JP7069651B2 - Load port device - Google Patents

Description

The present invention relates to a load port device, and more particularly to a load port device capable of eliminating static electricity while cleaning the inside of a container.

In the semiconductor manufacturing process, wafers are transferred between processing devices using a container called a hoop (FOUP). When processing a wafer, first, a container is placed on a mounting table of a load port device provided in the processing device. Subsequently, the load port device communicates the space inside the container with the space inside the processing chamber, and then the wafer transfer device takes out the wafer from the container with a robot arm or the like and transports the wafer to the processing chamber.

In the wafer processing process, in order to prevent the surface of the wafer from being contaminated and oxidized by contaminants and oxidizing gas inside the container containing the wafer, purge gas is introduced inside the container to clean the inside of the container. It is known to become.

On the other hand, the wafer housed in the container may be charged by static electricity generated in each manufacturing process, and may be in a state where it is easily discharged when a conductor or the like approaches. Therefore, for example, when the wafer is stored in or taken out of the container, a discharge is generated between the wafers or between the wafer and the robot arm, resulting in damage to the wafer and electrical destruction of the wafer transfer device, semiconductor manufacturing device, and the like. May occur. In addition, contaminants and the like may adhere to the charged wafer due to electrostatic force, making it difficult to remove them.

In order to solve the above problem, in Cited Document 1, an ionizer for ionizing gas is added to the purge nozzle or its vicinity, and the ionized gas is supplied on the flow of the purge gas introduced into the container. A method for eliminating static electricity inside the container is disclosed. Further, Cited Document 2 discloses a method of eliminating static electricity inside a container using an ionizer in a state where a closed space is formed by a replacement chamber.

Japanese Unexamined Patent Publication No. 2005-33118 Japanese Unexamined Patent Publication No. 2014-116441

In recent years, as a result of the progress of miniaturization of wiring in semiconductor elements, there is a demand for a technique for purging the inside of a container more efficiently and with high cleanliness in order to protect the wafer surface from oxidation and contamination.

Although the static elimination method according to Patent Document 1 is effective in static elimination inside the container, it is necessary to further enhance the reliability of static elimination when a finer circuit design is required.

On the other hand, the static elimination method according to Patent Document 2 can reliably eliminate static electricity by forming a closed space, but it takes a lot of time to eliminate static electricity, and a device configuration such as a drive system and a chamber for forming the closed space. Since the number of members is increased, there is a problem that the size of the device is increased and the cost is increased.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a load port device capable of quickly and surely eliminating static electricity in a container by a simple mechanism.

In order to solve the above problems, the first aspect of the present invention is to form a mounting table on which a container having a main opening for loading and unloading a wafer is formed on the side surface, and a device opening communicating with the main opening. A wall portion having an outer surface facing the container and an inner side surface opposite to the outer surface, a door for opening and closing the main opening, and the wall portion placed on the above-mentioned table. A first airflow generating means for generating a first airflow of cleaning gas introduced into the inside of the container from the inner side surface side through the device opening and the main opening, and the said on the inner side surface side of the wall portion. A second airflow generating means for generating a second airflow of cleaning gas flowing down from above the device opening along the opening surface of the device opening, a cleaning gas forming the first airflow, and the second airflow are formed. It is a load port device characterized by having an ion generating means for supplying ions to the cleaning gas to be used.

According to this aspect, an ion generating means for supplying ions to the cleaning gas forming the first airflow introduced into the container and the cleaning gas forming the second airflow flowing down along the opening surface of the device opening. Therefore, the inside of the container and the wafer are statically eliminated and cleaned, and ions are also supplied to the air around the opening of the device that may enter the container, thereby increasing the efficiency of introducing ions into the container. be able to.

A second aspect of the present invention is, in the first aspect, the first ionizer in which the ion generating means supplies ions to the cleaning gas forming the first airflow, and the cleaning forming the second airflow. It is a load port device including a second ionizer that supplies ions to the chemical gas.

According to this aspect, the inside of the container and the opening of the device are provided by separately providing an ionizer that supplies ions to the cleaning gas that forms the first airflow and an ionizer that supplies ions to the cleaning gas that forms the second airflow. It is possible to remove static electricity more reliably in the surrounding area.

A third aspect of the present invention is the load port device according to the second aspect, wherein the first ionizer is arranged inside the first airflow generating means.

According to this aspect, since the cleaning gas is ionized inside the first airflow generating means before the first airflow is formed, the cleaning gas can be ionized reliably and evenly. Therefore, it is possible to remove static electricity more reliably and uniformly inside the container.

In a fourth aspect of the present invention, in the second aspect, the first ionizer is placed in the first airflow or on the side of the first airflow between the device opening and the first airflow generating means. It is a load port device characterized by being arranged.

According to this aspect, even when the installation space cannot be secured inside the first airflow generating means or the like, ions can be supplied to the first airflow of the cleaning gas to eliminate static electricity inside the container.

A fifth aspect of the present invention has, in the second aspect, the first gas supply pipe for supplying the cleaning gas to the first airflow generating means, and the first ionizer is the first gas supply pipe. It is a load port device characterized by being arranged in.

