JP7099484B2 - Image sensor and image sensor - Google Patents

Description

The present invention relates to an image pickup unit, a method for manufacturing the image pickup unit, and an image pickup apparatus using the image pickup unit.

A conventional packageless solid-state image sensor generally includes a silicon chip having an image pickup region and a glass plate bonded to the silicon chip so as to cover the image pickup region. As an example of such a conventional solid-state image sensor, FIG. 4 (E) of Patent Document 1 below discloses a solid-state image sensor having a so-called COG (Chip on glass) structure.

Japanese Unexamined Patent Publication No. 11-121653

When the solid-state image sensor as described above is installed in an image pickup device such as an electronic camera, if the glass plate is directly received by a hard support member, the glass plate may be broken at the time of impact such as dropping.

The present invention has been made in view of such circumstances, and is an imaging unit in which a translucent plate such as a glass plate is not easily damaged by an impact such as dropping, a manufacturing method thereof, and an imaging device using the imaging unit. The purpose is to provide.

The following aspects are presented as means for solving the above problems. In the imaging unit according to the first aspect, a semiconductor chip having an imaging region, a first translucent plate bonded to the semiconductor chip so as to cover the imaging region, and the first translucent plate are predetermined. It is adhered with a soft adhesive to support the first translucent plate, and is locally opposed to the rear surface or the front surface of the first translucent plate with a predetermined gap. It is provided with a support member having a plurality of air cushion effect generating protrusions having a surface.

In the present specification, regarding the front and back, the subject side in the optical axis direction is referred to as the front, and the opposite side thereof is referred to as the rear.

In the first aspect, the imaging unit according to the second aspect has a predetermined gap of 5 μm or less. The predetermined gap is particularly preferably 1 μm or more and 2 μm or less.

In the image pickup unit according to the third aspect, in the first or second aspect, the position of the center of gravity of the position of the plurality of air cushion effect generating convex portions viewed from the optical axis direction is the first position viewed from the optical axis direction. The plurality of convex portions for generating an air cushion effect are arranged so as to substantially coincide with the position of the center of gravity of the translucent plate.

In the image pickup unit according to the fourth aspect, in any one of the first to third aspects, the support member has an opening in a region including a region corresponding to the image pickup region, and the opening in the support member. The portions on both sides of the first direction with respect to the portion and the portions on both sides of the first translucent plate in the first direction overlap each other when viewed from the optical axis direction, and are used for generating the plurality of air cushion effects. The convex portions are arranged on both sides of the support member.

In the image pickup unit according to the fifth aspect, in the fourth aspect, the facing surface of the plurality of air cushion effect generating protrusions has the predetermined gap with respect to the rear surface of the first translucent plate. A wiring pattern that is locally opposed and electrically connected to the semiconductor chip is formed on the first translucent plate, and is electrically connected to the wiring pattern of the first translucent plate. The first and second flexible printed substrates are provided, and the first and second flexible printed substrates are both sides of the first translucent plate in a second direction orthogonal to the first direction. The light is guided backward through the openings on both sides of the second direction with respect to the first translucent plate in the opening.

In any one of the first to fifth aspects, the imaging unit according to the sixth aspect is arranged on the front side of the first translucent plate at a distance from the first translucent plate. A frame-shaped rubber member that seals the space between the translucent plate 2 and the first translucent plate and the second translucent plate, the second translucent plate, and the translucent plate. It is provided with a frame-shaped pressing member that urges the rubber member rearward.

The method for manufacturing an image pickup unit according to a seventh aspect is a method for manufacturing an image pickup unit according to any one of the first to sixth aspects, and is a method for manufacturing the image pickup unit according to any one of the first to sixth aspects, with the facing surface of the plurality of convex portions for generating an air cushion effect. A step of adhering the first translucent plate and the support member with the adhesive while holding the gap between the rear surface or the front surface of the first translucent plate in the predetermined gap. It is prepared.

