JP7059553B2 - Adhesive tape for stealth dicing, dicing die bonding integrated tape, and method for manufacturing semiconductor devices - Google Patents

Description

The present invention relates to an adhesive tape for dicing and a tape integrated with dicing die bonding.

Conventionally, a semiconductor device is manufactured through the following steps. First, the semiconductor wafer is attached to the adhesive sheet for dicing, and the semiconductor wafer is separated into semiconductor chips in that state. After that, an expanding step, a pick-up step, a mounting step, a reflow step, a die bonding step and the like are carried out.

In recent years, as a method of obtaining a semiconductor chip by dividing a semiconductor wafer, a process of processing a groove to be a crease without completely cutting the semiconductor wafer, or irradiating the inside of a semiconductor wafer on a planned cutting line with laser light. A method of dividing the semiconductor wafer by applying an external force to the semiconductor wafer after carrying out the step of forming the modified region has been proposed. The former is called half-cut dicing, and the latter is called stealth dicing (see, for example, Patent Documents 1 and 2).

Japanese Patent No. 4358502 Japanese Unexamined Patent Publication No. 2009-164556

The above-mentioned Patent Document 2 discloses an embodiment in which stealth dicing is performed using a wafer processing tape provided with an adhesive tape and an adhesive film. According to the invention described in Patent Document 2, by carrying out the expansion under a low temperature condition of -15 to 5 ° C., the adhesive film can be attached to individual chips while maintaining the high breakability of the adhesive film. Correspondingly, it is said that it can be divided well. However, according to the studies by the present inventors, when the expansion is carried out under low temperature conditions, the adhesive tape is not sufficiently stretched, and necking tends to occur easily. When the adhesive tape is necked, the extensibility of the tape becomes non-uniform between the end portion and the center portion of the semiconductor wafer, and it becomes difficult to obtain good breakability. In addition, the adhesive tape conventionally used for stealth dicing has room for improvement in the pick-up property of the semiconductor chip.

The present invention has been made in view of the above problems, and is for dicing that can achieve both the fragmentability of a semiconductor wafer and the pick-up property of a semiconductor chip at a sufficiently high level in a manufacturing process of a semiconductor device including stealth dicing. It is an object of the present invention to provide an adhesive tape and a dicing die bonding integrated tape.

The present invention provides an adhesive tape for dicing. This pressure-sensitive adhesive tape includes at least a base material layer and a pressure-sensitive adhesive layer provided on the base material layer, and the pressure-sensitive adhesive layer contains a (meth) acrylic resin, a photopolymerization initiator, and a cross-linking agent. At the same time, the storage elastic modulus at −15 ° C. is 40 MPa or more (Condition 1) before the curing treatment by ultraviolet irradiation, and the storage elastic modulus at 25 ° C. is 100 MPa or more (Condition 2) after the curing treatment by ultraviolet irradiation. Is.

According to the adhesive tape according to the present invention, the adhesive layer satisfies the above-mentioned conditions (conditions 1 and 2) for the storage elastic modulus, so that the fragmentability of the semiconductor wafer and the semiconductor in the manufacturing process of the semiconductor device including stealth dicing are satisfied. Both chip pick-up properties can be achieved to a sufficiently high level.

From the viewpoint of obtaining the above-mentioned effects according to the present invention more stably, it is preferable that the (meth) acrylic resin has one or more aromatic rings. From the same viewpoint, the (meth) acrylic resin preferably contains a functional group capable of chain polymerization, and the functional group is preferably at least one selected from an acryloyl group and a methacryloyl group.

In the present invention, as the cross-linking agent, for example, a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule can be adopted. In the present invention, for example, a photoradical polymerization initiator can be adopted as the photopolymerization initiator.

The present invention provides a dicing die bonding integrated tape. The integrated tape includes the pressure-sensitive adhesive sheet and an adhesive layer provided on the pressure-sensitive adhesive layer included in the pressure-sensitive adhesive sheet. According to this integrated tape, the pressure-sensitive adhesive layer satisfies the above-mentioned conditions (conditions 1 and 2) for the storage elastic modulus, so that in the manufacturing process of the semiconductor device including stealth dicing, the fragmentability of the semiconductor wafer and the fragmentation of the semiconductor chip can be obtained. Both pick-up properties can be achieved to a sufficiently high level.

According to the present invention, in the manufacturing process of a semiconductor device including stealth dicing, a dicing adhesive tape and a dicing die bonding integrated tape capable of achieving both the splitting property of a semiconductor wafer and the pick-up property of a semiconductor chip at a sufficiently high level are provided. Provided.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding integrated tape according to the present invention. FIG. 2 is a cross-sectional view schematically showing an embodiment of the adhesive tape for dicing according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding parts will be designated by the same reference numerals, and duplicate description will be omitted. The present invention is not limited to the following embodiments. As used herein, the term (meth) acrylic means acrylic or methacrylic.

FIG. 1 is a cross-sectional view schematically showing a dicing die bonding integrated tape according to the present embodiment. The dicing die bonding integrated tape 10 (hereinafter, may be simply referred to as “tape 10”) shown in the figure includes a base material layer 1, an adhesive layer 3 provided on the base material layer 1, and an adhesive. It includes an adhesive layer 5 provided on the layer 3. The pressure-sensitive adhesive layer 3 is effective in a step of individualizing a semiconductor wafer (particularly an expanding step under low temperature conditions) and a pick-up step in a manufacturing process of a semiconductor device including stealth dicing. The adhesive layer 5 is effective in the process of adhering a semiconductor chip obtained through stealth dicing to a substrate or the like.

<Adhesive layer>
The pressure-sensitive adhesive layer 3 contains a (meth) acrylic resin, a photopolymerization initiator, and a cross-linking agent, and satisfies both the following conditions 1 and 2 with respect to the storage elastic modulus.
(Condition 1)
Before the curing treatment by ultraviolet irradiation, the storage elastic modulus at −15 ° C. is 40 MPa or more.
(Condition 2)
After the curing treatment by ultraviolet irradiation, the storage elastic modulus at 25 ° C. is 100 MPa or more.

