7, the measurement positions Pb to Pd are taken out and collected.

If only such a lower search / collection process (step S414) is performed, in the case shown in the column (b) of FIG. 7, the collection of the measurement position Pa that should be originally collected is forgotten, but the lower search / collection process is performed. By executing the upper search / collection process (step S415) following (step S), the measurement position Pa in the case in the column (b) of FIG. 7 is surely collected. Therefore, in the present embodiment, as described above, the lower search / collection process (step S414) and the upper search / collection process (step S415) are continuously performed. Then, it is determined whether or not the number of measurement positions collected subsequently, that is, the number of collections exceeds a predetermined threshold value (step S416).

When a determination of "NO" is made in step S416, in other words, when a measurement position sufficient for calculating the rotation angle has not been collected, the stored content of the ListLeft storage unit 313b is cleared (step S417) and the measurement position is set. After the start position to be taken out (memory address to take out the measurement position first from the ListMes storage unit 313a) is changed (step S418), the process returns to step S413 and the above series of processes (steps S413 to S416) are repeated. As a result, instead of the measurement position sequence P941, another measurement position sequence P942 or the like is newly taken out for rotation correction.

On the other hand, when it is determined as "YES" in step S416, that is, the measurement position sequence extends to some extent in the Y direction and the inclination of the measurement position sequence, that is, the rotation angle of the substrate 9 can be calculated. The process proceeds to step S419. Here, the rotation angle is calculated by line segment approximation based on the collected measurement positions.

The explanation will be continued by returning to FIG. When the calculation of the rotation angle (step S41) is completed as described above, all the measurement positions Pa to Pp are rotated in the opposite direction by the rotation angle, and the rotation correction of the measurement position is executed (step S42). Further, all the rotation-corrected measurement positions Pa to Pp are shifted and moved in the X direction and the Y direction, and the offset of the measurement positions Pa to Pp is executed (step S43). As a result, for example, as shown in column (c) of FIG. 7, the measurement positions Pa to Pp are aligned with respect to the design position (square mark in the figure). As a result, it is possible to suppress the influence of the rotation of the substrate 9 and the misalignment of the substrate 9 on the stage 11.

Next, steps S44 to S48 are repeated for the number of measurement position rows P941 to P944, and pairing of the measurement position and the design position is performed for each measurement position row. That is, one of the measurement position sequences P941 to P944 for which pairing has not been completed is selected (step S44), and the measurement positions constituting the selected measurement position sequence are collected (step S45).

FIG. 10 is a flowchart showing a collection operation of measurement positions constituting the selected measurement position sequence. In this collection operation (step S45), all the measurement positions subjected to the rotation correction and the shift correction are stored in the ListMes storage unit 313a (step S450) and then sorted in ascending order by the X coordinate (step S451). Then, the measurement positions for one row are collected in the Y direction from the measurement positions sorted in ascending order (steps S452 to S459). The specific collection method is basically the same as the lower search / collection (steps S414a to S414h) shown in FIG. 8, except for the determination condition. For example, when collecting the most upstream measurement position sequence P941 in the X direction, the first measurement position stored in the ListMes storage unit 313a after ascending order sorting as the position P0 is taken out and stored in the ListLeft storage unit 313b. Then, the position P0 is set as the reference position p_ref (xr, yr) (step S452).

Next, the measurement position p_ref. Whether or not next () is present is determined (step S453), and the measurement position p_ref. When the existence of next () is confirmed, the measurement position p_ref. next () is set (step S454), and the process proceeds to step S455. In this step S455, it is determined whether or not the following determination condition C is satisfied. This determination condition C is composed only of the conditions related to the X coordinate. This is because the measurement positions stored in the ListMes storage unit 313a have undergone rotation correction and shift correction, and the measurement positions to be collected are arranged in a line in the Y direction. .. Therefore, in step S455, the X coordinate p_cur. x is the following inequality p_ref. x-α <p_cur. x <p_ref. x + α
It is judged whether or not the satisfaction is satisfied. Then, when it is determined that the determination condition C is satisfied (“True” in step S456), that is, the measurement position p_cur is a measurement position constituting the measurement position sequence to be collected, the measurement position p_cur is paired. It is taken out from the ListMes storage unit 313a as the target measurement position and stored in the ListLeft storage unit 313b (step S456), and the measurement position p_cur is set to the new reference position p_ref (step S457), and then the process returns to step S453. Therefore, while it is determined to be "True" in step S455, the measurement positions to be collected are sequentially taken out from the ListMes storage unit 313a as a pairing target and stored in the ListLeft storage unit 313b.

On the other hand, if the determination condition C is not satisfied in step S455 and it is determined to be "False", the process proceeds to step S458, and the ListMes storage unit 313a is notified of the measurement position p_cur next to the measurement position p_cur. It is determined whether or not next () exists. Then, the next measurement position p_cur. If next () is present, it is set as the new measurement position p_cur (step S459), and the process returns to step S455. By executing such a series of processes, the measurement positions arranged in a line in the Y direction from the position P0 are taken out from the ListMes storage unit 313a and collected, and the measurement position sequence for pairing is obtained.