The image pickup apparatus according to the eighth aspect includes the image pickup unit according to any one of the first to sixth aspects.

According to the present invention, it is possible to provide an image pickup unit in which a translucent plate such as a glass plate is not easily damaged at the time of impact such as dropping, a method for manufacturing the image pickup unit, and an image pickup apparatus using the image pickup unit.

It is schematic sectional drawing which shows typically the electronic camera by 1st Embodiment of this invention. It is a schematic plan view which shows a part of the image pickup unit in FIG. 1 schematically. It is a schematic cross-sectional view schematically showing the image pickup unit in FIG. 1, which corresponds to the cross section along the line Y1-Y2 in FIG. It is a schematic cross-sectional view schematically showing the image pickup unit in FIG. 1, which corresponds to the cross section along the line Y3-Y4 in FIG. It is a schematic cross-sectional view schematically showing the image pickup unit in FIG. 1, which corresponds to the cross section along the line X1-X2 in FIG. FIG. 3 is a schematic cross-sectional view schematically showing one step of a method for manufacturing an image pickup unit in FIG. 1. It is a schematic plan view which shows a part of the image pickup unit of the electronic camera according to the 2nd Embodiment of this invention schematically. FIG. 6 is a schematic cross-sectional view schematically showing an image pickup unit of an electronic camera according to a second embodiment of the present invention, which corresponds to a cross section along the Y5-Y6 line in FIG. 7. FIG. 5 is a schematic cross-sectional view schematically showing an image pickup unit of an electronic camera according to a second embodiment of the present invention, which corresponds to a cross section along the Y7-Y8 line in FIG. 7. FIG. 6 is a schematic cross-sectional view schematically showing an image pickup unit of an electronic camera according to a second embodiment of the present invention, which corresponds to a cross section along X3-X4 line in FIG. 7.

Hereinafter, the image pickup unit according to the present invention, the manufacturing method thereof, and the image pickup apparatus will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view schematically showing an electronic camera 1 as an image pickup apparatus according to the first embodiment of the present invention. As shown in FIG. 1, X-axis, Y-axis, and Z-axis that are orthogonal to each other are defined. Of the X-axis directions, the direction of the arrow is called the + X direction or the + X side, and the opposite direction is called the −X direction or the −X side, and the same applies to the Y-axis direction and the Z-axis direction. The Z-axis coincides with the direction of the optical axis O of the photographing lens 3 of the electronic camera 1, the X-axis coincides with the left-right direction (horizontal direction) of the electronic camera 1, and the Y-axis coincides with the vertical direction (vertical direction) of the electronic camera 1. Is consistent with. The -Z side is called the front side on the subject side, and the + Z side is called the rear side. These points are the same for the figures described later.

The electronic camera 1 according to the present embodiment is configured as a single-lens reflex digital camera, but the imaging device according to the present invention is not limited to this, and other electronic cameras such as mirrorless cameras and compact cameras, and mobile phones. It can be applied to various image pickup devices such as an electronic camera mounted on the camera and an electronic camera such as a video camera that captures a moving image.

The electronic camera 1 according to the present embodiment includes a camera body 2 and a photographing lens 3 interchangeably held by the camera body 2. In FIG. 1, the photographing lens 3 is shown by an imaginary line.

The camera body 2 includes a lens mount (body-side mount) 11 that holds the photographing lens 3 interchangeably, a mount base 12 to which the lens mount 11 is attached, and an outer housing 13 that houses these and parts described later. And have. The mount base 12 has a central opening 12a along the optical axis O, and a lens mount 11 is attached to the front side thereof. Further, the camera body 2 has a quick return mirror 14, a focal plane shutter 15, and an image pickup unit 16 as members arranged along the optical axis O in the central opening 12a of the mount base 12. Further, the camera body 2 has a focusing screen 17, a pentaprism 18, and an eyepiece 19 as members fixedly supported on the upper side of the mount base 12 and constituting the finder device. A finder observation window 20 is provided at a position of the outer housing 13 facing the eyepiece 19.