According to this aspect, by surely and evenly ionizing the cleaning gas in the first gas supply pipe before the first air flow is formed, the inside of the container can be more reliably and uniformly discharged. Further, since the ionizer is arranged on the upstream side of the first airflow generating means, for example, even if the first airflow generating means is composed of a plurality of gas purge nozzles, the first ionizer is arranged in the gas supply pipe common to these. Therefore, it is not necessary to provide an ionizer for each gas purge nozzle, and one ionizer can supply ionized cleaning gas to all the gas purge nozzles.

A sixth aspect of the present invention is the load port device according to the second to fifth aspects, wherein the second ionizer is arranged inside the second airflow generating means.

According to this aspect, since the cleaning gas is ionized inside the second airflow generating means before the second airflow is formed, the cleaning gas can be ionized reliably and evenly. Therefore, it is possible to more reliably and uniformly eliminate static electricity such as air around the opening of the device.

In a seventh aspect of the present invention, in the second to fifth aspects, the second ionizer is in the second airflow between the device opening and the second airflow generating means, or in the second airflow. It is a load port device characterized by being arranged on the side.

According to this aspect, even when the installation space cannot be secured inside the second airflow generating means or the like, ions can be supplied to the second airflow of the cleaning gas to eliminate static electricity or the like around the opening of the device.

An eighth aspect of the present invention has a second gas supply pipe for supplying the cleaning gas to the second airflow generating means in the second to fifth aspects, and the second ionizer is the second ionizer. It is a load port device characterized by being arranged in a gas supply pipe.

According to this aspect, by ionizing the cleaning gas reliably and evenly in the second gas supply pipe before the second air flow is formed, it is possible to more reliably and uniformly eliminate the air and the like around the opening of the apparatus. can. Further, since the ionizer is arranged on the upstream side of the second airflow generating means, for example, even if the second airflow generating means is composed of a plurality of gas nozzles, by arranging the second ionizer in the gas supply pipe common to them, the ionizer is arranged. It is not necessary to provide an ionizer for each gas nozzle, and one ionizer can supply ionized cleaning gas to all the gas nozzles.

A ninth aspect of the present invention has, in the first aspect, a common gas supply pipe for supplying the cleaning gas to the first airflow generating means and the second airflow generating means, and the ion generating means is a method. It is a load port device characterized by being arranged in the common gas supply pipe.

According to this aspect, by arranging the ionizer in the common gas supply pipe, it is possible to supply the purified gas ionized to the first airflow generating means and the second airflow generating means by one ionizer. Therefore, it is possible to save the cost and space for installing a plurality of ionizers.

In the tenth aspect of the present invention, in the first aspect, the ion generating means is arranged inside the second airflow generating means, and the second airflow supplied with ions by the ion generating means. The load port device is characterized in that ions are supplied to the first airflow by entraining at least a part of the first airflow.

According to this aspect, since a part of the second airflow of the cleaning gas supplied with ions by the ion generating means is introduced into the container on the first airflow, the ion generating means is used as the first airflow generating means. It is possible to eliminate static electricity inside the container without providing it. Further, since the cleaning gas is ionized inside the second airflow generating means before the second airflow is formed, the cleaning gas can be ionized reliably and evenly. Therefore, it is possible to more reliably and uniformly eliminate static electricity such as air around the opening of the device.

In the eleventh aspect of the present invention, in the first aspect, the ion generating means is placed in the second airflow or on the side of the second airflow between the device opening and the second airflow generating means. A load port that is arranged and is characterized in that at least a part of the second airflow supplied with ions by the ion generating means is entrained in the first airflow to supply ions to the first airflow. It is a device.

According to this aspect, since a part of the second airflow of the cleaning gas supplied with ions by the ion generating means is introduced into the container on the first airflow, the ion generating means is used as the first airflow generating means. It is possible to eliminate static electricity inside the container without providing it. Further, even when the installation space cannot be secured inside the second airflow generating means or the like, ions can be supplied to the second airflow of the cleaning gas to eliminate static electricity or the like around the opening of the device.

A twelfth aspect of the present invention has a second gas supply pipe for supplying the cleaning gas to the second airflow generating means in the first aspect, and the ion generating means is the second gas supply pipe. A load characterized in that at least a part of the second airflow supplied with ions by the ion generating means is entrained in the first airflow to supply ions to the first airflow. It is a port device.

According to this aspect, since a part of the second airflow of the cleaning gas supplied with ions by the ion generating means is introduced into the container on the first airflow, the ion generating means is used as the first airflow generating means. It is possible to eliminate static electricity inside the container without providing it. Further, by ionizing the cleaning gas reliably and evenly in the second gas supply pipe before the second air flow is formed, it is possible to more reliably and uniformly eliminate the air and the like around the opening of the device. Further, since the ionizer is arranged on the upstream side of the second airflow generating means, for example, even if the second airflow generating means is composed of a plurality of gas nozzles, by arranging the second ionizer in the gas supply pipe common to them, the ionizer is arranged. It is not necessary to provide an ionizer for each gas nozzle, and one ionizer can supply ionized cleaning gas to all the gas nozzles.

A thirteenth aspect of the present invention is the load port device according to the first to twelfth aspects, wherein the first airflow generating means is arranged on both sides of the device opening on the inner side surface. be.

According to this aspect, the ionized cleaning gas can be uniformly supplied to a plurality of wafers arranged at predetermined intervals along the vertical direction in the container, so that the wafers can be reliably supplied. It is possible to eliminate static electricity.

