JP6935623B2 - A highly transparent polyimide precursor resin composition having excellent optical characteristics and phase delay characteristics, a method for producing a polyimide resin film using the same, and a polyimide resin film produced by the same. - Google Patents
A highly transparent polyimide precursor resin composition having excellent optical characteristics and phase delay characteristics, a method for producing a polyimide resin film using the same, and a polyimide resin film produced by the same. Download PDFInfo
- Publication number
- JP6935623B2 JP6935623B2 JP2019564974A JP2019564974A JP6935623B2 JP 6935623 B2 JP6935623 B2 JP 6935623B2 JP 2019564974 A JP2019564974 A JP 2019564974A JP 2019564974 A JP2019564974 A JP 2019564974A JP 6935623 B2 JP6935623 B2 JP 6935623B2
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- Prior art keywords
- bis
- polyimide
- resin film
- phenyl
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001721 polyimide Polymers 0.000 title claims description 51
- 239000004642 Polyimide Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000009719 polyimide resin Substances 0.000 title claims description 16
- 239000002243 precursor Substances 0.000 title claims description 15
- 239000011342 resin composition Substances 0.000 title claims description 13
- 230000003287 optical effect Effects 0.000 title claims description 10
- 239000000203 mixture Substances 0.000 claims description 45
- 229920005575 poly(amic acid) Polymers 0.000 claims description 39
- -1 dianhydride compound Chemical class 0.000 claims description 38
- 150000004985 diamines Chemical class 0.000 claims description 34
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 30
- 239000003960 organic solvent Substances 0.000 claims description 29
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 14
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 12
- LBVMWHCOFMFPEG-UHFFFAOYSA-N 3-methoxy-n,n-dimethylpropanamide Chemical compound COCCC(=O)N(C)C LBVMWHCOFMFPEG-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 6
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 6
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 claims description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 3
- ZJKAAVFEXXJDQW-UHFFFAOYSA-N 4-[4-[2-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]propan-2-yl]phenoxy]-3-(trifluoromethyl)aniline Chemical group C=1C=C(OC=2C(=CC(N)=CC=2)C(F)(F)F)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F ZJKAAVFEXXJDQW-UHFFFAOYSA-N 0.000 claims description 3
- IWFSADBGACLBMH-UHFFFAOYSA-N 4-[4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)C=C1 IWFSADBGACLBMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000001294 propane Substances 0.000 claims description 3
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 claims description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims 2
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims 1
- 239000000178 monomer Substances 0.000 description 27
- 239000010408 film Substances 0.000 description 26
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 25
- 239000000758 substrate Substances 0.000 description 22
- 238000005259 measurement Methods 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 239000007810 chemical reaction solvent Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 150000004984 aromatic diamines Chemical class 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229940018564 m-phenylenediamine Drugs 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007764 slot die coating Methods 0.000 description 2
- 238000000807 solvent casting Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RKFCDGOVCBYSEW-AUUKWEANSA-N tmeg Chemical compound COC=1C(OC)=CC(C(OC(C=2OC)=C34)=O)=C3C=1OC(=O)C4=CC=2O[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O RKFCDGOVCBYSEW-AUUKWEANSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical compound C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 230000008863 intramolecular interaction Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本発明は、低い熱膨張係数を有し、溶液キャスティング時に白濁現象が発生せず、優れた高透明性を有しながらも光特性及び位相遅延特性に優れたポリイミド前駆体樹脂組成物、これを用いたポリイミド樹脂フィルムの製造方法、及びこれによって製造されたポリイミド樹脂フィルムに関するものであり、フレキシブルディスプレイ基板素材、半導体素材に有用に活用することができる。 The present invention is a polyimide precursor resin composition having a low thermal expansion coefficient, no cloudiness phenomenon during solution casting, excellent high transparency, and excellent optical characteristics and phase delay characteristics. It relates to the method for producing the polyimide resin film used and the polyimide resin film produced by the method, and can be usefully used for a flexible display substrate material and a semiconductor material.
次世代ディスプレイ装置として注目されているフレキシブルディスプレイの基板素材は、軽く、破れず、撓むことが可能であり、容易な加工性によって、形態の制約がないものでなければならない。
現在ディスプレイ基板素材に用いられているガラス基板に比べて軽いだけでなく、破れず、製造がしやすく、薄膜型であるフィルムを製造可能な高分子材料が、フレキシブルディスプレイの具現のための最適な素材として注目されている。
The substrate material of a flexible display, which is attracting attention as a next-generation display device, must be light, unbreakable, flexible, easy to process, and not restricted in form.
A polymer material that is not only lighter than the glass substrate currently used as a display substrate material, is not torn, is easy to manufacture, and can produce a thin film, is optimal for the realization of flexible displays. It is attracting attention as a material.
現在、フレキシブルデバイスは一般に、有機発光ダイオード(OLED)ディスプレイを使用し、高い工程温度(300〜500℃)のTFT工程が用いられている。このような高い工程温度に耐える高分子材料は極めて限定されている。このため、最近では透明フレキシブルディスプレイ用プラスチック基板の候補として耐熱性及び寸法安定性に優れたポリイミド(PI)樹脂への関心が増している。 Currently, flexible devices generally use organic light emitting diode (OLED) displays and use high process temperature (300-500 ° C.) TFT processes. Polymer materials that can withstand such high process temperatures are extremely limited. For this reason, recently, there has been increasing interest in polyimide (PI) resins having excellent heat resistance and dimensional stability as candidates for plastic substrates for transparent flexible displays.
フレキシブルディスプレイ基板の適用のためには、優れた耐熱性及び寸法安定性に加えて、ディスプレイ視野角の確保のための優れた透過性、低い屈折率、位相遅延特性が必須である。しかし、通常のポリイミドは褐色又は黄色の色を帯びており、これは、ポリイミドの分子内(intra molecular)及び分子間(inter molecular)相互作用による電子移動複合体(Charge Transfer Complex,CTC)が主な原因である。これは、ポリイミド薄膜の光透過率を低下させ、複屈折を高めて、狭い視野角の問題を発生させる。関連先行技術として、韓国公開特許第2015−0046463号は、無色透明でありながらも改善された複屈折及び位相差特性を有するように、様々な酸二無水物、ジアミン化合物を用いてポリアミド酸(polyamic acid)溶液を製造し、これを用いてポリイミドフィルムを製造する方法を提供している。
一方、有機発光ダイオード(OLED)ディスプレイは、ガラス基板に樹脂を塗布後に熱硬化してフィルム化し、数段階の工程後にガラス基板から剥がす方法でディスプレイを製造する。このような作製過程中にガラス基板に樹脂を塗布したとき、常温での樹脂安定性が重要である。樹脂の安定性が確保されないと、樹脂の固まり、水分による白濁現象などによって、硬化後に均一なフィルムが成膜されず、結局、製品の欠陥につながり得る。
For the application of the flexible display substrate, in addition to excellent heat resistance and dimensional stability, excellent transparency, low refractive index, and phase delay characteristics for ensuring the display viewing angle are indispensable. However, ordinary polyimide has a brown or yellow color, which is mainly an electron transfer complex (Change Transfer Complex, CTC) due to intramolecular and intermolecular interactions of polyimide. Cause. This lowers the light transmittance of the polyimide thin film, increases birefringence, and causes the problem of a narrow viewing angle. As a related prior art, Korean Publication No. 2015-0046463 uses various acid dianhydrides and diamine compounds to make polyamic acids (polyimides and diamine compounds so as to have improved compound refraction and phase difference characteristics while being colorless and transparent. Provided is a method for producing a polyamic acid) solution and using the solution to produce a polyimide film.