The subject light that has passed through the photographing lens 3 is reflected upward by the quick return mirror 14 and is imaged on the focusing screen 17. The subject image formed on the focusing screen 17 is observed from the pentaprism 18 through the eyepiece 19 through the finder observation window 20. When the release button (not shown) is fully pressed, the quick return mirror 14 jumps upward, and the subject image from the photographing lens 3 is incident on the image pickup unit 16.

A liquid crystal display device 21 is provided on the back surface of the outer housing 13 of the camera body 2. A circuit board 22 on which a predetermined circuit (for example, a circuit for controlling an image sensor mounted on a semiconductor chip 31) is mounted between the image pickup unit 16 and the liquid crystal display device 21 is supported by a member (not shown). Have been placed.

FIG. 2 is a schematic plan view schematically showing a part of the image pickup unit 16 in FIG. 1 (semiconductor chip 31, glass substrate 32, support member 33, and first and second flexible printed substrates 34, 35). .. FIG. 3 is a schematic cross-sectional view schematically showing the image pickup unit 16 in FIG. 1, which corresponds to a cross section along the Y1-Y2 line in FIG. FIG. 4 is a schematic cross-sectional view schematically showing the image pickup unit 16 in FIG. 1, which corresponds to the cross section along the line Y3-Y4 in FIG. For ease of understanding, FIGS. 3 and 4 also show the selvagement 33c on the −X side and + Y side of the support member 33 that does not appear in the cross section. FIG. 5 is a schematic cross-sectional view schematically showing the image pickup unit 16 in FIG. 1, which corresponds to the cross section along the line X1-X2 in FIG.

In the present embodiment, the image pickup unit 16 includes a semiconductor chip 31 having an image pickup region (light receiving region) 31a on the front surface (the surface on the −Z side), and a glass substrate 32 as a first translucent plate. It has a so-called COG (Chip on glass) structure. Further, the image pickup unit 16 includes a plate-shaped support member (bracket) 33 to which the glass substrate 32 is adhered with an adhesive 51 having a predetermined softness to support the glass substrate 32, and first and second flexible printed circuit boards. It includes 34, 35, an optical low-pass filter 36 as a second translucent plate, a frame-shaped rubber member 37, and a frame-shaped pressing member 38.

In the present embodiment, the semiconductor chip 31 is an image sensor such as a CMOS or a CCD configured as a chip, and a plurality of pixels (not shown) are arranged two-dimensionally in the imaging region 31a. The semiconductor chip 31 photoelectrically converts the incident light incident on the imaging region 31a via the glass substrate 32 and outputs an image signal. The semiconductor chip 31 may be equipped with, for example, a readout circuit (not shown) that drives the pixels to read out an image signal, or a processing circuit (for example, an AD conversion circuit) that processes an output signal.

The glass substrate 32 is arranged on the −Z side of the semiconductor chip 31 so as to cover the image pickup region 31a on the −Z side of the semiconductor chip 31, and is bonded to the semiconductor chip 31 by the bump 39 and the adhesive 40. The space between the semiconductor chip 31 and the glass substrate 32 is kept airtight by the adhesive 40. The glass substrate 32 protrudes from the semiconductor chip 31 to the periphery in a plan view seen from the + Z side in the −Z direction. Electrode pads (not shown) are formed on the + X side and the −X side on the front surface (the surface on the −Z side) of the semiconductor chip 31, and the internal connection electrode pads 41a are formed on the rear surface (the surface on the + Z side) of the glass substrate 32. It is formed and is joined by bumps 39 between them. External connection electrode pads 41b are formed on the rear surface of the glass substrate 32 so as to protrude from the semiconductor chip 31 to the + X side and the −X side. Further, a wiring pattern 41c connecting the electrode pads 41a and 41b is formed on the rear surface of the glass substrate 32. The conductor pattern constituting the electrode pads 41a and 41b and the wiring pattern 41c can be formed, for example, by vapor deposition or printing on the glass substrate 32. As the first translucent plate, another translucent plate such as an optical low-pass filter may be used instead of the glass substrate 32.

