JP7081581B2 - Cutting method, cutting device and laminate - Google Patents

Description

The present invention relates to a cutting method, a cutting device and a laminate.

When manufacturing electronic devices such as solar cells; liquid crystal panels (LCDs); organic EL panels (OLEDs); receiving sensor panels that detect electromagnetic waves, X-rays, ultraviolet rays, visible rays, infrared rays, etc., the polyimide resin layer is the substrate. Used as. The polyimide resin layer is used in the state of a laminated body provided on a glass substrate, and the laminated body is provided for manufacturing an electronic device.
As described above, when the polyimide resin layer is provided on the glass substrate, for example, the size of the polyimide resin layer is smaller than that of the glass substrate. In this case, for example, after the polyimide resin layer is formed on the entire surface of the supporting base material, the polyimide resin layer is cut and processed to be smaller than the glass substrate to be bonded.
As a cutting method, as described in Patent Document 1, a sheet-shaped multilayer material in which a plurality of materials having different physical characteristic values are laminated is punched and cut having an acute-angled upper blade and a receiving member of the upper blade. A method for punching and cutting a sheet-shaped multilayer material by punching and cutting the sheet-shaped multilayer material with an upper blade, wherein the receiving member is provided with a relief portion of the cutting edge of the upper blade.

Japanese Unexamined Patent Publication No. 2004-154913

There are various requirements for the outer peripheral surface of the polyimide resin layer after cutting, and for example, the outer peripheral surface may be an inclined surface as an example. However, in the cutting method of Patent Document 1 described above, it is difficult to make the outer peripheral surface of the polyimide resin layer after cutting an inclined surface.
An object of the present invention is to solve a problem based on the above-mentioned prior art, and to provide a cutting method for obtaining a laminated body having an outer peripheral surface made of a slope, a cutting device, and a laminated body having an outer peripheral surface made of a slope. There is something in it.

In order to achieve the above-mentioned object, the first aspect of the present invention is a cutting method for cutting a resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated. The blade is a single-edged blade of which one of the two surfaces forming the cutting edge is an inclined surface, the angle formed by the two surfaces forming the cutting edge is 30 ° to 50 °, and the cutting edge is the surface of the resin layer. It has a step of entering the resin layer along the normal direction of the above and pressing the inclined surface of the blade against the resin layer to cut the resin layer. It provides a cutting method in which the angle between the outer outer surface and the surface of the supporting base material is an blunt angle.
A second aspect of the present invention is a cutting method for cutting a resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated, and the blade forms a cutting edge 2 Each of the two surfaces is a double-edged blade that is an inclined surface, and the angle between the two surfaces forming the cutting edge is 60 ° to 90 °, and the cutting edge is attached to the resin layer along the normal direction of the surface of the resin layer. It has a step of invading and pressing the inclined surface of the blade against the resin layer to cut the resin layer. It provides a cutting method in which the angle between the blades is blunt.

The cutting step is preferably a step of arranging elastic pressing portions on both sides of the blade and pressing the resin base material with the pressing portions to cut.
The pressing portion preferably has a hardness of 45 or more as measured by an Asker C hardness tester.
It is preferable to heat and cut at least one of the resin base material and the blade.
In the cutting step, two blades are used, and it is preferable that the two blades are arranged so that their inclined surfaces face each other.
It is preferable that the blade has a rectangular annular shape and the inclined surface faces the inside of the ring.
The resin base material preferably has an adhesive layer laminated between the support base material and the resin layer, and a protective film laminated on the resin layer. The resin layer is preferably a polyimide resin layer.

A third aspect of the present invention is a cutting device for cutting a resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated, and the blade forms a cutting edge 2 Of the two surfaces, one is a single-edged blade with an inclined surface, and the angle between the two surfaces forming the cutting edge is 30 ° to 50 °, and the cutting edge is made of resin along the normal direction of the surface of the resin layer. It has a cutting portion that enters the layer and presses the inclined surface of the blade against the resin layer to cut it. The cut surface of the resin layer by the blade is a slope, and the outer outer surface of the slope in contact with the atmosphere and the supporting base material It is intended to provide a cutting device having an blunt angle with the surface of the blade.
A fourth aspect of the present invention is a cutting device for cutting a resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated, and the blade forms a cutting edge 2 Each of the two surfaces is a double-edged blade that is an inclined surface, and the angle between the two surfaces forming the cutting edge is 60 ° to 90 °, and the cutting edge is attached to the resin layer along the normal direction of the surface of the resin layer. It has a cutting portion that allows the blade to enter and press the inclined surface of the blade against the resin layer to cut it. It provides a cutting device having an blunt angle with and from.

It is preferable to have elastic pressing portions arranged on both sides of the blade, and the cutting portion is cut by pressing the resin base material with the pressing portions.
The pressing portion preferably has a hardness of 45 or more as measured by an Asker C hardness tester.
It is preferable to have a heating portion for heating at least one of the resin base material and the blade.
The cutting portion has two blades, and it is preferable that the two blades are arranged so that the inclined surfaces of the cutting edges face each other.
It is preferable that the blade has a rectangular annular shape and the inclined surface of the cutting edge faces the inside of the ring.
The resin base material preferably has an adhesive layer laminated between the support base material and the resin layer, and a protective film laminated on the resin layer. The resin layer is preferably a polyimide resin layer.

A third aspect of the present invention has at least a support and a resin layer laminated on the support, the resin layer is rectangular, and all sides are composed of slopes, and the atmosphere of the slopes and the atmosphere of the slopes. An angle formed by an outer outer surface in contact with the surface of the support is an obtuse angle, and the side surface provides a laminated body having a waviness width of 100 μm or less per 100 mm in length along the side.
It is preferable that the angle between the inner surface on the opposite side of the outer surface of the slope of the resin layer and the surface of the support is 50 ° to 80 °.
It is preferable to have an adhesive layer laminated between the support and the resin layer, and a protective layer laminated on the resin layer. The resin layer is preferably a polyimide resin layer.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a cutting method for obtaining a laminate whose outer peripheral surface is composed of slopes, a cutting device, and a laminate whose outer peripheral surface is composed of slopes.