Regarding condition 1, if the storage elastic modulus at −15 ° C. is less than 40 MPa before the curing treatment of the pressure-sensitive adhesive layer 3 by irradiation with ultraviolet rays, the pressure-sensitive adhesive layer 3 is used as a dicing tape under low temperature conditions (for example, -15). When the expanding step is carried out at (° C. to −5 ° C.), since the adhesive layer 3 is soft, necking is likely to occur on the adhesive tape, and a part of the semiconductor wafer and the dicing film is undivided, resulting in a pickup failure. The storage elastic modulus is preferably 40 to 200 MPa, more preferably 50 to 150 MPa, and even more preferably 60 to 100 MPa. If the storage elastic modulus at −15 ° C. is 200 MPa or more before the curing treatment of the pressure-sensitive adhesive layer 3 by irradiation with ultraviolet rays, peeling may occur between the pressure-sensitive adhesive layer 3 and the adhesive layer 5 during expansion. This phenomenon is called "DAF (Die Attach Film) jump".

Regarding condition 2, if the storage elastic modulus at 25 ° C. is less than 100 MPa after the curing treatment of the adhesive layer 3 by ultraviolet irradiation, the peelability between the adhesive layer 5 and the adhesive layer 3 becomes insufficient and the adhesive layer 3 is pushed up. The impact of the pin is absorbed and the pickup becomes defective. The storage elastic modulus is preferably 100 to 500 MPa, more preferably 120 to 300 MPa, and even more preferably 150 to 250 MPa.

The pressure-sensitive adhesive layer 3 satisfying both the above conditions 1 and 2 can be formed by using a pressure-sensitive adhesive composition containing a specific (meth) acrylic resin. Hereinafter, the components contained in the pressure-sensitive adhesive composition will be described in detail.

[(Meta) acrylic resin]
The (meth) acrylic resin can be obtained by synthesizing it by a known method. Examples of the synthesis method include a solution polymerization method, a suspension polymerization method, an emulsion polymerization method, a bulk polymerization method, a precipitation polymerization method, a vapor phase polymerization method, a plasma polymerization method, and a supercritical polymerization method. The types of polymerization reactions include radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anionic polymerization, coordination polymerization, immodal polymerization, etc., as well as ATRP (atomic transfer radical polymerization) and RAFT (Atomic transfer radical polymerization). Techniques such as reversible additional cleavage chain transfer polymerization) can also be mentioned. Among these, synthesizing by radical polymerization using a solution polymerization method has good economic efficiency, high reaction rate, easy polymerization control, and can be blended by using the resin solution obtained by polymerization as it is. It has advantages such as.

Here, a method for synthesizing a (meth) acrylic resin will be described in detail by taking as an example a method of obtaining a (meth) acrylic resin by radical polymerization using a solution polymerization method.

The monomer used for synthesizing the (meth) acrylic resin is not particularly limited as long as it has one (meth) acryloyl group in one molecule. Specific examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, and isoamyl (meth) acrylate. , Hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) Acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol ( Acrylate (meth) acrylates such as meth) acrylates, methoxypolypropylene glycol (meth) acrylates, ethoxypolypropylene glycol (meth) acrylates, mono (2- (meth) acryloyloxyethyl) succinates; cyclopentyl (meth) acrylates, cyclohexyl (meth) acrylates, cyclopentyl (meth) acrylates, and cyclopentyl (meth) acrylates. Meta) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono ( Alicyclic (meth) acrylates such as 2- (meth) acryloyloxyethyl) hexahydrophthalate; benzyl (meth) acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate , 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) ) Acrylate, Phenoxypolyethylene glycol (meth) acrylate, Nonylphenoxypolyethylene glycol (meth) acrylate, Phenoxypolypropylene glycol (meth) acrylate, 2-Hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydro Xi-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl (meth) acrylate, etc. Aromatic (meth) acrylates; 2-tetrahydrofurfuryl (meth) acrylates, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) acryloyloxyethyl-N-carbazole and the like. Meta) acrylates, modified caprolactones of these, ω-carboxy-polycaprolactone mono (meth) acrylates, glycidyl (meth) acrylates, α-ethylglycidyl (meth) acrylates, α-propyl glycidyl (meth) acrylates, α-butyl glycidyl (Meta) acrylate, 2-methylglycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl ( Meta) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl Compounds having an ethylenically unsaturated group such as ether and an epoxy group; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2- (2-) Ethyl-2-oxetanyl) ethyl (meth) acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2) -A compound having an ethylenically unsaturated group and an oxetanyl group such as methyl-2-oxetanyl) propyl (meth) acrylate; a compound having an ethylenically unsaturated group and an isocyanate group such as 2- (meth) acryloyloxyethyl isocyanate; Ethylene such as -hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate Examples thereof include compounds having a sex unsaturated group and a hydroxyl group. The desired (meth) acrylic resin can be obtained by appropriately combining them.

The (meth) acrylic resin preferably has one or a plurality of aromatic rings from the viewpoint that the pressure-sensitive adhesive layer 3 satisfying the above conditions 1 and 2 can be easily obtained. In this case, as the monomer for synthesizing the (meth) acrylic resin, styrene, α-methylstyrene, α-ethylstyrene, α-propylstyrene, α-isopropylstyrene, α-butylstyrene, α-isobutylstyrene, α -Tert-Butyl styrene, 2-methyl styrene, 4-methyl styrene, 2-ethyl styrene, 4-ethyl styrene, 2-propyl styrene, 4-propyl styrene, 2-isopropyl styrene, 4-isopropyl styrene, 2-butyl styrene , 4-butyl styrene, 2-isobutyl styrene, 4-isobutyl styrene, 2-tert-butyl styrene, 4-tert-butyl styrene, benzyl (meth) acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) Acrylic, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2- From hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl (meth) acrylate It is preferable to use one selected type alone or in combination of two or more types.

The (meth) acrylic resin preferably has at least one functional group selected from a hydroxyl group, a glycidyl group, an amino group and the like as a reaction point with a functional group-introducing compound or a cross-linking agent described later. Examples of the monomer for synthesizing the (meth) acrylic resin having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 3-chloro-2. -Examples include compounds having an ethylenically unsaturated group and a hydroxyl group such as hydroxypropyl (meth) acrylate and 2-hydroxybutyl (meth) acrylate, and these may be used alone or in combination of two or more. Can be done.