A fourteenth aspect of the present invention is the load port device according to the first aspect, wherein the first airflow generating means and the second airflow generating means are integrated with each other. Is.

According to this aspect, a part of the cleaning gas supplied with ions by the ion generating means is introduced into the container by the first air flow, and the other part forms the second air flow, so that the inside of the container and the apparatus. It is possible to eliminate static electricity from the air around the opening. Further, since it is necessary to separately provide the first airflow generating means and the ion generating means by having the multi-directional airflow generating means in which the first airflow generating means and the second airflow generating means are integrated, it is related to these installations. You can save cost and space.

A fifteenth aspect of the present invention is the load port device according to the fourteenth aspect, wherein the ion generating means is arranged inside the multidirectional airflow generating means.

According to this aspect, in addition to the effect of the 14th aspect, the inside of the container and the apparatus for ionizing the cleaning gas inside the multidirectional airflow generating means before the first airflow and the second airflow are formed. It is possible to more reliably and uniformly remove static electricity from the air around the opening.

A sixteenth aspect of the present invention is, in the fourteenth aspect, the ion generating means in the first airflow or a side portion of the first airflow between the device opening and the multidirectional airflow generating means. Further, the load port device is arranged in the second airflow or on the side of the second airflow between the device opening and the multi-directional airflow generating means.

According to this aspect, in addition to the effect of the 14th aspect, ions are supplied to the first airflow and the second airflow of the cleaning gas even when the installation space cannot be secured inside the multidirectional airflow generating means or the like. It is possible to eliminate static electricity and the like inside the container and around the opening of the device.

In the fourteenth aspect of the present invention, the seventeenth aspect of the present invention has a third gas supply pipe for supplying the cleaning gas to the multi-directional airflow generating means, and the ion generating means is the third gas supply pipe. It is a load port device characterized by being arranged in.

According to this aspect, in addition to the effect of the 14th aspect, the cleaning gas is ionized in the third gas supply pipe before the first air flow and the second air flow are formed, so that the inside of the container and the opening of the device are opened. It is possible to remove static electricity more reliably and uniformly from the surrounding air and the like.

FIG. 1 is a schematic view of a load port device according to an embodiment of the present invention and an EFEM including the load port device. FIG. 2 is a partial schematic perspective view of the load port device shown in FIG. FIG. 3A is a schematic view showing a cleaning and static elimination operation inside the container of the load port device according to the embodiment of the present invention. FIG. 3B is a schematic view showing a cleaning and static elimination operation inside the container of the load port device according to the embodiment of the present invention. FIG. 3C is a schematic view showing a cleaning and static elimination operation inside the container of the load port device according to the embodiment of the present invention. FIG. 4 is a schematic plan sectional view (IV-IV cross section in FIG. 3C) of a load port device having an ionizer between the device opening and the first airflow generating means. FIG. 5 is a schematic view of a load port device having an ionizer between the device opening and the second airflow generating means. FIG. 6 is a partial schematic perspective view of a load port device in which ionizers are arranged in the first gas supply pipe and the second gas supply pipe, respectively. FIG. 7 is a partial schematic perspective view of a load port device having a common gas supply pipe in which an ionizer is arranged. FIG. 8A is a partially schematic perspective view showing the flow of the first airflow and the second airflow of the load port device according to the embodiment of the present invention, and FIG. 8B is FIG. 8A. 8 (c) is a schematic plan sectional view of the above, and FIG. 8 (c) is a schematic view of the load port device shown in FIG. 8 (a) as viewed from another angle. 9 (a) is a schematic view of a load port device having a multi-directional airflow generating means and an ionizer arranged in or on the side of the first and second airflows, FIG. 9 (b). FIG. 9 (c) is a schematic view of a load port device having a multi-directional airflow generating means and an ionizer arranged inside the multi-directional airflow generating means, and FIG. 9 (c) has the multi-directional airflow generating means and is the first. It is a schematic diagram of the load port device in which an ionizer is arranged in the air flow and the second air flow, respectively.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

First, the schematic structure of the load port device 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic view of a load port device 10 according to an embodiment of the present invention and an EFEM 50 including the same, and FIG. 2 is a partial schematic perspective view of the load port device 10 shown in FIG.

As shown in FIG. 1, the EFEM (Equipment front end module) 50 has a load port device 10 and a mini-environment device 51.

The mini-environment device 51 includes a wafer transfer chamber 52, a wafer transfer machine 54, and a fan filter unit (FFU) 56. The wafer transfer machine 54 is provided in the wafer transfer chamber 52, has an arm 54a for gripping the wafer 1, and an arm drive unit (not shown) for moving the arm 54a, and is configured to be capable of transporting the wafer 1. Has been done. The wafer 1 housed inside the container 2 is conveyed to the inside of the processing chamber 70 by the wafer transfer machine 54 via the wafer transfer chamber 52 maintained in a clean state. The processing chamber 70 is a part of an apparatus that performs predetermined processing on the wafer 1, and in the processing chamber 70, predetermined processing is sequentially performed on the wafer 1 conveyed by the arm 54a. Examples of the device including the processing chamber 70 include a device used in a semiconductor manufacturing process such as a vapor deposition device, a sputtering device, and an etching device. The wafer 1 that has completed the predetermined processing in the processing chamber 70 is conveyed from the processing chamber 70 to the inside of the container 2 again by the wafer transfer machine 54.