It is a schematic diagram which shows the 1st example of the cutting apparatus of embodiment of this invention. It is a schematic sectional drawing which enlarges and shows 1st example of the cutting part of the cutting apparatus of embodiment of this invention. (A) and (b) are schematic plan views which show 1st example of the cutting method of embodiment of this invention. (A) is a schematic cross-sectional view showing a cut portion of the resin base material of the embodiment of the present invention, and (b) is a schematic cross-sectional view showing an enlarged cut portion of the resin base material of the embodiment of the present invention. Is. It is a schematic plan view which shows the 1st example of the laminated body of embodiment of this invention. (A) is a schematic cross-sectional view showing a first example of the laminated body of the embodiment of the present invention, and (b) is a schematic cross-sectional view showing an enlarged side surface of the laminated body of the embodiment of the present invention. be. (A) is a schematic view which shows the outer peripheral surface of the laminated body of embodiment of this invention, and (b) is a schematic perspective view which shows the measuring method of the waviness width. It is a schematic sectional drawing which enlarges and shows 2nd example of the cutting part of the cutting apparatus of embodiment of this invention. It is a schematic perspective view which shows the 3rd example of the cutting part of the cutting apparatus of embodiment of this invention. It is a schematic cross-sectional view which shows the 2nd example of a resin base material. It is a schematic sectional drawing which shows the 2nd example of the laminated body of embodiment of this invention.

Hereinafter, the cutting method, the cutting device, and the laminated body of the present invention will be described in detail based on the preferred embodiments shown in the attached drawings.
It should be noted that the figures described below are exemplary for explaining the present invention, and the present invention is not limited to the figures shown below.
In the following, "-" indicating the numerical range includes the numerical values described on both sides. For example, when ε is a numerical value α ₁ to a numerical value β ₁ , the range of ε ₁ is a range including the numerical value α ₁ and the numerical value β ₁ , and when expressed in mathematical symbols, α ₁ ≤ ε ₁ ≤ β ₁ .
Angles such as "angle represented by a specific numerical value", "parallel", "vertical" and "orthogonal" include error ranges generally tolerated in the art, unless otherwise stated.

<Cutting device>
FIG. 1 is a schematic view showing an example of a cutting device according to an embodiment of the present invention.
The cutting device 10 shown in FIG. 1 is a press-type device, and the first table 12 and the second table 14 are arranged so as to face each other. The first base 12 and the second base 14 are connected by a ball screw 15. A drive unit 16 is provided at the end of the ball screw 15 on the first base 12 side, and the drive unit 16 rotates the ball screw 15 between the first base 12 and the second base 14. You can change the distance. As a result, the blade 30 described later can be made to enter the resin base material 20 to be cut and cut.
If the distance between the first base 12 and the second base 14 can be changed, the distance is not limited to the ball screw 15, and a vertical movement mechanism or the like can be appropriately used. Further, the drive unit 16 is not particularly limited as long as the ball screw 15 can be rotated, but for example, a motor is used.

For example, a heating table 17 is placed on the first table 12. The resin base material 20 to be cut is arranged on the heating table 17. The heating table 17 constitutes a heating unit. The heating table 17 is for heating the resin base material 20 at the time of cutting to keep the resin base material 20 at a specific temperature higher than 25 ° C. (room temperature), and for example, a heater is used. It is preferable that the heating table 17 has a feedback control unit in order to keep the temperature of the resin base material 20 within a certain range. Further, it is preferable that the heating table 17 can rotate in-plane on the first table 12.
Since it is not always necessary to heat the resin base material 20 at the time of cutting, a configuration without a heating table 17 may be used. In this case, it suffices as long as it is a table on which the resin base material 20 is placed and which can be rotated in-plane on the first table 12. If there is a heating table 17, the heating table 17 serves as a cutting table. If there is no heating table 17, the first table 12 becomes a cutting table. At the time of cutting, an underlay may be provided between the support base material 22 of the resin base material 20 and the cutting table. As the underlay, for example, a lithium terephthalate film (PET film), a polypropylene film (PP film), or a polytetrafluoroethylene film (PTFE film) can be used.

The resin base material 20 is obtained by laminating at least the support base material 22 and the resin layer 24, and the resin base material 24 is laminated on the surface 22a of the support base material 22. The cutting device 10 cuts the resin layer 24 of the resin base material 20 to obtain a laminated body described later.
A blade mold 18 is provided on the second table 14. A cutting portion 19 is provided on the blade mold 18.

[First example of cut portion]
The cutting portion 19 has two blades 30, and the two blades 30 have a length corresponding to the size of the resin layer 24 of the resin base material 20 to be cut. The two blades 30 are arranged so that the inclined surfaces 30c of the blade tips 30a face each other. For example, the ball screw 15 is rotated by the drive unit 16 to bring the second base 14 closer to the first base 12, and the cutting edge 30a of the two blades 30 is aligned with the normal direction of the surface 24a of the resin layer 24. The resin layer 24 is cut by pressing the inclined surface 30c of each blade 30 against the resin layer 24. The blade 30 will be described in detail later.

FIG. 2 is a schematic cross-sectional view showing an enlarged first example of a cutting portion of the cutting device according to the embodiment of the present invention. FIG. 2 shows a state in which the blade 30 has entered the resin layer 24. In FIG. 2, the resin layer 24 on the bottom surface 30b side of the blade 30 is removed from the outer edge portion 24d, and the resin layer 24 on the inclined surface 30c side of the blade 30 is a portion 24c that later constitutes the laminated body.
As shown in FIG. 2, the cutting portion 19 has, for example, a blade 30, and the blade 30 is provided on the blade mold 18.
A heating unit 32 is provided on the base portion 30d of the blade 30 on the blade mold 18 side. A fixing portion 33 is provided on the heating portion 32, and a pressing portion 34 is provided on the fixing portion 33. Pressing portions 34 are arranged on both sides of the blade 30.
The fixing portion 33 is, for example, a laminated structure of an adhesive member 33a, an elastic member 33b, and an adhesive member 33a. The pressing portion 34 is fixed to the heating portion 32 by the adhesive member 33a. The adhesive member 33a is configured to maintain the adhesive force even at the heating temperature of the heating unit 32.

