JP7008118B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device.

Conventionally, component mounting devices have been known. The component mounting device is disclosed, for example, in Japanese Patent No. 3691888.

In Japanese Patent No. 3691888, a suction head for mounting components on a substrate, a feeder for supplying components to the suction head, a camera for capturing the component supply position of the feeder from above, and a component supply for the feeder are provided. An electronic component mounting device (component mounting device) including an optical distance sensor for measuring a position height position is disclosed. This electronic component mounting device is configured to measure the height position of the component supply position by an optical distance sensor and to measure the horizontal position of the component supply position by imaging with a camera.

Japanese Patent No. 3691888

However, in the electronic component mounting device of Patent No. 3691888, the height position of the component supply position is measured by an optical distance sensor, the component is moved to a position different from the measured position, and the component is imaged by a camera. Since the horizontal position of the supply position is measured, there is a problem that the time for the component suction operation becomes longer because the measurement position needs to be moved.

The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to move the measurement position for measuring the height position and the horizontal position of the component at the component supply position. It is an object of the present invention to provide a component mounting device capable of suppressing a lengthening of the component suction operation time due to the above.

The component mounting device according to one aspect of the present invention is provided in a head unit including a mounting head for mounting components on a board, a component supply unit for supplying components to the mounting head, and a component supply unit. Based on the image pickup unit that can image the component supply position of the unit from multiple directions and the image of the component supply position imaged from multiple directions by the image pickup unit, the horizontal position and vertical height of the component at the component supply position. It is equipped with a control unit that acquires the vertical position, and the control unit corrects the vertical suction height position based on the vertical height position of the component at the acquired component supply position and controls the component suction. The control unit is configured to update the reference height position based on the result of acquiring the vertical height position of the component in the component supply position in the plurality of components .

In the component mounting device according to one aspect of the present invention, as described above, the horizontal position and the vertical height of the component at the component supply position are based on the images of the component supply positions captured from a plurality of directions by the image pickup unit. A control unit for acquiring the horizontal position is provided. As a result, it is possible to take an image without moving the head unit in the horizontal direction in order to acquire the height position and the horizontal position of the component supply position, so that it is possible to suppress a long time for imaging the component supply position. can do. As a result, it is possible to suppress a long time for the component suction operation due to the movement of the measurement position for measuring the height position and the horizontal position of the component at the component supply position. In addition, since the horizontal position and the vertical height position of the component at the component supply position can be acquired based on the common imaging result, the height position and the horizontal position of the component supply position can be measured separately. It is possible to suppress the lengthening of the component suction operation time as compared with the case of the above.

In the component mounting device according to the above one aspect, preferably, the control unit is configured to correct and acquire the horizontal position of the component based on the vertical height position of the component at the component supply position. There is. With this configuration, when the component supply position is photographed from an oblique direction, even if the vertical height position of the component at the component supply position deviates from the reference position, the horizontal position is corrected and acquired. Therefore, the horizontal position of the component can be accurately obtained.

In the component mounting device according to the above one aspect, preferably, the control unit acquires the height around the component supply position based on the images of the component supply positions captured from a plurality of directions by the image pickup unit, and determines the height of the component supply position. It is configured to determine the presence or absence of components to be adsorbed. With this configuration, the presence or absence of parts can be determined based on the height around the parts supply position. Therefore, when the presence or absence of parts is determined by image analysis using an image density threshold value or the like. Unlike, it is possible to determine the presence or absence of a component without depending on imaging conditions such as brightness. This makes it possible to accurately determine the presence or absence of parts. In addition, by determining the presence or absence of parts at the parts supply position, it is possible to recognize that if there are no parts, the parts cannot be sucked before taking an image to confirm the position and orientation of the sucked parts. Therefore, it is possible to shorten the time until the parts are adsorbed. As a result, it is possible to effectively suppress the lengthening of the component suction operation time. Such an effect is particularly effective when sucking a very small part, which is difficult to determine whether or not the part is sucked due to a change in the negative pressure of air for sucking the part of the mounting head.

In this case, preferably, the control unit controls to supply a new component to the component supply position when there is no component to be sucked at the component supply position, and again performs an operation of sucking the component by the mounting head. It is configured in. With this configuration, even if there are no components at the component supply position and component suction cannot be performed, the suction operation can be performed again before the mounting head is moved in the horizontal direction, so that the mounting head can be moved in the horizontal direction. Time loss can be effectively suppressed.