A fan filter unit 56 is provided on the ceiling of the wafer transfer chamber 52. The fan filter unit 56 is composed of a blower fan, a dust filter (not shown), and the like, and supplies clean air downflow to the inside of the wafer transfer chamber 52 to provide a local clean environment inside the wafer transfer chamber 52. To form.

The wafer transfer chamber 52 is a space for connecting the container 2 for transporting the wafer 1 and the processing chamber 70. At the end of the wafer transfer chamber 52, a load port device 10 is incorporated so as to close the opening formed in the outer wall thereof.

The load port device 10 is an interface device for transferring the wafer 1 housed inside the container 2 in a sealed state to the inside of the wafer transfer chamber 52 while maintaining a clean state. The load port device 10 has a mounting table 12 and a movable table 14. The movable table 14 is arranged on the mounting table 12 and is configured to be movable in the X-axis direction with respect to the mounting table 12. A container 2 is detachably placed on the upper portion of the movable table 14.

The container 2 is, for example, a hoop (FOUP) for sealing and storing and transporting a plurality of wafers 1. As shown in FIG. 1, a space for accommodating the wafer 1 is formed inside the container 2. The container 2 has a substantially box-like shape, and one of the plurality of side surfaces of the container 2 is formed with a main opening 2a for loading and unloading the wafer 1 housed inside the container 2. .. Further, the container 2 is provided with a lid 4 for sealing the main opening 2a.

Inside the container 2, a shelf (not shown) having a plurality of stages for accommodating a plurality of wafers 1 in an stacked manner so as not to come into contact with each other is provided. The wafer 1 is held horizontally by arranging one wafer on each stage of the shelf, and is housed in the container 2 with a predetermined interval along the vertical direction (Z-axis direction). ..

The load port device 10 further includes a wall portion 11 in which the device opening 13 is formed, and a door 18 that opens and closes the main opening 2a of the container 2. As shown in FIG. 2, the wall portion 11 has an outer surface 11b facing the container 2 mounted on the mounting table 12 and an inner side surface 11a opposite to the outer surface 11b, and the wafer is conveyed. It functions as a part of the outer wall that seals the chamber 52. As shown in FIG. 3A, the movable table 14 is moved in the positive direction of the X-axis, and the opening edge 2b of the container 2 to which the lid 4 is attached is fitted into the inside of the device opening 13, so that the device opening 13 becomes the main opening. Connected to 2a. The shapes of the main opening 2a and the device opening 13 are not particularly limited, but are usually substantially rectangular.

After the device opening 13 and the main opening 2a are connected, as shown in FIG. 3B, the door 18 of the load port device 10 is in the X-axis positive direction (wafer transfer chamber 52) together with the lid 4 closing the main opening 2a. The lid 4 is removed from the main opening 2a by moving to the inside). In the load port device 10, the door 18 opens the main opening 2a of the container 2 so that the inside of the container 2 and the wafer transfer chamber 52 communicate with each other through the main opening 2a and the device opening 13.

The load port device 10 further includes a bottom gas introduction unit 5 that introduces a cleaning gas from the bottom surface of the container 2 into the inside of the container 2. The bottom gas introduction unit 5 has a gas introduction nozzle that protrudes from the movable table 14 and can be connected to the bottom hole provided in the bottom surface of the container 2, and the cleaning gas is introduced into the container 2 from the bottom hole. do. The bottom gas introduction unit 5 can introduce the cleaning gas into the inside of the container 2 in a state where the main opening 2a of the container 2 is closed by the lid 4, but not only in such a case, the container 2 can be introduced. The cleaning gas can be introduced into the inside of the container 2 even when the inside of the container 2 and the wafer transfer chamber 52 communicate with each other. Purifying gas is supplied to the bottom gas introduction section 5 via a piping section (not shown). The type of the cleaning gas introduced into the container 2 by the bottom gas introduction unit 5 is not particularly limited, but for example, nitrogen gas or the like is preferably used.

As shown in FIG. 2, the load port device 10 has a front gas introduction unit 20 that introduces a cleaning gas into the inside of the container 2 from the main opening 2a of the container 2. The front gas introduction portion 20 has a gas purge nozzle 20a as a first airflow generating means provided on the inner side surface 11a side of the wall portion 11. As shown in FIG. 3C, the gas purge nozzle 20a is a state in which the inside of the container 2 and the wafer transfer chamber 52 communicate with each other from the inner side surface 11a side of the wall portion 11 through the device opening 13 and the main opening 2a. A first air flow F1 of the cleaning gas flowing into the inside is generated.

As shown in FIG. 2, gas purge nozzles 20a are provided on both side portions 13a of the device opening 13 on the inner side surface 11a of the wall portion 11. Further, the nozzle opening of the gas purge nozzle 20a is arranged toward the main opening 2a in order to introduce the cleaning gas into the container 2. The position of the gas purge nozzle 20a is not limited to both side portions 13a of the device opening 13, and may be any position as long as the cleaning gas can be introduced into the inside of the container 2. For example, the gas purge nozzle 20a may be arranged above or below the device opening 13, or at the door 18.