On the other hand, an organic light emitting diode (OLED) display is manufactured by applying a resin to a glass substrate, heat-curing it to form a film, and peeling it off from the glass substrate after several steps. When a resin is applied to a glass substrate during such a manufacturing process, resin stability at room temperature is important. If the stability of the resin is not ensured, a uniform film will not be formed after curing due to the lumping of the resin, the white turbidity phenomenon due to moisture, and the like, which may eventually lead to defects in the product.
したがって、ディスプレイ材料としての適用のためには、最適の単量体及び有機溶媒の組合せによって、常温で樹脂安定性を有し、色相発現がなく、複屈折率を下げて位相遅延特性に優れた、無色透明なポリイミド樹脂の開発が必要である。 Therefore, for application as a display material, it has resin stability at room temperature, does not develop hue, lowers the birefringence, and has excellent phase delay characteristics, depending on the optimum combination of monomer and organic solvent. , It is necessary to develop a colorless and transparent polyimide resin.
そこで、本発明者らは、上記問題を解決するために、光特性及び位相遅延特性に優れた高透明性のポリイミドフィルムの製造において、新規なジアミン化合物を含む芳香族ジアミン化合物の組成と、白濁現象が発生しない有機溶媒の組成を見出すことによって、従来のポリイミドフィルムに比べて高透明性、光特性及び位相遅延特性に優れたポリイミド前駆体樹脂組成物を発見し、本発明を完成するに至った。 Therefore, in order to solve the above problems, the present inventors have made a composition of an aromatic diamine compound containing a novel diamine compound and cloudiness in the production of a highly transparent polyimide film having excellent light characteristics and phase delay characteristics. By finding the composition of the organic solvent in which the phenomenon does not occur, a polyimide precursor resin composition having excellent transparency, optical characteristics and phase delay characteristics as compared with the conventional polyimide film was discovered, and the present invention was completed. rice field.
したがって、本発明は、光特性及び位相遅延特性に優れた高透明性のフレキシブルディスプレイ基板素材として使用可能なポリイミド前駆体樹脂組成物を提供することにその目的がある。
また、本発明は、前記組成物を用いてポリイミド樹脂フィルムの製造方法を提供することにその目的がある。
また、本発明は、前記製造方法によって製造されたフィルムの厚さ10〜15μmを基準に、複屈折0.01以下、面方向の位相差(Ro)が1nm以下、厚さ方向の位相差(Rth)が100nm以下、濁度(Haze)1.0以下、透過率(Transmittance)が88%以上、及び黄色度(Yellow Index,Y.I.)が7以下であるポリイミド樹脂フィルムを提供することにその目的がある。
Therefore, an object of the present invention is to provide a polyimide precursor resin composition that can be used as a highly transparent flexible display substrate material having excellent optical characteristics and phase delay characteristics.
Another object of the present invention is to provide a method for producing a polyimide resin film using the composition.
Further, in the present invention, the birefringence is 0.01 or less, the phase difference (Ro) in the plane direction is 1 nm or less, and the phase difference in the thickness direction is based on the thickness of the film produced by the production method of 10 to 15 μm. Provided is a polyimide resin film having a Rth) of 100 nm or less, a turbidity (Haze) of 1.0 or less, a transmittance of 88% or more, and a yellowness (Yellow Index, YI) of 7 or less. Has its purpose.
本発明は、ジアミン成分、酸二無水物化合物、及び有機溶媒を含むポリイミド前駆体樹脂組成物において、前記ジアミン成分は、下記化学式1で表示される2,2−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]プロパン(BATP)、下記化学式2で表示される1,1−ビス[4−4−アミノ−2−トリフルオロメチルフェノキシ]−フェニル]−1−フェニル−エタン(BATPPE)、下記化学式3で表示される4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)フェニル(BATPP)、及び下記化学式4で表示される4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)ビフェニル(BATPB)からなる群から選ばれる1種以上の芳香族ジアミンを含むことを特徴とする光特性及び位相遅延特性に優れた高透明性のポリイミド前駆体樹脂組成物を提供する。 In the present invention, in a polyimide precursor resin composition containing a diamine component, an acid dianhydride compound, and an organic solvent, the diamine component is a 2,2-bis [4- (4-amino4-amino) represented by the following chemical formula 1. -2-Trifluoromethylphenoxy) -phenyl] propane (BATP), 1,1-bis [4-4-amino-2-trifluoromethylphenoxy] -phenyl] -1-phenyl-represented by Chemical Formula 2 below. Ethane (BATPPE), 4,4'-bis (4-amino-2-trifluoromethylphenoxy) phenyl (BATPP) represented by Chemical Formula 3 below, and 4,4'-bis (4-amino-2-trifluoromethylphenoxy) phenyl (BATPP) represented by Chemical Formula 4 below. 4-Amino-2-trifluoromethylphenoxy) A highly transparent polyimide precursor having excellent optical and phase delay characteristics, which comprises one or more aromatic diamines selected from the group consisting of biphenyl (BATBP). A body resin composition is provided.
本発明では、前記化学式1〜4で表示される芳香族ジアミン化合物は、ジアミン成分の合計含有量に対して5〜30モル%を含むこともできる。
本発明では、前記ジアミン成分は、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノビフェニル(TFMB)、4,4−オキシジアニリン(ODA)、4,4−メチレンジアニリン(MDA)、p−フェニレンジアミン(pPDA)、m−フェニレンジアミン(mPDA)、p−メチレンジアニリン(pMDA)、m−メチレンジアニリン(mMDA)、p−シクロヘキサンジアミン(pCHDA)、p−キシリレンジアミン(pXDA)、m−キシリレンジアミン(mXDA)、m−シクロヘキサンジアミン(mCHDA)、4,4’−ジアミノジフェニルスルホン(DDS)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン(BAFP)、及び2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)からなる群から選ばれる1種以上を含むこともできる。
本発明では、前記有機溶媒は、ガンマ−ブチロラクトン(GBL)及びN−メチル−2−ピロリドン(NMP)の混合物、又はガンマ−ブチロラクトン(GBL)及び3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)の混合物、又は3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)単独物であってもよい。
本発明では、前記有機溶媒の使用量は、ガンマ−ブチロラクトン(GBL)30〜70モル%にN−メチル−2−ピロリドン(NMP)又は3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)70〜30モル%とすることもできる。
また、本発明は、前記組成物を用いて製造されたポリアミド酸溶液を熱処理してフィルムとして製造することを特徴とする透明ポリイミド樹脂フィルムの製造方法を提供する。
本発明では、前記ポリアミド酸溶液は、固形分含有量10〜40重量%条件基準で有機溶媒含有量を使用し、ジアミン成分95〜100モル%及び酸二無水物化合物100〜105モル%を混合して製造することもできる。
本発明では、前記ポリアミド酸溶液は、粘度が1,000〜10,000cPであることも効果的である。
また、本発明は、前記製造方法で製造されたフィルムの厚さ10〜15μmを基準に、532nmの波長における透過率が88%以上、532nm波長における黄色度(Yellow Index,Y.I.)が7以下、複屈折が0.01以下、厚さ方向の位相差(Rth)が100以下であるポリイミド樹脂フィルムを提供する。
In the present invention, the aromatic diamine compounds represented by the chemical formulas 1 to 4 can also contain 5 to 30 mol% with respect to the total content of the diamine components.