In the component mounting device according to the above one aspect, preferably, the control unit is a component at the component supply position during the component suction operation by the mounting head based on images of the component supply position captured from a plurality of directions by the image pickup unit. It is configured to acquire the height position in the vertical direction and correct the suction height position in the vertical direction to control the suction of parts. With this configuration, a distance sensor or the like is placed above the component supply position to measure the height position of the component at the component supply position, and then the mounting head is moved above the component supply position to attract the component. Since it is possible to suppress the loss of time for moving the mounting head in the horizontal direction, it is possible to effectively suppress the lengthening of the component suction operation time.

In the component mounting device according to the above one aspect, preferably, the control unit is configured to control the image pickup unit to image the component supply position from a plurality of directions when the mounting head is lowered to the component supply position. ing. With this configuration, imaging can be performed in parallel while the mounting head is being lowered to attract the parts, so compared to the case where imaging and lowering of the mounting head are performed separately, component suction is possible. The operation time can be shortened.

In the component mounting device according to the above one aspect, the image pickup unit is preferably configured so that the component supply position can be imaged from a plurality of oblique directions with respect to the vertical direction. With this configuration, the image pickup unit can take an image of the component supply position with the mounting head placed above the component supply position, so that the component suction operation and the image pickup operation by the mounting head can be easily performed in parallel. Can be done. As a result, it is possible to effectively suppress the lengthening of the component suction operation time.

In the component mounting apparatus according to the above aspect, preferably, the imaging unit includes a plurality of cameras, or includes a single camera and an optical system that divides the field of view of the single camera. With this configuration, the component supply position can be easily imaged from a plurality of directions by the optical system that divides the field of view of the plurality of cameras or a single camera.

According to the present invention, as described above, it is possible to suppress the lengthening of the component suction operation time due to the movement of the measurement position for measuring the height position and the horizontal position of the component at the component supply position. It is possible to provide a component mounting device capable of the above.

It is a figure which showed the whole structure of the component mounting apparatus by embodiment of this invention. It is a side view at the time of component suction of the head unit of the component mounting apparatus according to the embodiment of the present invention. It is a figure for demonstrating the measurement of the component position of the component supply position in the component mounting apparatus by embodiment of this invention. It is a figure which showed the example of the height information of the component supply position of the component mounting apparatus according to the embodiment of the present invention. It is a flowchart for demonstrating the control process (1st operation example) at the time of suction operation of the component mounting apparatus by embodiment of this invention. It is a flowchart for demonstrating the control process (second operation example) at the time of suction operation of the component mounting apparatus by embodiment of this invention. It is a flowchart for demonstrating the control process (third operation example) at the time of suction operation of the component mounting apparatus by embodiment of this invention. It is a side view of the head unit of the component mounting apparatus according to the modification of embodiment of this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(Configuration of component mounting device)
With reference to FIG. 1, the configuration of the component mounting device 100 according to the embodiment of the present invention will be described.

As shown in FIG. 1, the component mounting device 100 is a component mounting device that conveys the substrate P in the X direction by a pair of conveyors 2 and mounts the component 31 on the substrate P at the mounting work position M.

The component mounting device 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, and an imaging unit 8. And a control unit 9. The image pickup unit 8 is an example of the "imaging unit" in the claims.

The pair of conveyors 2 are installed on the base 1 and are configured to convey the substrate P in the X direction. Further, the pair of conveyors 2 are provided with a holding mechanism for holding the substrate P being conveyed in a state of being stopped at the mounting work position M. Further, the pair of conveyors 2 are configured so that the distance in the Y direction can be adjusted according to the dimensions of the substrate P.

The component supply unit 3 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. Further, a plurality of tape feeders 3a are arranged in the component supply unit 3. The component supply unit 3 is configured to supply the component 31 to the mounting head 42 described later.

The tape feeder 3a holds a reel (not shown) on which a tape that holds a plurality of parts 31 at predetermined intervals is wound. The tape feeder 3a is configured to supply the component 31 from the tip of the tape feeder 3a by rotating the reel to send out the tape holding the component 31. Here, the component 31 includes electronic components such as ICs, transistors, capacitors and resistors.

The head unit 4 is arranged above the pair of conveyors 2 and the component supply unit 3, and includes a plurality of (five) mounting heads 42 having nozzles 41 (see FIG. 2) attached to the lower ends, and a board recognition camera. 43 and is included.