The heating unit 32 is for heating the blade 30 at the time of cutting to keep the blade 30 at a specific temperature higher than 25 ° C. (room temperature), and for example, a heater is used. It is preferable that the heating unit 32 has a feedback control unit in order to keep the temperature of the blade 30 within a certain range. The temperature of the blade 30 by the heating unit 32 is preferably 55 ° C to 65 ° C.
Since it is not always necessary to heat the blade 30 at the time of cutting, a configuration without a heating unit 32 may be used.
The heating table 17 and the heating unit 32 are most preferably both, preferably having at least one, but may be configured without both. When at least one of the heating table 17 and the heating unit 32 is provided, it is preferable to provide the heating unit 32 because the heating table 17 may be affected by heat in the entire cutting device 10.

The pressing portion 34 has elasticity and is compressed and contracted when the blade 30 is cut. The cutting portion 19 cuts by pressing the resin base material 20 with the pressing portion 34. Therefore, it is preferable that the pressing portion 34 comes into contact with the resin base material 20 before the blade 30, and it is preferable that the pressing portion 34 is higher than the blade 30. Further, since the effect of holding down the resin base material 20 by the pressing portion 34 is enhanced, it is preferable to provide the pressing portion 34 without leaving a gap with the blade 30. The pressing portion 34 is made of, for example, natural rubber or synthetic rubber.
The pressing portion 34 preferably has a hardness of 45 or more as measured by an Asker C hardness tester. When the hardness of the pressing portion 34 by the Asker C hardness tester is 45 or more, the variation in the angle of the slope formed by cutting becomes small. As a result, the accuracy of repeated cutting is high, and the quality stability is excellent. The hardness of the pressing portion 34 is preferably 45 or more, and the hardness of the pressing portion 34 is more preferably 50 to 60.
Further, the pressing portion 34 is not always necessary, and may be configured without the pressing portion 34.

The blade 30 is a single-edged blade in which the cutting edge 30a is composed of two surfaces and one surface is an inclined surface 30c. In the case of a single-edged blade, of the two surfaces forming the cutting edge 30a, one surface is an inclined surface 30c as described above. The remaining surface constitutes the bottom surface 30b of the blade 30. The bottom surface 30b is a surface P that passes through the tip 30e of the cutting edge 30a and is perpendicular to the surface 22a of the support base material 22 at the time of cutting.
The blade 30 has an angle formed by two surfaces forming the cutting edge 30a of 30 ° to 50 °. The angle formed by the two surfaces forming the cutting edge 30a is called the cutting edge angle. In the case of the blade 30 shown in FIG. 2, the blade edge angle is the angle α formed by the inclined surface 30c of the blade edge 30a and the bottom surface 30b, and is 30 ° to 50 °.
The inclined surface 30c is composed of one plane, but is not limited to this, and may be configured by a plurality of planes.

When the angle formed by the two surfaces forming the cutting edge 30a is 30 ° to 50 °, the side surface 24b of the portion 24c (see FIG. 4B) of the resin layer 24 (see FIG. 4B) when the resin layer 24 is cut (FIG. 4 (b)). b)) can be formed on the slope 26, and the angle γ formed by the slope 26 between the outer outer surface 26a of the slope 26 in contact with the atmosphere and the surface 22a of the supporting base material 22 (see FIG. 4 (b)). The angle of can be made obtuse. For example, the angle of the inclination angle θ (see FIG. 4B) of the slope 26 of the resin layer 24 is preferably 50 ° to 80 °, more preferably 60 ° to 70 °. The inclination angle θ of the slope 26 is the angle formed by the inner surface 26b (see FIG. 4B) on the opposite side of the outer surface 26a (see FIG. 4B) of the slope 26 and the surface 22a of the support base material 22. be.
For the angle α, a side image or a cross-sectional image of the blade 30 is obtained using a microscope. In the side image or the cross-sectional image of the blade 30, the inclined surface 30c and the bottom surface 30b of the blade 30 are specified to specify the angle α. Find the angle of this angle α.
For the angles of the angle γ and the inclination angle θ, a side image or a cross-sectional image of the cut portion of the resin base material 20 is obtained by using a microscope. In the side image or cross-sectional image of the cut portion of the resin base material 20, the outer outer surface 26a of the slope 26 in contact with the atmosphere, the inner surface 26b on the opposite side of the outer surface 26a, and the surface 22a of the support base material 22 are identified. Specify the angle γ and the inclination angle θ. Obtain the angles of the specified angle γ and inclination angle θ. Further, the blade 30 is made of, for example, a cemented carbide. The thickness of the blade 30 is, for example, 1 mm, but the thickness of the blade 30 is preferably 0.5 to 1 mm.

The region 18a surrounded by the blade mold 18 and the cutting portion 19 is closed by the resin layer 24 at the time of cutting. At this time, the inside of the region 18a may be subjected to negative pressure or the inside of the region 18a may be sucked. .. As a result, the resin layer 24 can be stably cut.
As described above, when cutting, the pressure inside the region 18a may be negative as described above, but when the blade 30 is pulled out from the resin layer 24, it is preferable that the pressure inside the region 18a is zero or positive pressure. When the blade 30 is pulled out from the resin layer 24 while the inside of the region 18a is in a negative pressure state, the resin layer 24 is attracted to the blade mold 18, so that the cut surfaces of the resin layer 24 rub against each other and the cross-sectional quality deteriorates.
Further, the pressing portion 34 adjacent to the inclined surface 30c of the blade 30, that is, the inner pressing portion 34 may be higher than the outer pressing portion 34. As a result, only the outer edge portion 24d (see FIG. 2) can be satisfactorily removed, leaving the portion 24c constituting the laminated body in the resin layer 24 after cutting, and the portion 24c of the resin layer 24 used for the laminated body is stable. A good slope can be obtained.

<Cut method>
The resin base material 20 described above is cut by, for example, the cutting device 10 shown in FIG. 1 described above.
The cutting device 10 has a step of allowing the cutting edge 30a to enter the resin layer 24 along the normal direction of the surface 24a of the resin layer 24 and pressing the inclined surface 30c of the blade 30 against the resin layer 24 for cutting. .. The cut surface of the resin layer 24 by the blade 30 is a slope. The cut surface of the resin layer 24 is the side surface 24b.
Here, FIGS. 3A and 3B are schematic plan views showing a first example of the cutting method according to the embodiment of the present invention. FIG. 4A is a schematic cross-sectional view showing a cut portion of the resin base material according to the embodiment of the present invention, and FIG. 4B is a schematic diagram showing an enlarged cut portion of the resin base material according to the embodiment of the present invention. It is a cross-sectional view.