In the present invention, the diamine component is 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (TFMB), 4,4-oxydianiline (ODA), 4,4-methylenedianiline. (MDA), p-phenylenediamine (pPDA), m-phenylenediamine (mpDA), p-methylenedianiline (pMDA), m-methylenedianiline (mMADA), p-cyclohexanediamine (pCHDA), p-xylylene Amine (pXDA), m-xylylene diamine (mXDA), m-cyclohexanediamine (mCHDA), 4,4'-diaminodiphenylsulfone (DDS), 2,2-bis [4- (4-aminophenoxy) phenyl] One or more selected from the group consisting of -1,1,1,3,3,3-hexafluoropropane (BAFP) and 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP). Can also be included.
In the present invention, the organic solvent is a mixture of gamma-butyrolactone (GBL) and N-methyl-2-pyrrolidone (NMP), or gamma-butyrolactone (GBL) and 3-methoxy-N, N-dimethylpropanamide (DMPA). ), Or 3-methoxy-N, N-dimethylpropanamide (DMPA) alone.
In the present invention, the amount of the organic solvent used is 30 to 70 mol% of gamma-butyrolactone (GBL) and N-methyl-2-pyrrolidone (NMP) or 3-methoxy-N, N-dimethylpropanamide (DMPA) 70. It can also be ~ 30 mol%.
The present invention also provides a method for producing a transparent polyimide resin film, which comprises heat-treating a polyamic acid solution produced by using the above composition to produce a film.
In the present invention, the polyamic acid solution uses an organic solvent content based on a solid content of 10 to 40% by weight, and a diamine component of 95 to 100 mol% and an acid dianhydride compound of 100 to 105 mol% are mixed. Can also be manufactured.
In the present invention, it is also effective that the polyamic acid solution has a viscosity of 1,000 to 10,000 cP.
Further, in the present invention, the transmittance at a wavelength of 532 nm is 88% or more, and the yellowness (Yellow Index, YI.) at a wavelength of 532 nm is based on the thickness of the film produced by the above-mentioned production method of 10 to 15 μm. Provided is a polyimide resin film having 7 or less, a compound refraction of 0.01 or less, and a phase difference (Rth) in the thickness direction of 100 or less.
本発明によれば、従来のポリアミド酸溶液に比べて、溶液キャスティング時に白濁現象がなく、常温における樹脂安定性に優れ、熱硬化によるフィルムの製造時に、透明ながらも優れた機械的特性及び光学特性、位相遅延特性、耐熱特性を提供するので、フレキシブルディスプレイ基板素材、半導体素材などに有用に活用することができる。 According to the present invention, as compared with a conventional polyamic acid solution, there is no clouding phenomenon during solution casting, resin stability at room temperature is excellent, and when a film is produced by thermosetting, it is transparent but has excellent mechanical and optical properties. Since it provides phase delay characteristics and heat resistance characteristics, it can be usefully used for flexible display substrate materials, semiconductor materials, and the like.
本発明のポリイミド前駆体樹脂組成物(以下、‘ポリアミド酸組成物’という。)は、光特性及び位相遅延特性の向上のために新規な特定ジアミン化合物を含む芳香族ジアミン成分と、白濁現象が発生しない有機溶媒の組成と、それらの使用量を最適化して光特性及び位相遅延特性に優れるとともに高透明性を有するポリイミド樹脂フィルムを提供するという点にその特徴がある。本発明に係るポリイミド前駆体組成物、すなわち「ポリアミド酸組成物」は、ポリイミド樹脂フィルムの製造に用いられるポリアミド酸溶液の製造に用いられる組成物を意味する。 The polyimide precursor resin composition of the present invention (hereinafter referred to as'polyamic acid composition') has an aromatic diamine component containing a novel specific diamine compound for improving light characteristics and phase delay characteristics, and a cloudiness phenomenon. It is characterized in that it provides a polyimide resin film having excellent optical characteristics and phase delay characteristics and high transparency by optimizing the composition of organic solvents that are not generated and the amount of them used. The polyimide precursor composition according to the present invention, that is, "polyamic acid composition" means a composition used for producing a polyamic acid solution used for producing a polyimide resin film.
具体的に、本発明に係るポリアミド酸組成物は、ジアミン成分、酸二無水物化合物、及び有機溶媒を含むポリイミド前駆体樹脂組成物において、前記ジアミン成分は、2,2−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]プロパン(BATP)、1,1−ビス[4−4−アミノ−2−トリフルオロメチルフェノキシ]−フェニル]−1−フェニル−エタン(BATPPE)、下記4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)フェニル(BATPP)、及び4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)ビフェニル(BATPB)からなる群から選ばれる1種以上の芳香族ジアミンを含むことによって、優れた光透過率及び位相遅延特性を有する。各成分について具体的に説明すると、下記の通りである。 Specifically, the polyamic acid composition according to the present invention is a polyimide precursor resin composition containing a diamine component, an acid dianhydride compound, and an organic solvent, wherein the diamine component is 2,2-bis [4-( 4-Amino-2-trifluoromethylphenoxy) -phenyl] propane (BATP), 1,1-bis [4-4-amino-2-trifluoromethylphenoxy] -phenyl] -1-phenyl-ethane (BATPPE) Consists of 4,4'-bis (4-amino-2-trifluoromethylphenoxy) phenyl (BATPP) and 4,4'-bis (4-amino-2-trifluoromethylphenoxy) biphenyl (BATBP) below. By containing one or more aromatic diamines selected from the group, it has excellent light transmission and phase delay characteristics. A specific description of each component is as follows.
(A)ジアミン成分
本発明におけるジアミン成分は、下記化学式5で表示される2,2−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]プロパン(BATP)、下記化学式6で表示される1,1−ビス[4−4−アミノ−2−トリフルオロメチルフェノキシ]−フェニル]−1−フェニル−エタン(BATPPE)、下記化学式7で表示される4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)フェニル(BATPP)、及び下記化学式8で表示される4,4’−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)ビフェニル(BATPB)からなる群から選ばれる1種以上の芳香族ジアミンを含む。
(A) Diamine component The diamine component in the present invention is 2,2-bis [4- (4-amino-2-trifluoromethylphenoxy) -phenyl] propane (BATP) represented by the following chemical formula 5, and the following chemical formula 6 1,1-bis [4-4-amino-2-trifluoromethylphenoxy] -phenyl] -1-phenyl-ethane (BATPPE) represented by, and 4,4'-bis (4,4'-bis) represented by the following chemical formula 7. From the group consisting of 4-amino-2-trifluoromethylphenoxy) phenyl (BATPP) and 4,4'-bis (4-amino-2-trifluoromethylphenoxy) biphenyl (BATBP) represented by the following chemical formula 8. Contains one or more aromatic diamines of choice.