The mounting head 42 is configured to mount the component 31 on the substrate P. Specifically, the mounting head 42 is configured to suck the parts 31 supplied by the parts supply unit 3 and mount the sucked parts 31 on the substrate P arranged at the mounting work position M. There is. Further, the mounting head 42 is configured to be movable up and down (movable in the Z direction), and is supplied from the tape feeder 3a by the negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown). It is configured to attract and hold the component 31 and mount (mount) the component 31 at the mounting position on the substrate P.

The substrate recognition camera 43 is configured to image the fiction mark F of the substrate P in order to recognize the position and orientation of the substrate P. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component 31 on the substrate P.

The support portion 5 includes a motor 51. The support portion 5 is configured to move the head unit 4 in the X direction along the support portion 5 by driving the motor 51. Both ends of the support portion 5 are supported by a pair of rail portions 6.

The pair of rail portions 6 are fixed on the base 1. The rail portion 6 on the X1 side includes the motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. Since the head unit 4 can move in the X direction along the support portion 5 and the support portion 5 can move in the Y direction along the rail portion 6, the head unit 4 can move in the horizontal direction (XY direction). It is movable.

The component recognition image pickup unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition imaging unit 7 images the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31. It is configured to do. As a result, it is possible for the control unit 9 to acquire the suction state of the component 31 sucked by the nozzle 41 of the mounting head 42.

The image pickup unit 8 is provided in the head unit 4. As a result, the image pickup unit 8 is configured to move in the horizontal direction (XY direction) together with the head unit 4 by moving the head unit 4 in the XY direction. Further, the image pickup unit 8 is configured so that the component supply position 30 (see FIG. 2) of the component supply unit 3 can be imaged from a plurality of directions. Further, the image pickup unit 8 is configured to be able to capture an image for measuring the height of the mounting position of the substrate P. Further, as shown in FIG. 2, the image pickup unit 8 includes a plurality of cameras 81 and an illumination 82. As a result, the image pickup unit 8 can take an image of the component supply position 30 of the component supply unit 3 and the periphery of the component supply position 30 from a plurality of directions (angles).

As shown in FIG. 2, the image pickup unit 8 is configured so that the component supply position 30 can be imaged from a plurality of oblique directions with respect to the vertical direction (Z direction). Specifically, as shown in FIG. 3, the image pickup unit 8 is configured to take an image from tilt angles (θH and θL) in which the image pickup directions are different from each other with respect to the component surface Pb. Further, the cameras 81 of the image pickup unit 8 are arranged adjacent to each other in the vertical plane (in the YZ plane) including the component supply position 30 with respect to the component surface Pb. Further, the plurality of cameras 81 are arranged so as to be offset vertically.

The illumination 82 is configured to emit light when an image is taken by the camera 81. The illumination 82 is provided around the camera 81. The illumination 82 has a light source such as an LED (light emitting diode).

The control unit 9 includes a CPU, and mounts components such as a transfer operation of a substrate P by a pair of conveyors 2, a mounting operation by a head unit 4, an image pickup operation by a component recognition image pickup unit 7, an image pickup unit 8, and a substrate recognition camera 43. It is configured to control the overall operation of the device 100.

Here, in the present embodiment, the control unit 9 determines the position of the component 31 in the component supply position 30 in the horizontal direction (XY direction) and the position in the component supply position 30 based on the images of the component supply position 30 imaged from a plurality of directions by the image pickup unit 8. It is configured to acquire the height position in the vertical direction (Z direction). Further, the control unit 9 is configured to correct and acquire the position of the component 31 in the horizontal direction (XY direction) based on the height position of the component 31 in the vertical direction (Z direction) at the component supply position 30. ing.

Specifically, as shown in FIG. 3, the control unit 9 is configured to acquire the height position of the component surface Pb with respect to the reference surface Ps by stereo matching. That is, the height position and the horizontal position of the component 31 are acquired by matching the images of the component supply positions 30 captured substantially simultaneously by the plurality of cameras 81. For matching, a general matching method such as SSD (Sum of Squared Difference) or SAD (Sum of Absolute Difference) is used.