The cleaning gas is supplied to the gas purge nozzle 20a from a supply source of cleaning gas (not shown) via the first gas supply pipe 21. The type of the cleaning gas introduced into the container 2 by the front gas introduction unit 20 is not particularly limited, but for example, nitrogen gas or the like is preferably used.

As shown in FIG. 3B, the load port device 10 is a downflow forming portion that forms a downflow of cleaning gas from above the device opening 13 on the inner side surface 11a side of the wall portion 11 along the opening surface of the device opening 13. Has 30. When the front purge is performed, the downflow of the cleaning gas is formed by the downflow forming unit 30, so that the air in the wafer transfer chamber 52 can be effectively prevented from entering the inside of the container 2.

The downflow forming portion 30 has a curtain nozzle 30a as a second airflow generating means provided above the device opening 13 on the inner side surface 11a side of the wall portion 11, and the curtain nozzle 30a is the device opening 13. A second air flow F2 of the cleaning gas flowing vertically downward (Z-axis negative direction) along the opening surface is generated. As shown in FIG. 2, the curtain nozzle 30a is provided so as to project into the wafer transfer chamber 52 from the inner side surface 11a above the device opening 13. Further, the nozzle opening of the curtain nozzle 30a is arranged vertically downward (Z-axis negative direction) so as to form a downflow. The cleaning gas is supplied to the curtain nozzle 30a from the cleaning gas supply source via the second gas supply pipe 31. The type of the cleaning gas that forms the downflow is not particularly limited, but for example, nitrogen gas or the like is preferably used.

As shown in FIG. 2, the load port device 10 supplies ions to the cleaning gas forming the first airflow F1 (see FIG. 3C) and the cleaning gas forming the second airflow F2 (see FIG. 3B). It has a generating means 40. The ion generating means 40 includes a first ionizer 40a that supplies ions to the cleaning gas that forms the first airflow F1, and a second ionizer 40b that supplies ions to the cleaning gas that forms the second airflow F2.

As shown in FIG. 2, the first ionizer 40a is arranged inside the gas purge nozzle 20a (for example, an inner wall or the like). The first ionizer 40a is provided with, for example, a discharge needle, and is configured to ionize the surrounding gas by a corona discharge generated by applying a high voltage between the discharge needle and the counter electrode. The cleaning gas ionized by the first ionizer 40a inside the gas purge nozzle 20a is discharged from the nozzle opening of the gas purge nozzle 20a and introduced into the container 2 through the device opening 13 and the main opening 2a. As a result, ions can be supplied to the inside of the container 2 to clean the inside of the container 2 and the wafer 1 housed therein while eliminating static electricity.

As shown in FIG. 2, the second ionizer 40b is arranged inside the curtain nozzle 30a (for example, an inner wall or the like). The second ionizer 40b is configured to ionize the surrounding gas by corona discharge, for example, like the first ionizer 40a. The cleaning gas ionized by the second ionizer 40b inside the curtain nozzle 30a is discharged from the nozzle opening of the curtain nozzle 30a and flows down along the opening surface of the device opening 13 as shown in FIG. 3B. The second airflow F2 is formed. The second air flow F2 can eliminate static electricity in a region outside the container 2 that may affect the quality of the wafer 1 while preventing the air in the wafer transfer chamber 52 from entering the inside of the container 2. .. That is, the second airflow F2 can eliminate static electricity around the device opening 13 in the wafer transfer chamber 52 that may enter the container 2. In addition, the second airflow F2 can eliminate static electricity from the lid 4, the door 18, the purge nozzle 20a, and the like, and remove contaminants and the like adhering to them.

The drive of the first ionizer 40a and the second ionizer 40b is controlled by a control unit (not shown) of the load port device 10. The control unit of the load port device 10 sends a control signal to the first ionizer 40a and the second ionizer 40b, and controls the on / off of the first ionizer 40a and the second ionizer 40b. For example, when the first ionizer 40a and the second ionizer 40b receive the on signal of the ionizer from the control unit of the load port device 10, a high voltage is applied to the discharge needles of the first ionizer 40a and the second ionizer 40b to ionize the first ionizer 40a and the second ionizer 40b. To start. Further, when the first ionizer 40a and the second ionizer 40b receive the ionizer off signal from the control unit of the load port device 10, the first ionizer 40a and the second ionizer 40b terminate the voltage application to the discharge needles of the first ionizer 40a and the second ionizer 40b. Stop ionization.

Hereinafter, the static elimination operation inside the container 2 of the load port device 10 will be described with an example. The static elimination operation is started at the timing when the lid 4 is removed from the main opening 2a of the container 2 by the door 18 and the main opening 2a is opened, for example, as shown in FIG. 3B. When the static elimination operation is started, the control unit of the load port device 10 transmits an ionizer on signal to the first ionizer 40a and the second ionizer 40b shown in FIG. 2, and the discharge needles of the first ionizer 40a and the second ionizer 40b are transmitted. High voltage is applied to.