Since the cutting device 10 shown in FIG. 1 has two blades 30, two facing sides of the resin layer 24 are cut and face each other in one cutting step as shown in FIG. 3A. Two parallel cutting lines 25a are formed.
Since there are two blades 30, it is not possible to cut four sides in one cutting step, and it is necessary to change the orientation of the resin base material 20 and perform the second cutting. For example, after rotating the heating table 17 by 90 °, cutting is performed in the same manner as in the first cutting step. As a result, two parallel cutting lines 25b facing each other are formed as shown in FIG. 3 (b). By the two cutting steps, the side surface of the resin layer 24 is cut so as to be a slope. As a result, the resin layer 24 is separated into an outer edge portion 24d to be removed and a portion 24c that later constitutes the laminate.
When the outer edge portion 24d of the resin layer 24 is peeled off at the boundary between the two cutting lines 25a and the two cutting lines 25b, as shown in FIG. 4A, the cutting surface of the resin layer 24 is the slope 26. A portion 24c constituting the laminated body is obtained. Further, after the resin layer 24 is peeled off from the supporting base material 22, the resin layer 24 may be attached to another base material. For example, the resin layer 24 shown in FIG. 4A is peeled off from the support base material 22, and then attached to, for example, a glass support 42 to form a laminate shown in FIGS. 5 and 6A, which will be described later. 40 can be obtained. The laminated body 40 (see FIG. 6A) has at least a support 42 (see FIG. 6A) and a resin layer 24 laminated on the support 42. Next, the laminated body 40 (see FIG. 6A) will be specifically described.

<First example of laminated body>
FIG. 5 is a schematic plan view showing a first example of the laminated body of the embodiment of the present invention. FIG. 6A is a schematic cross-sectional view showing a first example of the laminate according to the embodiment of the present invention, and FIG. 6B is a schematic cross-sectional view showing an enlarged side surface of the laminate according to the embodiment of the present invention. It is a figure.
In the laminated body 40 of the first example shown in FIG. 6A, a glass support 42, a resin layer 24, and a protective layer 44 are laminated. For example, the protective layer 44 is arranged so as to cover the resin layer 24 on the support 42.
The resin layer 24 of the laminated body 40 is a portion 24c from which the outer edge portion 24d shown in FIG. 3B is removed, has a rectangular outer shape, and is compared with the surface 42a of the support 42. Is small.
All the side surfaces 24b of the resin layer 24 are composed of slopes 26. As shown in FIG. 6B, the angle γ formed by the outer outer surface 26a of the slope 26 in contact with the atmosphere and the surface 42a of the support 42 is an obtuse angle.
Further, the angle formed by the inner surface 26b on the opposite side of the outer surface 26a of the slope 26 of the resin layer 24 and the surface 42a of the support 42, that is, the angle θ of the inclination angle θ of the slope 26 of the resin layer 24 is 50 ° to 80 °. Is preferable, and more preferably 60 ° to 70 °. The angles of the angle γ and the inclination angle θ are obtained as described above.

As shown in FIG. 6A, an adhesion layer 46 is provided between the protective layer 44 and the resin layer 24. The adhesion layer 46 is in contact with the outer edge portion 42c of the surface 42a of the resin layer 24 and the support 42. The protective layer 44 is attached to the resin layer 24 by the adhesive layer 46. The protective layer 44 is peeled off when the resin layer 24 is used. Although the adhesive layer 46 is provided between the protective layer 44 and the resin layer 24, the present invention is not limited to this, and the protective layer 44 may be bonded to the resin layer 24 without providing the adhesive layer 46. ..

The protective layer 44 protects the support 42 and the resin layer 24, and particularly protects the resin layer 24 from dents and scratches caused by external forces.
In the laminated body 40 of the first example, the resin layer 24 is provided directly on the surface 42a of the support 42. A silane coupling agent may be provided on the surface 42a of the support 42 to bond the resin layer 24, but even in this case, the resin layer 24 is directly provided on the surface 42a of the support 42. And.

The side surface 24b of the resin layer 24 of the laminated body 40 shown in FIG. 5 has a waviness width δ (see FIG. 7A) per 100 mm in length along the sides of 100 μm or less. The side surface 24b of the resin layer 24 shown in FIG. 4A is the side surface 24b of the resin layer 24 of the laminated body 40.
Here, FIG. 7A is a schematic view showing the outer peripheral surface of the laminated body of the embodiment of the present invention, and FIG. 7B is a schematic perspective view showing a method of measuring the waviness width.
As shown in FIG. 7A, the waviness width δ is measured by using a two-dimensional measuring machine on the slope 26 of the resin base material 20 from the surface 24a side of the resin layer 24 after cutting the resin layer 24. The measurement distance L is set to 100 mm along the side surface 24b, and the reference line BL is set with both ends of the measurement distance L as zero points. The difference between the maximum values in the direction orthogonal to the reference line BL is defined as the above-mentioned waviness width δ.
Regarding the measurement distance L, as shown in FIG. 7B, the camera D arranged on the resin layer 24 is mounted on the resin layer 24 from an arbitrary position with respect to the side surface 24b of the resin layer 24 having a length of 100 mm or more. Along the side surface 24b of the 24, the measurement distance L is moved by 100 mm. Image data of the side surface 24b for the measurement distance L is obtained. As described above, the waviness width during the measurement distance L (100 mm) is measured.

[Second example of cut portion, third example]
FIG. 8 is an enlarged schematic cross-sectional view showing a second example of the cutting portion of the cutting device according to the embodiment of the present invention, and FIG. 9 is a third example of the cutting portion of the cutting device according to the embodiment of the present invention. It is a schematic perspective view which shows. In FIGS. 8 and 9, the same components as the cutting device 10 shown in FIG. 1 and the cutting portion 19 shown in FIG. 2 are designated by the same reference numerals, and detailed description thereof will be omitted. FIG. 8 shows a state in which the blade 30 has entered the resin layer 24.
The cutting portion 19 shown in FIG. 8 is different from the cutting portion 19 shown in FIG. 2 in that the blade 30 is a double-edged blade, and the other configurations are the same as those of the cutting portion 19 shown in FIG. In FIG. 8, the resin layer 24 on the inclined surface 30f side of the blade 30 is removed from the outer edge portion 24d, and the resin layer 24 on the inclined surface 30c side of the blade 30 is a portion 24c constituting the laminated body.