ここで、前記化学式5〜8で表示される芳香族ジアミン化合物は、ジアミン成分の合計含有量に対して5〜30モル%を含むことが好ましい。化学式5〜8で表示される芳香族ジアミン化合物が5モル%未満であると、複屈折、位相差特性の向上に限界があり、30モル%を超えると、熱的特性の低下による限界があるので、前記範囲で含むことが好ましい。 Here, the aromatic diamine compound represented by the chemical formulas 5 to 8 preferably contains 5 to 30 mol% with respect to the total content of the diamine components. If the amount of the aromatic diamine compound represented by the chemical formulas 5 to 8 is less than 5 mol%, there is a limit to the improvement of birefringence and retardation characteristics, and if it exceeds 30 mol%, there is a limit due to a decrease in thermal characteristics. Therefore, it is preferable to include it in the above range.
前記ジアミン成分は、TFMBのようなフッ素化芳香族ジアミン単量体だけでなく、非フッ素化芳香族ジアミン単量体も含むことができる。具体的に、芳香族ジアミン成分は、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノビフェニル(TFMB)、4,4−オキシジアニリン(ODA)、4,4−メチレンジアニリン(MDA)、p−フェニレンジアミン(pPDA)、m−フェニレンジアミン(mPDA)、p−メチレンジアニリン(pMDA)、m−メチレンジアニリン(mMDA)、p−シクロヘキサンジアミン(pCHDA)、p−キシリレンジアミン(pXDA)、m−キシリレンジアミン(mXDA)、m−シクロヘキサンジアミン(mCHDA)、4,4’−ジアミノジフェニルスルホン(DDS)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン(BAFP)、及び2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)からなる群から選ばれる1種以上を含むことができる。 The diamine component can include not only a fluorinated aromatic diamine monomer such as TFMB but also a non-fluorinated aromatic diamine monomer. Specifically, the aromatic diamine components are 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (TFMB), 4,4-oxydianiline (ODA), 4,4-methylenedi. Aniline (MDA), p-phenylenediamine (pPDA), m-phenylenediamine (mPDA), p-methylenedianiline (pMDA), m-methylenedianiline (mMADA), p-cyclohexanediamine (pCHDA), p-xylyl Range amine (pXDA), m-xylylene diamine (mXDA), m-cyclohexanediamine (mCHDA), 4,4'-diaminodiphenylsulfone (DDS), 2,2-bis [4- (4-aminophenoxy) phenyl ] -1,1,1,3,3,3-hexafluoropropane (BAFP), and 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP). The above can be included.
(B)酸二無水物化合物
本発明の芳香族酸二無水物化合物は、フッ素化芳香族酸二無水物、非フッ素化芳香族酸二無水物、又はそれらの混合物を含む。
フッ素化芳香族酸二無水物と非フッ素化芳香族酸二無水物を混合して使用する場合、ポリイミドフィルムの光学的特性及び耐熱特性を同時に向上させることができる。前記フッ素化芳香族酸二無水物のフッ素置換基によって、光学的特性に優れたポリイミドフィルムを製造でき、非フッ素化芳香族酸二無水物の強直な分子構造によって耐熱特性に優れたポリイミドフィルムを製造することができる。
(B) Acid dianhydride compound The aromatic acid dianhydride compound of the present invention contains a fluorinated aromatic acid dianhydride, a non-fluorinated aromatic acid dianhydride, or a mixture thereof.
When a fluorinated aromatic acid dianhydride and a non-fluorinated aromatic acid dianhydride are mixed and used, the optical properties and heat resistance properties of the polyimide film can be improved at the same time. A polyimide film having excellent optical properties can be produced by the fluorine substituent of the fluorinated aromatic acid dianhydride, and a polyimide film having excellent heat resistance properties can be produced by the tough molecular structure of the non-fluorinated aromatic acid dianhydride. Can be manufactured.
具体的に、フッ素化芳香族酸二無水物は、フッ素置換基が導入された芳香族酸二無水物であり、例えば、4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物(4,4’−(Hexafluoroisopropylidene)diphthalic anhydride,6FDA))、及び4,4’−(4,4’−ヘキサフルオロイソプロピリデンジフェノキシ)ビス−(フタル酸無水物)(4,4’−(4,4’−Hexafluoroisopropylidenediphenoxy)bis−(phthalic anhydride,6−FDPDA)からなる群から選ばれる1種以上を用いることができる。 Specifically, the fluorinated aromatic acid dianhydride is an aromatic acid dianhydride having a fluorine substituent introduced therein, and is, for example, 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (4,). 4'-(Hexafluoroisopropylide) diphthalic anhydride, 6FDA), and 4,4'-(4,4'-hexafluoroisopropylideneoxy) bis- (phthalic anhydride) (4,4'-(4,4) One or more selected from the group consisting of'-Hexafluoroisotropic lidenediphenoxy) bis- (physical anhydride, 6-FDPDA) can be used.
次に、非フッ素化芳香族酸二無水物は、フッ素置換基が導入されていない芳香族酸二無水物であり、ピロメリト酸二無水物(pyromellitic dianhydride,PMDA)、3,3’,4,4’−ビフェニルテトラカルボン酸二無水物(3,3’4,4’−biphenyltetracarboxylic acid dianhydride,BPDA)、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物(3,3’,4,4’−benzophenonetetracarboxylic dianhydride,BTDA)、4,4’オキシジフタル酸無水物(4,4’−oxydiphthalic anhydride,ODPA)、2,2−ビス[4−3,4−ジカルボキシフェノキシ]フェニル]プロパン無水物(2,2−Bis[4−(3,4−dicarboxyphenoxy)phenyl]propane dianhydride,BPADA)、3,3’,4,4’−ジフェニルスルホンテトラカルボン酸無水物(3,3’,4,4’−Diphenyl sufone tetracarboxylic dianhydride,DSDA)、及びエチレングリコールビス(4−トリメリテート無水物)(ethylene glycol bis(4−trimellitate anhydride)、TMEG)からなる群から選ばれる1種以上を用いることができる。 Next, the non-fluorinated aromatic acid dianhydride is an aromatic acid dianhydride in which a fluorine substituent is not introduced, and is pyromellitic dianhydride (PMDA), 3, 3', 4, 4'-biphenyltetracarboxylic acid dianhydride (3,3'4,4'-biphenyltetracarboxicid dianhydride, BPDA), 3,3', 4,4'-benzophenone tetracarboxylic dianhydride (3,3', 4,4'-benzophenonetracarboxylic dianhydride, BTDA), 4,4'-oxydiphthalic anhydride (ODPA), 2,2-bis [4-3,4-dicarboxyphenoxy] phenyl] propane Anhydride (2,2-Bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride, BPADA), 3,3', 4,4'-diphenylsulfone tetracarboxylic acid anhydride (3,3', 4) , 4'-Diphenyl sulfone terracarboxylic dianhydride, DSDA), and ethylene glycol bis (4-trimeritate anhydride), TMEG (which can be selected from one species or more), TMEG). ..