In the present embodiment, the support member 33 is configured in the shape of a rectangular frame plate and has an opening 33a. As the material of the support member 33, for example, any material such as metal can be used, but it is preferable to use a material having high rigidity and a coefficient of linear expansion as small as possible, such as aluminum and stainless steel.

The support member 33 has three selvages 33c with mounting holes 33b. One selvage 33c is arranged so as to project to the + Y side on the −X side, the other selvage 33c is arranged to project to the + Y side on the + X side, and the remaining one selvage 33c is arranged to project to the + X side. It is arranged so as to protrude toward the -Y side. The mount base 12 has an image pickup unit mounting portion 12b protruding rearward (+ Z side) at a position corresponding to each selvage portion 33c on the rear surface side. After the support member 33 is positioned or the like, the screw 42 (see FIG. 1) is screwed into the screw hole (not shown) of the corresponding mounting portion 12b of the corresponding imaging unit by inserting the mounting hole 33b of each selvage portion 33c. It is attached to the image pickup unit mounting portion 12b of the mount base 12 by the above means.

The support member 33 has a plurality of convex portions 33d for generating an air cushion effect having facing surfaces that locally face each other with a predetermined gap G in the −Z direction with respect to the rear surface (the surface on the + Z side) of the glass substrate 32. , Is provided. In the present embodiment, the number of the convex portions 33d for generating the air cushion effect is four, one convex portion 33d is arranged on the + Y side and the + X side with respect to the opening 33a, and the other convex portion 33d is the opening. The other convex portion 33d is arranged on the + Y side and the + X side with respect to the opening 33a, and the remaining one convex portion 33d is arranged on the -Y side and the -Y side with respect to the opening 33a. Moreover, the positions of the centers of gravity of the positions of the four convex portions 33d arranged on the −X side substantially coincide with the positions of the centers of gravity of the glass substrate 32 viewed from the direction of the optical axis O (Z-axis direction). This is preferable because the air cushion effect generated by the four air cushion effect generating convex portions 33d acts on the glass substrate 32 in a well-balanced manner at the time of impact such as dropping.

The number and arrangement of the convex portions 33d for generating the air cushion effect are not limited to the above-mentioned examples, but the number is set to 3 or more, and the position of the center of gravity of the positions of the convex portions 33d is in the direction of the optical axis O (Z). It is preferable that the position of the center of gravity of the glass substrate 32 as seen from the axial direction) is substantially the same.

The gap G is preferably an amount or less, for example, 5 μm or less so that the influence on the focus at the time of photographing is not so problematic even if the semiconductor chip 31 moves in the Z-axis direction by that distance. It is more preferable that the gap G is 2 μm or less. Further, if the gap G is too narrow, inconvenience will occur, so it is preferable that the gap G is, for example, 1 μm or more.

Further, the degree of mitigation of the impact at the time of impact such as dropping is the total of the facing surfaces of all the convex portions 33d for generating the air cushion effect (in the present embodiment, the four convex portions 33d for generating the air cushion effect). Since the ratio of the gap G to the area is relevant, the ratio is appropriately determined according to the desired degree of relaxation.

In the present embodiment, the + Y side portion of the support member 33 with respect to the opening 33a (particularly, the portion close to the opening 33a) and the + Y side portion of the glass substrate 32 (particularly, the portion protruding from the semiconductor chip 31 to the + Y side). And overlap in the Z-axis direction. Similarly, the −Y side portion of the support member 33 with respect to the opening 33a (particularly, the portion close to the opening 33a) and the —Y side portion of the glass substrate 32 (particularly, the portion protruding from the semiconductor chip 31 to the −Y side). And overlap in the Z-axis direction. In the present embodiment, the position of the front surface (the surface on the −Z side) of the support member 33 near the overlapping portion with the glass substrate 32 in the Z-axis direction is one step lower in the + Z direction than the other portions. This is preferable because the thickness of the image pickup unit 16 as a whole in the Z-axis direction can be made thinner. However, in the present invention, it is not always necessary to lower the vicinity of the overlapping portion of the support member 33 with the glass substrate 32 by one step.