When the blade 30 is a double-edged blade, the two surfaces forming the cutting edge 30a are inclined surfaces 30c and 30f, respectively. The angle formed by the two inclined surfaces 30c and 30f forming the cutting edge 30a, which cuts the resin layer 24 by pressing the inclined surfaces 30c and 30f of the blade 30 against the resin layer 24, that is, the angle of the angle β is from 60 ° to It is 90 °. When the angle β is 60 ° to 90 °, when the resin layer 24 is cut, the side surface 24b of the resin layer 24 can be formed on the slope 26, and the slope 26 is the outer outer surface of the slope 26 in contact with the atmosphere. The angle γ formed by the 26a and the surface 22a of the supporting base material 22 can be obtuse. As described above, for example, the angle of the inclination angle θ of the slope 26 of the resin layer 24 is preferably 50 ° to 80 °. The inclination angle θ of the slope 26 is as described above.
When the blades 30 are double-edged, the two blades 30 are arranged so that the inclined surfaces 30c of the blade tips 30a face each other.
In the blade 30 shown in FIG. 8, the angle formed by the inclined surface 30c and the surface P passing through the tip 30e of the cutting edge 30a and perpendicular to the surface 22a of the support base material 22 is defined as the angle Q. The above-mentioned vertical plane P divides the angle β into two equal parts, and the angle Q is half of the angle β. The angle between the inclined surface 30c and the inclined surface 30f is the same. When the blade 30 is a double-edged blade, it is preferable that the angle Q of the inclined surface 30c described above is 30 ° to 45 °.
The blade 30 shown in FIG. 8 is symmetrical with respect to the above-mentioned vertical surface P, but is not limited to this, and the angle between the inclined surface 30c and the inclined surface 30f may be different. In this case, it becomes asymmetric with respect to the above-mentioned vertical plane P.

In FIG. 9, only the resin base material 20 and the blade 50 are shown in order to show the shape of the blade 50. The blade 50 shown in FIG. 9 has a rectangular annular shape, and the slope 50c of the blade edge 50a faces the inside of the ring. With this configuration, the side surface of the resin layer 24 can be made into a slope in one cutting step. The size of the annular blade 50 is appropriately determined by the size of the laminated body to be formed.
The annular blade 50 may be single-edged or double-edged. When the blade 50 is a single blade, it is preferable that the cutting edge angle of the cutting edge 50a is 30 ° to 50 °. When the blade 50 is a double-edged blade, it is preferable that the cutting edge angle of the cutting edge 50a is 30 ° to 45 °.
The blade 50 shown in FIG. 9 is not particularly limited as long as it can be formed in an annular shape, and can be formed by, for example, a carbide blade.

<Second example of laminated body>
Next, a second example of the laminated body will be described.
FIG. 10 is a schematic cross-sectional view showing a second example of the resin base material. FIG. 11 is a schematic cross-sectional view showing a second example of the laminated body of the embodiment of the present invention. In FIG. 10, the same components as those of the resin base material 20 shown in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. In FIG. 11, the same components as those of the laminated body 40 shown in FIGS. 6A and 6B are designated by the same reference numerals, and detailed description thereof will be omitted.
The resin base material 20 to be cut is not limited to the configuration shown in FIG. 2, and is laminated between the support base material 22 and the resin layer 24, for example, as in the resin base material 21 shown in FIG. The structure may include the bonded adhesive layer 23 and the protective film 28 laminated on the resin layer 24. The protective film 28 protects the resin layer 24 at the time of cutting. The adhesive layer 23 is, for example, a silicone resin layer.

By cutting the resin base material 21 shown in FIG. 10 using the above-mentioned cutting device 10, the resin layer 24 can be cut while being protected by the protective film 28. After cutting, the support base material 22 and the adhesive layer 23 are peeled off, and for example, the resin layer 24 is attached to the glass support 42 via the adhesive layer 23. At this time, it is preferable to have the protective film 28. After bonding, the protective film 28 is peeled off, and the protective layer 44 is bonded onto the resin layer 24 via the adhesion layer 46. As a result, the laminated body 40 shown in FIG. 11 can be obtained.
The same material may be used for the protective film 28 at the time of cutting the resin layer 24 and the protective layer 44 of the laminated body 40, or different materials may be used.

Hereinafter, the support base material 22 constituting the resin base materials 20 and 21, the adhesive layer 23, the resin layer 24, the support body 42 constituting the laminated body 40, and the protective layer 44 will be described in detail.

[Resin base material]
<Supporting base material>
The support base material 22 supports the resin layer 24 at the time of cutting. Further, the support base material 22 is intended to prevent the heating table 17 and the like from being scratched when the resin layer 24 is cut. For example, it is composed of a polyethylene terephthalate film (PET film), a polypropylene film (PP film), a polytetrafluoroethylene film (PTFE film) and the like.

<Resin layer>
The resin layer 24 is formed with an electronic device or the like, and is made of, for example, a polyimide resin, a polycarbonate resin, or a polyethylene naphthalate resin. Above all, the resin layer 24 is preferably a polyimide resin layer made of a polyimide resin. For the polyimide resin layer, for example, a polyimide film is used. Specific examples of commercially available polyimide films include "Xenomax" manufactured by Toyobo Co., Ltd. and "UPIREX 25S" manufactured by Ube Kosan Co., Ltd.
An electronic device is formed on the resin layer 24. The surface 24a of the resin layer 24 is preferably smooth in order to form high-definition wiring and the like constituting the electronic device. Specifically, the surface roughness Ra of the surface 24a of the resin layer 24 is preferably 50 nm or less, more preferably 30 nm or less, still more preferably 10 nm or less. The lower limit of the surface roughness Ra is 0.01 nm or more.
When the electronic device is formed on the resin layer 24, since all the side surfaces of the resin layer 24 are formed of slopes, it is possible to suppress disconnection of wiring formed on the side surfaces in order to conduct conduction with the electronic device.
The thickness of the resin layer 24 is preferably 1 μm or more, more preferably 5 μm or more, still more preferably 10 μm or more, from the viewpoint of handleability in the manufacturing process. From the viewpoint of flexibility, the thickness of the resin layer 24 is preferably 1 mm or less, more preferably 0.2 mm or less.
The difference between the coefficient of thermal expansion of the resin layer 24 and the coefficient of thermal expansion of the support 42 is preferably small because warpage after heating or cooling can be suppressed. Specifically, the difference in the coefficient of thermal expansion between the resin layer 24 and the support 42 is preferably 0 to 90 × 10 ^-6 / ° C, more preferably 0 to 30 × 10 ^-6 / ° C.