好ましくは、本発明は、ジアミン成分として前記化学式5〜8で表示される化合物を含む場合、酸二無水物成分として、4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物(6FDA)、4,4’−(4,4’−ヘキサフルオロイソプロピリデンジフェノキシ)ビス−(フタル酸無水物)(6−FDPDA)、シクロブタンテトラカルボン酸二無水物(CBDA)、3,3’,4’,4−ビフェニルテトラカルボン酸二無水物(s−BPDA)、ビシクロ[2.2.2]オクト−7−エン−2,3,5,6−テトラカルボン酸二無水物(BTDA)、4−(2,5−ジオキソテトラヒドロフラン−3−イル)−1,2,3,4−テトラヒドロナフタレン−1,2−ジカルボン酸二無水物(TDA)、ピロメリト酸二無水物(PMDA)、ベンゾフェノンテトラカルボン酸二無水物(BTDA)、及びオキシジフタル酸二無水物(ODPA)からなる群から選ばれる1種以上を用いることができる。 Preferably, when the present invention contains the compound represented by the chemical formulas 5 to 8 as the diamine component, the acid dianhydride component is 4,4'-(hexafluoroisopropylidene) diphthalic acid anhydride (6FDA). 4,4'-(4,4'-hexafluoroisopropyridenediphenoxy) bis- (phthalic acid anhydride) (6-FDPDA), cyclobutanetetracarboxylic acid dianhydride (CBDA), 3,3', 4' , 4-Biphenyltetracarboxylic acid dianhydride (s-BPDA), Bicyclo [2.2.2] Oct-7-en-2,3,5,6-tetracarboxylic acid dianhydride (BTDA), 4- (2,5-Dioxotetratetra-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid dianhydride (TDA), pyromelitoic acid dianhydride (PMDA), benzophenone tetracarboxylic One or more selected from the group consisting of acid dianhydride (BTDA) and oxydiphthalic acid dianhydride (ODPA) can be used.
(C)有機溶媒
本発明における有機溶媒は、m−クレゾール、N−メチル−2−ピロリドン(NMP)、N,N−ジメチルホルムアミド(DMF)、ジメチルアセトアミド(DMAc)、ジメチルスルホキシド(DMSO)、ジエチルアセテート(DEA)、3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)などのような極性溶媒、テトラヒドロフラン(THF)、クロロホルムなどのような低沸点溶媒又はガンマ−ブチロラクトン(GBL)のような低吸水性溶媒を用いることができる。
(C) Organic Solvent The organic solvent in the present invention is m-cresol, N-methyl-2-pyrrolidone (NMP), N, N-dimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO), diethyl. Polar solvents such as acetate (DEA), 3-methoxy-N, N-dimethylpropanamide (DMPA), low boiling solvents such as tetrahydrofuran (THF), chloroform, etc. or low such as gamma-butyrolactone (GBL). A water-absorbent solvent can be used.
具体的に、本発明で使用する有機溶媒は、白濁現象の改善に重要な役割を果たすが、常温で溶液キャスティング時に白濁現象を改善するために、ガンマ−ブチロラクトン(GBL)及びN−メチル−2−ピロリドン(NMP)の混合物、又はガンマ−ブチロラクトン(GBL)及び3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)の混合物、又は3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)単独物を用いることが好ましい。 Specifically, the organic solvent used in the present invention plays an important role in improving the cloudiness phenomenon, but gamma-butyrolactone (GBL) and N-methyl-2 are used to improve the cloudiness phenomenon during solution casting at room temperature. A mixture of -pyrrolidone (NMP), or a mixture of gamma-butyrolactone (GBL) and 3-methoxy-N, N-dimethylpropanamide (DMPA), or a mixture of 3-methoxy-N, N-dimethylpropanamide (DMPA) alone. Is preferably used.
このとき、有機溶媒の使用量は、ガンマ−ブチロラクトン(GBL)30〜70モル%に対してN−メチル−2−ピロリドン(NMP)又は3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)70〜30モル%を用いることが好ましい。より好ましくは、ガンマ−ブチロラクトン(GBL)50〜70モル%に対してN−メチル−2−ピロリドン(NMP)又は3−メトキシ−N,N−ジメチルプロパンアミド(DMPA)30〜50モル%を用いることができる。あるいは、ガンマ−ブチロラクトン(GBL)単独物100モル%を用いることもできる。 At this time, the amount of the organic solvent used is N-methyl-2-pyrrolidone (NMP) or 3-methoxy-N, N-dimethylpropanamide (DMPA) 70 with respect to 30 to 70 mol% of gamma-butyrolactone (GBL). It is preferable to use ~ 30 mol%. More preferably, 30 to 50 mol% of N-methyl-2-pyrrolidone (NMP) or 3-methoxy-N, N-dimethylpropanamide (DMPA) is used with respect to 50 to 70 mol% of gamma-butyrolactone (GBL). be able to. Alternatively, 100 mol% of gamma-butyrolactone (GBL) alone can be used.
(D)反応触媒
本発明は、前記成分に加えて反応触媒をさらに含むことができる。本発明の反応触媒は、反応性によって、トリメチルアミン(Trimethylamine)、キシレン(Xylene)、ピリジン(Pyridine)及びキノリン(Quinoline)からなる群から選ばれる1種以上をさらに含むことができ、必ずしもこれに限定されない。また、ポリアミド酸組成物は、本発明の目的と効果を顕著に損傷させない範囲内で、必要によって、可塑剤、酸化防止剤、難燃化剤、分散剤、粘度調節剤、レベリング剤などの添加剤を少量含むことができる。
(D) Reaction catalyst The present invention may further include a reaction catalyst in addition to the above components. The reaction catalyst of the present invention may further include, and is not necessarily limited to, one or more selected from the group consisting of trimethylamine, xylene, pyridine and quinoline, depending on the reactivity. Not done. Further, the polyamic acid composition is added with a plasticizer, an antioxidant, a flame retardant, a dispersant, a viscosity modifier, a leveling agent and the like, if necessary, within a range that does not significantly impair the object and effect of the present invention. It can contain a small amount of agent.
なお、本発明に係るポリアミド酸組成物である、ジアミン成分、酸二無水物化合物、有機溶媒、及び反応触媒を用いて重合して得たポリアミド酸溶液は、ポリアミド酸溶液の全重量に対して固形分を10〜40重量%、好ましくは10〜25重量%含む。固形分が10重量%未満であると、フィルム製造時にフィルムの厚さを増加させるのに限界があり、固形分が40重量%を超えると、ポリアミド酸樹脂の粘度を調節するのに限界があるので、前記範囲内で形成する。 The polyamic acid solution obtained by polymerizing the polyamic acid composition according to the present invention using a diamine component, an acid dianhydride compound, an organic solvent, and a reaction catalyst is based on the total weight of the polyamic acid solution. The solid content is 10 to 40% by weight, preferably 10 to 25% by weight. If the solid content is less than 10% by weight, there is a limit to increasing the thickness of the film during film production, and if the solid content exceeds 40% by weight, there is a limit to adjusting the viscosity of the polyamic acid resin. Therefore, it is formed within the above range.
具体的に、前記ポリアミド酸溶液は、固形分含有量10〜40重量%条件基準で有機溶媒含有量を使用し、ジアミン成分95〜100モル%及び酸二無水物化合物100〜105モル%を混合して10〜70℃温度条件で12〜48時間反応させることが好ましい。このとき、反応温度は、使用単量体によって可変できる。
ここで、酸二無水物化合物は芳香族ジアミン成分に対して5モル%少ない量から5モル%多い量を添加して目標粘度に到達させることが好ましいが、これは、適切な粘度調節及び貯蔵安定性の確保のためである。
Specifically, the polyamic acid solution uses an organic solvent content based on a solid content of 10 to 40% by weight, and a diamine component of 95 to 100 mol% and an acid dianhydride compound of 100 to 105 mol% are mixed. The reaction is preferably carried out at a temperature of 10 to 70 ° C. for 12 to 48 hours. At this time, the reaction temperature can be changed depending on the monomer used.