Returning to FIG. 5 again, the explanation will be continued. In the next step S46, the design positions for one row corresponding to the measurement position row are collected from the design position storage unit 311 as pairing candidates and stored in the ListCAD storage unit 313c (step S46). Subsequently, the measurement positions stored in the ListLeft storage unit 313b are associated with the nearest design positions stored in the ListCAD storage unit 313c, respectively, and pairing is performed (step S47).

Such a series of processes (steps S44 to S47) is repeated as long as there is an unpaired measurement position sequence (“YES” in step S48). Then, when the pairing is completed for all the measurement processing columns, the pairing processing (step S4) is completed, and after the above-mentioned correction information generation (step S5) and drawing data correction (step S6) are performed, the substrate is used. Drawing for 9 is executed (step S7).

As described above, according to the present embodiment, the measurement positions Pa to Pd arranged in a row in the Y direction from the measurement positions Pa to Pp of the marks 93a to 93p included in the measurement image are collected as the measurement position sequence P941. (Step S45), the design position sequence corresponding to the measurement position sequence P941 is collected (step S46). Then, the measurement positions Pa to Pd constituting the measurement position sequence P941 are associated with the design position of the design position sequence and paired (step S47). Therefore, even if a part of the measurement position that should be originally included in the measurement position sequence P941 is missing, the other measurement positions are surely paired with the design position. Such a row pairing operation (steps S45 to S47) is similarly performed for the other measurement position rows P942 to P944 arranged in the X direction. Therefore, even if a part of the plurality of marks 93 cannot be detected due to dirt on the substrate 9, the measurement position and the design position can be correctly associated with each other for the remaining marks 93, and pairing can be performed. It is possible to stabilize the processing.

Further, since the pairing process can be performed accurately and stably in this way, the semiconductor chip 92 can be mounted on the substrate 9 at a high density.

As described above, in the present embodiment, steps S1, S2, S3, S4, and S5 are the "(a) step", "(b) step", "(c) step", and "(d) step" of the present invention, respectively. , Corresponds to an example of "(e) step". Further, steps SS41, S42, S43, S45, S46, and S47 are the "(d-4) step", "(d-5) step", "(d-6) step", and "(d-)" of the present invention, respectively. It corresponds to an example of "1) step", "(d-2) step", and "(d-3) step". Further, steps S45 to S47 correspond to an example of the "column pairing operation" of the present invention. Further, the Y direction (vertical direction) and the X direction (horizontal direction) correspond to the "first direction" and the "second direction" of the present invention, respectively.

The present invention is not limited to the above-described embodiment, and various modifications can be made other than those described above as long as the present invention is not deviated from the gist thereof. For example, in the above embodiment, the measurement positions are collected in the Y direction to acquire the measurement position sequence, but the measurement positions may be collected in the other direction, for example, the X direction to acquire the measurement position sequence.

Further, in the above embodiment, the column pairing operation (steps S45 to S47) is repeated based on the measurement position after the rotation correction (step S42) and the shift correction (step S43) are executed, but the rotation correction is performed. And at least one of the shift corrections may be omitted. That is, the column pairing operation is executed based on the measurement position obtained only by rotation correction, the measurement position obtained only by shift correction, or the measurement position obtained in step S3 without performing any rotation correction or shift correction. You may.

Further, in the above embodiment, rotation correction (step S42) and shift correction (step S43) are performed on the data without rotating and offsetting the substrate 9, but rotation correction (step S42) is performed in the pairing process. ) Is rotated to correct the rotation, and instead of the shift correction (step S43), the stage 11 is shifted and moved in the X and Y directions to perform shift correction with respect to the design position. The substrate 9 may be mechanically aligned. In this case, it is desirable to acquire the measurement image again after the alignment and to acquire the measurement positions of all the marks on the measurement image again.

Further, in the above embodiment, the rotation correction is performed using the measurement position, but when a plurality of alignment marks are provided on the upper surface 91 of the substrate 9 in addition to the mark 93, these alignment marks are imaged. Rotation correction or shift correction may be performed based on the position information obtained in the above steps.

Further, the correction information generation device 31 is a device (for example, a computer system as described above) that generates correction information used for correction of drawing data of an image drawn on the board 9 based on the position information of a mark on the board 9. ) May be used alone. Alternatively, the correction information generation device 31 may be used together with a device other than the direct drawing device 1.

INDUSTRIAL APPLICABILITY The present invention can be applied to all techniques for generating correction information used for correction of drawing data of an image drawn on the substrate based on the position information of a mark on the substrate.