Examples of the monomer for synthesizing a (meth) acrylic resin having a glycidyl group include glycidyl (meth) acrylate, α-ethylglycidyl (meth) acrylate, α-propyl glycidyl (meth) acrylate, and α-butyl glycidyl (meth). Acrylate, 2-Methylglycidyl (meth) acrylate, 2-Ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxide butyl (meth) acrylate, 3,4-epoxide heptyl (meth) acrylate , Α-Ethyl-6,7-epoxide heptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, etc. Examples thereof include compounds having an ethylenically unsaturated group and an epoxy group, and these can be used alone or in combination of two or more.

The (meth) acrylic resin synthesized from these monomers preferably contains a functional group capable of chain polymerization. The chain-polymerizable functional group is, for example, at least one selected from an acryloyl group and a methacryloyl group. The chain-growth-polymerizable functional group is introduced into the (meth) acrylic resin, for example, by reacting the (meth) acrylic resin synthesized as described above with the following compound (functional group-introduced compound). be able to. Specific examples of the functional group-introduced compound include 2-methacryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloylisocyanate, allylisocyanate, 1,1- (bisacryloyloxymethyl) ethyl isocyanate; diisocyanate compound. Alternatively, an acryloyl monoisocyanate compound obtained by reacting a polyisocyanate compound with hydroxyethyl (meth) acrylate or 4-hydroxybutylethyl (meth) acrylate; a diisocyanate compound or a polyisocyanate compound, a polyol compound, and hydroxyethyl (meth). Examples thereof include an acryloyl monoisocyanate compound obtained by reacting with acrylate. Of these, 2-methacryloyloxyethyl isocyanate is particularly preferable. These compounds may be used alone or in combination of two or more.

[Photopolymerization initiator]
The photopolymerization initiator is not particularly limited as long as it generates an active species capable of chain polymerization by irradiating at least one selected from ultraviolet rays, electron beams and visible light. For example, photoradical polymerization initiation is started. Agents are mentioned. Here, the chain-polymerizable active species means one in which the polymerization reaction is started by reacting with a chain-polymerizable functional group.

Examples of the photoradical polymerization initiator include benzoinketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexylphenylketone and 2-hydroxy-2-methyl-1-phenylpropane-1. -On, α-hydroxyketone such as 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propane-1-one; 2-benzyl-2-dimethylamino-1- Α-Aminoketones such as (4-morpholinophenyl) -butane-1-one, 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one; 1- [4 -(Phenylthio) phenyl] -1,2-octadion-2- (benzoyl) oxime and other oxime esters; bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2 , 4,4-trimethylpentylphosphenyl oxide, phosphenyl oxides such as 2,4,6-trimethylbenzoyldiphenylphosphenyl oxide; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) ) -4,5-Di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole 2,4,5-Triarylimidazole dimer such as dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; benzophenone, N, N'-tetramethyl-4,4 Benzophenone compounds such as'-diaminobenzophenone, N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone; 2-ethylanthraquinone, phenanthrenquinone, 2-tert-butylanthraquinone, Octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10- Kinone compounds such as phenanthraquinone, 2-methyl-1,4-naphthoquinone and 2,3-dimethylanthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; Benzoin compounds such as benzoin, methylbenzoin and ethylbenzoin; benzyl compounds such as benzyldimethylketal; aclysine compounds such as 9-phenylaclydin and 1,7-bis (9,9'-acridinylheptane): N-phenylglycine. , Benzyl.

The content of the photopolymerization initiator in the pressure-sensitive adhesive composition is, for example, 0.1 to 30 parts by mass and 0.3 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic resin. It is preferably 0.5 to 5 parts by mass, and more preferably 0.5 to 5 parts by mass. If the content of the photopolymerization initiator is less than 0.1 parts by mass, the pressure-sensitive adhesive layer 3 is insufficiently cured after irradiation with ultraviolet rays, and pickup failure is likely to occur. If the content of the photopolymerization initiator exceeds 30 parts by mass, contamination of the adhesive layer (transfer of the photopolymerization initiator to the adhesive layer) is likely to occur.

[Crosslinking agent]
The cross-linking agent is used, for example, for the purpose of controlling the elastic modulus and / or the adhesiveness of the pressure-sensitive adhesive layer 3. The cross-linking agent may be a compound having two or more functional groups in one molecule capable of reacting with at least one functional group selected from the hydroxyl group, glycidyl group, amino group and the like possessed by the (meth) acrylic resin. .. Examples of the bond formed by the reaction between the cross-linking agent and the (meth) acrylic resin include an ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, and a urea bond.

In the present embodiment, it is preferable to use a compound having two or more isocyanate groups in one molecule as the cross-linking agent. When such a compound is used, it can easily react with the hydroxyl group, glycidyl group, amino group and the like possessed by the (meth) acrylic resin to form a strong crosslinked structure.

Compounds having two or more isocyanate groups in one molecule include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, and diphenylmethane-4. , 4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate Examples thereof include isocyanate compounds such as.

As the cross-linking agent, the above-mentioned isocyanate compound and a reaction product of a polyhydric alcohol having two or more OH groups in one molecule (isocyanate group-containing oligomer) may be adopted. Examples of polyhydric alcohols having two or more OH groups in one molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, 1,8-octanediol, and 1,9-nonanediol. Examples thereof include 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol and 1,3-cyclohexanediol.

Among these, as a cross-linking agent, a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule (isocyanate group-containing oligomer). Is more desirable. By using such an isocyanate group-containing oligomer as a cross-linking agent, the pressure-sensitive adhesive layer 3 forms a dense cross-linked structure, whereby the pressure-sensitive adhesive can be sufficiently suppressed from adhering to the adhesive layer 5 in the pickup step. ..