Here, the acid dianhydride compound is preferably added in an amount 5 mol% less to 5 mol% more than the aromatic diamine component to reach the target viscosity, which is suitable for viscosity adjustment and storage. This is to ensure stability.
このような反応によって生成されたポリアミド酸溶液は、粘度が1,000〜10,000cPの範囲内であると好ましい。粘度が1,000cP未満であると、適度なレベルのフィルム厚さを得るのに問題があり、10,000cPを超えると、均一なコーティング及び効果的な溶媒除去に問題があるので、前記範囲内が好ましい。 The polyamic acid solution produced by such a reaction preferably has a viscosity in the range of 1,000 to 10,000 cP. If the viscosity is less than 1,000 cP, there is a problem in obtaining an appropriate level of film thickness, and if it exceeds 10,000 cP, there is a problem in uniform coating and effective solvent removal. Is preferable.
なお、本発明において透明ポリイミドフィルム及びその製造方法は、次の通りである。本発明は、前述したポリアミド酸組成物を用いて製造したポリアミド酸溶液を熱イミド化して製造した透明ポリイミドフィルムを提供する。本発明に係るポリアミド酸溶液は、粘性を有するものであり、フィルム製造時にガラス基板に適切な方法でコーティング後に熱処理される。前記コーティング方法は、周知の通常の方法を制限無く用いることができ、例えば、スピンコーティング(Spincoating)、ディップコーティング(Dip coating)、溶媒キャスティング(Solvent casting)、スロットダイコーティング(Slot die coating)、スプレーコーティング(Spray coating)などがあるが、これに限定されない。 In the present invention, the transparent polyimide film and the method for producing the same are as follows. The present invention provides a transparent polyimide film produced by thermally imidizing a polyamic acid solution produced using the above-mentioned polyamic acid composition. The polyamic acid solution according to the present invention has a viscosity and is heat-treated after being coated on a glass substrate by an appropriate method at the time of film production. As the coating method, a well-known ordinary method can be used without limitation, for example, spin coating (Spin coating), dip coating (Dip coating), solvent casting (Solvent casting), slot die coating (Slot die coating), spraying. There is, but is not limited to, coating (Spray coating) and the like.
本発明のポリアミド酸組成物は、高温対流オーブンで熱処理してポリイミドフィルムとして製造することができる。この時、熱処理条件は、窒素雰囲気下で、100〜450℃条件で30〜120分間行われる。より好ましくは、100℃/30分、220℃/30分、350℃/30分の温度及び時間条件下でフィルムを得ることが好ましい。これは、適切な溶媒の除去と特性の極大化ができるイミド化のためである。 The polyamic acid composition of the present invention can be produced as a polyimide film by heat treatment in a high-temperature convection oven. At this time, the heat treatment conditions are carried out in a nitrogen atmosphere at 100 to 450 ° C. for 30 to 120 minutes. More preferably, the film is obtained under the temperature and time conditions of 100 ° C./30 minutes, 220 ° C./30 minutes, and 350 ° C./30 minutes. This is due to imidization, which allows for proper solvent removal and maximization of properties.
本発明の透明ポリイミドフィルムは、前記ポリアミド酸組成物を用いて製造されるので、高い透明性を示すと同時に低い熱膨張係数を有する。
本発明のポリイミドフィルムは、フィルムの厚さ10〜15μmを基準に、複屈折0.01以下、面方向の位相差(Ro)が1.0nm以下、厚さ方向の位相差(Rth)が100nm以下、濁度(Haze)が1.0以下、透過率(Transmittance)が85%以上、好ましくは88%以上、黄色度(Yellow Index,Y.I.)が7以下、好ましくは5以下と低い。
Since the transparent polyimide film of the present invention is produced using the polyamic acid composition, it exhibits high transparency and at the same time has a low coefficient of thermal expansion.
The polyimide film of the present invention has a birefringence of 0.01 or less, a phase difference (Ro) in the plane direction of 1.0 nm or less, and a phase difference (Rth) in the thickness direction of 100 nm based on a film thickness of 10 to 15 μm. Hereinafter, the turbidity (Haze) is 1.0 or less, the transmittance (Transmitance) is 85% or more, preferably 88% or more, and the yellowness (Yellow Index, YI) is 7 or less, preferably 5 or less. ..
本発明のポリイミドフィルムは、様々な分野に用いることができ、特に、高透明性及び位相遅延特性が要求されるOLED用ディスプレイ、液晶素子用ディスプレイ、TFT基板、フレキシブル印刷回路基板、フレキシブル(Flexible)OLED面照明基板、電子ペーパー用基板素材のようなフレキシブル(Flexible)ディスプレイ用基板及び保護膜として提供することができる。 The polyimide film of the present invention can be used in various fields, and in particular, an OLED display, a liquid crystal element display, a TFT substrate, a flexible printing circuit substrate, and a flexible (Flexible) display, which require high transparency and phase delay characteristics. It can be provided as a substrate for a flexible display such as an OLED surface illumination substrate and a substrate material for electronic paper, and a protective film.
以下、本発明を実施例を用いてより詳細に説明する。しかし、それらの実施例は本発明を例示するためのもので、本発明の範囲を限定するものではない。
なお、表1中、酸二無水物及びジアミンの数字の単位はモル部であり、概算値である。
Hereinafter, the present invention will be described in more detail with reference to Examples. However, these examples are for exemplifying the present invention and do not limit the scope of the present invention.
In Table 1, the units of the numbers of acid dianhydride and diamine are molar parts, which are approximate values.
比較例1
下記表2に示した組成物として、ジアミン系単量体であるTFMB 32.329g(0.101mole)を有機溶媒であるDMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 45.333g(0.102mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,500cPであった。
Comparative Example 1
As the composition shown in Table 2 below, 32.329 g (0.101 mole) of TFMB, which is a diamine-based monomer, was added to 440.08 g of DMPA, which is an organic solvent, and dissolved in a nitrogen atmosphere at room temperature for 30 minutes to 1 hour. rice field. Then, after adding 45.333 g (0.102 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,500 cP.
実施例1
下記表2に示した組成物として、ジアミン系単量体であるTFMB 30.257g(0.094mole)、BATP 2.743g(0.005mole)を有機溶媒であるDMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 44.661g(0.100mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,800cPであった。
Example 1
As the compositions shown in Table 2 below, 30.257 g (0.094 mole) of TFMB and 2.743 g (0.005 mole) of BATP, which are diamine-based monomers, are added to 440.08 g of DMPA, which is an organic solvent, and a nitrogen atmosphere is provided. , Was dissolved at room temperature for 30 minutes to 1 hour. Then, after adding 6FDA 44.661 g (0.100 mole) which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,800 cP.
実施例2
下記表2に示した組成物として、ジアミン系単量体であるTFMB 28.215g(0.088mole)、BATP 5.400g(0.010mole)を有機溶媒であるDMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 44.047g(0.099mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,500cPであった。
Example 2
As the compositions shown in Table 2 below, 28.215 g (0.088 mole) of TFMB and 5.400 g (0.010 mole) of BATP, which are diamine-based monomers, were added to 440.08 g of DMPA, which is an organic solvent, to create a nitrogen atmosphere. , Was dissolved at room temperature for 30 minutes to 1 hour. Then, after adding 44.047 g (0.099 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,500 cP.