The area of the resin layer 24 (area of the surface 24a) is not particularly limited, but is preferably smaller than that of the support 42 in order to arrange the protective layer 44. On the other hand, the area of the resin layer 24 is preferably 300 cm ² or more from the viewpoint of productivity of the electronic device.
The shape of the resin layer 24 is not particularly limited and may be rectangular or circular. The resin layer 24 may be formed with an orientation flat (a flat portion formed on the outer peripheral edge of the substrate) and a notch (at least one V-shaped notch formed on the outer peripheral edge of the substrate).

<Adhesive layer>
The adhesive layer is composed of, for example, a silicone resin layer. The silicone resin layer is mainly made of a silicone resin. The structure of the silicone resin is not particularly limited. The silicone resin is usually obtained by curing (crosslink curing) a curable silicone that can become a silicone resin by a curing treatment.
Specific examples of the curable silicone include a condensation reaction type silicone, an addition reaction type silicone, an ultraviolet curable silicone, and an electron beam curable silicone depending on the curing mechanism. The weight average molecular weight of the curable silicone is preferably 5,000 to 60,000, more preferably 5,000 to 30,000.

As a method for producing the silicone resin layer, a curable composition containing the above-mentioned curable silicone to be a silicone resin is applied to the surface 24a of the resin layer 24, and if necessary, the solvent is removed to form a coating film. Then, the method of curing the curable silicone in the coating film to form a silicone resin layer is preferable.
The curable composition may contain, in addition to the curable silicone, a solvent, a platinum catalyst (when an addition reaction type silicone is used as the curable silicone), a leveling agent, a metal compound and the like. Specific examples of the metal element contained in the metal compound include 3d transition metal, 4d transition metal, lanthanoid metal, bismuth, aluminum, and tin. The content of the metal compound is adjusted as appropriate.

The thickness of the silicone resin layer is preferably 100 μm or less, more preferably 50 μm or less, and even more preferably 30 μm or less. On the other hand, the thickness of the silicone resin layer is preferably more than 1 μm, more preferably 4 μm or more. The above-mentioned thickness is obtained by measuring the thickness of the silicone resin layer at any position of 5 points or more with a contact type film thickness measuring device and arithmetically averaging them.

<Protective film>
The protective film 28 protects the resin layer 24 at the time of cutting. The protective layer that protects the resin layer 24 at the time of cutting can have the same configuration as the protective layer 44 described later. When the protective film 28 is attached to the resin layer 24, for example, the adhesion layer 46 shown in FIG. 6A is laminated.

[Laminate]
<Support>
The support 42 is made of, for example, a glass plate.
As the type of glass, non-alkali borosilicate glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass containing silicon oxide as a main component are preferable. As the oxide-based glass, glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.
More specifically, examples of the glass plate include a glass plate made of non-alkali borosilicate glass (trade name "AN100" manufactured by AGC Inc.).
Examples of the method for manufacturing a glass plate include a method of melting a glass raw material and forming the molten glass into a plate shape. Such a molding method may be a general one, and examples thereof include a float method, a fusion method, and a slot down draw method.

The thickness of the support 42 may be thicker or thinner than that of the resin layer 24. From the viewpoint of handleability of the laminated body 40, the thickness of the support 42 is preferably thicker than that of the resin layer 24.
The support 42 is preferably not flexible because it is required to function as a reinforcing plate and a transport substrate. Therefore, the thickness of the support 42 is preferably 0.3 mm or more, more preferably 0.5 mm or more. On the other hand, the thickness of the support 42 is preferably 1.0 mm or less.

<Protective layer>
The thickness of the protective layer 44 is preferably 20 μm or more, more preferably 30 μm or more, still more preferably 50 μm or more in order to reduce the influence of the force received from the outside. The upper limit of the thickness of the protective layer 44 is preferably 500 μm or less, more preferably 300 μm or less, and further preferably 100 μm or less.
The thickness of the protective layer 44 is the total thickness of the protective layer 44 and the adhesive layer 46. The upper limit of the thickness of the protective layer 44 is preferably 500 μm or less because if it is too thick, an excessive force may be required when peeling the protective layer 44.
The thickness of the protective layer 44 is a thickness obtained by measuring the thicknesses at arbitrary positions of 5 points or more with a contact-type film thickness measuring device and arithmetically averaging them.
The material constituting the protective layer 44 may be composed of, for example, a polyester resin (for example, polyethylene terephthalate (PET)), a polyolefin resin (for example, polyethylene (PE), polypropylene, etc.), a resin such as a polyurethane resin, or the like. preferable. Of these, as the resin constituting the protective layer 44, polyolefin is preferable, and polyethylene or polypropylene is more preferable.
When the protective layer 44 is bonded to the resin layer 24, for example, the adhesion layer 46 is laminated as shown in FIG. 6A.

The adhesive layer 46 is not particularly limited, and a known adhesive layer can be used. Specific examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer include (meth) acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, and urethane-based pressure-sensitive adhesives.
The adhesive layer 46 may be made of a resin, and specific examples of the resin include vinyl acetate resin, ethylene-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, and (meth) acrylic resin. Examples thereof include butyral resin, polyurethane resin and polystyrene elastomer.
In addition, (meth) acrylic is a concept including acrylic and methacrylic acid.

<Example of application of laminated body>
The laminate of the present invention can be used for various purposes, for example, manufacturing and mounting a display panel, PV (Photovoltaic), a thin film secondary battery, and a semiconductor component having a circuit formed on the surface. Alternatively, it may be used for temporary fixing.
Here, the display device panel includes an LCD, an OLED, an electronic paper, a plasma display panel, a field emission panel, a quantum dot LED panel, a MEMS (Micro Electro Mechanical Systems) shutter panel, and the like.

Hereinafter, the present invention will be specifically described with reference to Examples and the like, but the present invention is not limited to these examples. Examples 1 to 5 described later are examples.