The content of the cross-linking agent in the pressure-sensitive adhesive composition may be appropriately set according to the cohesive force and the elongation at break required for the pressure-sensitive adhesive layer 3, the adhesion to the pressure-sensitive adhesive layer 5, and the like. Specifically, the content of the cross-linking agent is, for example, 3 to 30 parts by mass, preferably 5 to 15 parts by mass, and 7 to 7 to 3 parts by mass with respect to 100 parts by mass of the (meth) acrylic resin. It is more preferably 10 parts by mass. By setting the content of the cross-linking agent within the above range, it is possible to achieve both the characteristics required for the pressure-sensitive adhesive layer 3 in the dicing step and the characteristics required for the pressure-sensitive adhesive layer 3 in the die bonding step in a well-balanced manner. , Excellent pick-up performance can also be achieved.

If the content of the cross-linking agent is less than 3 parts by mass with respect to the content of 100 parts by mass of the (meth) acrylic resin, the formation of the cross-linking structure tends to be insufficient, and this causes adhesion in the pickup process. The interfacial adhesion with the agent layer 5 is not sufficiently reduced, and defects are likely to occur during pickup. On the other hand, when the content of the cross-linking agent exceeds 30 parts by mass with respect to the content of 100 parts by mass of the (meth) acrylic resin, the pressure-sensitive adhesive layer 3 tends to become excessively hard, which causes the expanding step. The semiconductor chip is easily peeled off.

The thickness of the pressure-sensitive adhesive layer 3 may be appropriately set according to the conditions of the expanding step (temperature, tension, etc.), and is, for example, 1 to 200 μm, preferably 5 to 50 μm, and 10 to 20 μm. Is more preferable. If the thickness of the pressure-sensitive adhesive layer 3 is less than 1 μm, the adhesiveness tends to be insufficient, and if it exceeds 200 μm, the splitting property tends to be insufficient at the time of cool expansion.

The pressure-sensitive adhesive layer 3 is formed on the base material layer 1. As a method for forming the pressure-sensitive adhesive layer 3, a known method can be adopted. For example, a laminate of the base material layer 1 and the pressure-sensitive adhesive layer 3 may be formed by a two-layer extrusion method, or a varnish for forming the pressure-sensitive adhesive layer 3 may be prepared and applied to the surface of the base material layer 1. The pressure-sensitive adhesive layer 3 may be formed on the film that has been processed or mold-released, and the pressure-sensitive adhesive layer 3 may be transferred to the base material layer 1.

The varnish for forming the pressure-sensitive adhesive layer 3 is preferably prepared by using an organic solvent capable of dissolving a (meth) acrylic resin, a photopolymerization initiator and a cross-linking agent, which volatilizes by heating. Specific examples of the organic solvent include aromatic hydrocarbons such as toluene, xylene, mesityrene, cumene and p-simene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; methanol, ethanol, isopropanol, butanol, ethylene glycol and propylene. Alcohols such as glycol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone; methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone and the like. Esters; Carbonated esters such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol. Polyhydric alcohol alkyl ethers such as dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono Polyhydric alcohol alkyl ether acetates such as butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; N, N-dimethylformamide, N, N-dimethylacetamide, N -Includes amides such as methylpyrrolidone.

Among these, from the viewpoint of solubility and boiling point, for example, toluene, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methyl acetate, ethyl acetate, butyl acetate, ethylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and N, N-dimethylacetamide are preferable. One of these organic solvents may be used alone, or two or more of them may be used in combination. The solid content concentration of the varnish is usually preferably 10 to 60% by mass.

<Base layer>
As the base material layer 1, a known polymer sheet or film can be used, and there is no particular limitation as long as the expanding step can be carried out under low temperature conditions. Specifically, as the base material layer 1, crystalline polypropylene, amorphous polypropylene, high-density polyethylene, medium-density polyethylene, low-density polyethylene, ultra-low-density polyethylene, low-density linear polyethylene, polybutene, polymethylpentene and the like can be used. Polyethylene, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, polyethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene- Polyester such as hexene copolymer, polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyether ether ketone, polyimide, polyetherimide, polyamide, total aromatic polyamide, polyphenylsulfide, aramid (paper), glass , Glass cloth, fluororesin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, a mixture of these mixed with a plasticizer, or a cured product cross-linked by electron beam irradiation.

The base material layer 1 has a surface containing at least one resin selected from polyethylene, polypropylene, a polyethylene-polypropylene random copolymer, and a polyethylene-polypropylene block copolymer as a main component, and this surface and the pressure-sensitive adhesive layer 3 It is preferable that they are in contact with each other. These resins are good base materials from the viewpoints of properties such as Young's modulus, stress relaxation property and melting point, as well as price and waste material recycling after use. The base material layer 1 may be a single layer, but may have a multilayer structure in which layers made of different materials are laminated, if necessary. In order to control the adhesion to the pressure-sensitive adhesive layer 3, the surface of the base material layer 1 may be subjected to a surface roughening treatment such as a matte treatment or a corona treatment.

<Adhesive layer>
An adhesive composition constituting a known die bonding tape can be applied to the adhesive layer 5. Specifically, the adhesive composition constituting the adhesive layer 5 preferably contains an epoxy group-containing acrylic copolymer, an epoxy resin, and an epoxy resin curing agent. According to the adhesive layer 5 containing these components, the adhesiveness between chips / substrates and between chips / chips is excellent, electrode embedding property and wire embedding property can be imparted, and adhesion is performed at a low temperature in the die bonding step. It is preferable because it can be formed, excellent curing can be obtained in a short time, and it has excellent reliability after molding with a sealing agent.

Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, and the like. Bisphenol A novolak type epoxy resin, diglycidyl etherified product of biphenol, diglycidyl etherified product of naphthalenediol, diglycidyl etherified product of phenols, diglycidyl etherified product of alcohols, and alkyl substituted and halides thereof. , Bifunctional epoxy resin such as hydrogen additive, Novorak type epoxy resin and the like. Further, other commonly known epoxy resins such as a polyfunctional epoxy resin and a heterocyclic-containing epoxy resin may be applied. These can be used alone or in combination of two or more. In addition, a component other than the epoxy resin may be contained as an impurity as long as the characteristics are not impaired.