実施例3
下記表2に示した組成物として、ジアミン系単量体であるTFMB 20.713g(0.065mole)、BATP 15.292g(0.028mol)を有機溶媒であるDMPA440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 41.657g(0.094mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,600cPであった。
Example 3
As the composition shown in Table 2 below, 20.713 g (0.065 mole) of TFMB and 15.292 g (0.028 mol) of BATP, which are diamine-based monomers, were added to 440.08 g of DMPA, which is an organic solvent. It was dissolved at room temperature for 30 minutes to 1 hour. Then, after adding 41.657 g (0.094 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,600 cP.
実施例4
下記表2に示した組成物として、ジアミン系単量体であるTFMB 30.136g(0.094mole)、BATPPE 3.043g(0.005mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 44.483g(0.100mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,700cPであった。
Example 4
As the compositions shown in Table 2 below, 30.136 g (0.094 mole) of TFMB and 3.043 g (0.005 mol) of BATPPE, which are diamine-based monomers, were added to 440.08 g of the organic solvent DMPA, and the nitrogen atmosphere was maintained at room temperature. It was dissolved in 30 minutes to 1 hour. Then, after adding 6FDA 44.483 g (0.100 mole) which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,700 cP.
実施例5
下記表2に示した組成物として、ジアミン系単量体であるTFMB 28.009g(0.087mole)、BATPPE 5.970g(0.010mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 44.483g(0.100mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,600cPであった。
Example 5
As the compositions shown in Table 2 below, TFMB 28.009 g (0.087 mole) and BATPPE 5.970 g (0.010 mol), which are diamine-based monomers, were added to the organic solvent DMPA 440.08 g, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, after adding 6FDA 44.483 g (0.100 mole) which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,600 cP.
実施例6
下記表2に示した組成物として、ジアミン系単量体であるTFMB 20.270g(0.063mole)、BATPPE 16.665g(0.027mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 40.727g(0.092mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,600cPであった。
Example 6
As the compositions shown in Table 2 below, 20.270 g (0.063 mole) of TFMB and 16.665 g (0.027 mol) of BATPPE, which are diamine-based monomers, were added to 440.08 g of the organic solvent DMPA, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, after adding 40.727 g (0.092 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,600 cP.
実施例7
下記表2に示した組成物として、ジアミン系単量体であるTFMB 30.446g(0.095mole)、BATPP 2.165g(0.005mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 45.051g(0.101mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,800cPであった。
Example 7
As the compositions shown in Table 2 below, 30.446 g (0.095 mole) of TFMB and 2.165 g (0.005 mol) of BATPP, which are diamine-based monomers, were added to 440.08 g of the organic solvent DMPA, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, 45.051 g (0.101 mole) of 6FDA, which is a dianhydride-based monomer, was added, and then the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,800 cP.
実施例8
下記表2に示した組成物として、ジアミン系単量体であるTFMB 21.626g(0.068mole)、BATPP 12.520g(0.029mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 43.515g(0.098mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,300cPであった。
Example 8
As the compositions shown in Table 2 below, 21.626 g (0.068 mole) of TFMB and 12.520 g (0.029 mol) of BATPP, which are diamine-based monomers, were added to 440.08 g of the organic solvent DMPA, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, after adding 43.515 g (0.098 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,300 cP.
実施例9
下記表2に示した組成物として、ジアミン系単量体であるTFMB 30.330g(0.095mole)、BATPB 2.539g(0.005mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 44.792g(0.101mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,700cPであった。
Example 9
As the compositions shown in Table 2 below, 30.330 g (0.095 mole) of TFMB and 2.539 g (0.005 mol) of BATBP, which are diamine-based monomers, were added to 440.08 g of the organic solvent DMPA, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, after adding 44.792 g (0.101 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,700 cP.
実施例10
下記表2に示した組成物として、ジアミン系単量体であるTFMB 21.069g(0.066mole)、BATPB 14.364g(0.028mol)を有機溶媒DMPA 440.08gに入れ、窒素雰囲気、常温で30分〜1時間溶解させた。その後、二無水物系単量体である6FDA 42.228g(0.095mole)を添加した後に24時間撹拌してポリアミド酸溶液を製造した(反応温度:30℃、この時、固形分は反応溶媒の全重量に対して15重量%になるように維持させる。)。粘度測定装置(Brookfield DV2T,SC4−27)で測定した結果、粘度が4,800cPであった。
Example 10
As the compositions shown in Table 2 below, 21.069 g (0.066 mole) of TFMB and 14.364 g (0.028 mol) of BATBP, which are diamine-based monomers, were added to the organic solvent DMPA 440.08 g, and the atmosphere was nitrogen and the temperature was normal. It was dissolved in 30 minutes to 1 hour. Then, after adding 42.228 g (0.095 mole) of 6FDA which is a dianhydride monomer, the mixture was stirred for 24 hours to prepare a polyamic acid solution (reaction temperature: 30 ° C., at this time, the solid content was a reaction solvent. It is maintained so as to be 15% by weight based on the total weight of.). As a result of measurement with a viscosity measuring device (Blockfield DV2T, SC4-27), the viscosity was 4,800 cP.
実験例:物性測定
(1)常温白濁現象の評価
実施例1〜10及び比較例1で準備したポリアミド酸溶液をガラス板上に落としてスピンコーターを用いて一定の厚さ(固形分15%基準、溶液の厚さ100μmのとき、熱処理後に15μm)にし、温度25℃、湿度>90%の雰囲気で30分間放置した後、白濁現象を観察した。白濁現象発生レベルを0〜5と数値化して評価した(0:発生無し、5:大きく発生)。
Experimental example: Measurement of physical properties (1) Evaluation of normal temperature cloudiness phenomenon Drop the polyamic acid solution prepared in Examples 1 to 10 and Comparative Example 1 onto a glass plate and use a spin coater to obtain a constant thickness (based on solid content of 15%). When the thickness of the solution was 100 μm, the temperature was adjusted to 15 μm after the heat treatment, and the solution was left to stand in an atmosphere of temperature 25 ° C. and humidity> 90% for 30 minutes, and then a cloudiness phenomenon was observed. The white turbidity phenomenon occurrence level was quantified as 0 to 5 and evaluated (0: no occurrence, 5: large occurrence).
(2)フィルム製造及び物性の評価
ポリアミド酸溶液をガラス板上にスピンコーターを用いてコートした後、高温対流オーブンで熱処理した。熱処理条件は、窒素雰囲気で行い、100℃/30分、220℃/30分、350℃/30分の温度及び時間条件で最終フィルムを得た。このようにして得たフィルムに対して下記のような方法で物性を測定し、下記表1にその結果を示した。
(2) Film production and evaluation of physical properties The polyamic acid solution was coated on a glass plate using a spin coater, and then heat-treated in a high-temperature convection oven. The heat treatment conditions were carried out in a nitrogen atmosphere, and the final film was obtained under the temperature and time conditions of 100 ° C./30 minutes, 220 ° C./30 minutes, and 350 ° C./30 minutes. The physical properties of the film thus obtained were measured by the following methods, and the results are shown in Table 1 below.
