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JP7086103B2 - ワーク加工用シートおよび加工済みワークの製造方法 - Google Patents

ワーク加工用シートおよび加工済みワークの製造方法 Download PDF

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Publication number
JP7086103B2
JP7086103B2 JP2019558149A JP2019558149A JP7086103B2 JP 7086103 B2 JP7086103 B2 JP 7086103B2 JP 2019558149 A JP2019558149 A JP 2019558149A JP 2019558149 A JP2019558149 A JP 2019558149A JP 7086103 B2 JP7086103 B2 JP 7086103B2
Authority
JP
Japan
Prior art keywords
work
pressure
sensitive adhesive
processing sheet
work processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019558149A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019111759A1 (ja
Inventor
孝文 小笠原
美紗季 坂本
尚哉 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2019111759A1 publication Critical patent/JPWO2019111759A1/ja
Application granted granted Critical
Publication of JP7086103B2 publication Critical patent/JP7086103B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Packaging For Recording Disks (AREA)
JP2019558149A 2017-12-07 2018-11-27 ワーク加工用シートおよび加工済みワークの製造方法 Active JP7086103B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017235376 2017-12-07
JP2017235376 2017-12-07
PCT/JP2018/043552 WO2019111759A1 (ja) 2017-12-07 2018-11-27 ワーク加工用シートおよび加工済みワークの製造方法

Publications (2)

Publication Number Publication Date
JPWO2019111759A1 JPWO2019111759A1 (ja) 2020-12-10
JP7086103B2 true JP7086103B2 (ja) 2022-06-17

Family

ID=66750224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019558149A Active JP7086103B2 (ja) 2017-12-07 2018-11-27 ワーク加工用シートおよび加工済みワークの製造方法

Country Status (5)

Country Link
JP (1) JP7086103B2 (zh)
KR (1) KR102579055B1 (zh)
CN (1) CN111164737B (zh)
TW (1) TWI782146B (zh)
WO (1) WO2019111759A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230125004A (ko) * 2020-12-25 2023-08-28 닛토덴코 가부시키가이샤 수지 조성물

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220694A (ja) 2005-05-16 2007-08-30 Nitto Denko Corp ダイシング用粘着シート及びそれを用いた被加工物の加工方法
WO2008133104A1 (ja) 2007-04-20 2008-11-06 Nitto Denko Corporation ウォータージェットレーザダイシング用粘着シート
JP2011184576A (ja) 2010-03-09 2011-09-22 Hitachi Maxell Ltd 放射線硬化性粘着剤組成物、それを用いたダイシング用粘着フィルム、及び切断片の製造方法
WO2016017789A1 (ja) 2014-08-01 2016-02-04 リンテック株式会社 粘着シート
WO2016140176A1 (ja) 2015-03-02 2016-09-09 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352496Y2 (zh) 1973-06-21 1978-12-15
CN101831261A (zh) * 2009-03-03 2010-09-15 日立麦克赛尔株式会社 放射线固化性粘着剂组合物、切割用粘着膜、切断片制法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220694A (ja) 2005-05-16 2007-08-30 Nitto Denko Corp ダイシング用粘着シート及びそれを用いた被加工物の加工方法
WO2008133104A1 (ja) 2007-04-20 2008-11-06 Nitto Denko Corporation ウォータージェットレーザダイシング用粘着シート
JP2011184576A (ja) 2010-03-09 2011-09-22 Hitachi Maxell Ltd 放射線硬化性粘着剤組成物、それを用いたダイシング用粘着フィルム、及び切断片の製造方法
WO2016017789A1 (ja) 2014-08-01 2016-02-04 リンテック株式会社 粘着シート
WO2016140176A1 (ja) 2015-03-02 2016-09-09 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの加工方法

Also Published As

Publication number Publication date
CN111164737B (zh) 2023-08-29
CN111164737A (zh) 2020-05-15
TWI782146B (zh) 2022-11-01
TW201927980A (zh) 2019-07-16
KR102579055B1 (ko) 2023-09-15
JPWO2019111759A1 (ja) 2020-12-10
WO2019111759A1 (ja) 2019-06-13
KR20200095453A (ko) 2020-08-10

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