Examples of the epoxy resin curing agent include a phenol resin obtained by reacting a phenol compound with a xylylene compound which is a divalent linking group in the presence of a non-catalyst or an acid catalyst. Examples of the phenolic compound used for producing the phenolic resin include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, on-propylphenol, mn-propylphenol, and the like. pn-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcin, catechol, hydroquinone, 4-methoxyphenol, o-phenyl Phenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol, p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p-chlorophenol, o-bromo Examples thereof include phenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, p-fluorophenol and the like. These phenol compounds may be used alone or in combination of two or more. As the xylylene compound which is a divalent linking group used for producing a phenol resin, the following xylylene halides, xylylene range glycols and derivatives thereof can be used. That is, α, α'-dichloro-p-xylene, α, α'-dichloro-m-xylene, α, α'-dichloro-o-xylene, α, α'-dibromo-p-xylene, α, α' -Dibromo-m-xylene, α, α'-dibromo-o-xylene, α, α'-diiodo-p-xylene, α, α'-diiodo-m-xylene, α, α'-diiodo-o-xylene , Α, α'-dihydroxy-p-xylene, α, α'-dihydroxy-m-xylene, α, α'-dihydroxy-o-xylene, α, α'-dimethoxy-p-xylene, α, α'- Dimethoxy-m-xylene, α, α'-dimethoxy-o-xylene, α, α'-diethoxy-p-xylene, α, α'-diethoxy-m-xylene, α, α'-diethoxy-o-xylene, α, α'-di-n-propoxy-p-xylene, α, α'-di-n-propoxy-m-xylene, α, α'-di-n-propoxy-o-xylene, α, α'- Di-isopropoxy-p-xylene, α, α'-diisopropoxy-m-xylene, α, α'-diisopropoxy-o-xylene, α, α'-di-n-butoxy-p-xylene, α, α'-di-n-butoxy-m-xylene, α, α'-di-n-butoxy-o-xylene, α, α'-diisobutoxy-p-xylene, α, α'-diisobutoxy-m- Xylene, α, α'-diisobutoxy-o-xylene, α, α'-di-tert-butoxy-p-xylene, α, α'-di-tert-butoxy-m-xylene, α, α'-di- tert-butoxy-o-xylene can be mentioned. These can be used alone or in combination of two or more.

When the above-mentioned phenol compound and xylylene compound are reacted, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid and polyphosphate; organics such as dimethylsulfate, diethylsulfuric acid, p-toluenesulfonic acid, methanesulfonic acid and ethanesulfonic acid. Carboxy acids; Super-strong acids such as trifluoromethanesulfonic acid; Strongly acidic ion exchange resins such as alkane sulfonic acid type ion exchange resin; Super strong acid ion exchange such as perfluoroalkane sulfonic acid type ion exchange resin Resins (trade names: Nafion, Nafion, manufactured by Du Pont, "Nafion" is a registered trademark); natural and synthetic zeolites; using acidic catalysts such as active white clay (acidic white clay), substantially at 50-250 ° C. It is obtained by reacting until the xylylene compound as a raw material disappears and the reaction composition becomes constant. The reaction time depends on the raw material and the reaction temperature, but is about 1 hour to 15 hours, and may be actually determined by tracking the reaction composition by GPC (gel permeation chromatography) or the like.

The epoxy group-containing acrylic copolymer is preferably a copolymer obtained by using glycidyl acrylate or glycidyl methacrylate as a raw material in an amount of 0.5 to 6% by mass based on the obtained copolymer. When this amount is 0.5% by mass or more, high adhesive strength can be easily obtained, while when it is 6% by mass or less, gelation can be suppressed. For the balance, a mixture of alkyl acrylates having an alkyl group having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate, alkyl methacrylate, and styrene and acrylonitrile can be used. Of these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the Tg of the copolymer. When the Tg is less than −10 ° C., the tackiness of the adhesive layer 5 in the B stage state tends to increase, and the handleability tends to deteriorate. The upper limit of the glass transition point (Tg) of the epoxy group-containing acrylic copolymer is, for example, 30 ° C. The polymerization method is not particularly limited, and examples thereof include pearl polymerization and solution polymerization. Examples of commercially available epoxy group-containing acrylic copolymers include HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation).

The weight average molecular weight of the epoxy group-containing acrylic copolymer is 100,000 or more, and in this range, the adhesiveness and heat resistance are high, preferably 300,000 to 3,000,000, and preferably 500,000 to 2,000,000. Is more preferable. When the weight average molecular weight is 3 million or less, it is possible to suppress the deterioration of the filling property between the semiconductor chip and the substrate supporting the semiconductor chip. The weight average molecular weight is a polystyrene-equivalent value using a calibration curve of standard polystyrene by gel permeation chromatography (GPC).

The adhesive layer 5 may further contain a curing accelerator such as a tertiary amine, imidazoles, or a quaternary ammonium salt, if necessary. Specific examples of the curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate. These may be used alone or in combination of two or more.

The adhesive layer 5 may further contain an inorganic filler, if necessary. Specific examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, and boron nitride. Examples include crystalline silica and amorphous silica. These may be used alone or in combination of two or more.

The thickness of the adhesive layer 5 is, for example, 1 to 300 μm, preferably 5 to 150 μm, and more preferably 10 to 100 μm. If the thickness of the adhesive layer 5 is less than 1 μm, the adhesiveness tends to be insufficient, while if it exceeds 300 μm, the splitting property and pick-up property at the time of expansion tend to be insufficient.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. For example, in the above embodiment, the dicing die bonding integrated tape 10 including the base material layer 1, the pressure-sensitive adhesive layer 3, and the adhesive layer 5 in this order is exemplified, but the mode does not include the adhesive layer 5. It may be. FIG. 2 is a cross-sectional view schematically showing an embodiment of the adhesive tape for dicing according to the present invention. The dicing adhesive tape 20 shown in the figure includes a base material layer 1 and a pressure-sensitive adhesive layer 3 provided on the base material layer 1. Further, the tapes 10 and 20 may further include a cover tape (not shown) that protects the outermost layer on the side opposite to the base material layer 1. That is, the tape 10 may further include a cover tape that covers the adhesive layer 5, and the tape 20 may further include a cover tape that covers the adhesive layer 3.