Specifically, one camera 81 images the target component 31 at a tilt angle θH, and the other camera 81 images the target component 31 at a tilt angle θL. That is, the target component 31 is imaged substantially simultaneously by the plurality of cameras 81. Then, the parallax p (pixel) between the two captured images is obtained by stereo-matching the captured image with the tilt angle θH and the captured image with the tilt angle θL. Here, assuming that the camera resolution of the camera 81 is R (μm / pixel), the distance A (μm) can be obtained by the equation (1).
A = p × R / sin (θH−θL) ・ ・ ・ (1)

Then, using the distance A obtained by the formula (1), the height position hp (μm) of the component surface Pb with respect to the reference surface Ps is obtained by the formula (2).
hp = A × sin (θL) ・ ・ ・ (2)

Further, using the distance A obtained by the formula (1), the distance B (μm) deviated from the horizontal position when the component 31 is present on the reference surface Ps is obtained by the formula (3).
B = A × cos (θL) ・ ・ ・ (3)
As a result, the vertical height position and the horizontal position of the component 31 at the component supply position 30 can be accurately obtained. It should be noted that an angle error occurs due to the deviation from the center of the field of view of the camera 81 depending on the height position and the position of the target component 31. The angle error is corrected by a table obtained in advance, calculation, or the like.

Further, the control unit 9 acquires the height around the component supply position 30 based on the images of the component supply position 30 imaged from a plurality of directions by the image pickup unit 8, and the component 31 to be sucked at the component supply position 30. It is configured to determine the presence or absence. Further, the control unit 9 controls to supply a new component 31 to the component supply position 30 when there is no component 31 to be sucked at the component supply position 30, and also performs an operation of sucking the component 31 by the mounting head 42. It is configured to do it again. Specifically, the control unit 9 controls the tape feeder 3a to feed the tape and supply a new component 31 to the component supply position 30. Further, the control unit 9 again performs the suction operation of the component 31 by the mounting head 42 in a state where the new component 31 is supplied to the component supply position 30.

As shown in (A) as in the example shown in FIG. 4, when the component 31 is located at the component supply position 30 (tape pocket), the position of the outer portion (tape upper surface) of the component supply position 30 and the position. The height difference becomes smaller from the position of the component supply position 30. On the other hand, as shown in (B), when the component 31 is not in the component supply position 30 (tape pocket), the position of the outer portion (tape upper surface) of the component supply position 30 and the position of the component supply position 30. Then, the height difference becomes large. For example, if the height difference is larger than a predetermined threshold value, the control unit 9 determines that the component 31 is not at the component supply position 30, and if the height difference is equal to or less than the predetermined threshold value, the component 31 is a component. It is determined that the supply position is 30. In this case, the predetermined threshold value is determined for each type of the component 31 based on the size of the component 31, the thickness in the height direction, and the like. The predetermined threshold value may be stored in the table or may be obtained by calculation based on the information of the component 31.

Further, the control unit 9 is in the vertical direction of the component 31 at the component supply position 30 during the suction operation of the component 31 by the mounting head 42 based on the images of the component supply position 30 imaged from a plurality of directions by the image pickup unit 8. It is configured to acquire the height position in the Z direction), correct the suction height position in the vertical direction, and control the suction of the component 31. Further, the control unit 9 is configured to control the image pickup unit 8 to image the component supply position 30 from a plurality of directions when the mounting head 42 is lowered to the component supply position 30.

(Control processing during adsorption operation)
Next, with reference to FIGS. 5 to 7, the control process during the component suction operation by the control unit 9 of the component mounting device 100 will be described with reference to the flowchart.

First, a first operation example will be described with reference to FIG. In step S1 of FIG. 5, the mounting head 42 (nozzle 41) is moved to the suction XY position. That is, the mounting head 42 is moved in the horizontal direction so as to be located above the component supply position 30.

In step S2, the mounting head 42 (nozzle 41) is lowered toward the component supply position 30. In step S3, the image pickup unit 8 takes an image of the component supply position 30 while the mounting head 42 (nozzle 41) is descending. That is, the image of the component 31 immediately before the suction of the component supply position 30 is captured.

In step S4, the height of the adsorption point is measured. Specifically, the height position of the component 31 in the component supply position 30 in the vertical direction (Z direction) is measured based on the images of the component supply position 30 captured from a plurality of directions by the image pickup unit 8.

In step S5, the center position of the component 31 is measured. Specifically, the center position of the component 31 at the component supply position 30 is measured based on the image of the component supply position 30 captured by the image pickup unit 8. In the case of a rectangular component, the center position of the component 31 is, for example, an intersection of diagonal lines. Further, for example, the center position of the component 31 is the geometric center of gravity position of the component 31.