In the present embodiment, the four convex portions 33d for generating the air cushion effect are provided on the surface of the support member 33 on the −Z side of the overlapping portion with the glass substrate 32 so as to slightly protrude from the periphery in the −Z direction. ing.

In the present embodiment, three through holes 33e for receiving the adhesive 51 are formed in the overlapping portion of the support member 33 with the glass substrate 32. The adhesive 51 exists in each through hole 33e and projects from the through hole 33e in the −Z direction to reach the rear surface (+ Z side surface) of the glass substrate 32 so as to be between the support member 33 and the glass substrate 32. It is provided so as to adhere. One through hole 33e is arranged on the + Y side and + X side with respect to the opening 33a, another through hole 33e is arranged on the + Y side and −X side with respect to the opening 33a, and the remaining one through hole 33e is an opening. It is arranged on the −Y side with respect to the portion 33a and in the center in the X-axis direction. As a result, the adhesive 51 of the three through holes 33e is arranged so as to form a wide-area triangle, and the glass substrate 32 is supported by the support member 33 in a well-balanced manner via the adhesive 51 of the three through holes 33e. It has become so. However, the number of places where the adhesive 51 is provided and the arrangement of the adhesive 51 are not limited to such numbers and arrangements, and the structure for providing the adhesive 51 is not limited to the structure using the through hole 33e.

The adhesive 51 causes the glass substrate 32 to move instantaneously with respect to the support member 33 when the glass substrate 32 receives an impact force in the + Z direction relative to the support member 33 due to dropping or the like. While the glass substrate 32 is elastically deformed, in a normal state where the glass substrate 32 is not subjected to an impact force, the glass substrate 32 does not move relative to the support member 33 due to the weight of the glass substrate 32 and the semiconductor chip 31, and the semiconductor chip does not move. It has a predetermined softness to the extent that it hardly elastically deforms so as to maintain the desired position accuracy of 31. As the adhesive 51, for example, an acrylic adhesive can be mentioned.

As described above, the external connection electrode pad 41b is formed on the rear surface of the glass substrate 32 so as to protrude from the semiconductor chip 31 to the + X side and the −X side. A first flexible printed substrate 34 is joined to the external connection electrode pad 41b on the X side by a bump 61. A second flexible printed substrate 35 is joined to the external connection electrode pad 41b on the + X side by a bump 62.

The + X side portion and the −X side portion of the opening portion 33a of the support member 33 are the opening portions as they are without the glass substrates 32 overlapping. The first and second flexible printed circuit boards 34 and 35 are guided backward from both side portions in the X-axis direction of the glass substrate 32 through the openings on both sides in the X-axis direction with respect to the glass substrate 32 in the opening 33a. It is connected to the circuit board 22. In this way, the semiconductor chip 31 and the circuit board 22 are electrically connected via the first and second flexible printed circuit boards 34 and 35. Since the first and second flexible printed substrates 34 and 35 are guided backward by using the opening portion on the + X side and the opening portion on the −X side in the opening 33a, it is not necessary to route them unnecessarily and the length is shortened. Can be done.

In the present embodiment, the optical low-pass filter 36 is used as the second translucent plate, but another translucent plate such as an IR cut filter may be used. The optical low-pass filter 36 is arranged on the front side of the glass substrate 32 at a distance from the glass substrate 32. The frame-shaped rubber member 37 seals the space between the glass substrate 32 and the optical low-pass filter 36. The frame-shaped pressing member 38 is fixed to the support member 33, and holds the optical low-pass filter 36, the rubber member 37, and the glass substrate 32 by urging them backward and pressing them.