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. Unless otherwise specified, all chemicals used were reagents.

<Example 1>
[Synthesis of acrylic resin (Production Example 1)]
The following components were placed in a flask with a capacity of 2000 ml equipped with a three-one motor, a stirring blade, and a nitrogen introduction tube.
-Ethyl acetate (solvent): 635 g
2-Ethylhexyl acrylate: 395 g
2-Hydroxyethyl acrylate: 100 g
・ Methacrylic acid: 5g
-Azobisisobutyronitrile: 0.2 g

After stirring the contents until they became uniform, bubbling was carried out at a flow rate of 500 ml / min for 60 minutes to degas the dissolved oxygen in the system. The temperature was raised to 78 ° C. over 1 hour, and after the temperature was raised, polymerization was carried out for 6 hours. Next, the reaction solution was transferred to a pressure kettle having a capacity of 2000 ml equipped with a three-one motor, a stirring blade, and a nitrogen introduction tube, heated at 120 ° C. and 0.28 MPa for 4.5 hours, and then at room temperature (25 ° C., the same applies hereinafter). ).

Next, 490 g of ethyl acetate was added, and the mixture was stirred and diluted. To this, 0.025 g of methquinone as a polymerization inhibitor and 0.10 g of dioctyltin dilaurate as a urethanization catalyst were added, and then 81 g of 2-methacryloxyethyl isocyanate (Carens MOI (trade name) manufactured by Showa Denko KK). In addition, after reacting at 70 ° C. for 6 hours, the mixture was cooled to room temperature. Next, ethyl acetate was added to adjust the non-volatile content in the acrylic resin solution to 35% by mass to obtain a solution containing (A) acrylic resin (Production Example 1) having a functional group capable of chain polymerization. ..

The solution containing the acrylic resin (A) obtained as described above was vacuum dried at 60 ° C. overnight. The solid content obtained by this was elementally analyzed by a fully automatic elemental analyzer (manufactured by Elemental Co., Ltd., product surface: varioEL), and the content of the introduced 2-methacryloxyethyl isocyanate was calculated from the nitrogen content. , 0.89 mmol / g.

In addition, the polystyrene-equivalent weight average molecular weight of (A) acrylic resin was determined using the following equipment. That is, SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation was used, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Kasei Co., Ltd. was used as the column, and tetrahydrofuran was used as the eluent. GPC measurement was performed. As a result, the polystyrene-equivalent weight average molecular weight was 280,000. The hydroxyl value and acid value measured according to the method described in JIS K0070 were 32.8 mgKOH / g and 6.5 mgKOH / g. These results are summarized in Table 1.

[Preparation of dicing tape (adhesive layer)]
A varnish for forming an adhesive layer was prepared by mixing the following components (see Table 2). The amount of ethyl acetate (solvent) was adjusted so that the total solid content of the varnish was 25% by mass.
(A) Acrylic resin solution (Production Example 1): 100 g (solid content)
(B) Photopolymerization Initiator (1-Hydroxycyclohexylphenylketone, manufactured by Chivas Specialty Chemicals Co., Ltd., Irgacure 184, "Irgacure" is a registered trademark): 0.8 g
(B) Photopolymerization Initiator (Bis (2,4,6-trimethylbenzoyl) -Phenylphosphinoxide, manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 819, "Irgacure" is a registered trademark): 0.2 g
(C) Crosslinking agent (polyfunctional isocyanate, manufactured by Nippon Polyurethane Industry Co., Ltd., coronate L, solid content: 75%): 8.0 g (solid content)
・ Ethyl acetate (solvent)

A polyethylene terephthalate film (width 450 mm, length 500 mm, thickness 38 μm) having a mold release treatment on one surface was prepared. A varnish for forming an adhesive layer was applied to the surface subjected to the mold release treatment using an applicator, and then dried at 80 ° C. for 5 minutes. As a result, a laminated body (dicing tape) composed of a polyethylene terephthalate film and a pressure-sensitive adhesive layer having a thickness of 10 μm formed on the polyethylene terephthalate film was obtained.

A polyolefin film (width 450 mm, length 500 mm, thickness 100 μm) having a corona treatment on one surface was prepared. The surface treated with corona and the adhesive layer of the above-mentioned laminate were bonded at room temperature. Then, the pressure-sensitive adhesive layer was transferred to the polyolefin film (cover film) by pressing with a rubber roll. Then, it was left at room temperature for 3 days to obtain a dicing tape with a cover film.

[Preparation of die bonding tape (adhesive layer)]
First, cyclohexanone (solvent) was added to the following composition, and the mixture was stirred and mixed, and then kneaded for 90 minutes using a bead mill.
-Epoxy resin (YDCN-703 (trade name), manufactured by Nippon Steel & Sumitomo Metal Corporation, cresol novolac type epoxy resin, epoxy equivalent 210, molecular weight 1200, softening point 80 ° C.): 55 parts by mass-phenol resin (Millex XLC-LL ( Product name), manufactured by Mitsui Chemicals Co., Ltd., phenol resin, hydroxyl group equivalent 175, water absorption rate 1.8%, heating weight reduction rate at 350 ° C. 4%): 45 parts by mass, silane coupling agent (NUC A-189 (product name) Name), γ-mercaptopropyltrimethoxysilane manufactured by NUC Co., Ltd.): 1.7 parts by mass, silane coupling agent (NUCA-1160 (trade name), manufactured by Nippon Unicar Co., Ltd., γ-ureidopropyltriethoxysilane) : 3.2 parts by mass, filler (Aerosil R972 (trade name), manufactured by Nippon Aerosil Co., Ltd., silica, average particle size 0.016 μm): 32 parts by mass "Aerosil R972" contains organic groups such as methyl groups. It is a filler contained on the surface of silica particles, and is obtained by coating the surface of silica particles with dimethyldichlorosilane and hydrolyzing dimethyldichlorosilane in a reactor at 400 ° C.