In step S6, the XY position (horizontal position) of the component 31 is calculated. Specifically, the XY position of the component 31 is calculated based on the image of the component supply position 30 captured by the image pickup unit 8 and the height position of the component 31 measured in step S4. In step S7, the XY position of the component 31 of the component supply position 30 recognized by the control unit 9 is corrected. Then, the component 31 is sucked by the mounting head 42 (nozzle 41), and then the control process during the suction operation is terminated. The control process during the suction operation is performed for each suction operation of the component 31 by the mounting head 42 (nozzle 41).

Next, a second operation example will be described with reference to FIG. In step S11 of FIG. 6, the mounting head 42 (nozzle 41) is moved to the suction XY position. That is, the mounting head 42 is moved in the horizontal direction so as to be located above the component supply position 30.

In step S12, the mounting head 42 (nozzle 41) is lowered toward the component supply position 30. In step S13, the image pickup unit 8 takes an image of the component supply position 30 while the mounting head 42 (nozzle 41) is descending. That is, the image of the component 31 immediately before the suction of the component supply position 30 is captured.

In step S14, the height of the adsorption point is measured. Specifically, the height position of the component 31 in the component supply position 30 in the vertical direction (Z direction) is measured based on the images of the component supply position 30 captured from a plurality of directions by the image pickup unit 8.

In step S15, the center position of the component 31 is measured. Specifically, the center position of the component 31 at the component supply position 30 is measured based on the image of the component supply position 30 captured by the image pickup unit 8.

In step S16, the presence or absence of the component 31 is determined based on the height information of the target position. Specifically, the height around the component supply position 30 is acquired based on the images of the component supply position 30 captured from a plurality of directions by the image pickup unit 8. Then, based on the acquired height information around the component supply position 30, the presence or absence of the component 31 to be sucked at the component supply position 30 is determined.

In step S17, it is determined whether or not the component 31 is present at the component supply position 30. If the component 31 is located at the component supply position 30, the component 31 is attracted by the mounting head 42 (nozzle 41), and then the control process during the adsorption operation is terminated. If there is no component 31 at the component supply position 30, the process proceeds to step S18. In step S18, the re-adsorption process is performed. Specifically, the new component 31 is supplied to the component supply position 30, and the operation of sucking the component 31 by the mounting head 42 is performed again. After that, the control process during the suction operation is completed.

Next, a third operation example will be described with reference to FIG. 7. In step S21 of FIG. 7, the mounting head 42 (nozzle 41) is moved to the suction XY position. That is, the mounting head 42 is moved in the horizontal direction so as to be located above the component supply position 30.

In step S22, the mounting head 42 (nozzle 41) is lowered toward the component supply position 30. In step S23, the image pickup unit 8 takes an image of the component supply position 30 while the mounting head 42 (nozzle 41) is descending. That is, the image of the component 31 immediately before the suction of the component supply position 30 is captured.

In step S24, the height of the adsorption point is measured. Specifically, the height position of the component 31 in the component supply position 30 in the vertical direction (Z direction) is measured based on the images of the component supply position 30 captured from a plurality of directions by the image pickup unit 8.

In step S25, the target height position is updated. Specifically, the height position of the component 31 of the component supply position 30 recognized by the control unit 9 in the vertical direction (Z direction) is updated. In this case, for example, the updated height position information is used for adsorption of the component 31 immediately after. Further, for example, the updated height position information is measured for each adsorption, calculated by a simple average or a moving average, and used for the next and subsequent adsorptions.

In step S26, the component 31 is attracted by the mounting head 42 (nozzle 41). After that, the control process during the suction operation is completed. The height position of the component 31 may be measured for each adsorption or may be measured periodically.

(Effect of embodiment)
In this embodiment, the following effects can be obtained.

In the present embodiment, as described above, the horizontal (XY direction) position and the vertical direction (XY direction) of the component 31 at the component supply position 30 are based on the images of the component supply position 30 captured from a plurality of directions by the image pickup unit 8. A control unit 9 for acquiring a height position (in the Z direction) is provided. As a result, it is possible to take an image without moving the head unit 4 in the horizontal direction in order to acquire the height position and the horizontal position of the component supply position 30, so that it takes a long time to take an image of the component supply position 30. Can be suppressed. As a result, it is possible to suppress a long time for the component suction operation due to the movement of the measurement position for measuring the height position and the horizontal position of the component 31 at the component supply position 30. Further, since the horizontal position and the vertical height position of the component 31 at the component supply position 30 can be acquired based on the common imaging result, the height position and the horizontal position of the component supply position 30 can be obtained. It is possible to suppress the lengthening of the component suction operation time as compared with the case of measuring separately.