FIG. 6 is a schematic cross-sectional view schematically showing one step (a step of adhering the glass substrate 32 and the support member 33 with the adhesive 51) of the manufacturing method of the image pickup unit 16 in the present embodiment. It corresponds. In FIG. 6, the same or corresponding elements as the elements in FIG. 4 are designated by the same reference numerals, and the overlapping description thereof will be omitted.

When the image pickup unit 16 according to the present embodiment is manufactured, the gap between the facing surface of each air cushion effect generating convex portion 33d and the rear surface (+ Z side surface) of the glass substrate 32 is the predetermined gap G. The bonding step of bonding the glass substrate 32 and the support member 33 with the adhesive 51 is performed while the glass substrate 32 is held in the same state.

At this time, for example, as shown in FIG. 6, a tool 81 is used. In FIG. 6, the tool 81 is shown by a dotted line. The tool 81 includes a substrate 82 and two rail-shaped portions 83 provided on the + Y side and the −Y side on the −Z side surface of the substrate 82 and extending in the X-axis direction. Each rail-shaped portion 83 has a contact surface 83a that abuts on the + Z side surface of the support member 33, and a contact surface 83b that abuts on the + Z side surface of the glass substrate 32. When the + Z side surface of the support member 33 is abutted against the abutting surface 83a and the + Z side surface of the glass substrate 32 is abutted against the abutting surface 83b, the convex portion 33d for generating the air cushion effect of the support member 33 The difference in height between the contact surface 83a and the contact surface 83b in the Z-axis direction is such that the gap between the facing surface and the rear surface (+ Z side surface) of the glass substrate 32 is the predetermined gap G. It is set.

In the bonding step, a force in the + Z direction indicated by an arrow in FIG. 6 is applied to the glass substrate 32 and the support member 33 to abutt the + Z side surface of the support member 33 against the contact surface 83a and to the contact surface 83b. By abutting the + Z side surface of the glass substrate 32, the gap between the facing surface of the convex portion 33d for generating the air cushion effect and the rear surface (+ Z side surface) of the glass substrate 32 is held in the predetermined gap G. It is in the state of being. In this state, the glass substrate 32 and the support member 33 are adhered to each other by the adhesive 51 by injecting the adhesive 51 from each through hole 33e (see FIG. 3) of the support member 33 and curing the adhesive 51.

According to the present embodiment, since the glass substrate 32 and the support member 33 are adhered to each other by the adhesive 51 having the predetermined softness, the glass substrate 32 has a + Z direction component at the time of impact such as dropping. When an impact force is applied, the glass substrate 32 momentarily moves in the + Z direction due to the impact force. Then, since the facing surface of the convex portion 33d for generating the air cushion effect of the support member 33 faces the glass substrate 32 with a predetermined gap G, the air cushion effect is generated between them according to the principle of air viscosity. At this time, it is preferable that the viscous resistance frictional force of air is larger than the elastic force of the adhesive 51.

Therefore, according to the present embodiment, it is possible to avoid a collision of the glass substrate 32 with the support member 33 at the time of an impact such as dropping, and the glass substrate 32 is less likely to be damaged.

Further, since the glass substrate 32 and the support member 33 are adhered to each other by the adhesive 51 having the predetermined softness, the adhesive 51 stresses the impact force of the glass substrate 32 in a direction other than the + Z direction. In addition to absorbing it, the adhesive 51 can also absorb the deformation stress due to the difference in the linear expansion coefficient due to the heat of the glass substrate 32 and the support member 33.

[Second Embodiment]
FIG. 7 is a schematic plan view schematically showing a part of the image pickup unit 91 of the electronic camera according to the second embodiment of the present invention, and corresponds to FIG. 2. In FIG. 7, the sealing material 92 is not shown. FIG. 8 is a schematic cross-sectional view schematically showing the image pickup unit 91, which corresponds to the cross section along the line Y5-Y6 in FIG. 7, and corresponds to FIG. 9 is a schematic cross-sectional view schematically showing the image pickup unit 91, which corresponds to the cross section along the line Y7-Y8 in FIG. 7, and corresponds to FIG. 4. FIG. 10 is a schematic cross-sectional view schematically showing the image pickup unit 91, which corresponds to the cross section along the line X3-X4 in FIG. 7, and corresponds to FIG. 5.