After adding the following components to the composition obtained as described above, a varnish for forming an adhesive layer was obtained through the steps of stirring and mixing and vacuum degassing.
-Epoxide group-containing acrylic copolymer (HTR-860P-3 (trade name), manufactured by Nagase ChemteX Corporation, weight average molecular weight 800,000): 280 parts by mass-curing accelerator (Curesol 2PZ-CN (trade name), Shikoku Kasei Kogyo Co., Ltd., 1-cyanoethyl-2-phenylimidazole, "Curesol" is a registered trademark) 0.5 parts by mass

A polyethylene terephthalate film (thickness 35 μm) having a mold release treatment on one surface was prepared. A varnish for forming an adhesive layer was applied to the surface subjected to the mold release treatment using an applicator, and then heat-dried at 140 ° C. for 5 minutes. As a result, a laminate (die bonding tape) composed of a polyethylene terephthalate film (carrier tape) and an adhesive layer (B stage state) having a thickness of 10 μm formed on the film was obtained.

[Preparation of dicing die bonding integrated tape]
The die bonding tape composed of the adhesive layer and the carrier film was cut into a circle having a diameter of 335 mm together with the carrier tape. A dicing tape from which the polyethylene terephthalate film was peeled off was attached to this at room temperature, and then left at room temperature for 1 day. Then, the dicing tape was cut into a circle having a diameter of 370 mm. As a result, the dicing die bonding integrated tape according to Example 1 was obtained.

(1) Measurement of storage elastic modulus of adhesive layer (before curing treatment by ultraviolet irradiation)
Using a dynamic viscoelasticity measuring device manufactured by UBM Co., Ltd., the storage elastic modulus of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer was measured as follows. By sequentially laminating the pressure-sensitive adhesive layer of the dicing tape (a laminate consisting of a polyethylene terephthalate film and a pressure-sensitive adhesive layer having a thickness of 10 μm), a sample consisting of a pressure-sensitive adhesive composition having a thickness of 150 μm was obtained. The measurement conditions were a chuck distance of 20 mm, a frequency of 1 Hz, a temperature rise rate of 3 ° C./min, and a storage elastic modulus from −70 ° C. to 100 ° C. was measured. From this measurement result, the storage elastic modulus at −15 ° C. before the curing treatment by ultraviolet irradiation was determined.

(2) Measurement of storage elastic modulus of the adhesive layer (after curing treatment by ultraviolet irradiation)
Similar to (1) above, the storage elastic modulus of the pressure-sensitive adhesive composition from −70 ° C. to 100 ° C. was measured, except that a sample having a thickness of 150 μm composed of the pressure-sensitive adhesive composition irradiated with ultraviolet rays was measured. The rate was measured. From this measurement result, the storage elastic modulus at 25 ° C. after the curing treatment by ultraviolet irradiation was determined. The above sample was irradiated with ultraviolet rays (light source: metal halide lamp, main wavelength: 365 nm) using a conveyor UV irradiation device CS60 (manufactured by GS Yuasa Corporation). Ultraviolet rays were irradiated for 3 seconds at an illuminance of 70 mW / cm ² .

(3) Evaluation of stealth dicing property The stealth dicing property (wafer splitting property and adhesive layer splitting property) was evaluated by performing an expanding step after forming a modified region by irradiating a semiconductor wafer with a laser. .. That is, a semiconductor wafer (silicon wafer, thickness 50 μm, outer diameter 12 inches) was prepared. The adhesive layer was exposed by peeling the polyethylene terephthalate film from the dicing die bonding integrated tape. A dicing die bonding integrated tape was attached to the semiconductor wafer so that the adhesive layer adhered to one surface of the semiconductor wafer.

Using a laser dicing device (MAHOHDICING MACHINE manufactured by Tokyo Seimitsu Co., Ltd.), stealth dicing was performed on a laminate (semiconductor wafer / adhesive layer / adhesive layer / base material layer) containing a semiconductor wafer. The conditions were as follows.
-Laser light source: Semiconductor laser excited Nd (YAG laser)
Wavelength: 1064 nm
Laser light spot cross section: 3.14 × ^10-8 cm ²
Oscillation form: Q-switched pulse repetition frequency: 100 kHz
Pulse width: 30ns
Output: 20μJ / pulse Laser light quality: TEM00
Polarization characteristics: Linear polarization, lens magnification for condensing: 50 times, NA: 0.55
-Transmittance to laser light wavelength: 60%
-Movement speed of the table on which the semiconductor wafer is placed: 100 mm / sec

A laminate (semiconductor wafer / adhesive layer / adhesive layer / base material layer) containing the semiconductor wafer after forming the modified region was fixed to the expander. Then, the adhesive layer and the semiconductor wafer were separated by expanding the dicing tape (adhesive layer / base material layer) under the following conditions. As a result, a semiconductor chip with an adhesive piece was obtained. In this test example, the expansion was carried out under the following conditions, but the expanding conditions (“height”, “speed”, etc.) may be appropriately adjusted depending on the physical properties of the base film, the temperature conditions, and the like.
Equipment: DDS2300 (Fully Automatic Die Separator) manufactured by Disco Corporation
Cool expand conditions:
Temperature: -15 ° C, Height: 9 mm, Cooling time: 60 seconds Speed: 300 mm / sec, Waiting time: 0 seconds

By observing the expanded semiconductor wafer and adhesive layer with a microscope from the semiconductor wafer side, it was evaluated whether the semiconductor wafer and the adhesive layer were divided at predetermined positions. Microscopic observation was performed on the peripheral and central parts of the wafer, and the fragmentability was evaluated according to the following criteria.
A: The partitionability of the wafer and the adhesive layer was 95% or more and 100% or less.
B: The F splittability of the wafer and the adhesive layer was 90% or more and less than 95%.
C: The partitionability of the wafer and the adhesive layer was 30% or more and less than 90%.
D: The partitionability of the wafer and the adhesive layer was less than 30%.
The divideability (unit:%) is the ratio of the number of lines that can be divided to the total number of lines to be divided.