Further, in the present embodiment, as described above, the control unit 9 is positioned in the horizontal direction (XY direction) of the component 31 based on the height position of the component 31 in the vertical direction (Z direction) at the component supply position 30. Is configured to be corrected and acquired. As a result, when the component supply position 30 is photographed from an oblique direction, even if the vertical height position of the component 31 at the component supply position 30 deviates from the reference position, the horizontal position is corrected and acquired. Therefore, the horizontal position of the component 31 can be accurately obtained.

Further, in the present embodiment, as described above, the control unit 9 acquires the height around the component supply position 30 based on the images of the component supply position 30 imaged from a plurality of directions by the image pickup unit 8 to acquire the component. It is configured to determine the presence or absence of the component 31 to be sucked at the supply position 30. As a result, the presence or absence of the component 31 can be determined based on the height around the component supply position 30, so that the presence or absence of the component 31 can be determined by performing image analysis using an image density threshold value or the like. Unlike this, the presence or absence of the component 31 can be determined without depending on the imaging conditions such as brightness. As a result, the presence or absence of the component 31 can be accurately determined. Further, by determining the presence / absence of the component 31 at the component supply position 30, if the component 31 is not present, the component 31 cannot be adsorbed before taking an image to confirm the position and posture of the adsorbed component 31. Can be recognized, so that the time until the component 31 is adsorbed can be shortened. As a result, it is possible to effectively suppress the lengthening of the component suction operation time. Such an effect is particularly effective when sucking a very small part, which is difficult to determine whether or not the part 31 is sucked due to a change in the negative pressure of air for sucking the part of the mounting head 42.

Further, in the present embodiment, as described above, the control unit 9 controls to supply a new component 31 to the component supply position 30 and mounts the control unit 9 when there is no component 31 to be attracted to the component supply position 30. The operation of sucking the component 31 by the head 42 is configured to be performed again. As a result, even if there is no component 31 at the component supply position 30 and component suction cannot be performed, the suction operation can be performed again before the mounting head 42 is moved in the horizontal direction, so that the mounting head 42 is moved in the horizontal direction. Time loss can be effectively suppressed.

Further, in the present embodiment, as described above, the control unit 9 is subjected to the suction operation of the component 31 by the mounting head 42 based on the images of the component supply positions 30 imaged from a plurality of directions by the image pickup unit 8. The height position of the component 31 in the vertical direction (Z direction) at the supply position 30 is acquired, the suction height position in the vertical direction is corrected, and the component 31 is controlled to be sucked. As a result, a distance sensor or the like is placed above the component supply position 30 to measure the height position of the component 31 at the component supply position 30, and then the mounting head 42 is moved above the component supply position 30 to move the component 31. Since it is possible to suppress the loss of time for moving the mounting head 42 in the horizontal direction (XY direction) as compared with the case of sucking Can be done.

Further, in the present embodiment, as described above, the control unit 9 controls the image pickup unit 8 to image the component supply position 30 from a plurality of directions when the mounting head 42 is lowered to the component supply position 30. It is configured as follows. As a result, imaging can be performed in parallel while the mounting head 42 is lowered to suck the component 31, so that the component suction operation is performed as compared with the case where the imaging and the lowering of the mounting head 42 are performed separately. Time can be shortened.

Further, in the present embodiment, as described above, the image pickup unit 8 is configured so that the component supply position 30 can be imaged from a plurality of oblique directions with respect to the vertical direction (Z direction). As a result, the image pickup unit 8 can take an image of the component supply position 30 in a state where the mounting head 42 is arranged above the component supply position 30, so that the component adsorption operation and the image pickup operation by the mounting head 42 can be easily performed. Can be done in parallel. As a result, it is possible to effectively suppress the lengthening of the component suction operation time.

Further, in the present embodiment, as described above, the image pickup unit 8 is provided with a plurality of cameras 81. As a result, the component supply position 30 can be easily imaged from a plurality of directions by the plurality of cameras 81.