(a)透過率(Transmittance)
UV−Vis NIR Spectrophotometer(Shimadsu社、UV−1800)を用いて532nmで透過率を測定した。
(b)複屈折(birefringence)及び位相差(Retardation)
屈折率測定機(Metricon社、Prism Coupler 2010M)を用いて532nmでTE(Transeverse Elictric)モード、TM(Transverse Magnetic)モードで測定し、(TE値)−(TM値)の値を複屈折値として計算し、位相差測定装置(Otsuka社、RETs−100)を用いて532nmの面方向の位相差(Ro)、厚さ方向の位相差(Rth)を測定した。
(c)黄色度(Yellowness Index,YI)
色差計(LabScan XE)を用いて測定した。
(d)濁度(haze)
ヘイズメーター(TOYOSEIKI社、HAZE−GARD)を用いて測定した。
(A) Transmittance
Transmittance was measured at 532 nm using a UV-Vis NIR Spectrophotometer (Shimadsu, UV-1800).
(B) Birefringence and retardation
Measured in TE (Transverse Eric) mode and TM (Transverse Magic) mode at 532 nm using a refractive index measuring machine (Prism Coupler 2010M, Metallicon), and the value of (TE value)-(TM value) is used as the birefringence value. The calculation was performed, and the phase difference (Ro) in the plane direction and the phase difference (Rth) in the thickness direction at 532 nm were measured using a phase difference measuring device (RTs-100, manufactured by Otsuka).
(C) Yellowness (Yellowness Index, YI)
It was measured using a color difference meter (LabScan XE).
(D) Turbidity (haze)
The measurement was performed using a haze meter (TOYOSEIKI, HAZE-GARD).
前記表1に示すように、比較例1に比べて、実施例1〜10の場合、新規ジアミン単量体であるBATPP、BATPPE、BATP、BATPBが所定量含まれる場合、高い透過率を示すとともに、位相遅延特性に優れていることが確認できる。なお、ポリイミドフィルムで要求される透過率、濁度、黄色度などを満たし、白濁現象も発生しなかったことが分かる。 As shown in Table 1, in the cases of Examples 1 to 10 as compared with Comparative Example 1, when a predetermined amount of the novel diamine monomers BATPP, BATPPE, BATP, and BATPB is contained, the transmittance is higher and the transmittance is higher. , It can be confirmed that the phase delay characteristic is excellent. It can be seen that the transmittance, turbidity, yellowness, etc. required for the polyimide film were satisfied, and the white turbidity phenomenon did not occur.
これによって、本発明によって製造されたポリアミド酸前駆体樹脂溶液は、フィルム厚さ10〜15μmを基準に、532nmの波長における透過率が88%以上、黄色度(Yellow Index,Y.I.)が7以下、複屈折が0.01以下、厚さ方向の位相差(Rth)が100以下である透明ポリイミドフィルムを提供することができる。 As a result, the polyamic acid precursor resin solution produced by the present invention has a transmittance of 88% or more at a wavelength of 532 nm and a yellowness (Yellow Index, YI.) based on a film thickness of 10 to 15 μm. It is possible to provide a transparent polyimide film having a compound refraction of 7 or less, a compound refraction of 0.01 or less, and a phase difference (Rth) in the thickness direction of 100 or less.
したがって、本発明によって製造されたポリイミドフィルムは、優れた光透過率及び位相遅延特性を満たし、OLED用ディスプレイ、液晶素子用ディスプレイ、TFT基板、フレキシブル印刷回路基板、フレキシブル(Flexible)OLED面照明基板、電子ペーパー用基板素材のようなフレキシブル(Flexible)ディスプレイ用基板及び保護膜に広く適用することができる。
Therefore, the polyimide film produced by the present invention satisfies excellent light transmittance and phase delay characteristics, and is an OLED display, a liquid crystal element display, a TFT substrate, a flexible printing circuit substrate, a flexible OLED surface illumination substrate, and the like. It can be widely applied to flexible display substrates and protective films such as electronic paper substrate materials.
Claims (7)
前記ジアミン成分は、下記化学式1で表示される2,2−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]プロパン(BATP)、下記化学式2で表示される1,1−ビス[4−4−アミノ−2−トリフルオロメチルフェノキシ]−フェニル]−1−フェニル−エタン(BATPPE)、下記化学式3で表示される4,4'−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)フェニル(BATPP)、及び下記化学式4で表示される4,4'−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)ビフェニル(BATPB)からなる群から選ばれる1種以上の芳香族ジアミンを含み、前記化学式1〜4で表示される芳香族ジアミン化合物は、ジアミン成分の合計含有量に対して5〜30モル%を含み、
前記ジアミン成分は、2,2'−ビス(トリフルオロメチル)−4,4'−ジアミノビフェニル(TFMB)、4,4−オキシジアニリン(ODA)、p−フェニレンジアミン(pPDA)、m−フェニレンジアミン(mPDA)、p−メチレンジアニリン(pMDA)、m−メチレンジアニリン(mMDA)、p−キシリレンジアミン(pXDA)、m−キシリレンジアミン(mXDA)、4,4'−ジアミノジフェニルスルホン(DDS)、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン(BAFP)、及び2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)からなる群から選ばれる1種以上をさらに含むことを特徴とする、光特性及び位相遅延特性に優れた高透明性のポリイミド前駆体樹脂組成物。
The diamine component is 2,2-bis [4- (4-amino-2-trifluoromethylphenoxy) -phenyl] propane (BATP) represented by the following chemical formula 1, and 1,1 represented by the following chemical formula 2. -Bis [4-4-amino-2-trifluoromethylphenoxy] -phenyl] -1-phenyl-ethane (BATPPE), 4,4'-bis (4-amino-2-tri) represented by the following chemical formula 3. One or more aromatics selected from the group consisting of fluoromethylphenoxy) phenyl (BATPP) and 4,4'-bis (4-amino-2-trifluoromethylphenoxy) biphenyl (BATBP) represented by the following chemical formula 4. look including a family diamine, aromatic diamine compounds represented by formula 1-4 includes 5-30 mole% based on the total amount of the diamine component,
The diamine component is 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (TFMB), 4,4-oxydianiline (ODA), p-phenylenediamine (pPDA), m-phenylene. Diamine (mPDA), p-methylenedianiline (pMDA), m-methylenedianiline (mMADA), p-xylylenediamine (pXDA), m-xylylenediamine (mXDA), 4,4'-diaminodiphenylsulfone (mPDA) DDS), 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane (BAFP), and 2,2-bis [4- (4) -Aminophenoxy) Phenyl] A highly transparent polyimide precursor resin composition having excellent optical characteristics and phase delay characteristics, which further contains one or more selected from the group consisting of propane (BAPP).
る、請求項5に記載のポリイミド樹脂フィルムの製造方法。 The method for producing a polyimide resin film according to claim 5 , wherein the polyamic acid solution has a viscosity of 1,000 to 10,000 cP.
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WO2013114685A1 (en) * | 2012-02-01 | 2013-08-08 | 東洋紡株式会社 | Laminate, method for producing same, and method for producing device structure using same |
CN102716680B (en) * | 2012-06-05 | 2014-05-07 | 中国科学院化学研究所 | Polyamide microporous membrane and preparation method thereof |
KR102066385B1 (en) * | 2013-03-18 | 2020-01-15 | 아사히 가세이 가부시키가이샤 | Resin precursor, resin composition containing said resin precursor, resin film, method for producing said resin film, laminate, and method for producing said laminate |
JP6670238B2 (en) * | 2014-07-17 | 2020-03-18 | 旭化成株式会社 | Resin precursor, resin composition containing the same, polyimide resin film, resin film and method for producing the same |
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