Subsequently, as shown in FIG. 3B, the cleaning gas is discharged from the nozzle openings of the gas purge nozzle 20a and the curtain nozzle 30a, and the first airflow F1 (front purge) and the second airflow F2 (downflow) are formed. At this time, as shown in FIG. 2, the first ionizer 40a inside the gas purge nozzle 20a and the second ionizer 40b inside the curtain nozzle 30a refer to the cleaning gas in each of the nozzles 20a and 30a. , Ions are supplied. Therefore, as shown in FIG. 3B, the first air flow F1 of the cleaning gas supplied with ions by the first ionizer 40a is introduced into the container 2 through the device opening 13 and the main opening 2a, and is also introduced into the container 2. The second airflow F2 of the cleaning gas supplied with ions by the ionizer 40b flows down along the opening surface of the device opening 13 to form a downflow. As a result, the wafer 1 inside the container 2 is statically eliminated and cleaned, and at the outside of the container 2 such as the air around the device opening 13 which may enter the container 2 and the lid 4, the door 18, and the purge nozzle 20a. Static elimination and contaminant removal are performed in areas that may affect the quality of the wafer 1.

Next, as shown in FIG. 3C, the control unit of the load port device 10 moves the lid 4 together with the door 18 vertically downward (Z-axis negative direction). When the main opening 2a of the container 2 is completely opened, the arm 54a of the wafer transfer machine 54 takes out the wafer 1 from the inside of the container 2 through the device opening 13 and the main opening 2a and conveys the wafer 1 into the wafer transfer chamber 52. The load port device 10 continues to form the first airflow F1 and the second airflow F2 of the cleaning gas containing ions while the main opening 2a is open even during the transfer operation of the wafer 1 by the wafer transfer machine 54. do. As a result, it is possible to prevent the air in the wafer transfer chamber 52 from flowing into the container 2, keep the inside of the container 2 in a clean environment, and prevent damage to the wafer 1 due to electric discharge. When the transfer work of the wafer 1 is completed, the control unit of the load port device 10 closes the main opening 2a of the container 2 with the lid 4 by the door 18 and stops the discharge of the cleaning gas by the gas purge nozzle 20a and the curtain nozzle 30a. .. Further, the control unit of the load port device 10 transmits an ionizer off signal to the first ionizer 40a and the second ionizer 40b, and the supply of ions by the first ionizer 40a and the second ionizer 40b is stopped.

Although the first embodiment of the load port device 10 according to the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. be.

FIG. 4 is a cross-sectional view showing the load port device 110 according to the first modification in an enlarged manner around the device opening 13. Since the load port device 110 is the same as the load port device 10 according to the first embodiment except that the position of the first ionizer 140a is different, the load port device 110 is different from the load port device 10. Only explain.

As shown in FIG. 4, the first ionizer 140a of the load port device 110 is arranged in the first airflow F1 between the device opening 13 and the gas purge nozzle 120a.

In this modification, the cleaning gas discharged from the nozzle opening of the gas purge nozzle 120a in the front gas introduction unit 120 is ionized by the first ionizer 140a and then introduced into the container 2 through the device opening 13 and the main opening 2a. To. Therefore, even if the installation space for the ionizer cannot be secured inside the gas purge nozzle 120a, ions can be supplied to the first airflow F1 of the cleaning gas to eliminate static electricity inside the container 2 as in the load port device 10.

The first ionizer 140a may be integrally connected to the gas purge nozzle 120a (for example, a nozzle surface or the like), or may be arranged separately from the gas purge nozzle 120a. Further, the first ionizer 140a may be arranged on the side of the first airflow F1 and may be configured to supply the gas ionized by the first ionizer 140a to the first airflow F1.

FIG. 5 is a schematic view showing the load port device 210 according to the second modification in an enlarged manner around the device opening 13. Since the load port device 210 is the same as the load port device 10 according to the first embodiment except that the position of the second ionizer 240b is different, the load port device 210 is different from the load port device 10. Only explain.

As shown in FIG. 5, the second ionizer 240b of the load port device 210 is arranged in the second airflow F2 between the device opening 13 and the curtain nozzle 230a.

In this modification, the cleaning gas discharged from the nozzle opening of the curtain nozzle 230a is ionized by the second ionizer 240b and forms a second air flow F2 along the opening surface of the device opening 13. Therefore, even if the installation space for the ionizer cannot be secured inside the curtain nozzle 230a, ions are supplied to the second airflow F2 of the cleaning gas to eliminate static electricity and the like around the device opening 13 as in the load port device 10. be able to.

The second ionizer 240b may be integrally connected to the curtain nozzle 230a (for example, a nozzle surface or the like), or may be arranged separately from the curtain nozzle 230a. Further, the second ionizer 240b may be arranged on the side of the second airflow F2 and may be configured to supply the gas ionized by the second ionizer 240b to the second airflow F2.

FIG. 6 is a partial schematic perspective view of the load port device 310 according to the third modification. Since the load port device 310 is the same as the load port device 10 according to the first embodiment except that the positions of the first ionizer 340a and the second ionizer 340b are different, the load port device 310 is the load port device. Only the differences from 10 will be described.

As shown in FIG. 6, the first ionizer 340a of the load port device 310 is arranged in the first gas supply pipe 21 that supplies the cleaning gas from the supply source of the cleaning gas to the gas purge nozzle 320a. Further, the second ionizer 340b of the load port device 310 is arranged in the second gas supply pipe 31 that supplies the cleaning gas from the supply source of the cleaning gas to the curtain nozzle 330a.

In this modification, the cleaning gas is reliably and evenly ionized in the first gas supply pipe 21, and then the first air flow F1 is formed. Therefore, the inside of the container 2 can be more reliably and uniformly statically eliminated. Further, after the cleaning gas is surely and evenly ionized in the second gas supply pipe 31, the second air flow F2 is formed. Therefore, the air or the like around the device opening 13 can be more reliably and uniformly statically eliminated.