(Modification example)
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims.

For example, in the above embodiment, an example of a configuration in which the image pickup unit includes a plurality of cameras and the component supply position can be imaged from a plurality of directions is shown, but the present invention is not limited to this. In the present invention, as in the modified example shown in FIG. 8, the image pickup unit 8a may include a camera 81a, an illumination 82, and an optical system 83. In this case, the optical system 83 including the lens and the mirror may divide the field of view of the single camera 81a so that the component supply position can be imaged from a plurality of directions. The image pickup unit 8a is an example of the "imaging unit" in the claims.

Further, by taking an image while moving one camera, the component supply position may be imaged from a plurality of directions.

Further, in the above embodiment, an example of a configuration in which the horizontal position and the vertical height position of the component are acquired by matching and analyzing the images of the component supply positions captured from a plurality of directions is shown. , The present invention is not limited to this. In the present invention, the horizontal position and the vertical height position of the component may be acquired by analyzing the image of the component supply position captured from a plurality of directions by an analysis other than matching.

Further, in the above embodiment, an example of the configuration in which the component supply position is imaged by the image pickup unit while the mounting head is lowered is shown, but the present invention is not limited to this. In the present invention, the component supply position may be imaged by the image pickup unit before the mounting head is lowered.

Further, in the above embodiment, an example of a configuration in which the horizontal position of the component supply position is acquired during the component suction operation by the mounting head and the horizontal suction position is corrected from the next time onward is shown. Not limited to this. In the present invention, the horizontal position of the component supply position may be acquired during the suction operation, and the suction position in the horizontal direction may be corrected and sucked based on the acquired position.

Further, in the above embodiment, an example of the configuration in which the parts held by the tape are supplied to the parts supply position is shown, but the present invention is not limited to this. In the present invention, the parts placed on the tray or the like may be supplied to the parts supply position.

Further, in the above embodiment, for convenience of explanation, the processing of the control unit has been described using a flow-driven flow in which the processing is sequentially performed along the processing flow, but the present invention is not limited to this. In the present invention, the processing of the control unit may be performed by an event-driven type (event-driven type) processing in which the processing is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

3 Parts supply unit 4 Head unit 8, 8a Imaging unit (imaging unit)
9 Control unit 30 Parts supply position 31 Parts 42 Mounting head 81 Camera 81a Camera 83 Optical system 100 Parts mounting device P board

Claims (8)

A head unit that includes a mounting head that mounts components on the board,
A component supply unit that supplies components to the mounting head,
An image pickup unit provided on the head unit and capable of imaging the component supply position of the component supply unit from a plurality of directions.
A control unit for acquiring a horizontal position and a vertical height position of a component at the component supply position based on an image of the component supply position captured from a plurality of directions by the image pickup unit is provided.
The control unit is configured to correct the suction height position in the vertical direction and perform control to suck the component based on the acquired height position of the component in the vertical direction at the component supply position.
The control unit is configured to update the reference height position based on the result of acquiring the vertical height position of the component at the component supply position in a plurality of components . The component mounting device according to claim 1, wherein the control unit is configured to correct and acquire the horizontal position of the component based on the vertical height position of the component at the component supply position. .. The control unit acquires the height around the component supply position based on images of the component supply position captured from a plurality of directions by the image pickup unit, and determines whether or not there is a component to be sucked at the component supply position. The component mounting device according to claim 1 or 2, which is configured to be the same. The control unit is configured to control to supply a new component to the component supply position when there is no component to be sucked at the component supply position, and to perform an operation of sucking the component again by the mounting head. The component mounting device according to claim 3. Based on the images of the component supply positions captured from a plurality of directions by the image pickup unit, the control unit determines the height position of the component in the component supply position in the vertical direction during the component suction operation by the mounting head. The component mounting device according to any one of claims 1 to 4, which is configured to acquire and correct the suction height position in the vertical direction to control the suction of components. The control unit is configured to control the image pickup unit to image the component supply position from a plurality of directions when the mounting head is lowered to the component supply position. The component mounting device according to any one of the above items. The component mounting device according to any one of claims 1 to 6, wherein the imaging unit is configured to be capable of imaging the component supply position from a plurality of oblique directions with respect to the vertical direction. The component according to any one of claims 1 to 7, wherein the imaging unit includes a plurality of cameras, or includes a single camera and an optical system that divides the field of view of the single camera. Mounting device.

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