In FIGS. 7 to 10, the same or corresponding elements as the elements in FIGS. 2 to 5 are designated by the same reference numerals, and the overlapping description thereof will be omitted. The difference between the present embodiment and the first embodiment is described below.

In the present embodiment, the + Z side and the −Z side of the support member 33 in the first embodiment are inverted, and the front surface (—Z side surface) of the glass substrate 32 is attached to the support member 33 with the adhesive 51. It is glued.

In the present embodiment, the width of the opening 33a in the Z-axis direction is narrowed as compared with the case of the first embodiment, and the + Y side portion and the −Y side portion of the support member 33 with respect to the opening 33a are glass substrates. Not only the + Y side portion and the −Y side portion of the 32 overlap in the Z axis direction, but also the + X side portion and the −X side portion with respect to the opening 33a in the support member 33 are the + X side portion and the −X side of the glass substrate 32. Each side portion overlaps in the Z-axis direction. In the present embodiment, with respect to all the overlapping portions of the support member 33 with the glass substrate 32, the positions of the rear surface (the surface on the + Z side) near the overlapping portions in the Z-axis direction are in the −Z direction as compared with the other portions. It is one step lower.

Further, in the present embodiment, a sealing material 92 for sealing between the glass substrate 32 and the support member 33 is provided over the entire circumference of the glass substrate 32. In the present embodiment, the space between the glass substrate 32 and the optical low-pass filter 36 is sealed by the rubber member 37 and the sealing material 92. As the sealing material 92, an adhesive having a higher softness than the adhesive 51 is used, but an oil seal or the like may be used.

The present embodiment also has the same advantages as the first embodiment.

Although each embodiment of the present invention has been described above, the present invention is not limited to these embodiments.

For example, when the support member 33 is arranged on the rear side (+ Z side) with respect to the glass substrate 32, the support member 33 does not necessarily have to be provided with the opening 33a.

1 Electronic camera 3 Shooting lens 11 Lens mount 12 Mount base 16,91 Imaging unit 31 Semiconductor chip 31a Imaging area 32 Glass substrate (first translucent plate)
33 Support member 33a Opening 33d Convex part for generating air cushion effect 51 Adhesive

Claims (9)

The first translucent plate on which wiring is formed and transmits light,
A semiconductor substrate having a light receiving region for receiving light transmitted through the first translucent plate and bonded to the first translucent plate by a joint portion.
A member for supporting the first translucent plate and
A plurality of convex portions provided on a part of the member and facing the first translucent plate at intervals from the first translucent plate.
An image sensor comprising. The image pickup device according to claim 1, wherein the convex portion has a surface facing the first translucent plate at a distance from the first translucent plate. The image pickup device according to claim 1 or 2, wherein the position of the center of gravity of the plurality of convex portions substantially coincides with the position of the center of gravity of the first translucent plate. The image pickup device according to any one of claims 1 to 3, wherein the convex portion is a member for generating an air cushion effect. The image pickup device according to any one of claims 1 to 4, wherein the first translucent plate and the semiconductor substrate are sealed by the joint portion. Equipped with a circuit board
The image pickup device according to any one of claims 1 to 5, wherein the wiring electrically connects the semiconductor substrate and the circuit board. The image pickup device according to any one of claims 1 to 6, wherein the member supports the first translucent plate via a frame-shaped elastic member. The first translucent plate is provided with a second translucent plate provided on the opposite side of the semiconductor substrate.
The image pickup device according to claim 7 , wherein the elastic member seals between the first translucent plate and the second translucent plate. An image pickup apparatus comprising the image pickup device according to any one of claims 1 to 8.

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