<Evaluation>
(Quality of inclined surface)
In the evaluation of the quality of the inclined surface, in each example, the angle of the inclined angle was measured at three points per side of the cut resin base material using a microscope.
For the angle of inclination, a microscope is used to obtain a side image of the laminate, and in the side image of the resin substrate, the inner surface on the opposite side of the outside in contact with the atmosphere of the slope and the surface of the support are specified. , The tilt angle was identified. The angle of the specified tilt angle was obtained.
If the variation of the inclination angle is within 1 °, it is evaluated as "A", if it is more than 1 ° and less than 3 °, it is evaluated as "B", and if it is 3 ° or more, it is evaluated as "C". The evaluation results of the quality of the inclined surface are shown in Table 1 below.

<Example 1>
In Example 1, an adhesive layer, a resin layer, and a resin base material laminated in this order on a support base material are used, and the angle between the two surfaces forming the cutting edge (angle of the cutting edge) of this resin base material is set. It was cut using a 40 ° single-edged blade. A cemented carbide blade was used for the blade, and the thickness of the blade was 1 mm. As the pressing portion, a hardness of 35 by an Asker C hardness tester was used.
The resin base material will be described.
(Preparation of curable silicone)
Triethoxymethylsilane (179 g), toluene (300 g) and acetic acid (5 g) were added to a 1 L flask, and the mixture was stirred at 25 ° C. for 20 minutes and then heated to 60 ° C. for 12 hours. The obtained crude reaction solution was cooled to 25 ° C., and then the crude reaction solution was washed 3 times with water (300 g).
Chlorotrimethylsilane (70 g) was added to the washed crude reaction solution, and the mixture was stirred at 25 ° C. for 20 minutes and then heated to 50 ° C. for 12 hours. The obtained crude reaction solution was cooled to 25 ° C., and then the crude reaction solution was washed 3 times with water (300 g).
Toluene was distilled off from the washed crude reaction solution under reduced pressure to form a slurry, which was then dried overnight in a vacuum dryer to obtain curable silicone 1 which is a white organopolysiloxane compound. The curable silicone 1 had a number of T units: a number of M units = 87:13 (molar ratio).
The M unit means a monofunctional organosiloxy unit represented by (R) ₃ SiO _1/2 . The T unit means a trifunctional organosiloxy unit represented by RSiO _3/2 (R represents a hydrogen atom or an organic group).

(Preparation of curable composition)
Hexane was mixed with curable silicone 1 as a solvent, and bismuth 2-ethylhexanoate (III) was further added. The amount of solvent was adjusted so that the solid content concentration was 50% by mass. The amount of the metal compound added was adjusted so that the amount of the metal element was 0.01 part by mass with respect to 100 parts by mass of the resin. The obtained mixed solution was filtered using a filter having a pore size of 0.45 μm to obtain a curable composition.

(Preparation of resin base material)
The prepared curable composition is applied to a polyimide film having a thickness of 0.015 mm (trade name "Xenomax" manufactured by Toyobo Co., Ltd.) and heated at 140 ° C. for 10 minutes using a hot plate to form an adhesive layer. A silicone resin layer was formed. The thickness of the silicone resin layer was 10 μm. Subsequently, a PET film was provided on the silicone resin layer.
Next, air blow was performed to remove fine dust from the surface of the polyimide film, and then a protective film was attached to the polyimide film side to obtain a resin base material. As the protective film used, a PET film was used.

<Example 2>
The resin base material was cut in the same manner as in Example 1 except that the pressed portion had a hardness of 40 by an Asker C hardness tester.
<Example 3>
The resin base material was cut in the same manner as in Example 1 except that the pressed portion had a hardness of 50 by an Asker C hardness tester.
<Example 4>
The resin base material was cut in the same manner as in Example 1 except that the pressed portion had a hardness of 60 by an Asker C hardness tester.
<Example 5>
The resin base material was cut in the same manner as in Example 1 except that the pressing portion was not used.
In Example 5, since the pressing portion is not used, “-” is described in the column of hardness of the pressing portion in Table 1.

As shown in Table 1, by providing the pressing portion, the angle of the inclination angle could be within the range of 50 ° to 80 °. When the hardness of the pressed portion is high, the variation in the angle of inclination is small, and the repeatability, that is, the quality stability is excellent.
In Examples 1 to 5, after cutting the resin base material, the resin layer was peeled off from the supporting base material and attached to a glass plate to obtain a laminated body. When observing the range within 5 mm at the end of the resin layer in the laminated body, there were no more than three voids (air bubbles) at the interface between the resin layer and the glass plate. Further, when the side surface of the laminated body was observed with a microscope, the waviness width per 100 mm length along the side was 100 μm or less.

Examples 10 to 13 described later are examples, and the cutting of the resin base material was evaluated.

<Evaluation>
(Disconnect)
In the evaluation of cutting, in each example, it was confirmed whether or not peeling occurred at the interface between the resin layer and the supporting base material for the cut resin base material. As a cutting method, a PET film as an underlay was provided between the resin base material and the heating table, and the blade was inserted in the normal direction of the surface of the resin base material to cut the resin layer.
The resin base material was cut 5 times, of which 5 times did not cause interfacial peeling as "a", and 5 times of 5 times where interfacial peeling occurred 1 to 3 times as "b", 5 times. Of these, the one in which the interface peeling occurred 4 times was designated as "c", and the one in which all the interface peeling occurred 5 times was designated as "d".

<Example 10>
The same resin base material as in Example 1 was used, except that the pressing portion had a hardness of 60 by an Asker C hardness tester, the blade temperature was 25 ° C. (normal temperature), and the temperature of the resin base material was 25 ° C. (normal temperature). In the same manner as in 1, the resin substrate was cut 5 times.
<Example 11>
The resin base material was cut in the same manner as in Example 10 except that the resin base material was heated and the temperature was set to 60 ° C.
<Example 12>
The resin substrate was cut in the same manner as in Example 10 except that the blade was heated and the temperature was set to 60 ° C.
<Example 13>
The resin base material was cut in the same manner as in Example 10 except that the blade was heated, the temperature was set to 60 ° C., the resin base material was heated, and the temperature was set to 60 ° C.