The configuration in which the first ionizer 340a is arranged in the first gas supply pipe 21 and the configuration in which the second ionizer 340b is arranged in the second gas supply pipe 31 can be implemented as mutually independent configurations. .. For example, the first ionizer 340a may be arranged in the first gas supply pipe 21, and the second ionizer 340b may be arranged inside the curtain nozzle 330a. Further, for example, the first ionizer 340a may be arranged inside the gas purge nozzle 320a, and the second ionizer 340b may be arranged in the second gas supply pipe 31.

FIG. 7 is a partial schematic perspective view of the load port device 410 according to the fourth modification. Since the load port device 410 is the same as the load port device 10 according to the first embodiment except that the forms of the ion generating means 440 and the gas supply pipe are different, the load port device 410 is the load port device 10. Only the differences from the above will be explained.

As shown in FIG. 7, the ion generating means 440 of the load port device 410 is arranged in a common gas supply pipe 32 that supplies the cleaning gas from the cleaning gas supply source to the gas purge nozzle 420a and the curtain nozzle 430a.

In this modification, by arranging the ion generating means 440 in the common gas supply pipe 32, it is possible to supply the purified gas ionized to the gas purge nozzle 420a and the curtain nozzle 430a by one ion generating means 440. Therefore, it is possible to save the cost and space for installing a plurality of ion generating means.

FIG. 8 is a schematic view of the load port device 510 according to the fifth modification. Since the load port device 510 is the same as the load port device 10 according to the first embodiment except that the form of the ion generating means 540 is different, the load port device 510 is different from the load port device 10. Only explain.

As shown in FIG. 8A, the ion generating means 540 of the load port device 510 is arranged inside the curtain nozzle 530a.

In this modification, as shown in FIGS. 8 (a), 8 (b) and 8 (c), at least a part of the second air flow F2 of the cleaning gas supplied with ions by the ion generating means 540 is By being involved in the first airflow F1, ions are supplied to the first airflow F1. The ions supplied from the second airflow F2 to the first airflow F1 are introduced into the container 2 on the first airflow F1, so that the inside of the container 2 and the wafer 1 housed therein are statically eliminated. That is, in this modification, the ion generating means is provided only in the curtain nozzle 530a without providing the ionizer in the gas purge nozzle 520a, thereby saving the cost and space for installing the ionizer, and similarly to the load port device 10. It is possible to eliminate static electricity and the like inside the container 2 and around the device opening 13.

In this modification, the position of the ion generating means 540 is not limited to the inside of the curtain nozzle 530a. For example, the ion generating means 540 may be arranged in the second airflow F2 between the device opening 13 and the curtain nozzle 530a or on the side of the second airflow F2, or may be arranged from the source of the cleaning gas to the curtain nozzle 530a. It may be arranged in the second gas supply pipe 31 which supplies the cleaning gas to.

FIG. 9 is a schematic view of the load port device 610 according to the sixth modification. Since the load port device 610 is the same as the load port device 10 according to the first embodiment except that it has the multi-directional airflow generating means 35, the load port device 610 is different from the load port device 10. Only explain.

As shown in FIGS. 9 (a), 9 (b) and 9 (c), in the load port device 610, the first air flow generating means and the second air flow generating means are integrated (that is, the first one). It has a multi-directional airflow generating means 35 (which generates an airflow F1 and a second airflow F2). The multi-directional airflow generating means 35 is arranged above the device opening 13 on the inner side surface 11a side of the wall portion 11 like the curtain nozzle 30a of the load port device 10, and is the first cleaning gas toward the inside of the container 2. Along with forming the air flow F1, a second air flow F2 of the cleaning gas flowing down along the opening surface of the device opening 13 is formed.

In this modification, the ion generating means 640 is arranged inside the multidirectional airflow generating means 35 as shown in FIG. 9A. A part of the cleaning gas supplied with ions by the ion generating means 640 is introduced into the container 2 by the first air flow F1, and the other part forms the second air flow F2, so that it is the same as the load port device 10. It is possible to eliminate static electricity and the like inside the container 2 and around the device opening 13. Furthermore, since the gas purge nozzle and the curtain nozzle are integrated, it is not necessary to separately provide a purge nozzle, and since a plurality of ion generation means are not required, the cost and space for these installations can be saved. can.

In this modification, the position of the ion generating means 640 is not limited to the inside of the multidirectional airflow generating means 35. For example, as shown in FIG. 9B, the ion generating means 640 may be arranged in the second airflow F2 between the device opening 13 and the multidirectional airflow generating means 35 or on the side of the second airflow F2. Alternatively, as shown in FIG. 9C, it may be arranged in the third gas supply pipe that supplies the cleaning gas from the supply source of the cleaning gas to the multidirectional airflow generating means 35.