1 ... Direct drawing device (drawing device)
9 ... Substrate 12 ... Stage moving mechanism (scanning mechanism)
13 ... Light source unit 31 ... Correction information generator 32 ... Drawing data correction unit 93a to 93p ... Mark 141 ... Spatial light modulator (optical modulator)
311 ... Design position storage unit 312 ... Measurement position acquisition unit 313 ... Pairing processing unit 313a ... ListMes storage unit 313b ... ListLeft storage unit 313c ... ListCAD storage unit 314 ... Correction information generation unit P941 to P944 ... Measurement position sequence Pa to Pp ... Measurement position

Claims (6)

It is a correction information generation method that generates correction information used for correction of drawing data of an image drawn on the substrate based on the position information of a plurality of marks arranged in a grid pattern on the substrate.
(A) The process of preparing the design positions of the plurality of marks and
(B) A step of photographing the plurality of marks to acquire a measurement image, and
(C) A step of acquiring the measurement position of each mark in the measurement image and
(D) A step of associating each measurement position acquired in the step (c) with the design position, and
(E) A step of generating correction information used for correction of drawing data based on the difference between the measurement position and the design position associated with the step (d) is provided.
The step (d) is
(D-1) The measurement positions of a plurality of marks arranged in a row in the first direction while the positional deviation in the second direction orthogonal to the first direction is within a certain allowable range from the plurality of measurement positions. The process of collecting as a measurement position sequence and
(D-2) A step of collecting the design positions corresponding to the measurement position rows among the plurality of design positions as the design position rows, and
(D-3) Each measurement position constituting the measurement position sequence includes a step of associating the nearest design position with respect to the measurement position in the design position sequence.
The feature is that the step (d-1), the step (d-2), and the step (d-3) are performed for each measurement position sequence arranged in the second direction orthogonal to the first direction. How to generate correction information. The amendment information generation method according to claim 1.
The step (d) is
(D-4) A step of obtaining a rotation angle at which the measurement position acquired by the step (c) is rotated with respect to the design position on a plane including the first direction and the second direction.
(D-5) The step includes a step of rotating the measurement position relative to the design position by the rotation angle to correct the measurement position.
The steps (d-4) and (d-5) above are performed prior to performing the steps (d-1), (d-2) and (d-3) for all the measurement position sequences. While executing the step, the step (d-1), the step (d-2) and the step (d-3) are performed based on the corrected measurement position obtained by executing the step (d-5). How to generate correction information to be executed. The amendment information generation method according to claim 1.
The step (d) is
(D-4) A step of obtaining a rotation angle at which the measurement position acquired by the step (c) is rotated with respect to the design position on a plane including the first direction and the second direction.
(D-5) A step of correcting the measurement position by rotating it relative to the design position by the rotation angle.
(D-6) has a step of shifting and correcting the measurement position corrected by the step (d-5) in the plane with respect to the design position.
The step (d-4), the step (d-5), and the steps (d-5) prior to executing the step (d-1), the step (d-2), and the step (d-3) for all the measurement position sequences. The step (d-1), the step (d-2) and the step (d-2) and the step (d-2) and the step (d-2) and the step (d-2) and the step (d-2) are executed based on the corrected measurement position obtained by executing the step and the step (d-6). A correction information generation method for executing the step (d-3). It is a drawing method that draws an image on a board.
A step of acquiring correction information by the correction information generation method according to any one of claims 1 to 3.
The process of correcting the drawing data of the image drawn on the board by using the correction information, and
The process of scanning the light modulated based on the corrected drawing data on the substrate, and
A drawing method characterized by being provided with. A correction information generation device that generates correction information used for correction of drawing data of an image drawn on the substrate based on the position information of a plurality of marks arranged in a grid pattern on the substrate.
A design position storage unit that stores the design positions of the plurality of marks, and
A measurement position acquisition unit that acquires the measurement position of each mark in the measurement image obtained by photographing the plurality of marks, and a measurement position acquisition unit.
A pairing processing unit that associates each measurement position acquired by the measurement position acquisition unit with the design position of the mark, and a pairing processing unit.
It is provided with a correction information generation unit that generates correction information used for correction of drawing data based on the difference between the measurement position and the design position associated with the pairing processing unit.
The pairing processing unit measures a plurality of marks arranged in a row in the first direction while the positional deviation in the second direction orthogonal to the first direction is within a certain allowable range from the plurality of measurement positions. The position is acquired as a measurement position sequence, and a plurality of design positions corresponding to the measurement position sequence among the plurality of design positions are acquired as a design position sequence, and the design position sequence is obtained for each measurement position constituting the measurement position sequence. A correction information generation device, characterized in that a column pairing operation for associating the nearest design position is performed for each measurement position sequence arranged in a second direction orthogonal to the first direction. A drawing device that draws an image on a substrate.
Light source part and
The correction information generator according to claim 5 and
A drawing data correction unit that corrects drawing data of an image drawn on a substrate by using the correction information generated by the correction information generation device, and a drawing data correction unit.
An optical modulation unit that modulates the light from the light source unit based on the drawing data corrected by the drawing data correction unit, and
A scanning mechanism that scans the light modulated by the optical modulator on the substrate, and
A drawing device characterized by comprising.

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