(4) Evaluation of Pickability The semiconductor wafer (semiconductor chip) after the expanding step was irradiated with ultraviolet rays from the substrate layer side at an illuminance of 70 mW / cm ² for 3 seconds. The pick-up property of the semiconductor chip was evaluated using a flexible die bonder DB-730 (trade name) manufactured by Renesas East Japan Semiconductor. As the pickup collet, RUBBER TIP 13-087E-33 (trade name, size: 5 × 5 mm) manufactured by Micromechanics Co., Ltd. was used. As the push-up pin, EJECTOR NEEDLE SEN2-83-05 (trade name, diameter: 0.7 mm, tip shape: semicircle with a diameter of 350 μm) manufactured by Micromechanics was used. Five push-up pins were arranged with a pin center spacing of 4.2 mm. The pick-up property was evaluated under the conditions of the pin push-up speed at the time of pickup: 10 mm / sec and the push-up height: 200 μm, and the pick-up property was evaluated according to the following criteria.
A: 100 chips were picked up continuously, and no chip cracking or pick-up error occurred.
B: 100 chips were continuously picked up, and the rate of chip cracking or pickup error was greater than 0% and 5% or less.
C: 100 chips were continuously picked up, and the rate of chip cracking or pick-up error was 5% or more.

<Examples 2 to 7 and Comparative Examples 1 to 3>
[Synthesis of acrylic resin (Production Examples 2-9)]
A solution of the acrylic resin (A) according to Production Examples 2 to 9 was obtained by using the same method as in Production Example 1 except that the monomers shown in Table 1 were used. The dicing die bonding integrated tapes according to Examples 2 to 7 and Comparative Examples 1 to 3 were prepared in the same manner as in Example 1 except that the composition of the pressure-sensitive adhesive layer was the composition shown in Tables 2 and 3. Then, various evaluations were performed.

As shown in Table 2, the dicing die bonding integrated tapes according to Examples 1 to 7 are excellent in the breakability of the semiconductor wafer and the adhesive layer after stealth dicing, and even if the push-up height is as low as 200 μm. It can be picked up.

Comparative Example 1 is a comparative example in which the acrylic resin according to Production Example 1 is used, but the amount of the cross-linking agent is smaller than that of Example 1. In Comparative Example 1, undivided adhesive layer occurred particularly after stealth dicing, and the pick-up property was also insufficient. It is presumed that these are due to the low storage elastic modulus at −15 ° C. before the curing treatment by ultraviolet irradiation (before UV).

Comparative Example 2 is a comparative example using the acrylic resin (4-hydroxybutyl acrylate is used as a part of the raw material) according to Production Example 8. In Comparative Example 2, after stealth dicing, the semiconductor wafer and the adhesive layer were undivided, and subsequent pickup could not be performed.

Comparative Example 3 is a comparative example using the acrylic resin according to Production Example 9 (an acrylic resin having less chain transferable functional groups as compared with Production Example 2). In Comparative Example 3, the pickup could not be carried out. It is presumed that this is because the storage elastic modulus before the curing treatment by ultraviolet irradiation (after UV) was low.

According to the present invention, in the manufacturing process of a semiconductor device including stealth dicing, a dicing adhesive tape and a dicing die bonding integrated tape capable of achieving both the splitting property of a semiconductor wafer and the pick-up property of a semiconductor chip at a sufficiently high level are provided. Provided.

1 ... Base material layer, 3 ... Adhesive layer, 5 ... Adhesive layer, 10 ... Dicing die bonding integrated tape, 20 ... Adhesive tape for dicing

Claims (10)

Substrate layer and
The pressure-sensitive adhesive layer provided on the base material layer and
An adhesive tape for stealth dicing that has at least
The pressure-sensitive adhesive layer contains a (meth) acrylic resin, a photopolymerization initiator, and a cross-linking agent, and has a storage elastic modulus of 40 MPa or more at −15 ° C. and a storage elastic modulus of 40 MPa or more before being cured by ultraviolet irradiation. An adhesive tape for stealth dying having a storage elastic modulus of 100 MPa or more at 25 ° C. after being cured by irradiation with ultraviolet rays. The adhesive tape for stealth dicing according to claim 1, wherein the (meth) acrylic resin has one or more aromatic rings. The (meth) acrylic resin contains a functional group capable of chain polymerization.
The adhesive tape for stealth dicing according to claim 1 or 2, wherein the functional group is at least one selected from an acryloyl group and a methacryloyl group. Any of claims 1 to 3, wherein the cross-linking agent is a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule. The adhesive tape for stealth dicing described in item 1. The adhesive tape for stealth dicing according to any one of claims 1 to 4, wherein the photopolymerization initiator is a photoradical polymerization initiator. The adhesive tape for stealth dicing according to any one of claims 1 to 5, wherein the pressure-sensitive adhesive layer has a storage elastic modulus of 150 MPa or more at 25 ° C. after being cured by irradiation with ultraviolet rays. The adhesive tape for stealth dicing according to any one of claims 1 to 6, wherein the pressure-sensitive adhesive layer has a storage elastic modulus of 300 MPa or less at 25 ° C. after being cured by irradiation with ultraviolet rays. The adhesive tape for stealth dicing according to any one of claims 1 to 7, wherein the pressure-sensitive adhesive layer has a storage elastic modulus of 200 MPa or less at −15 ° C. before being cured by irradiation with ultraviolet rays. The adhesive tape for stealth dicing according to any one of claims 1 to 8 and the adhesive tape for stealth dicing .
An adhesive layer provided on the adhesive layer of the adhesive tape and
With dicing die bonding integrated tape. (A) A step of performing stealth dicing on the semiconductor wafer by forming a modified region on the semiconductor wafer by laser irradiation.
(B) The step of attaching the semiconductor wafer to the surface of the adhesive layer of the dicing die bonding integrated tape according to claim 9.
(C) A step of obtaining a semiconductor chip with an adhesive piece in which the semiconductor wafer and the adhesive layer are separated by expanding the base material layer under cooling conditions.
(D) A step of reducing the adhesive strength of the pressure-sensitive adhesive layer to the semiconductor chip with the adhesive piece by irradiating the pressure-sensitive adhesive layer with ultraviolet rays.
(E) A step of picking up the semiconductor chip with the adhesive piece from the adhesive layer, and
A method for manufacturing a semiconductor device, including.

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