JP6923238B2 - バッテリー温度測定装置及び方法 - Google Patents
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- 238000009529 body temperature measurement Methods 0.000 description 7
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
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- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
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- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
- G01R31/374—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC] with means for correcting the measurement for temperature or ageing
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- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
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- G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
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- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
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- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
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- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
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- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
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- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
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- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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- H01M2200/10—Temperature sensitive devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Description
13:電極リード
15:センシングバスバー
100:リードコネクタ
200:温度センサ
210:第1端子
300:演算部
400:BMSコネクタ
500:メモリ部
G:接地端子
I:集積回路基板
L:センシング経路
L1:信号ライン
L2:接地ライン
N:ノード
P:バッテリーパック
S:センシングアセンブリ
Claims (14)
- 二次電池の電極リードと接触するように構成された集積回路基板で前記二次電池の温度を測定するバッテリー温度測定装置であって、
前記集積回路基板上に直接取り付けられ、前記電極リードが連結されるように構成されたリードコネクタと、
前記集積回路基板上に取り付けられ、備えられた複数の端子のうち一端に備えられた第1端子が前記リードコネクタに直接接触して前記二次電池から動作電源の供給を受けるように構成された温度センサと、
前記温度センサと電気的に連結され、前記温度センサによって測定された電気的信号に基づいて前記二次電池の温度を測定するように構成された演算部と、を含む、バッテリー温度測定装置。 - 前記集積回路基板上に取り付けられ、前記集積回路基板の外部に備えられたBMSと電気的に連結され、前記温度センサの他端に備えられた第2端子と電気的に連結されるように構成されたBMSコネクタをさらに含む、請求項1に記載のバッテリー温度測定装置。
- 前記集積回路基板は、前記第2端子と前記BMSコネクタとの間を電気的に直接連結するように構成された信号ラインをさらに含む、請求項2に記載のバッテリー温度測定装置。
- 前記信号ラインは、前記集積回路基板上に取り付けられた前記温度センサの個数だけ前記集積回路基板に備えられる、請求項3に記載のバッテリー温度測定装置。
- 前記集積回路基板は、接地端子を備え、
前記第2端子と前記接地端子との間を電気的に連結するように構成された接地ラインをさらに含む、請求項3または4に記載のバッテリー温度測定装置。 - 前記接地ラインは、前記第2端子と直接連結された前記信号ラインから分岐した回路パターンラインである、請求項5に記載のバッテリー温度測定装置。
- 前記温度センサの動作電位は、前記リードコネクタと前記接地端子との間に印加される電位である、請求項5または6に記載のバッテリー温度測定装置。
- 前記集積回路基板が取り付けられ、前記二次電池の前記電極リードと連結されるセンシングバスバーが備えられ、前記センシングバスバーを通じて前記リードコネクタと前記二次電池の前記電極リードとの間を電気的に連結させるセンシングアセンブリをさらに含む、請求項1から7のいずれか一項に記載のバッテリー温度測定装置。
- 前記温度センサは、前記第1端子が前記リードコネクタの内部に挿入されて前記リードコネクタと直接接触する、請求項1から8のいずれか一項に記載のバッテリー温度測定装置。
- 前記第1端子は、前記リードコネクタの内部を貫通して前記リードコネクタの外部に突出し、前記電極リードと直接接触する、請求項9に記載のバッテリー温度測定装置。
- 前記リードコネクタの内部に前記温度センサの第1端子及び前記センシングバスバーが全て挿入される、請求項8に記載のバッテリー温度測定装置。
- 請求項1から11のうちいずれか一項に記載のバッテリー温度測定装置を含む、バッテリーパック。
- 二次電池の電極リードと接触するように構成された集積回路基板であって、
前記集積回路基板上に直接取り付けられ、前記電極リードが連結されるように構成されたリードコネクタと、
前記集積回路基板上に取り付けられ、2個の端子のうち一端に位置した一つの端子が前記リードコネクタに直接接触し、前記二次電池の電位を動作電位とするように構成された温度センサと、
前記集積回路基板上の基準電位を示し、前記温度センサの他端と電気的に連結されるように構成された接地端子と、を含む、集積回路基板。 - 二次電池の電極リードと接触するように構成された集積回路基板で前記二次電池の温度を測定するバッテリー温度測定方法であって、
前記集積回路基板上に直接取り付けられ、前記電極リードが連結されるように構成されたリードコネクタを介し、前記二次電池の電位を動作電位として供給して前記集積回路基板上に取り付けられた温度センサから電気的信号を受信する段階と、
前記温度センサから受信した電気的信号に基づいて前記二次電池の温度を測定する段階と、を含む、バッテリー温度測定方法。
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KR20180068220 | 2018-06-14 | ||
KR10-2018-0068220 | 2018-06-14 | ||
PCT/KR2019/007095 WO2019240494A1 (ko) | 2018-06-14 | 2019-06-12 | 배터리 온도 측정 장치 및 방법 |
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US (1) | US11480474B2 (ja) |
EP (1) | EP3700004A4 (ja) |
JP (1) | JP6923238B2 (ja) |
KR (1) | KR102363704B1 (ja) |
CN (1) | CN111295797B (ja) |
WO (1) | WO2019240494A1 (ja) |
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CN114830403A (zh) * | 2019-12-20 | 2022-07-29 | 赛昂能源有限公司 | 用于为可再充电电化学单元或电池提供、组装和管理集成的电力总线的系统和方法 |
JP2023517553A (ja) | 2020-07-17 | 2023-04-26 | チャンシン メモリー テクノロジーズ インコーポレイテッド | 半導体装置 |
EP3965105B1 (en) | 2020-07-17 | 2024-02-07 | Changxin Memory Technologies, Inc. | Calibration of temperature detection module in semiconductor memory comprising a plurality of memory chips |
EP3968324B1 (en) * | 2020-07-17 | 2023-07-05 | Changxin Memory Technologies, Inc. | Semiconductor device |
CN113725560A (zh) * | 2021-07-23 | 2021-11-30 | 浙江南都电源动力股份有限公司 | 软包电池连接板、极耳焊接工装及其焊接方法 |
CN114142179B (zh) * | 2021-08-24 | 2023-08-25 | 安徽南都华拓新能源科技有限公司 | 一种增加模组能量密度的方法 |
KR20230053376A (ko) | 2021-10-14 | 2023-04-21 | 현대모비스 주식회사 | 배터리 온도 측정 시스템 및 그 방법 |
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- 2019-06-12 CN CN201980005430.3A patent/CN111295797B/zh active Active
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CN111295797B (zh) | 2023-06-23 |
WO2019240494A1 (ko) | 2019-12-19 |
US20200333194A1 (en) | 2020-10-22 |
KR20190141605A (ko) | 2019-12-24 |
CN111295797A (zh) | 2020-06-16 |
KR102363704B1 (ko) | 2022-02-16 |
US11480474B2 (en) | 2022-10-25 |
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EP3700004A1 (en) | 2020-08-26 |
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