The angle of inclination could be within the range of 50 ° to 80 ° without heating the blade and the resin substrate. However, by heating and cutting at least one of the blade and the resin base material, the occurrence of interface peeling can be suppressed, particles can be prevented from entering the cutting interface, and an excellent cleanliness can be obtained. did it.
In Examples 10 to 13, after cutting the resin base material, the resin layer was peeled off from the supporting base material and attached to a glass plate to obtain a laminated body. When observing the range within 5 mm at the end of the resin layer in the laminated body, there were no more than three voids (air bubbles) at the interface between the resin layer and the glass plate. Further, when the slope of the laminated body was measured from the surface side of the resin layer using a two-dimensional measuring machine, the waviness width per 100 mm length of the side surface was 100 μm or less along the side.
Instead of the single-edged blade with an angle of 40 ° used in Examples 1 to 14 described above, the two surfaces forming the cutting edge are inclined surfaces, respectively, and the angle formed by the two surfaces forming the cutting edge is 80 °. It was cut using the double-edged blade of. As shown in FIG. 8, the double-edged blade has an angle Q of 40 ° between the inclined surface 30c and the surface P passing through the tip 30e of the cutting edge 30a and perpendicular to the surface 22a of the supporting base material 22. Even when the above-mentioned double-edged blade was used, the same result as that of the single-edged blade was obtained.

10 Cutting device 12 1st table 14 2nd table 15 Ball screw 16 Drive unit 17 Heating table 18 Blade type 19 Cutting unit 20, 21 Resin base material 22 Support base material 22a Surface 23 Adhesive layer 24 Resin layer 24a Surface 24b Side surface 24c Part 24d Outer edge 25a Cutting line 25b Cutting line 26 Slope 26a Outer surface 26b Inner surface 28 Protective film 30 Blade 30a Blade tip 30b Bottom 30c Inclined surface 30d Base 30f Inclined surface 32 Heating part 33 Fixed part 33a Laminated body 42 Support 42a Surface 42c Outer edge 44 Protective layer 46 Adhesive layer 50 Blade 50a Blade edge 50c Slope BL Reference line L Measurement distance Q angle α angle β angle γ angle θ tilt angle

Claims (18)

A cutting method for cutting the resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated.
The blade is a single-edged blade in which one of the two surfaces forming the cutting edge is an inclined surface, and the angle formed by the two surfaces forming the cutting edge is 30 ° to 50 °.
It has a step of allowing the cutting edge to enter the resin layer along the normal direction of the surface of the resin layer, and pressing the inclined surface of the blade against the resin layer to cut the resin layer.
A cutting method in which the cut surface of the resin layer by the blade is a slope, and the angle between the outer outer surface of the slope in contact with the atmosphere and the surface of the support base material is 110 ° to 130 ° . A cutting method for cutting the resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated.
The blade is a double-edged blade in which the two surfaces forming the cutting edge are inclined surfaces, respectively, and the angle formed by the two surfaces forming the cutting edge is 60 ° to 90 °.
It has a step of allowing the cutting edge to enter the resin layer along the normal direction of the surface of the resin layer, and pressing the inclined surface of the blade against the resin layer to cut the resin layer.
A cutting method in which the cut surface of the resin layer by the blade is a slope, and the angle between the outer outer surface of the slope in contact with the atmosphere and the surface of the support base material is 110 ° to 130 ° . The cutting method according to claim 1 or 2, wherein the cutting step is a step of arranging elastic pressing portions on both sides of the blade and pressing the resin base material with the pressing portions to cut. The cutting method according to claim 3, wherein the pressing portion has a hardness of 45 or more by an Asker C hardness tester. The cutting method according to any one of claims 1 to 4, wherein in the cutting step, at least one of the resin base material and the blade is heated for cutting. The cutting method according to any one of claims 1 to 5, wherein in the cutting step, two blades are used, and the two blades are arranged so that their inclined surfaces face each other. The cutting method according to any one of claims 1 to 5, wherein the blade is a rectangular annular shape and the inclined surface faces the inside of the ring. The one according to any one of claims 1 to 7, wherein the resin base material has an adhesive layer laminated between the support base material and the resin layer, and a protective film laminated on the resin layer. How to cut. The cutting method according to any one of claims 1 to 8, wherein the resin layer is a polyimide resin layer. A cutting device for cutting the resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated.
The blade is a single-edged blade in which one of the two surfaces forming the cutting edge is an inclined surface, and the angle formed by the two surfaces forming the cutting edge is 30 ° to 50 °.
It has a cutting portion that allows the cutting edge to enter the resin layer along the normal direction of the surface of the resin layer and presses the inclined surface of the blade against the resin layer to cut.
A cutting device in which the cutting surface of the resin layer by the blade is a slope, and the angle between the outer outer surface of the slope in contact with the atmosphere and the surface of the supporting base material is 110 ° to 130 ° . A cutting device for cutting the resin layer using a blade among at least a resin base material in which a support base material and a resin layer are laminated.
The blade is a double-edged blade in which the two surfaces forming the cutting edge are inclined surfaces, respectively, and the angle formed by the two surfaces forming the cutting edge is 60 ° to 90 °.
It has a cutting portion that allows the cutting edge to enter the resin layer along the normal direction of the surface of the resin layer and presses the inclined surface of the blade against the resin layer to cut.
A cutting device in which the cutting surface of the resin layer by the blade is a slope, and the angle between the outer outer surface of the slope in contact with the atmosphere and the surface of the supporting base material is 110 ° to 130 ° . The cutting device according to claim 10 or 11, which has elastic pressing portions arranged on both sides of the blade, and the cutting portion presses and cuts the resin base material with the pressing portions. The cutting device according to claim 12, wherein the pressing portion has a hardness of 45 or more by an Asker C hardness tester. The cutting device according to any one of claims 11 to 13, further comprising a heating portion for heating at least one of the resin base material and the blade. The cutting device according to any one of claims 11 to 14, wherein the cutting portion has two blades, and the two blades are arranged so that the inclined surfaces of the cutting edges face each other. .. The cutting device according to any one of claims 11 to 15, wherein the blade is a rectangular annular shape and the inclined surface of the blade edge faces the inside of the ring. The one according to any one of claims 11 to 16, wherein the resin base material has an adhesive layer laminated between the support base material and the resin layer, and a protective film laminated on the resin layer. Cutting device. The cutting device according to any one of claims 11 to 17, wherein the resin layer is a polyimide resin layer.

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