1: Wafer 2: Container 2a: Main opening 2b: Opening edge 4: Lid 5: Bottom gas introduction part 10, 110, 210, 310, 410, 510, 610: Load port device 11: Wall part 11a: Inner side surface 11b: Outer Side surface 12: Mounting table 13: Device opening 13a: Both sides 14: Movable table 18: Door 20, 120: Front gas introduction part 20a, 120a, 320a, 420a, 520a: Gas purge nozzle 21: First gas supply pipe 30, 230 : Downflow forming portions 30a, 230a, 330a, 430a, 530a: Curtain nozzle 31: Second gas supply pipe 32: Common gas supply pipe 35: Multidirectional airflow generating means 40, 440, 540, 640: Ion generating means
40a, 140a, 340a: 1st ionizer 40b, 240b, 340b: 2nd ionizer 50: EFEM
51: Mini-environment device 52: Wafer transfer chamber 54: Wafer transfer machine 54a: Arm 56: Fan filter unit 70: Processing chamber F1: First airflow F2: Second airflow

Claims (17)

A mounting table on which a container with a main opening for loading and unloading wafers is formed on the side surface is placed.
A wall portion in which a device opening communicating with the main opening is formed and has an outer surface facing the container and an inner surface opposite to the outer surface mounted on the above-mentioned table.
A door that opens and closes the main opening,
A first airflow generating means for generating a first airflow of cleaning gas introduced into the inside of the container from the inner side surface side of the wall portion through the device opening and the main opening.
A second airflow generating means for generating a second airflow of cleaning gas flowing down along the opening surface of the device opening from above the device opening on the inner side surface side of the wall portion.
It has an ion generating means for supplying ions to the cleaning gas forming the first airflow and the cleaning gas forming the second airflow.
The ion generating means includes a first ionizer that supplies ions to the cleaning gas that forms the first air flow, and a second ionizer that supplies ions to the cleaning gas that forms the second air flow. Load port device. The load port device according to claim 1 , wherein the first ionizer is arranged inside the first airflow generating means. The load according to claim 1 , wherein the first ionizer is arranged in the first airflow or on a side portion of the first airflow between the device opening and the first airflow generating means. Port device. It has a first gas supply pipe for supplying the cleaning gas to the first airflow generating means, and has a first gas supply pipe.
The load port device according to claim 1 , wherein the first ionizer is arranged in the first gas supply pipe. The load port device according to any one of claims 1 to 4 , wherein the second ionizer is arranged inside the second airflow generating means. The second ionizer is any of claims 1 to 4 , wherein the second ionizer is arranged in the second airflow between the device opening and the second airflow generating means or on a side portion of the second airflow. The load port device described in Crab. The second airflow generating means has a second gas supply pipe for supplying the cleaning gas.
The load port device according to any one of claims 1 to 4 , wherein the second ionizer is arranged in the second gas supply pipe. It has a common gas supply pipe that supplies cleaning gas to the first airflow generating means and the second airflow generating means.
The load port device according to claim 1, wherein the ion generating means is arranged in the common gas supply pipe. The ion generating means is arranged inside the second airflow generating means.
The load according to claim 1, wherein at least a part of the second airflow supplied with ions by the ion generating means is entrained in the first airflow to supply ions to the first airflow. Port device. The ion generating means is arranged in the second airflow or on the side of the second airflow between the device opening and the second airflow generating means.
The load according to claim 1, wherein at least a part of the second airflow supplied with ions by the ion generating means is entrained in the first airflow to supply ions to the first airflow. Port device. The second airflow generating means has a second gas supply pipe for supplying the cleaning gas.
The ion generating means is arranged in the second gas supply pipe, and is arranged in the second gas supply pipe.
The load according to claim 1, wherein at least a part of the second airflow supplied with ions by the ion generating means is entrained in the first airflow to supply ions to the first airflow. Port device. The load port device according to any one of claims 1 to 11 , wherein the first airflow generating means is arranged on both sides of the device opening on the inner surface. The load port device according to claim 1, further comprising a multi-directional airflow generating means in which the first airflow generating means and the second airflow generating means are integrated. The load port device according to claim 13 , wherein the ion generating means is arranged inside the multidirectional airflow generating means. The ion generating means is in the first airflow between the device opening and the multidirectional airflow generating means or a side portion of the first airflow, and between the device opening and the multidirectional airflow generating means. 13. The load port device according to claim 13 , wherein the load port device is arranged in the second airflow or on the side of the second airflow. It has a third gas supply pipe that supplies the cleaning gas to the multi-directional airflow generating means, and has a third gas supply pipe.
The load port device according to claim 13 , wherein the ion generating means is arranged in the third gas supply pipe. A mounting table on which a container with a main opening for loading and unloading wafers is formed on the side surface is placed.
A wall portion in which a device opening communicating with the main opening is formed and has an outer surface facing the container and an inner surface opposite to the outer surface mounted on the above-mentioned table.
A door that opens and closes the main opening,
A first airflow generating means for generating a first airflow of cleaning gas introduced into the inside of the container from the inner side surface side of the wall portion through the device opening and the main opening.
A second airflow generating means for generating a second airflow of cleaning gas flowing down along the opening surface of the device opening from above the device opening on the inner side surface side of the wall portion.
It has an ion generating means for supplying ions to the cleaning gas forming the first airflow and the cleaning gas forming the second airflow.
It has a multi-directional airflow generating means in which the first airflow generating means and the second airflow generating means are integrated.
It has a third gas supply pipe that supplies the cleaning gas to the multi-directional airflow generating means, and has a third gas supply pipe.
The load port device, wherein the ion generating means is arranged in the third gas supply pipe.

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